JP2003150924A - Non-contact ic label - Google Patents
Non-contact ic labelInfo
- Publication number
- JP2003150924A JP2003150924A JP2001343254A JP2001343254A JP2003150924A JP 2003150924 A JP2003150924 A JP 2003150924A JP 2001343254 A JP2001343254 A JP 2001343254A JP 2001343254 A JP2001343254 A JP 2001343254A JP 2003150924 A JP2003150924 A JP 2003150924A
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- label
- contact type
- adherend
- antenna circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims abstract description 46
- 238000003860 storage Methods 0.000 claims abstract description 4
- 239000000853 adhesive Substances 0.000 claims description 35
- 230000001070 adhesive effect Effects 0.000 claims description 35
- 239000000463 material Substances 0.000 claims description 18
- 239000012790 adhesive layer Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 8
- 239000010409 thin film Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 6
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims description 5
- 238000007740 vapor deposition Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000004820 Pressure-sensitive adhesive Substances 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 9
- 230000006870 function Effects 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 229910000737 Duralumin Inorganic materials 0.000 description 1
- 102000002322 Egg Proteins Human genes 0.000 description 1
- 108010000912 Egg Proteins Proteins 0.000 description 1
- 101000983338 Solanum commersonii Osmotin-like protein OSML15 Proteins 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 210000003278 egg shell Anatomy 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
- G06K19/07309—Means for preventing undesired reading or writing from or onto record carriers
- G06K19/07372—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit
- G06K19/07381—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit with deactivation or otherwise incapacitation of at least a part of the circuit upon detected tampering
- G06K19/0739—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit with deactivation or otherwise incapacitation of at least a part of the circuit upon detected tampering the incapacitated circuit being part of an antenna
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Security & Cryptography (AREA)
- General Engineering & Computer Science (AREA)
- Burglar Alarm Systems (AREA)
- Credit Cards Or The Like (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は非接触式ＩＣラベル
に関するものである。TECHNICAL FIELD The present invention relates to a non-contact type IC label.
【０００２】[0002]
【従来の技術】近年、非接触式ＩＣカードや非接触式Ｉ
Ｃタグを用いたシステムが普及する中、直接物品に貼り
つけられる非接触式ＩＣラベルの用途が、物流、物品管
理等の分野で拡大してきている。更に、ＩＣを搭載して
いることによる高いセキュリティ性から、重要機器等の
偽造防止等に用いられる封印ラベル等への利用も提案さ
れている。一方、非接触式ＩＣラベルは物品に貼付する
作業が容易であるが、物品に貼付されている状態からの
剥離も簡単なので、使用済みラベルの不正な再使用の危
険性や、封印ラベルとして利用する際も一旦剥がし、再
度貼りつけることによる偽造の危険性がある。従って、
前記のような剥離の容易性を悪用した不正使用を防止す
ることのできる非接触式ＩＣラベルが望まれている。2. Description of the Related Art In recent years, non-contact IC cards and non-contact I
With the spread of systems using C-tags, the applications of non-contact type IC labels that are directly attached to articles have been expanding in fields such as physical distribution and article management. Further, because of the high security provided by mounting the IC, it has been proposed to use it for a sealing label or the like used for preventing forgery of important equipment or the like. On the other hand, the non-contact type IC label is easy to attach to the product, but it is easy to peel it from the state where it is attached to the product, so there is a risk of unauthorized reuse of used labels and it is used as a seal label. When doing so, there is a risk of forgery by peeling it off once and then reattaching it. Therefore,
There is a demand for a non-contact type IC label that can prevent unauthorized use by taking advantage of the ease of peeling as described above.
【０００３】前記のような不正使用を防止する有効な手
段の１つは、被着体に貼付されている状態の非接触式Ｉ
Ｃラベルを被着体から剥離すると、その剥離動作によっ
て非接触式ＩＣラベルとしての機能も同時に破壊される
構造をもたせることである。こうした構造として、特開
２０００−１０５８０６号公報には、図６に示されるよ
うに、回路層１に金属薄膜をエッチングしてアンテナ回
路２を形成する前に予め回路層の表面の所定の領域にシ
リコーン樹脂等の剥離剤を塗布するなどして易破壊処理
された領域１１を設けておき、粘着剤５で被着体に貼付
されている状態のＩＣ３を有する非接触式ＩＣラベルを
被着体から剥離しようとする際にアンテナ回路２が損傷
を受け、再度貼付しても使用できなようにした非接触デ
ータキャリアが示されている。しかしながら通常のエッ
チング工法にてアンテナ回路等のパターンを形成する場
合、予め回路層と金属薄膜を接着剤にて一様に貼り合せ
た基材を用いるため、アンテナ回路の所定の領域に易破
壊処理された領域を形成しておくことは製造上、困難で
ある。One of the effective means for preventing the illegal use as described above is a non-contact type I attached to an adherend.
When the C label is peeled off from the adherend, the peeling operation also has a structure in which the function as the non-contact type IC label is destroyed at the same time. As such a structure, in Japanese Patent Laid-Open No. 2000-105806, as shown in FIG. 6, before a metal thin film is etched in the circuit layer 1 to form the antenna circuit 2, a predetermined region on the surface of the circuit layer is previously formed. The non-contact type IC label having the IC 3 in a state in which the region 11 that has been easily destructed by applying a release agent such as a silicone resin is provided and the IC 3 is attached to the adherend with the adhesive 5 is adhered. There is shown a non-contact data carrier in which the antenna circuit 2 is damaged when it is peeled from the antenna circuit and cannot be used even if it is re-attached. However, when forming a pattern for an antenna circuit, etc. by a normal etching method, a base material in which a circuit layer and a metal thin film are evenly bonded in advance with an adhesive is used, so that a predetermined area of the antenna circuit is easily destroyed. It is difficult in manufacturing to form the formed region.
【０００４】[0004]
【発明が解決しようとする課題】本発明は、製造が容易
な、被着体から剥離すると非接触式ＩＣラベルとしての
機能も同時に破壊される構造をもつ非接触式ＩＣラベル
を提供することを目的とする。SUMMARY OF THE INVENTION It is an object of the present invention to provide a non-contact type IC label which is easy to manufacture and has a structure in which the function as a non-contact type IC label is destroyed at the same time when peeled from an adherend. To aim.
【０００５】（１）アンテナ回路が形成された回路層
と、記憶素子を含む電子部品と、前記アンテナ回路と前
記電子部品を電気的に接続する接続部材と、これらを被
着体に貼り付けるために前記アンテナ回路と前記電子部
品を被覆して形成された粘着剤層と、前記被着体と反対
側の前記回路層に形成された被覆部材とから構成される
非接触式ＩＣラベルにおいて、ＩＣラベルを貼付した被
着体から剥がす際に、前記アンテナ回路と前記電子部品
間の電気的接続が破断するようにしたことを特徴とする
非接触式ＩＣラベル。(1) A circuit layer on which an antenna circuit is formed, an electronic component including a memory element, a connecting member for electrically connecting the antenna circuit and the electronic component, and affixing these to an adherend A non-contact type IC label comprising an adhesive layer formed by covering the antenna circuit and the electronic component, and a covering member formed on the circuit layer on the side opposite to the adherend. A non-contact type IC label characterized in that the electrical connection between the antenna circuit and the electronic component is broken when the label is peeled off from the adherend.
【０００６】（２）前記アンテナ回路が断線されたパタ
ーンを有し、前記断線されたパターンを接続するジャン
パー回路が設けられており、ＩＣラベルを貼付した被着
体から剥がす際に、ジャンパー回路と被着体の粘着力に
よりジャンパー回路が破断するようになした（２）に記
載の非接触式ＩＣラベル。(2) The antenna circuit has a disconnection pattern, and a jumper circuit for connecting the disconnection pattern is provided. When the antenna circuit is peeled off from the adherend, the jumper circuit and The non-contact type IC label according to (2), wherein the jumper circuit is broken by the adhesive force of the adherend.
【０００７】（３）アンテナ回路が形成された回路層
と、記憶素子を含む電子部品と、前記アンテナ回路と前
記電子部品を電気的に接続する接続部材と、これらを被
着体に貼り付けるために前記アンテナ回路と前記電子部
品を被覆して形成された粘着剤層と、前記被着体と反対
側の前記回路層に形成された被覆部材とから構成される
非接触式ＩＣラベルにおいて、前記アンテナ回路が断線
されたパターンを有し、前記断線されたパターンを接続
するジャンパー回路が設けられており、ＩＣラベルを貼
付した被着体から剥がす際に、ジャンパー回路と被着体
の粘着力によりアンテナ回路が破断するようになしたこ
とを特徴とする非接触式ＩＣラベル。(3) A circuit layer on which an antenna circuit is formed, an electronic component including a memory element, a connecting member for electrically connecting the antenna circuit and the electronic component, and affixing these to an adherend A non-contact type IC label comprising an adhesive layer formed by covering the antenna circuit and the electronic component, and a covering member formed on the circuit layer opposite to the adherend, The antenna circuit has a broken pattern, and a jumper circuit for connecting the broken pattern is provided. When the antenna circuit is peeled off from the adherend to which the IC label is attached, the adhesive force between the jumper circuit and the adherend causes A non-contact type IC label characterized in that the antenna circuit is broken.
【０００８】（４）前記回路層の前記アンテナ回路の外
側に、回路層の回路基材にスリットを設けた（１）〜
（３）何れかに記載の非接触式ＩＣラベル。(4) A slit is provided in the circuit substrate of the circuit layer outside the antenna circuit of the circuit layer (1) to
(3) The non-contact type IC label according to any one of the above.
【０００９】（５）アンテナ回路が形成された回路層
と、記憶素子を含む電子部品と、前記アンテナ回路と前
記電子部品を電気的に接続する接続部材と、これらを被
着体に貼り付けるために前記アンテナ回路と前記電子部
品を被覆して形成された粘着剤層と、前記被着体と反対
側の前記回路層に形成された被覆部材とから構成される
非接触式ＩＣラベルにおいて、前記回路層の前記アンテ
ナ回路の外側に、回路層の回路基材にスリットを設けた
ことを特徴とする非接触式ＩＣラベル。(5) A circuit layer on which an antenna circuit is formed, an electronic component including a memory element, a connecting member for electrically connecting the antenna circuit and the electronic component, and affixing these to an adherend A non-contact type IC label comprising an adhesive layer formed by covering the antenna circuit and the electronic component, and a covering member formed on the circuit layer opposite to the adherend, A non-contact type IC label characterized in that a slit is provided in a circuit substrate of the circuit layer outside the antenna circuit of the circuit layer.
【００１０】（６）前記接続部材が異導電性接着剤から
なるものである（１）〜（５）何れかに記載の非接触式
ＩＣラベル。(6) The non-contact type IC label according to any one of (1) to (5), wherein the connecting member is made of a different conductive adhesive.
【００１１】（７）前記アンテナ回路が、エッチング又
は蒸着工法により形成された金属薄膜である（１）〜
（６）何れかに記載の非接触式ＩＣラベル。(7) The antenna circuit is a metal thin film formed by an etching or vapor deposition method (1) to
(6) The non-contact type IC label according to any one of the above.
【００１２】（８）前記ジャンパー回路が導電性ペース
トからなるものである（２）、（３）、（４）、（６）
又は（７）に記載の非接触式ＩＣラベル。(8) The jumper circuit is made of a conductive paste (2), (3), (4), (6).
Alternatively, the non-contact type IC label according to (7).
【００１３】（９）前記被覆部材が脆質塩化ビニールシ
ートである（１）〜（８）何れかに記載の非接触式ＩＣ
ラベル。(9) The non-contact type IC according to any one of (1) to (8), wherein the covering member is a brittle vinyl chloride sheet.
label.
【００１４】（１）において、アンテナ回路と電子部品
間の電気的接続が破断するようにするためには、例え
ば、前記接続部剤と前記回路層との接着強度を、前記被
着体と前記粘着剤の粘着強度よりも弱く、且つ、前記粘
着剤と前記電子部品との粘着強度よりも弱くなるように
接続部材、粘着剤、回路の材質、電子部品の材質を選定
する。記憶素子を含む電子部品としてはＩＣが好ましく
用いられる。In (1), in order to break the electrical connection between the antenna circuit and the electronic component, for example, the adhesive strength between the connecting member and the circuit layer is set to the adherend and the adherend. The connection member, the adhesive, the material of the circuit, and the material of the electronic component are selected so as to be weaker than the adhesive strength of the adhesive and weaker than the adhesive strength between the adhesive and the electronic component. An IC is preferably used as an electronic component including a storage element.
【００１５】（２）において、ジャンパー回路と被着体
の粘着力によりジャンパー回路が破断してアンテナ回路
が破断するようにするためには、ジャンパー回路と回路
層との密着強度を、被着体と粘着剤の粘着強度よりも弱
く、且つ、粘着剤とジャンパー回路との粘着強度よりも
弱くなるように、粘着剤、ジャンパー回路の材質、回路
基材の材質を選定する。In (2), in order to break the jumper circuit and the antenna circuit due to the adhesive force between the jumper circuit and the adherend, the adhesion strength between the jumper circuit and the circuit layer should be adjusted. The adhesive, the material of the jumper circuit, and the material of the circuit substrate are selected so that they are weaker than the adhesive strength of the adhesive and weaker than the adhesive strength of the adhesive and the jumper circuit.
【００１６】（５）において、スリットは、アンテナ回
路の外側に部分に、好ましくは外端から設けることが好
ましい。スリットは非接触式ＩＣラベルを作製する前
に、予め、回路基材層に形成しておくことが好ましく、
ＩＣラベルの外周に１カ所〜数十カ所均一に、外周辺に
対して斜めに設けることが好ましい。In (5), it is preferable that the slit is provided in a portion outside the antenna circuit, preferably from the outer end. The slit is preferably formed in the circuit substrate layer in advance before producing the non-contact type IC label,
It is preferable to provide one to several tens of places on the outer periphery of the IC label uniformly and obliquely with respect to the outer periphery.
【００１７】（１）〜（６）において、接続部材として
は好ましくは、異導電性接着剤が用いられるが、好まし
い例としては、Ａｕ／Ｎｉめっきプラスチック粒子やＮ
ｉ粒子の導電粒子をエポキシ樹脂その他からなる常温で
粘性液体からなる接着剤に一定量分散させたもの等が挙
げられる。In (1) to (6), a different conductive adhesive is preferably used as the connecting member. Preferred examples include Au / Ni plated plastic particles and N.
For example, the conductive particles of i particles may be dispersed in a certain amount in an adhesive composed of an epoxy resin or the like and composed of a viscous liquid at room temperature.
【００１８】（１）〜（９）において、回路層の回路基
材としては厚さ２５〜５０μｍのポリエチレンテレフタ
レートフィルムが好ましく用いられる。In (1) to (9), a polyethylene terephthalate film having a thickness of 25 to 50 μm is preferably used as the circuit substrate of the circuit layer.
【００１９】（１）〜（６）において、アンテナ回路
は、エッチングや蒸着工法等により形成された金属薄膜
であることが好ましい。金属薄膜の材質としては、銅又
はアルミニウムが好ましい。In (1) to (6), the antenna circuit is preferably a metal thin film formed by etching or vapor deposition. Copper or aluminum is preferable as the material of the metal thin film.
【００２０】（８）において、ジャンパー回路は導電性
ペーストからなるものが好ましい。導電性ペーストとし
ては導電性銅ペーストや導電性銀ペーストが好ましく用
いられ、スクリーン印刷やディスペンス方式等によりア
ンテナ回路の断線部に短絡端とジャンパー回路がオーバ
ーラップするように形成し、アンテナ回路を導通させる
ことが好ましい。導電性ペーストで形成されたジャンパ
ー回路は非接触式ＩＣラベルを剥がす際にジャンパー回
路が容易に破断し、また、導電性にも優れている。In (8), the jumper circuit is preferably made of a conductive paste. Conductive copper paste or conductive silver paste is preferably used as the conductive paste, and it is formed by screen printing or a dispensing method so that the short-circuit end and the jumper circuit overlap at the disconnection part of the antenna circuit, and the antenna circuit is made conductive. Preferably. The jumper circuit formed of the conductive paste easily breaks when the non-contact type IC label is peeled off, and also has excellent conductivity.
【００２１】（９）において、被覆部材には脆質材料を
用いることが好ましく、表皮材として脆質塩化ビニール
シートを用い、回路層のＩＣ搭載の逆面に接着剤を介し
て貼り付けることにより形成することが好ましい。In (9), it is preferable that a brittle material is used for the covering member, and a brittle vinyl chloride sheet is used as a skin material, and the circuit layer is attached to the reverse side of the IC mounting via an adhesive. It is preferably formed.
【００２２】[0022]
【発明の実施の形態】図１は本発明の非接触式ＩＣラベ
ルの一構成の概略を示す図であって、（ａ）は側面から
見た断面説明図、（ｂ）は平面説明図である。図２は該
非接触式ＩＣラベルの使用方法を示す図であって、
（ａ）は該非接触式ＩＣラベルを貼付した状態を示す側
面から見た断面説明図、（ｂ）は一旦貼付した非接触式
ＩＣラベルを剥離した状態を示す側面から見た断面説明
図である。図１に示すように、本発明の非接触式ＩＣカ
ードは、回路層１の表面にアンテナ回路２が形成され、
前記アンテナ回路２と記憶素子を含む電子部品としての
ＩＣ３が接続部材４を介し接続され、回路層１の片面に
接着剤６を介し表皮材７が配備され、ＩＣ３が搭載され
た面に粘着剤層５が設けられた構造を有している。回路
層１としては、アンテナ回路２を形成できるものであれ
ば特に制限されるもではないが、例えば、ポリエチレン
テレフタレートのフィルム等など用いることができる。
アンテナ回路２には、銅やアルミニウム等の金属薄膜が
用いられる。また、接続部材４には、異方導電性接着剤
を用いることが望ましく、回路層１との接着強度は、前
記ＩＣ３と前記粘着剤層５の粘着強度よりも弱く、更
に、被着体と前記粘着剤層５の粘着強度よりも弱くして
おく。該非接触式ＩＣラベルは、図２（ａ）に示すよう
に被着体８に貼付される。この後、該非接触式ＩＣラベ
ルを被着体８から剥がそうとした場合には、図２（ｂ）
に示すようにＩＣ３と接続部材４が回路層１から剥離し
被着体８にとられ、前記アンテナ回路２と前記ＩＣ３
（電子部品間）の電気的接続は破断し、非接触式ＩＣラ
ベルとしての機能が破壊される。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a schematic view showing the structure of a non-contact type IC label of the present invention, in which (a) is a cross-sectional explanatory view as seen from a side and (b) is a plan explanatory view. is there. FIG. 2 is a diagram showing a method of using the non-contact type IC label,
(A) is a cross-sectional explanatory view seen from the side showing a state where the non-contact type IC label is stuck, and (b) is a cross-sectional explanatory view seen from the side showing a state where the non-contact type IC label once stuck is peeled off. . As shown in FIG. 1, in the non-contact type IC card of the present invention, an antenna circuit 2 is formed on the surface of a circuit layer 1,
The antenna circuit 2 and an IC 3 as an electronic component including a memory element are connected via a connecting member 4, a skin material 7 is provided on one surface of the circuit layer 1 via an adhesive 6, and an adhesive is applied on the surface on which the IC 3 is mounted. It has a structure in which a layer 5 is provided. The circuit layer 1 is not particularly limited as long as it can form the antenna circuit 2, but, for example, a polyethylene terephthalate film or the like can be used.
A metal thin film such as copper or aluminum is used for the antenna circuit 2. Further, it is desirable to use an anisotropic conductive adhesive for the connecting member 4, and the adhesive strength with the circuit layer 1 is weaker than the adhesive strength between the IC 3 and the adhesive layer 5, and further, with the adherend. It is set to be weaker than the adhesive strength of the adhesive layer 5. The non-contact type IC label is attached to the adherend 8 as shown in FIG. After that, when the non-contact type IC label is to be peeled off from the adherend 8, as shown in FIG.
As shown in FIG. 3, the IC 3 and the connecting member 4 are separated from the circuit layer 1 and taken by the adherend 8, and the antenna circuit 2 and the IC 3
The electrical connection (between the electronic components) is broken, and the function as the non-contact type IC label is destroyed.
【００２３】図３は本発明の非接触式ＩＣラベルの他の
一構成の概略を示す図であって、（ａ）は側面から見た
断面説明図（Ａ部分は図３（ｂ）のＡ１−Ａ２断面図、
Ｂ部分はＢ１−Ｂ２断面図）、（ｂ）は平面断面説明図
である。図４は該非接触式ＩＣラベルの使用方法を示す
図であって、（ａ）は該非接触式ＩＣラベルを貼付した
状態を示す図、（ｂ）は一旦貼付した非接触式ＩＣラベ
ルを剥離した状態を示す図である。図３に示すように、
図１の構造において前記アンテナ回路２を回路の一カ所
ないし数カ所で断線されたパターンとしておき、前記断
線されたパターンを接続するジャンパー回路９を設け、
前記ジャンパー回路９と前記回路層１との密着強度を、
前記被着体８と前記粘着剤層５の粘着強度よりも弱く、
且つ、前記粘着剤層５と前記ジャンパー回路９との粘着
強度よりも弱くしておく。該非接触式ＩＣラベルは、図
４（ａ）に示すように被着体８に貼付される。この後、
該非接触式ＩＣラベルを被着体８から剥がそうとした場
合には、図４（ｂ）に示すようにＩＣ３と接続部材４が
回路層１から剥離し被着体８にとられると共にジャンパ
ー回路９も回路層１から剥離し被着体８にとられ、ジャ
ンパー回路が破断し、非接触式ＩＣラベルとしての機能
が破壊される。FIG. 3 is a view showing the outline of another structure of the non-contact type IC label of the present invention, in which (a) is a cross-sectional view seen from the side (A part is A1 in FIG. 3 (b)). -A2 sectional view,
B portion is a B1-B2 sectional view), (b) is a plane sectional explanatory view. FIG. 4 is a diagram showing a method of using the non-contact type IC label, (a) shows a state in which the non-contact type IC label is stuck, and (b) shows the non-contact type IC label once stuck. It is a figure which shows a state. As shown in FIG.
In the structure of FIG. 1, the antenna circuit 2 is formed as a pattern of disconnection at one place or several places of the circuit, and a jumper circuit 9 for connecting the disconnected pattern is provided.
The adhesion strength between the jumper circuit 9 and the circuit layer 1 is
Weaker than the adhesive strength of the adherend 8 and the adhesive layer 5,
In addition, the adhesive strength between the adhesive layer 5 and the jumper circuit 9 is made weaker. The non-contact type IC label is attached to the adherend 8 as shown in FIG. After this,
When the non-contact type IC label is to be peeled off from the adherend 8, the IC 3 and the connecting member 4 are peeled off from the circuit layer 1 and taken off by the adherend 8 as shown in FIG. 9 is also peeled off from the circuit layer 1 and taken by the adherend 8, the jumper circuit is broken, and the function as the non-contact type IC label is broken.
【００２４】図５は本発明の非接触式ＩＣラベルの他の
一構成の概略を示す図であり、（ａ）は側面から見た断
面説明図、（ｂ）は平面説明図である。図５に示すよう
に、図３の構造において前記回路層１の前記アンテナ回
路２等の外側にスリット１０を設けた構造を有する。該
非接触式ＩＣラベルを被着体８から剥がそうとした場合
に、スリット１０から回路層１が破断することによって
も非接触式ＩＣラベルとしての機能が破壊される。この
場合、前記表皮材７には、脆質塩化ビニール等の脆質材
料を用いることが望ましい。脆質材料は卵の殻のように
ボロボロはがれる材料であり、非接触式ＩＣラベルをは
がす際に、表皮材が破断し易いため、表皮材と共にＩＣ
ラベルが機能が破壊されないまま剥がされてしまうこと
が防止できる。5A and 5B are views showing the outline of another structure of the non-contact type IC label of the present invention, in which FIG. 5A is a sectional explanatory view seen from the side and FIG. 5B is a plan explanatory view. As shown in FIG. 5, the structure of FIG. 3 has a structure in which a slit 10 is provided outside the antenna circuit 2 of the circuit layer 1. When the non-contact type IC label is to be peeled off from the adherend 8, the function of the non-contact type IC label is also destroyed by the circuit layer 1 breaking through the slit 10. In this case, it is desirable to use a brittle material such as brittle vinyl chloride for the skin material 7. The brittle material is a material that is peeled off like an egg shell, and when the non-contact type IC label is peeled off, the skin material is easily broken, so that the IC together with the skin material is broken.
It is possible to prevent the label from being peeled off without destroying its function.
【００２５】[0025]
【実施例】本発明を実現するための一実施例を次に示す
が、本発明はこれに限定されるものではない。まず、周
囲にスリット（長さ３ｍｍ）を設けた厚さ５０μｍのポ
リエチレンテレフタレート樹脂からなるフィルム状の回
路基材層（幅３０ｍｍ、長さ５０ｍｍ）の上に幅２０ｍ
ｍ、厚さ９μｍのアルミニウム薄膜を接着によりスリッ
トを避けるように形成し、エッチングにより回路が数カ
所で断線されたコイルパターン形状のアンテナ回路を形
成した。次に、アンテナ回路の断線部に導電性銀ペース
トをスクリーン印刷により塗布し乾燥させることにより
ジャンパー回路を形成し、アンテナ回路の断線部の導通
をとり、アンテナ回路層を形成した。ジャンパー回路部
はコイルパターンの端絡端とジャンパー回路部がオーバ
ーラップするようにし、コイルパターン幅３００μｍ、
ギャップ長さ１ｍｍ、ジャンパー回路幅３５０μｍ、ジ
ャンパー回路長さ２ｍｍとした。次に、アンテナ回路の
ＩＣとの接続部に異方導電性接着剤をポッティングし、
その上に厚さ１５０μｍのＩＣを搭載し、熱圧着するこ
とによりアンテナ回路とＩＣを接続した。さらに、回路
層のＩＣ搭載面と逆面に接着剤を介し、厚さ５０μｍの
脆性塩化ビニールシートを貼り付け、ＩＣ搭載面には、
強力な粘着力を有する厚さ１６０μｍの両面粘着テープ
を貼付け非接触式ＩＣラベルを製作した。EXAMPLE An example for realizing the present invention will be shown below, but the present invention is not limited thereto. First, a film-like circuit base material layer (width 30 mm, length 50 mm) made of a polyethylene terephthalate resin having a thickness of 50 μm and provided with slits (length 3 mm) on the periphery has a width of 20 m.
An aluminum thin film having a thickness of 9 μm and a thickness of 9 μm was formed by adhesion so as to avoid the slits, and an antenna circuit having a coil pattern shape in which the circuit was disconnected at several places was formed by etching. Next, a conductive silver paste was applied to the disconnection portion of the antenna circuit by screen printing and dried to form a jumper circuit, and the disconnection portion of the antenna circuit was electrically connected to form an antenna circuit layer. In the jumper circuit part, the end of the coil pattern and the jumper circuit part overlap so that the coil pattern width is 300 μm.
The gap length was 1 mm, the jumper circuit width was 350 μm, and the jumper circuit length was 2 mm. Next, an anisotropic conductive adhesive is potted on the connection portion of the antenna circuit with the IC,
An IC having a thickness of 150 μm was mounted thereon, and the antenna circuit and the IC were connected by thermocompression bonding. Further, a 50 μm thick brittle vinyl chloride sheet is attached to the surface of the circuit layer opposite to the IC mounting surface with an adhesive, and the IC mounting surface is
A 160 μm thick double-sided adhesive tape having a strong adhesive force was attached to produce a non-contact type IC label.
【００２６】このようにして得られた非接触式ＩＣラベ
ルを、制御基板ボックス、ダミーの証券印刷紙、ジュラ
ルミンケース等の被着体に貼付した。その後、この貼付
された非接触式ＩＣラベルを被着体から剥がしたとこ
ろ、ＩＣと接続部材及びジャンパー回路の一部が被着体
に残り、さらに、スリットを起点にアンテナ回路の一部
が切断され、完全に非接触式ＩＣラベルとしての機能が
破壊された。The non-contact type IC label thus obtained was attached to an adherend such as a control board box, a dummy security printing paper, a duralumin case or the like. After that, when the attached non-contact type IC label was peeled off from the adherend, a part of the IC, the connecting member and the jumper circuit remained on the adherend, and further, a part of the antenna circuit was cut from the slit. The function as a non-contact type IC label was completely destroyed.
【００２７】[0027]
【発明の効果】以上説明したように、本発明によって、
被着体に貼付されている状態の非接触式ＩＣラベルを被
着体から剥離すると、その剥離動作によって非接触式Ｉ
Ｃラベルとしての機能も同時に破壊される構造の非接触
式ＩＣラベルを製造上比較的容易に提供することができ
る。As described above, according to the present invention,
When the non-contact type IC label attached to the adherend is peeled from the adherend, the peeling operation causes the non-contact type I label
A non-contact type IC label having a structure in which the function as a C label is destroyed at the same time can be provided relatively easily in manufacturing.
【図面の簡単な説明】[Brief description of drawings]
【図１】本発明の非接触式ＩＣラベルの一構成を示す図
であって、（ａ）は側面から見た断面説明図、（ｂ）は
平面説明図。FIG. 1 is a diagram showing a configuration of a non-contact type IC label of the present invention, in which (a) is a cross-sectional explanatory view seen from a side and (b) is a plan explanatory view.
【図２】図１の非接触式ＩＣラベルの使用方法を示す図
であって、（ａ）は該非接触式ＩＣラベルを貼付した状
態を示す図、（ｂ）は一旦貼付した非接触式ＩＣラベル
を剥離した状態を示す図。2A and 2B are diagrams showing a method of using the non-contact type IC label of FIG. 1, wherein FIG. 2A is a diagram showing a state where the non-contact type IC label is attached, and FIG. 2B is a non-contact type IC label once attached. The figure which shows the state which peeled the label.
【図３】本発明の非接触式ＩＣラベルの他の一構成を示
す図であって、（ａ）は側面断面から見た説明図（Ａ部
分は図３（ｂ）のＡ１−Ａ２断面図、Ｂ部は、Ｂ１−Ｂ
２断面図）、（ｂ）は平面説明図。FIG. 3 is a diagram showing another configuration of the non-contact type IC label of the present invention, in which (a) is an explanatory view seen from a side cross-section (A part is a cross-sectional view taken along line A1-A2 of FIG. 3 (b)). , Part B is B1-B
2 sectional view), (b) is an explanatory plan view.
【図４】図３の非接触式ＩＣラベルの使用方法を示す図
であって、（ａ）は該非接触式ＩＣラベルを貼付した状
態を示す図、（ｂ）は一旦貼付した非接触式ＩＣラベル
を剥離した状態を示す図。FIG. 4 is a diagram showing a method of using the non-contact type IC label of FIG. 3, (a) showing a state in which the non-contact type IC label is attached, and (b) showing a non-contact type IC label once attached. The figure which shows the state which peeled the label.
【図５】本発明の非接触式ＩＣラベルの他の一構成を示
す図であって、（ａ）は側面断面から見た説明図、
（ｂ）は平面説明図。FIG. 5 is a diagram showing another configuration of the non-contact type IC label of the present invention, in which (a) is an explanatory diagram seen from a side cross section;
(B) is a plane explanatory view.
【図６】従来の非接触式ＩＣラベルの一構成例を示す断
面説明図。FIG. 6 is a cross-sectional explanatory view showing a configuration example of a conventional non-contact type IC label.
１ 回路層 ２ アンテナ回路 ３ ＩＣ ４ 接続部材 ５ 粘着剤層 ６ 接着剤 ７ 表皮材 ８ 被着体 ９ ジャンパー回路 １０ スリット １１ 易破壊処理された領域 1 circuit layer 2 antenna circuit 3 IC 4 connection members 5 Adhesive layer 6 adhesive 7 skin material 8 adherend 9 jumper circuit 10 slits 11 Easily destroyed area
───────────────────────────────────────────────────── フロントページの続き (72)発明者 渋谷 正仁 茨城県下館市大字五所宮1150番地 日立化 成工業株式会社五所宮事業所内 (72)発明者 木瀬 喜隆 茨城県下館市大字五所宮1150番地 日立化 成工業株式会社五所宮事業所内 (72)発明者 森村 龍兒 東京都豊島区東池袋３丁目７番４号 株式 会社倉本産業内 (72)発明者 桐本 修一 東京都豊島区東池袋３丁目７番４号 株式 会社倉本産業内 (72)発明者 島田 公仁 東京都豊島区東池袋３丁目７番４号 株式 会社倉本産業内 Ｆターム(参考） 2C005 MA01 MA19 MB10 NA08 NA36 NA41 NA47 NB03 NB10 NB38 PA03 PA15 PA18 PA29 RA06 5B035 AA13 BA05 BB09 CA01 CA08 CA23 5C084 AA03 AA09 BB31 CC34 DD01 EE07 FF02 ─────────────────────────────────────────────────── ─── Continued front page (72) Inventor Masahito Shibuya Hitachi, Shimodate City, Ibaraki Prefecture Seigo Co., Ltd. Goshomiya Works (72) Inventor Yoshitaka Kise Hitachi, Shimodate City, Ibaraki Prefecture Seigo Co., Ltd. Goshomiya Works (72) Inventor Ryuji Morimura 3-7-4 Higashiikebukuro, Toshima-ku, Tokyo Stock Company Kuramoto industry (72) Inventor Shuichi Kirimoto 3-7-4 Higashiikebukuro, Toshima-ku, Tokyo Stock Company Kuramoto industry (72) Inventor Kimito Shimada 3-7-4 Higashiikebukuro, Toshima-ku, Tokyo Stock Company Kuramoto industry F-term (reference) 2C005 MA01 MA19 MB10 NA08 NA36 NA41 NA47 NB03 NB10 NB38 PA03 PA15 PA18 PA29 RA06 5B035 AA13 BA05 BB09 CA01 CA08 CA23 5C084 AA03 AA09 BB31 CC34 DD01 EE07 FF02
Claims (9)
憶素子を含む電子部品と、前記アンテナ回路と前記電子
部品を電気的に接続する接続部材と、これらを被着体に
貼り付けるために前記アンテナ回路と前記電子部品を被
覆して形成された粘着剤層と、前記被着体と反対側の前
記回路層に形成された被覆部材とから構成される非接触
式ＩＣラベルにおいて、ＩＣラベルを貼付した被着体か
ら剥がす際に、前記アンテナ回路と前記電子部品間の電
気的接続が破断するようにしたことを特徴とする非接触
式ＩＣラベル。1. A circuit layer on which an antenna circuit is formed, an electronic component including a storage element, a connecting member for electrically connecting the antenna circuit and the electronic component, and for attaching these to an adherend. A non-contact type IC label comprising an adhesive layer formed by covering the antenna circuit and the electronic component, and a covering member formed on the circuit layer opposite to the adherend, which is an IC label. A non-contact type IC label, characterized in that the electric connection between the antenna circuit and the electronic component is broken when the label is peeled off from the adherend.
を有し、前記断線されたパターンを接続するジャンパー
回路が設けられており、ＩＣラベルを貼付した被着体か
ら剥がす際に、ジャンパー回路と被着体の粘着力により
ジャンパー回路が破断するようになした請求項１に記載
の非接触式ＩＣラベル。2. The antenna circuit has a broken pattern, and a jumper circuit for connecting the broken pattern is provided. When the antenna circuit is peeled off from the adherend, the jumper circuit and the covered circuit are removed. The non-contact type IC label according to claim 1, wherein the jumper circuit is broken by the adhesive force of the adhered body.
憶素子を含む電子部品と、前記アンテナ回路と前記電子
部品を電気的に接続する接続部材と、これらを被着体に
貼り付けるために前記アンテナ回路と前記電子部品を被
覆して形成された粘着剤層と、前記被着体と反対側の前
記回路層に形成された被覆部材とから構成される非接触
式ＩＣラベルにおいて、前記アンテナ回路が断線された
パターンを有し、前記断線されたパターンを接続するジ
ャンパー回路が設けられており、ＩＣラベルを貼付した
被着体から剥がす際に、ジャンパー回路と被着体の粘着
力によりジャンパー回路が破断するようになしたことを
特徴とする非接触式ＩＣラベル。3. A circuit layer on which an antenna circuit is formed, an electronic component including a memory element, a connecting member for electrically connecting the antenna circuit and the electronic component, and for attaching these to an adherend. A non-contact type IC label comprising an adhesive layer formed by covering the antenna circuit and the electronic component, and a covering member formed on the circuit layer on the side opposite to the adherend, wherein the antenna The circuit has a broken pattern, and a jumper circuit for connecting the broken pattern is provided. When the jumper circuit is peeled from the adherend to which the IC label is attached, the jumper circuit and the adherend have an adhesive force. A non-contact type IC label characterized by breaking the circuit.
に、回路層の回路基材にスリットを設けた請求項１〜３
何れかに記載の非接触式ＩＣラベル。4. A slit is provided in a circuit base material of the circuit layer outside the antenna circuit of the circuit layer.
The non-contact type IC label according to any one of the above.
憶素子を含む電子部品と、前記アンテナ回路と前記電子
部品を電気的に接続する接続部材と、これらを被着体に
貼り付けるために前記アンテナ回路と前記電子部品を被
覆して形成された粘着剤層と、前記被着体と反対側の前
記回路層に形成された被覆部材とから構成される非接触
式ＩＣラベルにおいて、前記回路層の前記アンテナ回路
の外側に、回路層の回路基材にスリットを設けたことを
特徴とする非接触式ＩＣラベル。5. A circuit layer on which an antenna circuit is formed, an electronic component including a storage element, a connecting member for electrically connecting the antenna circuit and the electronic component, and for attaching these to an adherend. A non-contact type IC label comprising an adhesive layer formed by covering the antenna circuit and the electronic component, and a covering member formed on the circuit layer on the side opposite to the adherend, wherein the circuit A non-contact type IC label characterized in that a slit is provided in a circuit substrate of a circuit layer outside the antenna circuit of the layer.
ものである請求項１〜５何れかに記載の非接触式ＩＣラ
ベル。6. The non-contact type IC label according to claim 1, wherein the connecting member is made of a different conductive adhesive.
着工法により形成された金属薄膜である請求項１〜６何
れかに記載の非接触式ＩＣラベル。7. The non-contact type IC label according to claim 1, wherein the antenna circuit is a metal thin film formed by an etching or vapor deposition method.
らなるものである請求項２、３、４、６又は７に記載の
非接触式ＩＣラベル。8. The non-contact type IC label according to claim 2, wherein the jumper circuit is made of a conductive paste.
である請求項１〜８何れかに記載の非接触式ＩＣラベ
ル。9. The non-contact type IC label according to claim 1, wherein the covering member is a brittle vinyl chloride sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001343254A JP3854124B2 (en) | 2001-11-08 | 2001-11-08 | Non-contact IC label |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001343254A JP3854124B2 (en) | 2001-11-08 | 2001-11-08 | Non-contact IC label |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003150924A true JP2003150924A (en) | 2003-05-23 |
| JP3854124B2 JP3854124B2 (en) | 2006-12-06 |
Family
ID=19156977
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001343254A Expired - Fee Related JP3854124B2 (en) | 2001-11-08 | 2001-11-08 | Non-contact IC label |
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| Country | Link |
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| JP (1) | JP3854124B2 (en) |
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| WO2005062247A1 (en) * | 2003-12-24 | 2005-07-07 | Singapore Technologies Logistics Pte Ltd | Rfid seal tag |
| JP2005301554A (en) * | 2004-04-09 | 2005-10-27 | Toppan Printing Co Ltd | Non-contact ic medium |
| JP2005309492A (en) * | 2004-04-16 | 2005-11-04 | Matsushita Electric Ind Co Ltd | Radio information medium |
| JP2006039643A (en) * | 2004-07-22 | 2006-02-09 | Dainippon Printing Co Ltd | Non-contact type data carrier having break detection function |
| JP2006048353A (en) * | 2004-08-04 | 2006-02-16 | Sun Corp | Authentication system |
| EP1628244A1 (en) * | 2003-05-26 | 2006-02-22 | Omron Corporation | Information carrier, information recording medium, sensor, commodity management method |
| JP2007025937A (en) * | 2005-07-14 | 2007-02-01 | Toppan Printing Co Ltd | Non-contact ic medium |
| WO2007132897A1 (en) | 2006-05-16 | 2007-11-22 | Toppan Printing Co., Ltd. | Ic label for prevention of forgery |
| JP2008052540A (en) * | 2006-08-25 | 2008-03-06 | Toppan Printing Co Ltd | Non-contact ic medium |
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| JP2010217242A (en) * | 2009-03-13 | 2010-09-30 | Toppan Printing Co Ltd | Non-contact ic label |
| JP2010257416A (en) * | 2009-04-28 | 2010-11-11 | Toppan Printing Co Ltd | Information recording medium, data carrier with non-contact type ic, and method of manufacturing the information recording medium |
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| JP2014142756A (en) * | 2013-01-23 | 2014-08-07 | Toppan Printing Co Ltd | Non-contact ic label and article with non-contact ic label |
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| JP2001013874A (en) * | 1999-06-25 | 2001-01-19 | Matsushita Electric Works Ltd | Id label |
| JP2001256575A (en) * | 2000-03-13 | 2001-09-21 | Sato Corp | Sticking type radio tag |
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| JP2000057292A (en) * | 1998-08-12 | 2000-02-25 | Lintec Corp | Noncontact data carrier label |
| JP2001013874A (en) * | 1999-06-25 | 2001-01-19 | Matsushita Electric Works Ltd | Id label |
| JP2001256575A (en) * | 2000-03-13 | 2001-09-21 | Sato Corp | Sticking type radio tag |
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| EP1628244A4 (en) * | 2003-05-26 | 2007-06-27 | Omron Tateisi Electronics Co | Information carrier, information recording medium, sensor, commodity management method |
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| GB2424302A (en) * | 2003-12-24 | 2006-09-20 | Singapore Technologies Logisti | Rfid seal tag |
| WO2005062247A1 (en) * | 2003-12-24 | 2005-07-07 | Singapore Technologies Logistics Pte Ltd | Rfid seal tag |
| JP4590908B2 (en) * | 2004-04-09 | 2010-12-01 | 凸版印刷株式会社 | Non-contact IC medium and method of manufacturing non-contact IC medium |
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| JP2005309492A (en) * | 2004-04-16 | 2005-11-04 | Matsushita Electric Ind Co Ltd | Radio information medium |
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| JP2006048353A (en) * | 2004-08-04 | 2006-02-16 | Sun Corp | Authentication system |
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| US8395504B2 (en) | 2006-05-16 | 2013-03-12 | Toppan Printing Co., Ltd. | IC label for prevention of forgery |
| WO2007132897A1 (en) | 2006-05-16 | 2007-11-22 | Toppan Printing Co., Ltd. | Ic label for prevention of forgery |
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| JP2009169899A (en) * | 2008-01-21 | 2009-07-30 | Toppan Printing Co Ltd | Forgery preventing ic tag |
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| JP2010217242A (en) * | 2009-03-13 | 2010-09-30 | Toppan Printing Co Ltd | Non-contact ic label |
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