JP2012118109A - Label with circuit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a label with a circuit capable of easily breaking the circuit when removing the label from a sticking object body, thereby eliminating any necessity of easily detecting the opening, preventing alteration and abuse by a fraudulent exchange of labels or sticking a paid seal (an electromagnetic shield label) showing the adjustment thereover, after purchasing an article.SOLUTION: This label with the circuit includes; a base material layer A, a brittle easy-fracture layer B, an electric circuit C and a pressure-sensitive adhesive layer D; and is formed by stacking them in this order. The cohesion of the easy-fracture layer B is the smallest of the respective layers of the base material layer A, the easy-fracture layer B and the pressure-sensitive adhesive layer D. When the label with the circuit is peeled off from the sticking object body, the easy-fracture layer B remains partially to the sticking object body side, so that the electric circuit C is partially broken to become no longer functional, thereby reducing the detection of a fraudulent opening and the exchange of labels and reducing a labor in accounting.

Description

  The present invention relates to a label with a circuit having a circuit for transmitting and receiving data wirelessly, and more particularly to a label with a circuit that can be easily destroyed when the label is peeled off from an adherend.

Conventionally, many labels using RFID technology capable of transmitting and receiving information such as identification data without directly contacting using a radio signal have been proposed. For example, Patent Document 1 proposes an IC label in which a thermoplastic resin film is used as a base material, a circuit layer is provided thereon, and an adhesive layer is laminated thereon.
Such an IC label is made of a material that has strength and is hard to break, keeping security in mind, and it is not assumed that the label is peeled off after being applied. On the other hand, for example, as in Cited Documents 2 to 4, by forming an electronic circuit (particularly the antenna part) on a substrate that is easily destroyed, the antenna part is cut when it is attempted to peel off after using a label using this. Also, a label has been proposed that can be illegally opened or peeled off because it breaks.

However, the sealing seal of the cited document 2 may not be able to cut the electric circuit as desired depending on the selection of the film base and the adhesive to be used. In order to reliably cut the electric circuit, Cuts must be made in the electrical circuit.
Similarly, the data carrier of cited document 3 and the weak label of cited document 4 are also provided with perforations, cuts, gaps, etc. in the surface direction or thickness direction of the substrate of the label, respectively, in order to break the circuit. Is a requirement.
However, such additional processing tends to make it difficult to reliably break the circuit due to problems such as a decrease in the sharpness of the blade used, and at that time the electric circuit is also deformed and used from the beginning. Since this becomes impossible, there is a problem that the yield tends to decrease. Moreover, since the number of processes is surely increased in the production of a label with a circuit in order to form precise perforations and cuts, there is a problem that the unit price is generally increased.

JP 2002-269526 A Japanese Patent Laid-Open No. 11-007245 JP 2006-039643 A JP 2009-217175 A

  The present invention has a simple configuration that is easy to mold, does not require any additional processing such as perforation or incision on the label, and can reliably destroy the circuit when the label is peeled off from the adherend. It is an object to provide a label with a circuit that can be used.

The present invention solves the problem by the following means.
That is, the present invention is a label with a circuit comprising a base material layer (A), a brittle easily breakable layer (B), an electric circuit (C), and a pressure-sensitive adhesive layer (D), which are laminated in this order. The cohesive force of the easily breakable layer (B) is the smallest in each of the base material layer (A), the easily breakable layer (B), and the pressure sensitive adhesive layer (D), and the pressure sensitive adhesive layer (D ) Is partially provided on the electric circuit (C).
In another aspect of the present invention, the base material layer (A), the brittle easily breakable layer (B), the electric circuit (C),
A label with a circuit comprising a pressure-sensitive adhesive layer (D) and a paste-killing layer (E) and laminated in this order, a base material layer (A), an easily breakable layer (B), and a pressure-sensitive adhesive layer The cohesive force of each layer of (D) is in the relationship of (A)>(D)> (B), and paste-killing (E) is partially provided on the pressure-sensitive adhesive layer (D). The present invention relates to a label with a circuit.

More specifically, in the present invention, the brittle easily breakable layer (B) contains 20 to 75% by weight of at least one of a thermoplastic resin, an inorganic fine powder and an organic filler, and is at least uniaxially stretched. It is preferable that the cohesive force is 5 to 150 g / cm width,
From the content of at least one of the inorganic fine powder and the organic filler of the easily breakable layer (B), the base material layer (A) contains 3 to 50% by weight of at least one of the thermoplastic resin and the inorganic fine powder and the organic filler. Is a resin film layer having a weight of 8% by weight or less, and preferably has a cohesive strength of 50 to 15000 g / cm width,
The pressure-sensitive adhesive layer (D) contains at least one pressure-sensitive adhesive selected from the group consisting of rubber-based pressure-sensitive adhesives, acrylic pressure-sensitive adhesives, silicone-based pressure-sensitive adhesives, and urethane-based pressure-sensitive adhesives, and has a cohesive strength of 20 to The width is preferably 1000 g / cm.

The electric circuit (C) is preferably formed by printing a conductive ink, a conductive paint, or a conductive paste on the surface of the easily breakable layer (B), transferring a metal foil, or etching or plating a metal.
The thermoplastic resin used for the brittle easily breakable layer (B) preferably contains a polyolefin resin.
The substrate (A) side surface of the label with circuit may be provided with printing (F),
Before forming the electric circuit (C) on the easily breakable layer (B), a back print (G) is provided on the easily breakable layer (B) to form a base material layer (A) and a brittle easily breakable layer (B). , Back printed (G), electric circuit (C), and pressure sensitive adhesive layer (D), and a label with a circuit formed by laminating in this order. It may be visible after
Release paper (H) may be provided on the pressure-sensitive adhesive layer (D) side surface of the label with circuit.

  According to the present invention, when the circuit-attached label is peeled off from the adherend, the part of the label that adheres to the adherend progresses due to the in-layer destruction of the easily breakable layer (B). Since the easy-breaking layer (B) peels off without breaking within the layer in the part not adhered to the adherend, the easy-breaking layer (B) is covered in the part adhered to the adherend of the label. By remaining on the side of the body and remaining part on the side of the peeled substrate layer (A), the electrical circuit (C) located between the two is partially destroyed and will not function, and unauthorized opening or re-installation It is possible to detect troubles and to reduce the trouble of accounting. When back printing (G) is provided on this, unauthorized opening or replacement can be further confirmed by visual recognition.

It is sectional drawing of the one aspect | mode of the label with a circuit of this invention. It is sectional drawing of another aspect of the label with a circuit of this invention. It is sectional drawing of the one aspect | mode of the label with a circuit of this invention which has printing (F) and release paper (H). It is sectional drawing of another aspect of the label with a circuit of this invention which has printing (F), back printing (G), and release paper (H). It is sectional drawing which shows that an electric circuit (C) fractures | ruptures, when peeling the label with a circuit of this invention from a to-be-adhered body.

[Label with circuit]
The label with a circuit of the present invention comprises a base material layer (A), a brittle easily breakable layer (B), an electric circuit (C), and a pressure-sensitive adhesive layer (D), and is laminated in this order. is there.

[Base material layer (A)]
The base material layer (A) has a high strength in the circuit-attached label, and does not break itself when it is peeled off with the (A) layer.
The base material layer (A) is an outermost layer when the circuit-attached label is attached to the adherend, and functions as a label that provides further visual printing and information on the surface. It is what has. Moreover, it has a function as a support body which ensures intensity | strength when shape | molding a label with a circuit from the height of the intensity | strength.
The base material layer (A) may be a paper material, resin film, or the like having strength, water resistance and durability, but may be a layer made of a thermoplastic resin from the viewpoint of protecting the electric circuit (C). preferable.

  Examples of the thermoplastic resin include ethylene resins such as high density polyethylene, medium density polyethylene, and low density polyethylene, or polyolefin resins such as propylene resin, polymethyl-1-pentene, and ethylene-cyclic olefin copolymer, and nylon-6. Polyamide resins such as nylon-6,6, nylon-6,10, nylon-6,12, polyethylene terephthalate, polyethylene naphthalate, polybutylene succinate, polylactic acid, and other copolymerizable with these monomers Examples thereof include thermoplastic polyester resins such as aliphatic polyester copolymerized with monomers, and thermoplastic resins such as polycarbonate, atactic polystyrene, syndiotactic polystyrene, and polyphenylene sulfide. These may be used in combination of two or more. Among these, it is preferable to use polyolefin resin. Further, among polyolefin resins, propylene resins and high density polyethylene are more preferable from the viewpoints of cost, water resistance, and chemical resistance.

  Such propylene-based resins are propylene homopolymers, mainly composed of polypropylene and propylene which are isotactic or syndiotactic and have various degrees of stereoregularity, and ethylene, butene-1, hexene-1 Copolymers with α-olefins such as heptene-1,4-methylpentene-1 are used. This copolymer may be a binary system, a ternary system, or a quaternary system, and may be a random copolymer or a block copolymer.

  The base material layer (A) obtained from this thermoplastic resin may be uniaxially stretched or biaxially stretched. The thickness of the base material layer (A) is usually in the range of 10 to 500 μm, preferably 20 to 300 μm. If it is less than 10 μm, the base layer (A) has a low breaking strength, and when it is peeled off from the easily breakable layer (B) with the base layer (A), it breaks in the middle and the expected performance of the present invention. Difficult to demonstrate. On the other hand, if it exceeds 500 μm, the stiffness of the layer increases, and the ease of peeling and the printability deteriorate.

The base material layer (A) may or may not contain at least one of inorganic fine powder and organic filler. When it is included, the concealability of the label with circuit can be improved, it is difficult to visually confirm the internal electric circuit (C), and when the surface of the label with circuit is printed, the visibility is improved. For example, the barcode reading rate is improved.
The inorganic fine powder has a particle size of usually 0.01 to 15 μm, preferably 0.01 to 8 μm.
More preferably, 0.03 to 4 μm is used. Specifically, fine powders such as calcium carbonate, calcined clay, silica, diatomaceous earth, talc, titanium oxide, barium sulfate, and alumina can be used.

  As the organic filler, it is preferable to select a different type of resin from the thermoplastic resin that is the main component. For example, when the thermoplastic resin is a polyolefin-based resin, examples of the organic filler include polyethylene terephthalate, polybutylene terephthalate, polycarbonate, nylon-6, nylon-6,6, cyclic olefin homopolymer, and cyclic olefin and ethylene. And those having a melting point of 120 ° C to 300 ° C or a glass transition temperature of 120 ° C to 280 ° C.

When the base material layer (A) contains at least one of an inorganic fine powder and an organic filler, the base material layer (A) preferably contains 3 to 50% by weight of at least one of the inorganic fine powder and the organic filler, More preferably, it contains 40% by weight.
Further, the content of the inorganic fine powder and the organic filler in the base material layer (A) is preferably 8% by weight or more less than the content of the inorganic fine powder and the organic filler in the easily breakable layer (B) described later. More preferably, the content is less than%.
Within the above range, the strength of the base layer (A) is higher than that of the easily breakable layer (B) and the pressure-sensitive adhesive layer (D) described later, while concealing the base layer (A). Can hold.
As a result, the base material layer (A) preferably has a cohesive force of 50 to 15000 g / cm width, and more preferably 100 to 12000 g / cm width.

The base material layer (A) may have a two-layer structure, a multilayer structure of three or more layers, and the number of stretching axes of this multilayer structure is 1 axis / 1 axis, 1 axis / 2 axes, 2 axes / 1. Axis, 1 axis / 1 axis / 2 axis, 1 axis / 2 axis / 1 axis, 2 axis / 1 axis / 1 axis, 1 axis / 2 axis / 2 axis, 2 axis / 2 axis / 1 axis, 2 axis / Two axes / 2 axes may be used. The multilayering of the base material layer (A) makes it possible to add various functions such as writability, printability, thermal transfer suitability, scratch resistance, and secondary processing suitability.
However, when the layer on the side in contact with the easily breakable layer (B) is the layer (A1), at least the content of the inorganic fine powder and the organic filler in the same layer (A1) is higher than that of the easily breakable layer (B). It is preferably 8% by weight or less, more preferably 10% by weight or more.

[Brittle easily breakable layer (B)]
The easily breakable layer (B) has the weakest cohesion force itself among the layers constituting the circuit-attached label of the present invention, and when it is peeled off with the (A) layer, it easily coheses and breaks itself. Is a layer. Therefore, when the label is peeled, cohesive failure of the (B) layer occurs inside the same layer, and the (B) layer is separated into the peeled (A) layer side and the pressure-sensitive adhesive layer (D) side. Follow.
There are various methods for forming the easily breakable layer (B). By including at least one of a thermoplastic resin, an inorganic fine powder and an organic filler in the easily breakable layer (B), It is possible to reduce the cohesive force to obtain more stable peelability, and the present invention follows this method.

  Examples of the thermoplastic resin that can be contained in the easily breakable layer (B) include the thermoplastic resins mentioned in the section of the base material layer (A), and a polyolefin resin that is easily stretch-molded is preferable. Moreover, the inorganic fine powder and organic filler quoted by the base material layer (A) can be used for the inorganic fine powder and organic filler in an easily breakable layer (B). The inorganic fine powder and the organic filler of the base material layer (A) and the easily breakable layer (B) may be the same or different.

The content of at least one of the inorganic fine powder and the organic filler in the easily breakable layer (B) is preferably 20 to 75% by weight, and more preferably 25 to 70% by weight. If the content of at least one of the inorganic fine powder and the organic filler in the easily breakable layer (B) is less than 20% by weight, sufficient peelability cannot be obtained, and if it exceeds 75% by weight, the molding stability of the same layer is impaired. .

The easily breakable layer (B) is preferably uniaxially stretched or biaxially stretched. Inside the easily breakable layer (B) stretched and formed containing at least one of inorganic fine powder or organic filler, a number of pores with inorganic fine powder or organic filler as the core are formed, and brittle easy breakage A layer (B) can be obtained. Further, it becomes possible to obtain an easily breakable layer (B) having a uniform thickness by stretch molding.
As a result, the easily breakable layer (B) preferably has a cohesive force of 5 to 150 g / cm width, and more preferably 10 to 140 g / cm width.

  The thickness of the easily breakable layer (B) is usually 0.1 to 10 μm, preferably 0.2 to 5 μm. If the thickness is less than 0.1 μm, it becomes difficult to form the easily breakable layer (B) having a uniform film pressure, and the weak cohesive force cannot be exhibited, and stable peelability tends to be hardly obtained. On the contrary, if it exceeds 10 μm, there is no problem in peelability, but it becomes difficult to concentrate the peel stress at substantially the same position in the thickness direction of the same layer, and the peel force tends to be shaken.

[Electric circuit (C)]
The electric circuit (C) includes an antenna that wirelessly transmits and receives data in the circuit-attached label of the present invention. The electric circuit (C) is provided directly on the surface of the easily breakable layer (B) and breaks together (breaks) according to the cohesive failure of the easily breakable layer (B). It is weak.

  The electric circuit (C) is composed of a conductive ink containing a metal such as carbon or silver on the easily breakable layer (B) side surface of the laminated film composed of the base material layer (A) and the brittle easily breakable layer (B). A paint or conductive paste may be printed by silk screen printing, flexographic printing, gravure printing, ink jet printing, etc. and dried, or a metal foil formed of a conductive metal such as silver, copper or aluminum may be used. It may be provided by transferring, or may be provided by etching or plating a metal such as copper or aluminum.

[Pressure-sensitive adhesive layer (D)]
The pressure-sensitive adhesive layer (D) is characterized in that its cohesive strength is stronger in the label with circuit than in the easily breakable layer (B). Therefore, after applying the label with circuit to the adherend, when the layer (A) is peeled off from the adherend, the layer (B) is effective without cohesive failure in the pressure sensitive adhesive layer (D). Can be destroyed.
In particular, the pressure-sensitive adhesive layer (D) in the present invention is provided on the easily breakable layer (B) via the electric circuit (C), but is not provided on the entire surface of the easily breakable layer (B). It is provided so as to partially hang over the electric circuit (C), or after being provided on the entire surface of the easily breakable layer (B), further paste-killing (E) is partially applied to the pressure-sensitive adhesive layer (D) (electrical The circuit (C) is provided so as to partially hang on the circuit (C).

  The label with a circuit of the present invention has a portion that is adhered to an adherend and a portion that is not adhered according to the coating pattern of the pressure-sensitive adhesive layer (D) or the coating pattern of the paste-killing (E). Therefore, when the label with circuit is attached to the adherend, and then the label with circuit is peeled off from the adherend, the portion of the label that adheres to the adherend is the easily breakable layer (B). Peeling progresses due to in-layer destruction, but the part that is not adhered to the adherend of the label proceeds without peeling the easily breakable layer (B) within the layer, so the part that is adhered to the adherend is The easily breakable layer (B) and the pressure-sensitive adhesive layer (D) partially remain on the adherend side, and other portions remain on the peeled substrate layer (A) side, so that an electric circuit located between the two (C) is partially destroyed and no longer functions.

  Examples of such pressure-sensitive adhesives include rubber-based adhesives, acrylic-based adhesives, and silicone-based adhesives. Specific examples of the rubber-based pressure-sensitive adhesive include natural rubber, polyisobutylene rubber, butyl rubber, styrene-butadiene rubber, styrene-isoprene block copolymer, styrene-butadiene block copolymer and a mixture thereof, or Abietin for these rubber-based pressure-sensitive adhesives. Examples include those containing a tackifier such as an acid rosin ester, a terpene / phenol copolymer, and a terpene / indene copolymer. As specific examples of the acrylic pressure-sensitive adhesive, the glass transition point of 2-ethylhexyl acrylate / n-butyl acrylate copolymer, 2-ethylhexyl acrylate / ethyl acrylate / methyl methacrylate copolymer, or the like is −20 ° C. or lower. Things. Specific examples of the silicone pressure-sensitive adhesive include a mixture of silicone rubber and silicone resin.

These pressure-sensitive adhesives may be of a solvent type, an emulsion type, a hot melt type, etc., and are generally laminated by applying a solvent type or an emulsion type. Such coatings include kiss coating, screen coating, bar coating, comma coating, knife coating, roll coating, curtain coating, gravure coating, reverse coating, reverse gravure. The pressure-sensitive adhesive layer (D) is formed by coating, etc., smoothing as necessary, and passing through a drying step.
In the case of forming a pressure-sensitive adhesive layer (D) by forming an uneven pattern on the pressure-sensitive adhesive, a technique such as gravure coating or screen coating may be used, and embossing is applied in advance. A technique of applying or laminating the release paper and transferring the embossed pattern to the pressure-sensitive adhesive layer (D) may be used. In the latter case, the pressure sensitive adhesive layer (D) becomes an electric circuit (C) by peeling the release paper and laminating the uneven surface of the pressure sensitive adhesive layer (D) so as to be in contact with the easily breakable layer (B) surface of the laminated film. ) A label with a circuit partially provided thereon can be obtained.

When the cohesive force of the pressure sensitive adhesive is smaller than that of the layer (B), peeling (cohesive failure) proceeds in the pressure sensitive adhesive layer (D), and the intended purpose cannot be achieved. Further, in the embodiment using paste killing (E), the peeling is accompanied by the destruction of the pressure sensitive adhesive layer (D). Therefore, if the cohesive force of the pressure sensitive adhesive is larger than that of the layer (A), the label with circuit is peeled off. It tends to be difficult.
The pressure-sensitive adhesive preferably has a cohesive strength of 20 to 1000 g / cm width, and more preferably 25 to 500 g / cm width in order to achieve the intended purpose. When the cohesive force of the pressure-sensitive adhesive is less than 20 g / cm width, the strength is insufficient and the easily breakable layer (B) cannot be sufficiently broken, and the intended purpose tends to be difficult to achieve. On the contrary, when the cohesive force of the pressure-sensitive adhesive exceeds 1000 g / cm width, it becomes difficult to peel the pressure-sensitive adhesive layer (D) in a pattern, particularly in the state where the paste-killing (E) is provided. There is a tendency that it is difficult to achieve the purpose.

After providing the electric circuit (C) on the surface of the easily breakable layer (B) side of the laminated film consisting of the base material layer (A) and the brittle easily breakable layer (B), the pressure sensitive adhesive layer (D) The pressure sensitive adhesive may be applied directly on the surface of the easily breakable layer (B) so as to cover the electric circuit (C), and the pressure sensitive adhesive may be formed on the release paper (H) described later. An agent may be applied, dried if necessary, a pressure-sensitive adhesive layer (D) may be formed, and this may be laminated on the easily breakable layer (B) side surface. The latter method is preferred for the purpose of reducing the thermal history of the label with circuit.
The coating amount of the pressure sensitive adhesive is not particularly limited, but is usually in the range of ^{3 to} 60 g / m ² , preferably 10 to 40 g / m ² in terms of solid content.

When the adhesive force between the pressure-sensitive adhesive layer (D) and the easily breakable layer (B) is small, an anchor coating agent is applied to the back surface of the easily breakable layer (B) before providing the pressure-sensitive adhesive. It is preferable. As the anchor coating agent, polyurethane, polyisocyanate / polyether polyol, polyisocyanate / polyester polyol / polyethyleneimine, alkyl titanate, etc. can be used, and these are generally organic solvents such as methanol, ethyl acetate, toluene, hexane, Used by dissolving in water. The coating amount of the anchor coating agent, 0.01-5 g / m ² by solid content after coating and drying, is preferably in the range of 0.02~2g / m ^2. Applying such an anchor coat treatment is also useful for enhancing the adhesive force between the electric circuit (C) and the easily breakable layer (B).

[Sheet killing (E)]
The paste-killing (E) is partly provided on the pressure-sensitive adhesive layer (D) in a uniform state of the circuit-attached label so that the pressure-sensitive adhesive does not adhere to the adherend at the part. .
When a label with a circuit is attached to the adherend, and then the label is peeled off, the portion without the paste (E) is adhered to the adherend, so that the easily breakable layer (B) is broken, Although the pressure-sensitive adhesive layer (D) remains on the adherend, the portion provided with the paste (E) on the pressure-sensitive adhesive layer (D) is not adhered to the adherend. All of the layers (D) are peeled together. Therefore, it becomes possible to break the electric circuit (C) applied to the boundary of the presence or absence of paste killing (E).
Such paste killing includes non-tacky printing inks, varnishes, silicone agents, etc., which are partially printed on the pressure-sensitive adhesive layer (D) using a technique such as printing, for example, an electric circuit (C ), A paste kill (E) can be formed by providing a pattern, preferably in a pattern.

[Formation of labels with circuits]
The label with a circuit of the present invention forms a laminated film in which a base material layer (A) and a brittle easily breakable layer (B) are laminated, and then forms an electric circuit (C) by a technique such as printing, It can be formed by laminating a pressure sensitive adhesive layer (D) on this. When the electric circuit (C) is formed by a technique such as printing, it is preferable to simultaneously form printing (F) and back printing (G).

[Formation of laminated film]
The forming method for forming the base material layer (A) and the easily breakable layer (B) in a sheet shape is not particularly limited, and various known methods can be used, but as a specific example, it was connected to a screw type extruder. Cast molding that extrudes the molten resin into a sheet using a single or multi-layer T die or I die, inflation molding that uses a circular die to extrude the molten resin into a tube, and expands with the internal air pressure, and kneaded Examples thereof include calender molding, rolling molding, etc., in which the material is rolled with a plurality of hot rolls and processed into a sheet shape.
Various known methods can be used for laminating the base material layer (A) and the easily breakable layer (B), but specific examples include laminating them in a multi-layer die using a feed block and a multi-manifold. There are an extrusion method and an extrusion lamination method using a plurality of dies. Moreover, when the base material layer (A) has a multilayer structure, a multilayer die and extrusion lamination can be used in combination.

[Stretching]
After the base material layer (A) and the easily breakable layer (B) are laminated to form a laminated film, it is preferable to stretch each layer by stretching it in at least a uniaxial direction. Since the brittle easily breakable layer (B) of the present invention is brittle and low in strength and usually has a small thickness, it is very difficult to stretch-mold the single easily breakable layer (B). The base layer (A) can be stretched by laminating the easily breakable layer (B) as a support and then stretching the easily breakable layer (B).

The easily breakable layer (B) of the present invention can be easily formed with pores and reduced in thickness by stretching. As the stretching method, when stretching a cast film, longitudinal stretching using the difference in the peripheral speed of the roll group, lateral stretching using a tenter oven, rolling, simultaneous biaxial stretching using a combination of a tenter oven and a linear motor, etc. Can be mentioned. In addition, examples of the method for stretching the inflation film include simultaneous biaxial stretching by a tubular method. The draw ratio is not particularly limited, and is appropriately determined in consideration of the characteristics of the thermoplastic resin used. For example, when a propylene homopolymer or a copolymer thereof is used as a thermoplastic resin, it is about 1.2 to 12 times, preferably 2 to 10 times when stretched in one direction. The area magnification is 1.5 to 60 times, preferably 4 to 50 times. When using other thermoplastic resins, it is 1.2 to 10 times, preferably 2 to 5 times when stretched in one direction, and preferably 1.5 to 20 times by area magnification in the case of biaxial stretching. Is 4 to 12 times.

  The stretching temperature can be performed within a known temperature range suitable for a thermoplastic resin having a temperature not lower than the glass transition temperature of the thermoplastic resin used and not higher than the melting point of the crystal part. Specifically, when the thermoplastic resin is a propylene homopolymer (melting point 155 to 167 ° C.), it is 100 to 164 ° C., and when it is a high density polyethylene (melting point 121 to 134 ° C.), it is 70 to 133 ° C. ˜70 ° C. lower temperature. In addition, polyethylene terephthalate (melting point: 246 to 252 ° C.) is selected at a temperature at which crystallization does not proceed rapidly. The stretching speed is preferably 20 to 350 m / min.

[Print (F), reverse print (G)]
On the surface of the substrate layer (A) side of the circuit-attached label of the present invention, for the purpose of providing information visually, if necessary, a logo mark, a product name, a company name, an expiration date, a notice, a design such as a character, It is also possible to provide a print (F) by printing a barcode, a pattern or the like.
Such printing may be performed in the state of an easily peelable laminated film alone, or may be performed after forming a pressure-sensitive adhesive label structure with a release paper attached.
As printing, known methods such as offset printing, letterpress printing, gravure printing, flexographic printing, letter press printing, ink jet recording method, thermal recording method, thermal transfer recording method, and electrophotographic recording method can be used.

Before forming the electric circuit (C) on the surface of the easily breakable layer (B) side of the laminated film, the label with a circuit of the present invention is provided with back printing (G) in advance, the base material layer (A), It is good also as a label with a circuit formed by laminating a brittle easily breakable layer (B), back printing (G), electric circuit (C), and pressure-sensitive adhesive layer (D) in this order. In this aspect, it is preferable that the back printing (G) is visible after the circuit-attached label is peeled off, so that unauthorized opening or pasting can be further confirmed by visual recognition. Also, if the reverse letter of “paid” or “paid” is printed on the reverse side, the letter will remain on the adherend according to the adhesive pattern etc. after the label with circuit is removed. A discrimination effect similar to that of applying the top is obtained.
The back printing (G) can use the same technique as the printing (F), and may be performed during the same printing process as the printing (F). Furthermore, these printing and the formation of the electric circuit (C) may be performed in the same printing process.

[Release paper (H)]
Release paper (H) on the outside of the pressure-sensitive adhesive layer (D) of the label with circuit, if necessary, before attaching the label with circuit to the adherend to facilitate the handling of the label with circuit. It is also possible to provide. The release paper (H) provided on the label with a circuit via the pressure-sensitive adhesive layer (D) is formed on the pressure-sensitive adhesive layer (D) in order to improve the peelability from the pressure-sensitive adhesive layer (D). Generally, the surface to be contacted is subjected to silicone treatment. The release paper can usually be used as usual, and high-quality paper or kraft paper can be used as it is, or it can be treated with a silicone treatment on glassine paper, coated paper, plastic film, etc. Can be used.

[Cohesive strength]
In the present invention, the strength against peeling of each of the base material layer (A), the easily breakable layer (B), and the pressure-sensitive adhesive layer (D) constituting the circuit-attached label is organized by cohesive force. The cohesive strength was defined as the peel strength obtained from the peel strength test. Specifically, the peel strength of the base material layer (A) and the easily breakable layer (B) is obtained by the following method, and the peel strength of the pressure-sensitive adhesive layer (D) is JIS-K-6854-2: 1999. The peel strength was determined according to the peel adhesion strength test method by 180 degree peeling.

[Peel strength of base material layer (A)]
Glue to an aluminum plate with a thickness of 1 mm so that the adhesive (trade name “TM595” and “CAT56” standard mixture manufactured by Toyo Morton Co., Ltd.) is 25 g / m ² , and the end is approximately 30 mm wide. (Gripping) is applied, and this is applied to the base material layer (A) surface of the laminated film of the base material layer (A) and the brittle easily breakable layer (B), and is pressure-bonded. After storing in a temperature-controlled room (temperature 20 ° C., relative humidity 65%) for 1 week, this was cut into a width of 10 mm and a length of 300 mm, and a tensile tester (manufactured by Shimadzu Corporation, trade name: AUTOGRAPH) was used. At a pulling speed of 300 mm / min, the gripping portions on the aluminum plate side and the laminated film side are peeled at an angle of 180 °, and the stress when the peeling of the base material layer (A) is stable, or the base material layer The cohesive force of (A) is very strong and stable. When the thus broken without the maximum stress just before rupture is measured by the load cell.

The peel strength (cohesive force) of the base material layer (A) is 50 to 15000 g / cm width, preferably 100 to 12000 g / cm width. When the peel strength is less than 50 g / cm width, it is difficult to peel the label smoothly due to the cohesive force of the easily breakable layer (B) and the pressure-sensitive adhesive layer (D). When the width exceeds 15000 g / cm, there is no problem in terms of function as a label with a circuit, but it is difficult to obtain the same base material layer (A) in selecting the material of the present invention.
When the base material layer (A) has a multilayer structure, the layer in contact with the easily breakable layer (B) was defined as the layer (A1), and the peel strength thereof was measured. Specifically, from the same resin composition and stretching conditions, a laminated film composed of a two-layer structure of a layer (A1) and an easily breakable layer (B) was separately formed and measured by the above method.

[Peel strength of easily breakable layer (B)]
After the laminated film of the base material layer (A) and the brittle easily breakable layer (B) is stored in a temperature-controlled room (temperature 20 ° C., relative humidity 65%) for 12 hours, an adhesive tape ( Nichiban Co., Ltd., trade name: cello tape CT-18) was attached, and this was cut to a width of 10 mm and a length of 300 mm. The adhesive tape at one end was peeled off by about 30 mm by hand, and the adhesive tape side and the laminated film side were peeled off. A gripping part is formed. Using a tensile tester (manufactured by Shimadzu Corporation, trade name: AUTOGRAPH), each gripping part was peeled off at an angle of 180 ° at a tensile speed of 300 mm / min, and the easy-breaking layer (B) was peeled off. The stress when it is stable is measured with a load cell.
The peel strength (cohesive force) of the easily breakable layer (B) is 5 to 150 g / cm width, preferably 10 to 140 g / cm width. When the peel strength is less than 5 g / cm width, there is a possibility that peeling easily occurs during secondary processing such as printing, printing, and wiping, and a problem arises in secondary workability. If the width exceeds 150 g / cm, it is not practical because the easily breakable layer (B) does not peel or it is necessary to increase the stress required for peeling.

Hereinafter, the present invention will be described more specifically with reference to Examples, Comparative Examples, and Test Examples. The materials, amounts used, ratios, operations, and the like shown below can be changed as appropriate without departing from the spirit of the present invention. Therefore, the scope of the present invention is not limited to the specific examples shown below. The% described below is% by weight unless otherwise specified.
In addition, Table 1 summarizes the raw materials for the base material layer (A) and the brittle easily breakable layer (B) used in each example.

[Preparation of resin composition]
What mixed the raw material of Table 1 with the compounding ratio of Table 2 was melt-kneaded with the biaxial kneader set to 210 degreeC, and then extruded in the shape of a strand with the extruder set to 230 degreeC, After cooling, it was cut with a strand cutter to prepare pellets of the resin composition (af) shown in Table 2, and used in the subsequent production examples.

[Production example of laminated film]
(Production Examples 1-6)
The resin compositions (af) listed in Table 2 were employed in the combinations shown in Table 3 as constituting the base material layer (A) and the easily breakable layer (B), and this was set at 230 ° C. After melt-kneading with two extruders, each is supplied to an extrusion die set at 250 ° C., laminated in the die and extruded into a sheet, cooled to 60 ° C. by a cooling device, and an unstretched sheet is obtained. Obtained.
This non-stretched sheet was heated to 140 ° C. and stretched 5 times in the machine direction (MD) using the peripheral speed difference of the roll group. Next, this 5-fold stretched sheet is again heated to about 145 ° C. using a tenter oven and stretched 8 times in the transverse direction (TD), and then further heated to 160 ° C. to perform heat treatment to form a biaxially stretched film. Obtained.

Next, after cooling to 60 ° C. and slitting the ears, the biaxially stretched film was subjected to surface treatment by corona discharge, and the two layers having the layer thickness and cohesive force described in Production Examples 1 to 6 in Table 3 A laminated film having a structure (base layer (A) / easy to break layer (B), number of stretching axes: 2 axes / 2 axes) was obtained.
In Production Example 5, the resin composition f was used for the easily breakable layer (B), and during the stretch molding, the rough breakage frequently occurred on the easily breakable layer (B) side, and the film could not be stably formed. It was. Therefore, no later evaluation was performed.

(Production Examples 7 and 8)
Table 3 shows that the resin composition described in Table 2 constitutes the base material layer (A) and the easily breakable layer (B).
Adopted in the combination described in the above, after melt-kneading each in two extruders set at 230 ℃, supplied to the extrusion die set at 250 ℃, laminated in the die and extruded into a sheet, This was cooled to 60 ° C. by a cooling device to obtain an unstretched sheet.
This unstretched sheet is heated to 130 ° C., stretched 5 times in the machine direction (MD) using the peripheral speed difference of the roll group, and further heated to 160 ° C. for heat treatment to obtain a uniaxially stretched film. It was.
Next, after cooling to 60 ° C. and slitting the ears, both surfaces of this uniaxially stretched film were subjected to surface treatment by corona discharge, and the two layers having the layer thickness and cohesive force described in Production Examples 7 and 8 in Table 3 A laminated film having a structure (base layer (A) / easy to break layer (B), number of stretching axes: 1 axis / 1 axis) was obtained.

(Production Example 9)
The resin composition b shown in Table 2 was melt-kneaded with an extruder set at 250 ° C., extruded into a sheet form from a T die, and cooled to 60 ° C. with a cooling device to obtain an unstretched sheet. .
After heating this non-stretched sheet to 140 ° C., a uniaxially stretched film was obtained by stretching 5 times in the machine direction (MD) using the peripheral speed difference of the roll group. Next, the resin composition c and the resin composition e shown in Table 2 were melt-kneaded by two extruders set at 250 ° C., respectively, and extruded from a T-die into a sheet shape, and the surface of a uniaxially stretched film And a resin sheet having a laminated structure of base material layer (A2) / base material layer (A1) / easy breakable layer (B).

Next, the resin sheet having this laminated structure is heated again to about 120 ° C. using a tenter oven and stretched 8 times in the transverse direction (TD), and further heated to 160 ° C. for heat treatment to perform biaxial stretching. A film was obtained.
Next, after cooling to 60 ° C. and slitting the ear portion, both surfaces of this biaxially stretched film were subjected to surface treatment by corona discharge, and a three-layer structure having a layer thickness and a cohesive force described in Production Example 9 in Table 3 ( A laminated film of base layer (A2) / base layer (A1) / easy to break layer (B), number of stretch axes: 1 axis / 2 axes / 1 axis was obtained.

(Examples 1 to 5, Comparative Examples 1 and 4)
Print (F) including the product name and the suggested retail price on the surface of the base layer (A) or layer (A2) side of the laminated film described in Table 4 obtained in the above production example using a rotary seal printer. gave. Next, an antenna pattern is formed by flexographic printing using silver-containing ink (trade name: PChem / DOWA silver nanoink) manufactured by DOWA Electronics Co., Ltd. on the surface of the easily breakable layer (B) so as to make this a resonant label. The electric circuit (C) was provided by sintering and drying at 100 ° C. for 50 seconds.
Subsequently, the pressure-sensitive adhesives described in Table 4 (manufactured by Toyo Ink Manufacturing Co., Ltd., trade name: olivine BPS 8170, trade name: olivine BPS 1109, trade name: olivine BPS 5448) were employed in the combinations described in Table 4, and this The release paper (H) (manufactured by Oji Tac Co., Ltd., high-quality paper-based polyrami sheet, product name: L7C) was coated in a streak pattern so that the surface was 25 g / m ² using a silk screen. After drying to form the pressure-sensitive adhesive layer (D), this is laminated so as to be applied to the electric circuit (C) on the surface of the easily breakable layer (B) side of the laminated film, and printing (F) / base material Label with circuit laminated in the order of layer (A) (or base material layer (A2 / A1)) / easy-breakable layer (B) / electric circuit (C) / pressure-sensitive adhesive layer (D) / release paper (H) Got.
In Comparative Examples 1 and 4, the pressure-sensitive adhesive layer (D) has the smallest cohesive force.

(Comparative Example 2)
The laminated film using the resin composition f in the easily breakable layer (B) obtained in the above Production Example 5 has a large number of coarse breaks on the easily breakable layer (B) side during biaxial stretching and stably forms a film. Therefore, the subsequent evaluation and the molding of the label with a circuit were not performed.
(Comparative Example 3)
Although the laminated film using the resin composition f for the easily breakable layer (B) obtained in Production Example 8 above could be formed by uniaxial stretching, silver was formed on the easily breakable layer (B) side surface. When an antenna pattern is formed by flexographic printing using a contained ink (trade name: PChem / DOWA silver nano ink manufactured by DOWA Electronics Co., Ltd.), a part of the easily breakable layer (B) is formed on the flexographic plate side. As a result, the electric circuit (C) could not be formed. Therefore, the subsequent label with circuit was not formed.

(Comparative Example 5)
Printing (F) including a trade name and a suggested retail price was applied to the base layer (A) side surface of the laminated film obtained in Production Example 2 using a rotary seal printer. Next, an antenna pattern is formed by flexographic printing using silver-containing ink (trade name: PChem / DOWA silver nanoink) manufactured by DOWA Electronics Co., Ltd. on the surface of the easily breakable layer (B) so as to make this a resonant label. The electric circuit (C) was provided by sintering and drying at 100 ° C. for 50 seconds.
Next, the pressure-sensitive adhesive (manufactured by Toyo Ink Mfg. Co., Ltd., trade name: Orbine BPS1109) is applied to the silicone coated surface side of the release paper (H) (manufactured by Oji Tac Co., Ltd., high-quality paper-based polyrami sheet, trade name: L7C). After coating the entire surface with a roll coater to 25 g / m ² and drying to form a pressure sensitive adhesive layer (D), this was applied to the surface of the laminated film on the easily breakable layer (B) side. Laminated and labeled with circuit in the order of printing (F) / base material layer (A) / easy breakable layer (B) / electric circuit (C) / pressure sensitive adhesive layer (D) / release paper (H) Got.

(Example 6, Comparative Example 6)
Printing (F) including a product name and a suggested retail price was applied to the base layer (A) side surface of the laminated film shown in Table 4 obtained in the above production example using a rotary seal printer. Next, the conductive silver paste (manufactured by Toyo Ink Manufacturing Co., Ltd., trade name: REXALPHA, RA-FL FD type) is used on the surface of the easily breakable layer (B) to make this a resonant label, and the antenna is screen printed. A pattern was formed and UV-cured to provide an electric circuit (C).
Next, the pressure-sensitive adhesive listed in Table 4 (manufactured by Toyo Ink Mfg. Co., Ltd., trade name: Olivevine BPS8170, trade name: Olivevine BPS1109) was employed in the combination shown in Table 4, and this was easily broken by the laminated film. After coating the entire surface of the layer (B) side with a roll coater to 25 g / m ² and drying to form a pressure-sensitive adhesive layer (D), the pressure-sensitive adhesive layer (D) On top, UV varnish (trade name: UV Haku OP varnish UP-2, manufactured by T & K Toka Co., Ltd.) was provided in a streak shape by UV seal printing, and cured with ultraviolet rays to form paste (E).
Next, the release paper (H) (manufactured by Oji Tac Co., Ltd., high-quality paper-based polyrami sheet, product name: L7C) is laminated so that the pressure-sensitive adhesive layer (D) is in contact with the silicone coated surface side, and printing (F) Obtaining a label with circuit laminated in the following order: / base layer (A) / easy breakable layer (B) / electric circuit (C) / pressure sensitive adhesive layer (D) / glue kill (E) / release paper (H) It was.

(Example 7)
The laminated film obtained in Production Example 2 above is subjected to printing (F) including a product name and a suggested retail price on the surface of the base material layer (A) using a rotary seal printing machine, and an easily breakable layer (B) Back printing (G) including the reverse letter of “paid” was performed on the side surface. Next, the conductive silver paste (manufactured by Toyo Ink Manufacturing Co., Ltd., trade name: REXALPHA, RA-FL FD type) is used on the surface of the easily breakable layer (B) to make this a resonant label, and the antenna is screen printed. A pattern was formed and UV-cured to provide an electric circuit (C).

Next, the pressure-sensitive adhesive (manufactured by Toyo Ink Mfg. Co., Ltd., trade name: Orbine BPS1109) is applied to the silicone coated surface side of the release paper (H) (manufactured by Oji Tac Co., Ltd., high-quality paper-based polyrami sheet, trade name: L7C). After applying a straight line to a girth of 25 g / m ² using a silk screen and drying to form a pressure-sensitive adhesive layer (D), the electricity on the surface of the easily breakable layer (B) side of the laminated film This is laminated so as to be applied to the circuit (C), and printing (F) / base material layer (A) / easy-breaking layer (B) / back printing (G) / electric circuit (C) / pressure-sensitive adhesive layer A label with a circuit laminated in the order of (D) / release paper (H) was obtained.

(Evaluation of whether or not the electric circuit (C) is destroyed when the label with circuit is peeled off)
The release paper (H) is removed from the circuit labels obtained in Examples 1 to 7 and Comparative Examples 1 and 4 to 6, and the pressure-sensitive adhesive layer (D) is brought into contact with a smooth SUS plate. Then, the laminated film portion was peeled off by hand, and whether or not the electric circuit (C) was destroyed was visually confirmed.
The labels with circuits obtained from Examples 1 to 7 are all formed of a streaky pressure-sensitive adhesive layer (D), a fractured electric circuit (C), and a cohesive fracture easily breakable layer (B) on a SUS plate. Part of the residue remained, and the destruction of the electric circuit (C) was confirmed.

When the circuit-labeled labels obtained from Comparative Examples 1 and 4 were peeled off, cohesive failure proceeded in the pressure-sensitive adhesive layer (D), and the failure of the electric circuit (C) could not be confirmed.
In each of the labels with circuit obtained from Comparative Example 5, the pressure-sensitive adhesive layer (D), the electric circuit (C), and the cohesive breakable layer (B) remained entirely on the SUS plate. The destruction of the circuit (C) could not be confirmed.
In the label with circuit obtained from Comparative Example 6, the pressure-sensitive adhesive layer (D) hardly breaks in accordance with the print pattern of the paste-killing (E) when the laminated film part is peeled off by hand, The laminated film itself was broken, and as a result, it was confirmed that the electric circuit (C) was broken, but the entire label could not be peeled cleanly.

Claims (10)

A label with a circuit comprising a base material layer (A), a brittle easily breakable layer (B), an electric circuit (C), and a pressure-sensitive adhesive layer (D), which are laminated in this order,
In each of the base material layer (A), the easily breakable layer (B) and the pressure sensitive adhesive layer (D), the cohesive force of the easily breakable layer (B) is the smallest,
A label with circuit, wherein the pressure-sensitive adhesive layer (D) is partially provided on the electric circuit (C). A label with a circuit comprising a base material layer (A), a brittle easily breakable layer (B), an electric circuit (C), a pressure-sensitive adhesive layer (D), and a paste-killing agent (E), which are laminated in this order. There,
The cohesive strength of each of the base material layer (A), the easily breakable layer (B), and the pressure-sensitive adhesive layer (D) has a relationship of (A)>(D)> (B),
A label with a circuit, wherein paste (E) is partially provided on the pressure-sensitive adhesive layer (D).   The brittle easily breakable layer (B) is a porous resin film layer containing 20 to 75% by weight of at least one of a thermoplastic resin, an inorganic fine powder and an organic filler, and stretched at least in a uniaxial direction. The label with a circuit according to claim 1 or 2, wherein the force is 5 to 150 g / cm width.   From the content of at least one of the inorganic fine powder and the organic filler of the easily breakable layer (B), the base material layer (A) contains 3 to 50% by weight of at least one of the thermoplastic resin and the inorganic fine powder and the organic filler. 4. The label with circuit according to claim 1, wherein the resin film layer has a weight of 50 to 15000 g / cm width.   The pressure-sensitive adhesive layer (D) includes at least one pressure-sensitive adhesive selected from the group consisting of a rubber-based pressure-sensitive adhesive, an acrylic pressure-sensitive adhesive, and a silicone-based pressure-sensitive adhesive, and its cohesive strength is 20 to 1000 g / cm width. The label with a circuit according to any one of claims 1 to 4, wherein the label is provided.   The electric circuit (C) is formed by printing conductive ink, conductive paint, or conductive paste on the surface of the easily breakable layer (B), transferring a metal foil, or etching or plating a metal. The label with a circuit according to any one of claims 1 to 5.   The label with a circuit according to any one of claims 1 to 6, wherein the thermoplastic resin used for the brittle easily breakable layer (B) contains a polyolefin resin.   The label with a circuit according to any one of claims 1 to 7, wherein printing (F) is provided on the surface of the substrate with the substrate layer (A).   Before forming the electric circuit (C) on the easily breakable layer (B), the back print (G) is applied on the easily breakable layer (B), and the back print (G) is visible after the label with the circuit is peeled off. The label with a circuit according to claim 1, wherein   The label with a circuit according to any one of claims 1 to 9, wherein a release paper (H) is provided on the pressure-sensitive adhesive layer (D) side surface of the label with a circuit.

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