JP2003196614A - Communication device for ic chip mounting body - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a communication device for an IC chip mounting body capable of providing favorable communication characteristics to various types of antenna shapes of IC chip mounting body and having an electrostatic antenna. <P>SOLUTION: A reader/writer communicates with, at least, two types of IC chip mounting bodies by electrostatic connecting method and is formed of a transmission antenna At transmitting communication signals from a reader/ writer side electrostatic antenna and a receiving antenna Ar receiving the signal returned from the IC chip mounting body. A distance between gravity centers of areas of the respective antenna parts of one IC chip mounting body side electrostatic antenna is set as Lb and the distance between gravity centers of areas of the respective antenna parts of the other IC chip mounting body side electrostatic antenna is set as Ls (Lb>Ls) and the transmission antenna At and a receiving antenna Ar of the reader writer are so disposed that the intervals between their pole plates are varies, so that when the maximum value and the minimum value of the distance of the interval between the pole plates are set as Mm and Mn respectively, Mm=1.0×Lb and Mn=0.4×Ls. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a communication device used for reading / writing (R / W) of an IC chip package in which information recorded on an IC chip is recorded, rewritten, and read in a contactless manner. It is a thing.

These IC chip mounting bodies record necessary information on the IC chip, and when necessary, information can be recorded, rewritten, and read by a communication device such as a reader / writer in a short time. Radio Frequency Id
As an IC carrier called "entification (wireless automatic identification)", it is possible to transmit information without contact with the reader antenna. Among these IC chip packages, the present invention relates to a communication device used for an IC chip package that performs electrostatic coupling type communication.

[0003]

2. Description of the Related Art An IC chip for performing electrostatic coupling type communication used in the present invention has a terminal for communication, and the terminal is connected to a conductive antenna. It is usually joined to the conductive antenna via a conductive adhesive. In the present invention, IC
A chip and a small area antenna bonded to it, and
The minute label integrated with the conductive adhesive on the antenna will be referred to as a minute antenna medium or a minute antenna label. Since the antenna size of this micro antenna medium is small, the distance from the antenna of the reader / writer, so-called communication distance, is extremely short, and information is recorded, written, and read unless the micro antenna medium is in close contact with the reader / writer. It is very difficult to handle because it cannot be done. Further, in some cases, even if the small area antenna and the reader / writer are brought into close contact with each other, communication is often impossible, which is a problem. Separately from the IC chip and the micro antenna medium provided with the electrostatic antenna layer, a base material such as paper or a plastic film provided with a large area electrostatic antenna layer is prepared, and the micro antenna medium is provided on the antenna medium. A method has been proposed in which an antenna medium is attached so that both electrostatic antenna layers are connected to each other to form an IC chip package in the form of a card or a tag.
That is, according to this method, the communicable distance to the antenna of the reader / writer can be greatly expanded, for example, to several tens of centimeters. Therefore, information can be transmitted in a form where the card or tag is held away from the reader / writer. Recording, writing, and reading can be performed, and the practicability as an IC chip package is significantly improved. In the present invention,
An IC chip mounting body is obtained by joining and mounting this small antenna medium on another antenna having a large area, and a large area antenna to be joined is referred to as an electrostatic antenna J. The electrostatic antenna J is composed of at least one pair of electrostatic antennas J1 and J2. This IC chip mounting body receives a transmission signal from a communication device called a reader / writer and returns the reception signal to the reader / writer.
By this exchange, recording of data in the IC chip,
It is rewritten and erased. The reader / writer is equipped with a transmitting antenna for transmitting a communication signal and a receiving antenna for receiving a received signal. In the present invention, this antenna will be referred to as an electrostatic antenna A. The electrostatic antenna A includes a transmitting antenna At and a receiving antenna Ar.
Composed of.

In recent years, magnetic cards using magnetic recording such as telephone cards, prepaid cards used in transportation such as trains and buses, highway cards used for payment of tolls on expressways, and merchandise cards such as point cards have become extremely popular. It is used in many fields. These magnetic cards are generally polyester substrates with a thickness of 188 μm or 250 μm, mainly polyethylene terephthalate (PE).
A magnetic recording layer containing a magnetic material such as barium ferrite is provided on one surface of T). On the opposite surface of the base material, a unique design matching the card is provided by offset printing or the like. Furthermore, a concealing layer such as silver or white is provided on the upper side of the magnetic recording layer, the clause text, etc. is printed by offset printing, and a heat sensitive layer is provided on one side or both sides, and the amount of money used and the remaining amount etc. Can be recorded at any time with a thermal head.

A rewritable heat-sensitive recording layer which can be repeatedly used is sometimes provided on the surface of the card, and a face photograph or the like is printed by a sublimation transfer method.

However, since the magnetic card itself can easily perform recording, rewriting, and reading on the magnetic recording layer by using the magnetic head, falsification and forgery of the remaining amount of money used can be easily performed by using the magnetic head. be able to. As a countermeasure against this, forgery such as providing two or more magnetic recording layers with different coercive force to record information individually or specially providing a magnetic bar code with a unique magnetic signal that can not be visually distinguished inside the card Countermeasures against alteration have been taken.

However, in order to prevent such magnetic forgery, it is relatively easy to determine the magnetic pattern by obtaining a magnetic head suitable for the magnetic forgery, and it is possible to forge by physically forming the same card. It is a big social problem.

Further, in reading / writing and rewriting of a magnetic card, it is necessary to apply a magnetic field generated from a magnetic head, which is a so-called minute electromagnet, to the card, and recording must be performed in a state close to contact. There was a flaw.

For these reasons, in recent years, an IC carrier that records, reads, and rewrites information in a memory of an IC chip called a non-contact IC card by using a communication device called a reader / writer has been used by JR. It is being used for train commuter passes, bus tickets, subway tickets, etc. This non-contact IC card converts and saves data by a very complicated encryption process, so it is very difficult to grasp the contents even if the data itself is read, and it is a high security forgery. ,
It is difficult to change.

Further, since the memory capacity of the IC chip itself is 100 bytes or more, a large amount of information can be input, and it can be used in a wide range of application environments.

For this non-contact IC card, for example, there is an ISO standard (for example, the physical characteristics of the IC card are standardized by ISO / IEC 14443-1), and the standardization by JIS is also recommended. At present, the physical shape of the card such as thickness is standardized.

However, the thickness of the non-contact IC card is usually 400 μm to 800 μm, and a polyester resin (PET or the like) is used as the base material. The IC card is constructed by etching an antenna with copper or aluminum or winding a conductive wire on a base material, and connecting an inlet with an IC chip bonded by flip chip bonding or the like to a base material such as PET. It can be joined by laminating method,
A resin base material such as ABS is joined by injection molding and punched into a card shape. Therefore, the number of steps is large and the thickness is thick, so that it can be used repeatedly, but the cost per sheet is high.

In the present invention, it is possible to record information on the IC chip in a non-contact manner by the electrostatic coupling method. For the communication method using the electrostatic coupling method, see,
-513518 publication. Since the IC chip is used, it is possible to utilize the memory of the IC chip having an information amount of 100 bytes or more.

An IC card using such an electrostatic coupling system can generally be set at an extremely low cost as compared with a non-contact type IC card having the above-mentioned etching antenna, and for example, as a disposable IC card. Can also be used sufficiently. Communication by the electrostatic coupling method is performed by electrostatically coupling the electrostatic antenna of the IC chip mounting body and the electrostatic antenna of the reader / writer.
However, the IC chip mounting body is often used as an IC card shape or an IC tag having various shapes, and the reader / writer is also required to perform good communication with the IC chip mounting bodies having such various shapes. It becomes a condition.

[0015]

Up to now, there have been no studies on the correlation between the electrostatic antenna of the IC chip mounting body and the electrostatic antenna of the reader / writer. Therefore, it is an object of the present invention to provide an electrostatic antenna of a reader / writer that can obtain good communication characteristics with respect to various antenna shapes of an IC chip mounting body.

[0016]

A communication device for an IC chip mounting body according to the present invention includes at least a pair of IC chip mounting body side electrostatic antennas Jb1 and Jb2 and IC chip mounting body side electrostatic antennas Js1 and Js2, respectively. A communication device equipped with a reader / writer side electrostatic antenna for performing communication with two types of IC chip mounted bodies by an electrostatic coupling method, wherein the reader / writer side electrostatic antenna transmits a communication signal At and an IC chip. The IC chip mounting body side electrostatic antennas Jb1 and Jb2 are formed from a receiving antenna Ar that receives a signal returned from the mounting body.
The distance between the center of gravity of the area of each antenna part of
b, the IC chip mounting body side electrostatic antennas Js1 and Js
Let Ls be the distance between the centers of gravity of the areas of the respective antenna parts of s2 (Lb> Ls), and the antenna arrangement is such that the inter-electrode plate spacing between the transmitting antenna At and the receiving antenna Ar changes, When the maximum value of the distance between the plates is Mm and the minimum value is Mn, Mm = 1.0 × Lb, Mn = 0.
Equipped with a reader / writer electrostatic antenna that is 4 × Ls.

More preferably, the communication device for an IC chip mounting body according to the present invention is provided with at least two types of IC chip mounting body side electrostatic antennas Jb1 and Jb2 and IC chip mounting body side electrostatic antennas Js1 and Js2, respectively. A communication device having a reader / writer side electrostatic antenna for performing communication with the IC chip mounted body according to an electrostatic coupling method, wherein the reader / writer side electrostatic antenna transmits a communication signal and an IC chip mounted body The electrostatic antennas Jb1 and Jb2 formed on the IC chip mounting body side, which are formed from a receiving antenna Ar for receiving a signal returned from
The distance between the center of gravity of the area of each antenna part of
b, the IC chip mounting body side electrostatic antennas Js1 and Js
Let Ls be the distance between the centers of gravity of the areas of the respective antenna portions of s2, and let (Lb> Ls), and let the maximum value of the distance between the electrode plates between the transmitting antenna At and the receiving antenna Ar be M.
m, Mm = 0.8 × Lb, where M is the minimum value,
A reader / writer side electrostatic antenna with Mn = 0.5 × Ls may be provided.

In the communication device for an IC chip package according to the present invention, the maximum value is Mm and / or the minimum value is Mm.
A reader / writer-side electrostatic antenna in which the distance between the electrode plates changes may be provided so that n is provided at a plurality of positions of at least two or more.

In the communication device for an IC chip package according to the present invention, the transmitting antenna At and the receiving antenna A are further arranged so that the change in the inter-electrode plate distance becomes smooth.
It is preferable that at least one of the opposite edges of the r bipolar plate is formed by a smooth line.

In the communication device for an IC chip package according to the present invention, the value of Lb of the IC chip package is 50 cm.
It is below, and the value of Ls is preferably 4 mm or more.

[0021]

1 (A) and 1 (B) show an example of an IC chip mounting body in which the above-mentioned minute antenna medium is joined to a large area antenna. The antenna medium 2 in this IC chip mounting body 1 has a pair of large area antenna layers J1 and J2 [hatched areas in FIG. 1 (A)] on the upper surface of a base material 21 such as paper or plastic film. The material 21 is provided so as not to be connected to each other at a narrow interval in the central portion. The IC chip mounting body 1 is attached to the upper surface 21a of the antenna medium 2 with the minute antenna medium 3 straddling between the large-area antenna layers J1 and J2. Then, the minute antenna medium 3 is formed as shown in FIG.
As shown in (B), a base material 3 such as a plastic film
A pair of small-area antenna layers 32, 32 [areas shaded in FIG. 2 (A)] on the lower surface side (adhesive surface side with respect to the antenna medium 2) of 1 are narrow spaces in the central portion of the base material 31. Is provided so as not to be connected to each other, and the IC chip 3 is provided so as to extend between the small area antenna layers 32, 32.
3 and the terminals 33a, 33a of the IC chip are arranged on one small area antenna layer 3 via the conductive adhesive layer 34.
2 is provided, and a non-conductive adhesive layer 35 having a bonding strength with respect to the antenna medium 2 is provided in the peripheral portion of the lower surface, and the antenna medium 2 is provided in the central portion of each small area antenna layer 32. A conductive adhesive layer 36 that is responsible for electrical coupling with the corresponding large-area antenna layers J1 and J2 is provided. Here, the IC chip needs to be electrically connected or electromagnetically coupled to the small-area antenna layer, but as the conductive adhesive layer 34, specifically, ACF (anisotropic conductive film) or A conductive adhesive such as ACP (anisotropic conductive paste) is used.

In addition, with the above-mentioned simple antenna medium alone,
Communication distance with reader / writer is extremely short. For example, if the antennas with a small area of 15 mm x 10 mm are arranged in parallel at a distance of 1 mm, the communication distance is 5 mm or less, and communication is not possible unless the reader / writer is in close contact.
Depending on the relative positional relationship with the reader / writer antenna, if the deviation from the center point of the reader / writer antenna is large, communication may not be possible at all. The size of the micro antenna medium is 5m to make it easy to manufacture.
It is preferably about m to 20 mm square.

In the IC chip mounting body of the present invention, a micro antenna medium having an IC chip and a micro antenna is once attached to an antenna medium having an antenna of an appropriate size. At this point it is common to store information in the memory of the IC. Then, if necessary, combine this antenna label with a larger area antenna to
When used as a C label or the like, it becomes possible to secure a sufficient communication distance.

In order to perform stable IC chip communication, it is necessary to appropriately increase the size of the tag antenna. The size of the reader / writer antenna is 10 mm ~
The size is about 500 mm square, and an antenna size of about 5 mm to 500 mm square is desirable for stable communication with this antenna. If it is smaller than this, the communication distance is not extremely short and it is not practical, and if it is larger than this, the card cost becomes high, and handling when using the card becomes difficult.

In the above antenna layer, a conductive layer having a thickness of 0.5 μm to 20 μm having conductivity is used for paper, synthetic paper, PET.
It is provided by printing or printing on a substrate such as a synthetic resin film. Such base materials are sold by Mitsubishi Plastics, Teijin DuPont, Taihei Kagaku, and the like. Now, the material used for the conductive layer is mainly composed of a conductive substance and a binder. The thickness of the substrate is not particularly limited as long as it can be used as cards, but is preferably 1 μm to 500 μm. Screen printing, flexographic printing,
The conductive layer is formed in a predetermined pattern by a printing method such as offset printing or a printing method such as inkjet printing, thermal transfer printing, laser printing and the like. In the case of the electrostatic coupling method, the antenna pattern may be, for example, two rectangles arranged side by side at regular intervals.
It is necessary to construct one or more patterns, and each antenna is bonded to the small area antenna. Of course, even if two or more antenna patterns are provided, there is no problem as long as it does not affect communication.

Naturally, the size of the large area antenna is required to fit in the shape of cards, tags and the like. The large area antenna needs to be electrostatically coupled to the small area antenna provided in the minute antenna medium for communication. The small area antennas are usually divided and provided according to the number of bonding terminals of the IC chip, and generally, the number of bonding terminals is two.
Since it is a single piece, the small area antenna is divided into two. Therefore, in order to electrostatically couple these small area antennas, the large area antenna provided on the base material is often divided into two and used. Therefore, the shape of the electrostatic antenna is approximately the size of the card divided into two, and the two divided antennas are provided apart from each other so as not to be joined at an interval of 1 to 10 mm. The size of the card is, for example,
In the case of JISII type, it will be about 54 mm x 86 mm. Therefore, it is preferable to set the size of the antenna divided into two, 54 mm × 43 mm, which is subtracted by the antenna interval, in order to increase the antenna area and improve the communication distance. In addition, since the large area antenna itself can be made to have a heat-sealing property, the antenna part is not limited to the size of the card when the sheet is heat-molded, and when the card is formed in the subsequent step, the antenna can be used. So that they can be separated individually,
It is also possible to print in a continuous sheet form.
Of course, the present invention is not limited to these cards, and it goes without saying that the dimensions of the electrostatic antenna range from about 5 mm square to about 500 mm square. The communication distance with the reader / writer also depends on the antenna shape of the reader / writer, but generally the larger the area of the electrostatic antenna, the larger the communication distance, and it is necessary to appropriately select the antenna shape depending on the application.

In the present invention, it is recommended that the substrate be at least one selected from paper, synthetic paper, polyester, polyimide, polyamide, polycarbonate and ABS resin.

The ink needs to be liquefied for use in printing or for printing to form an electrostatic antenna, which means that the ink material is dissolved, mixed, dispersed, or heated and melted in a solvent. , By using an attritor, ball mill, sand mill, roll mill, or the like, or by kneading. At this time, a powdery material such as conductive carbon black is finely pulverized and dispersed to a predetermined particle size. As the average particle size of the conductive material,
Needless to say, it is necessary to suppress the thickness to the thickness of the printing layer or the printing layer. Conductive carbon black and fine particles of gold or silver may be hard to disperse to a predetermined average particle diameter in a state where the particles themselves are hard and include a binder. Therefore, in many cases, the conductive material is pre-dispersed in a predetermined solvent in advance by a roll mill or the like to prepare a master batch, and then a predetermined amount is mixed with a solution in which the binder component is dissolved.

The conductivity of the conductive antenna layer is defined by its surface resistivity. This surface resistivity is generally assumed to be a rectangular parallelepiped, and the length of opposing sides to which electrodes are applied is W [ mm] and the distance between the two sides is L
[mm] and the measured resistance between the electrodes is R [Ω], it is expressed by surface resistivity ρs = R × W ÷ L. In the present invention, in order to obtain sufficient communication characteristics. The surface resistivity of the conductive layer is preferably 1Ω / □ to 10000Ω / □. As described above, in the electrostatic coupling method, in order to match the surface resistivity with the above range, it is necessary to mix the conductive antenna ink while preparing the conductive agent and the binder component. Usually, the conductive agent content is 5 to 45 in the solid content of the ink.
It is desirable that the amount is about wt%.

The method of forming the conductive antenna is selected from general printing methods such as screen printing, flexographic printing, offset printing and gravure printing, and printing methods such as ink jet printing and thermal transfer printing. For example, in screen printing, a base material having a predetermined shape, generally a sheet-shaped base material 1 and a screen gauze using a predetermined mesh material, is printed in a predetermined pattern. The number of meshes in this case is usually
225 mesh to 420 mesh is used, and when solid-printing an antenna, a bias mesh in which the printing direction of the squeegee and the mesh direction of the mesh are inclined is often used. The printing thickness can be adjusted by the number of meshes on the screen, the thickness of the photosensitive emulsion, the squeegee transportation speed during printing, and the like. The thickness of the conductive antenna layer generally tends to lower the surface low efficiency as the antenna thickness increases, but there is a limit to the thickness that can be formed by printing or printing, and the antenna thickness is usually 0.5 μm to 20 μm is desirable. When increasing the thickness, printing may be performed multiple times.

By the way, it is usual to record an image by printing or printing on the side which becomes the card surface such as the base material 21 and the base material 31. Printing is performed by a normal printing method such as offset printing, gravure printing, screen printing. In printing, a recording layer such as an inkjet print recording layer, a sublimation transfer print recording layer, and a heat-sensitive print recording layer may be provided on the surface of the base material. The base material is often laminated in a sheet form. In this case, the recording layer is previously formed on the surface of the base material by a coating method or the like.
In sublimation transfer printing, a so-called intermediate layer transfer method is also used in which a recording intermediate layer is provided and a sublimation-transferred intermediate layer is attached to the card when the card is printed.

In the present invention, base materials such as the base material 21 and the base material 31 are often handled in a sheet form. For example,
If the card size is the above-mentioned JIS II type, prepare a base material with a sheet size that can accommodate about 5 rows x 6 rows, for example, a sheet size of about 375 mm x 475 mm, and perform surface printing and conductive antenna printing. After that, a small antenna label is attached, the base materials are overlaid, and the above-mentioned molding method is used. The sheet laminated body after molding is punched into a card size using a card puncher or the like to obtain a card. This card puncher is sold, for example, by Isel.

In the present invention, the inter-antenna distance of the electrostatic antenna of the reader / writer is made appropriate in order to ensure good communication in correspondence with the various types of IC chip package side electrostatic antennas. In this case, the IC chip mounting body side electrostatic antenna J is composed of a pair of mounting body side electrostatic antennas J1 and J2, and the reader / writer side electrostatic antenna transmits a communication signal (excitation) antenna At and the IC chip mounting body. And a mounting-antenna-side electrostatic antenna J1, which is formed from a receiving antenna Ar for receiving a signal returned from
The distance between the center of gravity points of the area portions of the respective antenna portions of J2 is defined as L, and this distance is hereinafter abbreviated as the mounting body side antenna distance. The transmitting antenna At and the receiving antenna Ar
When the distance between the electrode plates is M, the distance between the electrode plates of the transmitting antenna At and the receiving antenna Ar is abbreviated as the distance between the transmitting and receiving antennas on the communication device side.

Generally, when the IC chip mounting body is an IC card, it is a JIS size rectangle of about 54 mm × 86 mm. The communication characteristics for an electrostatic antenna of this size were obtained as follows. In this case, the size of the transmitting antenna At and the receiving antenna Ar of the reader / writer is set to 60 mm square, and the distance between the pole plates between the antennas is set to M. While the M is changed appropriately, the IC
The distance L between the centers of gravity of the area portions of the antenna parts of the chip mounting body side electrostatic antennas J1 and J2 is set to 20,35,50,1.
The maximum communication distance with respect to each IC chip mounting body having a size of 00 mm was obtained. The result is shown in FIG. Figure 3 is I
Between the shortest pole plates of the transmission antenna At and the reception antenna Ar on the reader / writer side with respect to the IC chip mounting body in which the distance L between the center points of the respective antenna portions of the C chip mounting side electrostatic antennas J1 and J2 is appropriately changed. The graph showing the maximum communication distance with respect to the distance Mmin. I at this time
The arrangement of the electrostatic antennas J1 and J2 of the C mounting body is shown in FIG. The dimensions of the electrostatic antennas J1 and J2 are shown in Table 1 below.
And a square antenna having the same size as the mounting body side antenna distance L is combined. Further, FIG. 5 shows the arrangement of the transmitting antenna At and the receiving antenna Ar on the reader / writer side and the shortest interelectrode distance Mmin.

From the graph of FIG. 3, it can be seen that there is an optimum value of the distance M between the communication device side transmitting / receiving antenna distances that gives the maximum communication distance for each mounting body side antenna distance L.

FIG. 6 is a plot of this maximum communication distance with respect to the mounting body-side antenna distance L. Therefore, when the distance between the transmitting and receiving antennas on the communication device side is optimally designed, it is considered that the maximum possible communication distance with respect to the mounting body side antenna distance L is shown in FIG. FIG. 6 is a graph showing the relationship between the distance L between the antennas on the mounting body side and the maximum communication distance.

From FIG. 6, it can be seen that the maximum communication distance increases as the distance L between the mounting body side antennas increases. Here, focusing on the relationship between the mounting body-side antenna distance L indicating the maximum communication distance and the communication-device-side transmitting / receiving antenna distance M, the following table 1 is obtained. Table 1 shows the relationship between the mounting body-side antenna distance L indicating the maximum communication distance and the communication device-side transmitting / receiving antenna distance M.

[0038]

[Table 1]

From this table, it can be seen that the distance M between the communication device side transmitting / receiving antennas, which indicates the maximum communication distance, is in the range of 50% to 80% of the mounting body side antenna distance L. From now on, the distance M between the transmitting and receiving antennas on the communication device side should be widened,
It is understood that by changing the distance between the communication device side transmitting / receiving antennas within this range, it becomes possible to optimally communicate with the mounting bodies having various different mounting body side antenna distances L. That is, the distance between the transmitting and receiving antennas on the communication device side is 40% to 100% of the distance L between the mounting body side antennas, and more preferably 50%, under the condition that the maximum communication distance can be obtained and the change range is narrowed as much as possible. It is preferable to set it so as to change within the range of -80%. The condition that the change range is narrowed leads to making the communication device side antenna as compact as possible.

In the present invention, the pair of mounting body side electrostatic antennas Jb1 and Jb2 and the mounting body side electrostatic antennas Js1 and Js.
A communication device having a reader / writer side electrostatic antenna for performing communication by electrostatic coupling with at least two types of IC chip mounted bodies each having s2, wherein the reader / writer side electrostatic antenna transmits a communication signal. (excitation)
The antenna At and the receiving antenna Ar for receiving a signal returned from the IC chip mounting body are formed, and the distance between the centers of gravity of the antenna parts of the mounting body side electrostatic antennas Jb1 and Jb2 is Lb, and Let Ls be the distance between the center of gravity points of the areas of the antenna parts of the mounting body side electrostatic antennas Js1 and Js2, and (Lb> Ls), and the maximum distance between the electrode plates between the transmitting antenna At and the receiving antenna Ar. When the value is Mm and the minimum value is Mn, Mm
= 1.0 × Lb, Mn = 0.4 × Ls, and a reader / writer side electrostatic antenna is provided,
More preferably, Mm = 0.8 × Lb, Mn = 0.5
The reader / writer side electrostatic antenna with × Ls is used.
Further, the distance M between the transmitting and receiving antennas of the electrostatic antenna of the reader / writer is adjusted to match the antenna shape of the IC chip package to be used within the above range according to a plurality of types of IC chip packages to be used. The feature is that a plurality of gaps are formed.

Further, at least one of opposite edges of both polar plates of the transmitting antenna At and the receiving antenna Ar is constituted by a smooth line so that the change of the distance between the polar plates becomes smooth. Forming an electrostatic antenna on the reader / writer side that is characterized in that the distance L between the mounting body side antennas varies with the width of this range.
It is convenient because it can correspond to. However, the relative position of the electrostatic antenna that can secure the optimum communication distance is naturally limited. It is recommended to use these antennas properly depending on the application.

Generally, the size of the electrostatic antenna of the IC chip mounting body is in the range of about 10 mm to 500 mm, so that the value of L of the IC chip mounting body is 4 mm≤L≤50c.
It is practical to be m.

The reader / writer antenna has a thickness of 0.
A conductive layer such as copper foil or aluminum foil with a thickness of about 0.01 mm to 1 mm is laminated on a substrate used for general-purpose electronic circuits such as a phenol resin or glass epoxy resin substrate with a thickness of about 2 mm to 5 mm, and etching is performed. It is used after being patterned into a predetermined shape by the method. In order to secure the communication distance, a multilayer laminated board provided with a plurality of conductive layers may be used. Further, in order to reduce the influence of noise, it is also possible to install a ground electrode at the position of the board to which the electric circuit is connected.

[0044]

The present invention will be described in more detail with reference to the following examples, but of course the present invention is not limited thereto. (Embodiment 1) An explanation will be given with reference to the minute antenna medium and the IC mounting body shown in FIGS. In the IC chip mounting body 1, the minute antenna medium 3 to which the IC chip is joined is joined to the antenna medium 2 provided with a conductive antenna by screen printing to form a punched card. Formation of minute antenna medium: Paper base material 3 with a thickness of 100 μm
Conductive antenna 32 with a size of 10 mm × 10 mm on one
32 (compound 1 below) are provided in parallel by printing at intervals of 5 mm, and two terminals of an IC chip of 1.5 mm x 2.0 mm size 3
3a, 33a are ACP (anisotropic conductive paste) layers 34,
By 34, it joined to both conductive antennas 32 and 32. Further, a conductive adhesive layer 36 and an adhesive layer 35 containing fine silver particles were applied and formed on the two conductive antenna portions, and this was used as the fine antenna medium 3. The surface resistance of the micro antenna was 900 Ω / □.

[Formulation 1] Conductive carbon black (Ketjen Black manufactured by Lion) 15 parts by weight Polyester resin (Vylon manufactured by Toyobo) 20 parts by weight Nonionic dispersant 2 parts by weight Cyclohexanone 20 parts by weight Isophorone 40 parts by weight Antenna medium Formation: P having a thickness of 200 μm as the base material 21
Using ETG (manufactured by Mitsubishi Plastics Co., Ltd.), a conductive ink of the following [Formulation 2] was printed by screen printing. Base material 21
Sheet size is 375mm × 475mm.
ISII size cards are arranged in 5 rows x 6 rows.
A semi-automatic printing machine (manufactured by Tokai Shoji Co., Ltd.) was used as the screen printing machine, and a 350 mesh bias gauze was used as the screen printing machine. After printing the electrostatic antenna layer by screen printing, it was dried at 55 ° C. for 30 minutes by a dryer. The surface resistance of the electrostatic antennas J1 and J2 after this was 3000 Ω / □. [Compound 2]: Nonionic dispersant mixed with conductive ink 2 parts by weight Conductive carbon black (Ketjen Black manufactured by Lion) 32 parts by weight Polyester resin (Byron manufactured by Toyobo Co., Ltd., softening point 98 ° C) 49 parts by weight Cyclohexanone 30 Parts by weight Isophorone 40 parts by weight

Preparation of conductive layer ink: A resin is added to a solvent and stirred to form a uniform resin liquid, and solid components such as nonionic dispersant, conductive carbon black and resin are added and stirred to form a uniform dispersion. Dispersed with a lighter to obtain a uniform mixed liquid ink. The shapes of the electrostatic antennas J1 and J2 are
As shown in Table 2 below. Table 2 shows the dimensions of the electrostatic antenna and the inter-antenna distance L of each IC chip mounting body used in the examples. The shape of the electrostatic antenna manufactured in each example was exactly the same as the plan view shown in FIG.

[0047]

[Table 2]

Reader / Writer Substrate: A glass epoxy substrate having a thickness of 0.5 mm was laminated with a copper foil having a thickness of 30 μm to form a communication device side transmitting / receiving antenna having a shape shown in FIG. 7 by an etching method. FIG. 7 is a plan view of the communication device-side transmitting / receiving antenna used in the first embodiment. The maximum communication distance for each IC chip package is shown in Table 3 below. Table 3 is a table showing the relationship between the distance L between the antennas on the mounting body side and the maximum communication distance.

[0049]

[Table 3]

The M optimum design expected maximum communication distance is the maximum communication distance expected from the above-mentioned FIG. 6 when the communication device side transmitting / receiving antenna distance M is optimally designed. The measured value is close to the expected maximum communication distance, and it can be seen that good communication characteristics can be secured for IC chip mounted bodies having various antenna dimensions. That is, it is considered that the communication device side transmitter / receiver antenna distance M can be designed in a state close to the optimum.

(Example 2) In the same manner as in Example 1, the IC chip mounting body shown in the following Table 4 was prepared.

[0052]

[Table 4]

The antennas shown in FIG. 8 were prepared for these IC chip mounting bodies, and the maximum communication distance for each IC chip mounting body when using this antenna is shown in Table 5 below.
It became like. FIG. 8 is a plan view of the communication device side transmitting / receiving antenna used in the second embodiment.

[0054]

[Table 5]

From the above results, it can be seen that good communication characteristics can be ensured for IC chip mounted bodies having various antenna dimensions. That is, it is considered that the communication device side transmitter / receiver antenna distance M can be designed in a state close to the optimum.

[0056]

As described above in detail, under the condition that the variation range of the distance between the communication device side transmitting / receiving antennas is narrowed as much as possible, the communication device side within a certain range with respect to the mounting body side antenna distance L. By designing to change the distance between the transmitting and receiving antennas, the maximum communication distance can be obtained for the IC chip mounting bodies having various antenna dimensions. The condition that the change range is narrowed leads to making the communication device side transmitting / receiving antenna as compact as possible.

[Brief description of drawings]

FIG. 1 shows a configuration example of an IC chip package used in the present invention, in which (A) is a plan view and (B) is B-in (A).
The longitudinal cross-sectional view which shows the cross section in a B line typically.

2A and 2B show a configuration example of a minute antenna medium used in the IC chip mounting body, FIG. 2A is a bottom view, and FIG. 2B is a cross-sectional view taken along line BB in FIG. 2A. Vertical sectional view.

FIG. 3 is a distance L between the center of gravity points of the area portions of the respective antenna portions of the IC chip mounted body side electrostatic antennas J1 and J2
6 is a graph showing the maximum communication distance with respect to the shortest interelectrode distance Mmin between the transmission antenna At and the reception antenna Ar on the reader / writer side with respect to the IC chip mounting body in which is appropriately changed.

FIG. 4 is a plan view showing an arrangement of electrostatic antennas J1 and J2 of an IC mounted body.

FIG. 5 is a plan view showing the arrangement of a transmission antenna At and a reception antenna Ar on the reader / writer side.

FIG. 6 is a graph showing the relationship between the mounting body side antenna distance L and the maximum communication distance.

FIG. 7 is a plan view of the communication device side transmitting / receiving antenna used in the first embodiment.

FIG. 8 is a plan view of a communication device side transmitting / receiving antenna used in a second embodiment.

[Explanation of symbols]

1 IC chip assembly J1, J2 Mounting side electrostatic antenna At transmitting antenna Ar receiving antenna

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Yuji Bando             2 Oji Paper Co., Ltd. 1 Tatsumi-cho, Anan City, Tokushima Prefecture             Ceremony Company Card Media Office F-term (reference) 5B035 BA05 BB09 CA23                 5B058 CA15 KA02 KA24 YA20                 5J047 AA01 AA02 AA04 AA07 AA12                       AB07 AB13 EF04 EF05

Claims (5)

[Claims] 1. A pair of IC chip mounted body side electrostatic antennas J
b1, Jb2 and IC chip mounting body side electrostatic antenna J
What is claimed is: 1. A communication device comprising a reader / writer-side electrostatic antenna for performing communication by electrostatic coupling with at least two types of IC chip mounting bodies each including s1 and Js2, wherein the reader / writer-side electrostatic antenna transmits a communication signal. The IC is formed by a transmitting antenna At for transmitting and a receiving antenna Ar for receiving a signal returned from the IC chip mounting body.
Let Lb be the distance between the center of gravity points of the areas of the antenna parts of the chip mounting body side electrostatic antennas Jb1 and Jb2, and the distance between the center of gravity points of the area of the respective antenna parts of the IC chip mounting side electrostatic antennas Js1 and Js2. Is Ls, and (Lb> Ls), the antenna arrangement is such that the distance between the electrode plates between the transmitting antenna At and the receiving antenna Ar changes, and the maximum value of the distance between the electrode plates is Mm and the minimum value is Mn. Where, Mm = 1.0 × Lb, Mn = 0.4 × Ls
A communication device equipped with a reader / writer side electrostatic antenna. 2. A pair of IC chip mounted body side electrostatic antennas J
b1, Jb2 and IC chip mounting body side electrostatic antenna J
What is claimed is: 1. A communication device comprising a reader / writer-side electrostatic antenna for performing communication by electrostatic coupling with at least two types of IC chip mounting bodies each including s1 and Js2, wherein the reader / writer-side electrostatic antenna transmits a communication signal. The IC is formed by a transmitting antenna At for transmitting and a receiving antenna Ar for receiving a signal returned from the IC chip mounting body.
Let Lb be the distance between the center of gravity points of the areas of the antenna parts of the chip mounting body side electrostatic antennas Jb1 and Jb2, and the distance between the center of gravity points of the area of the respective antenna parts of the IC chip mounting side electrostatic antennas Js1 and Js2. Is Ls, and (Lb> Ls), Mm = 0.8 × Lb, where Mm is the maximum value and Mn is the minimum value of the distance between the electrode plates between the transmitting antenna At and the receiving antenna Ar. Mn = 0.
A communication device equipped with a reader / writer-side electrostatic antenna that is 5 × Ls. 3. A reader / writer-side electrostatic antenna in which the distance between the electrode plates changes so that the maximum value is Mm and / or the minimum value is Mn at a plurality of positions of at least two or more. 2. The communication device according to item 2. 4. At least one of the opposite edges of both polar plates of the transmitting antenna At and the receiving antenna Ar is constituted by a smooth line so that the change in the distance between the polar plates becomes smooth. Claims 1 to 1 characterized
The communication device according to claim 3. 5. The value of Lb of the IC chip mounting body is 50 c
The communication device according to any one of claims 1 to 4, wherein m is less than or equal to m and the value of Ls is greater than or equal to 4 mm.