JP4043622B2 - Printed book with non-contact IC storage media - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a booklet-like printed material having a non-contact IC storage medium in which a non-contact IC module capable of performing non-contact communication with an external processing apparatus is built.
[0002]
[Prior art]
Conventionally, for example, a non-contact type IC card is generally known as a non-contact IC storage medium that performs non-contact communication with an external processing device. These non-contact type IC cards are usually made of plastic, for example, a data communication coil that performs non-contact input / output of signals inside a 0.76 mm thick card made of a polyvinyl chloride base material and the data In general, a non-contact IC card is configured by incorporating a non-contact IC module including an IC chip (semiconductor integrated circuit) connected to a communication coil.
[0003]
Since these non-contact type IC cards are usually made of plastic, the card base is required to be processed and molded depending on the shape of the built-in non-contact IC module. It has also become a factor that hinders trends in various industries trying to improve services by introducing customer service systems.
[0004]
Recently, it has become possible to reduce the thickness of a non-contact IC module, and a non-contact IC card having a thickness of, for example, 0.25 mm has been developed using a polyethylene terephthalate base as a card base. The non-contact type IC card as a contact IC storage medium is made of plastic, so it is not possible to enter or print various information and data or to print with a printer, etc. In addition, there is a problem that it is not suitable for various booklet printed materials such as passbooks and passports that require printing.
[0005]
For this reason, in order to provide non-contact IC storage means for booklet-like printed matter, a front cover or a back cover is formed from a resin sheet containing a non-contact IC module, and a booklet is placed between the front cover and the back cover. A booklet-like printed material has been developed and publicly known so that text sheets can be bound and written on a paper text sheet.
However, these booklet-like printed materials usually have a structure in which a non-contact IC module is built in the vicinity of the center of the resin sheet provided on the surface side of the booklet-like printed material. When it is used for a bankbook etc., pressure is applied to the built-in IC chip or non-contact IC module by a feed roller that runs near the center of the bankbook during printer printing by an ATM device (automatic deposit / withdrawal device). In addition, there is a risk of breaking the IC chip and the non-contact IC module, which is not preferable.
[0006]
In addition, in order to incorporate a non-contact IC module on the front cover or back cover of a booklet-like printed material, the manufacturing cost increases, so it is also necessary to use this for a printed material that cannot be reused such as a passbook. There is a lot of waste and problems.
[0007]
[Problems to be solved by the invention]
The present invention provides a booklet-like printed material that can be provided with a non-contact IC function with less resource and lower manufacturing cost than conventional products, and in particular, performs a printing process using a printer printing device such as a bankbook. Even when it is used for booklet-like printed matter for applications where it is necessary, it is configured so as not to be affected as much as possible by the pressure on the IC chip of the non-contact IC module provided on the booklet-like printed matter by the feed roller in the printer printing device. A non-contact IC that is designed so that the IC chip is not pushed by the body paper that is bound inside the booklet-like printed matter even when the booklet-like printed matter is bound, and the cause of failure of the IC chip is reduced. A booklet-like printed material having a storage medium is provided.
[0008]
[Means for Solving the Problems]
In order to achieve the above-mentioned object, a booklet-like printed material having a non-contact IC storage medium according to the present invention includes a non-contact IC storage medium in which a non-contact IC module is built in between two sheets that are superposed and bonded. A booklet-like printed material having a non-contact IC storage medium affixed to the front cover or back cover of the book-like printed material, the non-contact IC storage medium being near the corner of the inner surface of the front cover or back cover When the booklet-like printed material is bound to the area and bound to the booklet-like printed matter, the IC chip portion built in the non-contact IC storage medium attached to the booklet-like printed matter and the text sheet bound to the inside of the booklet-like printed matter In order not to overlap with each other, a notch is provided in a region near the corner of the text sheet .
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described in detail with reference to the drawings.
1 is a plan view showing a state in which the upper sheet is removed from the non-contact IC storage medium before die cutting, FIG. 2 is a cross-sectional view of FIG. 1A-A, and FIG. 3 is an adhesive layer on the non-contact IC storage medium of FIG. FIG. 4 is a cross-sectional view showing a state in which a release paper is provided, FIG. 4 is a cross-sectional view of a non-contact IC storage medium that is die-cut from the non-contact IC storage medium before die-cutting in FIG. 3, and FIG. FIG. 6 is a cross-sectional view showing a state in which various types of non-contact IC modules are built in, FIG. 6 is a cross-sectional view of a non-contact IC storage medium that is die-cut from a non-contact IC storage medium before die-cutting in FIG. FIG. 8 is a perspective view showing a state in which a non-contact IC storage medium is pasted on a booklet-like printed material according to the present invention, FIG. 8 is a cross-sectional view taken along line BB of FIG. 5, and FIG. FIG. 10 is a perspective view showing a state in which a notch is provided, and FIG. Perspective view showing a state polymerized on the back cover side of the affixed IC storage medium, FIG. 11 is a plan view showing a state in which binding of the booklet-like printed material in the present invention.
[0013]
As shown in FIGS. 1 and 2, the non-contact IC storage medium 1 used in the present invention is formed by incorporating a non-contact IC module 5 between two sheets 2a and 2b superposed and bonded. Yes.
The non-contact IC module 5 includes a non-contact IC chip 3 and a reception / transmission coil 4 that performs transmission / reception of signals connected to the IC chip 3 in a non-contact manner.
[0014]
There are various configurations of the non-contact IC module 5. For example, a coil printing 4 a is applied as a transmission / reception coil 4 using, for example, conductive ink on a polyethylene terephthalate sheet 2 b having a thickness of about 80 μm as shown in FIG. In addition, the portion where the conductive ink intersects is covered with the insulating ink on the coil print 4a made of the conductive ink, and the coil print 4a made of the conductive ink is applied thereon to form a loop-shaped transmission / reception. The coil 4 is formed.
The number of turns of the receiving / transmitting coil 4 formed in a loop shape by the coil printing 4a with conductive ink is suitably 3-5 turns.
The width of the coil print 4a is preferably about 1 mm.
[0015]
When the receiving / transmitting coil 4 is formed by applying coil printing 4a with conductive ink, an anisotropy having a thickness of about 20 μm is formed below the non-contact IC chip 3 (for example, having a thickness of about 50 μm). By providing the conductive sheet 6, the IC chip 3 and the coil printing 4a portion of the conductive ink are connected.
Then, an adhesive 7 is applied onto the sheet 2b provided with the non-contact IC module 5 on the upper side as shown in FIG. 2, and a polyethylene terephthalate sheet 2a having a thickness of, for example, about 80 μm is overlaid and bonded. Thus, the non-contact IC storage medium 1 in a state before being punched is manufactured.
Next, as shown in FIG. 3, after the adhesive 9 is applied to the lower surface side of the sheet 2b, the release paper 10 is bonded, or the release paper 10 coated with the adhesive 9 is applied to the sheet 2b. Bond to the bottom side.
Then, a non-contact IC storage medium seal 1a as shown in FIG. 4 is manufactured by punching from a punching line 8 having a desired size (for example, 2 cm in length and 3 cm in width).
[0016]
Further, as the receiving / transmitting coil 4 of the non-contact IC module 5, a coated copper wire 4b may be used instead of the coil printing 4a using the conductive ink described above.
As an example of the form using the coated copper wire 4b for the transmission / reception coil 4, as shown in FIG. 5 and FIG. 6, a non-contact IC chip 3 (for example, having a thickness of about 50 μm) and a coated copper wire 4b (for example, Then, a non-contact IC module 5 is formed by connecting a device having a diameter of about 50 μm and a loop shape of about 4 turns).
For example, the non-contact IC module 5 is sandwiched between two sheets 2a and 2b made of resin-impregnated paper having a thickness of about 100 μm, and adhesives 7a and 7b applied to the inner surfaces of the respective sheets 2a and 2b. Thus, the non-contact IC storage medium 1 in a state before being punched is manufactured by bonding and integrating.
[0017]
Next, as shown in FIG. 5, after the adhesive 9 is applied to the lower surface side of the sheet 2b, the release paper 10 is bonded, or the release paper 10 to which the adhesive 9 has been applied is applied to the sheet 2b. Bond to the bottom side.
Then, a non-contact IC storage medium seal 1a as shown in FIG. 6 is manufactured by punching from a punching line 8 having a desired size (for example, 2 cm in length and 3 cm in width).
[0018]
Further, the non-contact IC module 5 may be built in the non-contact IC storage medium by filling and curing between the sheets 2a and 2b using a resin such as a thermoplastic resin instead of the adhesive.
Then, the non-contact IC storage medium 1 is prepared in a state where the adhesive 9 is previously applied to the lower surface side of the sheet 2b and the release paper 10 is not bonded, and it is necessary to apply it to the booklet printed matter. The pressure-sensitive adhesive 9 may be applied to the lower surface side of the sheet 2b and attached to a desired position of the booklet-like printed material.
[0019]
The first invention in the present invention is characterized in that a non-contact IC storage medium is pasted on the front cover 11a or the back cover 11b of the booklet-like printed matter 11, and FIG. The structure which affixed the non-contact IC storage medium 1 to the inner surface is shown.
Usually, the booklet-like printed material is composed of a front cover 11a and a back cover 11b, and a text sheet 11c provided between the front cover 11a and the back cover 11b. When the contact IC storage medium 1 is attached, the non-contact IC storage medium 1 is bent when turning the body paper 11c, and excessive stress is applied to the built-in non-contact IC module 5, which causes a failure. There is a risk.
In addition, since the normal text sheet 11c uses a thin sheet, if the non-contact IC storage medium 1 is attached, there is a risk of causing damage such as tearing of the sheet during use.
[0020]
According to the first invention, the non-contact IC storage medium 1 is attached to a desired position on the front or back surface of the front cover 11a or the back cover 11b in accordance with the intended use of the booklet-like printed matter 11, The form can be adjusted.
In particular, when the non-contact IC storage medium 1 is affixed to the surface of the front cover 11a or the back cover 11b, a desired print pattern or character information may be printed on the surface of the sheet 2a.
[0021]
Next, according to a second aspect of the present invention, the non-contact IC storage medium 1 is affixed to a region near the corners on the inner surface of the front cover 11a or the back cover 11b of the booklet-like printed matter 11 as shown in FIG. It is made.
In the case where the booklet-like printed material 11 is a medium used for the printer printing process of an ATM device such as a passbook, a non-contact IC module built in by a feed roller that runs near the center of the passbook There is a risk of damage to the IC chip or the non-contact IC module due to pressure applied by the influence.
Accordingly, by adhering the non-contact IC storage medium 1 to the area near the corners on the inner surface of the front cover 11a or the back cover 11b of the booklet-like printed matter 11, adverse effects due to these feed rollers can be avoided.
[0022]
However, since the non-contact IC storage medium 1 is configured by sandwiching the IC chip 3 between the two sheets 2a and 2b, the sheet 2a and 2b of the part incorporating the IC chip 3 is pushed outward, When the thickness of a part of the non-contact IC storage medium 1 is actually increased to about 50 μm and the non-contact IC storage medium 1 is attached to the front cover 11a or the back cover 11b of the booklet-like printed material 11, as shown in FIG. The surface in which the IC chip 3 is built is swollen.
When the booklet-like printed matter 11 is bound in this state, there is a risk that the IC chip 3 is pressed against the body of paper 11c bound especially inside the booklet-like printed matter 11 and pressure is applied to cause damage or failure.
[0023]
Therefore, as shown in FIG. 9, the third invention in the present invention is to attach the non-contact IC storage medium 1 to the area near the corners on the inner surface of the front cover 11a or the back cover 11b of the booklet-like printed material 11 and As shown in FIG. 10, when the main body paper 11c bound inside the booklet-like printed material 11 is overlapped and bound to the front cover 11a or the back cover 11b, the IC chip 3 built in the non-contact IC storage medium 1 is used. The cutout portion 12 is provided in the vicinity of the corner of the text sheet 11c so that the portion is not overlapped with the text sheet 11c.
[0024]
As a result, as shown in FIG. 11, when the booklet-like printed material 11 is bound, the IC chip 3 incorporated in the non-contact IC storage medium 1 is adversely affected by a failure due to the pressure applied by the body paper 11c. Can be avoided.
The shape of the notch 12 formed in the vicinity of the text sheet may be a desired shape such as a corner cut or a rounded corner.
[0025]
The booklet-like printed matter having the non-contact IC storage medium of the present invention is particularly effective when used for a bankbook, passport, or the like that would be problematic if the booklet-like printed matter is misused by a third party. For example, collation data for verifying the identity of the person such as the face photo data of the person is stored in the IC chip 3, and the identity of the collation data is confirmed by wirelessly communicating signals with an external device. It is possible to ensure the certainty when using the printed booklet.
[0026]
【The invention's effect】
As described above in detail, the booklet-like printed matter having the non-contact IC storage medium of the present invention is manufactured by separately manufacturing the booklet-like printed matter main body and the non-contact IC storage medium, and then the non-contact IC storage in the booklet-like printed matter. Since the medium is affixed, there is no need to make the structure of the booklet-like printed body special, so the booklet-like printed body can also be manufactured using ordinary paper, so contactless ICs can be manufactured at low manufacturing costs. It is possible to provide a printed booklet that can be processed, and it is possible to produce this in a resource-saving manner.
[0027]
In addition, a non-contact IC storage medium is also applied to the area around the corners of the front cover or back cover even when used for booklet-like printed materials for applications that require printing using a printer such as a passbook. Therefore, there is an effect that the adverse effect of the pressure on the IC chip of the non-contact IC module provided on the booklet-like printed matter by the feeding roller in the printer printing apparatus is not affected as much as possible.
In addition, even if the booklet-like printed matter is bound, the IC chip is not pushed by the text sheet that is bound inside the booklet-like printed matter. The effect that there is very little can be expected.
[0028]
[Brief description of the drawings]
FIG. 1 is a plan view showing a state in which an upper sheet is removed from a non-contact IC storage medium before die cutting.
FIG. 2 is a cross-sectional view of FIG. 1A-A.
3 is a cross-sectional view showing a state where an adhesive layer and release paper are provided on the non-contact IC storage medium of FIG.
4 is a cross-sectional view of a non-contact IC storage medium that has been punched with a punching line from the non-contact IC storage medium before being punched in FIG. 3;
5 is a cross-sectional view showing a state in which different types of non-contact IC modules are built in FIG. 3. FIG.
6 is a cross-sectional view of a non-contact IC storage medium that has been punched with a punching line from the non-contact IC storage medium before being punched in FIG. 5;
FIG. 7 is a perspective view showing a state in which a non-contact IC storage medium is pasted on a booklet-like printed material according to the present invention.
8 is a cross-sectional view taken along the line BB in FIG.
FIG. 9 is a perspective view showing a state in which a notch portion is provided in a corner portion of a text sheet in a booklet-like printed material according to the present invention.
10 is a perspective view showing a state in which the text sheet of FIG. 9 is superposed on the back cover side to which a non-contact IC storage medium is attached. FIG.
FIG. 11 is a plan view showing a state in which a booklet-like printed material according to the present invention is bound.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Non-contact IC storage medium 1a Non-contact IC storage medium seal 2a, 2b Sheet 3 IC chip 4 Sending / receiving coil 4a Coil printing 4b Covered copper wire 5 Non-contact IC module 6 Anisotropic conductive sheets 7, 7a, 7b Adhesive 8 Die cutting line 9 Adhesive 10 Release paper 11 Booklet print 11a Front cover 11b Back cover 11c Text sheet 12 Notch

Claims (1)

The non-contact IC recording medium in which the non-contact IC module is built between the two sheets are bonded together is polymerized, booklet-like with a non-contact IC recording medium comprising affixed to the front cover or back cover of the booklet-like prints Printed material,
The non-contact IC storage medium is affixed to the booklet-like printed matter when the non-contact IC storage medium is attached to a region near the corner of the inner surface of the front cover or back cover and the booklet-like printed matter is bound. A non-contact portion is provided in a region near the corner of the body paper so that the IC chip portion built in the paper and the body paper bound to the inside of the booklet-like printed material do not overlap with each other Book-like printed matter having an IC storage medium.

Images