JP2004351559A - Method and device for punching card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide device and method which prevents occurrence of cracks in a resin sheet at the time of punching a card and reducing swelling-out of an adhesive layer and cutting defects, and has excellent cutting property at an end part of the card, and excellent adhering strength, heat resistance, water resistance, and chemical resistance. <P>SOLUTION: In this method for punching the card for forming a card product from the resin sheet formed by arranging product parts, the card part is separated by using laser. After cutting circular arc parts at four corners of the card, four sides of the card part are cut from the resin sheet by using laser. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a card punching method and a card punching device for punching at least one resin card from a resin sheet.
[0002]
[Prior art]
Conventionally, in the fields of credit cards, ID cards, cash cards, etc., as an alternative to a magnetic card, an IC chip is formed on a substrate while the adhesive layers of a pair of resin sheets having an adhesive layer on one side face each other. In addition, an electronic information recording card in which an antenna substrate on which an antenna circuit product is mounted is sandwiched and bonded to create a laminate has been developed because of its extremely large information recording capacity and high security. (For example, Patent Document 1 and Patent Document 2).
[0003]
Thus, a card punching device has been proposed that forms a card product part from a resin sheet formed by arranging product parts (for example, Patent Document 3).
[0004]
[Patent Document 1]
Japanese Patent Laid-Open No. 10-147087 (pages 1 to 4, FIGS. 1 to 4)
[0005]
[Patent Document 2]
JP 2002-157561 A (pages 1 to 13, FIGS. 1 to 16)
[0006]
[Patent Document 3]
Japanese Patent Laid-Open No. 7-25510 (pages 1 to 11, FIGS. 1 to 10)
[0007]
[Problems to be solved by the invention]
By the way, in the punching of such a resin card, particularly a resin card bonded through an adhesive layer, since it is cut by a shearing force, a crack (crack) of a resin sheet serving as a surface layer or a card edge The adhesive layer may protrude from the portion, which may cause poor card appearance and poor card printer conveyance.
[0008]
The present invention has been made in view of the above points, and at the time of card punching, it can prevent the occurrence of cracks in the resin sheet from the end of the card, and can reduce the protrusion and cutting failure of the adhesive layer, cutting the end of the card. An object of the present invention is to provide a card punching method and a card punching device which have good properties, excellent adhesive strength, heat resistance, water resistance and chemical resistance.
[0009]
[Means for Solving the Problems]
In order to solve the above-described problems and achieve the object, the present invention is configured as follows.
[0010]
The invention according to claim 1 is a card punching method for molding a card product from a resin sheet formed by arranging product parts.
A card punching method characterized in that a card portion is cut using a laser.
[0011]
According to the first aspect of the present invention, the card portion is cut using a laser to prevent the occurrence of cracks from the end of the resin sheet at the time of card punching, and the adhesive layer protrudes or is poorly cut. The card edge is easy to cut and has excellent adhesive strength, heat resistance, water resistance, and chemical resistance.
[0012]
The invention according to claim 2 is a card punching method for molding a card product from a resin sheet formed by arranging product parts.
The card punching method is characterized in that the arc portion at the four corners of the card is first cut and then the laser is used to cut out four sides of the card portion from the resin sheet.
[0013]
According to the invention of the second aspect, after cutting the arc portions at the four corners of the card first, the laser is then used to cut out the four sides of the card portion from the resin sheet. , Prevents cracking from the edge of the resin sheet, and can reduce the protrusion and cutting failure of the adhesive layer, has good cutting ability at the edge of the card, and has excellent adhesive strength, heat resistance, water resistance, and chemical resistance. In addition, the card product portion can be molded easily and efficiently from the resin sheet.
[0014]
The invention according to claim 3 is the sheet according to claim 1 or 2, wherein the resin sheet is a sheet in which a PET resin as a surface layer is bonded via an adhesive layer softer than the surface layer. The card punching method described.
[0015]
According to the invention described in claim 3, in the sheet in which the resin sheet is bonded to the surface of the PET resin via the adhesive layer softer than the surface layer, the adhesive layer from the end of the resin sheet Since it can reduce the protrusion and cutting failure, the card edge has good cutting properties and excellent adhesive strength, heat resistance, water resistance and chemical resistance.
[0016]
The invention according to claim 4 is a card punching device for molding a card product from a resin sheet formed by arranging product parts.
Positioning on the first stage and cutting out arcs at the four corners of the card;
Cutting the card side in the sheet conveying direction with a laser while feeding the resin sheet to the second stage;
A card punching device comprising: a step of positioning a strip-shaped resin sheet on a second stage and cutting out a card side perpendicular to the sheet conveying direction with a laser.
[0017]
According to the fourth aspect of the present invention, the arc portion at the four corners of the card is cut first, and then the laser is used to cut out four sides of the card portion from the resin sheet. , Prevents cracking from the edge of the resin sheet, and can reduce the protrusion and cutting failure of the adhesive layer, has good cutting ability at the edge of the card, and has excellent adhesive strength, heat resistance, water resistance, and chemical resistance. In addition, the card product portion can be molded easily and efficiently from the resin sheet.
[0018]
The invention according to claim 5 is a card punching device for molding a card product from a resin sheet formed by arranging product parts.
Positioning on the first stage and cutting out arcs at the four corners of the card;
A card punching device comprising: a step of cutting a card portion by moving a laser that cuts out four sides of the card portion in the second stage along the short side of the card and the long side of the card.
[0019]
According to the invention described in claim 5, after cutting the arc portions at the four corners of the card first, and then using the laser, the four sides of the card portion are cut out from the resin sheet, so that when the card is punched , Prevents cracking from the edge of the resin sheet, and can reduce the protrusion and cutting failure of the adhesive layer, has good cutting ability at the edge of the card, and has excellent adhesive strength, heat resistance, water resistance, and chemical resistance. In addition, the card product portion can be molded easily and efficiently from the resin sheet.
[0020]
The invention according to claim 6 is a card punching device for molding a card product from a resin sheet formed by arranging a plurality of product parts.
The stage comprises a plurality of means for detecting the printing position of the card product and means for cutting out the card portion,
The card punching device is characterized in that each of the cutting means has a mechanism capable of individually adjusting a card partial cutout position based on position detection information.
[0021]
According to the sixth aspect of the present invention, the card product portion is reliably cut out from the resin sheet by detecting the print position of the card product and individually adjusting the card portion cutout position based on the position detection information. be able to.
[0022]
The invention according to claim 7 is the sheet according to claim 4, wherein the resin sheet is a sheet in which a PET resin as a surface layer is bonded via an adhesive layer softer than the surface layer. It is a card punching device given in any 1 paragraph.
[0023]
According to the seventh aspect of the present invention, an adhesive is obtained by applying, to the apparatus of the present invention, a sheet in which a resin sheet is bonded to a surface of a PET resin via an adhesive layer softer than the surface layer. It is possible to reduce the protrusion of the layer and cutting failure, and it is possible to produce a card having excellent cutting strength at the end of the card and excellent adhesive strength, heat resistance, water resistance and chemical resistance.
[0024]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of a card punching method and a card punching device according to the present invention will be described below in detail with reference to the drawings. Note that the present invention is not limited to the embodiment.
[0025]
First, the card | curd shape | molded by the card | curd punching method and card | curd punching apparatus of this invention is demonstrated based on FIG. 1 thru | or FIG. The example of an electronic information recording card is shown as a card | curd which shape | molds card products from the resin sheet formed by arranging the product part of this embodiment. As this electronic information recording card, specifically, a card including a business card, nameplate, passport, examination card, telephone card, identification card, driver's license, commuter pass, cash card, IC card, etc. In general, it is about the size of a hand, and in many cases it is carried around. Here, an example of an employee card of a company to which an IC card is applied will be described, but the application example is not limited to this form.
[0026]
An IC card is an antenna in which an IC chip and an antenna circuit are mounted on a substrate while the adhesive layers of a pair of sheet materials having an adhesive layer on one side made of a synthetic resin such as a vinyl chloride resin face each other. A laminate is formed by sandwiching and bonding substrates, and there are a contact type and a non-contact type depending on the manner of electrical contact between the antenna substrate and an external circuit. However, if the contact terminal is exposed on the card surface as in the contact type, the contact surface may be deteriorated, the contact may be defective, and power supply to the IC card and data signal input / output may not be performed. .
[0027]
Therefore, an IC card having a configuration in which electromagnetic waves are generated and / or received by an antenna substrate for exchanging electrical signals in a non-contact manner has appeared.
[0028]
FIG. 1 is a plan view showing an example of such a contactless IC card having no metal terminal on the surface. In the figure, an IC card 1 is provided with an antenna substrate 2 in which an antenna circuit 2c is mounted on a substrate 2a as an IC chip 2b and a signal exchange unit for R / W (read / write).
[0029]
The antenna substrate 2 here is specifically an IC chip 2b for electrically storing information of the user of the electronic card on the substrate 2a and a coiled antenna circuit 2c connected to the IC chip 2b. . The IC chip 2b is a memory alone or in addition to a microcomputer. In some cases, a capacitor may be included in the electronic component.
[0030]
The present invention is not limited to this, and is not particularly limited as long as it is an electronic component necessary for the information recording member. The antenna substrate 2 has the antenna circuit 2c, but when it has an antenna pattern, any method such as conductive paste printing, copper foil etching, or winding welding may be used.
[0031]
As the substrate 2a, a thermoreversible film such as polyester is used, and polyimide is advantageous when heat resistance is required. The IC chip and antenna pattern can be joined using conductive adhesives such as silver paste, copper paste, and carbon paste (EN-4000 series from Hitachi Chemical, XAP series from Toshiba Chemical) and anisotropic conductive films (Hitachi Chemical). There are known methods using industrial anisol, etc.) or soldering methods, but any method may be used.
[0032]
In the case where such an antenna substrate 2 is made into a card, there is a method of bonding between the front and back sheets via an adhesive layer. However, the shearing stress due to the flow of the resin or adhesive causes the joint between the IC chip and the antenna circuit to come off, or the smoothness of the IC card surface is impaired due to the flowability of the resin or uneven cooling. Affects quality stability degradation. Therefore, electronic parts are used in a form encapsulated in a resin layer in the form of a porous resin film, a porous foamable resin film, a flexible resin sheet, a porous resin sheet, or a nonwoven fabric sheet in advance. Is preferred.
[0033]
For example, a method described in Japanese Patent Application No. 11-105476 can be used.
[0034]
For example, as the non-woven sheet portion, there are a mesh-like woven fabric such as a non-woven fabric, a plain woven fabric, a twill woven fabric, and a satin woven fabric. Moreover, the textile etc. which have the pile called a moquette, a plus velor, a seal | sticker, a bell pet, and a suede can be used. Materials include polyamides such as nylon 6, nylon 66 and nylon 8, polyesters such as polyethylene terephthalate, polyolefins such as polyethylene, polyvinyl alcohols, polyvinylidene chloride, polyvinyl chloride, polyacrylonitrile, acrylamide, methacryl Acrylics such as amides, synthetic resins such as polycyanide vinylidene, polyfluoroethylene, and polyurethane, natural fibers such as silk, cotton, wool, cellulose, and cellulose ester, recycled fibers (rayon, acetate), aramid fibers The fiber which combined the 1 type (s) or 2 or more types chosen from among these is raised. Among these fiber materials, polyamides such as nylon 6 and nylon 66, acrylics such as polyacrylonitrile, acrylamide and methacrylic eye, polyesters such as polyethylene terephthalate, celluloses and cellulose esters as recycled fibers are preferable. Examples include rayon, acetate, and aramid fiber.
[0035]
Further, since the IC chip has a weak point pressure strength, it is also preferable to have a reinforcing plate in the vicinity of the IC chip. The reinforcing plate is made of, for example, stainless steel, and may be disposed on the upper surface of the IC chip or on both surfaces of the IC chip so as to sandwich the IC chip, or a frame-shaped member is surrounded by the IC chip. You may arrange in.
[0036]
The key information section 3 is attribute identification information for identifying the IC card 1 and other cards, and is, for example, a code number assigned to the surface of the IC card 1. The character information section 4 is a name, a workplace, an issue date, and the like given to the surface of the IC card 1, and the image information section 5 is image information such as a face.
[0037]
FIG. 2 is a cross-sectional view schematically showing the layer configuration of the IC card. The first sheet material 10 has an adhesive layer 6, and the second sheet material 20 has an adhesive layer 7, and an IC chip 2 b and an antenna circuit are formed on the substrate 2 a in the adhesive layers 6 and 7. This is a configuration of an IC card 1 in which an antenna substrate 2 having 2c is enclosed.
[0038]
A pair of sheet materials having an adhesive layer on one side is usually formed by applying an adhesive to the surface of various plastic films and the like, and as a method of applying the adhesive, a spin coater, a roll coater, a blade coater, Some use a die coater. In particular, when a reactive adhesive such as a moisture curing type is used, it is preferable to use a die coater in order to prevent unnecessary curing reaction from proceeding before coating.
[0039]
Alternatively, an adhesive sheet is prepared separately, and the antenna substrate 2 and the adhesive layer are sequentially laminated between a pair of sheet materials so that a desired configuration is obtained at the time of bonding, and then bonded by a hot press apparatus. good.
[0040]
The base material of the first sheet material 10 and the second sheet material 20 can be made of resin, paper, or the like. Examples thereof include polyethylene terephthalate resin, polyethylene resin, polypropylene resin, acrylonitrile butadiene styrene copolymer resin, polyvinyl chloride resin, polyphenylene sulfide resin, polyimide resin, fine paper, matte paper, coated paper, and synthetic paper. In order to improve the adhesiveness with the adhesive, easy adhesion treatment (primer application, corona discharge treatment, plasma treatment, etc.) may be applied.
[0041]
In addition, as the adhesive, for example, an epoxy two-component mixed type, a UV curable adhesive, a hot melt adhesive, preferably a moisture curable reactive hot melt adhesive is used. As the hot melt resin, ethylene vinyl copolymer resin, polyolefin, polyester, acrylamide, polyurethane and the like can be used. Moisture curable materials as reactive hot melt adhesives are disclosed in JP 2000-036026, JP 2000-21855, JP 2000-21278, JP 2000-21855, and JP 2000-369855. JP-A-10-316959, JP-A-11-5964 and the like are disclosed as photocurable adhesives.
[0042]
Next, an embodiment of an IC card manufacturing apparatus is shown in FIG.
[0043]
The IC card manufacturing apparatus is provided with a feed shaft 50 for feeding the roll-shaped second sheet material 20, and the second sheet material 20 fed from the feed shaft 50 is supplied from the adhesive application device 41. Apply adhesive.
[0044]
Further, the IC card manufacturing apparatus is provided with a feed shaft 21 for feeding the roll-shaped first sheet material 10, and the first sheet material 10 fed from the feed shaft 21 is supplied from the adhesive application device 43. Apply the applied adhesive.
[0045]
The antenna substrate 2 is placed on the adhesive layer of the second sheet material 20 formed as described above, and the first sheet material 10 and the second sheet material 20 are used by the laminating unit 27 using the bonding roll 27a. And paste together.
[0046]
In this IC card manufacturing apparatus, a heating and pressing unit 72, a coating unit 90, a coating solution drying unit 95, a cutting unit 74, and a punching unit 73 are arranged along the transport direction.
[0047]
The heating and pressurizing unit 72 includes a flat hot press upper die 72a and a hot press lower die 72b disposed so as to face each other in the vertical direction, and the hot press upper die 72a and the hot press lower die 72b are in contact with and away from each other. It is provided to be movable.
[0048]
The hot press upper die 72a and the lower die 72b are not flat and can be heat rollers.
[0049]
The image receiving layer coating solution container 30 is provided above the coating unit 90, and a supply roller 31 a is provided in the image receiving layer coating solution container 30. The image receiving layer coating solution 33 is provided from the supply roller 31 a through the intermediate roller 31 b. Is supplied to the application roller 32, and by the reverse rotation of the application roller 32, the image receiving layer coating liquid 33 is applied to one surface side of the first sheet material 10, and the image receiving layer is formed on the surface by the reverse coater method.
[0050]
The application unit 90 is provided with a writing layer coating solution container 60 below, and a writing roller 61a is provided in the writing layer coating solution container 60, and the writing layer coating is applied from the supply roller 61a through the intermediate roller 61b. The liquid 63 is supplied to the application roller 62, and the writing layer application liquid 63 is applied to one surface side of the second sheet material 20 by the reverse rotation of the application roller 62, and a writing layer is formed on the surface by the reverse coater method.
[0051]
The coating liquid drying unit 95 vaporizes the solvent of the image receiving layer of the first sheet material 10 and the writing layer of the second sheet material 20 to form a coating layer on both sides.
[0052]
The cutting portion 74 includes a cutter upper die 74a and a cutter lower die 74b which are vertically opposed to each other. The cutter upper die 74a is provided so as to be movable up and down, and the first sheet material 10 and the second sheet material 20 are heat-welded. In this state, it is cut into a sheet shape, and the laminate 84 is sent to the punching unit 73.
[0053]
The punching unit 73 is provided with a card punching device 100. The card punching apparatus 100 forms a card product of a laminate 84 from a resin sheet P formed by arranging product parts such as an IC chip and an antenna circuit.
[0054]
FIG. 4 shows a card punching device. The card punching device 100 according to this embodiment includes a step of positioning at the first stage A, cutting out by the press device 80, and cutting out the arc portion 1a at the four corners of the card at the cutout portion 1d by the press device 80; The step of cutting the card side 1b in the sheet conveyance direction with the laser 81 while feeding the resin sheet P to the stage B of the sheet B, positioning the strip-shaped resin sheet P on the second stage B, and orthogonal to the sheet conveyance direction A card side 1c to be cut out by a laser 81.
[0055]
In this way, after cutting the arcuate portion 1a at the four corners of the card with the cutter 80, the card 81 is cut out by cutting out the four sides 1b and 1c of the card portion from the resin sheet P using the laser 81. Occasionally, cracks from the edge of the resin sheet P can be prevented, and the protrusion of the adhesive layer and cutting failure can be reduced, and the card edge can be cut well, resulting in adhesive strength, heat resistance, water resistance, and chemical resistance. A card product portion can be molded from a resin sheet excellently and easily and efficiently.
[0056]
FIG. 5 is a view showing another embodiment of the card punching device. The card punching device 100 according to this embodiment includes a step of positioning at the first stage A, cutting out by the press device 80, and cutting out the arc portion 1a at the four corners of the card at the cutout portion 1d by the press device 80; And moving the laser 81 that cuts out the four sides of the card portion along the short side 1b and the long side 1c of the card to cut out the card portion.
[0057]
In this way, the arc device 1a at the four corners of the card is first cut by the press device 80, and then the four sides 1b and 1c of the card portion are cut out from the resin sheet P by using the laser 81. Prevents cracking from the edge of the resin sheet at the time of punching, reduces the protrusion of the adhesive layer and cutting defects, and has excellent card edge cutting ability, resulting in adhesive strength, heat resistance, water resistance, and chemical resistance. A card product portion can be molded from a resin sheet excellently and easily and efficiently.
[0058]
As the laser used in the present invention, a CO ₂ laser or a YAG laser that is generally used for cutting applications can be used.
[0059]
FIG. 6 is a diagram showing another embodiment of the card punching device. In the card punching apparatus 100 of this embodiment, the stage C is provided with a plurality of means 85 for detecting the printing position of the card product part and means 86a, 86b, 86c for cutting out the card part. The means 85 for detecting the printing position is composed of, for example, a CCD or the like, detects a mark indicating the printing position of the card product attached to the resin sheet P, and prints the card product from the means 85 for detecting the printing position. The position detection information that has detected the position is sent to the control device 87.
[0060]
The cut-out means 86a is a press device, and is cut out by the cut-out means 86a, and the cut-out portion 1d cuts out the arc portion 1a at the four corners of the card. The cutting means 86b is a laser and cuts out the card short side 1b. The cutting means 86c is a laser and cuts out the card long side 1c.
[0061]
The control device 87 controls each of the cutting means 86a, 86b, 86c based on the position detection information from the printing position detecting means 85, and individually cuts out card portions.
[0062]
As described above, this embodiment has a mechanism that can individually adjust the card part cutout position, detects the print position of the card product, and individually adjusts the card part cutout position based on the position detection information. By doing so, the card product can be reliably cut out from the resin sheet P.
[0063]
This resin sheet P is a sheet in which a PET resin as a surface layer is bonded through an adhesive layer softer than the surface layer, and can prevent protrusion of the adhesive layer and cutting failure, and has good cutability at the end of the card. Excellent adhesive strength, heat resistance, water resistance, and chemical resistance.
[0064]
【The invention's effect】
As described above, in the invention described in claim 1, by using a laser to separate the card portion, it is possible to prevent the occurrence of cracks from the end of the resin sheet when the card is punched, and It can reduce cutting defects and has good cutting ability at the end of the card, with excellent adhesive strength, heat resistance, water resistance, and chemical resistance.
[0065]
In the invention according to claim 2, after cutting the arc portions at the four corners of the card first, the laser sheet is then used to cut out the four sides of the card portion from the resin sheet. Can prevent cracking from the edge of the card, reduce the protrusion of the adhesive layer and cutting defects, and has good cutting properties at the card edge, excellent adhesive strength, heat resistance, water resistance, chemical resistance, and easy Card products can be efficiently molded from resin sheets.
[0066]
In the invention according to claim 3, in the sheet in which the resin sheet is bonded to the surface of the PET resin through the adhesive layer softer than the surface layer, the protrusion of the adhesive layer and cutting failure can be reduced. Excellent card edge cutting ability, excellent adhesive strength, heat resistance, water resistance, and chemical resistance.
[0067]
In the invention according to claim 4, after cutting the arc portions at the corners of the card 4 first, and then using a laser, the four sides of the card portion are cut out from the resin sheet. Can prevent cracking from the edge of the card, reduce the protrusion of the adhesive layer and cutting defects, and has good cutting properties at the card edge, excellent adhesive strength, heat resistance, water resistance, chemical resistance, and easy Card products can be efficiently molded from resin sheets.
[0068]
In the invention according to claim 5, after cutting the arc portions at the corners of the card 4 first, and then using a laser, the four sides of the card portion are cut out from the resin sheet. Can prevent cracking from the edge of the card, reduce the protrusion of the adhesive layer and cutting defects, and has good cutting properties at the card edge, excellent adhesive strength, heat resistance, water resistance, chemical resistance, and easy Card products can be efficiently molded from resin sheets.
[0069]
In the invention according to claim 6, the card product can be reliably cut out from the resin sheet by detecting the printing position of the card product and individually adjusting the card partial cutout position based on the position detection information.
[0070]
In the invention according to claim 7, the resin sheet protrudes from the adhesive layer by applying the sheet of PET resin, which is the surface layer, to the device of the present invention, which is bonded via an adhesive layer softer than the surface layer. And a cutting defect can be reduced, and a card having excellent cut strength at the end of the card and excellent adhesive strength, heat resistance, water resistance, and chemical resistance can be produced.
[Brief description of the drawings]
FIG. 1 is a plan view showing an example of a non-contact type IC card having no metal terminal on its surface.
FIG. 2 is a cross-sectional view schematically showing a layer configuration of an IC card.
FIG. 3 is a diagram showing an embodiment of an IC card manufacturing apparatus.
FIG. 4 is a diagram showing a card punching device.
FIG. 5 is a view showing another embodiment of the card punching device.
FIG. 6 is a view showing another embodiment of the card punching device.
[Explanation of symbols]
2 Antenna substrate 2a Substrate 2b IC chip 2c Antenna circuit 6, 7 Adhesive layer 10 First sheet material 20 Second sheet material 27 Laminating unit 41, 43 Adhesive application device 72 Heating and pressing unit 100 Card punching device

Claims (7)

In a card punching method for molding a card product from a resin sheet formed by arranging product parts,
A card punching method, wherein a card portion is separated using a laser. In a card punching method for molding a card product from a resin sheet formed by arranging product parts,
A card punching method comprising: first cutting arc portions at four corners of a card, and then cutting out four sides of the card portion from the resin sheet using a laser. The card punching method according to claim 1 or 2, wherein the resin sheet is a sheet in which a PET resin as a surface layer is bonded through an adhesive layer softer than the surface layer. In a card punching device that molds card products from resin sheets formed by arranging product parts,
Positioning on the first stage and cutting out arcs at the four corners of the card;
Cutting the card side in the sheet conveying direction with a laser while feeding the resin sheet to the second stage;
A card punching device comprising: a step of positioning a strip-shaped resin sheet on the second stage and cutting out a card side perpendicular to the sheet conveying direction with a laser. In a card punching device that molds card products from resin sheets formed by arranging product parts,
Positioning on the first stage and cutting out arcs at the four corners of the card;
A card punching device comprising: a step of cutting a card portion by moving a laser that cuts out the four sides of the card portion in the second stage along the short side of the card and the long side of the card. In a card punching device that forms a card product from a resin sheet formed by arranging a plurality of product parts,
The stage comprises a plurality of means for detecting the printing position of the card product and means for cutting out the card portion,
A card punching device, characterized in that each of the cutting means has a mechanism capable of individually adjusting the card partial cutout position based on the position detection information. The card punching according to any one of claims 4 to 6, wherein the resin sheet is a sheet in which a PET resin as a surface layer is bonded through an adhesive layer softer than the surface layer. apparatus.

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