JP2005216099A - Thread and sheet containing ic chip, manufacturing method for them, sheet - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce a possibility of damaging an IC chip without taking time and effort. <P>SOLUTION: The periphery of the IC chip 10 on a resin layer 20 loaded with the IC chip 10 is printed with a foaming ink 40 which foams on heating. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a thread in which an IC chip is mounted on a sheet substrate, a sheet containing an IC chip, a manufacturing method thereof, and a sheet.

  In the past, counterfeit crimes have frequently occurred in securities such as prepaid cards, various admission tickets, gift certificates and stock certificates because they are widely distributed and can be exchanged relatively easily. In particular, in recent years, with the improvement and popularization of copying machines such as color copiers, counterfeit products that cannot be easily distinguished from genuine products can be manufactured relatively easily, and countermeasures against counterfeiting are required. Yes. Moreover, measures against counterfeiting are required not only for the above-mentioned securities but also for banknotes.

  As one of countermeasures against such counterfeiting, a technique for preventing forgery of securities or banknotes by attaching or inserting a member called a thread on the securities or banknotes is considered. In this technology, a thread formed by cutting a plastic film, thin paper, etc. to a width of about several millimeters is not exposed from the surface of securities or banknotes, or securities such that a part is exposed from the surface. It is inserted into the paper layer of the banknote, and the authenticity of the securities and banknotes is determined by the presence or absence of this thread.

  Furthermore, in recent years, a technique for determining the authenticity of securities or bills using a thread on which an IC chip is mounted has been considered. In this technology, a thread in which an IC chip is bonded to one side of a film cut to a width of about several millimeters is inserted into a paper layer of securities or banknotes, and when using securities or banknotes, an IC is used. By reading the information written on the chip, the authenticity of the securities or bills is determined (for example, see Patent Document 1).

  However, in the above-described thread and the IC chip-containing sheet in which the IC chip is mounted on the sheet base material like this thread, the IC chip is only bonded on the sheet base material. As a result, the IC chip is likely to be damaged.

Here, in a non-contact IC card in which an antenna and an IC chip are mounted on a substrate, a technique for providing a substantially circular reinforcing material on the IC chip and thereby protecting the IC chip is considered (for example, (See Patent Document 2). If this technique is used, the possibility that the IC chip adhered on the sheet base material is damaged can be reduced.
JP 2002-319006 A Japanese Patent Laid-Open No. 2002-170087

  However, when the IC chip is protected by providing the reinforcing material on the IC chip as described above, the position and pressure when the reinforcing material is mounted on the IC chip must be precisely controlled. There is a problem that it takes.

  The present invention has been made in view of the problems of the conventional techniques as described above, and a thread that can reduce the possibility that an IC chip is damaged without taking time and a manufacturing method thereof. The object is to provide a method and sheet.

In order to achieve the above object, the present invention provides:
A thread in which an IC chip capable of reading at least information in a non-contact state is mounted on a belt-like sheet base material,
Printing is performed on the periphery of the IC chip on the sheet base material with a foaming ink that foams by giving predetermined conditions.

In addition, the thread manufacturing method,
Printing the foamed ink around a region where the IC chip is mounted on the sheet substrate;
Mounting the IC chip on the sheet substrate;
Giving the predetermined condition to the foamed ink.

Also, an IC chip-containing sheet in which an IC chip is mounted on a sheet base material,
Printing is performed on the periphery of the IC chip on the sheet base material with a foaming ink that foams by giving predetermined conditions.

Moreover, it is a manufacturing method of the sheet containing the IC chip,
Printing the foamed ink around a region where the IC chip is mounted on the sheet substrate;
Mounting the IC chip on the sheet substrate;
Giving the predetermined condition to the foamed ink.

  In the present invention configured as described above, printing is performed around the IC chip of the sheet base material on which the IC chip is mounted by foaming ink that foams by giving predetermined conditions. However, when an external force is applied around the IC chip of the sheet base material, most of the external force is applied to the expanded foamed ink. The external force applied to the IC chip is small, thereby reducing the possibility of the IC chip being damaged.

  As described above, in the present invention, printing is performed around the IC chip of the sheet base material on which the IC chip is mounted with foamed ink, and this firing ink is given a predetermined condition in the manufacturing process. Since it expands, the IC chip is protected by the foamed ink, so that the IC chip can be damaged without any effort just by printing on the sheet substrate with the foamed ink. The possibility can be reduced.

  Embodiments of the present invention will be described below with reference to the drawings.

  1A and 1B are diagrams showing an embodiment of a thread according to the present invention. FIG. 1A is a diagram showing a stacked state, and FIG. 1B is a diagram showing an internal configuration.

  In this embodiment, as shown in FIG. 1, an IC chip 10 is mounted and bonded on a resin layer 20 that is a sheet base material by a hot melt layer 30 made of hot melt, and a paper layer 50 is laminated thereon. It is configured. In addition, the periphery of the IC chip 10 of the resin layer 20 is printed so as to surround the IC chip 10 with the foamed ink 40 that foams when heated. The resin layer 20 is made of strip-shaped PET, and is bonded to the paper layer 50 by a hot melt layer 30. Further, the IC chip 10 can read information in a non-contact state, and the information written in the IC chip 10 can be read close to an information writing / reading device provided outside. Read out.

  In the thread configured as described above, for example, an adhesive (not shown) is applied to one surface, and is used by being affixed to securities or banknotes. Therefore, if one surface of the thread is made of a paper layer 50 or a layer made of nonwoven fabric and this surface is a surface to be affixed to securities or banknotes, the adhesiveness between the threads and securities or banknotes can be improved. it can. On the other hand, when the sheet base material on which the paper layer 50 is laminated is the resin layer 20 made of a material such as PET as described above, the mechanical strength of the thread can be improved. It is also conceivable to use a material made of paper or non-woven fabric in place of the resin layer 20, in which case the mechanical strength is weaker than that using the resin layer 20, but either side of the thread is valuable. Adhesiveness with securities and banknotes can also be improved as an adhesive surface with securities and banknotes.

  When a securities or banknote with a thread attached is brought close to the above-described information writing / reading device, for example, information written in the IC chip 10 is read, and based on the read information, the valuable information is read. The authenticity of securities and banknotes will be determined. Note that, in the IC chip 10, as described above, when the authentication determination is performed only by the information written in the IC chip 10, the information written in the IC chip 10 may be read in a non-contact state. However, the information may be written in a non-contact state by being brought close to the information writing / reading device.

  It is also conceivable to use the thread by inserting it into the paper layer of the securities or banknotes instead of sticking the threads as shown in FIG. 1 to the securities or banknotes. In that case, for example, paper made from at least two paper layers using a multi-tank type net paper machine is used as securities or banknotes, and threads are made between the paper layers when manufacturing securities or banknotes. Keep in mind. The securities and banknotes in which threads are inserted in this way are also used in the same manner as described above. Moreover, it is also conceivable to use a securities or banknotes in which a plurality of papers are stacked with a thread sandwiched between the stacked papers.

  It is also conceivable that a recess is formed in securities, bills or the like, and a thread as shown in FIG. 1 is fitted into the recess. The securities and banknotes in which threads are inserted in this way are also used in the same manner as described above.

  The thread as shown in FIG. 1 is not limited to securities, banknotes, etc. as described above, but is attached to a sheet-like one, as described above, punched, sandwiched, Alternatively, it is used by being incorporated into a sheet by being fitted.

  Below, the manufacturing method of the thread | sled mentioned above is demonstrated.

  FIG. 2 is a diagram for explaining a method of manufacturing the thread shown in FIG.

  First, printing is performed around the area on which the IC chip 10 of the resin sheet 21 to be the resin layer 20 is mounted by cutting so as to surround the area with the foamed ink 40 that is foamed by heating (see FIG. 2 (a)). As the foamed ink 40, for example, it is conceivable to use an ink that contains or contains an expansion agent and is blended with a foaming agent that expands, decomposes, reacts, etc. by heat.

  Next, the hot melt layer 30 is laminated on the surface of the resin sheet 21 that has been printed with the foamed ink 40 (FIG. 2B).

  Next, the IC chip 10 is mounted on the resin sheet 21 on which the hot melt sheet 31 is laminated (FIG. 2C).

  When the IC chip 10 is heated and pressurized when the IC chip 10 is mounted on the resin sheet 21, the portion of the hot melt sheet 31 that contacts the IC chip 10 and its surroundings are melted, thereby causing the IC chip 10 to be hot. The IC chip 10 is bonded onto the resin sheet 21 by being embedded in the melt sheet 31 and then the hot melt sheet 31 is cured (FIG. 2D).

  FIG. 3 is a diagram showing a state in which the IC chip 10 is mounted and bonded on the resin sheet 21 on which the hot melt sheet 31 is laminated and printed with the foamed ink 40 in the thread manufacturing process shown in FIG. It is.

  As shown in FIG. 3, the IC chip 10 is mounted and bonded in a matrix on the resin sheet 21 printed with the foamed ink 40 and the hot melt sheet 31 is laminated. Each of the formed IC chips 10 is surrounded by the foamed ink 40 printed on the resin sheet 21.

  Next, a paper sheet 51 to be a paper layer 50 is laminated on the resin sheet 21 on which the IC chip 10 is mounted and adhered, and the hot melt sheet 31 is melted by the heat when pressed and heated. At the same time, the foamed ink 40 is foamed and expanded, and then the hot melt sheet 31 is cured, whereby the resin sheet 21 and the paper sheet 51 are bonded to each other (FIG. 2E). In this state, since the foamed ink 40 printed around the IC chip 40 is greatly expanded, when an external force is applied around the IC chip 10, most of the external force is applied to the expanded foam ink 40, The external force applied to the IC chip 10 is small.

  Thereafter, the paper sheet 51 and the resin sheet 21 adhered to each other by the hot melt sheet 31 are cut into a strip shape, thereby completing the thread roll.

  FIG. 4 is a diagram illustrating a state in which the paper sheet 51 and the resin sheet 21 are cut into a strip shape in the thread manufacturing process illustrated in FIG. 1.

  As shown in FIG. 4, when the paper sheet 51 and the resin sheet 21 adhered to each other by the hot melt sheet 31 are cut into a strip shape, the IC chip 10 and the foamed ink 40 surrounding it are linearly formed on the resin sheet 21. A thread roll is formed, and this thread roll is wound up, and then attached to securities, banknotes, etc., for each unit to be attached (for example, one IC chip 10 is included) As shown in FIG. 1, a thread as shown in FIG. 1 is formed.

  In this embodiment, printing is performed so as to surround the IC chip 10 with the foamed ink 40 around the IC chip 10 on the resin layer 20. However, in the printing with the foamed ink 40, the IC chip 10 is The IC chip 10 is not limited to be surrounded, but is provided in a C-shape having an open portion in a part thereof, only on a region adjacent to two opposite sides of the IC chip 10, or adjacent to each other of the IC chip 10. It is conceivable to apply only to the area adjacent to the two sides.

  In this embodiment, printing is performed with the foamed ink 40 and the paper layer 50 is laminated on the resin layer 20 on which the IC chip 10 is mounted. However, in the present invention, the paper layer 50 is laminated. It is not limited. However, even in that case, after mounting the IC chip 10 on the resin layer 20, it is necessary to apply heat to the foamed ink 40 to foam and expand the foamed ink 40.

  In the present embodiment, the resin layer 20 made of PET is used. However, the present invention is not limited to this, and for example, one made of PET-G or PVC can be considered. It is also conceivable to use a resin layer made of PET, PET-G or PVC instead of the paper layer 50. When a resin layer 20 made of PET-G or PVC is used and a resin layer made of PET-G or PVC is used instead of the paper layer 50, these are bonded to each other by heating. Therefore, the hot melt layer 30 may be laminated only in the region of the resin sheet 21 where the IC chip 10 is mounted. Even in that case, the foamed ink 40 is expanded and expanded by heating for bonding the resin layers.

  In this embodiment, the IC chip 10 is bonded to the resin layer 20 by the hot melt layer 30 and the resin layer 20 and the paper layer 50 are bonded. However, instead of the hot melt layer 30, UV curing is performed. It is also conceivable to use an adhesive layer made of a mold adhesive. In that case, when the IC chip 10 is bonded onto the resin layer 20, ultraviolet rays are irradiated from the surface of the resin layer 20 opposite to the surface on which the IC chip 10 is mounted. Needs to transmit ultraviolet rays. Further, in this case, if the foamed ink 40 is not foamed by heating but is foamed by irradiating with ultraviolet rays, the resin layer 20 and the paper layer 50 are the same as in the above-described embodiment. The foamed ink 40 can be foamed in the step of adhering the ink. Thus, in the foamed ink 40 printed on the resin layer 20, it is preferable that the conditions given for bonding the resin layer 20 and the paper layer 50 be the conditions for foaming.

  Further, in the thread manufacturing method of the present invention, as described above, after the resin sheet 21 that becomes the resin layer 20 by being cut, the IC chip 10 is mounted in a matrix and the paper layer 50 is laminated, It is not limited to manufacturing a thread by cutting, but substantially printing a foamed ink 40 on the belt-shaped resin layer 20 and mounting the IC chip 10, and then laminating a paper layer 50. I just need it.

  In this embodiment, the thread in which the IC chip 10 is mounted and fixed on the belt-shaped resin layer 20 has been described. However, the IC chip-containing sheet in which the IC chip is mounted and fixed on the sheet base material is also described. It can be manufactured by the same manufacturing method as described above. The IC chip-containing sheet can be used as a single sheet by forming an adhesive or a printing layer on the sheet surface, or can be used by laminating other sheets.

It is a figure which shows one Embodiment of the thread | sled of this invention, (a) is a figure which shows a lamination | stacking state, (b) is a figure which shows an internal structure. It is a figure for demonstrating the manufacturing method of the thread | sled shown in FIG. FIG. 2 is a diagram showing a state in which an IC chip is mounted and bonded on a resin sheet on which hot-melt sheets are laminated and printed with foamed ink in the thread manufacturing process shown in FIG. 1. It is a figure which shows the state by which the paper sheet and the resin sheet were cut | judged in the strip | belt shape in the manufacturing process of the thread | thread shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 IC chip 20 Resin layer 21 Resin sheet 30 Hot melt layer 31 Hot melt sheet 40 Foamed ink 50 Paper layer 51 Paper sheet

Claims (5)

A thread in which an IC chip capable of reading at least information in a non-contact state is mounted on a belt-like sheet base material,
A thread on which printing is performed around the IC chip on the sheet base material by foaming ink that foams by applying predetermined conditions. It is a manufacturing method of the thread according to claim 1,
Printing the foamed ink around a region where the IC chip is mounted on the sheet substrate;
Mounting the IC chip on the sheet substrate;
And a step of giving the predetermined condition to the foamed ink.   A sheet in which the thread according to claim 1 is incorporated. An IC chip-containing sheet in which an IC chip is mounted on a sheet substrate,
An IC chip-containing sheet in which printing is performed around the IC chip on the sheet base material with a foaming ink that is foamed by applying predetermined conditions. It is a manufacturing method of the sheet | seat containing an IC chip of Claim 4,
Printing the foamed ink around a region where the IC chip is mounted on the sheet substrate;
Mounting the IC chip on the sheet substrate;
A method for producing an IC chip-containing sheet, the method comprising: applying the predetermined condition to the foamed ink.

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