JP2010055467A - Rfid label with optical function - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an RFID label that, in an OVD (Optical Variable Device)-integrated structure, do not restrict OVD-based optical effects of providing improved decoration and design and optical information recording function, and cannot be reused even when removed from an adherend while maintaining OVD-based advantages such as the development of an RFID antenna function. <P>SOLUTION: In the RFID label having at least a label substrate, an OVD layer, an RFID IC chip, a lead wiring layer electrically connected to the IC chip, and an adhesive layer for attaching the RFID label to an adherend, the OVD layer has the function of providing optical effects and is conductive, a cover layer is disposed between the OVD layer and the lead wiring layer, and the OVD layer and the cover layer are separated from each other when the RFID label is removed from the adherend. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an RFID label having an OVD function that exhibits an optical effect and having an RFID tag function capable of receiving and / or transmitting data to / from an external device without contact.

  In managing merchandise at retail stores and rental stores, RFID tags equipped with RFID IC chips and antennas are used. RFID is an abbreviation for Radio Frequency IDentification, and is a general term for a system that enables non-contact transmission and reception of data unique to an RFID IC chip using high frequency. ID information, which is unique information for distinguishing each RFID tag, is written on the IC chip incorporated in the RFID tag. In some cases, the IC chip has a general-purpose memory area different from the memory area containing the ID information, and can read and write information related to products. The reading of IC chip ID information and the reading and writing of information in the general-purpose memory area are performed by a short-distance wireless communication using an electromagnetic field, radio waves, or the like by a dedicated data read / write device (hereinafter referred to as RW (RW = Reader Writer). Can be performed in a non-contact manner.

  For example, by attaching the RFID tag to a product and reading the ID information by RW, the RW can be combined with a computer system and applied to goods in / out management, inventory management, rental management, and the like. Furthermore, if information related to the product such as the product code, the arrival date and the person in charge is written in the general-purpose memory area by RW, the information is read by RW connected to another computer system. Can be transmitted between computer systems.

  Hereinafter, an RFID tag that can be used as a label by incorporating an adhesive layer or the like into the RFID tag and affixing it to a product or the like is referred to as an RFID label.

  With the spread of the RFID tag, it is expected that an OVD integrated RFID tag in which an OVD (Optical Variable Device) function is added to the RFID tag will be put to practical use.

  OVD is a general term for means capable of expressing an optical effect such as a color change or an image change depending on a viewing angle or a measurement angle. In order to express this optical effect, the OVD is capable of expressing a stereoscopic image or a special decorative image using light interference such as a hologram, a layer made of a diffraction grating, In many cases, a multilayer thin film structure is formed by appropriately selecting and combining thin film layers having different optical characteristics.

  Since this OVD can give unique effects such as stereoscopic images and color changes, it can exhibit excellent decorative effects and is used in general printed materials such as various packaging materials, picture books and catalogs. Furthermore, since OVD requires advanced manufacturing technology, it is applied to credit cards, securities, certificates, etc. as a means for preventing forgery.

  It is also possible to record product information encoded as optical information that can be read by an optical reading device in the OVD. Thereby, for example, OVD can be used as a more advanced anti-counterfeit medium.

  By integrating the OVD having the above characteristics with the RFID tag, the following advantages are assumed.

  For example, until now, when RFID tags and OVD were separately attached to products etc., it is possible to integrate RFID tags and OVD and attach them to products etc. collectively, reducing overall costs. Can do.

  In addition, OVD usually uses a metal thin film as a material for its functional thin film layer. However, since the metal thin film is conductive, the metal thin film can be used as an RFID tag antenna by considering the design. Can also be used. Therefore, compared with the case where each function is expressed individually, the cost of material cost can be further reduced in consideration of functions such as decoration.

  Furthermore, the OVD can be designed in various ways, and when the OVD and the RFID tag are integrated, the RFID tag can have a design property, a high-class feeling, a forgery prevention function, and the like by the OVD. .

  As an example of the forgery prevention function, for example, by integrating the OVD and the RFID tag, the authenticity determination of the RFID tag using either the information by the RW of the RFID tag or the information from optical reading including visual observation is performed. It becomes possible. Therefore, even when there is no RFID RW, the authenticity of the RFID tag can be determined by optical reading means such as visual inspection. That is, when it is difficult to read information using a high frequency for some reason, it can be read by an optical reading means. Therefore, the market application range of RFID tag authenticity determination can be expanded at low cost.

Further, when used as a more advanced anti-counterfeit medium, product information encoded as optical information is recorded in the OVD, the optical information is read by an optical reader, and the IC for RFID read by RW It can be compared with the product information of the chip. Thus, for example, it is possible to perform authenticity determination when either OVD or the IC chip is forged (Patent Document 1).
Thus, since it has various merits, an OVD-integrated RFID label has been devised by combining OVD with an RFID tag, and further combining as an RFID antenna using the conductivity of a metal thin film of OVD. Yes.
However, the conventional OVD-integrated RFID label structure has a problem that the IC chip and lead wiring layer for RFID can be seen from the gap of the OVD, and the decorativeness and design characteristic of OVD are impaired. It was. On the other hand, in order to hide the IC chip and the lead wiring layer, many restrictions are imposed on the OVD design, and when the OVD has functions such as recording of optical information. In addition, there is a problem that the function is limited due to the restriction of the design.

In addition, with the conventional OVD integrated RFID label, since the OVD integrated RFID label already attached to the product can be removed from the adherend and reused, so-called “reuse” is possible. There has been a major problem in preventing forgery that the RFID label integrated with the OVD peeled off from a genuine product can be diverted to a forged product (Patent Document 2).
JP 2004-227435 A Japanese Patent No. 3854124

This invention is made | formed in view of the above situation, and the subject of this invention is OVD and RFI.
In the integration of the D label, there is no limitation on the effect of improving decorativeness and design by the optical effect of OVD and the function of recording optical information, etc. An object of the present invention is to provide an RFID label that cannot be reused even if it is peeled off from an adherend while maintaining its advantages.

The invention according to claim 1 for solving the above-described problem is an RFID label that transmits and receives data to and from an external device in a non-contact manner, and at least an OVD layer is disposed on a label substrate, and then RFID In an RFID label comprising an IC chip for use and a lead wiring layer electrically connected to the IC chip, and an adhesive layer for attaching the RFID label to an adherend, the OVD layer comprises: The IC chip having a function of exhibiting an optical effect and conductivity, and a concealing layer disposed on the OVD layer and / or on a label substrate without the OVD layer, And the lead wiring layer are disposed on the concealing layer, and the RFID label is disposed between the OVD layer and the adhesive layer when the RFID label is peeled off from the adherend. Shape Any layers that are, or a RFID label, wherein the produced peeling in the layer.
The invention according to claim 2 for solving the above problem is the RFID label according to claim 1, wherein the optical effect according to claim 1 is manifested in a visible light region.

  The invention according to claim 3 for solving the above problem is the RFID label according to claim 1 or 2, wherein the OVD layer and the lead wiring layer are electrically connected. .

  The invention according to claim 4 for solving the above problem is that the adhesion strength between any of the layers formed between the OVD layer and the adhesive layer is the adhesion strength between the adhesive layer and the adherend. The RFID label according to any one of claims 1 to 3, wherein the RFID label is weaker.

  The invention according to claim 5 for solving the above problem is the RFID label according to any one of claims 1 to 4, wherein the concealing layer has a peeling function.

  The invention according to claim 6 for solving the above-mentioned problem is characterized in that a release layer is provided between the OVD layer and the concealing layer and / or on the label substrate without the OVD layer. It is an RFID label as described in any one of Claims 1-5.

  The invention according to claim 7 for solving the above-described problem is that a peeling layer is provided between the concealing layer and the lead wiring layer and / or between the concealing layer without the lead wiring layer and the adhesive layer. The RFID label according to claim 1, wherein the RFID label is provided.

  The invention according to claim 8 for solving the above-described problem is that a release layer is provided between the lead wiring layer and the adhesive layer and / or between the concealing layer without the lead wiring layer and the adhesive layer. The RFID label according to claim 1, wherein the RFID label is provided.

  The invention according to claim 9 for solving the above-described problem is that a part of the release layer is formed in a pattern between the label substrate and the adhesive layer in a plane defined by the label substrate. The RFID label according to any one of claims 6 to 8, wherein the RFID label is arranged in a mechanical manner.

By providing a concealing layer between the OVD layer and the lead wiring layer using the RFID label according to the present invention, it is possible to remove the RFI from the OVD gap of the conventional OVD integrated RFID label.
The problem that the decorativeness and designability are impaired by the appearance of the D IC chip and the lead wiring layer is solved. In addition, there is no design restriction necessary to hide the IC chip and the lead wiring layer, and the decorativeness and design can be further improved. As a result, there is no restriction on the function of recording optical information on the OVD due to design restrictions.
With the RFID label according to the present invention, the OVD layer and the lead wiring layer are electrically connected in at least an alternating high frequency region, so that the OVD layer can function as an antenna for the RFID label.
With the RFID label according to the present invention, when the RFID label is peeled off from the adherend, peeling occurs between the OVD layer and the concealing layer, so that the RFID label is destroyed and cannot be reused. It becomes prevention. Further, since the function of the antenna is lost, it is possible to make it impossible to take out information on the RFID label.

  Hereinafter, an example of an embodiment of an RFID label according to the present invention will be described based on FIGS. 1, 2, 3, 4, 5, and 6. However, the present invention is not limited to this. is not.

  FIG. 1 is an example of a cross-sectional view of an RFID label according to the present invention. This is a cross-sectional view of a portion corresponding to the position A-A ′ shown in FIG. 2. FIG. 2 is a plan view when viewed from the direction of the adhesive layer without the release sheet 8 shown in FIG. However, the OVD layer 2 is not actually visible due to the concealment layer 9, but for the sake of illustration, the design of the OVD layer 2 is shown transparently in FIG.

  FIG. 1 shows an example of a cross-sectional view of an RFID label 1 according to the present invention. The OVD layer 2 is partially disposed on the label substrate 6, and the concealing layer 9 is disposed on the entire surface thereof. Further, the lead wiring layer 3 is partially disposed thereon, and the IC chip 4 is disposed on the lead wiring layer 3. Here, the lead wiring layer 3 is bonded to the electrode portion of the IC chip 4. The adhesive layer 7 is disposed on the layer having such a configuration. Further, a release sheet layer 8 is disposed. FIG. 1 shows a state where the release sheet layer is peeled off.

  The concealing layer 9 is an electrically insulating material, and the OVD layer 2 and the lead wiring layer 3 are galvanically insulated by the concealing layer 9 disposed therebetween, but the high frequency alternating current The signal is electrically coupled by capacitive coupling. The frequency characteristic is defined by the thickness and dielectric constant of the concealing layer 9 and the overlap between the lead wiring layer 3 and the conductive portion of the OVD layer 2. Thus, by arranging the conductive layer such as the metal material of the OVD layer 2 and the lead wiring layer 3 so as to overlap, the pattern formation design of the conductive portion of the OVD layer 2 can be appropriately performed. The OVD layer 2 can be used as an antenna for an RFID label.

Further, in FIG. 1, the concealment layer 9 corresponding to a portion where the OVD layer 2 and the lead wiring layer 3 overlap each other is formed as a design so that the OVD layer 2 and the lead wiring layer 3 can be in direct contact with each other. It is good also as such a structure. When there is a release layer 10 as shown in FIG. 3A, the release layer 10 and the concealing layer 9 are patterned in a design that does not overlap the portion where the OVD layer 2 and the lead wiring layer 3 overlap. The OVD layer 2 and the lead wiring layer 3 may be formed to be in direct contact with each other.
As described above, the conductive portion of the OVD layer 2 is designed to function as an RFID antenna by patterning, and combined with the butterfly-shaped design shown in FIG. It is also possible to achieve both improvement in design and decoration.

  The wiring pattern of the lead wiring layer may be designed and arranged as necessary corresponding to the terminals of the IC chip.

  The IC chip 4 and a part of the lead wiring layer 3 usually need to be provided so as not to overlap the OVD layer 2 so as not to deteriorate the communication function. Therefore, when directly provided on the OVD layer, which is a transparent substrate, the IC chip 4 and the lead wiring layer 3 are visible, which greatly affects the design. However, according to the present invention, the surface of the OVD layer is affected. By providing the concealing layer 9, the IC chip 4 and the lead wiring layer 3 can be concealed, so that the designability as OVD can be maintained. The concealing layer 9 can be made inconspicuous according to the color of the adherend, but may be made visible as part of the design using various colors and patterns.

The frequency used for communication between the RW and the RFID label is preferably a 2.45 GHz band (2.400 to 2.482 MHz) and / or a 900 MHz band (850 to 950 MHz), but the present invention is not limited to this. .
The OVD layer 2 can be formed, for example, by forming a metal thin film layer such as aluminum or gold on the label substrate 6 by vapor deposition, and processing the metal thin film layer. That is, the metal thin film layer is processed by using a relief type that records interference fringes of light such as holograms and diffraction gratings as a fine concavo-convex pattern on a plane, or a volume type that records interference fringes in the volume direction. It becomes.

  As a method for forming the metal thin film layer, the vapor deposition method, the sputtering method, the electroless plating method, or the like can be used, but the present invention is not limited to this.

Alternatively, the OVD layer 2 may be separately formed and disposed on the label substrate 6 by a transfer method.
In addition, as a method of causing a color change (color shift) depending on the viewing angle, it is also possible to use a multilayer thin film structure by laminating thin films of ceramics or metals having different optical characteristics to form a multilayer thin film. It is not limited.
In particular, from the viewpoint of improving mass productivity and reducing costs, a method using a relief mold and a method of forming a multilayer thin film structure are preferable as processing methods.
As a method of patterning the OVD layer, for example, as described above, first, a metal thin film is formed on the entire surface by vapor deposition or sputtering as described above, and then an acid or alkali resistant resin is applied to the metal. There is a method of obtaining a pattern by etching a metal thin film with an acid or alkali by printing a pattern on the thin film and using it as a positive resist. As a method for forming the pattern, a known technique for partially forming a metal thin film can be used as appropriate, but the present invention is not limited to this.

  When the concealing layer 9 is provided, since the total thickness of the label becomes thick, the strength increases and the handling becomes easy. Therefore, it is easy to “recycle” the label by removing it from the adherend. However, according to the present invention, the problem can be solved by providing a function of peeling between any of the layers formed between the OVD layer 2 and the adhesive layer 7. That is, it is realized by making the adhesion strength between any layers formed between the OVD layer 2 and the adhesive layer 7 smaller than the adhesion strength between the adherend 11 and the adhesive layer 7. Can do.

  For example, in FIG. 1, the masking layer 9 may be provided with a peeling function by forming the masking layer 9 using a material having low adhesion to each layer.

  Furthermore, as shown in FIGS. 3, 4, 5, and 6, the release layer 10 may be formed using a material having low adhesion between the OVD layer 2 and the adhesive layer 7.

For example, as shown in FIGS. 3A and 3B, the release layer 10 is interposed between the OVD layer 2 and the concealing layer 9.
It is good also as a method of providing. At this time, the release layer 10 may be formed on the label substrate 6 in a portion where the OVD layer 2 is not present.

  Further, as shown in FIGS. 4A and 4B, a peeling layer 10 may be provided between the lead wiring layer 3 and the concealing layer 9. At this time, the peeling layer 10 may be formed between the adhesive layer 7 and the concealing layer 9 in a portion where the lead wiring layer 3 is not present.

  Further, as shown in FIGS. 5A and 5B, the peeling layer 10 may be provided between the adhesive layer 7 and the concealing layer 9 without being disposed below or on the lead wiring layer 3. .

  Further, as shown in FIGS. 6A and 6B, the release layer 10 may be provided on the lead wiring layer 3. At this time, the peeling layer 10 may be formed between the adhesive layer 7 and the concealing layer 9 in a portion where the lead wiring layer 3 is not present.

  In the layer configuration shown in FIG. 1, as a method for reducing the adhesion between the concealment layer 9 and the OVD layer 2, a component for reducing the adhesion strength such as silicon particles is mixed with the material forming the concealment layer 9. The OVD layer 2 formed on the label substrate 6 can be applied by printing or the like, but the present invention is not limited to this.

  As a layer structure shown in FIGS. 3, 4, 5, and 6, as a forming method in the case where the release layer 10 is provided between any layers formed between the label substrate 6 and the adhesive layer 7, For example, a silicon polymerization acrylic resin or the like can be provided by applying a printing method or the like, but the present invention is not limited to this.

  The concealing layer 9 and the release layer 10 shown in FIGS. 3, 4, 5, and 6 are applied by a printing method such as screen printing, flexographic printing, gravure printing, offset printing, etc. However, the present invention is not limited to this.

  In order to prevent the counterfeiting so-called “reuse” caused by unauthorized reuse of the RFID label, the adhesive strength between the concealing layer 9 and the release layer 10 in the RFID label according to the present invention is the same as the adhesive layer 7 shown in FIG. It is desirable to make it smaller than the adhesion strength between the adherend 11. At this time, the release layer 10 can be disposed on the entire surface or partially in a pattern.

  In this case, for example, as shown in FIG. 3B, it is more preferable to partially dispose the release layer 10 in a pattern than to provide the entire surface. This is because by disposing the release layer 10 in a pattern, a difference in peel strength can be achieved in the plane, and therefore the lead wiring layer 3 and / or the OVD layer 2 can be expected to break. In this case, in particular, it is provided around the IC chip 4 and the lead wiring layer 3 so that when the RFID label is peeled off after being attached to the adherend, the communication is steadily performed without being broken when the RFID label is peeled off from the release sheet. The function can be disabled. Furthermore, the RFID label can be more reliably broken by cutting the entire label layer or a part of the layer with a laser or the like to provide a cut. At this time, if a cut is provided at the boundary between the portion where the release layer 10 is present and the portion where the release layer 10 is absent, a higher effect can be obtained.

  As shown in FIGS. 1 and 2, the lead wiring layer 3 is provided so as to partially overlap the OVD layer 2. As a method of forming the lead wiring layer 3, a method of forming a conductive paste by applying it in a pattern by printing or the like can be used. The conductive material of the conductive paste is preferably silver. Examples include a silver paste containing a resin as a binder, a solvent, and fine silver particles.

  The silver paste can be printed and patterned by a printing method such as screen printing, flexographic printing, gravure printing, or offset printing. Then, a coating film is formed by heating and evaporating the solvent. The contact between the silver particles contained in the coating film serves as a conductor. Thus, the lead wiring layer can be formed, but the present invention is not limited to this.

  Further, conductive ink may be printed by an ink jet printer. Thereby, the thickness of the lead wiring layer 3 can be formed thinly and uniformly, and the lead wiring layer 3 can be more easily broken. Furthermore, the thickness of the entire RFID label can be made thinner and smoother.

Further, as a method of forming the lead wiring layer 3, a metal foil such as aluminum may be used. In this case, an adhesive layer for adhering the metal foil is provided between the concealing layer 9 and the lead wiring layer 3, but a notch may be provided in order to make the metal foil easy to cut.
The lead wiring layer 3 is connected to the connection terminal of the IC chip 4. The joint portion may be anisotropic conductive material such as ACP (Anisotropic Conductive Paste) or ACF (Anisotropic Conductive Film), NCP (Non-Conductive Paste) or NCF (NCF). A material for bonding such as a non-conductive film can be appropriately selected. Moreover, you may join directly by an ultrasonic wave etc.
Thus, as shown in FIG. 1 and FIG. 3A, by providing the concealing layer 9 between the OVD layer 2 and the lead wiring layer 3, the IC chip and the lead wiring layer 9 can be concealed. The design range of the OVD layer can be expanded. Further, when the RFID label 1 attached to the adherend is peeled off, the OVD layer, the IC chip, and the lead wiring layer are separated, so that information reading from the IC chip 4 cannot be performed normally, and the RFID It is possible to leave a history of trying to destroy or peel off the label 1. At this time, it is impossible to reapply the peeled OVD layer and reproduce the original state, and it is also difficult to cleanly remove the IC chip and lead wiring layer remaining on the adherend. Cannot be reused.

  The label substrate 6 is not particularly limited as long as it is an insulating material. For example, PET, PVC, ABS, paper or the like can be used, but the present invention is not limited to this.

  Further, a second release layer may be provided between the label substrate 6 and the OVD layer 2 so that the RFID label 1 is peeled off from the OVD layer 2 when the RFID label 1 is peeled off from the adherend.

Examples of the material for the adhesive layer 7 include acrylic thermal adhesives, hot melt resins (for example, polyamide, urethane, EVA, etc.), adhesives, and the like, but the present invention is limited to this. Do not mean.
Further, a release sheet 8 that can be easily peeled is temporarily adhered to the surface of the adhesive layer 7. As the release sheet, a separator in which a release agent layer such as silicone resin is laminated on a paper or plastic sheet by coating or the like can be used.

  Next, specific examples of the present invention will be described.

<Example 1>
(Production of hologram label substrate)
As a label substrate for a hologram that is OVD, a hologram forming layer is applied to a PET film having a thickness of 50 μm with a urethane-based resin using a gravure coating method, and then 80 nm using a vacuum deposition method. After forming the aluminum reflective layer, a hologram image was formed by embossing to produce a hologram deposition sheet. The hologram deposition sheet was patterned into a butterfly shape using an alkali etching method to form an OVD layer on the label substrate.

(Formation of concealment layer)
A paste was prepared by mixing silicon particles in the same color ink as the adherend. This was applied on the entire surface of the hologram substrate as the OVD of the label substrate by screen printing and dried to provide a concealing layer.

(RFID tag formation)
A silver paste in which silver powder is dispersed in polyester resin is printed by screen printing (350 mesh) on the concealing layer side of the label substrate described above. A lead wiring layer having a thickness of 5 μm was obtained by drying with a machine. Two terminals of a 0.4 mm square IC chip were joined to this lead wiring layer by ACP (anisotropic conductive paste).

Next, polyethylene is laminated on one side of the kraft paper, and an acrylic adhesive is applied to a release sheet (thickness: 112 μm) that has been treated with silicon, and this is transferred to the RFID label substrate. An adhesive layer was provided to prepare an RFID label A with an optical function.
The obtained RFID label A could be read by an IC reader / writer device.

<Example 2>
(Formation of release layer)
An RFID label B with an optical function was produced in the same manner as in Example 1. However, a release layer was formed under the shielding layer.

  That is, first, a silicon polymerization type acrylic resin (manufactured by Toa Gosei Co., Ltd.) was pattern printed on the hologram surface side of the label substrate. At this time, the release layer was printed together so as to overlap the portion where the IC chip and the lead wiring layer were provided. On this, a concealing layer was printed with the same color ink as the adherend.

  Below, the comparative example of this invention is demonstrated.

<Comparative example>
An aluminum thin film antenna was formed on a 38 μm thick PET film by etching, and an IC chip for RFID was mounted to obtain an RFID inlet. A transparent RFID label C was prepared by providing a hologram layer on a PET film substrate, laminating an RFID inlet thereon, and further providing an adhesive layer.

  The RFID labels A, B, and C produced in this way were attached to a box containing a product as shown in FIG. Thereafter, the label was carefully removed from the adherend.

  In the RFID labels A and B of Examples 1 and 2, the IC chip and the lead wiring layer could not be seen due to the concealing layer, and the label had high design properties. Further, when peeled off from the adherend, the hologram label substrate, the IC chip, and the lead wiring layer were separated, and the function of reading and writing information in a non-contact manner as an RFID label could be completely disabled. In particular, in the case of the RFID label B, it was separated into a pattern including the IC chip part, and it was possible to leave a trace that was clearly peeled off.

On the other hand, in the RFID label C of the comparative example for comparison, the IC chip and the lead wiring layer became completely visible from the surface, and the design was inferior. In addition, when the label is carefully peeled off from the adherend, the label substrate is peeled off cleanly, and the RFID inlet can also be separated, so that it can be easily reused and can be reused. Was confirmed.

It is a section explanatory view showing one composition of an RFID label with an optical function of the present invention. It is a plane explanatory view for explaining one composition of the RFID label with an optical function of the present invention. However, the case where a concealing layer is transparent is shown. It is (a) cross-sectional explanatory drawing and (b) plane explanatory drawing which show the other structure of the RFID label with an optical function of this invention. It is (a) cross-sectional explanatory drawing and (b) plane explanatory drawing which show the other structure of the RFID label with an optical function of this invention. It is (a) cross-sectional explanatory drawing and (b) plane explanatory drawing which show the other structure of the RFID label with an optical function of this invention. It is (a) cross-sectional explanatory drawing and (b) plane explanatory drawing which show the other structure of the RFID label with an optical function of this invention. It is a figure which shows the state which affixed the RFID label with an optical function of this invention on the goods box.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 RFID label with an optical function 2 OVD layer 3 Lead wiring layer 4 IC chip 6 Label base material 7 Adhesive layer 8 Release sheet 9 Hiding layer 10 Release layer 11 Adhering body

Claims (9)

An RFID label that transmits and receives data to and from an external device in a non-contact manner, and at least an OVD layer is disposed on a label substrate, and then an RFID IC chip and leads that are electrically connected to the IC chip In an RFID label in which a wiring layer is disposed and an adhesive layer for adhering the RFID label to an adherend is disposed, the OVD layer has a function of exhibiting an optical effect and has conductivity. In addition, a concealing layer is disposed on the OVD layer and / or a label substrate without the OVD layer, and the IC chip and the lead wiring layer are disposed on the concealing layer. The RFID label is characterized in that when the RFID label is peeled off from the adherend, any layer formed between the OVD layer and the adhesive layer, or peeling in the layer, is performed. Raw RFID labels, wherein a. 2. The RFID label according to claim 1, wherein the optical effect according to claim 1 is manifested in a visible light region. The RFID label according to claim 1 or 2, wherein the OVD layer and the lead wiring layer are electrically connected. The adhesion strength between any layers formed between the OVD layer and the adhesive layer is weaker than the adhesion strength between the adhesive layer and the adherend. The RFID label according to one item. The RFID label according to claim 1, wherein the shielding layer has a peeling function. The RFID label according to any one of claims 1 to 5, wherein a release layer is provided between the OVD layer and the concealing layer and / or on the label substrate without the OVD layer. 6. A release layer is provided between the concealing layer and the lead wiring layer and / or between the concealing layer without the lead wiring layer and the adhesive layer. RFID label according to 1. 6. A release layer is provided between the lead wiring layer and the adhesive layer and / or between the concealing layer without the lead wiring layer and the adhesive layer. RFID label according to 1.   The surface of the release layer is defined by a label substrate, and is partially arranged in a pattern between any of the label substrate and the adhesive layer. The RFID label according to any one of the above.