JP4285347B2 - Electronic component mounted substrate and circuit module - Google Patents

Description

  The present invention relates to an electronic component-mounted substrate in which an electronic component is embedded in an insulating resin base material and cracks of the insulating resin base material are prevented, and a circuit module using the substrate.

  In recent years, development of electronic devices such as IC cards has been activated. Then, in order to reduce the size and thickness of an electronic component mounted substrate to be incorporated in an electronic device, a substrate in which an IC chip or a memory chip is embedded in an insulating resin base material has been developed.

  The prior art will be described below using an IC card as an example.

  Conventionally, an IC card is subjected to various deformations such as bending and twisting due to an external stress during use. Therefore, in order to alleviate the influence of external stress on the module part on which the IC chip is mounted, the IC card has been reinforced by providing a rigid metal plate or the like on the IC chip part or the module part.

  FIG. 15 is a cross-sectional view of a conventional non-contact IC card provided with a core module component with built-in electronic components.

  As shown in FIG. 15, in an electronic component built-in core module component 1500 in a non-contact IC card, an electronic component 1510 such as an IC chip and an electronic component reinforcing member 1520 provided on the back surface thereof are made of, for example, polyethylene terephthalate or polycarbonate. Embedded in a thermoplastic resin substrate 1530. Further, the electrode surface of the bump 1550 of the electronic component 1510 is exposed on the circuit pattern forming surface 1540 corresponding to the circuit forming surface of the thermoplastic resin base material 1530. A circuit pattern 1560 that is in electrical contact with the electrode surface of the bump 1550 is formed on the circuit pattern forming surface 1540. An IC card manufactured by laminating the electronic component built-in core module component 1500 configured as described above is disclosed (for example, Patent Document 1).

Moreover, in order to prevent the crack of a semiconductor package, it is disclosed that the back surface of the silicon chip is coated with, for example, a polyimide resin to improve the adhesion between the mold resin and the silicon chip (for example, Patent Documents). 2).
Japanese Patent Laid-Open No. 2003-6687 JP-A-6-21271

  However, the IC card disclosed in Patent Document 1 prevents defects such as cracking and chipping of the IC chip due to bending stress and torsional stress applied to the non-contact IC card by the electronic component reinforcing member 1520. Therefore, as shown in the cross-sectional views of FIGS. 16A and 16B, the crack 1600 of the thermoplastic resin base material 1530 due to the stress concentrated on the edge of the IC chip due to bending applied to the IC card cannot be prevented. Further, as shown in the sectional view of FIG. 16C, the thermoplastic resin base material 1530 is peeled off 1610 from the IC chip surface by repeated bending stress. Furthermore, similarly, even when forming a core module with built-in electronic components, warpage occurs due to differences in thermal expansion and contraction due to differences in the amount and thickness of the thermoplastic resin substrate 1530 formed on the upper and lower surfaces of the IC chip. . Also at this time, there is a problem that stress concentrates on the edge of the IC chip due to warpage, and a crack 1600 occurs in the thermoplastic resin base material 1530 as shown in the plan view of FIG.

  Further, the semiconductor package disclosed in Patent Document 2 improves the adhesion between the silicon chip and the mold resin, prevents cracks in the package, and has a problem that it is impossible to prevent the generation of cracks due to the edges of the silicon chip. .

  Therefore, the present invention solves such problems and prevents the occurrence of cracks in the insulating resin base material due to the edge of the electronic component embedded in the insulating resin base material. An object is to provide a finished board and a circuit module.

  In order to achieve the above object, an electronic component mounted substrate according to the present invention includes an electronic component having a protruding electrode on one surface, and a reinforcing member that covers at least the electronic component provided on the other surface of the electronic component. And an insulating resin base material in which the electronic component and the reinforcing member are embedded so that at least the protruding electrode of the electronic component is exposed, and a wiring pattern connected to the protruding electrode provided on the surface of the insulating resin base material. The reinforcing member has a configuration in which at least the tip of the upper edge is removed so as to disperse the stress generated in the insulating resin base material.

  With this configuration, the warping of the insulating resin base material when creating a substrate with electronic components mounted, and the bending stress and torsional stress when using with an IC card, etc. are not concentrated on the edge of the electronic component, but distributed by the roundness of the reinforcing member Therefore, the occurrence of cracks is suppressed.

  Also, an electronic component having a protruding electrode on one surface, a resin material formed to cover at least the other surface of the electronic component, and the protruding electrode of the electronic component so that at least the electronic component and the resin material are exposed. Insulating resin base material embedded in the wiring, and a wiring pattern connected to the protruding electrode provided on the surface of the insulating resin base material, the resin material so as to disperse the stress generated in the insulating resin base material At least the tip of the edge on the upper surface side is removed.

  With this configuration, the stress is not concentrated on the edge of the electronic component and is dispersed, thereby suppressing the occurrence of cracks. Furthermore, the adhesive strength with the insulating resin can be improved and peeling can be prevented.

  An electronic component having a protruding electrode on one surface, a reinforcing member that covers at least the electronic component provided on the other surface of the electronic component, a resin material that is formed to cover the reinforcing member, and an electronic component An insulating resin base material that embeds the reinforcing member and the resin material so that at least the protruding electrode of the electronic component is exposed, and a wiring pattern that is connected to the protruding electrode provided on the surface of the insulating resin base material. The resin material has a configuration in which at least the tip of the edge on the upper surface side is removed so as to disperse the stress generated in the insulating resin base material.

  Further, the reinforcing member may be configured such that at least the tip of the edge on the upper surface side is removed so as to disperse the stress generated in the insulating resin base material.

  With these configurations, it is possible to disperse stress concentration and prevent the occurrence of cracks. Further, the bending strength can be improved by the reinforcing member, and the adhesive strength can be increased by the resin material.

  In addition, the reinforcing member may have at least one through hole.

  Further, the reinforcing member may have a roughened surface.

  The surface of the resin material may be roughened.

  With these configurations, it is possible to improve the adhesive strength due to the throwing effect due to the through holes and increase the adhesion area due to the roughening, and to prevent the occurrence of cracks.

  The insulating resin base material may be a polyester resin and the resin material may include an epoxy resin.

  Thereby, adhesive strength can be improved with the optimal combination of an insulating resin base material and a resin material, and the prevention effect of a crack can be heightened.

  Moreover, it can also be set as the circuit module structure provided with the above-mentioned electronic component mounting board | substrate.

  ADVANTAGE OF THE INVENTION According to this invention, the electronic component mounting board | substrate and circuit module excellent in reliability which prevent generation | occurrence | production of the crack of the insulating resin base material by the edge of the electronic component embed | buried in the insulating resin base material can be implement | achieved. Further, it is possible to prevent the occurrence of cracks by improving the adhesive strength between the insulating resin substrate and the electronic component.

(First embodiment)
Hereinafter, an electronic component mounted substrate and a manufacturing method thereof according to a first embodiment of the present invention will be described with reference to FIGS.

  FIG. 1A is a plan view schematically showing an electronic component mounted substrate according to the first embodiment of the present invention, and FIG. 1B is an AA ′ line in FIG. It is sectional drawing. FIG. 2 is a flowchart showing a method for manufacturing an electronic component mounted substrate.

  In the electronic component mounted substrate 100 according to the first embodiment of the present invention, the electronic component 110 includes a protruding electrode 120 on one surface, and the other surface is at least larger than the electronic component 110 in the thickness direction. A reinforcing member 140 having a roundness 130 is embedded in an insulating resin substrate 150 made of, for example, a thermoplastic resin such as polyethylene terephthalate or a thermosetting resin such as an epoxy resin. Here, the roundness 130 provided in the thickness direction of the reinforcing member 140 is generated at the insulating resin base material 150 by removing a sharp tip at least at an edge on a surface (hereinafter referred to as an upper surface) that does not face the electronic component 110. It is used in the meaning of a shape capable of dispersing stress, and the same applies to the following.

  The protruding electrodes 120 formed by the bumps of the electronic component 110 are exposed on the circuit pattern forming surface 160 corresponding to the circuit forming surface of the insulating resin substrate 150. A circuit pattern 170 that is in electrical contact with the protruding electrode 120 is formed on the circuit pattern formation surface 160.

  In the electronic component mounted substrate 100 having such a configuration, since the shape of the peripheral portion of the reinforcing member 140 embedded in the insulating resin base material 150 has the roundness 130 in the thickness direction, the stress concentration is dispersed, and the insulation The crack does not occur in the conductive resin substrate 150.

  Moreover, generation | occurrence | production of the crack from the temperature cycle etc., for example, peeling from the reinforcement member 140 of the insulating resin base material 150, etc. can be suppressed under the environment used.

  For example, Table 1 shows the relationship between the roundness 130 of the reinforcing member 140 and the number of occurrences of cracks with respect to the thickness. Table 1 shows the roundness 130 of the reinforcing member 140 as a substitute for the radius R.

  As shown in Table 1, when the roundness 130 of the edge of the reinforcing member 140 is 1/5 or more of the thickness and 1.0 or less, cracks hardly occurred. Note that the radius R and thickness of the reinforcing member 140 are particularly limited as long as the roundness 130 has a shape that does not generate an inflection point so as to disperse the stress generated in the insulating resin base material 150 at the edge of the reinforcing member 140. Not. Further, if there is at least a roundness 130 at the edge of the upper surface portion of the reinforcing member 140, a part of the thickness direction may be a straight line, and the lower surface portion may not have the roundness 130, and is not particularly limited.

  In the first embodiment, the configuration in which the edge of the entire outer periphery of the reinforcing member 140 has the roundness 130 in the thickness direction is shown. However, basically, in the thickness direction of the edge where stress is concentrated due to bending or the like. The round 130 may be formed, and is not particularly limited. At that time, as shown in FIG. 1A, when the corner portion 180 remains in the reinforcing member 140, it is preferable to round the corner portion 180. The planar shape of the reinforcing member 140 is not limited to a quadrangle, and may be a circle, an ellipse, or a rhombus.

  FIG. 2 is a flowchart illustrating a method for manufacturing an electronic component mounted substrate according to the first embodiment of the present invention, using a non-contact IC card as an example. FIG. 3 is a diagram for specifically explaining the manufacturing method of FIG.

  Below, the manufacturing method of the said non-contact IC card including the manufacturing method of the electronic component mounted substrate 100 is demonstrated using FIG. 2 and FIG.

  In step (shown as “S” in FIG. 2) 101 shown in FIG. 2, a metal wire made of gold, copper, solder or the like is placed on the electrode (not shown) of the electronic component 110 shown in FIG. A protruding electrode (hereinafter referred to as a bump) 120 is formed by the wire bonding method used. In addition, the formation method of the bump 120 is not limited to the formation by the wire bonding method, and may be formed by a plating method.

  In the next step 102, as shown in FIG. 3B, the electronic component 110 having the bump 120 formed on one surface 110A and the other surface 110B of the electronic component 110 facing the surface 110A are provided. The sheet-like insulating resin base material formed of the reinforcing member 140 having the roundness 130 in the thickness direction, with a thermoplastic resin having electrical insulation properties such as polyethylene terephthalate, vinyl chloride, polycarbonate, or acrylonitrile butadiene styrene. 150. In this case, the reinforcing member 140 and the other surface 110B of the electronic component 110 may be bonded in advance and placed on the insulating resin substrate 150.

  In the first embodiment of the present invention, the reinforcing member 140 is provided in contact with the other surface 110B of the electronic component 110, and has the same or larger area as the electronic component 110. Further, the reinforcing member 140 is made of a metal such as stainless steel, nickel, copper or aluminum, or plastic, and the shape thereof may be a quadrangle or a circle as shown in FIG. It is not something. Further, the thickness of the reinforcing member 140 varies depending on the thickness of the insulating resin base material 150 and the electronic component 110, but is generally preferably about 50 to 200 μm. That is, the material, shape, and thickness of the reinforcing member 140 are determined from the viewpoint of improving mechanical strength from bending deformation or torsional deformation of the electronic component mounted substrate 100 due to external force, and preventing damage to the electronic component 110. The

  As shown in FIG. 3, the thickness t1 of the insulating resin base material 150 is set so that the bump 120 is insulative resin base material as will be described later in the case of the electronic component mounted substrate 100 according to the first embodiment of the present invention. Since it is necessary to expose from the circuit pattern forming surface 160 of 150, the thickness of the electronic component 110, the height of the bump 120, the height of the reinforcing member 140 and the thickness of the electronic component 110 and the reinforcing member 140 are basically equal to or greater than the total thickness. It is desirable to make the total thickness or less. For example, when the thickness of the electronic component 110 is 180 μm, the height of the bump 120 is 40 μm, and the thickness of the reinforcing member 140 is 50 μm, the thickness of the insulating resin substrate 150 is preferably 250 μm.

  In the next step 103, as shown in FIG. 3C, the insulating resin base material 150 on which the electronic component 110 having the bump 120 and the reinforcing member 140 are placed is placed between the flat surfaces of the hot press plates 300 and 310. The electronic component 110 and the reinforcing member 140 having the bumps 120 and the insulating resin base material 150 are heated and relatively pressed by the hot press plates 300 and 310, and the electronic component 110 and the reinforcing member are pressed. 140 is embedded in the insulating resin substrate 150. The hot press machine includes moving devices 320 and 330 for moving the hot press plates 300 and 310 for the pressing operation, and heating devices 340 and 350 for heating the hot press plates 300 and 310, respectively. .

For example, when an insulating resin base material 150 (softening temperature: 120 ° C.) made of polyethylene terephthalate is used, the heating conditions of the hot press machine are a pressure of 30 × 10 ⁵ Pa, a temperature of 165 ° C., and a press time of 150 seconds. In addition, the said temperature and pressure are an example, It is necessary to change conditions according to the material of the insulating resin base material 150. FIG.

  In the electronic component mounted substrate 100 according to the first embodiment of the present invention, the bumps 120 of the electronic component 110 are pressed until they contact the hot press plate 300 and are exposed. Then, as shown in FIG. 3D, the bump 120 is exposed to the circuit pattern forming surface 160 which is a contact surface with the hot press plate 300 in the insulating resin base material 150 by the pressing operation.

  At this time, in the electronic component mounted substrate 100 according to the first embodiment of the present invention, the surface 140B of the reinforcing member 140 opposite to the surface 140A facing the electronic component 110, and the circuit of the insulating resin base 150 Although the surface 150B opposite to the pattern forming surface 160 is illustrated as having a different flat surface, the present invention is not limited to this.

  That is, depending on the electronic component mounted substrate 100 to be manufactured, for example, the insulating resin base material 150 may be adjusted depending on the thickness t1 of the insulating resin base material 150 described above, the pressing force of the hot press plates 300 and 310, or the like. The surface 140B of the reinforcing member 140 opposite to the surface 140A facing the electronic component 110 from the surface 150B may be substantially the same plane.

  In the next step 105, as shown in FIG. 1B, the conductive material containing silver, copper, etc. is brought into contact with the bump 120 exposed on the circuit pattern forming surface 160 of the insulating resin substrate 150. The circuit pattern 170 is formed on the circuit pattern forming surface 160 using the paste.

  Note that the circuit pattern 170 is formed by conductive paste in general by screen printing, offset printing, gravure printing, intaglio printing, dispensing drawing, or the like. For example, in the case of screen printing, a conductive paste is printed through a mask of 250 to 500 mesh / inch to form a circuit pattern 170 having a conductor thickness of about 30 μm. Then, the said conductive paste is hardened on 110 degreeC and hardening conditions for about 15 minutes.

  Of course, the circuit pattern 170 is formed in a form corresponding to the function of the electronic component mounted substrate 100 as a product.

  In this way, the circuit pattern 170 and the electronic component 110 are electrically connected to form the electronic component mounted substrate 100 shown in FIG.

  Further, for example, a non-contact IC card is manufactured by the following steps as shown in FIG.

In the next step 106, for example, as shown in FIG. 5 (a), the electronic component mounted substrate 100 is heated from the thickness direction thereof with electrical insulation such as polyethylene terephthalate, vinyl chloride, polycarbonate, or acrylonitrile butadiene styrene. Sandwich between the sheet-like second insulating resin base material 500 and the third insulating resin base material 510 made of a plastic resin, a thermosetting resin, or the like, laminate, and seal the electronic component mounted substrate 100. Stop. The laminating process is performed by heating and pressing with heated flat press plates 520 and 530. For example, when an insulating resin substrate 150 made of polyethylene terephthalate is used, the processing conditions are a pressure of 30 × 10 ⁵ Pa, a temperature of 160 ° C., a press pressurization time of 1 minute, and a pressure holding time of 1 minute. The flat press machine includes moving devices 540 and 550 for moving the flat press plates 520 and 530 for the pressing operation, and heating devices 560 and 570 for heating the flat press plates 520 and 530, respectively. .

Further, the laminating process may be performed by a roll press method using heated rollers 575 and 578 as shown in FIG. A sheet-like second insulating resin base material 500 and a third insulating resin base material 500 such as polyethylene terephthalate, vinyl chloride, polycarbonate, or acrylonitrile butadiene styrene are sandwiched from the thickness direction of the electronic component mounted substrate 100. The insulating resin base material 510 is supplied between the rollers 575 and 578 and laminated. For example, when the second insulating resin base material 500 and the third insulating resin base material 510 made of polyethylene terephthalate are used, the processing conditions are a pressure of 30 × 10 ⁵ Pa, a temperature of 165 ° C., and a laminating speed of 0.1 m. / Min. In some cases, an adhesive sheet is supplied between the second insulating resin base material 500, the third insulating resin base material 510, and the electronic component mounted substrate 100 to perform a laminating process.

  The roll press machine includes driving devices 580 and 585 for rotating the rollers 575 and 578 for the pressing operation, and heating devices 590 and 595 for heating the rollers 575 and 578, respectively.

  Through the above steps, the electronic component mounted substrate 100 on which the electronic component 110 and the reinforcing member 140 are mounted as shown in FIG. 1 and the electronic component mounted substrate 100 according to the first embodiment of the present invention are obtained. The contactless IC card used is completed.

  In the electronic component mounted substrate 100 having such a configuration, the shape of the peripheral portion of the reinforcing member 140 embedded in the insulating resin base material 150 has the roundness 130 in the thickness direction. The stress applied to the edge of the electronic component 110 is dispersed, and the insulating resin substrate 150 is not cracked. Furthermore, since the reinforcing member 140 has a shape larger than that of the electronic component 110, the electronic component 110 can be prevented from cracking and chipping, and the amount of the insulating resin substrate 150 on the upper and lower surfaces of the electronic component 110 can be prevented from warping. is there.

  Moreover, generation | occurrence | production of the crack from the temperature cycle etc., for example, peeling from the reinforcement member 140 of the insulating resin base material 150, etc. can be suppressed under the environment used.

  As a result, it is possible to prevent deterioration of the characteristics of the electronic component 110 due to the ingress of moisture, water vapor, foreign matter, and the like through cracks and peeled portions, and the electronic component mounted substrate 100 having excellent reliability such as moisture resistance can be obtained. Obtainable.

(Second Embodiment)
Hereinafter, a method for manufacturing an electronic component mounted substrate according to a second embodiment of the present invention will be described with reference to FIG.

  FIG. 6A is a plan view schematically showing the electronic component mounted substrate 100 according to the second embodiment of the present invention, and FIG. 6B is AA ′ of FIG. It is line sectional drawing. In FIG. 6, the same components as those in FIG.

  The electronic component mounted substrate 100 of the second embodiment is different from the electronic component mounted substrate 100 of the first embodiment in that the reinforcing member 600 includes at least one through hole 610. .

  In the electronic component mounted substrate 100 according to the second embodiment of the present invention, the electronic component 110 includes a protruding electrode 120 on one surface, and the other surface is at least larger than the electronic component 110 in the thickness direction. A reinforcing member 600 having a roundness 130 and having a through hole 610 is embedded in an insulating resin substrate 150 such as polyethylene terephthalate. Then, a protruding electrode (hereinafter referred to as a bump) 120 of the electronic component 110 is exposed on the circuit pattern forming surface 160 corresponding to the circuit forming surface of the insulating resin substrate 150. A circuit pattern 170 that is in electrical contact with the bump 120 is formed on the circuit pattern forming surface 160.

  Here, it is preferable that the shape of the through hole 610 in the depth direction has a roundness 620 at the edge, and the hole shape on the surface 600A facing the electronic component 110 is larger than the hole shape of the surface 600B not facing. However, the present invention is not limited to this. Moreover, the hole shape of the through-hole 610 is not limited to the shape shown in FIG. 6, for example, the shape shown in FIG. 7 may be sufficient, and the arrangement | positioning may be random.

  With such a configuration, by having the roundness 130 in the thickness direction of the edge of the reinforcing member 600, it is possible to disperse the concentration of bending stress and torsional stress and prevent the occurrence of cracks. Furthermore, by increasing the adhesion area with the insulating resin substrate 150, the adhesive strength can be improved.

  In order to enlarge the adhesion area, the same effect can be obtained even if the surface 710 of the reinforcing member 700 is roughened by a sandblasting method or an etching method as shown in FIG.

(Third embodiment)
Hereinafter, an electronic component mounted substrate according to a third embodiment of the present invention will be described with reference to FIG.

  FIG. 9A is a plan view schematically showing an electronic component mounted substrate according to the third embodiment of the present invention, and FIG. 9B is an AA ′ line in FIG. It is sectional drawing. In FIG. 9, the same components as those in FIG.

  The electronic component mounted substrate 100 of the third embodiment and the electronic component mounted substrate 100 of the first embodiment are at least thick at the edge of the surface opposite to the protruding electrode 120 of the electronic component 110. A reinforcing resin material 900 having a roundness 910 in the vertical direction is different in that the electronic component 110 is covered by, for example, screen printing, spraying, dipping or the like.

  In this case, it is important that the reinforcing resin material 900 has viscosity in order to form the roundness 910 at the edge of the electronic component 110 by its surface tension. Further, it is necessary to combine a reinforcing resin material 900 having a strong adhesive strength with the mold resin or silicon substrate of the electronic component 110 and the insulating resin base material 150. For example, when the insulating resin substrate 150 is a polyester resin, the reinforcing resin material 900 is preferably an epoxy resin.

  And the manufacturing method of the electronic component mounted board | substrate 100 which concerns on 3rd Embodiment is the reinforcement which consists of an epoxy resin with a viscosity of 50-100 Pa.s, for example on the surface opposite to the protruding electrode 120 of the electronic component 110. A typical resin material 900 is formed by coating or printing, and is cured by drying or heating, and then manufactured by a method similar to the method shown in FIG.

  Such a reinforcing resin material 900 can prevent cracking of the insulating resin base material 150, and thus has a great effect on productivity and cost reduction.

  Note that the reinforcing resin material 900 may be formed on the entire surface other than the protruding electrodes 120 of the electronic component 110. In addition, if the resin material 900 on the surface of the protruding electrode 120 can be removed by a plasma etching method or the like in a later processing step, the whole can be formed by first covering the resin material 900 with the resin material 900.

(Fourth embodiment)
Hereinafter, an electronic component mounted substrate according to a fourth embodiment of the present invention will be described with reference to FIG.

  FIG. 10A is a plan view schematically showing an electronic component mounted substrate according to the fourth embodiment of the present invention, and FIG. 10B is an AA ′ line in FIG. It is sectional drawing. In FIG. 10, the same components as those in FIG.

  The electronic component mounted substrate 100 of the fourth embodiment is rounded in the thickness direction at least on the edge of the reinforcing member 1000 on the reinforcing member 1000 of the electronic component mounted substrate 100 of the first embodiment. The resin material 1010 forming 1020 is coated.

  In this case, it is not particularly necessary to form roundness in the thickness direction at the end of the reinforcing member 1000. For example, as shown in FIG. 11B, a resin material 1120 may be formed on a reinforcing member 1100 having roundness 1110, and the entire reinforcing member 1100 is covered with the resin material 1120 as shown in FIG. It is good also as composition to do.

  In addition, as shown in FIG. 12, the contact surface 1220 of the resin material 1210 formed on the electronic component 110 or the reinforcing member 1200 with the insulating resin base material 150 may be roughened. The roughening method can be realized, for example, by printing a resin material 1210 made of an epoxy resin having a viscosity of 50 to 100 Pa · s on a mesh screen and transferring the mesh. With this configuration, the adhesion strength can be improved by increasing the adhesion area with the insulating resin substrate 150.

  Further, as shown in FIG. 13, when the resin material 1310 has elasticity such as a rubber-based material, for example, at least the edge of the reinforcing member 1300 having the edge is formed with a resin material 1310 to be covered. Also good. The reason is that the stress concentration applied to the edge can be absorbed by elastic deformation of the resin material 1310. Therefore, for example, as shown in FIGS. 13B and 13C, the surface or the whole of the reinforcing member 1300 may be covered with the resin material 1310.

  In the embodiment of the present invention, the case where roundness is formed on the upper and lower surfaces in the thickness direction of the reinforcing member has been described, but it goes without saying that roundness may be formed only on the upper surface as shown in FIG.

  In addition, by configuring a circuit module including passive components, external connection terminals, and the like on the electronic component mounted substrate according to the embodiment of the present invention, it can be applied to an IC card, a memory card, and the like. Furthermore, circuit modules may be laminated to form a multilayer circuit module. Thereby, the circuit module provided with the electronic component mounting board | substrate excellent in the reliability without a crack is realizable.

  In the electronic component mounted substrate according to the present invention, by providing a reinforcing member having a roundness in the thickness direction or a resin material on one surface of the electronic component, generation of cracks in the insulating resin base material in which the electronic component is embedded Therefore, it can be applied to various small and thin electronic devices that are easily deformed.

(A) The top view which showed typically the electronic component mounted substrate based on the 1st Embodiment of this invention (b) The sectional view on the A-A 'line of the same figure (a) The flowchart which shows the manufacturing method of the electronic component mounted substrate based on the 1st Embodiment of this invention The figure explaining concretely the manufacturing method of the electronic component mounted substrate which concerns on the 1st Embodiment of this invention The top view which shows the reinforcement member which concerns on another example of the 1st Embodiment of this invention. The figure explaining concretely the manufacturing method of the electronic component mounted substrate which concerns on the 1st Embodiment of this invention (A) The top view which showed typically the electronic component mounted substrate based on the 2nd Embodiment of this invention (b) The sectional view on the A-A 'line of the same figure (a) The top view which shows another example of the reinforcement member which concerns on the 2nd Embodiment of this invention. (A) The top view which showed typically the electronic component mounted substrate based on another example of the 2nd Embodiment of this invention (b) A-A 'sectional view taken on the line of the same figure (a) (A) The top view which showed typically the electronic component mounted substrate based on the 3rd Embodiment of this invention (b) The sectional view on the A-A 'line of the same figure (a) (A) The top view which showed typically the electronic component mounted substrate based on the 4th Embodiment of this invention (b) The sectional view on the A-A 'line of the same figure (a) (A) The top view which showed typically the electronic component mounted substrate which concerns on another example of the 4th Embodiment of this invention (b) The sectional view on the AA 'line of the same figure (a) (c) AA 'line sectional view of another example of the same figure (a). Sectional drawing which showed typically the electronic component mounted substrate which concerns on another example of the 4th Embodiment of this invention. (A) The top view which showed typically the electronic component mounted substrate which concerns on another example of the 4th Embodiment of this invention (b) The sectional view on the AA 'line of the same figure (a) (c) AA 'line sectional view of another example of the same figure (a). Sectional drawing which shows the example of another shape of the roundness of the thickness direction of the reinforcement member in embodiment of this invention Sectional view of a conventional core module component with built-in electronic components (A) Cross-sectional view showing a bent state of a conventional core module component with built-in electronic components (b) Cross-sectional view showing a state bent in the opposite direction of FIG. Sectional drawing which shows peeling state (d) The top view which illustrates typically the generation | occurrence | production state of the crack of a core module component with a built-in electronic component

Explanation of symbols

100 Electronic component mounted substrate 110 Electronic component 120 Protruding electrode (bump)
130, 620, 910, 1020, 1110 Roundness 140, 600, 700, 1000, 1100, 1200, 1300 Reinforcing member 150 Insulating resin substrate 160 Circuit pattern forming surface 170 Circuit pattern 180 Corners 300, 310, 520, 530 Heat Press plate 320, 330, 540, 550 Moving device 340, 350, 560, 570, 590, 595 Heating device 575, 578 Roller 580, 585 Drive device 610 Through hole 710 Surface of reinforcing member 900, 1010, 1120, 1210, 1310 Resin material

Claims (9)

An electronic component having a protruding electrode on one surface;
A reinforcing member that covers at least the electronic component provided on the other surface of the electronic component;
An insulating resin base material that embeds the electronic component and the reinforcing member so that at least the protruding electrodes of the electronic component are exposed; and
A wiring pattern connected to the protruding electrodes provided on the surface of the insulating resin substrate;
The electronic component-mounted substrate, wherein the reinforcing member has at least the top edge of the upper surface side removed so as to disperse the stress generated in the insulating resin base material. An electronic component having a protruding electrode on one side;
A resin material formed to cover at least the other surface of the electronic component;
An insulating resin base material embedded so that at least the protruding electrodes of the electronic component and the resin material are exposed;
A wiring pattern connected to the protruding electrodes provided on the surface of the insulating resin substrate;
An electronic component mounted substrate, wherein the resin material has at least the tip of the edge on the upper surface side removed so as to disperse the stress generated in the insulating resin base material. An electronic component having a protruding electrode on one surface;
A reinforcing member that covers at least the electronic component provided on the other surface of the electronic component;
A resin material formed to cover the reinforcing member;
An insulating resin base material that embeds the electronic component, the reinforcing member, and the resin material so that at least the protruding electrodes of the electronic component are exposed;
A wiring pattern connected to the protruding electrodes provided on the surface of the insulating resin substrate;
An electronic component mounted substrate, wherein the resin material has at least the tip of the edge on the upper surface side removed so as to disperse the stress generated in the insulating resin base material. 4. The electronic component mounted substrate according to claim 3, wherein the reinforcing member has at least the tip of the edge on the upper surface side removed so as to disperse the stress generated in the insulating resin base material. 5. 5. The electronic component mounted substrate according to claim 1, wherein the reinforcing member has at least one through hole. 5. The electronic component mounted substrate according to claim 1, wherein a surface of the reinforcing member is roughened. The electronic component mounted substrate according to claim 2 or 3, wherein a surface of the resin material is roughened. 4. The electronic component mounted substrate according to claim 2, wherein the insulating resin base material is a polyester-based resin, and the resin material includes an epoxy resin. Circuit module comprising the electronic component-mounted substrate according to any one of claims 1 to 3.

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