JP2017003619A - Sealing sticker - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable determination by mechanical detection and visual inspection through arranging a light diffraction layer in addition to a resonance circuit by a given dot pattern on the same surface of a base material of a resonance tag.SOLUTION: A sealing sticker includes a resonance circuit including a coil and a capacitor for performing electrical detection. The sealing sticker includes: a brittle processing layer and an anchor layer formed on one side of a base material. A light diffraction layer is formed between the brittle processing layer and the anchor layer. The coil and a lower electrode of the capacitor are formed on the anchor layer. The capacitor includes the lower electrode, a dielectric layer covering the lower electrode, and an upper electrode on the dielectric layer. The light diffraction layer includes a diffraction forming layer and a metal reflective layer. The metal reflective layer includes dot patterns in a plurality of alienated regions.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a seal seal, and more particularly to a seal seal that can be determined by mechanical detection and visual inspection when it is illegally peeled off.

  A seal sticker is attached to the opening of precious metals and other valuables, documents containing confidential information, packaging bags for storing recording media, boxes, cases, etc., to detect whether or not they have been tampered with. To be done. As such a seal, a seal made of paper, film or the like that can be visually checked for the presence or absence of opening is known.

  For example, it is possible to detect the opening of a seal using a solvent by coloring the seal or destroying the pattern printed on the seal. In addition, it is possible to detect the opening of the opening mouth using a dryer by breaking the pattern printed on the seal or by breaking the notch provided on the seal. Furthermore, it can be confirmed by visual inspection (gazing) that the mouth which cuts the sealing seal at the boundary of the opening.

  However, there is a case where it is difficult to visually confirm the change of the seal seal described above, and in recent years, there has been an increasing demand for mechanical detection of the seal seal in order to improve the efficiency of detection of opening. As a method of such mechanical detection, for example, it is known to use a resonance tag in which a resonance circuit is incorporated in a seal seal (see, for example, Patent Documents 1 to 3).

  For a mouth that cuts the sealing seal at the boundary of the opening, a disconnection of a part of the wiring of the resonance circuit can be mechanically detected using a radio wave having a resonance frequency of the resonance circuit. In such a resonance tag, a coil is formed on one surface of a base material, and electrodes are formed on both surfaces of the base material to form a capacitor, thereby forming a resonance circuit. Therefore, since processing for metal wiring is required on both the front and back surfaces of the base material, there is a problem that productivity is low.

  Further, the conventional resonance tag is mainly used for shoplifting prevention. In order to detect that a product with a resonance tag attached is illegally taken out of the store, the operation of the resonance circuit by the radio wave of the resonance frequency is detected by a detection device installed at the entrance of the store. Therefore, when a product is legitimately purchased, a part of the resonance tag circuit of the product is cut off at a store so that it is not detected by the detection device.

Japanese Unexamined Patent Publication No. 64-23395 JP 2005-326623 A JP 2005-128189 A

  However, if the resonance tag is used to detect whether or not it has been tampered with, it can be illegal if it can be peeled off from the opening with a solvent and a dryer to the extent that the wiring of the resonance circuit is not broken. It cannot be detected. That is, after peeling off the resonance tag, it is easy to attach the same resonance tag again or attach a different resonance tag.

  An object of the present invention is to provide a sealing seal that can be determined by mechanical detection and visual observation by arranging an optical diffraction layer in an arbitrary halftone dot pattern in addition to the resonance circuit on the same surface of the substrate of the resonance tag. It is to provide.

  In order to achieve the above object, one embodiment of the present invention is a sealing seal having a resonance circuit composed of a coil and a capacitor for performing electrical detection, A brittle treatment layer and an anchor layer on the surface, an optical diffraction layer between the brittle treatment layer and the anchor layer, and the coil and the lower electrode of the capacitor are formed on the anchor layer. The capacitor includes the lower electrode, a dielectric layer covering the lower electrode, and an upper electrode on the dielectric layer, and the optical diffraction layer includes a diffraction forming layer and a metal reflective layer, and the metal reflective layer is The dot pattern is formed by a plurality of spaced halftone dot patterns.

  According to the present invention, it is possible to determine by mechanical detection and visual observation using a seal seal provided with an optical diffraction layer in addition to a resonance circuit, and it is possible to detect opening with high accuracy.

It is a figure which shows the seal seal concerning one Embodiment of this invention. It is a figure which shows the cross section of the seal seal of this embodiment. It is a figure which shows the shape of the pattern adhesive layer of the seal seal of this embodiment. It is a figure which shows the shape of the optical diffraction layer of the seal seal | sticker of this embodiment. It is a figure which shows the shape of the optical diffraction layer of the seal seal | sticker of this embodiment. It is a figure which shows the other Example of the seal seal | sticker of this embodiment.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

(Structure of seal)
FIG. 1 shows a seal seal according to an embodiment of the present invention. FIG. 1 is a perspective view of the base material 2 as seen from the upper surface of the seal seal. FIG. 2 is a view showing a cross section taken along one-dot chain line AB in FIG. Since the sealing seal 1 is manufactured in order from the base material 2 to the release layer 10 as will be described later, the base material 2 is the lowest layer and the release layer 10 is the uppermost layer. On the other hand, since the peeling layer 10 is removed and the adhesive layer 9 is affixed to the adherend during use, the substrate 2 is viewed from the top surface.

  In the seal 1, a patterned adhesive layer 11 and a light diffraction layer 12 that are brittle treatment layers are formed on one surface of a substrate 2, and an anchor layer 15 is formed thereon. The light diffraction layer 12 is composed of a diffraction formation layer 13 and a metal reflection layer 14, and details will be described later.

  A print 8 is formed on the anchor layer 15, and a conductive film to be the coil 3 and the lower capacitor electrode 4 is formed thereon. The coil 3 and the lower capacitor electrode 4 are connected at the connection portion 3 a outside the coil 3. The print 8 is printed so as to overlap at least a part of the coil 3 and / or the lower capacitor electrode 4. A dielectric layer 5 is formed so as to cover the lower capacitor electrode 4, and an upper capacitor electrode 6 is formed thereon to constitute a capacitor on one surface of the substrate 2. By providing a jumper wire 7 that connects the connection portion 3b inside the coil 3 and the upper capacitor electrode 6, a resonance circuit 17 for performing electrical detection is configured.

  Further, an adhesive layer 9 is provided on the entire surface so as to cover the structure on the anchor layer 15, and a release layer 10 is formed as the outermost layer to constitute the seal 1. With such a configuration, it is not necessary to process the both surfaces of the base material as in the prior art, and it is only necessary to sequentially stack the structures on one surface, which is excellent in productivity.

(Base material)
Although it does not specifically limit as the base material 2, What is necessary is just to have a function which can support the resonance circuit 17 grade | etc.,. When the printing 8 is provided, it is preferable to use a transparent base material so that it can be viewed from the other surface of the base material 2. For example, resin base materials such as acrylic base materials such as polyethylene terephthalate (PET), polyolefin base materials such as polyethylene, polyester base materials, and polycarbonate base materials can be used. The thickness of a base material can be 20-200 micrometers.

(Printing)
At least a part of the print 8 can be provided on the anchor layer 15 so as to overlap at least a part of the coil 3 and / or the lower capacitor electrode 4. When the seal seal 1 is peeled off, the resonant circuit 17 can be operated by connecting a part of the destroyed resonant circuit 17 using conductive ink. Even if the resonance circuit 17 can be electrically operated by overlapping the printing 8 with the resonance circuit 17, it is difficult to restore the printing 8, so that unauthorized opening and tampering of the seal seal are detected visually. can do.

  The print 8 can be formed by a conventional printing method, and specifically includes letters, numbers, symbols, and background patterns. In particular, it is preferable to form continuously and periodically. Further, the print 8 may be formed over the entire surface of the anchor layer 15 or may be formed along the resonance circuit 17. The thickness of the print 8 is 1 to 10 μm, preferably 2 to 3 μm. If it is too thick, there is a possibility of adversely affecting the resonance circuit provided thereon.

(Resonant circuit)
The coil 3 and the lower capacitor electrode 4 constituting the resonance circuit 17 are not particularly limited as long as they have conductivity. For example, a method of patterning a metal thin film by etching or the like, or a method of forming by a printing method such as screen printing using a conductive ink can be used. Considering that the resonance circuit 17 is easily destroyed when the sealing seal 1 is peeled off and that a capacitor is configured based on the lower capacitor electrode 4, it is preferable to use conductive ink. Also, from the viewpoint of productivity, it is preferable to use a conductive ink because it can be formed by printing.

  As the conductive ink, an ink in which a metal such as silver is dispersed in a solvent, or an ink containing another conductive material can be used. When the conductive ink is used, the thickness is 10 to 30 μm. The pattern of the resonance circuit is not particularly limited, but can be constituted by one or more coil patterns matched to a desired resonance frequency and a capacitor on the same surface of the substrate 2.

  As the solvent, an ester organic solvent such as diethylene glycol monoethyl ether acetate can be used. Further, the conductive ink may contain a binder resin as necessary.

  The detector includes a method using a resonance frequency of the resonance circuit and a frequency different from the resonance frequency, and a method using only the resonance frequency of the resonance circuit. The former method can be detected regardless of the capacitor arrangement. In the latter method, when a capacitor is disposed inside the coil, the capacitor is erroneously detected even if the coil is cut, and it may not be possible to detect that the coil has been cut. Therefore, considering that the latter method is used, it is preferable to dispose the capacitor outside the coil 3 as shown in FIG.

(Capacitor)
For the dielectric layer 5 constituting the capacitor, an insulating resin can be used. The insulating resin is preferably formed by printing. The dielectric layer 5 only needs to be formed so as to cover at least the lower capacitor electrode 4, but when the upper capacitor electrode 6 is provided, the lower capacitor electrode 4 is prevented from conducting at the end of each electrode. Form larger. Insulating resin may be formed on one entire surface of the substrate 2, but the cost is increased. The dielectric layer 5 is preferably 0.1 to 5 mm larger than the lower capacitor electrode 4.

  As shown in FIG. 1, the connection portion 3 b inside the coil 3 and the upper capacitor electrode 6 are connected by a jumper wire 7 provided on the dielectric layer 5 formed across the coil 3.

  Examples of the insulating resin used for the dielectric layer include acrylic and urethane resists. Further, as the solvent, ester organic solvents such as diethylene glycol monoethyl ether acetate can be used. The dielectric layer 5 is preferably printed twice or more times. This is because, when forming by printing, it is difficult to secure a thickness sufficient to ensure insulation. From the viewpoint of productivity, it is preferable that the dielectric layer 5 can be formed by two printings. The dielectric layer 5 is formed by screen printing or the like and has a film thickness of 10 to 50 μm. The thickness is particularly preferably 20 to 40 μm. Within this range, smoothness is not adversely affected, and a short circuit between the upper capacitor electrode 6 and the lower capacitor electrode 4 can be prevented.

  The upper capacitor electrode 6 and the jumper wire 7 are formed on the dielectric layer 5. The upper capacitor electrode 6 and the jumper wire 7 are not particularly limited as long as they have conductivity. Considering that the resonance circuit 17 can be easily destroyed when the seal seal 1 is peeled off, it is preferable to use conductive ink. As the conductive ink, an ink in which a metal such as silver is dispersed in a solvent, or an ink containing another conductive material can be used. When the conductive ink is used, the thickness is 10 to 30 μm. As the solvent, an ester organic solvent such as diethylene glycol monoethyl ether acetate can be used. Further, the conductive ink may contain a binder resin as necessary.

  As described above, a detector that uses only the resonance frequency of the resonance circuit, if a capacitor is placed inside the coil, erroneously detects the capacitor even if the coil is disconnected, and the coil is disconnected. May not be detected. Therefore, in the sealing seal 1 of the first embodiment, the capacitor is disposed outside the coil 3.

(Adhesive layer)
The adhesive layer 9 is provided for sticking a sealing seal on the adherend, and is not particularly limited as long as it has sufficient adhesiveness. Known pressure-sensitive adhesives and adhesives can be used. For example, acrylic pressure-sensitive adhesives can be used. The adhesive layer 9 can be formed by a printing method and has a thickness of 10 to 100 μm.

  A release layer 10 can be provided on the outermost layer. When the seal seal 1 is used, the release layer 10 is peeled off, and the exposed adhesive layer 9 is attached to the adherend. The release layer 10 is not particularly limited, but a paper material can be used. Specifically, a coated paper subjected to a peeling process can be used.

(Pattern adhesive layer)
For the patterned adhesive layer 11 that functions as a brittle treatment layer, a material having an adhesive strength stronger than the adhesive strength of the adhesive layer 9 is used. The pattern adhesive layer 11 is not applied to the entire surface of the substrate 2 as in the adhesive layer 9, but is formed on the pattern and subjected to a brittle treatment described below. When the sealing sticker 21 once pasted is peeled off, the resonance circuit or the like is pulled to the substrate 2 side in the portion where the patterned adhesive layer 11 is provided, and the patterned adhesive layer 11 is not provided. In the portion, a pattern is formed so that the resonance circuit and the like remain on the adherend side together with the adhesive layer 9. As a result, when the seal seal 21 is peeled off, the resonance circuit and the like are easily broken, and the detection of the peel off of the seal seal can be performed with higher accuracy.

  The pattern adhesive layer 11 is not particularly limited as long as it satisfies the above functions, and for example, a polyester-based adhesive can be used. The patterned adhesive layer 11 can be formed by a printing method or the like, and has a thickness of 0.05 to 0.5 μm.

  FIG. 3 shows the shape of the patterned adhesive layer of the seal seal of this embodiment. The pattern of the patterned adhesive layer 11 is not particularly limited as long as it can destroy the resonance circuit or the like, but at least a portion where the patterned adhesive layer 11 is formed at the end of the seal 1 and a portion where it is not formed It is preferable that it is provided so as to be included. This is because when the seal seal 1 is peeled from the end portion, the portion remaining on the adherend and the portion dragged by the base material are separated, so that the resonance circuit and the like can be reliably destroyed. Moreover, as shown in FIG. 3, the effect of preventing replacement can be further enhanced by making the pattern into a complicated shape.

(Light diffraction layer)
As the optical diffraction layer 12, for example, a hologram layer including a diffraction formation layer 13 having a diffraction structure and a metal reflection layer 14 can be used. By providing the light diffractive layer 12, it is possible to make a visual determination when it is illegally peeled off, and the security level can be increased. After providing the diffraction forming layer 13 on the base material 2 and the patterned adhesive layer 11 and forming the diffraction structure, the metal reflective layer 14 is provided. The diffraction forming layer 13 can be made of a resin material such as acrylic, and forms a diffractive structure using an embossed plate. As the metal reflective layer 14, a metal reflective material such as aluminum, or a transflective metal compound such as zinc oxide, zinc sulfide, or titanium oxide can be used.

  It is preferable that the diffraction forming layer 13 has a lower adhesive strength with the substrate 2 than the adhesive strength of the adhesive layer 9. This is because when the pattern adhesive layer 11 is provided, the seal 1 is broken into a pattern when the seal 1 is peeled off. That is, in the portion where the patterned adhesive layer 11 is provided, the optical diffraction layer 12 remains on the substrate 2 side, and in the portion where the patterned adhesive layer 11 is not provided, the optical diffraction layer 12 is attached to the adhesive layer 9. And remains on the adherend side.

  When providing the patterned adhesive layer 11, the diffraction forming layer 13 can be provided on the patterned adhesive layer 11. By doing in this way, when peeling off the sealing sticker 1, since the optical diffraction layer 12 is destroyed with a resonance circuit, it is more preferable at the point of detection of peeling of the sealing sticker 1.

  Further, when the optical diffraction layer 12 is provided, the anchor layer 15 is provided between the optical diffraction layer 12 and the resonance circuit 17. When a hologram layer is formed as the light diffraction layer 12, unevenness remains on the surface. Therefore, it is preferable to form the resonance circuit 17 after smoothing the surface with the anchor layer 15.

  The light diffraction layer 12 is not limited to the hologram element, and various elements such as a scattering element and a multilayer interference element can be used. Alternatively, only the patterned adhesive layer 11 and the anchor layer 15 may be formed on one surface of the substrate 2 and only the brittle treatment layer having no hologram layer may be formed.

(Light diffraction layer pattern)
Since the metal material has conductivity, it adversely affects the electrical characteristics of the resonance tag. Moreover, since it lacks transparency, the inside of the adherend to which the seal is stuck cannot be seen. Therefore, it is necessary to pattern the metal reflective layer 14 in a plurality of spaced areas. Specifically, patterning can be performed by etching using a mask layer. By patterning, the optical effect can be partially shown, and by removing the conductivity in the metal reflection layer by patterning into a plurality of spaced areas, the resonance circuit by blocking and reflecting electromagnetic waves The influence of can be eliminated. Further, the visibility is improved by patterning, and the inside of the adherend can be confirmed.

  However, if the area of the halftone dot pattern of the light diffraction layer 12 is too small, the optical effect as a hologram layer is reduced. On the other hand, if the size is too large, the visibility is deteriorated, so that the inside of the adherend cannot be observed, and further, there is a new problem that the electrical characteristics are affected.

  FIG. 4 shows the shape of the light diffraction layer of the seal seal of this embodiment. As the halftone dot pattern of the light diffraction layer 12, the metal reflection layer (main element) 14 left by the etching process is regularly spaced at a constant pitch. The main elements 14 have a uniform round shape with a constant pitch L of 50 to 110 μm, a diameter d1 of 30 μm or more and 70% or less of the pitch length L. Specifically, the mask layer is formed by gravure printing using a halftone gravure plate having a pattern of a plurality of main elements 14 spaced at a constant pitch as shown in FIG. The portion on which the mask layer is printed remains by the etching process, and other portions are removed, so that an arbitrary halftone dot pattern can be created.

  The size of the main element 14 is set so that the diameter d1 is 30 μm or more and 70% or less of the pitch length L. This is because if the diameter is smaller than 30 μm, the area of the light diffraction layer 12 is too small, so that the optical effect as a hologram layer cannot be obtained. On the other hand, if it is too large, the visibility will deteriorate. Furthermore, if the main element 14 is too large and the main elements are connected to each other, the electrical characteristics are also affected, and communication with the resonance tag becomes impossible. On the other hand, if the pitch L is increased to 110 μm or more, the image becomes rough when viewed as a hologram image, and a sufficient optical effect cannot be obtained.

  FIG. 5 shows the shape of the light diffraction layer of the seal seal of this embodiment. As the halftone dot pattern of the light diffraction layer 12, two types of shapes of a metal reflection layer (main element) 14 and a metal reflection layer (second element) 16 are used. The diameter d2 of the second element 16 is 30% or more larger than the diameter d1 of the main element 14 and smaller than the pitch length L. When the second element 16 having a larger size is arranged as an aggregate on a part of the main elements 14 arranged with a uniform size and pitch, a difference in density of the halftone dot pattern occurs, and the density is visually confirmed. Is done.

  FIG. 6 shows another example of the seal seal of this embodiment. The second element 16 is set as an aggregate so that characters and the like are drawn in the halftone dot pattern of the plurality of main elements 14 spaced apart at a constant pitch so that characters and geometric patterns can be visually recognized. Form. Thereby, the effect that a character and a geometric pattern emerge in the hologram image by the light diffraction layer 12 is acquired, and a new visual security function can be provided. In particular, in the case of a halftone dot pattern, the luminance is lower than that of the solid pattern, and a viewing angle at which no light diffraction is observed is also generated. However, even with the above-described halftone dot pattern, a difference in shading can be sufficiently recognized, and characters and geometric patterns can also be sufficiently recognized.

  As a specific production method, a halftone dot gravure plate in which a mask layer is arranged in a pattern of a plurality of main elements 14 spaced apart at a constant pitch and a second element 16 is arranged in a character pattern spaced apart at a constant pitch is produced. Then, it is formed by gravure printing using it. The portion on which the mask layer is printed remains by the etching process, and other portions are removed, so that an arbitrary halftone dot pattern can be created.

  The diameter d2 of the second element 16 is 30% or more larger than the diameter d1 of the main element 14 and smaller than the pitch length L. If the second elements are connected to each other, the electrical characteristics are affected and communication with the resonance tag becomes impossible. Moreover, it is necessary to make it larger than the main element so that the difference in the density of the halftone dot pattern can be visually recognized.

  When providing the patterned adhesive layer 11, the diffraction forming layer 13 can be provided on the patterned adhesive layer 11. By doing in this way, when peeling off the sealing sticker 1, since the optical diffraction layer 12 is also destroyed with the resonance circuit 17, it becomes more preferable at the point of detection of unauthorized peeling.

[Example 1]
As the base material 2, PET 20 mm long × 40 mm wide × 50 μm thick was used. A pattern adhesive layer 11 made of a polyester resin adhesive was formed on one surface of the substrate 2 by gravure printing so as to have an average film thickness of about 0.15 μm. As the pattern of the pattern adhesive layer 11, an X-shaped pattern having a length of 2.5 mm of intersecting straight lines was arranged at an interval of 10 mm.

  On the patterned adhesive layer 11, a diffraction forming layer 13 made of urethane-acrylic resin was formed by gravure printing so as to have an average film thickness of about 1.5 μm. Next, a diffraction structure was formed on the diffraction forming layer 13 using a hologram embossed plate. On top of that, the light diffraction layer 12 was formed by providing aluminum with a film thickness of 50 nm as the metal reflective layer 14 by vapor deposition.

  In order to pattern the metal reflection layer 14 in a dot pattern, the mask layer made of vinyl acetate resin is made to have a film thickness of about 1.5 μm using a gravure plate with a laser porshell plate 250 line dot ratio of 35%. And by gravure printing. Next, a mask layer was printed by an alkali etching method to remove aluminum other than the portion, and a halftone dot pattern-like light diffraction layer 12 was obtained.

  On the optical layer 12, an anchor layer 15 made of polyvinyl butyral resin was formed by gravure printing so as to have an average film thickness of about 0.1 μm.

  On the anchor layer 15, a print 8 was printed using red ink. For the print 8, a repetitive pattern of “TP0123” was formed by screen printing at a film thickness of about 2 μm at a position overlapping the long side of a resonance circuit provided in a subsequent process.

  Next, a resonance circuit 17 having a resonance frequency of 28 MHz was formed as follows. The coil 3 and the lower capacitor electrode 4 were formed by screen printing using silver ink (manufactured by Toyobo Co., Ltd.) so as to have an average film thickness of about 20 μm. The pattern of the coil 3 is a substantially rectangular pattern consisting of 6 turns, and is connected to the lower capacitor electrode 4 of 1.4 mm length × 20 mm width at the connection portion 3 a outside the coil 3. The connection portion 3b inside the coil 3 is connected to the upper capacitor electrode 6 via a jumper wire.

  A dielectric layer 5 was formed on the lower capacitor electrode 4, a part of the connection part 3 b inside the coil 3, and the lower part of the jumper wire 7 provided in a later step. An average film thickness of about 15 μm was printed by one screen printing, and a dielectric layer 5 having an average film thickness of 30 μm was formed by two printings. As a material of the dielectric layer 5, a thermosetting highly transparent resist (manufactured by Asahi Chemical Research Co., Ltd.) was used. The portion covering the lower capacitor electrode 4 was provided with a dielectric layer 5 having a shape 1 mm larger than the four sides of the lower capacitor electrode 4.

  On the dielectric layer 5, the upper capacitor electrode 6 and the jumper wire 7 were formed by screen printing using silver ink (manufactured by Toyobo Co., Ltd.) so as to have an average film thickness of about 20 μm. A resonance circuit 17 was produced by connecting the connection portion 3 b inside the partially exposed coil 3 and the upper capacitor electrode 6 by a jumper wire 7.

  Finally, an acrylic pressure-sensitive adhesive was coated as the adhesive layer 9 with an average film thickness of about 50 μm, and release paper was attached as the release layer 10 to prepare a seal seal A.

[Example 2]
Seal seal B was produced in the same manner as in Example 1. However, only the halftone dot pattern of the light diffraction layer 12 is different from the first embodiment. The mask layer made of a vinyl acetate resin was printed using a gravure plate with a laser porshell plate 250 line dot ratio of 35% and a character of “TP0123” arranged at a dot ratio of 60%.

(Comparative example)
As a comparative example, a seal seal C was produced. However, the difference from Examples 1 and 2 is that the light diffraction layer 12 does not have a halftone dot pattern.

(Optical effect confirmation)
When the optical diffraction effect on the produced seal was visually confirmed, the optical effect of the diffractive structure could be confirmed in both of the seals A and B produced in Examples 1 and 2. The diameter size of the halftone dots of the observed light diffraction layer was about 45 μm, and the pitch was about 101 μm. In the seal sticker B, the characters “TP0123” due to the dot density difference could be confirmed. The diameter of the halftone dot in the part forming the characters “TP0123” was about 75 μm.

(Machine detection test)
The communication performance as a resonance tag of the seal was evaluated. Both the seals A and B produced in Examples 1 and 2 were able to detect the response of the resonant circuit using a detector (AIMEX: electrical detection at a frequency of 28 MHz). However, the seal seal C produced in Comparative Example 1 could not be detected due to radio wave interference by the metal reflection layer.

(Peel test)
When the seal seal affixed to the acrylic plate was peeled off by hand, it was confirmed that both the seal seals A and B partially left the optical diffraction layer and the resonance circuit on the acrylic plate and were visually destroyed. Moreover, it became impossible to detect even with a detector (AIMEX: electrical detection at a frequency of 28 MHz), and it was clearly confirmed that the seal was broken.

DESCRIPTION OF SYMBOLS 1 Sealing seal 2 Base material 3 Coil 4 Lower capacitor electrode 5 Dielectric layer 6 Upper capacitor electrode 7 Jumper wire 8 Background printing part 9 Adhesion layer 10 Peeling layer 11 Pattern-like adhesion layer 12 Light diffraction layer 13 Diffraction formation layer 14,16 Metal reflection Layer 15 Anchor layer 17 Resonant circuit

Claims (8)

A sealing seal having a resonance circuit composed of a coil and a capacitor for electrical detection,
Having a brittle treatment layer and an anchor layer on one side of the substrate;
Having a light diffraction layer between the brittle treatment layer and the anchor layer;
The coil and a lower electrode of the capacitor are formed on the anchor layer, and the capacitor includes the lower electrode, a dielectric layer covering the lower electrode, and an upper electrode on the dielectric layer,
The sealing seal according to claim 1, wherein the light diffraction layer includes a diffraction formation layer and a metal reflection layer, and the metal reflection layer is formed by a plurality of spaced halftone dot patterns.   The halftone dot pattern of the light diffraction layer has a uniform pitch of 50 to 110 μm, a main element made of a uniform round shape with a diameter of 30 μm or more and a size of 70% or less of the pitch length, which is arranged apart. The sealing seal according to claim 1, wherein   In the halftone dot pattern of the light diffraction layer, second elements having a uniform round shape that is 30% or more larger than the diameter size of the main element and smaller than the pitch length are arranged as an aggregate in a part of the main element. The sealing seal according to claim 2, wherein   4. The seal according to claim 3, wherein the assembly of the second elements is formed so that a character or a geometric pattern can be recognized visually.   5. The sealing according to claim 1, wherein the brittle treatment layer is a patterned adhesive layer having an adhesive strength stronger than that of an adhesive layer for attaching the seal seal to an adherend. seal.   6. The sealing seal according to claim 1, wherein the diffraction forming layer has an adhesive strength weaker than an adhesive strength of an adhesive layer for attaching the sealing seal to an adherend.   The seal seal according to any one of claims 1 to 6, wherein the coil, the lower electrode, and the upper electrode are formed of conductive ink.   The seal seal according to any one of claims 1 to 7, wherein printing is performed so as to overlap a part of the coil and / or the lower electrode.