JP4612434B2 - Non-contact IC tag and non-contact IC tag mounting method - Google Patents

Description

The present invention relates to a non-contact IC tag and a non-contact IC tag mounting method. Specifically, the present invention relates to a non-contact IC tag and a non-contact IC tag mounting method considering an IC chip breakage prevention structure.
The non-contact IC tag of the present invention is used for a non-contact IC tag label, a tag attached to a luggage, a case, etc., a slip, or the like. Therefore, the main application fields of the present invention are fields such as transportation, distribution, inventory management, and factory process management.

Non-contact type IC tags record and hold information and can exchange information by communicating with external devices in a non-contact manner, so that they can be used as recognition media in transportation and logistics, or for various purposes such as product quality control and inventory management. It has come to be used frequently.
However, when a non-contact type IC tag is used as a physical distribution label, inevitable stress is often applied from the outside during physical distribution. In particular, when the IC chip part receives an impact, it is fatally damaged. Therefore, a structure for protecting the IC chip portion has been conventionally considered. However, there is a problem that a non-contact IC tag cannot be manufactured at a low cost because of a complicated structure.
In particular, a non-contact IC tag structure having a flat (planar) surface state has been demanded in the past, and the problem of increasing the manufacturing load for realizing the structure is remarkable.

  As an unavoidable structural problem of the non-contact IC tag, there is a problem that the thickness of the IC chip is much larger than that of the substrate or the like. Although the IC chip is reduced in size and thinned, recent IC chips also have a planar size within 0.2 mm to 2 mm square and a thickness of 100 μm to 500 μm. Therefore, even if the antenna pattern is formed on the substrate surface, the IC chip is mounted, and the protective member is covered and flattened, the IC chip portion becomes bulky when the IC tag labels are stacked.

This stacked state can be considered as a case where the IC chip is damaged. When non-contact IC tag labels are used, several to dozens are often stacked. To make it easier to use, it is normal to align the labels. Inevitably, the IC chip portions will inevitably overlap in the vertical direction. In this state, when a heavy object is placed on the label from the upper surface, any one of the IC chips that are in a vertical positional relationship receives an impact, and the IC chip that is a silicon crystal is destroyed. In this case, a defective label is suspected in an unused state.
Another cause is that even when an IC tag attached to a hard adherend collides with another hard object, the protruding IC chip portion is most susceptible to impact.
The cause of the failure of the IC chip is not only these causes, but it is considered that the thick IC chip 3 is easily damaged when it contacts or collides with a hard structural material such as metal.

  For reference, an actual contactless IC tag embodiment is illustrated in FIG. In the non-contact IC tag 1, an antenna pattern 2 is formed on the surface of a base material (base film) 11, and an IC chip 3 is attached to both end portions 2 a and 2 b of the antenna pattern 2 having a winding coil shape. In FIG. 5, the antenna pattern 2 is formed by photo-etching a metal foil laminated on a transparent base material 11, and is a view seen from the side to be attached to an adherend. One end of the antenna coil is connected to the conduction circuit 7 passing through the back surface of the base material by using a caulking tool or the like so as to communicate with both ends 2 a and 2 b of the antenna coil connected to the IC chip 3. The pads of the IC chip 3 are connected to both end portions 2a and 2b by a conductive adhesive or the like. Although not shown, a thickness adjustment pattern may be provided around the IC chip 3, but the metal foil for antenna has a thickness of about 20 μm to 35 μm and does not correspond to the thickness of the IC chip 3.

Patent Documents 1 and 2 are applications relating to non-contact IC cards belonging to the same technical field as the non-contact IC tag. In any case, it is an object to realize a uniform thickness of the entire IC card and smooth the surface. Non-contact IC tags have been flattened to achieve the same problem, but the selection of materials and the like is limited in non-contact IC tags that are desired to be low in price. Further, there has been a problem that even if the surface is as flat as possible, the above-mentioned damage to the IC chip cannot be completely prevented.
Patent Document 3 relates to a method of manufacturing an IC tag label, but has a problem of realizing a flat (planar) IC tag label.

JP-A-7-266767 JP-A-8-194801 JP 2003-67708 A

  Therefore, in the present invention, the direction to achieve uniform thickness of the entire non-contact IC tag is to change the way of thinking, and to prevent damage to the IC chip by increasing the thickness of only the IC chip part and reinforcing the protection. The present invention has been completed based on the idea.

The first of the gist of the present invention that solves the above problems is that an antenna pattern is formed on a substrate surface, an IC chip is mounted thereon, a protective member for covering them is provided, and the antenna pattern on the opposite side of the substrate pattern is provided. A non-contact IC tag having a pressure-sensitive adhesive layer on a surface, having a punched hole penetrating at least an IC chip portion and sized to surround the IC chip, and is 1/10 of the IC chip around the punched hole A thin layer structure having a uniform thickness of about 1/2 to about 1, and the adherend side when mounted is flat and the surface opposite to the adherend is thinner around the structure body In the non-contact IC tag, the IC chip is inserted between the base material and the protective member so that the IC chip is positioned at the center of the punched hole.

The second of the gist of the present invention for solving the above-mentioned problems is that a non-contact IC tag having a protective member for forming an antenna pattern on a substrate surface and mounting an IC chip and covering them, penetrates at least the IC chip portion. A punching hole that surrounds the IC chip and has a uniform thickness around the punching hole that is about 1/10 to 1/2 of the IC chip. Protect the substrate with a thin layer structure with the body side flat and the surface opposite the adherend thinner around the structure so that the IC chip is positioned at the center of the hole The non-contact IC tag is characterized by being inserted between the members.

  The third of the gist of the present invention for solving the above problems is that an antenna pattern is formed on a substrate surface and an IC chip is mounted, and a non-contact IC tag having a protective member covering the whole is mounted on an adherend. At this time, after a thin layer structure having at least a through hole penetrating the IC chip portion and enclosing the IC chip is bonded to the adherend, the IC chip of the non-contact IC tag is removed. The non-contact IC tag mounting method is characterized in that the non-contact IC tag is attached after being aligned so as to be positioned at the center of the hole.

Since the non-contact IC tag of the present invention employs a structure that surrounds the IC chip, even if the normal IC tag is handled, there are few problems as in the conventional IC tag.
The non-contact IC tag mounting method of the present invention employs a mounting method that takes into consideration the prevention of damage to the IC chip, so that even if a conventional non-contact IC tag is used, the IC tag is less likely to fail. .

The present invention relates to a non-contact IC tag having an IC chip breakage preventing structure and a non-contact IC tag mounting method. The present invention will be described below with reference to the drawings.
FIG. 1 is a schematic plan view showing an example of a non-contact IC tag of the present invention, FIG. 2 is a cross-sectional view thereof, and FIG. 3 is a diagram for explaining various examples of structures used for the non-contact IC tag. These are figures explaining the mounting method of the non-contact IC tag of the present invention.

In the non-contact IC tag 1 of the present invention, the structure 10 is inserted between the base material 11 and the surface side protection member 4 so as to surround the periphery of the IC chip 3 as shown in FIG. The structure 10 is composed of a thin base material 101 and an adhesive layer 102, and has a through hole 103 penetrating the IC chip 3 portion at substantially the center (see FIG. 2). The punched hole 103 does not need to be circular and may be rectangular. Moreover, the keyhole shape which one side opened may be sufficient. In short, any shape that surrounds the IC chip 3 as a whole is acceptable. However, in the case of a circular shape, stress applied to the periphery of the hole is dispersed, so that even a weak material such as paper hardly breaks from the periphery of the hole.
The structure 10 relieves shock or stress when the IC chip 3 comes into contact with the IC chip 3 of another IC tag or collides with another hard object. Although the structure 10 itself will be described in detail later, it is not limited to a rectangular shape, and may be a circular shape or other shapes.

  The size of the punch hole 103 needs to be a size that surrounds (contains) the IC chip 3, and is related to the planar size of the IC chip 3, but in the case of an IC chip having a side of less than 1 mm, it is usually a circular punch In the case of a hole, the diameter is preferably about 1 mm to 5 mm, and even in the case of a square punched hole, one side is preferably about 1 mm to 5 mm. This is because, if the hole is too large, the effect of cushioning against a sharp object is not produced.

The cross-sectional structure of the non-contact IC tag 1 of the present invention is that the antenna pattern 2 is formed on the base material (base film) 11 as shown in FIG. 2, and the IC chip 3 is mounted on both ends 2a and 2b of the antenna pattern. . The protective member 4 includes a surface base material 41 and an adhesive layer 42, and is usually configured to cover and protect the entire non-contact IC tag 1. For the sake of illustration, the adhesive layer 42 and the antenna pattern 2 are illustrated as having a gap, but the antenna pattern 2 or the substrate 11 is actually in close contact. The surface of the substrate 11 on the adherend side has an adhesive layer 5. The pressure-sensitive adhesive layer 5 is a case where the pressure-sensitive adhesive layer 5 is applied in advance to a release paper 6 having a release surface, which is generally called a separator paper, and this is adhered to the substrate 11 of the IC tag 1. There are many. Such a label body is also called an IC tag label 1L.
The IC tag is not limited to a label body, but there is also a card-like one in which a base material and a display body that substitutes for the protective member are inherently bonded. Since this thing is not what is stuck and used, it does not have an adhesive layer. Although such a thing is also called a Rami card, the present invention can be applied to any form of IC tag.

  In the case of FIG. 2, the structure 10 can be a paper base as an example, and an adhesive layer 102 is applied to the antenna pattern surface side of the paper base 101. The structure 10 has the punched hole 103 as described above, and is inserted between the base material 11 and the protective member 4 so that the IC chip 3 is located at the center of the hole.

It is sufficient that the structure 10 has an area surrounding the periphery of the IC chip 3 and is related to the size of the IC tag 1, but at least from half or less of the total area of the IC tag to about 1/10, the smallest In this case, it is considered sufficient to have an area about 1/20 of the total area of the IC tag.
The thickness of the structure 10 is perfect if the thickness is equal to that of the IC chip 3, but the smoothness is somewhat lowered. Even if the thickness is not equivalent to that of the IC chip 3, a sufficient effect can be obtained even when the thickness is about 1/10 to 1/2 of the IC chip 3. Therefore, if the thickness of the IC chip is 500 μm, a remarkable chip destruction preventing effect can be obtained if it has a thickness of about 50 μm to 250 μm, preferably about 100 μm to 250 μm. Even when the structure 10 does not have the same thickness as the IC chip, the protective member 4 and the base material 11 are interposed between other IC tags so that the IC chips directly collide with each other. This is because it can alleviate the impact. However, with the current thickness of the IC chip 3, a significant IC chip breakage preventing effect cannot be obtained with the thickness of the structure 10 of less than 50 μm.

FIG. 3 is a diagram illustrating various examples of structures used for non-contact IC tags. The left side of the figure is a plan view, and the right two columns show the cross section of the left dotted line.
FIG. 3A is an example in which the planar rectangular structure 10 is formed with a circular punched hole 103. The cross section may be a thin layer having a uniform thickness as in the center row, but may have a shape in which the adherend side is a flat surface and the periphery of the upper surface is made thinner as in the right row. In the latter case, since the periphery of the structure 10 can be flattened, the appearance can be improved.
FIG. 3B shows an example in which the planar circular structure 10 is formed with a circular punched hole 103. The cross-sectional shape is the same as that in the case of FIG.
FIG. 3C shows an example in which a planar rectangular structure 10 is formed with a keyhole-shaped punching hole 103. This shape of the punched hole is considered to be convenient when the wiring is arranged in the opening portion extending outward from the central IC chip 3. The cross-sectional shape is the same as that in the case of FIG.

FIG. 3D shows an example in which the planar oblong structure 10 is formed with a square punched hole 103. The cross-sectional shape is the same as that in the case of FIG.
FIG. 3E shows a shape in which the outer part of the central separation groove 103 of the structure 10 having a shape separated into two pieces is joined by a thinner connecting member 105. Such a structure 10 is suitable for the purpose of passing the antenna coil through the central separation groove portion when the IC chip 3 is mounted across the antenna coil as the central portion. Such a shape is difficult to realize with a paper base, but can be easily formed with a plastic molded body, a laminated film, or the like.
Although it is difficult to handle in use, there may be a case where the structure separated into two pieces is simply arranged in parallel on both sides of the IC chip 3 without providing the connecting member 105.

The non-contact IC tag 1 of the present invention can be manufactured in the same process as the conventional IC tag manufacturing method. However, after mounting the IC chip 3 on the antenna pattern 2 of the base material (base film) 11, the protective member In the step before laminating 4, a step of aligning and inserting the structure 10 is required. Such a process is sufficiently possible even with an existing automated line.

<Embodiment related to material of structure>
As the material of the structure 10, various materials such as a paper base or a plastic film, or a plastic molded body or a metal material described below can be used. In the case of a metal material, it is necessary to insulate the surface in contact with the antenna.

(1) Paper substrate Fine paper, coated paper, kraft paper, glassine paper, synthetic paper, latex or melamine resin impregnated paper can be used.
(2) A wide variety of plastic films can be used, and the following single films or composite films thereof can be used by punching or the like.
Polyethylene terephthalate (PET), PET-G (terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer), polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, polycarbonate, polyamide, polyimide, cellulose diacetate, cellulose triacetate, Polystyrene, ABS, polyacrylate, polypropylene, polyethylene, polyurethane, and the like.

(3) Plastic molded body The above-mentioned injection molded product or compression molded product of the plastic material can be used.
(4) Metallic materials Metallic materials such as stainless steel, aluminum, copper, brass, and iron can be used after being press-molded and insulated. In this case, the configuration is the same as that of the washer, but durability can be provided even in a state where the usage environment of the IC tag is inferior and a severe impact is received.

Next, a method for mounting the non-contact IC tag according to the present invention will be described. The mounting method is a mounting method that exerts a remarkable effect when used for a conventional IC tag having no structure.
FIG. 4 is a diagram for explaining a method for mounting a non-contact IC tag according to the present invention.
In this non-contact IC tag mounting method, first, as shown in FIG. 4A, the structure 10 with an adhesive is attached to the portion of the adherend 8 to which the IC tag 1L is to be mounted, where the IC tag 1L is to be mounted. Adhere.
The structure 10 may have the same configuration as that used for any of the above-described non-contact IC tags. Next, the IC tag 1L with an adhesive is attached so that the IC chip 3 is positioned at the center of the punched hole 103 of the structure 10 (FIG. 4B). After the IC tag 1L is mounted, the IC chip 3 is housed in the punched hole 103 of the structure 10, so that the IC chip 3 is less likely to be damaged even when pressed by a hard object from above.
The non-contact IC tag mounting method of the present invention is a simple method as described above, but exhibits a remarkable effect of reducing the damage of the IC chip in the subsequent use process of the IC tag. is there.

  Hereinafter, actual embodiments will be described using examples. Examples 1 to 4 are examples of the non-contact IC tag of the present invention, and Example 5 is an example of the mounting method of the non-contact IC tag of the present invention.

As the structure 10, a latex-impregnated paper having a thickness of 50 μm is used, a circular punching hole having a diameter of 4 mm is formed at the center thereof, punched out so as to have a size of 20 mm × 32 mm, and a hot melt adhesive is applied to one surface. It was prepared by coating to a thickness of 5 μm.
As a base material (base film) of the IC tag, a base material obtained by dry laminating a 25 μm thick aluminum foil on a transparent biaxially stretched polyester film having a thickness of 38 μm is used, and after having a photosensitive resist applied thereto, an antenna pattern is provided. The photomask was exposed and exposed. After exposure and development, photoetching was performed to complete an inlet base film having the antenna pattern 2 as shown in FIG. The antenna pattern 2 has an outer shape of approximately 45 mm × 76 mm.

  The IC chip 3 having a planar size of 1.0 mm square and a thickness of 500 μm and having spike-like bumps was attached to both ends 2a and 2b of the inlet base film by applying heat pressure in a face-down state. Next, the structure 10 prepared above is temporarily bonded so that the IC chip 3 is positioned at the center of the circular hole 103 (see FIG. 1), and then the thickness is 40 μm through a polyester hot melt adhesive. A non-contact IC tag 1 was completed by laminating coated papers and hot pressing. Finally, the back surface of the base material 11 was subjected to pressure-sensitive adhesive processing in which the release paper 6 was laminated via the 55 μm pressure-sensitive adhesive layer 5 and cut into a size of 54 mm × 86 mm to complete a non-contact IC tag label with release paper.

  As the structure 10, a PET-G sheet having a thickness of 110 μm was used, and a punched hole having a square shape with a side of 5 mm at the center was punched out so as to have a size of 18 mm × 30 mm. As a base material (base film) of an IC tag, a base material obtained by dry laminating an aluminum foil with a thickness of 25 μm on a PET-G sheet with a thickness of 80 μm is used, and after applying a photosensitive resist thereto, an antenna as shown in FIG. A photomask having a pattern was exposed and exposed. After exposure and development, the inlet base sheet having the antenna pattern 2 was completed by photoetching. The antenna pattern had an outer shape of approximately 45 mm × 76 mm.

  An IC chip 3 having a plane size of 1.0 mm square and a thickness of 400 μm and having spike-like bumps was attached to both ends 2a and 2b of the inlet base sheet by applying heat pressure in a face-down state. . Next, after placing the previously prepared structure 10 so that the IC chip 3 is positioned at the center of the circular hole 103 (see FIG. 1), a white PET-G sheet having a thickness of 80 μm is laminated. A card-like non-contact IC tag was completed by hot pressing. The size was cut to 54 mm × 86 mm.

A PET sheet having a thickness of 60 μm is used as the structure 10, a circular punching hole with a diameter of 4 mm is formed at the center thereof, and the entire size is punched so as to form a circle with a diameter of 30 mm. The agent was prepared by applying to a thickness of 5 μm.
Other processes and materials were the same as in Example 1, and a non-contact IC tag label with release paper was completed.

As the structure 10, a stainless steel plate having a thickness of 200 μm was used, and a punched hole having a circular shape with a diameter of 6 mm at the center thereof and a circular shape with a diameter of 20 mm and a circular periphery was punched out. A hot melt adhesive was applied on one side to a thickness of 12 μm and prepared.
Other processes and materials were the same as in Example 1, and a non-contact IC tag label with release paper was completed.

As the structure 10, a PET sheet having a thickness of 80 μm was used, and a punched hole having a square shape with a side of 5 mm at the center was punched out so as to have a size of 20 mm × 30 mm.
As a base material (base film) of the IC tag, a base material obtained by dry laminating a 25 μm-thick aluminum foil on a 38 μm-thick transparent biaxially stretched polyester film is used and photoetched in the same process as in Example 1. Thus, the inlet base film having the antenna pattern 2 as shown in FIG. 5 was completed. The antenna pattern had an outer shape of approximately 45 mm × 76 mm.

  An IC chip 3 having a plane size of 0.8 mm square and a thickness of 420 μm and having spike-like bumps was attached to both end portions 2a and 2b of the inlet base film by applying heat pressure in a face-down state. Next, a coated paper having a thickness of 40 μm was laminated through a polyester-based hot melt adhesive and hot-pressed to complete a non-contact IC tag. Finally, the back surface of the base material 11 was processed with an adhesive under the same conditions as in Example 1 and cut to a size of 54 mm × 86 mm to complete the non-contact IC tag label 1 with release paper.

  After applying an adhesive to the adherend side surface of the structure 10 prepared in advance, it is attached to the adherend 8, the release paper of the contact IC tag label 1 completed as described above is removed, and the adhesive layer 5 is used. The IC chip 3 was aligned and bonded so that the IC chip 3 was positioned in the hole 103 portion of the structure 10.

The non-contact IC tags 1 of Examples 1 to 4 were tested for use under the same conditions as the conventional IC tags, but it was found that defects caused by breakage of the IC chip were significantly reduced.
In addition, it was confirmed that the non-contact IC tag attached to the adherend 8 in Example 5 described above was less likely to cause problems due to breakage of the IC chip 3 even in the conventional type.

It is a schematic plan view which shows the example of the non-contact IC tag of this invention. FIG. It is a figure explaining the various examples of the structure used for a non-contact IC tag. It is a figure explaining the mounting method of the non-contact IC tag of the present invention. It is a figure which shows embodiment of a non-contact IC tag.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Non-contact IC tag 2 Antenna pattern 3 IC chip 4 Protection member 5 Adhesive layer 6 Release paper 7 Conduction circuit 8 Substrate 10 Structure 11 Base material

Claims (5)

In a non-contact IC tag having an antenna pattern formed on a substrate surface, mounting an IC chip, having a protective member covering them, and having a pressure-sensitive adhesive layer on the surface opposite to the antenna pattern of the substrate, It has a punched hole that penetrates the IC chip portion, and is a size that surrounds the IC chip, and has a uniform thickness around 1/10 to 1/2 of the IC chip around the punched hole. In this case, a thin layer structure in which the adherend side is flat and the surface opposite to the adherend is made thinner around the structure so that the IC chip is positioned at the center of the punched hole. A non-contact IC tag, which is inserted between a base material and a protective member. In a non-contact IC tag having an antenna pattern formed on a substrate surface and mounting an IC chip and having a protective member for covering them, the IC chip has a hole that penetrates at least the IC chip portion and surrounds the IC chip. And having a uniform thickness of about 1/10 to 1/2 of the IC chip around the punched hole, the adherend side when mounted is flat and the surface opposite to the adherend is A non-contact IC in which a thin-layer structure thinned around the structure is inserted between a base material and a protective member so that the IC chip is positioned at the center of the punched hole tag.   When an IC chip is mounted by forming an antenna pattern on the substrate surface, and a non-contact IC tag having a protective member covering the entire surface is mounted on an adherend, there is at least a through hole penetrating the IC chip portion. Then, after bonding the thin layer structure that surrounds the IC chip to the adherend, the non-contact IC tag is positioned so that the IC chip is positioned at the center of the punched hole, A method for mounting a non-contact IC tag, comprising attaching a contact IC tag. 4. The method of mounting a non-contact IC tag according to claim 3, wherein the thin layer structure has a uniform thickness of about 1/10 to 1/2 of the IC chip . The thin layer structure has a uniform thickness of about 1/10 to 1/2 of the IC chip around the perforated hole, and the adherend side when mounted is a flat surface opposite to the adherend. 4. The method for mounting a non-contact IC tag according to claim 3, wherein the surface is made thinner in the periphery of the structure.

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