JP2013250855A - Non-contact ic medium, and packaging material with non-contact ic medium - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a non-contact IC medium that reliably breaks an antenna or the like of a non-contact IC medium to disable communication when a packaging material is opened.SOLUTION: A packaging material with the non-contact IC medium is formed by bonding, with an adhesion layer 15 interposed, a function-breaking packaging material 2 breaking principal functional elements of the non-contact IC medium when the packaging material is opened, to a non-contact IC medium 1 including an antenna 13 and an IC chip 14 that are provided on a one surface part of a support body 11 with a peeling layer 12 interposed therebetween. Adhesive strength between the support body 11 and the antenna 13 constituting the non-contact IC medium 1 is made smaller than adhesive strength between the function-breaking packaging material 2 and the adhesion layer 15.

Description

  The present invention relates to a non-contact IC medium and a packaging material with a non-contact IC medium that are used by being attached to, for example, a container that is a product in order to identify the authenticity of the product containing the product.

  Products such as bottled products with caps that contain specific articles have a “bar code (one-dimensional barcode, two-dimensional barcode)” or “IC tag” that gives meaning to the data related to the production and distribution of the product. “Seal” etc. are used for printing or mounting, product production and distribution management.

  In recent years, IC tags can be attached to products, and data related to products can be read from and written to IC tags using a dedicated data read / write device, enabling product entry / exit management, inventory management, rental management, etc.・ It is attracting attention in the distribution field. Since the IC tag is equipped with an IC chip, it has a feature that it can be managed integrally with the product while storing not only the product code but also various necessary data such as the arrival date and the person in charge.

  By the way, conventionally, for example, a bottle product with a cap containing an article such as high-class liquor has been proposed in which an “IC tag-attached seal” is attached (Patent Document 1). Specifically, the “seal with IC tag” is attached to the cap of the bottle product, and it is used to distinguish the authenticity of the product from the data stored in the “seal with IC tag”.

  However, since the IC tag sticker attached to the cap of the bottle product can communicate with the IC tag even after the package is opened, the sticker is peeled off and attached to the counterfeit product. Counterfeiting was possible.

  Therefore, Patent Document 2 provides anti-counterfeiting technology in which the IC tag is broken at the same time as opening the package and communication becomes impossible when the package is opened. However, the support and the antenna constituting a part of the non-contact IC medium are strong. Therefore, if it is carefully peeled off, it may not be destroyed, and it has not yet been possible to reliably prevent counterfeiting.

Japanese Patent No. 4220184 International Publication No. 2006/016559 Pamphlet

  The present invention has been made in order to solve the above-mentioned problems, and is a non-contact IC medium that prevents the counterfeiting due to the reuse by making the main function surely broken at the time of opening to make communication impossible. And it aims at providing the packaging material with a non-contact IC medium.

  In order to solve the above-mentioned problem, the invention corresponding to claim 1 includes a support made of a predetermined insulating material, a release layer provided on one surface of the support, and the release layer or the release layer. An antenna formed of conductive ink containing conductive particles via an anchor layer applied to the peeling layer, and the transmission / reception of the data without contact with an external device that is electrically connected to the antenna via the antenna An IC chip capable of reading and writing data, and a main functional element is peeled from the support through the peeling layer.

  According to the invention corresponding to the first aspect, by providing the release layer between the support and the antenna, the main functional element such as an antenna can be easily peeled from the support.

  The invention corresponding to claim 2 uses a material having low adhesion to the material of the support as the release layer according to the invention corresponding to claim 1, and is substantially 1 / compared to the support. The thickness is about 20 and the structure is such that at least one main functional element of the antenna and the IC chip can be easily separated from the support.

  In the invention corresponding to claim 3, the antenna according to claim 1 or claim 2 is formed by a predetermined printing method using a conductive paste in which conductive particles are dispersed in a resin binder. It is characterized by that.

  The invention corresponding to claim 4 covers the non-contact IC medium having the structure described in any one of claims 1 to 3 and at least the surface of the antenna of the non-contact IC medium. A functional break wrapping material that breaks the main functional elements of the non-contact IC medium when opened and is bonded via the adhesive layer applied as described above, and the support and the antenna constituting the non-contact IC medium It is a packaging material with a non-contact IC medium, characterized in that the adhesive strength is smaller than the adhesive strength between the packaging material for functional breakage and the adhesive layer.

  According to the invention corresponding to claim 4, when the packaging material for breaking the function is opened, the antenna having a low adhesive strength is broken from the support, and communication with the external device can be disabled.

  The invention corresponding to claim 5 is applied to the functional breakable packaging material according to the invention corresponding to claim 4 in a base material having a function of the packaging material of the adherend and a predetermined portion of the base material. And a perforated cut that breaks when opened.

  According to the invention corresponding to claim 5, when opening using a perforated cut attached to the base material having the function of the packaging material, the adhesive strength between the functional fracture packaging material and the adhesive layer The support and the antenna having a smaller adhesive strength are peeled off through the peeling layer, and the antenna placed in the lower area where the cut is made easily breaks, making it impossible to reuse. It is impossible to reuse counterfeit products.

  The invention corresponding to claim 6 uses a material that shrinks by heating as the substrate according to the invention corresponding to claim 4 or claim 5, and the perforated cut is the main part of the non-contact IC medium. It is characterized in that it is provided so as to pass over at least the antenna area among the functional elements.

  According to the present invention, the antenna or the like can be surely broken at the time of opening to make communication impossible, so that counterfeiting due to reuse can be prevented.

The schematic sectional drawing which shows one Embodiment of the packaging material with a non-contact IC medium which concerns on this invention. The top view when it cuts along the BB line of FIG. The schematic sectional drawing which shows the mode at the time of opening of the packaging material with a non-contact IC medium which concerns on this invention. The figure which shows an example which attached the packaging material with a non-contact IC medium which concerns on this invention to the to-be-adhered body which is a container. The figure which shows an example which attached the packaging material with a non-contact IC medium which concerns on this invention to the to-be-adhered body which is another container.

Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 and 2.
FIG. 1 is a schematic sectional view showing an embodiment of a packaging material A with a non-contact IC medium according to the present invention.

  The packaging material A with a non-contact IC medium is for non-contact IC medium 1 having an IC chip capable of reading and writing necessary information, and function breakage having a function of peeling main functional elements from the non-contact IC medium 1 when opened. It is comprised with the packaging material 2.

  The non-contact IC medium 1 includes a support 11 for supporting an antenna and the like, a release layer 12 provided on one surface portion of the support 11 and easily peeled from the support 11, An antenna 13 made of a conductive pattern formed on the surface of the release layer 12, an IC chip 14 disposed so as to be electrically connected to the antenna 13, and the IC chip 14 so as to cover the antenna 13 And an adhesive layer 15 applied thereto. The IC chip 14 is electrically joined to the antenna 13 by, for example, an adhesive resin (not shown).

  The non-contact IC medium 1 can be used as it is, for example, in a state where a thin film sheet (not shown) that also serves as a packaging material is attached to the adhesive layer 15.

  Further, an anchor layer 16 is provided between the release layer 12 and the antenna 13 as necessary.

Hereinafter, each component of the non-contact IC medium 1 will be described in detail.
<Support 11>
The support 11 is not particularly limited as long as it is an insulating material. For example, a film such as a polyester film, a polypropylene film, a polycarbonate film, and cellophane can be used, but a polyester film is most suitable in terms of characteristics such as surface smoothness, transparency, versatility, and workability, and a thickness of 10 μm to About 100 μm is used.

<Peeling layer 12>
The release layer 12 is applied between the support 11 and the antenna 13. At this time, the adhesive strength between the support 11 and the antenna 13 is higher than the adhesive strength between the functional fracture packaging material 2 and the adhesive layer 15. Designed small. Thereby, when the packaging material 2 for functional breakage is destroyed, the antenna 13 can be easily broken through the release layer 12 having a low adhesive strength.

  Specifically, a material having low adhesion with the material of the support 11 is used as the release layer 12. For example, cellulose resin, urethane resin, acrylic resin, melamine resin and the like can be used, and a polyol component composed of polyether polyol, polyester polyol, and acrylic polyol is the main component, and a prepolymer component having an isocyanate group is the curing agent. A liquid reaction type urethane resin can be used as the most preferable one. Therefore, the release layer 12 is formed by printing the above material on the entire predetermined surface of the support 11 with a film thickness of 0.5 μm to 5.0 μm by gravure printing.

<Antenna 13>
The antenna 13 is preferably formed in a desired pattern by printing, for example, conductive ink made conductive by dispersing any of metal particles in the printing ink.

  The conductive material by this conductive paste is preferably silver, and includes an evaporative drying type silver paste containing a binder resin, a solvent, and silver powder to obtain conductivity by contacting them. For example, it can be formed by printing with a film thickness of 5.0 μm to 20.0 μm by a printing method such as screen printing, flexographic printing, gravure printing, or offset printing. It is also possible to print conductive ink with a printer. As a result, the antenna 13 is easily broken. In addition, you may use the electroconductive material of electroconductive printing ink combining the particle | grains of metals mentioned above, and the particle | grains of carbon (C) which is electroconductive materials other than metals.

<IC chip 14>
The IC chip 14 is a packaged semiconductor integrated circuit (IC) including a simple microcomputer, ROM, RAM, and the like, and is read and written to and from the external device such as a data read / write device via the antenna 13. It is a storage medium that can read and write desired data according to instructions.

  The antenna 13 and the IC chip 14 are connected via an electrical junction. As the electrical joint, metal particle material (anisotropic conductive material) such as ACP (Anisotropic Conductive Paste) and ACF (Anisotropic Conductive Film) and an adhesive binder are used. It is preferable that the electrical connection is realized by curing the adhesive binder under heat and pressure conditions.

<Adhesive layer 15>
Examples of the material for the adhesive layer 15 include acrylic pressure-sensitive adhesives. At this time, the adhesive force between the adhesive layer 15 and the functional breakable packaging material 2 needs to be higher than the adhesive force between the support 11 and the release layer 12 constituting the non-contact IC medium 1. Thereby, the antenna 13 can be reliably broken along the opening of the packaging material 2 for breaking the function.

<Anchor layer 16>
The anchor layer 16 is applied to hold the antenna 13 with good adhesion, but is not necessarily required as long as the antenna 13 can sufficiently maintain adhesion with the release layer 12, for example. For example, the anchor layer 16 can be formed by printing using an epoxy resin-based ink by a printing method such as screen printing, flexographic printing, gravure printing, or offset printing. As a material of the anchor layer 16, a material having a strong adhesive force with an adhesive binder constituting ACP or the like and a high heat resistance is preferable. Thereby, the mounting reliability improvement of the IC chip 14 can be expected. On the other hand, since it is necessary to break along with the opening of the base material 1, the thickness is preferably 5 μm or less, and is designed so as not to be a tough film.

  Next, the function-breaking packaging material 2 has a role of peeling off the main functional elements from the non-contact IC medium 1 when opened. As shown in FIGS. And an adhesive layer 15 on the surface of the antenna 13 including the IC chip 14 constituting the non-contact IC medium 1. Is glued through. FIG. 2 is a plan view of the packaging material A with a non-contact IC medium in FIG. 1 taken along the line BB.

<Substrate 21>
The base material 21 is made of a material that shrinks and deforms by heat, and generally a stretched resin film is used. The thickness is preferably in the range of 50 μm to 100 μm. This can be said to have a moderate strength as the base material 21 and easy heat shrinkage. Examples of the material include OPS (stretched polystyrene), stretched PP (polypropylene), and stretched PET (polyethylene terephthalate).

<Cut 22>
The two perforated cuts 22 are provided to break the main functional elements of the non-contact IC medium 1 belonging to the range of the two cuts 22-22. For example, the antenna 13, the IC chip 14, or the antenna 13 including the IC chip 14 which is the main functional element is provided so as to pass over a region where the antenna 13 is broken.

  FIG. 3 is a schematic sectional view for explaining a state when the packaging material A with a non-contact IC medium is opened.

  First, as described above, a separation between the support 11 and the antenna 13 having an adhesive strength smaller than the adhesive strength between the adherend (not shown) that is a container such as a bottle with a cap and the adhesive layer 15. A layer 12 is provided.

  In addition, the base material 21 is provided on the pattern area of the antenna 13 via the adhesive layer 15, and at this time, the antenna 13, the IC chip 14, or the area of the antenna 13 including the IC chip 14 is straddled. Two cuts 22 are provided, and the base 21 is easily opened using these cuts 22.

  As shown in FIGS. 4 and 5, the packaging material A with a non-contact IC medium is attached to a required portion of the adherends (containers) X and Y. FIG. 4 is a diagram showing an example in which the packaging material A with a non-contact IC medium is attached so as to cover the cap portion of the adherend X which is a bottle with a cap containing articles such as high-class liquor, and FIG. 5 is a box-shaped container. It is a figure which shows the example which attached the packaging material A with a non-contact IC medium so that the surroundings of the four surfaces of a predetermined to-be-adhered body Y might be covered. In addition, in the case of the to-be-bonded body Y which is a box-type container, you may make it attach the packaging material A with a non-contact IC medium only to one surface (opening surface) of the to-be-bonded body Y, for example.

  The attachment of the packaging material A with non-contact IC medium to the adherends X and Y is performed by applying heat to the adherends X and Y after attaching the packaging material A with non-contact IC medium. Can be attached using heat shrinkage. At this time, since the packaging material A with the non-contact IC medium is attached along the shapes of the adherends X and Y, the support 11 of the non-contact IC medium 1 and the adherends X and Y are in complete contact with each other. Therefore, the breaking effect of the antenna 13 becomes higher.

  And after attaching the packaging material A with a non-contact IC medium, if it opens using the two cuts 22 attached | subjected to the base material 21, the base material 21 will fracture | rupture on the boundary of the two cuts 22. FIG. At this time, a part of the non-contact IC medium 1 (inside the cut line 22-22) is peeled off from the release layer 12 together with the base material 21. As a result, the antenna 13 or the IC chip 14 or the antenna 13 including the IC chip 14 bonded to the adhesive layer 15 is broken along with the breakage of the base material 21, and communication with the outside is completely disabled. Therefore, the antenna 13 can be broken at least reliably by opening the base material 21.

Hereinafter, specific examples of the packaging material A with a non-contact IC medium according to the present invention will be described.
(1) About production of non-contact IC medium 1 For example, about 1 micrometer thickness is used with the gravure roll coater using the ink of the following composition (a) with respect to the one surface part of the support body 11 which is a polyester film with a thickness of 25 micrometers. Then, the coating material was cured so as not to adhere to the surface other than the application at 80 ° C. for 7 days to form the release layer 12.

<Composition (a) of release layer 12>
Acrylic polyol resin 25.0% by weight
Nitrocellulose resin 5.0% by weight
Xylylene diisocyanate 5.0% by weight
Toluene 25.0% by weight
Isobutyl acetate 20.0% by weight
MEK (methyl ethyl ketone) 20.0% by weight
On the upper surface of the release layer 12 formed as described above, black ink (1000 710 black: manufactured by Seiko Advance) is printed by screen printing, and dried at 60 ° C. for 3 minutes, thereby anchor layer 16 having a thickness of about 4 μm. Was provided.

  Further, silver paste (AGEP201X: manufactured by Sumitomo Electric) is printed on the surface of the anchor layer 16 by screen printing (350 mesh), dried at 70 ° C. for 3 minutes with a warm air dryer, and then 25 ° C. 2 Weekly curing was performed to form a loop antenna 13 having a thickness of 6 μm.

  An IC chip 14 was joined to the antenna 13 by ACP (anisotropic conductive paste).

A 20 μm thick acrylic adhesive was applied to a release sheet obtained by applying silicon treatment to one side of PET, and the adhesive layer 15 was applied by transferring this to the surface of the antenna 13 to produce a non-contact IC medium 1.

(2) Production of functional breakable packaging material 2 For example, a pattern is formed by offset printing on a base material 21 having a width of 100 mm and a length of 35 mm made of an OPS (stretched polystyrene) film having a thickness of 90 μm (“EPS45T” manufactured by CI Kasei Co., Ltd.). Printed. In the length direction of the base material 21, two cuts 22 serving as perforations with a pitch of 0.5 mm were made.

  The adhesive layer 15 surface of the non-contact IC medium 1 was bonded to the base material 21 so as to straddle the two cut lines 22. Then, the edge 5mm of the width direction of a base material was accumulated and bonded so that the non-contact IC medium 1 might become an inner surface, and the cylindrical packaging material A with a non-contact IC medium was produced.

Comparative Example 1

  Below, the comparative example of this invention is demonstrated.

  An aluminum thin film antenna was formed on a 38 μm thick PET film by etching, and after mounting an IC chip, an adhesive layer was provided to produce a tough non-contact IC medium having no brittle function. This was pasted on a base material in the same manner as in the above-described Example to prepare a packaging material B with a non-contact IC medium.

  The produced non-contact IC medium-equipped packaging material B was attached to a plastic cap portion of a liquor bottle containing the product shown in FIG. 4 by applying heat to shrink the base material. At this time, it was confirmed that communication was possible using an RFID reader. Thereafter, the packaging material B was peeled off from the adherend X along the perforations (cuts 22).

In the packaging material A with a non-contact IC medium of Example 1, when the non-contact IC medium 1 is peeled off from the adherend X, the portion of the non-contact IC medium 1 along the destruction of the base material 21 as shown in FIG. Peeling occurred at the interface with the layer 12. As a result, the antenna 13 was also broken, making RFID communication impossible.

  On the other hand, in the packaging material B with the non-contact IC medium of the comparative example, the non-contact IC medium was communicable without being destroyed even if the base material was peeled off from the adherend X. Therefore, the non-contact IC medium can be peeled off from the base material and can be cleanly separated, and can be used by being attached to a counterfeit product.

  In addition, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the invention.

  Further, the above embodiment includes various upper and lower level inventions, and various inventions can be extracted by appropriately combining a plurality of disclosed constituent elements. For example, when an invention is extracted because some constituent elements can be omitted from all the constituent elements described in the means for solving the problem, the omitted part is used when the extracted invention is implemented. Is appropriately supplemented by well-known conventional techniques.

  A ... packaging material with non-contact IC medium, X, Y ... adherend, 1 ... non-contact IC medium, 2 ... functional breaking packaging material, 11 ... support, 12 ... release layer, 13 ... antenna, 14 ... IC Chip, 15 ... adhesive layer, 16 ... anchor layer, 21 ... base material, 22 ... perforated cut.

Claims (6)

A support composed of a predetermined insulating material;
A release layer provided on one surface of the support,
An antenna formed of a conductive ink containing conductive particles through the release layer or an anchor layer applied to the release layer;
An IC chip electrically connected to the antenna and capable of reading and writing data for transmitting and receiving the data without contact with an external device via the antenna;
A non-contact IC medium, wherein a main functional element is peeled from the support through the peeling layer.   The release layer is made of a material having low adhesion to the material of the support and has a thickness of about 1/20 as compared with the support. From the support, at least one of the antenna and the IC chip is used. The non-contact IC medium according to claim 1, wherein the main functional elements of a kind are easily peeled off.   The non-contact IC medium according to claim 1, wherein the antenna is formed by a predetermined printing method using a conductive paste in which conductive particles are dispersed in a resin binder. A non-contact IC medium having the structure described in any one of claims 1 to 3 and an adhesive layer applied so as to cover the antenna surface side of the non-contact IC medium, and then opened. A function breaking packaging material that sometimes breaks the main functional elements of the non-contact IC medium,
A packaging material with a non-contact IC medium, wherein an adhesive strength between a support and an antenna constituting the non-contact IC medium is smaller than an adhesive strength between the packaging material for functional breakage and the adhesive layer.   The packaging material for functional breakage is provided with a base material having a function of a packaging material for an adherend, and a perforated cut that is applied to a predetermined portion of the base material and breaks when opened. The packaging material with a non-contact IC medium according to claim 4. The base material uses a material that shrinks by heating,
6. The non-contact IC medium according to claim 4, wherein the perforated cut is provided so as to pass over at least an area of an antenna which is a main functional element of the non-contact IC medium. Packaging material.

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