JP2003308510A - Re-sticking prevention noncontact type tag - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a noncontact type tag provided with a communication circuit part having at least a noncontact type communication antenna, capable of detecting data by a noncontact method, and provided with a prevention measure effective for illegal use by re-sticking. <P>SOLUTION: This noncontact type tag is provided with at least a separation layer easily separable from a base material and an adhesive layer on a partial surface or the entire surface of the base material in that relative order. The communication circuit part having at least the noncontact type communication antenna is so formed as to be positioned between the separation layer and the adhesive layer. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

The present invention comprises a non-contact type communication antenna,
The present invention relates to a non-contact type tag which is a non-contact type information record carrier capable of detecting data in a non-contact type, and more particularly to a non-contact type tag provided with effective preventive measures against unauthorized use due to replacement.

[0002]

2. Description of the Related Art Conventionally, a non-contact type tag has been used as one of shoplifting prevention means which is attached to a product and detects and informs unauthorized removal outside a store. In recent years, this non-contact tag has a built-in integrated circuit,
It has been developed into an IC-equipped tag that enables writing and reading of information without mechanical contact, and its use is expanding to product management such as product storage management and inventory management. Further, in such a non-contact type tag such as an IC mounted tag, arbitrary information is stored in advance, and when necessary, the information is confirmed to verify the authenticity of the attached product. The use as an authentication tag has also been tried. However, as the field of use of the non-contact tag expands, there is a fear of unauthorized use in which the tag is peeled off from a genuine product and attached to a counterfeit product for distribution as a genuine product.

To counter such forgery, Japanese Patent Laid-Open No. 2001-2
In Japanese Patent No. 56575, etc., a method is proposed in which a cut is made in a film serving as a base material to prevent forgery and unauthorized use, but since the base material serving as a support has a cut, a communication circuit portion is It is easy to destroy, and there is a risk that this part will be destroyed in the process of attaching the tag. Also, during the manufacturing process, the adhesive (adhesive) may stick out from the cuts in the base material and adhere to another object to destroy it.
Poor workability has also been pointed out. Further, these tags can be adhered to the surface of the tough film and then can be peeled off together with the tough film from the adherend without being destroyed, and the problem of illegal use still remains.

[0004]

SUMMARY OF THE INVENTION The present invention has been made in view of the above situation, and it is hard to break because it does not make any work such as cuts in the base material as a support. Workability and appearance in the process are not impaired,
Moreover, it is an object of the present invention to provide a non-contact type tag in which part of the constituent material is surely destroyed only when it is attempted to peel off the object which has been pasted once, thus making it impossible to replace the tag.

[0005]

SUMMARY OF THE INVENTION In order to solve the above problems, the invention according to claim 1 has a release layer which is easily peeled off from a part or the whole surface of the base material. ,
Prevention of replacement, characterized in that the adhesive layer is provided in at least this relative order, and a communication circuit section having at least a non-contact type communication antenna is provided between the peeling layer and the adhesive layer. It is a non-contact tag.

Further, in the invention as set forth in claim 2, the release layer, the communication circuit section having at least the non-contact type communication antenna, and the adhesive layer are provided on at least a part or the entire surface of the base material in this relative order. In preparation for this, a peeling layer that enhances the peeling property between the base material and the communication circuit portion is provided in the peelable region between the base material and the communication circuit portion, and further, the base material and the communication circuit portion An adhesive anchor layer for improving the adhesiveness of the base material is provided in the adhesive area between the base material and the communication circuit section, and
This is a non-replacement prevention non-contact tag in which the communication circuit section is provided so as to be located between the peeling layer and the adhesive layer.

Further, in the invention according to claim 3, the release layer, the communication circuit section having at least the non-contact type communication antenna, and the adhesive layer are provided on at least a part or the entire surface of the base material in this relative order. In preparation for this, a peeling layer that enhances the peeling property between the base material and the communication circuit portion is provided in part or all between the base material and the communication circuit portion, and further, peeling between the communication circuit portion and the adhesive layer. A non-replacement prevention non-contact tag in which a second peeling layer for improving the property is partially provided in a region between the communication circuit section and the adhesive layer.

Further, in the invention according to claim 4, a release layer, an OVD layer and an adhesive layer which are easily peeled from the substrate are provided on at least a part or the entire surface of the substrate in this relative order. A release layer that enhances the release property between the base material and the OVD layer is provided on a part or the whole of the region between the base material and the OVD layer, and further, at least a communication circuit having a non-contact communication antenna. The replacement prevention non-contact tag is characterized in that the part is provided so as to be located between the OVD layer and the adhesive layer.

Further, in the invention according to claim 5, the OVD layer, the communication circuit section having at least the non-contact type communication antenna, and the adhesive layer are provided on at least a part or the entire surface of the base material in this relative order. In preparation for this, a peeling layer that enhances the peeling property between the base material and the OVD layer is provided in the peelable region between the base material and the OVD layer, and further, the adhesion between the base material and the communication circuit section. And an adhesive anchor layer for improving the property
It is provided in the adhesive area between the VD layer and
The communication circuit unit is a non-replacement contactless tag that is provided so as to be located between the OVD layer and the adhesive layer.

Furthermore, the invention according to claim 6 is a communication circuit having an OVD layer and an adhesive layer in at least this relative order on a part or the whole surface of a base material, and having at least a non-contact type communication antenna. A part is provided between the OVD layer and the adhesive layer, and a peeling layer that enhances the peelability between the communication circuit part and the adhesive layer is one of the regions between the base material and the OVD layer. Part or the entire surface, and a second peeling layer for enhancing the peeling property between the communication circuit portion and the adhesive layer is partially provided in the region between the communication circuit portion and the adhesive layer. This is a non-replacement prevention non-contact type tag.

Further, the invention according to claim 7 is the non-replacement prevention contactless tag according to any one of claims 1 to 6, wherein the communication circuit portion is provided with an integrated circuit chip. It is characterized by

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail with reference to the drawings showing the embodiments thereof. FIG. 1 is a cross-sectional explanatory view showing an example of a basic configuration of a non-replacement prevention non-contact tag of the present invention and a state of destruction at the time of peeling. Further, FIGS. 2, 3, 4, 5, and 6 are cross-sectional explanatory views showing another basic configuration example of the non-replacement prevention non-contact tag of the present invention and a state of breakage at the time of peeling them. In the figure, A shows a state before being peeled off, and B in the figure shows a state after being peeled off and destroyed.

The non-replacement prevention non-contact type tag shown in FIG.
The base material 1, the peeling layer 2, the communication circuit section 3, and the adhesive layer 4 are laminated in this order. This non-replacement prevention non-contact type tag easily peels off between the base material 1 and the communication circuit section 3 when it is forcibly peeled off once attached, and part or all of the communication circuit section 3 is covered. Remain on the body. The remaining communication circuit section 3 becomes fragile because the base material 1 serving as a support is lost, and is broken if it is forcibly peeled off.

The non-replacement prevention non-contact tags shown in FIGS. 2 and 3 are of a type that completely breaks when they are peeled off. In the replacement preventive non-contact tag shown in FIG. 2, a peeling layer 2 that enhances the peeling property between the base material 1 and at least the communication circuit section 3 having the non-contact communication antenna is formed on the base material 1.
Is provided in the peelable area between the communication circuit section 3 and
Furthermore, an adhesive anchor layer 5 that enhances the adhesiveness between the base material 1 and the communication circuit section 3 is provided in the adhesive area between the base material 1 and the communication circuit section 3, and the communication circuit section 3 is The structure is provided so as to be located between the peeling layer 2 and the adhesive layer 4. When the tag is to be peeled off, there is a portion that easily peels off and a portion that does not peel off between the base material 1 and the communication circuit portion 3. Therefore, part of the communication circuit portion 3 is peeled off together with the base material 1, Some remain on the adherend, causing complete destruction.

In addition, in the non-replacement prevention non-contact tag shown in FIG. 3, the peeling layer 2 for enhancing the peeling property of the base material 1 and the communication circuit portion 3 having at least the non-contact communication antenna has the base material 1 and the communication circuit portion. The second peeling layer 6 provided between the communication circuit unit 3 and the adhesive layer 4 is provided in a region between the communication circuit unit 3 and the adhesive layer 4. It has been configured. If you try to remove this tag,
In the communication circuit section 3, the portion where the second peeling layer 6 is present is separated to the base material 1 side, and the portion where it is not present is separated to the adherend side to cause destruction. Further, in this tag, since the second peeling layer 6 portion is located under the communication circuit unit 3, it is difficult to confirm its existence, and the tag design is not impaired.

In short, in the case of these constitutions, when it is attempted to peel off the one adhered to the adherend, the communication circuit section 3 is divided into the base material 1 side and the adhesive layer 4 side, which leads to complete destruction. It is designed to be tightened.

On the other hand, the non-replacement prevention non-contact type tags shown in FIGS. 4, 5 and 6 are all characterized in that an OVD layer is provided, and the tag which is destroyed when it is about to be peeled off can be easily discriminated by visual inspection, and a fake one is also possible. It is a very difficult structure to make. That is, when the peeling prevention non-contact tag shown in FIG. 4 is peeled off, peeling easily occurs between the base material 1 and the peeling layer 2, and the OVD layer 7 and the communication circuit section 3 are partially or entirely covered. Remain on the body. OVD layer 7 left
Also, the communication circuit section 3 is configured to be destroyed by a slight force because the base material 1 serving as a support is lost. Also,
With this configuration, even if a replacement is performed, O
By confirming whether or not the VD layer 7 has been destroyed, it is possible to visually determine that the replacement has been performed easily. Furthermore, OVD is a technology that is extremely difficult to counterfeit, which can also prevent counterfeiting.

When the peeling prevention non-contact type tag shown in FIG. 5 is peeled off, a portion easily peeled off and a portion not peeled off occur between the base material 1 and the OVD layer 7.
A part of the OVD layer 7 and the communication circuit unit 3 is peeled off together with the base material 1, and a part of the OVD layer 7 remains on the adherend, causing complete destruction. In this replacement prevention non-contact tag as well, similar to the above replacement prevention non-contact tag, the presence or absence of forgery can be easily determined by checking the OVD state.

When the peeling prevention non-contact type tag shown in FIG. 6 is to be peeled off, the communication circuit is on the base material 1 side in the portion where the second peeling layer 6 is present, and is on the adherend side in the portion where it is not present. This is a structure in which the part 3 is pulled apart to cause destruction. Further, also in the replacement preventive non-contact type tag, as in the replacement preventive non-contact type tag shown in FIG. 5, it is possible to easily determine the presence or absence of forgery by checking the OVD layer. Further, in the tag according to this configuration, since the second peeling layer 6 portion is located under the communication circuit unit 3, the presence thereof cannot be visually confirmed, so that the tag design is not impaired.

Further, by further providing an integrated circuit chip in the communication circuit section 3 of the non-replacement prevention non-contact tag according to these various configurations, complicated information is recorded in this integrated circuit and the information is read out. In addition, it is possible to verify by collating, and it is possible to have a higher anti-counterfeiting effect.

The materials and manufacturing methods for forming these layers will be described below. It is sufficient for the base material 1 to have heat resistance and strength such that it is not softened and deformed by the heat and pressure during tag manufacturing and processing. Examples of the constituent material thereof include polyvinyl chloride, polyester, polycarbonate, polymethyl methacrylate, polystyrene, polyethylene, polyethylene terephthalate, polyethylene naphthalate, polypropylene, polyvinyl alcohol, and other synthetic resins, natural resins, paper, synthetic paper, and the like. , These can be used alone or in combination. Moreover, the thickness is 2-1 in consideration of operability and workability.
It is preferably about 00 μm.

Next, the peeling layer 2, which is a whole or a part of the peeling preventive non-contact type tag of the present invention which is once stuck to an adherend, is peeled off completely or partially. It is a layer provided so that the tag is destroyed.
The constituent material of the peeling layer 2 may be any of a thermoplastic resin, a thermosetting resin, an ultraviolet ray or an electron beam curable resin, as long as it is a material that can be peeled between layers. Specifically, thermoplastic polyacrylic acid ester resin, chlorinated rubber resin, vinyl chloride-vinyl acetate copolymer resin, cellulose resin, chlorinated polypropylene resin, epoxy resin, polyester resin, nitrocellulose resin, Thermoplastic resin such as styrene acrylate resin, polyether resin, polycarbonate resin, etc., urethane curing resin, melamine curing resin, epoxy curing resin, etc., epoxy (meth) acrylic, urethane (meth) acrylate Examples thereof include ultraviolet rays and electron beam curable resins.

In consideration of releasability, petroleum wax,
Various waxes such as plant waxes, metal salts of higher fatty acids such as stearic acid, mold release agents such as silicone oil, Teflon (R) powder, polyethylene powder, organic fillers such as silicone fine particles and acrylonitrile fine particles, and It is also possible to add an inorganic filler such as silica fine particles to reduce the cohesive force of the layer itself so that the layer can be easily broken. On the other hand, these materials can be appropriately used for the second peeling layer 6, but it is necessary to select a material that can be peeled off more easily than the peeling layer 2. That is, the peel strength between the communication circuit unit 3 and the second peel layer 6 is selected to be smaller than the peel strength between the base material 1 and the peel layer 2. (See FIGS. 3 and 6)

On the other hand, the communication circuit section 3 needs to have at least a non-contact type communication antenna. This antenna has a different shape depending on the communication system, and the antenna used in the known non-contact type communication carrier is used for the tag of the present invention. That is, an antenna used for communication means such as an electrostatic coupling method, an electromagnetic induction method, or a microwave method can be appropriately selected and used. As a method of forming this antenna, a method of forming a conductive metal foil such as copper or aluminum by half-cutting, etching, or plating, or using a conductive ink obtained by mixing these conductive powders is used. Examples include a method of forming by a printing method. These are examples, and any known antenna used for non-contact type communication can be used, but in any case, it is preferable to form the antenna with a thickness of 35 μm or less so that the antenna is easily broken. Further, depending on the configuration of the non-replacement prevention non-contact tag of the present invention, it is more preferably 20 μm or less, depending on the shape of the antenna, in order to make the antenna more easily broken.

On the other hand, the communication circuit section 3 can be equipped with an integrated circuit chip for storing / recording according to the purpose of use. The integrated circuit chip in the present invention is a generic term for chips such as so-called ICs, LSIs, VLSIs, etc., and means all chips using integrated circuits. The tag equipped with such an integrated circuit chip can not only record and manage the distribution history, but also verify the authenticity of the product by verifying arbitrary information recorded in advance.

Further, the adhesive layer 4 is a layer for attaching and fixing the non-replacement prevention non-contact type tag of the present invention to an adherend, and it is a pressure sensitive type for adhering by pressure or a heat sensitive for adhering while applying heat. Type of thing is applied. Examples of the pressure-sensitive adhesive constituting the former include rubber-based adhesives such as natural rubber, isoprene rubber, styrene-butadiene rubber and butyl rubber, and acrylic pressure-sensitive adhesives such as ethyl acrylate and butyl acrylate. Other than the above, any one having pressure-sensitive adhesiveness such as polyester and vinyl resin having low glass transition point and having adhesiveness at room temperature can be used. On the other hand, examples of the heat-sensitive adhesive constituting the latter include thermoplastic resins such as acrylic resins, urethane resins, epoxy resins, polyester resins, and vinyl resins, which are thermoplastic resins, but are not necessarily limited to these. It is not something that will be done.

On the other hand, the adhesive anchor layer 5 shown in FIGS.
Is a layer for partially adhering the base material 1 and the peeling layer 2 or the base material 1 and the communication circuit section 3 to each other.
Thermoplastic resin, thermosetting resin that promotes adhesion between layers,
An ultraviolet ray or electron beam curable resin is used. Specifically, thermoplastic polyacrylic acid ester resin, chlorinated rubber resin, vinyl chloride-vinyl acetate copolymer resin, cellulose resin, chlorinated polypropylene resin, epoxy resin, polyester resin, nitrocellulose resin, Thermoplastic resin such as styrene acrylate resin, polyether resin, polycarbonate resin, etc., urethane curing resin, melamine curing resin, epoxy curing resin, etc., epoxy (meth) acrylic, urethane (meth) acrylate Examples thereof include ultraviolet rays and electron beam curable resins.

Next, the OVD will be described. OVD
(Optical Variable Device)
Is an image utilizing light interference, and is a display body in which the expression of the stereoscopic image changes or the color changes (color shifts) depending on the viewing angle. Among them, as the OVD such as a hologram or a diffraction grating, a relief type in which interference fringes of light are recorded on a plane as a fine uneven pattern and a volume type in which interference fringes are recorded in a volume direction can be specifically mentioned. it can. On the other hand, the method is different from holograms and diffraction gratings,
There is also a multilayer film system in which thin films of ceramics or metal materials having different optical characteristics are laminated and a color change (color shift) occurs depending on the viewing angle. Among these OVDs, relief type holograms (diffraction gratings) and multi-layer thin film type are preferable in view of mass productivity and cost, and these OVDs are generally widely used. Hereinafter, the OVD layer 7 including these OVDs will be described in more detail.

The replacement prevention non-contact tag shown in FIG. 4A shows an example of the most basic structure of the replacement prevention non-contact tag having the OVD layer 7 which is a relief hologram. Relief type holograms (diffraction gratings) are generally manufactured by making a relief type master plate with a fine relief pattern by an optical imaging method, and then replicating the relief pattern from this master plate by electroplating. It is mass-produced by obtaining a nickel-made press plate and then pressing with this press plate. The OVD forming layer 7a of the OBD layer 7 forming a part of the present invention is formed by heating and pressing the press plate thus obtained, and duplicating the concavo-convex pattern on the part.

The OVD forming layer 7a is required to have a property of being moldable by a press plate, and the material thereof may be any of thermoplastic resin, thermosetting resin, ultraviolet ray or electron beam curable resin. . Specifically, a thermoplastic resin such as an acrylic resin, an epoxy resin, a cellulosic resin, or a vinyl resin, or a polyisocyanate added as a crosslinking agent to an acrylic polyol or polyester polyol having a reactive hydroxyl group and crosslinked urethane Resins, thermosetting resins such as melamine-based resins and phenol-based resins, and ultraviolet or electron beam-curable resins such as epoxy (meth) acrylic and urethane (meth) acrylates can be used alone or in combination. In addition to the above materials, any known material that can form an OVD image can be used.

The OVD effect layer 7b is made of a material having a refractive index different from that of the polymer material forming the relief surface in order to enhance the diffraction efficiency of the OVD image. Materials used include TiO ₂ , Si ₂ O ₃ , SiO, Fe ₂ O ₃ having different refractive indices,
High refractive index material such as ZnS or A with higher reflection effect
Examples thereof include metal materials such as 1, Sn, Cr, Ni, Cu, and Au, but are not necessarily limited thereto.
Other known materials can be widely used. And these can be used individually or in combination. The OVD layer 7 having such a structure is formed by using these materials by a vacuum vapor deposition method,
It is formed by a known thin film forming technique such as sputtering. The film thickness depends on the application, but is 50 to 1000
It may be about 0 Å, and the shape thereof may be any of a layer shape, a granular shape (sea island shape), a pattern shape, and the like, and an appropriate one may be selected and applied according to the purpose.

On the other hand, when the multi-layer thin film type OVD is adopted, the OVD layer 7 is composed of multi-layer thin film layers having different optical aptitude, and is laminated and formed as a metal thin film, a ceramic thin film, or a composite thin film in which these are combined. For example, when laminating thin films having different refractive indexes, a thin film having a high refractive index and a thin film having a low refractive index may be combined, or a specific combination may be laminated alternately. A desired multilayer thin film layer (OVD layer) can be obtained by a combination thereof. This multilayer thin film layer is formed of a material such as ceramics or metal, and is formed by laminating approximately two or more high refractive index materials and a low refractive index material having a refractive index of about 1.5 with a predetermined film thickness.

An example of the materials used below will be given. First, as ceramics, Sb ₂ O ₃ (3.0 = refractive index n: same below), Fe ₂ O ₃ (2.7), TiO ₂ (2.
6), CdS (2.6), CeO ₂ (2.3), ZnS
(2.3), PbCl ₂ (2.3), CdO (2.
2), Sb ₂ O ₃ (2.0), WO ₃ (2.0), SiO
(2.0), Si ₂ O ₃ (2.5), In ₂ O ₃ (2.
0), PbO (2.6), Ta ₂ O ₃ (2.4), ZnO
(2.1), ZrO ₂ (2.0), MgO (1.6),
SiO ₂ (1.5), MgF ₂ (1.4), CeF
₃ (1.6), CaF ₂ (1.3 to 1.4), AlF
₃ (1.6), Al ₂ O ₃ (1.6), GaO (1.7)
Etc., and a thin film of a simple metal or an alloy, for example, A
l, Fe, Mg, Zn, Au, Ag, Cr, Ni, C
u, Si, etc. may be mentioned. Examples of the organic polymer having a low refractive index include polyethylene (1.51), polypropylene (1.49), polytetrafluoroethylene (1.35), polymethylmethacrylate (1.4
9) and polystyrene (1.60). By selecting at least one of these high-refractive index materials or metal thin films of 30% to 60% transmission and at least one of low-refractive index materials, and stacking them alternately with a predetermined thickness to form a multilayer thin film, Will absorb or reflect visible light. Since the thin film made of metal has different optical characteristics such as a refractive index depending on the state of the constituent materials, the forming conditions, etc., the values under certain conditions are used in the embodiments of the present invention.

In forming a multi-layered thin film layer, an appropriate material is selected from the above-mentioned materials on the basis of optical properties such as refractive index, reflectance and transmittance, weather resistance, interlayer adhesion, etc. It is formed by stacking. A known method can be used as the forming method, and for example, the film thickness, the film forming speed, the number of layers, or the optical film thickness (= n · d, n: refractive index, d: film thickness) can be controlled. It is formed by an ordinary vacuum vapor deposition method or a sputtering method.

Although the simplest construction of the non-replacement contactless tag of the present invention has been described above, this construction is a basic construction, and each layer is colored or a printing layer is provided between layers to design it. For the purpose of improving the anti-counterfeiting effect and further improving the anti-counterfeiting effect by forming a printing layer using a known anti-counterfeiting ink that enables verification of ultraviolet / infrared emitting ink, infrared absorbing ink, etc. Applicable accordingly.

[0036]

EXAMPLES The present invention will be described in detail with reference to specific examples. <Example 1> First, a 25 μm thick transparent polyethylene terephthalate (PET) film base material was coated with a 2 μm thick release layer made of an acrylic resin by a gravure method, and then a 12 μm thick aluminum foil was formed. After bonding, the communication circuit section was formed by the etching method. Next, an acrylic pressure-sensitive adhesive is applied with a thickness of 20 μm by the comma coat method, an adhesive layer is provided, and release paper is laminated on the adhesive layer to produce a non-contact tag having a structure as shown in FIG. did.

Example 2 First, on a substrate made of a transparent polyethylene terephthalate (PET) film having a thickness of 25 μm, an adhesive anchor layer made of a polyester resin having a thickness of 1 μm was constructed as shown in FIG. Partially,
The peeling layer made of acrylic resin was formed by sequentially applying the gravure method to a thickness of 2 μm. Then 12μ
After laminating m-thick aluminum foil, a communication circuit portion was formed by an etching method. After that, an acrylic pressure-sensitive adhesive is applied by a comma coat method to a thickness of 20 μm, an adhesive layer is provided, and release paper is laminated on the adhesive layer, and a non-contact tag having a structure as shown in FIG. 2 is formed. It was made.

Example 3 First, a release layer made of an acrylic resin was applied to a substrate made of a transparent polyethylene terephthalate (PET) film having a thickness of 25 μm by 2 μm by a gravure method.
It was applied and formed in a thickness of m. Then, after bonding an aluminum foil having a thickness of 12 μm, a communication circuit portion was formed by an etching method. Thereafter, an acrylic-modified silicone resin was partially applied by a gravure method to a thickness of 2 μm as shown in FIG. 3 to form a second release layer. Then, an acrylic pressure-sensitive adhesive was applied on the second release layer by a comma coat method to a thickness of 20 μm, an adhesive layer was provided, and release paper was laminated on the second release layer. An expression tag was created.

Example 4 First, a release layer and a hollow layer (OVD) made of an acrylic resin were formed on a substrate made of a transparent polyethylene terephthalate (PET) film having a thickness of 25 μm.
(Forming layer) is applied and formed to a thickness of 20 μm and a thickness of 5 μm respectively by a gravure method, and then an OVD relief pattern is formed by a roll embossing method, and then an Al vapor deposition of 0.05 μm thickness is performed using a vacuum vapor deposition method. A thin film layer (OVD effect layer) was provided. After that, the OVD effect layer was partially subjected to etching processing so that Al vapor deposition remained only in the central portion. Then, an aluminum foil having a thickness of 12 μm was attached from above, and a communication circuit portion was formed by an etching method. Further, an acrylic pressure-sensitive adhesive is applied on the communication circuit section by a comma coat method to a thickness of 20 μm, an adhesive layer is provided, and then release paper is laminated, and the non-contact structure as shown in FIG. An expression tag was created.

Example 5 First, as shown in FIG. 5, an adhesive anchor layer made of polyester resin was partially applied and formed on a substrate made of a transparent polyethylene terephthalate (PET) film having a thickness of 25 μm so as to have a thickness of 1 μm. Then, a release layer made of an acrylic resin and an OVD forming layer made of a urethane resin were applied and formed by a gravure method to a thickness of 2 μm. Then, after forming an OVD relief pattern by a roll embossing method, an Al vapor deposition thin film layer (OVD effect layer) having a film thickness of 0.05 μm was provided by a vacuum vapor deposition method. Then, the OVD effect layer was partially subjected to etching processing so that Al vapor deposition was left only in the central portion, aluminum foil was attached, and then a communication circuit portion was formed by an etching method. Further, an acrylic pressure-sensitive adhesive is applied by a comma coat method to a thickness of 20 μm, an adhesive layer is provided, and finally release paper is laminated.
A contactless tag having a structure as shown in FIG. 5 was produced.

Example 6 First, a release layer made of an acrylic resin and an OVD forming layer made of a urethane resin were formed on a substrate made of a transparent polyethylene terephthalate (PET) film having a thickness of 25 μm by 2 μm by a gravure method.
Was applied and formed in a thickness of. Then, after forming an OVD relief pattern by a roll embossing method, an Al vapor deposition thin film layer (OVD) having a film thickness of 0.05 μm is formed by a vacuum vapor deposition method.
Effect layer). After that, the OVD effect layer was partially subjected to etching processing so that Al vapor deposition was left only in the central portion, aluminum foil was attached, and then a communication circuit portion was formed by an etching method. Then, an acrylic modified silicone resin was partially applied by a gravure method to a thickness of 2 μm as shown in FIG. 6 to form an adhesive layer. Finally, the acrylic pressure sensitive adhesive is applied by the comma coat method to 20
A non-contact tag having a structure as shown in FIG. 6 was produced by applying and forming a film having a thickness of μm, and further laminating release paper.

The non-contact type tag (sticker) thus obtained was attached to a corrugated paper as an adherend. Then, Table 1 shows the result when the sticker was forcibly peeled off.

[0043]

[Table 1]

As described above, it was confirmed that any of the replacement prevention non-contact type tags according to the embodiment was easily destroyed and the unauthorized use and reuse due to the replacement were prevented.

[0045]

The non-replacement non-contact tag of the present invention is
Rather than making a work for preventing replacement on the base material which becomes the support, the function for preventing replacement is added to the layer structure. Therefore, it has good operability until it is attached to the adherend, and it is not broken before being attached. Then, if it is attempted to be peeled off after being attached, it can be easily destroyed, and reuse and illegal use due to replacement can be prevented. Further, by integrally forming the OVD, it is possible to prevent forgery such as copying. Furthermore, by mounting an integrated circuit on these tags, it is possible to record complicated information, which can be applied to product logistics management,
It is also possible to use it as a medium provided with a verification function that makes it possible to distinguish a counterfeit.

[Brief description of drawings]

FIG. 1 is a cross-sectional explanatory view showing an example of the configuration of a non-contact tag of the present invention and a state of breakage during peeling.

FIG. 2 is a cross-sectional explanatory view showing another example of the configuration of the non-contact tag of the present invention and the state of destruction at the time of peeling.

FIG. 3 is a cross-sectional explanatory view showing still another example of the configuration of the non-contact tag of the present invention and the state of destruction at the time of peeling.

FIG. 4 is a cross-sectional explanatory view showing still another example of the configuration of the non-contact tag of the present invention and the state of destruction at the time of peeling.

5A and 5B are cross-sectional explanatory views showing still another example of the configuration of the non-contact tag of the present invention and a state of destruction at the time of peeling.

FIG. 6 is a cross-sectional explanatory view showing still another example of the configuration of the non-contact tag of the present invention and the state of destruction at the time of peeling.

[Explanation of attachment]

1 base material 2 Release layer 3 Communication circuit section 4 Adhesive layer 5 Adhesive anchor layer 6 Second release layer 7 OVD layer 7a OVD forming layer 7b OVD effect layer

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) G09F 3/10 G06K 19/00 HF term (reference) 5B035 AA13 BA03 BA05 BB09 CA01 CA23 5C084 AA03 AA09 BB40 CC35 DD07 DD87 EE07 FF03 GG07 GG09

Claims (7)

[Claims] 1. A communication circuit section having a release layer easily peeled from the base material and an adhesive layer in at least this relative order on a part or the whole surface of the base material, and having at least a non-contact type communication antenna. Is a non-replacement prevention non-contact tag which is provided so as to be located between the peeling layer and the adhesive layer. 2. A release layer on a part or the whole surface of a substrate,
A communication circuit section having at least a non-contact through-type credit antenna and an adhesive layer are provided in at least this relative order, and a peeling layer for enhancing the peeling property between the base material and the communication circuit section is provided between the base material and the communication circuit section. The adhesive anchor layer for enhancing the adhesiveness between the base material and the communication circuit section is provided in the adhesive area between the base material and the communication circuit section, and A non-replacement prevention contactless tag, wherein the communication circuit section is provided between the peeling layer and the adhesive layer. 3. A release layer on a part or the whole surface of a substrate,
A communication circuit section having at least a non-contact type communication antenna and an adhesive layer are provided in at least this relative order, and a peeling layer for enhancing the peeling property between the base material and the communication circuit section is provided between the base material and the communication circuit section. A second peeling layer which is provided on all or part of the communication circuit portion and enhances the peelability between the communication circuit portion and the adhesive layer, and is partially provided in the region between the communication circuit portion and the adhesive layer. A non-contact tag that prevents replacement. 4. A peelability between the substrate and the OVD layer is provided on at least a part or the entire surface of the substrate, at least in this relative order, a release layer, an OVD layer and an adhesive layer which are easily peeled from the substrate. A release layer that enhances the temperature is provided on a part or the entire surface of the region between the base material and the OVD layer, and a communication circuit section having at least a non-contact type communication antenna is provided on the OVD layer and the adhesive layer. A non-replacement non-contact tag that is provided so as to be located between the tags. 5. An OVD layer, a communication circuit section having at least a non-contact type communication antenna, and an adhesive layer are provided in at least this relative order on a part or the whole surface of a substrate,
A peeling layer that enhances the peelability between the base material and the OVD layer is provided in a peelable region between the base material and the OVD layer, and further, the adhesion between the base material and the communication circuit unit is enhanced. An adhesive anchor layer is provided in an adhesive region between the base material and the OVD layer, and the communication circuit section is provided so as to be located between the OVD layer and the adhesive layer. A non-contact tag that prevents replacement. 6. A communication circuit section comprising an OVD layer and an adhesive layer in at least this relative order on a part or the whole surface of a base material, and a communication circuit section having at least a non-contact communication antenna.
A release layer which is provided between the D layer and the adhesive layer and which enhances the release property between the communication circuit section and the adhesive layer is a part of the region between the base material and the OVD layer, or A second peeling layer that is provided on the entire surface and that enhances the peeling property between the communication circuit unit and the adhesive layer is partially provided in the region between the communication circuit unit and the adhesive layer. A non-contact tag that prevents replacement. 7. The non-replacement prevention contactless tag according to claim 1, wherein the communication circuit section is provided with an integrated circuit chip.