JP3956660B2 - Non-contact type IC tag and method for manufacturing non-contact type IC tag - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a non-contact type IC tag, and more particularly to a non-contact type IC tag for pasting on a circular article such as an optical disc, history management, inventory management, and the like.
[0002]
[Prior art]
Conventional non-contact IC cards and tags are almost rectangular in shape. For example, in the case of a card, a rectangular shape is most suitable for carrying in a wallet or the like. In addition, since the shape of an article is often a rectangular parallelepiped, the tag shape is preferably rectangular in order to perform alignment when sticking.
[0003]
[Problems to be solved by the invention]
However, when affixing to a circular article such as an optical disc, it is difficult to affix with a good balance if the tag shape is rectangular. Also, it doesn't look good. Furthermore, when the circular article is in a high-speed rotation state, the center of gravity tends to become unstable, and the stability of the article itself is lost.
[0004]
The present invention is an IC tag to be attached to a circular article such as an optical disk, and the stability is not lost even when the circular article to which the IC tag is attached is in a high-speed rotation state. It is an object of the present invention to provide a non-contact type IC tag that is excellent in electric efficiency and capable of stable communication even in communication.
[0005]
[Means for Solving the Problems]
The present invention relates to the following.
(1) A non-contact IC tag characterized in that the outer shape is substantially circular or elliptical.
(2) The non-contact IC tag according to (1), wherein the built-in antenna coil is formed in a donut shape.
(3) The non-contact type IC tag according to (2), wherein an adhesive material is laminated on one surface or both surfaces of an IC module including at least an IC chip and a circuit substrate, and can be attached to an article or the like.
(4) The non-contact type IC tag according to (2) or (3), wherein a through-hole is formed in a portion where there is no built-in antenna coil and electronic component.
(5) In any one of (2) to (4), by forming a perforated slit to form a through hole, an unnecessary portion can be easily cut out by hand. The non-contact type IC tag described.
(6) The non-contact type IC tag according to any one of (2) to (5), which includes a step of forming a perforated slit in a portion where there is no built-in antenna coil and electronic component. Production method.
[0006]
DETAILED DESCRIPTION OF THE INVENTION
As shown in FIG. 1, the non-contact IC tag according to the embodiment of the present invention includes an IC module 1, an adhesive layer 2 laminated on the IC module 1, a skin layer 3 laminated on the adhesive layer 2, a circuit The adhesive layer 5 laminated | stacked on the lower surface of the base material 4 and the peeling layer 6 laminated | stacked on the lower surface of the adhesive layer 5 are provided.
[0007]
Here, the IC module 1 is electrically connected to the IC chip 8 on the circuit substrate 4, the IC chip 8 fixed on the circuit substrate 4 with the anisotropic conductive adhesive 7, and the circuit substrate 4. The antenna coil 9 is provided.
[0008]
The circuit substrate 4 according to the embodiment of the present invention is made of a thin plastic plate. By being made of a thin plastic plate, the IC tag according to the embodiment of the present invention can be easily bent, and is attached not only on a flat surface such as the surface of an optical disc but also on a curved surface such as a side surface of a bottle. be able to. Specifically, a polyethylene terephthalate film is used as the material of the circuit substrate 4. If the thickness of the circuit substrate 4 is reduced to less than 30 μm, the strength of the circuit substrate 4 is lowered, and it becomes difficult to hold the IC chip 8 on the circuit substrate 4, which is not preferable. On the other hand, when the thickness of the circuit substrate 4 is 125 μm or more, it is difficult to stick the IC tag on the curved surface, and the weight itself becomes heavy, which is inconvenient to handle. Therefore, the thickness of the circuit substrate 4 is preferably in the range of 30 μm or more and less than 125 μm. More preferably, they are 30 micrometers or more and less than 100 micrometers, More preferably, they are 30 micrometers or more and less than 90 micrometers.
[0009]
The antenna coil 9 is formed by screen-printing a conductive paint on the circuit substrate 4. The antenna coil pattern is shown in FIG. The antenna coil 9 is composed of a coil pattern in which one wiring electrically connected at one end to the IC chip 8 forms a spiral shape two-dimensionally toward the center direction. This spiral is a substantially circular spiral. Moreover, the insulation part 10 is formed so that a coil may be crossed on the one part area | region which comprises a coil. The wiring from the inside of the coil pattern passes over the insulating portion 10 and is taken out of the coil and electrically connected to the IC chip 8. Unlike the coil used for the conventional IC tag, in the IC tag according to the embodiment, the antenna coil 9 is composed of a two-dimensional pattern formed on the same plane as described above. In the case of a so-called three-dimensional shape in which a pattern is formed from the front surface to the back surface of the circuit substrate, the thickness of the IC label is increased by the thickness of the antenna coil 9, so that the IC label becomes difficult to bend and is on a curved surface. This is because it becomes difficult to apply. From the viewpoint of improving the sensitivity of the antenna coil 9, it is preferable to increase the cross-sectional area of the wiring and increase the number of turns of the coil.
[0010]
The skin layer 3 is made of a flexible paper base material. The skin layer 3 protects the antenna coil 9 and the IC chip 8 from impact and can print characters and illustrations. The IC tag according to the embodiment can also be used as a normal label. The adhesive layer 5 is made of an adhesive material such as rubber or acrylic. Normally, the adhesive layer 5 has a structure that is not exposed to the outside due to the presence of the release layer 6, but the release layer 6 and the adhesive layer 5 have a structure that can be easily separated. Therefore, when used, it is possible to attach the IC tag by peeling the release layer 6 so that the adhesive layer 5 exposed to the outside is brought into contact with an optical disk or the like. The pressure-sensitive adhesive material that forms the pressure-sensitive adhesive layer 5 is made of a material having a lower adhesive strength than the material used for the adhesive layer 2. This is to prevent the IC tag from being destroyed due to separation of the skin layer 3 when the IC tag once attached is peeled off.
[0011]
In addition, even if it is other than the above-mentioned polyethylene terephthalate as a material of the circuit base material 4 of the IC tag which concerns on embodiment, it can be used. For example, as a material of the circuit substrate 4, a plate using a thermosetting resin, a plate using a thermoplastic resin, or the like can be used.
[0012]
For thermosetting resins, phenol resin, urea resin, melamine resin, alkyd resin, acrylic resin, unsaturated polyester resin, diallyl phthalate resin, epoxy resin, silicone resin, resin synthesized from cyclopentadiene, tris (2-hydroxyethyl) Resin containing isocyanurate, resin synthesized from aromatic nitrile, trimerized aromatic dicyanamide resin, resin containing triallyltrimethacrylate, furan resin, ketone resin, xylene resin, thermosetting resin containing condensed polycyclic aromatic Etc. can be used as the material of the circuit substrate 4. Examples of the thermoplastic resin include polyolefin resins such as polyethylene, polypropylene, 4-methylpentene-1 resin, polybutene-1 resin, and high-pressure ethylene copolymer, styrene resin, polyvinyl chloride, polyvinylidene chloride, polyvinyl alcohol, poly Acrylonitrile, polyacrylic acid plastic, diene plastic, polyimide, polyester, polycarbonate, polyacetal, fluorine resin, polyurethane plastic, polystyrene thermoplastic elastomer, polyolefin thermoplastic elastomer, polyurethane thermoplastic elastomer, polyester Thermoplastic elastomer, polyamide thermoplastic elastomer, low crystalline 1,2-polybutadiene, chlorinated polymer thermoplastic elastomer, It can be used system thermoplastic elastomer, or a thermoplastic elastomer, such as ion crosslinked thermoplastic elastomers, and the like as the material of the circuit substrate 4. Furthermore, these resins are impregnated with cloth or paper woven with insulating fibers such as glass fibers or cell sources, mixed with short fibers such as glass chopped strands or insulating whiskers, or film-like What was shape | molded in can be used.
[0013]
Further, the antenna coil 9 is not limited to the circuit pattern shown in FIG. 2, but may be other patterns such as meander lines.
[0014]
For the skin layer 3, it is also preferable to use high-quality paper or a resin having writing ability. When the skin layer 3 is formed of a resin, the surface of the skin layer 3 can be provided with writing ability by applying surface coating with various resins or conductive materials, for example, in order to have toner printing ability. This is because not only the information such as books is recorded in the IC chip, but also by directly writing characters and symbols, the information can be confirmed not only by the reader but also visually.
[0015]
Further, as the material of the adhesive layer 2, a resin such as styrene / butadiene copolymer, polyvinyl acetate, starch, silicone compound, glue, casein, polyvinyl alcohol, and polyurethane is used alone or in the form of a solution, an aqueous solution, or an emulsion. be able to.
[0016]
In addition to the materials described above, the adhesive layer 5 may be made of an adhesive base polymer such as natural rubber, modified natural rubber, styrene-butadiene rubber, acrylonitrile-butadiene rubber, or other synthetic rubber, or ethylene-vinyl acetate copolymer resin. Vinylidene chloride resin and the like can be used in the form of a solution or an emulsion.
[0017]
Furthermore, as another embodiment of the present invention, in the IC tag according to the above embodiment, a material having a lower adhesive strength than the adhesive layer 2 is used as the material of the adhesive layer 5. A material having a stronger adhesion than the layer 2 is used. In this case, when the IC tag once attached is peeled off, the IC tag is separated between the skin layer 3 and the circuit substrate 4, and the antenna coil 9 or the IC chip 8 is damaged. Therefore, for example, when used as an IC tag for sealing, it is possible to easily identify whether or not an act such as opening or disassembling has been performed by attaching the surface of the article or between the articles. In addition, when the information recorded on the IC tag is highly confidential, there is an advantage that the content of the information cannot be known because the IC tag is damaged.
Note that the configuration and materials of the IC tag according to the embodiment of the present invention are not necessarily as described above.
[0018]
Next, FIG. 3 shows an outline view of the IC tag according to the embodiment of the present invention. Here, the outer shape of the IC tag when pasted on an optical disk will be described.
[0019]
The through hole 11 formed in the central portion of the IC tag is the same size as or larger than the fitting hole of the optical disc. The outer periphery of the IC tag is the same size or smaller than the outer periphery size of the optical disc. By sticking the IC tag to the optical disc in the center, it is possible to prevent trouble due to interference in the disc drive when the optical disc is operated by the disc drive. Further, since the load of the IC tag is uniformly applied to the surface of the optical disk, it does not become unstable during the rotation of the optical disk. If the thickness of the IC tag is 0.5 mm or more, there is a possibility that the IC tag does not operate normally due to interference in the disk drive. Therefore, the thickness of the IC tag is preferably within 0.5 mm. FIG. 4 is an outline view when a perforated slit 12 is formed on the surface of the IC tag so that the through hole 11 can be easily formed by hand. This is a very effective means when surface printing is performed after the IC tag is formed. If there is a through-hole 11 before printing, printing will drop to the bottom, and blurring, blurring, etc. will occur at the end of the through-hole 11. Therefore, the through holes 11 may be formed after printing without forming the through holes 11 before printing.
[0020]
As described above, the IC tag in which the adhesive layer 5 and the release layer 6 are formed on one side of the IC module is described as an example of the embodiment of the present invention. However, the adhesive layer 5 and the release layer 6 are provided instead of the skin layer 3. Alternatively, the adhesive layer 5 and the release layer 6 may be provided on the skin layer 3.
[0021]
【The invention's effect】
As described above, according to the present invention, it is possible to apply a good balance to a circular article such as an optical disk, and it is possible to maintain stability even when the circular article is in a high-speed rotation state. A non-contact IC tag can be provided. Further, according to the present invention, it is possible to provide a non-contact type IC tag that is excellent in electrical efficiency in communication with a reader and enables stable communication.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of a non-contact IC tag according to an embodiment of the present invention.
FIG. 2 is a plan view showing a circuit pattern of the non-contact type IC tag according to the embodiment of the present invention.
FIG. 3 is a plan view showing the outer shape of the non-contact IC tag according to the embodiment of the present invention.
FIG. 4 is a plan view showing the outer shape of the non-contact IC tag according to the embodiment of the present invention.
[Explanation of symbols]
1: IC module 2: Adhesive layer 3: Skin layer 4: Circuit board 5: Adhesive layer 6: Release layer 7: Anisotropic conductive adhesive 8: IC chip 9: Antenna coil 10: Insulating part 11: Through hole 12: Perforated slit

Claims (4)

Non-contact IC tag for optical discs, the outer shape is circular,
Ri Na comprise IC chip, IC module comprising a circuit substrate and an antenna coil, and a slit for the through-hole forming, a,
Adhesive is laminated on one or both surfaces of the IC module, and the through hole forming slit is perforated, and the size of the through hole forming slit is the same size or larger than that of the optical disc fitting hole. The antenna coil is formed in a donut shape along the outer periphery of the IC tag, and the outer periphery of the IC tag is equal to or smaller than the outer periphery size of the optical disc ,
Non-contact IC tag for optical disc .   2. The non-contact type IC tag for an optical disc according to claim 1, wherein the non-contact type IC tag is attached to an optical disc rotating at high speed. 2. The non-contact type IC tag for optical disks according to claim 1, wherein the thickness of the IC tag is within 0.5 mm.   2. The non-contact type IC tag for an optical disk according to claim 1, wherein the IC chip is fixed to the circuit substrate with an anisotropic conductive adhesive.

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