JP2004264665A - Ic label to be stuck on card type cd and card type cd using same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC label which can be stuck on the surface a card type CD (compact disc) easily and which makes the CD having the label stuck be used equivalently as the conventional CD without hurting the function and handling property of the conventional CD, and to provide a card type CD using the IC label. <P>SOLUTION: This IC label includes an IC chip 6, an antenna circuit board 1 which is electrically connected to the IC chip 6, cover material 3 which is formed above the IC chip 6 and the antennas circuit board 1 via an adhesive layer 2, and adhesive material 4 which is formed by lamination on the lower surface of the antenna circuit board 1. The thickest part of the IC label card is ≤0.3 mm. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a non-contact type IC label that is attached to a card-type CD (compact disc) to perform CD history management, inventory management, and the like, and a card-type CD using the same.
[0002]
[Prior art]
In recent years, an information recording medium of a type in which an IC chip is built in and information is exchanged via an external information recording / reproducing device has been devised. This information recording medium is called an IC label, an IC card, an IC tag, or the like (hereinafter, referred to as an “IC label”) according to its shape. In a non-contact type IC label, a current flows through a resonance circuit built in the IC label or the like due to an electromagnetic wave emitted from a reader / writer, and information is written to and read from an IC chip. By using the electromagnetic wave, the reader / writer and the IC label can exchange information without contacting each other. Therefore, simple information can be exchanged without bringing the information recording medium into contact with the reading device like a magnetic tape, and no inconvenience such as failure of reading of information due to poor contact does not occur. In addition, an IC label has an advantage that a power supply is not required for an IC label or the like since current flows due to electromagnetic waves emitted from a reader / writer. Further, the IC chip can easily update information and has a large capacity, so that a large amount of information can be recorded as compared with a magnetic tape or the like. Further, since the information written in the IC chip cannot be confirmed visually or the like, the contents of the information can be hidden unless a dedicated reader / writer is used. Further, since the IC chip and the resonance circuit can be reduced in size, an IC label or the like can be made thin and light. It has been proposed to use this medium as, for example, an ID card, a membership card, a commuter pass, a pass ticket, an event numbered ticket, a CD, or the like, or a delivery tag or an identification tag. Also, by attaching an IC label to a book, inventory management can be easily performed in a bookstore or a library, for example. In the future, by attaching an information recording medium with a built-in IC chip to the product and using it in conjunction with electronic money, the product can be obtained simply by the purchaser passing the gate with the built-in reader / writer with the product. A system for performing settlement has been proposed.
In a conventional IC label, a circuit board on which an electronic component such as an IC chip is mounted and a skin layer are bonded via an adhesive. In most cases, the height of the electronic component is 150 μm or more. Therefore, irregularities are generated on the label surface, and the thickest part of the label is almost 0.3 mm or more in most cases.
[0003]
[Patent Document 1]
JP 2000-105806 A
[Problems to be solved by the invention]
The unevenness on the label surface not only impairs the appearance, but also has a high possibility of deteriorating the print quality in decorative printing on the label surface. In addition, when affixed to a card-type CD, inserted into a disk drive or during operation, it interferes in the disk drive, which may lead to a malfunction or failure of the CD.
The present invention relates to an IC label that can be attached to the surface of a card-type CD. The IC label can be easily attached, and the attached CD can be used in exactly the same manner as the function and handling of a conventional CD. The present invention provides an IC label that can be used, and a card-type CD using the same. This makes it possible to easily print illustrations and characters on the label surface by offset printing, sublimation retransfer printing, or the like.
[0005]
[Means for Solving the Problems]
The present invention provides [1] an IC chip, an antenna circuit board electrically connected to the IC chip, a skin material formed above the IC chip and the antenna circuit board via an adhesive layer, and a lower surface of the antenna circuit board. An IC label including a laminated adhesive material, wherein the thickest part is 0.3 mm or less.
The present invention also provides [2] the IC label according to [1], wherein the skin material is a paper base or a polyester base.
The present invention [3], wherein the thickness of the IC chip is 60 to 150 μm, the thickness of the skin material and the antenna circuit board is 30 to 50 μm, and the thickness of the adhesive is 30 to 50 μm. Alternatively, it is the IC label according to the above [2].
Further, the present invention provides [4] an IC label in which the IC chip is flip-chip mounted on an antenna circuit board, wherein the antenna circuit and the IC chip are electrically connected by an anisotropic conductive adhesive. The IC label according to any one of the above [1] to [3].
[5] The present invention also provides any one of the above [1] to [4], wherein a hot melt layer is provided as an adhesive layer between the IC chip mounting side of the antenna circuit board and the skin material. It is an described IC label.
In addition, the present invention provides [6] the difference between the thickest part and the thinnest part in the flatness of the label surface is 0.05 mm or less by setting the thickness of the hot melt layer to the thickness of the IC chip or more and 150 μm or less. The IC label according to any one of the above [1] to [5].
The present invention also provides [7] the IC label according to any one of [1] to [6] above, wherein a circular through hole having a diameter of 15 to 20 mm is provided at the center of the label. .
[8] The IC label according to any one of [1] to [7], wherein an etching pattern of aluminum or copper is used in a circuit forming portion of the antenna circuit board. is there.
[9] The IC label according to any one of [1] to [8], wherein the jumper forming portion of the antenna circuit is disposed on a back surface of the antenna circuit board. is there.
[10] The IC label according to any one of [1] to [9], wherein the mounted IC chip and the jumper are arranged diagonally with respect to the center of the label. It is.
The present invention also provides the IC label according to the above [9] or [10], wherein the jumper portion is formed of a silver paste.
Further, the present invention provides [12] a card-type CD, wherein the IC label according to any of the above [1] to [11] is attached to a surface of the card-type CD.
According to the present invention, in order to keep the total thickness of the IC label within 0.3 mm and maintain the surface flatness, a hot melt layer is interposed between the circuit board and the skin layer, and the center of the label is provided with a CD center hole. It is preferable to provide holes of the same shape or larger. Further, in order to prevent the CD from being unbalanced in a high-speed rotation state in the disk drive, it is preferable to dispose a relatively heavy IC chip and a jumper on the diagonal line of the label.
[0006]
BEST MODE FOR CARRYING OUT THE INVENTION
An IC label according to an embodiment of the present invention will be described with reference to FIG. As shown in FIG. 1, an IC label according to the present invention includes an antenna circuit board 1 on which an antenna circuit 7 is formed, a hot melt layer 2 as an adhesive layer laminated on the antenna circuit board 1, and a hot melt layer 2. It comprises a skin layer 3 laminated thereon, an adhesive 4 laminated on the lower surface of the antenna circuit board 1, and a release layer 5 laminated on the lower surface of the adhesive 4.
The antenna circuit board 1 is made of a thin plastic plate or the like. Thereby, flexibility can be given to the IC label, and the sticking process to the card type CD becomes easy. Further, it can be stuck on not only a flat surface such as the surface of a CD but also a curved surface such as a side surface of a bottle.
In order to reduce the thickness of the IC label to 0.3 mm or less, it is desirable that the antenna circuit board 1 be as thin as possible. However, if the thickness of the antenna circuit board 1 is reduced to less than 30 μm, the strength of the antenna circuit board 1 decreases, and it becomes difficult to hold the IC chip 6 on the antenna circuit board 1, which is not preferable. For this reason, the thickness of the antenna circuit board 1 is preferably in the range of 30 to 50 μm.
[0007]
As a material of the antenna circuit board 1, a film or a sheet using a thermosetting resin or a thermoplastic resin can be used. As thermosetting resin, epoxy resin, phenol resin, urea resin, melamine resin, alkyd resin, acrylic resin, unsaturated polyester resin, diallyl phthalate resin, silicone resin, resin synthesized from cyclopentadiene, tris (2-hydroxyethyl) Resins containing isocyanurate, resins synthesized from aromatic nitriles, trimerized aromatic dicyanamide resins, resins containing triallyl trimethacrylate, furan resins, ketone resins, xyle resins, thermosetting resins containing condensed polycyclic aromatics, etc. Is mentioned.
Examples of the thermoplastic resin include polyethylene, polypropylene, 4-methylpentene-1 resin, polybutene-1 resin, polyolefin resin such as high-pressure ethylene copolymer, styrene resin, polyvinyl chloride, polyvinylidene chloride, polyvinyl alcohol, and polyacrylonitrile. , Polyacrylic plastic, diene plastic, polyimide, polyester, polycarbonate, polyacetal, fluorine resin, polyurethane plastic, and polystyrene thermoplastic elastomer, polyolefin thermoplastic elastomer, polyurethane thermoplastic elastomer, polyester heat Thermoplastic elastomer, polyamide-based thermoplastic elastomer, low-crystalline 1,2-polybutadiene, chlorinated polymer-based thermoplastic elastomer, fluorine Can be used a thermoplastic elastomer, or a thermoplastic elastomer, such as ion crosslinked thermoplastic elastomer, or the like engineering plastic as the material of the antenna circuit substrate 1. In addition, these resins are impregnated into cloth or paper woven with insulating fibers such as glass fiber or cellulose, mixed with short fibers such as glass chopped strands or insulating whiskers, or molded into films. Can be used. Among these, a PET (polyethylene terephthalate) film or a polyimide film is preferably used.
[0008]
The antenna circuit board 1 is provided with an antenna circuit 7, and the circuit forming portion is preferably formed by an etching pattern of aluminum or copper. Alternatively, an aluminum foil is attached, and unnecessary portions of the copper foil or the aluminum foil are removed by etching.
As shown in FIG. 2, the pattern of the antenna circuit 7 is a coil pattern in which one wire electrically connecting one end of the IC chip 6 has a two-dimensional spiral shape. This spiral is a square spiral. Unlike a coil used for a conventional IC label, the antenna circuit 7 has a two-dimensional pattern formed on the same plane as described above. In the case of a three-dimensional shape, the thickness of the IC label is increased by the thickness of the antenna circuit 7, so that the IC label is difficult to bend, and it is difficult to attach the IC label on a curved surface. From the viewpoint of improving the sensitivity, it is preferable that the antenna circuit 7 has a large cross-sectional area of the wiring and a large number of turns of the coil.
2 (front surface) and FIG. 3 (back surface) show a configuration example of the antenna circuit board 1. As a method of forming the jumper portion 8 of the antenna circuit 7, a conductive paste such as a silver paste is preferably screen-printed on the back surface of the antenna circuit substrate 1 and connected to the antenna circuit 7 on the front surface through the through hole 9. Of course, the antenna circuit 7 on the surface can also be formed of a conductive paste.
[0009]
The IC chip 6 is preferably mounted on a terminal portion of the antenna circuit 7 disposed on the antenna circuit board 1 by a flip chip mounting method. As the IC chip 6, for example, an I-CODE chip manufactured by Philips Semiconductors or the like is used. Examples of the connection material include an alloyed connection using ultrasonic waves, a melting point solder, a conductive adhesive, an anisotropic conductive adhesive, and an adhesive. Since an easy and reliable connection is possible, anisotropic conductive bonding is preferable. The agent 10 is used to perform electrical connection with the antenna circuit and fix the antenna circuit board 1.
The thickness of the IC chip 6 used in the present invention is preferably set to 60 to 150 μm. If the thickness is out of the range, the thickness of the hot melt layer 2 as an adhesive layer for absorbing surface irregularities increases, There is a possibility that the IC label total thickness of 0.3 mm or less cannot be secured. If the thickness of the IC chip is less than 60 μm, the physical strength of the IC chip 6 is reduced, and the IC chip 6 is easily broken, resulting in poor workability. As another technique, there is a circuit board 1 in which a copper winding and an IC module are combined, but this is not suitable for a thin IC label because it is difficult to flatten surface irregularities and control the thickness. .
[0010]
The skin layer 3 is preferably a flexible paper base or polyester base, and preferably has a thickness of 30 to 50 μm. The skin layer 3 protects the antenna circuit 7 and the IC chip 6 from impact and can print characters, illustrations, and the like, and it is also preferable to use a high-quality paper or a resin having writeability. When the skin layer 3 is formed of a resin, the surface of the skin layer 3 can have writing suitability by, for example, applying a surface coat with various resins or conductive materials in order to impart toner printing suitability. This is because by directly printing and writing characters and symbols, there is an advantage that information can be confirmed not only by a disk drive (reader / writer) but also by visual observation. Examples of the polyester-based substrate include polyethylene terephthalate, polybutylene rate, polyethylene naphthalate, polycyclohexylene dimethylene phthalate, and polyarylate, and versatile polyethylene terephthalate is preferred.
[0011]
As an adhesive layer, thermoplastic resin such as vinyl acetate, polyvinyl alcohol, polyvinyl butyral, vinyl chloride, methacrylic, acrylic, styrene, polyethylene, polypropylene, polyamide, cellulose, isobutylene, vinyl ether, etc. Adhesives, thermosetting resin adhesives such as urea resin, melamine resin, phenol resin, epoxy resin, isocyanate resin, urethane resin, polyimide resin, polychloroprene, NBR, acrylic rubber, SBR, natural rubber And other rubber-based adhesives. Among these, it is preferable to use the acrylic resin alone or in the form of a solution, an aqueous solution, or an emulsion. It is preferable to use a hot-melt layer as the adhesive layer. By using a thermoplastic resin-based adhesive, when the antenna circuit board 1 and the skin layer 3 are hot-press molded, the IC chip 6 or the antenna on the antenna circuit board 1 is formed. By absorbing the thickness of the circuit 7, the surface can be flattened. However, the thickness of the hot melt layer 2 is preferably not less than the thickness of the thickest component mounted on the antenna circuit board 1 (in most cases, the IC chip 6) and not more than 150 μm. As a material of the hot melt layer 2, in addition to the above-mentioned thermoplastic resin-based adhesive, resins such as styrene / butadiene copolymer, polyvinyl acetate, starch, silicone-based compound, glue, casein, polyvinyl alcohol, polyester, and polyurethane are used. It can be used alone or in the form of a solution, aqueous solution or emulsion.
[0012]
The adhesive material 4 is made of natural rubber, modified natural rubber, synthetic rubber such as styrene-butadiene rubber, acrylonitrile-butadiene rubber, ethylene-vinyl acetate copolymer resin, vinylidene chloride-based resin rubber-based, acrylic-based adhesive, or the like. Become. Normally, the adhesive 4 has a structure that is not exposed to the outside due to the presence of the release layer 5, but has a structure in which the release layer 5 and the adhesive 4 can be easily separated. Therefore, when used, by peeling off the release layer 5, it is possible to make the adhesive material 4 exposed to the outside come into contact with a CD or the like, and attach an IC label.
The release layer 5 means generally what is generally called release paper.
The configuration and the material of the IC label according to the embodiment need not necessarily be as described above.
[0013]
Next, an external view of the IC label according to the embodiment is shown in FIG. Here, the outer shape of an IC label when affixed to a card type CD will be described. The through hole 11 formed in the center of the IC label is the same size as or larger than the insertion hole of the card type CD. However, too large is not desirable in design. Therefore, a diameter of 15 to 20 mm is preferable. The outer circumference of the IC label is equal to or smaller than the outer circumference of the card type CD. Since the size of the card type CD varies depending on the manufacturer, it is not limited here. By sticking this IC label on the card-type CD so as to be centered, it is possible to prevent troubles caused by interference in the disk drive when the card-type CD is operated by the disk drive. Also, as shown in FIGS. 2 and 3, the heavy IC chip 6 and the jumper 8 are arranged on the diagonal line of the label, so that the load balance is not lost and the card type CD is unstable during rotation. It will not be.
[0014]
If the thickness of the IC label exceeds 0.3 mm, the IC label may not operate normally due to interference in the disk drive. Therefore, the thickness of the IC label needs to be 0.3 mm or less. The layer configuration for that is as described above.
[0015]
【The invention's effect】
As described above, according to the present invention, an IC label that can be attached to the surface of a card-type CD can be attached easily, and the attached CD has the functions of a conventional CD. Provided is an IC label that can be used with exactly the same handleability. Also, illustrations and characters can be easily printed on the label surface by offset printing, sublimation retransfer printing, or the like.
[Brief description of the drawings]
FIG. 1 is a sectional view of an IC label according to an embodiment of the present invention.
FIG. 2 is a plan view showing an antenna circuit board (front surface) of the IC label according to the embodiment of the present invention.
FIG. 3 is a plan view showing an antenna circuit substrate (back surface) of the IC label according to the embodiment of the present invention.
FIG. 4 is a plan view showing the outer shape of the IC label according to the embodiment of the present invention.
[Explanation of symbols]
1. 1. antenna circuit board Adhesive layer (hot melt layer)
3. Epidermis layer 4. Adhesive layer5. Release layer 6. IC chip7. Antenna circuit8. Jumper section9. Through hole 10. Anisotropic conductive adhesive 11. Through hole

Claims (12)

An IC chip, an antenna circuit board electrically connected to the IC chip, a skin material formed above the IC chip and the antenna circuit board via an adhesive layer, and an adhesive material laminated on the lower surface of the antenna circuit board. An IC label comprising: a thickest portion having a thickness of 0.3 mm or less. The IC label according to claim 1, wherein the skin material is a paper base or a polyester base. 3. The IC label according to claim 1, wherein the thickness of the IC chip is 60 to 150 [mu] m, the thickness of the skin material and the antenna circuit board is 30 to 50 [mu] m, and the thickness of the adhesive is 30 to 50 [mu] m. 4. The IC label which is flip-chip mounted on an antenna circuit board, wherein the antenna circuit and the IC chip are electrically connected by an anisotropic conductive adhesive. An IC label according to any one of the above. The IC label according to any one of claims 1 to 4, wherein a hot melt layer is provided as an adhesive layer between the IC chip mounting side of the antenna circuit board and the skin material. The difference between the thickest part and the thinnest part in the flatness of the label surface is set to 0.05 mm or less by making the thickness of the hot melt layer not less than the thickness of the IC chip and not more than 150 μm. An IC label according to any one of the above. The IC label according to any one of claims 1 to 6, wherein a circular through hole having a diameter of 15 to 20 mm is provided at the center of the label. 8. The IC label according to claim 1, wherein an etching pattern of aluminum or copper is used in a circuit forming portion of the antenna circuit board. 9. The IC label according to claim 1, wherein the jumper forming portion of the antenna circuit is disposed on a back surface of the antenna circuit board. 10. The IC label according to claim 1, wherein the mounted IC chip and the jumper are arranged diagonally with respect to the center of the label. The IC label according to claim 9, wherein the jumper portion is formed of a silver paste. A card type CD, wherein the IC label according to any one of claims 1 to 11 is attached to a surface of the card type CD.

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