JP2007115183A - Non-contact ic tag having ic chip breakdown prevention structure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a non-contact IC tag preventing IC chip from being compressed to breakdown by arranging a strip-like structure on both sides of the IC chip. <P>SOLUTION: In the non-contact IC tag 1 having the IC chip breakdown prevention structure, an antenna pattern 2 is formed on a base film surface 11, the IC chip 3 is mounted, wherein the non-contact IC tag has a surface protective member. In the non-contact IC tag in which two sheets of strip-like structures 10a and 10b are arranged with an interval so as to form a parallel band-shaped groove on the both sides of the IC chip 3 between the surface protective member and the base film 11, the load of the IC chip at compression breakdown is 1,000 N or more, otherwise the load of a part other than the strip-like structures 10a and 10b is three times or more as large as a non-contact IC tag having the same structure. In addition, it is preferable that the thickness of the strip-like structures is not larger than the equivalent thickness of the IC chip 3. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

The present invention relates to a non-contact IC tag having an IC chip destruction prevention structure. Specifically, a strip-shaped structure for protecting an IC chip is inserted into the IC tag layer structure at intervals so as to form a groove parallel to both sides of the IC chip, and the IC chip is disposed in the groove. The non-contact IC tag is configured so that the IC chip is not directly subjected to external force.
Such a non-contact IC tag can be used as a normal IC tag. In particular, a non-contact IC tag that can be suitably used in an environment where the IC tag is susceptible to external force, such as transportation, logistics, product manufacturing process, construction site, etc. Concerning

Non-contact type IC tags record and hold information and can exchange information by communicating with external devices in a non-contact manner, so that they can be used as recognition media in transportation and logistics, or for various purposes such as product quality control and inventory management. It has come to be used frequently.
However, when a non-contact type IC tag is used as a physical distribution label, inevitable stress is often applied from the outside during physical distribution. In particular, when the IC chip part receives an impact, it is fatally damaged. Therefore, a structure for protecting the IC chip portion has been conventionally considered. However, there is a problem that a non-contact IC tag cannot be manufactured at a low cost because of a complicated structure.
In particular, a non-contact IC tag having a flat surface (planar surface) has been demanded in the past, and the problem of increasing the manufacturing load for realizing this is significant.

  As an unavoidable structural problem of the non-contact IC tag, there is a problem that the thickness of the IC chip is much larger than that of the base film or the like. Although the IC chip is reduced in size and thinned, recent IC chips also have a planar size within 0.2 mm to 2 mm square and a thickness of 150 μm to 500 μm. Therefore, even if the IC chip is mounted with the antenna pattern formed on the base film surface and the surface protective member is covered and flattened, the IC chip portion becomes bulky when the IC tag labels are stacked.

This stacked state can be considered as a case where the IC chip is damaged. When non-contact IC tag labels are used, several to dozens are often stacked. To make it easier to use, it is normal to align the labels. Inevitably, the IC chip portions will inevitably overlap in the vertical direction. When a heavy object is placed on the label in the stacked state, any one of the IC chips that are in a vertical positional relationship receives an impact, and the IC chip that is a silicon crystal is destroyed. In this case, a defective label is suspected in an unused state. Another cause is that even when an IC tag attached to a hard adherend collides with another hard object, the protruding IC chip portion is susceptible to impact.
The cause of the failure of the IC chip is not only these causes, but it is considered that the thick IC chip 3 is easily damaged when it contacts or collides with a hard structural material such as metal.

For reference, an embodiment of an actual common contactless IC tag is illustrated in FIG.
In the non-contact IC tag 1, an antenna pattern 2 is formed on the surface of a base film 11, and IC chips 3 are mounted on both ends 2a and 2b of the antenna pattern 2 in the form of a coiled coil. In FIG. 8, the metal foil laminated on the transparent base film 11 is photo-etched to form the coiled antenna pattern 2, and is a view seen from the side to be attached to the adherend. One end of the antenna coil is connected to the conduction circuit 17 passing through the back surface of the base film by using a caulking tool or the like so as to communicate with both ends 2a and 2b of the antenna coil connected to the IC chip 3. The pads of the IC chip 3 are connected to both end portions 2a and 2b by a conductive adhesive or the like. Although not shown, a thickness adjustment pattern may be provided around the IC chip 3, but the metal foil for antenna has a thickness of about 20 μm to 35 μm and does not correspond to the thickness of the IC chip 3.

Patent Documents 1 and 2 are documents related to a non-contact IC card belonging to the same technical field as the non-contact IC tag. In any case, it is an object to realize a uniform thickness of the entire IC card and smooth the surface. Non-contact IC tags have been flattened to achieve the same problem, but the selection of materials and the like is limited in non-contact IC tags that are desired to be low in price. Further, there has been a problem that even if the surface is as flat as possible, the above-mentioned damage to the IC chip cannot be completely prevented.
Patent Document 3 relates to a method of manufacturing an IC tag label, but has a problem of realizing a flat IC tag label. Patent Document 4 is a content related to a prior application having the same meaning as the present application, but differs from the present application in that a protective member provided with a punched hole is inserted only in the peripheral portion of the IC chip.
Patent document 5 is also a prior application having the same effect as the present application, but does not examine the compression fracture strength of the IC chip.

JP-A-7-266767 JP-A-8-194801 JP 2003-67708 A Japanese Patent Application No. 2005-051036 Japanese Patent Application No. 2005-151967

In the method of uniforming the thickness conventionally employed in the IC card, it is difficult to reduce the manufacturing cost, and there is a problem in material selection. Further, the non-contact IC tag of Patent Document 4 has been found to have a problem that a slight difficulty occurs in the actual manufacturing process.
Therefore, in the present invention, the structure is inserted into both sides of the IC chip portion to form a breakage prevention structure, the thickness of the structure is preferably equal to or less than that of the IC chip, and the entire thickness is reduced. The research has been completed to achieve the compressive fracture strength of an IC chip that could not be realized with the non-contact IC tag of the present invention.

  A first aspect of the present invention for solving the above problems is a non-contact IC tag having a surface protection member for forming an antenna pattern on a surface of a base film, mounting an IC chip, and covering them, and the surface protection member and the base film. In a non-contact IC tag in which two strip-shaped structures having a thickness equal to or less than that of the IC chip are arranged on both sides of the IC chip so as to form parallel strip-shaped grooves, A non-contact IC tag having an IC chip destruction prevention structure characterized in that the load at the time of compressive fracture is three times or more that of a non-contact IC tag having the same structure except for a strip-shaped structure .

  A second aspect of the present invention that solves the above-described problems is a non-contact IC tag having a surface protection member for forming an antenna pattern on a base film surface, mounting an IC chip, and covering the IC chip, and the surface protection member and the base film. In a non-contact IC tag in which two strip-shaped structures having a thickness equal to or less than that of the IC chip are arranged on both sides of the IC chip so as to form parallel strip-shaped grooves, A non-contact IC tag having an IC chip breakage prevention structure characterized in that the load at the time of compressive breakage is 1000 N or more.

  According to a third aspect of the present invention for solving the above-described problems, in the non-contact IC tag having an antenna pattern formed on the base film surface and mounting an IC chip and covering the surface, the surface protection member and the base film In a non-contact IC tag in which two strip-shaped structures are arranged at intervals so as to form parallel strip-shaped grooves on both sides of the IC chip, the load at the time of IC chip compression failure is The non-contact IC tag having an IC chip destruction preventing structure characterized by being 1000 N or more.

In the first and second inventions, the thickness of the strip structure is a paper or plastic film having a uniform thickness of 60% or more of the thickness of the IC chip, or a magnetic material sheet having a uniform thickness of 60% or more, It can be.
In the third invention, the thickness of the IC chip is in the range of 150 μm to 210 μm, and the strip-like structure is a paper or plastic film having a uniform thickness of 250 μm or less, or a uniform thickness of 60% or more. Magnetic material sheet.

  In the non-contact IC tag having the IC chip destruction preventing structure according to the present invention, the strip structure is inserted so as to form a parallel groove on both sides of the IC chip, so that the IC chip is positioned in the groove. Therefore, the load at the time of compressive fracture of the IC chip is 1000 N or more, so even if the normal IC tag is handled, the IC chip is less likely to be broken like a conventional non-contact IC tag.

The present invention relates to a non-contact IC tag (hereinafter also simply referred to as “non-contact IC tag”) having an IC chip breakage preventing structure, and will be described below with reference to the drawings.
1 is a schematic plan view showing an example of a non-contact IC tag of the present invention, FIG. 2 is a cross-sectional view thereof, FIG. 3 is a diagram for explaining a method of manufacturing a non-contact IC tag, and FIG. 4 is a non-contact IC. FIG. 5 is a diagram for explaining another method for manufacturing a tag, FIG. 5 is a diagram for explaining a processing method of a non-contact IC tag, FIG. 6 is a diagram showing a compression tester, and FIG. 7 is a sample mounting method for the compression tester. FIG.

As shown in FIG. 1, the non-contact IC tag 1 of the present invention has an antenna pattern 2 formed on the surface of a base film 11 and has IC chips 3 attached to both ends 2a and 2b thereof.
On both sides of the IC chip 3, strip-shaped structures 10a and 10b having a uniform thickness are inserted, and parallel strip-shaped grooves 9 are formed by the structures 10a and 10b. The thickness of the structures 10a and 10b is set to be within 1.2 times the thickness of the IC chip 3, and is preferably equal to or rather thin than the IC chip 3 so that the protrusion of the IC chip 3 is reduced. Yes. This strip-shaped structure serves as a protective wall for the IC chip 3 and is caused by external force when the IC chip 3 comes into contact with the IC chip 3 of another non-contact IC tag or collides with another hard object. It is to reduce the impact.

  The width L of the groove 9 is required to accommodate at least the IC chip 3 and is related to the planar size of the IC chip 3, but in the case of an IC chip having a side of less than 1.0 mm, usually 1.0 mm to 5. A width of about 0 mm is sufficient. This is because, if the width is too wide, the structure does not serve as a protective wall against a pointed object and does not produce an impact mitigating effect.

  The non-contact IC tag of the present invention is characterized in that the thickness of the two strip-shaped structures disposed on both sides of the IC chip is 1.2 times or less, or preferably equal to or less than the thickness of the IC chip. Regardless, the load at the time of compressive fracture of the IC chip is that it is three times or more that of the non-contact IC tag having the same structure except that the strip-like structure is excluded. Further, specifically, the load at the time of compressive failure of the IC chip during the compression test of the non-contact IC tag is characterized by being 1000 N or more. A method of measuring the load at the time of IC chip compression failure will be described later.

The cross-sectional structure of the non-contact IC tag 1 of the present invention is such that the strip-shaped structures 10a and 10b are bonded to the surface of the antenna pattern 2 of the base film 11 as shown in FIG. The surface protection member 4 is coated. The surface protection member 4 is bonded via an adhesive layer 5 and is usually configured to cover and protect the entire contactless IC tag 1.
The surface of the base film 11 on the adherend side has an adhesive layer 7. The pressure-sensitive adhesive layer 7 is applied to the base film 11 of the non-contact IC tag 1 in advance by applying the pressure-sensitive adhesive layer 7 to a release paper 8 having a release surface generally called a separator paper. In many cases.

As the strip-shaped structures 10a and 10b, paper or a plastic film can be used as an example.
Adhesive is applied to the antenna pattern surface side of the strip-shaped structures 10 a and 10 b, and is adhered to the antenna pattern 2 surface by the adhesive layer 6. The thickness of the strip-shaped structures 10a and 10b is perfect as a function to prevent destruction if the thickness is 1.4 times that of the IC chip 3, but the thickness equal to or less than that of the IC chip 3 (IC chip 3 The compression fracture strength is also obtained when the thickness is up to about 2/3 of the above. In addition to the thickness of the strip-like structures 10a and 10b, the thickness of the structure cannot be uniformly defined because the protection of the IC chip is affected not only by the thickness of the strip-like structures 10a and 10b, but also by the thickness of the protective member 4 and the base film.

  Therefore, if the thickness of the IC chip is 210 μm, the strip structure 10 can have a remarkable IC chip destruction preventing effect if it has a thickness of about 250 μm to 125 μm, preferably about 250 μm to 150 μm. If it is thick, the effect of preventing destruction is improved, but if it is 250 μm or more (the thickness of the IC chip exceeds 40 μm), the flexibility of the non-contact IC tag is lowered. Therefore, it is preferable that the strip structure 10 is thin if it is thin. However, since the current thickness of the IC chip 3 is limited to about 150 μm, the thickness of the strip-shaped structures 10 a and 10 b of less than 90 μm (less than 60% of the thickness of the IC chip) is that of claim 1 or claim 2. In some cases, the IC chip destruction preventing effect that satisfies the requirements cannot be obtained.

  Even if the thickness of the strip-shaped structures 10a and 10b is not equal to the thickness of the IC chip, the compressive strength is more than three times that of the non-contact IC tag having the same structure as that when the structure is not used. Although the reason for this is not clear, the base film 11 and the surface protection member 4 of the IC chip 3 are compressed and deformed (reduced), and at the same time, the strip structures 10a and 10b and the surface protection member around the IC chip 3 This is considered to be because the force that 4 deforms and repels is applied to the opposite surface side (a pressure receiving plate of a test machine described later), and the force received by the IC chip 3 is alleviated. In many cases, the force received by the IC chip 3 in the usage scene of the non-contact IC tag is a surface force. Therefore, if the IC chip 3 is not destroyed by such an external force, it matches the purpose of use.

  However, even if the strip-shaped structures 10a and 10b do not have a predetermined thickness and the compression fracture strength cannot be achieved, a normal effect of preventing IC chip destruction may be obtained. Even when the strip-shaped structures 10a and 10b do not have the same thickness as the IC chip, the protective member 4 and the base film 11 are interposed between other IC tags. This is because the impact that directly collides can be mitigated. However, non-contact IC tags that cannot achieve the predetermined compressive fracture strength described in the claims are not the subject of the present application.

In addition to paper and plastic film, a magnetic material sheet can be used for the strip-like structures 10a and 10b. The magnetic material sheet refers to a high magnetic permeability sheet-like magnetic material.
Usually, ferrite is used, but there are a) one composed of ferrite alone, b) one composed of a composite material of ferrite and plastic, c) one composed of a composite material of ferrite and metal, plastic.
As the ferrite, ferrite powder or flakes are used. As the plastic, a thermoplastic plastic with good processability can be used, or a thermosetting plastic with good heat resistance can be used. As the metal powder, carbonyl iron powder, atomized powder such as iron-permalloy, reduced iron powder, and the like are used. In addition to molding using plastic, a sintered body or compact of metal powder and ferrite powder may be used. Amorphous magnetic sheets are also known as new materials. The thickness of the magnetic material sheet can also be the same as that of the above paper or plastic film.

When a non-contact IC tag is mounted close to a conductive member such as an object made of a metal material or a metal container, an eddy current is generated in the metal behind the object by an alternating magnetic field generated by an electromagnetic wave for IC tag transmission / reception. Occurs. This eddy current generates a magnetic flux that repels the transmission / reception magnetic flux, which attenuates the transmission / reception magnetic flux, making transmission and reception often difficult.
When a magnetic material sheet is used for the strip-shaped structures 10a and 10b, it is possible to suppress the generation of eddy currents caused by the magnetic flux entering the metal when the transmission / reception magnetic flux passes through the magnetic material sheet. The magnetic material sheet is suitable for use for such an effect.

Next, a method for manufacturing a non-contact IC tag will be described.
The non-contact IC tag 1 can be manufactured by a modified process of the conventional non-contact IC tag manufacturing method. That is, after attaching the IC chip 3 to the antenna pattern 2 of the base film 11 and before laminating the surface protection member 4, a step of aligning and inserting the strip-like structures 10a and 10b is necessary. Such a process is sufficiently possible even with an existing automated line. In the manufacturing process of the non-contact IC tag, since the process of forming the antenna pattern 2 on the base film 11 is well known, the process of inserting the strip-shaped structures 10a and 10b, which is a feature of the present invention, will be described. .

FIG. 3 is a diagram for explaining a method of manufacturing a non-contact IC tag.
To the dispensing unit 20 of the IC tag processing machine, the structure paper 10R with adhesive is supplied from the upper right side in the figure. From the lower left side, an IC chip 3 is already mounted on the antenna pattern 2, and a continuous body 11R of base film 11 cut in one row on which IC tag circuits are formed is supplied at a constant speed. The structure paper 10R with adhesive is cut into a strip-like structure 10 having a predetermined length by a cutting blade 23 of a rotary cutter 21 that rotates in synchronization with the dispensing unit 20. The cutting length is shorter than the pitch of the non-contact IC tag by an amount corresponding to the width L of the groove 9.
At this time, the surface of the strip structure 10 on the side not in contact with the drum 22a of the dispensing unit 20 is the surface of the adhesive layer 6 (see FIG. 2). The drum 22a of the dispensing unit 20 immediately adsorbs the strip-shaped structure 10 cut by the vacuum suction mechanism, and rotates and conveys the state while maintaining the state.

When the drum 22a of the dispensing unit 20 transports the strip-shaped structure 10 to a position where it comes into contact with the base film continuum 11R, the strip-shaped structure 10 becomes the base by the pressing force between the drum 22a and the drum 22b. It is stuck on the continuous body 11R side of the film.
At this time, at the rotational speed (circumferential speed) of the drums 22a and 22b of the dispensing unit and the transport speed of the base film continuum 11R, the transport speed of the base film continuum 11R is increased by the width of the groove 9. Has been. That is, the width L of the groove 9 is variable by adjusting the conveyance speed of the continuous body 11R. After sticking the strip-shaped structure 10 to the base film 11, the process of laminating the surface protection member 4 is performed.

FIG. 5 is a diagram for explaining a processing method of a non-contact IC tag.
Said manufacturing method presupposes sticking the strip-shaped structure 10 with respect to the continuous body 11R of a base film in the state of FIG. 5 (A). After the base film continuous body 11R is cut into the non-contact IC tags 1 having individual pitches (FIG. 5B), the strip-shaped structure 10 has two strip-shaped structures of the structure 10a and the structure 10b. Will be divided into bodies.
Thereafter, the surface protective member 4 is further laminated on the surface of the strip-shaped structure 10 and then cut into individual non-contact IC tags or separation lines 12 such as perforation lines between adjacent non-contact IC tags 1 are provided. A continuous body of non-contact IC tags. Also in the case of cutting, the part of the separation line 12 becomes the cutting line 12.

FIG. 4 is a diagram for explaining another method of manufacturing a non-contact IC tag.
In the case of FIG. 4, the strip structure 10 is attached to the base film continuum 11 </ b> R by the label applicator 25. In this case, a label (strip-shaped structure 10) punched into a predetermined size and held on the release film 24 is supplied and attached to the base film continuous body 11R. In this case, pressure-sensitive adhesive processing is performed on the surface of the release film 24 of the label (strip-shaped structure 10). The label (strip-shaped structure 10) is attached by the label applicator 25, and the label (strip-shaped structure 10) peeled off from the release film 24 at the peeling edge 26 of the label applicator 25 is pressure-bonded by rollers 27 and 28. And it sticks to the continuous body 11R of a base film. At this time, the label is attached in synchronization with the mark provided on the base film continuum 11R. In this case, it is necessary to prepare a label transfer material provided with labels (strip-shaped structures 10) at predetermined intervals in advance. The release film 24 is removed and wound at the release edge 26 at the same time as the label is attached.

Even if the method is not as described above, the continuous structure sheet is cut into strip-like structures 10a and 10b having different widths with respect to the base film continuous body 11R in which the IC tag circuits are connected on the long side. It is also possible to perform a manufacturing method of laminating and sticking to both sides of the IC chip 3 of the continuous body 11R. In this case, the dispensing unit 20 is not used and a planar line processing apparatus can be used. This is a suitable method for manufacturing a mass.
After sticking the strip-shaped structures 10a and 10b, the surface protection member 4 is laminated, and then cut into individual non-contact IC tags, or a continuous body of non-contact IC tags provided with separation lines 12 such as perforations. The same can be done.

<Embodiments related to other materials>
(1) Base film A wide variety of plastic films can be used, and the following single films or composite films thereof can be used.
Polyethylene terephthalate (PET), PET-G (terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer), polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, polycarbonate, polyamide, polyimide, cellulose diacetate, cellulose triacetate, Polystyrene, ABS, polyacrylate, polypropylene, polyethylene, polyurethane, and the like.

(2) Strip-shaped structure As the material of the strip-shaped structure, high-quality paper, coated paper, craft paper, glassine paper, synthetic paper, latex or melamine resin-impregnated paper base material can be used. As a plastic film, the simple substance or composite_body | complex of the plastic film for base films mentioned above can be used. Moreover, a magnetic material sheet may be used as described above.
(3) Surface protection member A wide variety of plastic films and paper substrates can be used. The simple substance or composite_body | complex of the above-mentioned paper base material or the plastic film for base films can be used.

(4) Adhesive, pressure-sensitive adhesive In the present specification, the term adhesive refers to various types such as a solvent type, a polymerization type, an ultraviolet curable type, an emulsion type, and a heat-melt type, and so-called pressure-sensitive adhesive types. Shall be included. In either case, the purpose can be achieved by bonding the two materials.
Further, in the present specification, the term “adhesive” refers to an adhesive that keeps an intermediate tack state indefinitely without a significant increase in viscosity.
Adhesive and adhesive resin compositions include natural rubber, nitrile rubber, epoxy resin, vinyl acetate emulsion, polyester, acrylic, acrylate copolymer, polyvinyl alcohol, phenolic resin, Various materials such as can be used.

<About compressive strength test method>
The compression strength test is performed using a compression tester 30 as shown in FIG.
The load cell 32 is attached to the compression load cell attachment plate 31, and the pressure receiving plate 33 is screwed into the load cell 32. The compression plate 34 is also fitted into the base. Since the movable crosshead 35 is movable up and down, the pressure plate 33 can be pressed to compress the sample mounted between the compression plate 34 and the pressure plate 33. The testing machine 30 is operated by the operation panel 36.
The pressure receiving plate 33 and the compression plate 34 are metal plates having parallel horizontal planes facing each other as shown in FIG. 7, and the sample 1S is attached to the surface of the compression plate 34 between the pressing surfaces. The pressure receiving plate 33 is usually 100 mm in diameter. In the case of a non-contact IC tag, a unit of non-contact IC tag is measured with the release paper 8 removed and adhered to the surface of the compression plate 34 with the adhesive layer 7, but within the size of the pressure receiving plate 33. If not, the periphery may be cut so that the IC chip 3 portion is positioned substantially at the center of the pressure receiving plate 33.

In general, the compression yield strength, compression fracture strength, or compression strength (σ _c ) satisfies the relational expression of σ _c = P _c / A (JIS K7056 etc.). A is the original minimum cross-sectional area (mm ² ) of the test piece, and P _c is the load (N) at yield, at maximum load, and at break.
In the case of a non-contact IC tag, it is considered that the compressive strength of the IC chip 3 is maximized. However, since the strength including the periphery is measured, the minimum cross-sectional area cannot be obtained. Eventually, the load (N) at the time of destruction of the IC chip is compared.

As the base film 11 of the non-contact IC tag 1, a base film 11 (continuous film having a width of 54 mm) obtained by dry laminating a 25 μm thick aluminum foil on a transparent biaxially stretched polyester film having a thickness of 38 μm is used. On the other hand, after applying a photosensitive resist, a photomask having an antenna pattern was exposed and exposed.
After exposure and development, photoetching was performed to complete an inlet base film having the antenna pattern 2 as shown in FIG. One antenna pattern 2 has an outer shape of approximately 45 mm × 76 mm.

An IC chip 3 having a plane size of 1.0 mm square and a thickness of 210 μm and having spike-like bumps was attached to both ends 2a and 2b of the inlet base film 11 by applying heat pressure in a face-down state. .
Next, as a film for the strip-like structures 10a and 10b, a PET film having a thickness of 128 μm and a width of 54 mm is used, and a polyester hot melt adhesive is applied to the PET film. 20 was cut to a length of 82 mm and pasted to a base film continuum 11R on which a non-contact IC tag circuit was formed (see FIG. 3). The strip-shaped structure 10 was stuck on both sides of the IC chip 3 so as to form parallel grooves 9 having a width L (see FIG. 1) of 4 mm.

  Furthermore, a surface protective member (coated paper) 4 having a thickness of 40 μm was laminated on the structure 10 via a polyester-based hot melt adhesive sheet and hot-pressed. Next, the back surface of the base film 11 was subjected to pressure-sensitive adhesive processing in which a release paper 8 was laminated via a 32 μm pressure-sensitive adhesive layer 7 to complete a continuous body of the non-contact IC tag 1. Finally, as shown in FIG. 5, the separation line 12 is provided in the form of a perforation line to form a continuous body of the non-contact IC tag 1. One non-contact IC tag label 1 was 54 mm wide × 86 mm long.

Until the formation of the antenna pattern 2, the same material as in Example 1 was used, and the inlet base film was completed by the same process. One antenna pattern 2 has an outer shape of approximately 45 mm × 76 mm.
The IC chip 3 having a planar size of 1.0 mm square and a thickness of 150 μm and having spike-like bumps was attached to both ends 2a and 2b of the inlet base film 11 by applying heat pressure in a face-down state. .

  Next, as a film for the strip-like structures 10a and 10b, a PET film having a thickness of 100 μm and a width of 54 mm is used, and a polyester hot melt adhesive is applied to the PET film. 20 was cut to a length of 82 mm and pasted to a base film continuum 11R on which a non-contact IC tag circuit was formed (see FIG. 3). The strip-shaped structure 10 was stuck on both sides of the IC chip 3 so as to form parallel grooves 9 having a width L (see FIG. 1) of 4 mm.

Further, a surface protective member (coated paper) 4 having a thickness of 40 μm was laminated on the structure 10 via a polyester-based hot melt adhesive sheet and hot-pressed.
Processes after the process of laminating the pressure-sensitive adhesive layer 7 and the release paper 8 were performed under the same conditions as in Example 1.

Until the formation of the antenna pattern 2, the same material as in Example 1 was used, and the inlet base film was completed by the same process. One antenna pattern 2 has an outer shape of approximately 45 mm × 76 mm.
The IC chip 3 having a planar size of 1.0 mm square and a thickness of 150 μm and having spike-like bumps was attached to both ends 2a and 2b of the inlet base film 11 by applying heat pressure in a face-down state. .

Next, as the strip-shaped structures 10a and 10b, a magnetic material sheet having a thickness of 100 μm (manufactured by TDK Corporation, “(trade name) IRL02”) was subjected to adhesive label processing to obtain a label transfer material. One label-like magnetic material sheet was 54 mm wide and 82 mm long.
The label transfer material of the magnetic material sheet is aligned with the base film continuous body 11R on which the non-contact IC tag is formed as shown in FIG. Were attached so as to form parallel grooves 9 having a width L (see FIG. 1) of 4 mm.

Further, a surface protective member (coated paper) 4 having a thickness of 40 μm was laminated on the structure 10 via a polyester-based hot melt adhesive sheet and hot-pressed.
Processes after the process of laminating the pressure-sensitive adhesive layer 7 and the release paper 8 were performed under the same conditions as in Example 1.

Until the formation of the antenna pattern 2, the same material as in Example 1 was used, and the inlet base film was completed by the same process. One antenna pattern 2 has an outer shape of approximately 45 mm × 76 mm.
The IC chip 3 having a planar size of 1.0 mm square and a thickness of 150 μm and having spike-like bumps was attached to both ends 2a and 2b of the inlet base film 11 by applying heat pressure in a face-down state. .
Next, as a film for the strip-like structures 10a and 10b, a PET film having a thickness of 180 μm and a width of 54 mm is used, and a polyester hot melt adhesive is applied to the PET film. 20 was cut to a length of 82 mm and pasted to a base film continuum 11R on which a non-contact IC tag circuit was formed (see FIG. 3). The strip-shaped structure 10 was stuck on both sides of the IC chip 3 so as to form parallel grooves 9 having a width L (see FIG. 1) of 4 mm.

Further, a surface protective member (coated paper) 4 having a thickness of 40 μm was laminated on the structure 10 via a polyester-based hot melt adhesive sheet and hot-pressed.
Processes after the process of laminating the pressure-sensitive adhesive layer 7 and the release paper 8 were performed under the same conditions as in Example 1.

A non-contact IC tag was manufactured under the same conditions as in Example 4 except that a paperboard having a thickness of 120 μm and a width of 54 mm was used as the strip-shaped structures 10a and 10b. A non-contact IC tag circuit was formed by cutting the strip-shaped structure 10 coated with a polyester hot melt adhesive into a length of 82 mm using a dispensing unit 20 of an IC tag processing machine. The process which sticks to the continuous body 11R of a base film was performed (refer FIG. 3).
The strip-shaped structure 10 was stuck on both sides of the IC chip 3 so as to form parallel grooves 9 having a width L (see FIG. 1) of 4 mm.

Further, a surface protective member (coated paper) 4 having a thickness of 40 μm was laminated on the structure 10 via a polyester-based hot melt adhesive sheet and hot-pressed.
Processes after the process of laminating the pressure-sensitive adhesive layer 7 and the release paper 8 were performed under the same conditions as in Example 1.

[Comparative Example 1]
Until the formation of the antenna pattern 2, the same material as in Example 1 was used, and the inlet base film was completed by the same process. One antenna pattern 2 has an outer shape of approximately 45 mm × 76 mm.
An IC chip 3 having a plane size of 1.0 mm square and a thickness of 210 μm and having spike-like bumps was attached to both ends 2a and 2b of the inlet base film 11 by applying heat pressure in a face-down state. . However, strip-shaped structures are not used. Processes after the process of laminating the pressure-sensitive adhesive layer 7 and the release paper 8 were performed under the same conditions as in Example 1.

[Comparative Example 2]
Until the formation of the antenna pattern 2, the same material as in Example 1 was used, and the inlet base film was completed by the same process. One antenna pattern 2 has an outer shape of approximately 45 mm × 76 mm.
The IC chip 3 having a planar size of 1.0 mm square and a thickness of 150 μm and having spike-like bumps was attached to both ends 2a and 2b of the inlet base film 11 by applying heat pressure in a face-down state. . However, strip-shaped structures are not used. Processes after the process of laminating the pressure-sensitive adhesive layer 7 and the release paper 8 were performed under the same conditions as in Example 1.

The compressive strength was measured for each of 5 points of the non-contact IC tag of 1 unit of Examples 1 to 5 and Comparative Examples 1 and 2. The measurement was based on “Tensilon universal testing machine RTE-1210” manufactured by A & D Co., Ltd. As a result, in the non-contact IC tags of Examples 1 to 5, the load (N) at the time of breaking the IC chip was 1000 N or more, but the non-contact IC tags of Comparative Example 1 and Comparative Example 2 Were all in the range of 200N to 300N.
Note that 1000 N or more is intended to exceed the measurement range (1000 N) of the testing machine, and thus an absolute value is not obtained.

From the above results, even if the thickness of the strip-shaped structures 10a and 10b is about 1.2 times the thickness of the IC chip 3 or less than the thickness of the IC chip 3, it is about 2/3. Compared with a normal non-contact IC tag without 10a and 10b, it was confirmed that an IC chip destructive load of 3 times or more was obtained.
In addition, the non-contact IC tag of each of the above examples was found to significantly reduce the problems caused by destruction of the IC chip under normal use conditions.

It is a schematic plan view which shows the example of the non-contact IC tag of this invention. FIG. It is a figure explaining the manufacturing method of a non-contact IC tag. It is a figure explaining other manufacturing methods of a non-contact IC tag. It is a figure explaining the processing method of a non-contact IC tag. It is a figure which shows a compression tester. It is a figure which shows the mounting method of the sample of a compression tester. It is a figure which shows embodiment of a general non-contact IC tag.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Non-contact IC tag which has IC chip destruction prevention structure, non-contact IC tag 2 Antenna pattern 3 IC chip 4 Surface protection member 5,6 Adhesive layer 7 Adhesive layer 8 Release paper 9 Groove 10, 10a, 10b Strip-shaped structure Body 11 Base film 12 Cut line, cut line

Claims (7)

In a non-contact IC tag having a surface protection member for forming an antenna pattern on a base film surface and mounting an IC chip, and covering the IC chip, the IC chip is located between the surface protection member and the base film on both sides of the IC chip. In a non-contact IC tag in which two strip-shaped structures having a thickness equal to or less than the thickness are arranged so as to form parallel strip-shaped grooves, the load at the time of IC chip compression failure is reduced. A non-contact IC tag having an IC chip destruction prevention structure, wherein the non-contact IC tag has three or more times the non-contact IC tag having the same structure except for. In a non-contact IC tag having a surface protection member for forming an antenna pattern on a base film surface and mounting an IC chip, and covering the IC chip, the IC chip is located between the surface protection member and the base film on both sides of the IC chip. In a non-contact IC tag in which two strip-shaped structures having a thickness equal to or less than the thickness are arranged so as to form parallel strip-shaped grooves, the load at the time of IC chip compression failure is 1000 N or more A non-contact IC tag having an IC chip breakage preventing structure. In a non-contact IC tag having a surface protection member for forming an antenna pattern on a base film surface and mounting an IC chip and covering them, two pieces are provided between the surface protection member and the base film on both sides of the IC chip. In the non-contact IC tag in which the strip-shaped structures are arranged at intervals so as to form parallel strip-shaped grooves, the load at the time of compressive failure of the IC chip is 1000 N or more A non-contact IC tag having a destruction prevention structure. 3. The contactless structure having an IC chip breakage prevention structure according to claim 1, wherein the strip structure is a paper or plastic film having a uniform thickness of 60% or more of the thickness of the IC chip. IC tag. 3. The non-contact IC having an IC chip destruction preventing structure according to claim 1, wherein the strip-like structure is a magnetic material sheet having a uniform thickness of 60% or more of the thickness of the IC chip. tag. 4. The IC chip breakage preventing structure according to claim 3, wherein the thickness of the IC chip is in a range of 150 [mu] m to 210 [mu] m, and the strip structure is a paper or plastic film having a uniform thickness of 250 [mu] m or less. Non-contact IC tag having. 4. The IC chip destruction preventing structure according to claim 3, wherein the thickness of the IC chip is in a range of 150 [mu] m to 210 [mu] m, and the strip structure is a magnetic material sheet having a uniform thickness of 250 [mu] m or less. Non-contact IC tag.