JPH02153542A - Manufacture of integrated circuit device - Google Patents

Abstract

PURPOSE:To manufacture a high-dimensional accuracy and high-quality thin integrated circuit device suitable for an IC card at a high efficiency and at low cost by a method wherein an integrated circuit element mounted on a metallic thin plate is covered with a sealing resin and part of the metallic thin plate is used as a terminal for external connection use. CONSTITUTION:An insulative bonding agent 12 is applied on most of one surface 11a of a metallic thin plate 11 excepting the connecting parts of the one surface 11a with gold wires 14. An integrated circuit element 13 is mounted and fixed through this bonding agent 12. Then, input/output electrodes 13a of the element 13 and the one surface 11a of the plate 11 are electrically connected to each other by the wires 14. After that, the element 13, the wires 14 and the side of the one surface 11a of the plate 11 are coated with a sealing resin 15. Subsequently, unnecessary parts of the plate 11 are removed to form the plate 11 into a desired configuration and after a terminal 11c for external connection use is formed, a coupling part 11d is cut and removed to obtain an integrated circuit device in a completed state.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method of manufacturing an integrated circuit device used, for example, in an IC card.

2. Description of the Related Art In recent years, so-called IC cards, in which integrated circuit elements such as microcomputers and memories are mounted or built into plastic cards, have been put into practical use.

This IC card has a larger storage capacity and better security than the magnetic stripe card that is already used for many meals, so it can be used not only for conventional magnetic stripe cards but also for various purposes such as identification cards. It is considered to be used for this purpose.

By the way, an IC card is a plastic card K made of vinyl chloride resin, etc., and is equipped with an integrated circuit device having a terminal for connection with an external device such as a reader/writer.
This integrated circuit device is required to be extremely thin.

There are many types of IC cards, but the standardization of IC cards with the same dimensions as conventional magnetic stripe cards was in 130 (
International Organization for Standardization).

Hereinafter, an IC card and an integrated circuit device used in the IC card will be described with reference to the accompanying drawings.

Fig. 4 is a perspective view of the 10 card, Fig. 6 is a cross-section of the 5' section of Fig. 4 showing the periphery of the integrated circuit device, and Fig. 6 is a cross-sectional view of the conventional integrated circuit device using a circuit board. FIG.

Conventionally, there have been many methods for manufacturing and configuring IC cards.1 For example, as shown in FIGS. A hole 2 slightly larger than the size of the integrated circuit device 300 is made using a mold or a Thomson mold, and the integrated circuit device 30, which is slightly thinner than the plastic card 1, is inserted and glued so that the external connection terminals 32 are exposed. .

As shown in FIG. 6, a conventional integrated circuit device has a film-like insulating substrate 31 with terminals for external connection; turns 32; The integrated circuit element 35 is die-bonded to a thin circuit board on which a circuit pattern 33 and circuit conductors such as through holes 34 are formed, and the input/output electrodes of the integrated circuit element 36 and the circuit-ζ
The turn 33 is connected with a metal wire 36 by a wire bonding method or the like. Further, a sealing frame 37 for preventing resin flow during resin sealing is provided by adhering to the circuit board, and the circuit board is sealed with a sealing material 38 such as epoxy resin. (Unexamined Japanese Patent Publication No. 55
(No. 56647, Japanese Patent Application Laid-open No. 68-92597) In addition, as a conventional integrated circuit device that does not require a high precision circuit board as described in M, a lead frame made of a thin metal plate processed into a desired shape is used. , one side of the lead frame is used as an external connection terminal, the other side is equipped with an integrated circuit element, and the input/output electrodes of the integrated circuit element and the other side of the lead frame are electrically connected with metal wires to form an integrated circuit. There is an integrated circuit device whose element side is covered with a sealing resin. (Unexamined Japanese Patent Publication No. 54-69
(No. 068, Japanese Unexamined Patent Publication No. 63-33853) Problems to be Solved by the Invention In the integrated circuit device mounted on an IC card, it is necessary to achieve high reliability, thinness, high dimensional accuracy, and low cost. That is what is required. However, in the integrated circuit device using the circuit board as described above, the circuit board used is a double-sided board with through holes in which wiring conductors are formed on both sides of the insulating board 31 and connected by the through holes 34. It has the following problems. ■Circuit boards are expensive. ■Differences in the thickness of the insulating board and variations in the plating thickness when forming through holes cause variations in the total thickness of the circuit board, making it difficult to obtain good thickness dimensional accuracy. (2) When the integrated circuit element 35 is sealed with resin, the resin flows out from the through hole 34, so a means for sealing the through hole 34 is required to prevent the resin from flowing out.

On the other hand, integrated circuit devices using lead frames made of thin metal plates processed into desired shapes do not require the high-precision precision circuit boards mentioned above, so they can be manufactured with high dimensional accuracy and high efficiency, and they can be integrated at low cost. It has the advantage of being a circuit device.

However, integrated circuit devices using this lead frame have a single-sided sealed structure in which one side of the lead frame serves as an external connection terminal and is exposed from the sealing resin. When formed, the sealing resin tends to ooze out onto the external connection terminal surface and form a thin layer of flakes. In this case, it is necessary to remove this thin layer by physical polishing, solvent, etc. Not only does this complicate the process, but there is a risk that the quality of the integrated circuit device may be impaired. In addition, the lead frame of this integrated circuit device is transported during the manufacturing of the integrated circuit device.
Due to productivity constraints such as assembly, it is difficult to make the lead frame too thin, and the limit is about 0.12 fl. Therefore, the thin integrated circuit device has the following problems. ■The sealing resin becomes substantially thinner by the thickness of the lead frame, reducing the strength of the integrated circuit device and making it difficult to obtain sufficient reliability for practical use. ■In order to minimize warping of the product as an integrated circuit device, it is desirable to further reduce the thickness of the lead frame, but this is difficult.

The present invention has been made in view of the above-mentioned problems, and it is an object of the present invention to provide a method for manufacturing a thin integrated circuit device with high dimensional accuracy and high quality suitable for RC cards with high efficiency and at low cost.

Means for Solving the Problems In order to solve the above problems, the method for manufacturing an integrated circuit device of the present invention includes mounting an integrated circuit element on one surface of a thin metal plate via an insulating adhesive, and The input/output electrodes are electrically connected to one surface of the thin metal plate, a sealing resin is formed on one side of the thin metal plate, and the integrated circuit element and the electrical connection portion are covered with the sealing resin. Later,
A part of the metal thin plate is removed to make the metal thin plate into a desired shape of an external connection terminal.

Effects of the present invention With the above configuration, the present invention eliminates the need for the conventionally used expensive double-sided circuit board with through holes, solves the cost, quality, and other problems associated with through hole formation, and makes thin integrated circuit devices inexpensive. can be manufactured with high quality.

At the same time, in order to use the thin metal plate as an external connection terminal, the process of removing a part of the thin metal plate and shaping it into a desired shape forms a sealing resin, and seals the integrated circuit element and the electrical connection portion with the sealing resin. In the process from mounting and connecting the integrated circuit elements to patterning the external connection terminals, the thin metal plate is a flat plate with no irregularities, so it has the following effects. ■Since the metal thin plate is a flat plate, there is no leakage of sealing resin to the external connection terminal surface, and
On the side of the sealing resin, the mold and the thin metal plate are in good contact with each other, and it is possible to form a good sealing resin without occurrence of resin flakes or the like. ■Surface treatment of the external connection terminal surface is performed after each process, so it can prevent steel etc. and ensure the quality of the appearance. ■High stability during process transportation. ■Since the shape processing of the metal thin plate is performed after resin sealing, the metal thin plate can be made extremely thin, and the thickness of the integrated circuit element and the sealing resin can be increased accordingly, thereby improving the strength of the integrated circuit device.

■Since the thin metal plate can be made extremely thin, detailed terminal patterns for external connections can be formed.

EXAMPLE Hereinafter, a method of manufacturing an integrated circuit device according to an example of the present invention will be described with reference to the drawings.

FIG. 1 is a longitudinal cross-sectional view showing each step of a method for manufacturing an integrated circuit device according to an embodiment of the present invention.

FIG. 2 is a longitudinal sectional view of an integrated circuit device produced by a manufacturing method according to an embodiment of the present invention. FIG. 3 is a longitudinal sectional view illustrating a method of forming a sealing resin in an embodiment of the present invention.

1, 2, and 3, 11 is a metal thin plate, 12 is an insulating adhesive, 13 is an integrated circuit element, 14 is a metal wire, 16 is a sealing resin, and 16 is a mold.

The method for manufacturing the integrated circuit device of this embodiment will be described in detail below along with its configuration.

First, a 35 μm thick copper foil was used as the metal thin plate 11.

In order to connect the metal wire 14 to a desired portion of the part 11a of the thin metal plate 11 by the wire bonding method described later, surface treatment was performed by nickel plating and gold plating to obtain the structure shown in FIG. 1(a). .

Next, the metal wire 14 of the part 112L of the metal thin plate 11 described above is
An insulating adhesive 12 made of an insulating resin was applied by screen printing to most of the parts except for the connecting parts. Next, the integrated circuit element 13 was mounted, and the insulating adhesive material 12 was cured by heating to be adhesively fixed.

Note that the reason why the insulating adhesive 12 was provided on most of the surface 111L of the thin metal plate 11 excluding the connection portion of the metal wire 14 was to improve the adhesion between the sealing resin 16 and the thin metal plate 11 to be formed later. This is also to prevent part of the thin metal plate 11 from being etched from the 11a side during chemical etching to be described later.

Next, using a fine gold wire with a diameter of 26 μm as the metal wire 14, the integrated circuit element 130 input/output electrode 132L and the surface treated part 111L of the gold@thin plate 11 by nickel plating and gold plating are bonded by wire bonding. were electrically connected as shown in FIG. 1(b).

Input/output electrode 131L of integrated circuit element 13 and thin metal plate 11
After making the necessary electrical connections with the one surface 11a, molding is performed using a sealing molding material such as epoxy resin by a transfer molding method, and the integrated circuit element 13, metal wire 14 and thin metal plate 11 are sealed with the sealing resin 15. One surface 111L side was coated and protected, and FIG. 1 (Cj) was obtained.

The method for forming the sealing resin 16 described above will be explained in more detail using FIG. 3. The thin metal plate 11 on which the integrated circuit element 13 is mounted and fixed by adhesive, and the necessary electrical connections are made with the metal wire 14, is brought into contact with the lower mold 16a of the transfer molding mold 16 heated to the molding temperature. , lower mold 1
68 and the upper mold 16b, a sealing molding material consisting of an epoxy resin as a main component, a hardening agent, a filler, and other additives is injected into the molding mold 16 under heat and pressure. ) 180 and held for a certain period of time to harden, then taken out from the transfer molding die 16 to form a sealing resin 16. In FIG. 3, reference numeral 16d designates an air vent for discharging the air inside the molding die 16 when the sealing material is injected.

In the present embodiment described above, the metal thin plate 11 is a flat plate and does not have any openings such as through holes.
There is no need for any means to prevent the resin from flowing out to the other surface 11b of the thin metal plate 11, and one surface 111L of the thin metal plate 11 on which the resin is formed has no irregularities, and the other surface 11b is also flat. Since there is no pattern formed, the mold can be clamped with sufficient pressure during mold clamping, and the molding die 16
The resin adhered well to the thin metal plate 11, the sealing resin 15 did not leak out, the generation of thin flakes was prevented, and the sealing resin 16 could be formed satisfactorily.

As for the method of forming the sealing resin 15, a transfer molding method using a sealing molding material mainly composed of epoxy resin has been described, but in addition to this, a phenolic resin may be used as the sealing molding material. Alternatively, injection molding using a thermoplastic resin may be used.

Next, an etching resist film was formed on the other surface 11b of the thin metal plate 11, unnecessary portions of the metal were removed by chemical etching, and the etching resist film was removed to give the thin metal plate 11 a desired shape. After this, the thin metal plate 1 of the desired shape is
10 surface is subjected to surface treatment by nickel plating and gold plating to form external connection terminals 11c, as shown in FIG.
d) was created. Note that the broken line portion 11d in FIG. 1(d)
is a connection portion of the external connection terminal 110, which partially connects a plurality of integrated circuit devices and also serves as a conductor as a lead for performing the above-mentioned surface treatment by plating.

Thereafter, the connecting portion 11d of the thin metal plate 11 was cut and removed, and each integrated circuit device was separated. As a result, a completed integrated circuit device according to the manufacturing method of this embodiment shown in FIG. 2 was obtained.

In this way, after the integrated circuit element 13 is mounted and connected to the thin metal plate 11 via the insulating adhesive 12 and the sealing resin 16 is formed, a pattern is formed and the surface of the thin metal plate 11 is plated with nickel and gold. Since the external connection terminal 11C was formed by applying surface treatment by polishing, it was possible to prevent scratches and dirt from occurring on the surface of the external connection terminal 110, and the appearance quality could be ensured.

The dimensions of the integrated circuit device according to this embodiment shown in FIG.
0ff, Yo: 712ffl, radius of curvature of four corners 1.51
In RM, the thickness of the external connection terminal 11C and the sealing resin 16 was 0.65JII, and the dimensional accuracy was extremely good, and the dimensional variation was small, being ±20 μm or less in the thickness dimension.

For each radical method of thickness, the external connection terminal 110 is approximately 0.
,04! I1M, integrated circuit element 13 is 0.36MM.

The thickness of the insulating adhesive 12 under the integrated circuit element 13 is 0.03n.
The sealing resin 16 on the 1 integrated circuit element 13 was 0.23 mm.

The shape of the sealing resin 15 of the integrated circuit device according to this embodiment is, as shown in FIG. 16
It has an uneven shape of about μm, and a corner portion 16a is a curved surface with a radius of curvature of about 0.2111.

As described above, the method for manufacturing the integrated circuit device of this example is as follows:
In order to use the thin metal plate 11 as an external connection terminal 11C, a part of the thin metal plate 11 is removed and processed into a desired shape.
This is done after covering the electrical connection portion with the sealing resin 16, and in the process from mounting and connecting the integrated circuit element 13 to patterning the external connection terminals 11Ct, the metal thin plate 11 is a flat plate with no unevenness. Therefore, there is no need for any means to prevent the resin from flowing out during resin sealing, and when the mold is clamped,
The mold can be clamped with sufficient pressure, the upper mold 16b is in good contact with the thin metal plate 11, the sealing resin 16 does not flow out, the generation of thin flakes can be prevented, and the sealing resin 16 is well sealed. I was able to form it.

Further, after the integrated circuit element 13 is mounted and connected to the thin metal plate 11 via the insulating adhesive 12 and the sealing resin 15 is formed, a pattern is formed and the surface of the thin metal plate 11 is plated with nickel and gold. Since the external connection terminal 110 was formed by surface treatment, the external connection terminal 1
It was possible to prevent the occurrence of scratches and dirt on the surface of 1c, and the appearance quality was ensured.

In addition, since the shape processing of the metal thin plate 11 was performed after the formation of the sealing resin 16, even if the thickness of the metal thin plate 11 is made extremely thin at 36 μm, the stability during process transportation is high, and the metal thin plate 1
1 can be made thinner, the integrated circuit element 13 and the sealing resin 1 can be made thinner.
6 could be made thicker, and the strength of the integrated circuit device could be improved.

In addition, the thin metal plate 11 is made extremely thin, and the external connection terminal 1
Since the formation process of 1c was carried out by chemical etching, a fine pattern could be formed.

Further, the insulating adhesive 12 is applied to one surface 112L of the thin metal plate 11 forming the sealing resin 15, excluding the electrical connection portion.
Since the metal thin plate 11 and the sealing resin 15 were provided in a large portion thereof, sufficient strength of the adhesion between the thin metal plate 11 and the sealing resin 15 was obtained.

Effects of the Invention As described above, the present invention mounts an integrated circuit element on one side of a thin metal plate via an insulating adhesive, and electrically connects the input/output electrodes of the integrated circuit element to one side of the thin metal plate. Then, the integrated circuit element and the electrical connection portion are covered with the sealing resin on one side of the thin metal plate, and then,
This is a method of manufacturing an integrated circuit device in which a part of the thin metal plate is removed and the thin metal plate is used as an external connection terminal having a desired shape.

This makes it possible to solve cost, quality, and other problems associated with substrate formation, such as the formation of expensive through-holes, which have been conventionally used, and it becomes possible to manufacture thin integrated circuit devices at low cost and with high quality.

At the same time, the process of removing a part of the thin metal plate and shaping it into the desired shape in order to provide terminals for external connections is carried out after the integrated circuit element and electrical connection parts are covered with sealing resin. In the process from mounting connection to patterning of external connection terminals, since the metal thin plate is used, it has the following numerous effects.

(2) There is no need for any means to prevent the resin from flowing out during resin sealing, the sealing resin does not flow out, the generation of thin burrs can be prevented, and the sealing resin can be formed satisfactorily.

■ Since the surface treatment of the external connection terminal can be performed after each process, it is possible to prevent scratches and dirt from occurring on the surface of the external connection terminal, and to ensure the quality of the external appearance.

■ Even if the thickness of the thin metal sheet is made extremely thin, it remains stable during process transportation, and by making the thin metal sheet thinner, the thickness of the integrated circuit element and sealing resin can be increased, improving the strength of the integrated circuit device. be able to.

■ In the process from mounting and connecting the integrated circuit element to forming external connection terminals, each input and output electrode of the integrated circuit element is all connected to one continuous thin metal plate and has the same potential.
Integrated circuit elements are not destroyed by static electricity during these steps.

In addition, since the thin metal plate is made extremely thin and the external connection terminals are formed by chemical etching, it is possible to form fine patterns.

Furthermore, since the insulating adhesive material is provided on most of one surface of the thin metal plate forming the sealing resin, excluding the electrical connection portion, the adhesion between the thin metal plate and the sealing resin is improved.

As described above, the present invention allows extremely high quality integrated circuit devices to be easily manufactured.

[Brief explanation of the drawing]

FIG. 1 is a longitudinal cross-sectional view of each process for explaining a method of manufacturing an integrated circuit device according to an embodiment of the present invention, and FIG. 2 is a longitudinal cross-sectional view of an integrated circuit device obtained by a method of manufacturing an integrated circuit device according to an embodiment of the present invention. 3 is a vertical sectional view of a container for explaining the method of forming a sealing resin in an embodiment of the present invention, FIG. 4 is a perspective view of a RE card, and FIG. 6 is a part of a conventional IC card. FIG. 6 is a vertical cross-sectional view of a conventional integrated circuit device. 11... Metal thin plate, 11a... - side,
11b...Other side, 110...External connection terminal, 12...Insulating adhesive, 13...
...Integrated circuit element, 14...Metal wire, 16...
...Sealing resin, 16...Molding mold. Name of agent: Patent attorney Shigetaka Awano and 1 other famous painters

Claims (4)

[Claims] (1) An integrated circuit element is mounted on one side of a thin metal plate via an insulating adhesive, the input/output electrodes of the integrated circuit element and one side of the thin metal plate are electrically connected, and one side of the thin metal plate is In the integrated circuit device, the integrated circuit element and the electrical connection portion are covered with a sealing resin, and then a part of the metal thin plate is removed, and the metal thin plate is used as an external connection terminal of a desired shape. Production method. (2) The method for manufacturing an integrated circuit device according to claim 1, wherein the insulating adhesive is provided on most of one surface of the thin metal plate forming the sealing resin, excluding the electrical connection portion. (3) The method of manufacturing an integrated circuit device according to claim 1, wherein the process of removing a portion of the thin metal plate and shaping it into a desired shape is carried out by chemical etching. (4) The method for manufacturing an integrated circuit device according to claim 1, wherein the sealing with the sealing resin is performed using a mold.