JP4504692B2 - Thread manufacturing method, IC chip-containing sheet manufacturing method, and thread and IC chip-containing sheet manufactured thereby - Google Patents

Description

The present invention relates to a thread in which an IC chip is mounted on a sheet substrate and a method for manufacturing an IC chip-containing sheet, and a thread and an IC chip-containing sheet manufactured thereby .

  In the past, counterfeit crimes have frequently occurred in securities such as prepaid cards, various admission tickets, gift certificates and stock certificates because they are widely distributed and can be exchanged relatively easily. In particular, in recent years, with the improvement and popularization of copying machines such as color copiers, counterfeit products that cannot be easily distinguished from genuine products can be manufactured relatively easily, and countermeasures against counterfeiting are required. Yes. Moreover, measures against counterfeiting are required not only for the above-mentioned securities but also for banknotes.

  As one of countermeasures against such counterfeiting, a technique for preventing forgery of securities or banknotes by attaching or inserting a member called a thread on the securities or banknotes is considered. In this technology, a thread formed by cutting a plastic film, thin paper, etc. to a width of about several millimeters is not exposed from the surface of securities or banknotes, or securities such that a part is exposed from the surface. It is inserted into the paper layer of the banknote, and the authenticity of the securities and banknotes is determined by the presence or absence of this thread.

Furthermore, in recent years, a technique for determining the authenticity of securities or bills using a thread on which an IC chip is mounted has been considered. In this technology, a thread made by bonding an IC chip with an adhesive on one side of a film cut to a width of about several millimeters is put into a paper layer of securities or banknotes, and the use of securities or banknotes is performed. Sometimes, authenticity of securities and banknotes is determined by reading information written on the IC chip (see, for example, Patent Document 1).
JP 2002-319006 A

  However, in the above-described thread and the IC chip-containing sheet in which an IC chip is mounted on a sheet base material such as this thread, when the IC chip is mounted on a sheet base material such as a film base material, Since the IC chip is bonded and fixed on the material by an adhesive, there is a problem that the cost is increased by the amount of the adhesive and the IC chip protrudes from the sheet base material.

The present invention has been made in view of the problems of the conventional techniques as described above, and the IC chip does not protrude on the sheet base material, and the IC chip is placed on the sheet base material. An object of the present invention is to provide a method of manufacturing a thread and an IC chip-containing sheet that can be fixed without using an adhesive and can reduce the thickness of the entire thread, and a thread and an IC chip-containing sheet manufactured by the method . And

In order to achieve the above object, the present invention provides:
On a strip-shaped sheet base material made of a resin capable of transmitting laser light, at least information can be read out in a non-contact state, and an IC chip having a color with high laser light absorption is mounted and fixed. A method of manufacturing a thread,
Mounting the IC chip on the sheet substrate;
While pressing the IC chip against the sheet base material, a laser beam is applied to at least a region where the IC chip is mounted from a surface side of the sheet base material opposite to the surface on which the IC chip is mounted. The IC chip is melted by heat generated by the laser light by irradiating and absorbing the laser light to the IC chip, thereby melting the region where the IC chip is mounted in the sheet base material. And embedding in .

In addition, a method for producing an IC chip-containing sheet in which an IC chip made of a color having a high laser light absorption rate is mounted and fixed on a sheet base material made of a resin capable of transmitting laser light,
Mounting the IC chip on the sheet substrate;
While pressing the IC chip against the sheet substrate, a laser beam is applied to at least a region where the IC chip is mounted from the surface side of the sheet substrate opposite to the surface where the IC chip is mounted. The IC chip is melted by the heat generated by the laser light by irradiating and absorbing the laser light to the IC chip, thereby melting the region where the IC chip is mounted in the sheet base material. And embedding in .

Moreover, the said sheet | seat base material is also fuse | melted by heating the area | region in which the said IC chip is mounted of the said sheet | seat base material in the process of pressurizing the said IC chip.

  In the present invention configured as described above, after mounting an IC chip capable of reading at least information in a non-contact state on a sheet base material made of a resin capable of transmitting laser light, the IC of the sheet base material When laser light is irradiated to at least the area where the IC chip is mounted from the surface side opposite to the surface where the chip is mounted, the laser light passes through the sheet base material and is absorbed by the IC chip. Heat is generated in a region where the IC chip of the substrate is mounted, and the sheet substrate in that region is melted. At this time, when the IC chip mounted on the sheet base material is pressed against the sheet base material, the IC chip is embedded in the molten sheet base material. It will be fixed in the state embedded in the sheet base material.

  In this way, the region where the IC chip of the sheet base material is mounted is melted by laser light, and the IC chip is embedded and fixed in the region, so that the IC chip does not protrude on the sheet base material, and The IC chip can be fixed to the sheet base material without using an adhesive or the like, and the entire thread can be made thin.

  In addition, when the IC chip is pressed against the sheet substrate, if the region of the sheet substrate on which the IC chip is mounted is heated, the sheet substrate is melted by the heating, and the melting of the sheet substrate is accelerated. be able to.

  As described above, in the present invention, the region where the IC chip of the sheet base material is mounted is melted by the laser beam, and the IC chip is embedded and fixed in the region. The IC chip can be fixed to the sheet substrate without protruding and without using an adhesive, and the entire thread can be made thin.

  In addition, in the step of heating the region where the IC chip of the sheet base material is mounted in the step of pressing the IC chip against the sheet base material, the melting of the sheet base material can be accelerated.

  Embodiments of the present invention will be described below with reference to the drawings.

  1A and 1B are diagrams showing the structure of a thread manufactured by an embodiment of the thread manufacturing method of the present invention, where FIG. 1A is a top view, and FIG. 1B is AA ′ shown in FIG. It is sectional drawing.

  As shown in FIG. 1, the thread manufactured in this form is embedded in an IC chip 10 that can read information in a non-contact state in a resin layer 20 that is a belt-like sheet base material. The chip 10 is configured to be mounted and fixed on the resin layer 20. The material of the resin layer 20 may be a transparent or translucent PET, PET-G, PVC, or the like that has a low laser light absorption rate and can transmit the laser light, and its thickness is an IC chip. It is comprised so that it may become thicker than 10 thickness. Further, in the IC chip 10, information written in the IC chip 10 is read by being brought close to an information writing / reading device provided outside.

  In the thread configured as described above, for example, an adhesive (not shown) is applied to one surface, and is used by being affixed to securities or banknotes.

  When a securities or banknote with a thread attached is brought close to the above-described information writing / reading device, for example, information written in the IC chip 10 is read, and based on the read information, the valuable information is read. The authenticity of securities and banknotes will be determined. Note that, in the IC chip 10, as described above, when the authentication determination is performed only by the information written in the IC chip 10, the information written in the IC chip 10 may be read in a non-contact state. However, the information may be written in a non-contact state by being brought close to the information writing / reading device.

  It is also conceivable to use the thread by inserting it into the paper layer of the securities or banknotes instead of sticking the threads as shown in FIG. 1 to the securities or banknotes. In that case, for example, a paper machine manufactured from at least two paper layers using a multi-tank type net paper machine is used as securities or banknotes, and a thread is placed between the paper layers when manufacturing securities or banknotes. Keep in mind. The securities and banknotes in which threads are inserted in this way are also used in the same manner as described above. In addition, it is also conceivable to use a securities or banknotes in which a plurality of papers are laminated with a thread sandwiched between the laminated papers.

  It is also conceivable that a recess is formed in securities, bills or the like, and a thread as shown in FIG. 1 is fitted into the recess. The securities and banknotes in which threads are inserted in this way are also used in the same manner as described above.

  The thread as shown in FIG. 1 is not limited to securities, banknotes, etc. as described above, but is attached to a sheet-like one as described above, punched, sandwiched, Alternatively, it is used by being incorporated in a sheet by being fitted.

  Below, the manufacturing method of the thread | sled mentioned above is demonstrated.

  FIG. 2 is a diagram for explaining a method of manufacturing the thread shown in FIG.

  First, the IC chip 10 is mounted on the resin sheet 2 which is thicker than the IC chip 10 and becomes the resin layer 20 by cutting (FIG. 2A).

  Next, while pressing the IC chip 10 mounted on the resin sheet 2 against the resin sheet 2, the IC chip is mounted from the side of the resin sheet 2 opposite to the surface on which the IC chip 10 is mounted. A laser beam is irradiated on the formed region (FIG. 2B). At this time, a holding plate 1 made of a material that can transmit laser light, such as glass, is brought into contact with the surface of the resin sheet 2 that is irradiated with the laser light, whereby the resin sheet 2 of the IC chip 10 is contacted. It is necessary to prevent the resin sheet 2 from moving in accordance with the pressure applied to the surface. Further, the region to be irradiated with the laser light is not limited to the region where the IC chip 10 is mounted, and if the region including the IC chip 10 is included, the surface of the resin sheet 2 on which the IC chip 10 is mounted May be the entire surface on the opposite side.

  Then, the laser light irradiated from the surface opposite to the surface on which the IC chip 10 of the resin sheet 2 is mounted passes through the presser plate 1 and the resin sheet 2. Further, since the IC chip 10 mounted on the resin sheet 2 generally has a high absorption rate of laser light such as black, the laser light transmitted through the presser plate 1 and the resin sheet 2 is then transmitted to the IC chip 10. Will be absorbed. As a result, heat is generated in the region of the resin sheet 2 where the IC chip 10 is mounted, and the resin sheet 2 in that region is melted. At this time, since the IC chip 10 mounted on the resin sheet 2 is pressurized against the resin sheet 2, the IC chip 10 is embedded in the molten resin sheet 2 (FIG. 2C). . At this time, if the region of the resin sheet 2 where the IC chip 10 is mounted is heated together with the pressure applied to the resin sheet 2 of the IC chip 10, the region of the resin sheet 2 where the IC chip 10 is mounted is also heated. It melts, and thereby the melting of the resin sheet 2 can be accelerated.

  Thereafter, when the melted resin sheet 2 is hardened, the IC chip 10 is fixed while being embedded in the resin sheet 2 (FIG. 2D).

  FIG. 3 is a diagram illustrating a state in which the IC chip 10 is embedded in the resin sheet 2 in the thread manufacturing process illustrated in FIG. 1.

  As shown in FIG. 3, IC chips 10 are mounted in a matrix on the resin sheet 2 and embedded in the resin sheet 2.

  Thereafter, the resin sheet 2 in which the IC chip 10 is embedded and fixed is cut into a strip shape to complete a thread roll.

  FIG. 4 is a diagram illustrating a state in which the resin sheet 2 in which the IC chip 10 is embedded is cut into a strip shape in the thread manufacturing process illustrated in FIG. 1.

  As shown in FIG. 4, when the resin sheet 2 in which the IC chip 10 is embedded is cut into a strip shape, a thread roll is formed in which the IC chip 10 is embedded in a straight line on the resin sheet 2 and mounted. This thread roll is wound up and then cut into units to be attached (for example, one IC chip 10 is included) when it is attached to securities or banknotes. A thread as shown will be formed.

  In the present embodiment, the resin layer 20 is made thicker than the IC chip 10 so that the entire IC chip 10 is embedded in the resin layer 20, but the present invention is not limited to this. Even if the thickness of the resin layer 20 is thinner than the thickness of the IC chip 10, the IC chip 10 is formed in the resin layer 20 by adopting a configuration in which a part of the IC chip 10 is embedded in the resin layer 20. It is also possible to mount and fix.

  Further, in this embodiment, as described above, the resin sheet 2 that becomes the resin layer 20 by being cut is mounted by embedding the IC chip 10 in the resin sheet 2 and then cutting to manufacture a thread. However, the present invention is not limited to this. The IC chip 10 is substantially mounted on the belt-shaped resin layer 20, and then the IC chip 10 is pressed against the resin layer 20, while the IC of the resin layer 20. By irradiating at least the region where the IC chip 10 is mounted from the side opposite to the surface where the chip 10 is mounted, the region of the resin layer 20 where the IC chip 10 is mounted is melted. What is necessary is just to embed and fix the IC chip 10 in the resin layer 20.

  Further, in this embodiment, the thread is described in which the IC chip 10 is mounted and fixed on the belt-shaped resin layer 20, but the IC chip is mounted and fixed on the sheet base material made of resin. The sheet can also be manufactured by the same manufacturing method as described above. The IC chip-containing sheet can be used as a single sheet by forming an adhesive or a printing layer on the sheet surface, or can be used by laminating other sheets.

It is a figure which shows the structure of the thread | sled manufactured by one Embodiment of the manufacturing method of the thread | sled of this invention, (a) is a top view, (b) is AA 'sectional drawing shown to (a). . It is a figure for demonstrating the manufacturing method of the thread | sled shown in FIG. It is a figure which shows the state by which the IC chip was embedded in the resin sheet in the manufacturing process of the thread | yarn shown in FIG. FIG. 2 is a view showing a state in which a resin sheet embedded with an IC chip is cut into a strip shape in the thread manufacturing process shown in FIG.

Explanation of symbols

1 Presser plate 2 Resin sheet 10 IC chip 20 Resin layer

Claims (6)

An IC chip made of a color having a high laser light absorption rate is mounted and fixed on a belt-like sheet base material made of a resin capable of transmitting laser light so that at least information can be read out in a non-contact state. A method of manufacturing a thread,
Mounting the IC chip on the sheet substrate;
While pressing the IC chip against the sheet substrate, a laser beam is applied to at least a region where the IC chip is mounted from the surface side of the sheet substrate opposite to the surface where the IC chip is mounted. The IC chip is melted by the heat generated by the laser light by irradiating and absorbing the laser light to the IC chip, thereby melting the region where the IC chip is mounted in the sheet base material. A method of manufacturing a thread having a step of embedding in a thread. In the manufacturing method of the thread according to claim 1,
A thread manufacturing method in which the sheet base material is melted also by heating a region of the sheet base material on which the IC chip is mounted in the step of pressurizing the IC chip.   A thread manufactured by the thread manufacturing method according to claim 1 or 2. On a sheet base material made of a resin capable of transmitting laser light, an IC chip made of a color having a high absorption rate of laser light is mounted and fixed, and a method for producing a sheet containing an IC chip,
Mounting the IC chip on the sheet substrate;
While pressing the IC chip against the sheet substrate, a laser beam is applied to at least a region where the IC chip is mounted from the surface side of the sheet substrate opposite to the surface where the IC chip is mounted. The IC chip is melted by the heat generated by the laser light by irradiating and absorbing the laser light to the IC chip, thereby melting the region where the IC chip is mounted in the sheet base material. A method for manufacturing a sheet containing an IC chip, which includes a step of embedding in an IC chip. In the manufacturing method of the sheet | seat containing an IC chip of Claim 4 ,
The manufacturing method of the sheet | seat with an IC chip which fuses the said sheet | seat base material also by heating the area | region where the said IC chip | tip of the said sheet | seat base material is mounted in the process of pressurizing the said IC chip.   The IC chip containing sheet | seat manufactured by the manufacturing method of the IC chip containing sheet | seat of Claim 4 or Claim 5.

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