JP2005309492A - Radio information medium - Google Patents

Radio information medium Download PDF

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Publication number
JP2005309492A
JP2005309492A JP2004121587A JP2004121587A JP2005309492A JP 2005309492 A JP2005309492 A JP 2005309492A JP 2004121587 A JP2004121587 A JP 2004121587A JP 2004121587 A JP2004121587 A JP 2004121587A JP 2005309492 A JP2005309492 A JP 2005309492A
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Japan
Prior art keywords
information
chip
information medium
main surface
wireless information
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JP2004121587A
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Japanese (ja)
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Tomoyuki Futagawa
智之 二川
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Priority to JP2004121587A priority Critical patent/JP2005309492A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To prevent the unauthorized reuse of a once attached radio information medium, and to protect information stored in a memory. <P>SOLUTION: In this radio information medium, an IC chip having an information writing means, an information reading means, and an information storing means, and an oscillation coil having a radio signal transmitting/receiving means are placed on the first main surface of a film-shaped base, and a tacky adhesive layer is formed on the back face of the first main surface. The tacky adhesive layer is provided with an easily peelable region outside the IC chip placing region. Consequently, it is possible to prevent the illegal reuse of the once attached radio information medium, and to protect the information stored in the memory. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は物品のトレーサビリティ管理を適正に行うため再使用を防止した無線情報媒体に関するものである。   The present invention relates to a wireless information medium that prevents reuse in order to properly manage the traceability of articles.

工業製品や農作物、食料品などの物品の素材、生産場所、流通経路などの物品固有の情報に基づくトレーサビリティ管理の重要性から、ICタグやICラベルなどの無線情報媒体を用いたトレーサビリティ管理が広く行われている。一方、物品から無線情報媒体を取り外し、情報を偽装したり、別の物品に再使用されるなどの不正使用が懸念される。従来の無線情報媒体としては、ICラベルの形態を採り、一度物品に貼付したICラベルが剥離された場合、ICチップやアンテナを破壊し再使用を防ぐ構造としているものがあった(例えば、特許文献1参照)。   Traceability management using wireless information media such as IC tags and IC labels is widespread due to the importance of traceability management based on material-specific information such as materials of industrial products, agricultural products, foodstuffs, production locations, distribution channels, etc. Has been done. On the other hand, there is a concern about unauthorized use such as removing a wireless information medium from an article to disguise information or reusing it for another article. As a conventional wireless information medium, there is one that takes the form of an IC label and has a structure in which an IC chip and an antenna are destroyed to prevent reuse when the IC label once attached to an article is peeled off (for example, patents) Reference 1).

図2は、前記特許文献に記載された従来の無線情報媒体を示す断面図である。   FIG. 2 is a cross-sectional view showing a conventional wireless information medium described in the patent document.

図2において、ICタグは、CPU、メモリ、変復調回路、電源制御回路を集積回路化したICチップ101と、アンテナ102とICチップ101間を接続する導線103とがほぼ同一の平面上に配置されて第一の粘着層104と第二の粘着層105との間に挟み込まれ、第一の粘着層104の外側には表面基材106が、第二の粘着層105の外側には剥離ライナ107がそれぞれ貼着されてシート状に一体化し、粘着層104、105で挟み込まれているICチップ101の中で、導線103やICチップ101等の表面積は、コイル状のアンテナ102の表面積に比べ非常に小さいので、ICタグを貼付対象の部品上に一旦貼付した後で引き剥がそうとした場合、アンテナ102、導線103及びICチップ101からなる本体部分と被着材の表面との間に働く粘着力に抵抗する外力が加わり、その外力は前記本体部分を構成する各部にそれぞれ不均一に加えられることになり、導線103の断線やICチップ101の端子部との接続部分などを破壊することで再使用を防いでいた。
特開2000−251164号公報
In FIG. 2, the IC tag includes an IC chip 101 in which a CPU, a memory, a modulation / demodulation circuit, and a power supply control circuit are integrated, and a conductive wire 103 that connects the antenna 102 and the IC chip 101 on substantially the same plane. And sandwiched between the first adhesive layer 104 and the second adhesive layer 105, the surface base material 106 is outside the first adhesive layer 104, and the release liner 107 is outside the second adhesive layer 105. Are integrated into a sheet shape and are sandwiched between adhesive layers 104 and 105. Among the IC chips 101, the surface area of the lead wire 103, the IC chip 101, etc. is much smaller than the surface area of the coiled antenna 102. Therefore, when the IC tag is once pasted on the component to be pasted and then peeled off, the main body portion including the antenna 102, the conductor 103 and the IC chip 101 is used. An external force that resists the adhesive force acting on the surface of the adherend is applied, and the external force is applied non-uniformly to each part constituting the main body part, causing the disconnection of the conductive wire 103 and the terminal of the IC chip 101. The reuse part was prevented by destroying the connection part with the part.
JP 2000-251164 A

しかしながら、前記従来の構成では、CPU、メモリ、変復調回路、電源制御回路が集積回路化されたICチップ101をも破壊する恐れがある。ICチップ101が破壊された場合、ICチップ101に内蔵されているメモリに記憶された情報を読出すことが困難になるという課題を有していた。   However, in the conventional configuration, the IC chip 101 in which the CPU, the memory, the modem circuit, and the power supply control circuit are integrated may be destroyed. When the IC chip 101 is destroyed, there is a problem that it becomes difficult to read information stored in a memory built in the IC chip 101.

本発明は、前記従来の課題を解決するもので、一旦貼付した無線情報媒体が引き剥された場合の再利用とメモリ記憶情報の破壊を防ぐ無線情報媒体を提供することを目的とする。   An object of the present invention is to solve the above-described conventional problems, and to provide a wireless information medium that prevents reuse and destruction of memory storage information when a wireless information medium once pasted is peeled off.

前記従来の課題を解決するために、本発明の無線情報媒体は、フィルム状の基体の第一主面に、情報書込み手段と情報読出し手段と情報記憶手段とを備えたICチップと、無線信号の受発信手段を備えた共振コイルとが載置され、第一主面の背面に粘着材層が形成された無線情報媒体において、粘着材層は前記ICチップ載置領域の外囲に剥離容易領域を備えたものである。   In order to solve the above-described conventional problems, a wireless information medium according to the present invention includes an IC chip including an information writing unit, an information reading unit, and an information storage unit on a first main surface of a film-like substrate; In the wireless information medium in which the resonance coil having the receiving / transmitting means is mounted and the adhesive material layer is formed on the back surface of the first main surface, the adhesive material layer is easily peeled off around the IC chip mounting area. It has a region.

本構成によって、一旦貼付した無線情報媒体の不正な再利用を防ぐと共に、メモリに記憶された情報を保護することができる。   With this configuration, it is possible to prevent unauthorized reuse of the wireless information medium once pasted, and to protect the information stored in the memory.

以上のように、本発明の無線情報媒体によれば、工業製品や農作物、食料品などの物品の素材、生産場所、流通経路などの物品固有の情報に基づくトレーサビリティ管理などに用いられるICタグやICラベルなどの情報を偽装したり、別の物品に再使用されるなどの不正使用を防ぐ事が出来る。さらに、ICチップは破壊されることがないので引き剥がされた物品固有の情報は保持することができる。   As described above, according to the wireless information medium of the present invention, an IC tag used for traceability management based on information unique to an article such as a material of an industrial product, an agricultural product, a foodstuff, a production location, a distribution route, etc. It is possible to prevent unauthorized use such as disguising information such as an IC label or reusing it for another article. Furthermore, since the IC chip is not destroyed, information unique to the peeled article can be retained.

以下本発明の実施の形態について、図面を参照しながら説明する。    Embodiments of the present invention will be described below with reference to the drawings.

(実施の形態)
図1は、本発明の実施の形態における無線情報媒体としてICラベルを示した断面図である。
(Embodiment)
FIG. 1 is a cross-sectional view showing an IC label as a wireless information medium according to an embodiment of the present invention.

図1において、ICチップ7はCPU、メモリ、変復調回路、電源制御回路が集積回路化され半導体素子であり、絶縁性、耐湿性に優れる紙や合成樹脂やポリイミドフィルムなどがフィルム状に加工された基体3の第一主面に薄膜の共振コイルからなるアンテナ6と共に載置されている。アンテナ6は金、銀、銅などの導電性ペーストをパターニングにより形成したり、金、銀、銅などの薄膜を貼り付けたり、金、銀、銅などを蒸着を用いて形成することができる。ICチップ7とアンテナ6とは絶縁性、耐湿性に優れる紙や合成樹脂などがフィルム状に加工された保護被膜8で基体3の第一主面が保護されている。ICチップ7とアンテナ6とは導通接続されており、情報識別装置(図示せず)が発信する電波を受信して誘電された電圧を電源とし情報書込み、情報読出し、情報記憶が行われる。また、アンテナ6はICチップ7外囲に張り巡らされており、貼付されたICラベルが引き剥がされた場合にはアンテナ6だけが剥がれICチップ7は残留する構造となっている。アンテナ6だけが剥がれる構造としてはICチップ7外囲にミシン目やリード罫などの破断容易部9を設ける構造としている。また、アンテナ6の下層に位置する粘着材層2の粘着力を小さくし剥離容易領域に形成する構造も有効である。   In FIG. 1, an IC chip 7 is a semiconductor element in which a CPU, a memory, a modulation / demodulation circuit, and a power supply control circuit are integrated, and a paper, a synthetic resin, a polyimide film, or the like having excellent insulation and moisture resistance is processed into a film shape. The first main surface of the substrate 3 is placed together with an antenna 6 made of a thin film resonance coil. The antenna 6 can be formed by patterning a conductive paste such as gold, silver, or copper, attaching a thin film such as gold, silver, or copper, or depositing gold, silver, copper, or the like by vapor deposition. The first main surface of the substrate 3 is protected between the IC chip 7 and the antenna 6 by a protective film 8 in which paper or synthetic resin having excellent insulation and moisture resistance is processed into a film. The IC chip 7 and the antenna 6 are conductively connected, and information writing, information reading, and information storage are performed using a dielectric voltage received from a radio wave transmitted from an information identification device (not shown). Further, the antenna 6 is stretched around the IC chip 7, and when the attached IC label is peeled off, only the antenna 6 is peeled off and the IC chip 7 remains. As a structure in which only the antenna 6 is peeled off, an easily breakable portion 9 such as a perforation or a lead ruler is provided around the IC chip 7. In addition, a structure in which the adhesive force of the adhesive material layer 2 positioned below the antenna 6 is reduced and formed in an easily peelable region is also effective.

基体3の第二主面にアクリル系やゴム系からなる粘着材層2が設けられ、更に、粘着材層2を覆う紙やフィルムからなる剥離紙1が設けられている。   An adhesive material layer 2 made of acrylic or rubber is provided on the second main surface of the substrate 3, and a release paper 1 made of paper or film covering the adhesive material layer 2 is further provided.

かかる構成によれば、ICラベルを不正に剥がし取られるような場合、ICチップ7とアンテナ6とが断線状態になるため、情報識別装置(図示せず)が発信する電波を受信することが不可能となり電源電圧を誘電することが出来ずに情報書込み、情報読出し、情報記憶を行うことが出来ないため情報が偽装されることがない。さらに、ICチップ7は破壊されずに確実に残留することで、引き剥がされた物品固有の情報は保持される。また、ICチップ7は物品に残留するため、他の物品に不正に再貼付されることがない。   According to such a configuration, when the IC label is illegally peeled off, the IC chip 7 and the antenna 6 are disconnected, so that it is impossible to receive radio waves transmitted by the information identification device (not shown). It becomes possible to write information, read information, and store information without being able to induct the power supply voltage, so that information is not camouflaged. Further, since the IC chip 7 remains without being destroyed, the information unique to the peeled article is retained. Further, since the IC chip 7 remains in the article, it is not illegally reattached to another article.

また、共振コイルからなるアンテナ6は通信を行う時以外は特に用を成さないため、ICラベルが剥がし取られるような場合は破壊しても特に影響はない。   In addition, since the antenna 6 made of a resonance coil is not particularly useful except when communicating, even if the IC label is peeled off, there is no particular influence even if it is destroyed.

なお、本実施の形態において、無線情報媒体としてICラベルを用いて説明したが、共振コイルからなるアンテナ6の誘電により電源電圧を確保する構成を備えた無線情報媒体であれば適宜用いる事が出来る。   In this embodiment, an IC label is used as the wireless information medium. However, any wireless information medium having a configuration in which a power supply voltage is secured by the dielectric of the antenna 6 made of a resonance coil can be used as appropriate. .

適正な物品のトレーサビリティ管理に有用であり、特に無線情報媒体に適している。   It is useful for traceability management of proper goods, and is particularly suitable for wireless information media.

本発明の実施の形態における無線情報媒体の断面図Sectional drawing of the radio | wireless information medium in embodiment of this invention 従来の無線情報媒体の断面図Sectional view of a conventional wireless information medium

符号の説明Explanation of symbols

1 剥離紙
2 粘着材層
3 基体(フィルム)
6 アンテナ
7 ICチップ
8 保護被膜
101 ICチップ
102 アンテナ
103 導線
104 第一の粘着層
105 第二の粘着層
106 表面基材
107 ライナ
DESCRIPTION OF SYMBOLS 1 Release paper 2 Adhesive material layer 3 Base | substrate (film)
6 Antenna 7 IC chip 8 Protective coating 101 IC chip 102 Antenna 103 Conductor 104 First adhesive layer 105 Second adhesive layer 106 Surface base material 107 Liner

Claims (3)

フィルム状の基体の第一主面に、情報書込み手段と情報読出し手段と情報記憶手段とを備えたICチップと、無線信号の受発信手段を備えた共振コイルとが載置され、前記第一主面の背面に粘着材層が形成された無線情報媒体において、前記粘着材層は前記ICチップ載置領域の外囲を剥離容易領域とした無線情報媒体。 An IC chip having information writing means, information reading means, and information storage means, and a resonance coil having radio signal receiving / transmitting means are mounted on the first main surface of the film-like substrate. The wireless information medium in which an adhesive material layer is formed on the back surface of the main surface, wherein the adhesive material layer has an outer periphery of the IC chip mounting area as an easily peelable area. 前記粘着材層は、前記剥離容易領域よりも前記ICチップ載置領域の粘着力が大きい粘着層が形成された請求項1に記載の無線情報媒体。 The wireless information medium according to claim 1, wherein the adhesive material layer is formed with an adhesive layer having a greater adhesive force in the IC chip mounting area than in the easily peelable area. 前記ICチップ載置領域周囲を垂直方向に破断容易部手段が形成された請求項1または2に記載の無線情報媒体。 The wireless information medium according to claim 1, wherein an easily breakable portion means is formed in a vertical direction around the IC chip mounting area.
JP2004121587A 2004-04-16 2004-04-16 Radio information medium Pending JP2005309492A (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000057292A (en) * 1998-08-12 2000-02-25 Lintec Corp Noncontact data carrier label
JP2002032730A (en) * 2000-07-14 2002-01-31 Dainippon Printing Co Ltd Contactless data carrier device
JP2002072883A (en) * 2000-09-05 2002-03-12 Oji Paper Co Ltd Data memory element holding label
JP2003150924A (en) * 2001-11-08 2003-05-23 Hitachi Chem Co Ltd Non-contact ic label

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000057292A (en) * 1998-08-12 2000-02-25 Lintec Corp Noncontact data carrier label
JP2002032730A (en) * 2000-07-14 2002-01-31 Dainippon Printing Co Ltd Contactless data carrier device
JP2002072883A (en) * 2000-09-05 2002-03-12 Oji Paper Co Ltd Data memory element holding label
JP2003150924A (en) * 2001-11-08 2003-05-23 Hitachi Chem Co Ltd Non-contact ic label

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