JP2007190456A - Manufacturing apparatus for laminated body - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To accomplish a desired thickness distribution and to eliminate a waste of a product and ununiformness of a quality on manufacturing. <P>SOLUTION: In the manufacturing apparatus for the laminated body, a pair of sheet materials is coated with a polymer melt by an extrusion type coater head 200 and the polymer melt of the pair of sheet materials are stuck while opposed to each other. The coater head 200 has a flow-in channel 203 for making the polymer melt flowing-in, and a means A for gradually increasing a channel diameter of the channel for flowing the polymer melt flowing-in from the flow-in channel 203 to an end in a sheet material width direction. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an apparatus for manufacturing a laminate in which an adhesive is applied to the surface of a sheet material, and a plurality of sheet materials are laminated via the adhesive.

  In general, as a method of applying a polymer melt adhesive to the surface of various plastic film sheets, there is a method using a spin coater, roll coater, blade coater, die coater or the like. In particular, when a reactive adhesive such as a moisture curing type is used, it is preferable to use a die coater in order to prevent unnecessary curing reaction from proceeding before coating.

  In addition, it is known to produce a laminate by bonding a plurality of sheet materials with a press device or the like through an adhesive layer. For example, for use in building materials such as door panels and wall materials, recording on optical disks, etc. There are card applications such as materials and IC cards with built-in electronic components between plastic substrates.

Further, an electronic information recording card using a hot-melt type adhesive and a manufacturing method thereof are disclosed in, for example, Japanese Patent Laid-Open Nos. 10-147087 and 2002-157561. In this case, an adhesive is applied to one or both of the substrates, each substrate is moved from the adhesive application device to a press or a laminating device, and the substrates are bonded together.
Japanese Patent Laid-Open No. 10-147087 JP 2002-157561 JP

  For example, in the manufacturing process of a laminated body such as a non-contact type IC card, an extrusion type coater head is used for a pair of sheet materials, and an adhesive is interposed to bond the front and back sheets together. However, generally, a coating width of about several tens of cm is formed according to the size so that a plurality of cards are arranged in the sheet. The device for applying the adhesive is, for example, a coater shape having a plurality of on-off valves in the seat width direction via the supply pipe and the first manifold in the center and further having a slit on the downstream side. A thickness distribution that gradually increases toward the end in the sheet width direction is generated. Since the thickness distribution in the sheet width direction appears in the card thickness distribution after a subsequent card molding step, the card has a high quality with many variations. Further, when individual information or the like is printed on the card surface, the thickness distribution varies in printability, resulting in a large quality variation.

  On the other hand, assuming that the coating head has been improved to make the distribution in the sheet width direction uniform, the coating film thickness distribution is read by a sensor, information is fed back to the means for changing the slit interval of the coater, and the coater is repeated while repeating trial and error. It is known to control the film thickness distribution by adjusting the slit interval, but the structure to change the slit interval according to the situation becomes large, and the laminate is manufactured while reading the coating film thickness distribution information When this happens, while adjusting the coating film thickness distribution and the slit interval, defective products continue to be produced, which is a production issue.

  The present invention has been made in view of the above points, and an object of the present invention is to provide a laminate manufacturing apparatus that has a desired thickness distribution and can eliminate manufacturing waste and quality variations.

  In order to solve the above problems and achieve the object, the present invention is configured as follows.

According to the first aspect of the present invention, a polymer melt is applied to a pair of sheet materials with an extrusion type coater head, and the polymer melts of the pair of sheet materials are opposed to each other. In the manufacturing apparatus of the laminated body to be combined,
The coater head is
An inflow channel into which the polymer melt flows;
Means for gradually increasing the flow path diameter of the flow path for flowing the polymer melt flowing in from the flow path from the central portion to the sheet material width direction end;
It is the manufacturing apparatus of the laminated body characterized by having.

The invention according to claim 2, wherein the coater head is
An inflow channel into which the polymer melt flows;
A first manifold that flows the polymer melt flowing in from the inflow channel in the sheet material width direction;
A plurality of communication passages having opening and closing valves arranged in the sheet material width direction;
A second manifold for flowing the polymer melt flowing in communication with the plurality of communication paths in the sheet material width direction;
A slit portion that communicates with the second manifold and discharges the polymer melt;
Have
The means for gradually increasing the flow path diameter is characterized in that the flow path diameter of the first manifold is gradually increased from the central part toward the end in the sheet material width direction. Device.

The invention according to claim 3, wherein the coater head is
An inflow channel into which the polymer melt flows;
A first manifold that flows the polymer melt flowing in from the inflow channel in the sheet material width direction;
A plurality of communication passages having opening and closing valves arranged in the sheet material width direction;
A second manifold for flowing the polymer melt flowing in communication with the plurality of communication paths in the sheet material width direction;
A slit portion that communicates with the second manifold and discharges the polymer melt;
Have
The means for gradually increasing the flow passage diameter is characterized in that the flow passage diameters of the plurality of communication passages having the opening / closing valve are gradually increased from the communication passage in the central portion toward the communication passage at the end in the sheet material width direction. It is a manufacturing apparatus of the laminated body of Claim 1.

The invention according to claim 4, wherein the coater head is
An inflow channel into which the polymer melt flows;
A first manifold that flows the polymer melt flowing in from the inflow channel in the sheet material width direction;
A plurality of communication passages having opening and closing valves arranged in the sheet material width direction;
A second manifold for flowing the polymer melt flowing in communication with the plurality of communication paths in the sheet material width direction;
A slit portion that communicates with the second manifold and discharges the polymer melt;
Have
The means for gradually increasing the flow path diameter is characterized in that the flow path diameter of the second manifold is gradually increased from the center toward the end in the sheet material width direction. Device.

  With the above configuration, the present invention has the following effects.

  In the invention according to claim 1, the flow path diameter of the flow path having a structure in which the polymer melt flowing from the inflow path located at the substantially central portion of the coater head flows to the end in the sheet material width direction is set to the inflow path. By gradually increasing the width from the center of the sheet material to the end in the sheet material width direction, the stress applied to the polymer melt itself is almost even at any position of the width of the discharge port of the slit portion provided in the sheet material width direction. As a result, a desired thickness distribution can be obtained with a simple structure, and it is possible to eliminate waste and quality variations of products in manufacturing.

  In the invention according to claim 2, since the flow path diameter of the first manifold of the coater head is gradually increased from the center toward the end in the sheet material width direction, the stress that the polymer melt itself receives is reduced to the sheet. It becomes almost uniform at any position in the width direction of the material, so that a desired thickness distribution can be obtained simply and desired, and it is possible to eliminate the waste of products and variations in quality.

  In the invention according to claim 3, the flow path diameter of the plurality of communication passages having the open / close valve of the coater head is gradually increased from the communication passage of the central portion toward the communication passage of the sheet material width direction end, The stress applied to the polymer melt itself is almost uniform at any position in the width direction of the sheet material, providing a desired desired and desired thickness distribution, and eliminating waste and quality variations in manufacturing products. .

  In the invention according to claim 4, since the flow path diameter of the second manifold of the coater head is gradually increased from the center toward the end in the sheet material width direction, the stress that the polymer melt itself receives is reduced to the sheet. It becomes almost uniform at any position in the width direction of the material, and a desired thickness distribution can be obtained with a simple structure, and it is possible to eliminate waste and quality variations of products in manufacturing.

  Hereinafter, although the embodiment of the manufacturing device of the layered product of the present invention is described, the embodiment of the present invention shows the most preferable mode of the present invention, and the present invention is not limited to this.

  In the laminate manufacturing apparatus of the present invention, a polymer melt is applied to a pair of sheet materials with an extrusion type coater head, and the polymer melts of the pair of sheet materials are attached to face each other. For example, an adhesive can be used as the polymer melt. As an example of application to the manufacturing apparatus of the laminate, there is a card manufacturing apparatus, specifically, a business card, nameplate, passport, examination card, telephone card, identification card, driver's license, commuter pass, cash card, A card including an IC card or the like, which is generally about the size of a hand and is often carried around. Here, an example of an employee card of a company to which an IC card is applied will be described, but the application example is not limited to this form.

  An IC card contains an IC unit in a recess provided in a part of a base made of a synthetic resin such as vinyl chloride resin. Depending on the electrical contact between the IC and the external circuit, the contact type and non-contact type There is a type. However, if the contact terminal is exposed on the card surface as in the contact type, the contact surface may be deteriorated, the contact may be defective, and power supply to the IC card and data signal input / output may not be performed. .

  In view of this, an IC card having a configuration in which an electromagnetic wave is generated and / or received by an antenna coil for exchanging electrical signals in a non-contact manner has appeared.

  FIG. 1 is a plan view showing an example of such a contactless IC card having no metal terminal on the surface. In the figure, an IC card 1 is provided with a module substrate 2 on which an IC chip 2a and an antenna 2b as a signal transmitting / receiving unit for R / W (read / write) are mounted on a base material 2c. Since the IC chip 2a has a weak point pressure strength, it is also preferable to have a reinforcing plate in the vicinity of the IC chip. The key information portion 3 of the IC card 1 is attribute identification information for identifying the IC card 1 and other cards, and is, for example, a code number given to the surface of the IC card 1. The character information section 4 of the IC card 1 is a name, a workplace, an issue date, and the like attached to the surface of the IC card 1, and the image information section 5 is image information such as a face.

  FIG. 2 is a cross-sectional view schematically showing the layer configuration of the IC card. The module substrate 2 in which the IC chip 2a and the antenna 2b are mounted on the base material 2c is enclosed in the adhesive layers 6 and 7 interposed between the first sheet material 10 and the second sheet material 20. This is a configuration of the IC card 1.

  As the sheet material of the IC card 1 composed of the first sheet material 10 and the second sheet material 20, a sheet material such as resin or paper can be used. This sheet material is, for example, polyethylene terephthalate resin, polyethylene resin, polypropylene resin, acrylonitrile butadiene styrene copolymer resin, polyvinyl chloride resin, polyphenylene sulfide resin, polyimide resin, fine paper, matte paper, coated paper, synthetic paper, etc. It is. Further, the surface sheet portion may be subjected to easy adhesion treatment (primer application, corona discharge treatment, plasma treatment, etc.) in order to enhance the adhesion with the adhesive.

  The module substrate is an intermediate inlet provided with a mounting portion for an antenna or an IC chip on a base material, and may include a capacitor in some cases. As the substrate, for example, an insulating plastic sheet having a thickness of about 10 to 100 μm and made of a resin such as epoxy, glass epoxy, polyimide, polycarbonate, PVC, PET, or ABS is generally used. In addition, as a connection body between the IC chip and the antenna, a gold bump or nickel bump is used for the input / output terminal of the IC chip, and for example, a direct connection of both ends of a coil of an antenna formed by winding a copper wire is self-crimping. It is also possible to use a structure in which the two nonwoven fabric sheets having the properties are integrated with each other.

  For example, examples of the non-woven sheet member include a mesh woven fabric such as a non-woven fabric, and a plain woven fabric, a twill woven fabric, and a satin woven fabric. In addition, a fabric having pile called moquette, plush velor, seal, velvet, or suede can be used. Materials include polyamides such as nylon 6, nylon 66 and nylon 8, polyesters such as polyethylene terephthalate, polyolefins such as polyethylene, polyvinyl alcohols, polyvinylidene chloride, polyvinyl chloride, polyacrylonitrile, acrylamide, methacryl Acrylics such as amides, synthetic resins such as polycyanide vinylidene, polyfluoroethylene, and polyurethane, natural fibers such as silk, cotton, wool, cellulose, and cellulose ester, recycled fibers (rayon, acetate), aramid fibers The fiber which combined the 1 type (s) or 2 or more types chosen from among these is raised. Of these fiber materials, rayon that is preferably polyamide-based such as nylon 6 or nylon 66, acrylic-based such as polyacrylonitrile, acrylamide or methacrylid, polyester-based such as polyethylene terephthalate, cellulose-based as recycled fiber, or cellulose ester-based And acetate and aramid fibers.

  Self-compression bonding means that when a compressive force is applied to a flexible substrate at room temperature or under heating, each fiber constituting the flexible substrate is bonded, and a plurality of flexible substrate materials are stacked to apply a compressive force. In some cases, the superimposed flexible substrate materials are bonded to each other. For example, when the fibers constituting the nonwoven fabric are coated with PET-G, the nonwoven fabric is pressed by heating at a temperature equal to or higher than the melting point of PET-G. The sheet material is self-bonded.

  In addition, since the nonwoven sheet material has compressibility in the thickness direction, when the two nonwoven sheet materials are compressed in the thickness direction with the IC chip and antenna connection body interposed therebetween, the two nonwoven sheet materials Since the concave portion for embedding the connection body is formed on the inner surface of the non-woven fabric, and the surface of the nonwoven fabric sheet material can be formed flat, the information carrier such as a non-contact type IC card having a flat surface and excellent aesthetics is produced. be able to.

  The antenna exchanges data with an external reader / writer in a non-contact manner. The shape, number of turns, etc. are the size of the antenna coil on the receiving side, and how far away it can travel (communication distance) It depends on what frequency radio wave is received (communication frequency).

  In addition, since the IC chip has a weak point pressure applied locally, it is preferable to have a metal reinforcing plate as a reinforcing structure in the vicinity of the IC chip or a ring-shaped reinforcing member around the IC chip.

  The thickness of the module substrate is preferably 10 to 300 μm, more preferably 30 to 300 μm, still more preferably 30 to 250 μm.

  As the adhesive used in the present invention, for example, an epoxy two-component mixed type, a UV curable adhesive, a hot melt adhesive, preferably a moisture curable reactive hot melt adhesive is used. As the hot melt resin, ethylene vinyl copolymer resin, polyolefin, polyester, acrylamide, polyurethane and the like can be used. When the card substrate which is a laminate is easily warped, or when a layer susceptible to high-temperature processing such as an image receiving layer for image formation by thermal transfer is provided on the card surface, the image receiving layer is formed when the bonding temperature is too high. The temperature of the sheet material and the adhesive when pasting through an adhesive due to problems such as damage, thermal contraction of the sheet material, and deterioration of dimensions and positional accuracy during pasting. Are preferably bonded at 80 ° C. or lower, more preferably 10 to 80 ° C., and still more preferably 20 to 80 ° C. Among adhesives that adhere at low temperatures, specifically, a reactive hot melt adhesive is preferable. Particularly preferred in the present invention is a photocurable hot melt adhesive, which is activated by irradiating it with an energy beam such as an electron beam or an ultraviolet ray as disclosed in JP-A-2001-56849. It consists of a photoreactive component that causes polymerization or crosslinking reaction by a photocationic polymerization initiator and a hot melt adhesive component. As a lamp serving as a light source for initiating the reaction, a low-pressure mercury lamp, a medium-pressure mercury lamp, a high-pressure mercury lamp, an ultrahigh-pressure mercury lamp, a microwave mercury lamp, a metal halide lamp, or the like including an emission wavelength of 300 to 500 nm can be used.

  Next, a laminated body manufacturing apparatus will be described. FIG. 3 shows an embodiment of an IC card manufacturing apparatus.

  The IC card manufacturing apparatus is provided with a feed shaft 50 for feeding the roll-shaped second sheet material 20, and the second sheet material 20 is guided and conveyed by guide rollers 51 and 52. An adhesive application device 41 for applying an adhesive to the second sheet material 20 fed from the feed shaft 50 is disposed. An adhesive is supplied and applied onto the second sheet material 20 from the adhesive application device 41, and then the module substrate 2 is supplied.

  Further, the IC card manufacturing apparatus is provided with a feed shaft 30 for feeding the roll-shaped first sheet material 10, and the second sheet material 20 is guided and conveyed by the guide rollers 31 to 33. An adhesive application device 42 for applying an adhesive to the second sheet material 20 fed from the feed shaft 30 is disposed.

  In this IC card manufacturing apparatus, a pressure unit 72, a coating unit 90, a coating liquid drying unit 95, a cutting unit 74, and a punching unit 73 are arranged on the transport path 100 along the transport direction.

  In the pressure unit 72, a pair of bonding rollers 72a and a plurality of pairs of pressure rollers 72b are arranged. The first sheet material 10 and the second sheet material 20 are bonded together by the pair of bonding rollers 72a, and the first sheet material 10 and the second sheet material bonded by a plurality of pairs of pressure rollers 72b. A predetermined pressure is applied to the first sheet material 10 and the second sheet material 20 which are conveyed under pressure and bonded together, and are brought into close contact with each other.

  The image receiving layer coating solution container 30 is provided above the coating unit 90, and a supply roller 31 a is provided in the image receiving layer coating solution container 30. The image receiving layer coating solution 33 is provided from the supply roller 31 a through the intermediate roller 31 b. Is supplied to the application roller 32, and by the reverse rotation of the application roller 32, the image receiving layer coating liquid 33 is applied to one surface side of the first sheet material 10, and the image receiving layer is formed on the surface by the reverse coater method.

  The application unit 90 is provided with a writing layer coating solution container 60 below, and a writing roller 61a is provided in the writing layer coating solution container 60, and the writing layer coating is applied from the supply roller 61a through the intermediate roller 61b. The liquid 63 is supplied to the application roller 62, and the writing layer application liquid 63 is applied to one surface side of the second sheet material 20 by the reverse rotation of the application roller 62, and a writing layer is formed on the surface by the reverse coater method.

  The coating liquid drying unit 95 vaporizes the solvent of the image receiving layer of the first sheet material 10 and the writing layer of the second sheet material 20 to form a coating layer on both sides.

  The cutting portion 74 includes a cutter upper die 74a and a cutter lower die 74b that are vertically opposed to each other. The cutter upper die 74a is provided so as to be movable up and down, and the first sheet material 10 and the second sheet material 20 are heated. The sheet 84 is cut in a welded state, and the sheet 84 is fed to the punching unit 73.

  The punching unit 73 includes a card punching upper die 73a and a card punching lower die 73b that are arranged facing each other in the vertical direction. The card punching upper die 73a is movable in the vertical direction so that the first sheet material 10 and the second sheet material 20 are integrated after being completely heat-welded, and thereafter punched to the size of the IC card 1. It has become. In the lower part of the card punching lower die 73b, there is provided a storage portion 85 for sequentially stacking and storing, for example, 4 to 100 IC cards 1 that have been punched from the sheet 84.

  The adhesive applicator 41 is configured as shown in FIGS. 4 and 5, and the adhesive applicator 42 is configured in the same manner as the adhesive applicator 41 and will not be described. FIG. 4 is a schematic configuration diagram showing an embodiment of the adhesive application device, and FIG. 5 is an enlarged view showing a passage of the adhesive application device.

  The adhesive coating apparatus 41 of this embodiment uses an extrusion type coater head 200, and the adhesive 300 is supplied from the adhesive tank 240 to the coater head 200 by driving the pump 250. The coater head 200 is configured by joining a divided head half 201 and a divided head half 202, and the divided head half 201 and the divided head half 202 are used to connect an inflow channel 203, a first manifold 204, and a plurality of continuous heads. Passages 205a to 205d, a second manifold 206, and a slit portion 207 are formed. In the slit portion 207, a discharge port 207a for applying the adhesive 300 is formed in the sheet material width direction.

  The inflow channel 203 is formed at the central portion in the sheet material width direction on the most upstream side of the coater head 200, and the adhesive is supplied to the inflow channel 203 by driving the pump 250. The first manifold 204 has a large-diameter passage cross-sectional area and is formed long in the sheet material width direction. The first manifold 204 flows in the sheet material width direction by reducing the flow rate of the adhesive 300 flowing in from the inflow channel 203. The plurality of communication passages 205a to 205d have opening / closing valves 205a1 to 205d1, and are formed by communicating the first manifold 204 and the second manifold 206. The plurality of communication passages 205 a to 205 d are arranged at equal intervals in the sheet material width direction, and the plurality of communication passages 205 a to 205 d have the same passage cross-sectional area so that the adhesive 300 flows evenly to the second manifold 206. It has become. Similar to the first manifold 204, the second manifold 206 is formed long in the sheet material width direction, and reduces the flow rate of the adhesive 300 flowing in from the plurality of communication paths 205a to 205d to flow in the sheet material width direction. The slit portion 207 is formed to communicate with the most downstream side in the sheet material width direction of the second manifold 206, and the adhesive 300 is discharged from the discharge port 207 a of the slit portion 207 to the second sheet material 20. 300 is applied.

  The coater head 200 of the present invention has means A for gradually increasing the flow path diameter of the flow path for flowing the adhesive 300 flowing in from the flow-in flow path 203 from the central portion to the end in the sheet material width direction. A characteristic of the flow of the polymer melt including the adhesive is that the internal stress of the polymer melt caused by flow resistance affects the thickness distribution in the course of the flow of the polymer melt in the pipe. That is, when the adhesive 300 that has flowed through a pipe or the like such as the coater head 200 is discharged from the discharge port 207a of the slit portion 207, the portion that receives more stress is the slit portion 207 and the second sheet material. 20 is discharged at a thickness larger than the interval W with respect to 20. Since the end portion with a longer flow process is more susceptible to stress and appears in the form of a thickness distribution, the flow path of the coater head 200 makes the degree of stress generation in the flow pipe approximately the same between the center portion and the end portion. It is effective, and by gradually increasing the diameter of the flow path of the adhesive 300 flowing in from the inflow flow path 203 to the end in the sheet material width direction, the stress received by the polymer melt itself becomes uniform. The thickness distribution can be improved.

  4 and 5, the flow path diameter D10 of the first manifold 204 is gradually increased from the central part 204a near the inflow flow path toward the sheet material width direction end part 204b. The degree to which the flow path diameter D10 of the first manifold 204 gradually increases from the central part 204a near the inflow flow path toward the end part 204b in the sheet material width direction is the viscosity of the adhesive 300, the length in the sheet material width direction, and the like. Can be changed. In the first manifold 204, the adhesive 300 flows in from the inflow channel 203. The adhesive 300 is distributed in the central portion near the inflow channel so as to be distributed to the plurality of downstream communication paths 205a to 205d. It flows from 204a toward the sheet material width direction end portion 204b. Since the flow path diameter of the first manifold 204 is gradually increased from the central portion 204a in the vicinity of the inflow flow path toward the sheet material width direction 204a, the internal stress of the adhesive 300 itself generated by the flow resistance is in the sheet material width direction. Therefore, the adhesive 300 allows the second manifold 206 and the slit portion 207 to pass through the plurality of communication passages 205a to 205d so as to have a desired thickness with a simple structure. It flows and is applied to the second sheet material 20 from the discharge port 207a, and it is possible to eliminate the waste and quality variation of the product in manufacturing.

  In the embodiment of FIG. 6, the flow path diameter D10 of the first manifold 204 is the same from the central part 204a near the inflow flow path toward the sheet material width direction end part 204b, but a plurality of communication paths 205a to 205d. Is gradually increased from the vicinity of the inflow channel toward the end in the sheet material width direction. That is, the flow path diameter D11 of the communication paths 205a and 205d is larger than the communication paths 205b and 205c, and the flow path diameter D11 of the communication paths 205a to 205d is gradually increased from the first manifold 204 toward the second manifold 206, respectively. Yes.

  For this reason, the adhesive 300 of the first manifold 204 flows into the second manifold 206 from the plurality of communication passages 205a to 205d, but flows into the second manifold wheel 206, but the flow path diameter of the communication passages 205a to 205d is small. Due to the difference, the internal efficacy of the adhesive 300 caused by the flow resistance when the adhesive 300 flows through the first manifold 204 and the communication paths 205a to 205d is almost equal at the outlet of any of the communication paths 205a to 205d. . Thereby, the adhesive 300 can be sent to the second manifold 206 from the plurality of communication paths 205a to 205d so as to have a desired thickness distribution with a simple structure, and the adhesive 300 is supplied to the second manifold 206, the slit portion. It is possible to flow through 207 and be applied to the second sheet material 20 from the discharge port 207a, thereby eliminating the waste and quality variation of the manufactured product.

  In the embodiment of FIG. 7, the flow path diameter D10 of the first manifold 204 is the same from the central part 204a in the vicinity of the inflow flow path toward the sheet material width direction end part 204b, and a plurality of communication paths 205a to 205d. The flow path diameter D11 of the second manifold 206 is the same as the sheet material from the central portion 206a near the inflow flow path. It gradually increases toward the end 206b in the width direction. The degree to which the flow path diameter D12 of the second manifold 206 gradually increases from the central part 206a near the inflow flow path toward the sheet material width direction end part 206b is the viscosity of the adhesive 300, the length in the sheet material width direction, and the like. Can be changed. In the second manifold 206, the adhesive 300 flows from the plurality of communication passages 205a to 205d, but the adhesive 300 flows so as to fill the second manifold 206 from the outlets of the communication passages 205a to 205d. Then, it flows to the discharge port 207a of the slit part 207. Since the flow path diameter of the second manifold 206 is gradually increased from the central portion 206a toward the sheet material width direction end portion 206b, the adhesive 300 is used in the first manifold 204, the communication passages 205a to 205d, and the second passage. The internal stress generated by the flow resistance when flowing through the manifold 206 is substantially uniform in any of the sheet material width direction of the discharge port 207a of the slit portion 207. As a result, the adhesive 300 is applied to the second sheet material 20 from the discharge port 207a through the second manifold 206 and the slit portion 207 so as to have a desired thickness distribution with a simple structure. It is possible to eliminate product waste and quality variations.

In the embodiment of FIG. 8, the means A for gradually increasing the flow path diameter is implemented for each of the first manifold 204, the plurality of communication passages 205a to 205d, and the second manifold 206. It may be performed for the plurality of communication passages 205a to 205d, may be performed for the first manifold 204 and the second manifold 206, and may be performed for the plurality of communication passages 205a to 205d and the second manifold 206. By providing the means A for gradually increasing the flow path diameter in this way, the adhesive 300 flowing in from the inflow flow path 203 located substantially at the center of the coater head 200 causes the first manifold 204 and the plurality of communication paths 205a to 205d to flow. The internal stress generated by the flow resistance when flowing through the second manifold 206 is substantially uniform in any of the sheet material width directions of the discharge port 207a of the slit portion 207. As a result, the adhesive 300 has a simple structure and a desired distribution, and it is possible to eliminate waste and quality variations of products in manufacturing.
[Example]
A 0.05 mm hot melt adhesive layer is applied onto a 0.18 mm thick PET sheet that is continuously conveyed, and a maximum thickness of 0.3 mm is further formed on a 0.04 mm thick PET film. After placing the IC module on which the transmitting / receiving antenna coil and the IC chip are placed in the three rows in the width direction on the sheet, the hot melt adhesive having a thickness of 0.35 mm is placed on the other PET sheet having a thickness of 0.18 mm. The sheet coated with the layers was bonded in the direction in which the adhesive faces to create a laminate having a plurality of IC cards. The hot melt adhesive layer used was a moisture curable polyurethane hot melt, and the viscosity at the time of application was 35000 mPa · sec.

  For the application of the adhesive onto the PET sheet, an extrusion type coater for hot melt was used. The basic structure is that it has an adhesive inlet at the center in the width direction of the head, a first manifold with an equivalent diameter of 15 mm, and four communication paths (with an equivalent diameter of 5 mm, open / close) arranged at equal intervals in the width direction. With a valve mechanism), a second manifold with an equivalent diameter of 20 mm, and a discharge port with a slit interval of 0.8 mm and a slit length of 10 mm downstream thereof. The application width of the adhesive is 300 mm, and three cards can be arranged in the width direction.

When the distribution of the adhesive film thickness direction was evaluated by changing the flow path configuration in the head, the film thickness difference was as small as 10% or less under the conditions of the present invention, and printing was good even in card surface printing, which is a subsequent process. Results were obtained.

  “20 mm inner thickness / width direction center thickness from end” expresses the ratio of the film thickness difference in the coating film width direction, and the closer to 1, the more the film thickness difference is not shown.

  The present invention can be applied to an apparatus for manufacturing a laminate in which an adhesive is applied to the surface of a sheet material, and a plurality of sheet materials are stacked via the adhesive. It is possible to eliminate quality variations.

It is a top view which shows an example of the non-contact-type IC card without a metal terminal on the surface. It is sectional drawing which shows the layer structure of an IC card typically. It is a figure which shows embodiment of the manufacturing apparatus of an IC card. Schematic configuration diagram showing an embodiment of an adhesive application device It is an enlarged view which shows the channel | path of an adhesive agent coating apparatus. It is an enlarged view which shows the channel | path of an adhesive agent coating apparatus. It is an enlarged view which shows the channel | path of an adhesive agent coating apparatus. It is an enlarged view which shows the channel | path of an adhesive agent coating apparatus.

Explanation of symbols

1 IC card
2 Module board
2a IC chip
2b antenna
2c Base material
3 Key information section
4 Character information section
5 Image information section
6,7 Adhesive layer
10 First sheet material
20 Second sheet material
41, 42 Adhesive application equipment
200 coater head
203 Inflow channel
204 First manifold
205a-205d Multiple communication paths
206 Second manifold
207 Slit
240 adhesive tank
250 pump
300 Adhesive A Means to gradually increase the channel diameter

Claims (4)

In an apparatus for manufacturing a laminate in which a polymer melt is applied to a pair of sheet materials with an extrusion type coater head, and the polymer melts of the pair of sheet materials are opposed to each other,
The coater head is
An inflow channel into which the polymer melt flows;
Means for gradually increasing the flow path diameter of the flow path for flowing the polymer melt flowing in from the flow path from the central portion to the sheet material width direction end;
An apparatus for producing a laminate, comprising: The coater head is
An inflow channel into which the polymer melt flows;
A first manifold that flows the polymer melt flowing in from the inflow channel in the sheet material width direction;
A plurality of communication passages having opening and closing valves arranged in the sheet material width direction;
A second manifold for flowing the polymer melt flowing in communication with the plurality of communication paths in the sheet material width direction;
A slit portion that communicates with the second manifold and discharges the polymer melt;
Have
The means for gradually increasing the flow path diameter is characterized in that the flow path diameter of the first manifold is gradually increased from the central part toward the end in the sheet material width direction. apparatus. The coater head is
An inflow channel into which the polymer melt flows;
A first manifold that flows the polymer melt flowing in from the inflow channel in the sheet material width direction;
A plurality of communication passages having opening and closing valves arranged in the sheet material width direction;
A second manifold for flowing the polymer melt flowing in communication with the plurality of communication paths in the sheet material width direction;
A slit portion that communicates with the second manifold and discharges the polymer melt;
Have
The means for gradually increasing the flow passage diameter is characterized in that the flow passage diameters of the plurality of communication passages having the opening / closing valve are gradually increased from the communication passage in the central portion toward the communication passage at the end in the sheet material width direction. The manufacturing apparatus of the laminated body of Claim 1. The coater head is
An inflow channel into which the polymer melt flows;
A first manifold that flows the polymer melt flowing in from the inflow channel in the sheet material width direction;
A plurality of communication passages having opening and closing valves arranged in the sheet material width direction;
A second manifold for flowing the polymer melt flowing in communication with the plurality of communication paths in the sheet material width direction;
A slit portion that communicates with the second manifold and discharges the polymer melt;
Have
The means for gradually increasing the flow path diameter is characterized in that the flow path diameter of the second manifold is gradually increased from the center toward the end in the sheet material width direction. apparatus.