JP2007025937A - Non-contact ic medium - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a non-contact IC medium formed by interposing an inlet constituted by electrically connecting an IC chip and an antenna between front and back base materials through adhesive, wherein when the IC inlet in the non-contact IC medium with paper as the base materials is intentionally peeled, the antenna can be surely broken down. <P>SOLUTION: This non-contact IC medium is formed by interposing a non-contact IC inlet constituted of an IC chip in which unique identification information is stored and an antenna where the section of an antenna by the printing whose film thickness is 1 to 30μm and the section of an antenna by etching are connected for transmitting and receiving the identification information between base materials equipped with adhesive layers. The strength of the section of the antenna by printing is made fragile than the section of the antenna by etching so that when the base materials are peeled, the antenna section by printing of the antenna joined to the IC chip bonded between the base materials can be broken down. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a non-contact IC medium used for admission tickets, employee ID cards, ID cards and the like.

  In the past, student ID cards and employee ID cards have been used in many situations, such as entrance and exit management, billing at cafeterias, and PC access rights, using not only facial photographs that prove their identity but also magnetic tape data. Recently, using an IC chip with a unique identification number that can be contactlessly communicated, it is possible to read these certificates and cards by simply holding them over each scanner, opening the gate, and giving a password. It has become. Usually, these non-contact IC media are electrically bonded to an IC chip after a dipole antenna or loop antenna made of aluminum or copper is formed by etching on a tough base substrate such as polyimide, PEN, or PET. Thus, a thin part called a so-called inlet was formed, and the inlet was sandwiched between a paper base or a plastic base and finished into a card shape.

  On the other hand, overseas ID cards, such as national ID cards or driver's licenses, are still used, such as a national ID card or a driver's license. Because there are many people, there are places where the above-mentioned non-contact IC chip is inserted to prevent forgery. In this case, when the data management center and individual scanners are connected, the system becomes quite large, and at present, it is possible to have a stand-alone scanner that can be individually handled offline, for example, can be individually read in the field.

  For this reason, in order to prevent counterfeiting, special inks and holograms such as ultraviolet fluorescence and OVD (Optically Variable Device) are usually printed and processed on the surface to prevent forgery.

  Further, as a technique for preventing forgery and alteration of a non-contact IC medium, it has been considered as an ID label for an article that is desired to have a unique ID such as Patent Document 1 and Patent Document 2. In particular, Patent Document 1 is a sealing seal that prevents forgery and alteration by cutting an antenna by using two types of adhesives having strong and weak adhesive strength.

  However, with regard to facial photographs, it is now possible to easily duplicate and forge due to recent advances in personal computer technology. There was a problem that similar products could be obtained as long as special inks, similar hologram foils or seals were obtained. In particular, when a non-contact IC chip is inserted into an ID card, remove only the inlet that connects the IC chip to the antenna in the other person's ID card, cut it off, and put it in another forged certificate. Can impersonate others. In that case, if the system is connected online, fraud will be detected when it is read by the scanner, but if it is offline, it can be read even if it is stolen data. It has the problem that it is difficult to detect.

  And by making a counterfeit ID card from an illegally acquired ID card and impersonating it, you can gain access right to entrance / exit of related facilities and equipment, or in some cases misuse the ID card It will be possible to borrow from financial companies.

The known literature is described below.
JP 2001-13874 A JP 2003-150924 A

  The present invention has been made in view of the above points, and in particular, a non-contact IC medium in which an antenna is reliably destroyed when an IC inlet in a non-contact IC medium based on paper is intentionally peeled off. Is intended to provide.

  The invention according to claim 1 of the present invention provides unique identification information in a non-contact IC medium formed by sandwiching an inlet in which an IC chip and an antenna are electrically coupled between front and back substrates via an adhesive. A non-contact IC inlet composed of an antenna in which an IC portion storing an IC portion storing an antenna portion by printing having a thickness of 1 to 30 μm and an etching antenna portion capable of transmitting and receiving the identification information is combined with an adhesive layer A non-contact IC medium formed by being sandwiched between base materials provided with a substrate, wherein the strength of the antenna portion by printing is weaker than that of the antenna portion by etching, so that when the base materials are separated, A non-contact IC medium formed by destroying an antenna portion by printing an antenna bonded to an IC chip bonded between materials That.

  In the invention according to claim 2 of the present invention, the upper and lower surfaces of the antenna are divided into partial areas, and an adhesive layer is alternately provided on the upper surface or the lower surface for each partial area, and the antenna layer is interposed via the adhesive layer. It is a non-contact IC medium formed by being sandwiched between materials, and when the base material is peeled off, the portion of the antenna due to printing of the antenna bonded to the IC chip adhered between the base materials is partially cut. The non-contact IC medium according to claim 1, wherein

  The invention according to claim 3 of the present invention is such that the printed antenna has at least a binder resin and solvent, and silver (Ag) powder, carbon (C) powder, or copper (Cu). It is formed by printing a conductive paste containing powder, nickel (Ni) powder, gold (Au) powder, or a mixture of these metal powders and obtaining conductivity by contact between the metal powders. The non-contact IC medium according to claim 1 or 2.

  In the invention according to claim 4 of the present invention, an antenna made of copper (Cu) or aluminum (Al) is formed on one side of a base material of either PET, PEN, or polyimide. 4. The non-contact IC medium according to claim 1, wherein the non-contact IC medium is a non-contact IC medium.

  In the non-contact IC medium according to the present invention, the adhesive layer has an inlet of an IC chip in which unique identification information is stored and an antenna composed of a combination of an antenna capable of transmitting and receiving this information and an antenna formed by printing a conductive paste. Because it is formed by sandwiching it with the paper substrate provided, the antenna part due to brittle printing does not retain the inlet shape when the inlet formed with the IC chip and antenna is peeled off from the non-contact IC medium and bonded The unique identification information stored in the IC chip cannot be read by the scanner because the printed antenna is partially peeled off and cut, and forgery and alteration can be found.

Further, in the non-contact IC medium according to the present invention, since the antenna includes not only the antenna part by printing but also the antenna part by etching of copper or aluminum part, a non-contact IC medium having low resistance and good communication characteristics is provided. Obtainable.

  Embodiments of the present invention will be described below.

  FIG. 1 is a side sectional view showing an embodiment of the non-contact IC medium of the present invention.

  FIG. 1 shows an IC chip 1 storing unique identification information, a portion of an antenna 2 with a thickness of 1 to 30 μm that can transmit and receive this identification information, and an antenna 3 by etching on a PET base substrate 4. The non-contact IC medium 10 is formed by laminating a non-contact IC inlet 8 composed of an antenna 7 coupled to the base material 6 between the base material 6 provided with the adhesive layer 5. The portion of the antenna 2 by printing is formed by making its strength weaker than the portion of the antenna 3 by etching formed on the base substrate 4 made of PET. For this reason, the non-contact IC medium 10 of the present invention is formed such that when the base materials 6 are separated, the antenna 2 portion due to the printing of the antenna connected to the IC chip adhered between the base materials 6 is destroyed. This is a non-contact IC medium.

  The adhesive layer 5 is an adhesive that strongly adheres to the base substrate 4 of PET, PEN or polyimide and one of the paper base 6, the antenna 2 by printing, or the other paper base 6, for example, general Acrylic resins, natural and synthetic rubbers, styrene / butadiene copolymers, polyvinyl acetate, vinyl acetate / ethylene copolymers, starch, silicone compounds, glue, casein, polyvinyl alcohol, polyurethane, styrene-butadiene rubber, acrylonitrile -Synthetic rubber such as butadiene rubber, ethylene-vinyl acetate copolymer resin, acrylic ester resin, vinyl chloride resin, vinylidene chloride resin, polyester resin, polyester urethane resin, vinyl chloride vinyl acetate copolymer, etc. Resins such as thermoplastic resins can be used alone or in solution, aqueous solution, It can be used in the form of Rujon. In particular, an appropriate amount of a curing agent can be added to these adhesive layer resins in order to have chemical resistance as well as resistance to physical destruction.

  A method for producing a non-contact IC medium of the present invention will be described. First, on the adhesive layer 5 of the paper base material 6 (the lower base material 6 in the figure) on which the adhesive layer has been applied and formed, the antenna 3 by the etching on the base base material 4 of PET, PEN or polyimide is printed. The antenna 7 is formed as a combined body with the antenna 2 by the above method, and the IC chip 1 is joined to the printed antenna 2. In addition, the joining method of an IC chip and an antenna or printing and an etching antenna can be performed by thermocompression bonding using well-known connection materials, such as an anisotropic conductive film and anisotropic conductive paste. Next, the paper base material 6 (the upper base material 6 in the figure) on which the antenna is not formed is bonded to the antenna surface by a heat laminating method so as to be inside, and a non-contact IC medium (non-contact IC) (Referred to as medium A).

  The printed antenna 2 is manufactured as a loop-shaped or dipole-shaped antenna pattern formed by printing a conductive paste with a length and thickness suitable for a resonant frequency of 125 KHz, 13.65 MHz, 2.45 GHz, or the like. . The conductive paste includes at least a binder resin, solvent, silver (Ag) powder, carbon (C) powder, copper (Cu) powder, nickel (Ni) powder, gold (Au) powder, or a metal thereof. The thing which contains the mixture of powder | flour and has acquired electroconductivity by those contact is mention | raise | lifted.

The IC chip 1 is formed as an integrated circuit and has a control unit, a modulation / demodulation unit and a memory area, and ID information such as unique identification data is stored in the memory area. The ID information stored in the memory area is called by the control unit and can be transmitted from the antenna 7 of the combination of the print antenna 2 and the etching antenna 3. The ID information can be received and read by a scanner formed as a reader / writer. The transmission / reception of the ID information is performed on the same principle as that of a non-contact IC card having no power source. That is, the scanner is called by a weak radio wave, and an induction electromagnetic field is formed by the radio wave. When the antenna 7 is brought close to the scanner so that the antenna is positioned in the induction electromagnetic field, an electromotive force is generated in the antenna 7 by electromagnetic induction. In the IC chip 1, this electromotive force is used as a power source, and the ID information stored in the memory area can be called by the control unit and transmitted from the antenna. The ID information thus transmitted is received by the scanner. Can be read.

  The IC medium incorporates a reader / writer capable of non-contact communication, and can be used in an entrance gate, a parking lot, or a personal computer.

  In the non-contact IC medium A, the antenna 7 which is a joined body of the printed antenna 2 and the etching antenna 3 is firmly bonded by the adhesive layer 5, so that, for example, a thin blade is inserted between the paper substrates. Even if the antenna is taken out from the paper base, the printed antenna itself is brittle, so it does not form the shape of the antenna after it is taken out, and even if the surface of the non-contact IC medium is counterfeited Since normal communication cannot be performed, troubles such as an ID reading error and an extreme decrease in communication distance occur, and fraud can be prevented.

  FIG. 2 is a side sectional view showing an embodiment of the non-contact IC medium of the present invention.

  In FIG. 2, the upper and lower surfaces of the antenna 7 are divided into partial areas, and the adhesive layer 5 is alternately provided on the upper surface or the lower surface in each partial area, and is sandwiched between the substrates via the adhesive layer. Non-contact IC medium. The portion of the antenna 2 by printing is provided with the adhesive layer 5 alternately with the upper surface or the lower surface for each partial area, and is laminated between the base materials, so that the formation of the adhesive layer for each partial area is only on the upper surface, Or it is repeated alternately with only the lower surface. When the base materials are separated, the printed antenna 2 portions adhered between the base materials 6 are alternately pulled to the base material 6 side on the upper surface or the base material side on the lower surface for each partial area. This is a non-contact IC medium in which the printed antenna 2 is partially cut.

  A method for producing a non-contact IC medium of the present invention will be described. First, the adhesive layers 5 provided alternately on both sides of the printed antenna 2 are formed of a thermoplastic resin that strongly adheres to both the printed antenna 2 and the paper base 6. Next, the etching antenna 3 formed on the base substrate 4 is pasted on the adhesive layer 5 of the paper substrate 6 (the lower substrate 6 in the figure) to which the adhesive layer 5 is applied, and then printed. The antenna 2 is formed, and then the IC chip 1 is bonded by the same method as described above, and the paper substrate (upper substrate 6 in the figure) is bonded inside and bonded to the antenna surface by a heat laminating method. Thus, a non-contact IC medium (non-contact IC medium B) can be produced.

  The antenna 7 which is a combination of the printed antenna 2 and the etched antenna 3 forms an antenna pattern by printing using an etching antenna and a conductive paste having a resonance frequency of 125 KHz, 13.65 MHz, 2.45 GHz or the like. Looped or dipole printed antenna.

  As shown in FIG. 2, the non-contact IC medium B is firmly peeled off by the adhesive layer 5 that is partially applied alternately on both sides, as shown in FIG. Even if it does so, since there is an adhesive alternately on both sides of the antenna, the printed antenna is cut and destroyed, so that fraud can be prevented.

  That is, even if the inlet of the non-contact IC medium B is to be removed cleanly, the antenna portion 2 by printing remains partially adhered to the adhesive layer 5 and the paper substrate 6 as shown in FIG. Remains on the substrate sheet 6 side, and the remaining antenna is cut off on the other substrate sheet 6 (see FIG. 3).

  Then, when the non-contact communication means is peeled off from the non-contact IC medium A or the non-contact IC medium B together with the antenna, the printed antenna 2, the etching antenna 3, or the adhesive layer 5 is cut and destroyed. Even if the ID information stored in the chip 1 is read by the scanner, the ID information cannot be read because the ID information is not transmitted from the print antenna 2 and the etching antenna 3. Therefore, when the ID information cannot be read by the scanner in this way, it can be found that the non-contact IC medium A or the non-contact IC medium B may be peeled off and replaced with an unauthorized one. Is.

  FIG. 3 is a side cross-sectional view schematically showing a shape when an inlet of a non-contact IC medium of Example 2 of the present invention is to be extracted.

  FIG. 3 is a diagram for explaining a peeled state when an inlet formed of an IC chip and an antenna is to be peeled from a non-contact IC medium. Since the antenna has a brittle property formed by printing, the printed antenna 2 is pulled to the bonding surface side of the base material 6 and the adhesive layer 5 for each partial area, and the printed antenna is partially cut. Function is destroyed. 3 is partially cut off and the printed antenna 2 is peeled off. A part of the printed antenna 2 and the etching antenna 3 are peeled off on the lower side of the base material 6 side. That is, the peeling interface is a joint surface between the printed antenna 2 and the etching antenna 3, and the printed antenna 2 is cut for each partial area. Since the print antenna 2 is disconnected, communication becomes impossible, the unique identification information stored in the IC chip cannot be read by the scanner, and forgery and alteration can be found.

  Examples will be described below.

Example 1 will be described with reference to FIG. First, after printing characters and patterns on one side of a paper base 6 having a basis weight of 123 g / m ^{2 by} a known printing method such as offset printing, gravure printing, flexographic printing, etc., a polyester resin (Toyobo) is used as an adhesive layer 5 on the opposite side. : RV200) was applied at a dry rate of 15 g / m ² to obtain a paper substrate (lower substrate 6 in the figure). Next, on the adhesive layer 5 of the paper base material, the Al etching antenna 3 is attached to the PET base base material 4, and the thickness is further increased by using a conductive paste (Fujikura Kasei: Dotite) using silver powder. After printing the printed antenna 2 by a known printing method such as screen printing, gravure printing, offset printing or the like so as to be 15 μm, an IC chip for tag is attached to both ends of the antenna 7 using an anisotropic conductive film (Hitachi Chemical: ANISOLM). 1 (OMRON: I-CODE) was mounted. Thus, the adhesive is printed on the paper substrate 6 (lower substrate 6 in the figure) on which the antenna is printed and the paper substrate (upper substrate 6 in the figure) on which the antenna is not printed. The antennas 7 were laminated so as to be sandwiched, pressed by a hot laminator with a hot plate temperature of 150 ° C. and a pressure of 2 kg / cm ² , and then punched into a card shape to obtain a non-contact IC medium of Example 2.

A second embodiment will be described with reference to FIG. After printing characters and patterns on one side of a paper base 6 having a basis weight of 157 g / m ^{2 by} a known printing method such as offset printing, gravure printing, flexographic printing, etc., a polyester resin (Toyobo: RV200 as an adhesive layer 5 on the opposite side) ) Was applied with stripes of 3 mm width at a dryness of 8 g / m ² to obtain a paper substrate 6 (lower substrate 6 in the figure). After that, similarly to Example 1, the Al etching antenna 3 was pasted on the PET base material 4, and the printed antenna 2 was printed using a conductive paste (Fujikura Kasei: Dotite) using silver powder. A tag IC chip 1 (OMRON: I-CODE) was mounted on both ends of the antenna 7 using a conductive film (Hitachi Chemical: ANISOLM). The adhesive sandwiches the antenna 7 between the paper substrate 6 on which the antenna is printed (the lower substrate 6 in the drawing) and the paper substrate on which the antenna is not printed (the upper substrate 6 in the drawing). After the lamination, the non-contact IC medium of Example 2 was obtained by punching into a card shape. It should be noted that when the paper base material was laminated, the portions where the adhesive was applied to both sides of the antenna were positioned so as to be alternately adhered to both sides of the antenna, and thermal lamination was performed.

  Examples 3 to 4 were carried out as comparative examples of the present invention. This will be described below.

  Instead of the etching antenna 3 and the printed antenna 2 used in the first embodiment, the same as in the first embodiment except that an inlet provided with an Al etching antenna 7 having a PET base material 4 of 38 μm thickness is provided. The non-contact IC medium of Example 3 was produced by the method described above.

  In place of the etching antenna 3 and the printed antenna 2 used in the second embodiment, the same as the second embodiment except that an inlet provided with an antenna 7 of a Cu etching process using a polyimide base material having a thickness of 25 μm is inserted. A non-contact IC medium of Example 4 was produced by the method.

  Next, an attempt was made to extract the inlet using Example 1, Example 2 and Comparative Examples 3 and 4. In the non-contact IC medium of Example 1, when the paper base material layer 6 was to be peeled off, the antenna portion 2 by printing was broken, and unique identification information could not be read. Next, in Example 2, since it was still more difficult, the antenna 2 by printing partly peeled off, the function of the inlet was destroyed, and communication was not possible. That is, forgery was not possible in both Example 1 and Example 2.

  Next, in the non-contact IC media of Comparative Examples 3 and 4, an attempt was made to extract the inlet. Due to the toughness of the PET base substrate 4 or the polyimide base substrate 4, the inlet can be taken out in a nearly perfect shape. A non-contact IC medium can be produced, and unique identification information can be read. That is, it was forged.

1 is a side sectional view showing an embodiment of a non-contact IC medium of the present invention, and corresponds to Example 1. FIG. FIG. 3 is a side sectional view showing an embodiment of a non-contact IC medium of the present invention, and corresponds to Example 2. It is side sectional drawing which represented typically the shape when it was going to extract the inlet of the non-contact IC medium of Example 2 of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... IC chip 2 ... Print (by) antenna 3 ... Etching (by) antenna 4 ... (PET) Base base material 5 ... Adhesive layer 6 ... Base material 7 ... Antenna 8 ... Non-contact IC inlet 10 ... Non-contact IC medium

Claims (4)

  In a non-contact IC medium formed by sandwiching an inlet in which an IC chip and an antenna are electrically coupled with an adhesive between front and back substrates, an IC chip storing unique identification information and the identification information A non-contact IC inlet made of an antenna in which an antenna portion by printing with a thickness of 1 to 30 μm capable of transmitting and receiving and an antenna portion by etching is combined is sandwiched between base materials provided with an adhesive layer. It is a non-contact IC medium, and the strength of the antenna portion by printing is made weaker than the antenna portion by etching, so that when the base material is peeled off, it is joined to the IC chip adhered between the base materials. A non-contact IC medium formed so as to destroy an antenna portion due to antenna printing.   The upper and lower surfaces of the antenna are divided into partial areas, and an adhesive layer is alternately provided on the upper surface or the lower surface for each partial area, and the contactless IC is formed by being sandwiched between the substrates via the adhesive layer. 2. The medium is a medium, and when the substrates are separated from each other, a portion of the antenna by printing of the antenna bonded to the IC chip bonded between the substrates is partially cut. The non-contact IC medium described in 1.   In the antenna by printing, the conductive paste used for printing is at least a binder resin and solvent, and silver (Ag) powder, carbon (C) powder, copper (Cu) powder, nickel (Ni) powder, or gold 3. The non-conductive layer according to claim 1, which is formed by printing a conductive paste containing (Au) powder or a mixture of these metal powders and obtaining conductivity by contact between the metal powders. Contact IC media.   The etching antenna is characterized in that an antenna made of copper (Cu) or aluminum (Al) is formed on one side of a base substrate of either PET, PEN, or polyimide. 4. The non-contact IC medium according to any one of 3 above.

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