JP2007011534A - Sheet with built-in ic chip - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a sheet with a built-in IC chip that protects the IC chip against mechanical outer forces, keeps a tape from being pulled out, and prevents dropping or damaging of the IC chip. <P>SOLUTION: The sheet with a built-in IC chip is characterized in that, in an antenna-equipped IC chip where an external antenna is joined to an IC chip having a built-in memory and being 0.6 mm or less long on each side, an external-antenna-equipped IC chip carrier tape where that IC chip part is buried in a narrowly slit tape is inserted into a sheet-shaped object. The carrier tape is either inserted into or affixed to the sheet-shaped object while being partly exposed. The carrier tape is made of either paper or a combination of paper and film bonded together. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  More particularly, the present invention relates to an RFID chip built-in sheet with an external antenna.

  In recent years, advances in copier technology have facilitated the forgery of securities, which has become a major social problem, so banknotes, gift certificates, checks, stock certificates, passports, identification cards, cards, etc. cannot be illegally altered or forged. Thus, various anti-counterfeiting measures are taken.

  As a countermeasure against forgery, forgery prevention paper called “threaded paper” in which a thread (tape) called “thread” is drawn between paper layers has been developed (Patent Documents 1 to 4). Threaded paper requires a high level of technology for drawing threads and is therefore suitable as a means for preventing forgery, and is often used in banknotes and gift certificates in various countries.

  In addition, in order to further enhance the anti-counterfeiting effect of the threaded paper, a technique of making paper or forming a micro character or a micro image made of a metal vapor deposition layer on the surface of the thread has been proposed (patent) Reference 5).

  Recently, in order to further enhance the anti-counterfeiting effect, a method has been proposed in which a thread having an IC chip bonded to one side of a thin film is inserted into a sheet-like material such as paper or a plastic sheet (Patent Document 6, 7)

  The anti-counterfeit paper using a thread to which an IC chip is bonded as disclosed in Patent Documents 6 and 7 exhibits a better anti-counterfeit function than the anti-counterfeit paper using only a thread. However, the following problems may occur due to the structure.

Since the portion where the IC chip of the thread is bonded becomes a convex portion, the IC chip is easily peeled off by an external force. In particular, there is a possibility that the IC chip may peel off from the thread and fall off at places where mechanical external force or heat is applied in the paper making process (wire, press, dryer, calender). Because it is difficult to detect that the paper has been dropped during the paper making process, if a single IC chip is missing after printing as a forgery-proof ticket after printing, numbering (number given to the forgery-proof ticket) is printed. The problem arises that you have to reprint. In addition, the IC chip may fall off during distribution or use.

Further, since the thread IC chip bonded portion becomes a convex portion, the IC chip itself may be damaged by an external force such as a calendar, and the circuit / function may be impaired. In order to reduce the external force applied to the IC chip, a configuration in which a groove is provided in a portion where a paper thread is inserted is also conceivable. However, in this case as well, the part to which the IC chip is adhered becomes a raised part because it is thicker than the film-only part. Therefore, there is a limit to the effect of avoiding concentration of external force.
In particular, if the sheet is paper, at least a portion of the paper as the tape material has good adhesion between the sheet and the tape because the expansion rate due to heat during drying during paper manufacture is close to the tape, As a result, it is difficult to pull out the tape from the IC chip built-in sheet.
JP-A-48-75808 JP 50-88377 A JP 51-130308 A Japanese Patent Laid-Open No. 10-292297 Japanese Patent Laid-Open No. 10-219597 JP 2002-319006 A JP 2004-139405 A

  An object of the present invention is to provide an IC chip built-in sheet in which the IC chip is not easily subjected to mechanical external force, the tape is not easily pulled out, and the IC chip is not dropped or damaged.

In order to solve the above problems, the present invention includes the following aspects.
(1) An IC chip carrying tape with an external antenna embedded in a tape in which a chip portion of an IC chip with an antenna obtained by bonding an external antenna to an IC chip with a side of 0.6 mm or less containing a memory is narrowly slit. IC chip built-in sheet inserted inside the sheet.
(2) The IC chip built-in sheet according to (1), wherein the IC chip-carrying tape with an external antenna is inserted into a sheet-like material with a part thereof exposed.
(3) The IC chip built-in sheet according to (1), wherein the tape material is paper or a laminate of paper and film.

(4) An IC chip carrying tape with an external antenna, in which a chip portion of an IC chip with an external antenna joined to an IC chip with a side of 0.6 mm or less with a built-in memory is embedded in a narrow slit tape However, the IC chip built-in sheet is attached to the sheet.
(5) The IC chip built-in sheet according to (4), wherein the tape material is paper or a laminate of paper and film.

According to the present invention, since the IC chip is embedded in the tape main body, it is difficult to receive a mechanical external force, so that an IC chip built-in sheet that does not drop or damage the IC chip can be obtained.
In particular, when the sheet material is paper, the sheet material and the tape material are the same, the adhesiveness is increased, and it becomes difficult to pull out the tape from the IC chip built-in sheet, and the forgery prevention effect is further enhanced.

  Hereinafter, the present invention will be described in detail with reference to the drawings. In the drawings used in the following description, for convenience of explanation, the dimensional ratio is different from the actual one, and in particular, the thickness direction is shown enlarged.

According to the present invention, as shown in FIGS. 1 and 2, the semiconductor chip 10 having the external antenna 11 is bonded to the front surface or the back surface of the tape 20 with an adhesive. At this time, the IC chip body is embedded in a hole provided in advance. Adhesives such as water-soluble adhesives such as PVA, starch, sodium alginate, polychloroprene adhesives, polyurethane adhesives, thermoplastic SBR adhesives, hot melt adhesives, epoxy adhesives, vinyl adhesives, Phenoxy resin adhesives, polyester adhesives, polysulfone adhesives and the like can be used alone or in combination. In particular, an adhesive excellent in water resistance and heat resistance is preferable. For example, a two-component curable epoxy adhesive is a typical example. In addition, when it is desired to cure the adhesive instantaneously, an ultraviolet curable adhesive can be used. Although there is no limitation in the width | variety of the tape main body 20, it is preferable to set it as 1-10 mm in width. The length is preferably as long as possible, but can be 500 to 20000 m.
The tape main body 20 includes a first base material and a second base material. The first base material and the second base material may be bonded separately or may be configured integrally with the same material.

The IC chip 10 has an IC (integrated circuit) connected to an antenna. The IC chip 10 can read and / or write information stored in the memory by applying electric energy to the IC chip 10 by a non-contact recognition method.
Although the IC chip 10 is preferably as small as possible, it can be used as long as one side is usually 1 mm or less, and is preferably 0.6 mm or less. The thickness should just be thinner than the thickness of the IC chip built-in sheet of the final product. For example, a fine and thin one with a side of 0.4 mm and a thickness of 160 μm can be used. Although the manufacturing method of the IC chip 10 is not particularly limited, for example, it can be manufactured by the method described in Patent Document 6.

  The material of the first base material and the second base material is not particularly limited, but paper, plastic film, etc. can be used. Among them, one in which one of the first base material and the second base material is made of paper and the other is made of a plastic film is preferable because it stretches less when it is rolled into paper or the like as an IC chip built-in tape.

  Various materials can be applied as the base material of the plastic film depending on the insulating properties, mechanical strength, and usage. For example, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyethylene terephthalate / isophthalate copolymer, terephthalic acid / cyclohexanedimethanol / ethylene glycol copolymer, cyclohexanedimethanol / ethylene glycol copolymer, polyethylene terephthalate / polyethylene naphthalate Polyester resins such as co-extruded films of phthalate, polyamide resins such as nylon 6, nylon 66 and nylon 610, polyolefin resins such as polyethylene, polypropylene and polymethylpentene, vinyl resins such as polyvinyl chloride, polyacrylates, Acrylic resins such as polymethacrylate and polymethylmethacrylate, polyimide, polyamideimide, polyether Engineering resins such as imide resins such as imide, polyarylate, polysulfone, polyethersulfone, polyphenylene ether, polyphenylene sulfide (PPS), polyaramid, polyetherketone, polyethernitrile, polyetheretherketone, polyethersulfite There are styrene resins such as polycarbonate, polystyrene, high impact polystyrene, AS resin, ABS resin, cellophane, cellulose triacetate, cellulose diacetate, and cellulose films such as nitrocellulose.

  The paper is not particularly limited, but paper containing metal or the like that hinders communication with the IC chip 10 is not preferable. Further, synthetic paper can be used as necessary.

  In the IC chip built-in tape of the present embodiment, since the entire IC chip 10 is embedded in the tape body 20, it is difficult to receive a mechanical external force. Therefore, according to the IC chip built-in tape of this embodiment, an IC chip built-in sheet in which the IC chip 10 is not dropped or damaged can be obtained.

[IC chip built-in sheet]
(First embodiment of IC chip built-in sheet)
3 and 4 are schematic configuration diagrams of the first embodiment of the IC chip built-in sheet according to the present invention, FIG. 3 is a plan view, and FIG. 4 is a sectional view taken along line III-III ′ of FIG.
As shown in FIG. 3 and FIG. 4, the IC chip built-in sheet of this embodiment is composed of the IC chip built-in tape 1 and the sheet-like material 2 according to the present invention. It is inserted inside the object 2.

  The material of the sheet-like material 2 is not particularly limited, and paper, plastic film, etc. can be used. Among them, it is preferable to use paper because the IC chip built-in tape 1 can be inserted in the paper making process. Examples of the method for producing the IC chip built-in sheet according to the present embodiment include a single-layer or multi-layer paper method in which an IC chip built-in tape is inserted in the paper making process, or a method in which a plurality of substrate sheets are bonded. It is done.

For example, the single-layer paper making method is such that the IC chip built-in tape 1 is fed out together with the material supplied to the paper making net from the slice of a long paper machine, and the IC chip is built in the paper layer formed on the paper making net. A method of inserting the tape 1 so as to be buried (Japanese Patent Application Laid-Open No. 51-13039) or an IC chip built-in tape 1 insertion device installed in the stock flowing out of the flow box of the long paper machine, There is a method of making the IC chip built-in tape 1 in a non-contact state between the chip built-in tape 1 and the paper (Japanese Patent Laid-Open No. 2-169790).
As a multi-layer paper making method, for example, when producing a laminated paper having at least two layers by using a multi-tank type net paper machine, the IC chip built-in tape 1 is inserted between the paper layers immediately before each paper layer is overlaid. Can be used. In this case, it is preferable to use a combined paper composed of at least three layers of a pair of outermost paper layers and an inner paper layer.

In the case of multilayer papermaking, it is preferable to make paper without attaching the sheet raw material to all or a part of the insertion position of the layer into which the IC chip built-in tape is inserted. More specifically, it is preferable that the layer into which the IC chip built-in tape is inserted has a width corresponding to the width of the IC chip built-in tape and a portion where the sheet raw material is not attached is formed. However, the portion to which the sheet raw material is not attached is not necessarily the same width as the IC chip built-in tape, and may be somewhat narrow as long as unevenness does not occur on the surface of the IC chip built-in sheet. It is preferable that the portion where the sheet raw material is not attached is wider than the IC chip built-in tape, because even if the IC chip built-in tape snakes when inserted, it does not protrude from the non-attached portion. Furthermore, it is not always necessary to make a sheet without continuously attaching the sheet material. For example, the presence or absence of the sheet material may be repeated at intervals of several millimeters so that the paper thickness of the IC chip embedded portion is reduced.

5 and 6 are schematic configuration diagrams showing a modification of the first embodiment, FIG. 5 is a plan view, and FIG. 6 is a VV ′ cross-sectional view of FIG. Similarly, FIGS. 7 and 8 are schematic configuration diagrams showing another modification of the first embodiment, FIG. 7 is a plan view, and FIG. 8 is a cross-sectional view taken along the line VII-VII ′ of FIG.
The IC chip built-in sheets of these modified examples have a three-layer structure in which an inner layer 2b is provided between an upper layer 2a and a lower layer 2c in which the sheet-like material 2 is the outermost layer. , Inserted into the inner layer 2. The inner layer 2b is provided with a paper making portion 2d that does not allow the insertion position partial sheet material of the IC chip built-in tape 1 to adhere thereto. The width of the paper making portion 2d is slightly wider than the IC chip built-in tape 1.
In the modified examples of FIGS. 5 and 6, the paper making portion 2 d is continuously provided in the entire insertion position portion of the IC chip built-in tape 1. On the other hand, in the modified examples of FIGS. 7 and 8, a part of the insertion part of the IC chip built-in tape 1 (a part corresponding to the IC chip embedded part) is provided with a gap.

  When using a single-layer or multi-layer method, if the paper layer and the IC chip built-in tape 1 are not firmly bonded, the IC chip built-in tape 1 is pulled by something and falls out of the paper layer. There is a fear. As a means for solving such a problem, for example, a water-soluble resin is used in the size press solution in the paper making process, or a thermoplastic resin or a water-soluble resin is applied to the IC chip built-in tape 1 in advance to adhere to the paper layer. It is better to take a method of improving the strength. It is also conceivable to improve the adhesive strength with the paper layer by using a film and paper as the base material of the IC chip built-in tape 1.

Next, a method of inserting the IC chip built-in tape 1 between the paper layers by a method of bonding a plurality of substrate sheets will be described. In this case, the material of the base sheet is not limited, and a plastic film or the like can be used in addition to paper.
Examples of the resin used for bonding include water-soluble resins, thermomeltable resins made of thermoplastic polymers, thermosetting resins, etc., but curable types that are difficult to peel off after bonding are used. It is desirable to use it.

  In terms of adhesion, ease of handling, etc., ethylene resin, propylene resin, styrene resin, vinyl chloride resin, vinylidene chloride resin, ethylene / vinyl acetate copolymer resin, butyral resin, polyester resin, polyamide resin, acrylic resin, Nitrile resin, butadiene resin, halogenated rubber, urethane resin, cellulose resin, gelatin, phenol resin, urea-formaldehyde resin, melamine-formaldehyde resin, epoxy resin, unsaturated polyester resin, silicon resin, alkyd resin, allyl Resins, furan resins or copolymers of monomers constituting these resins can be preferably used.

  Among them, polyester resin, low density polyethylene, atactic polypropylene, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-ethyl acrylate copolymer, ethylene-isobutyl acrylate copolymer, vinyl acetate-crotonic acid copolymer Polymer, vinyl acetate-phthalic anhydride copolymer, styrene-isoprene-styrene block copolymer, styrene-butadiene-styrene block copolymer, styrene-ethylene-butylene-styrene block copolymer, nylon-12, terephthal An acid-1.3-butadiol-based copolymer is preferably used. Of course, these hot-melt resins made of thermoplastic polymers can be used alone or in combination of two or more, and a curing agent can be used in combination.

  As a specific method of bonding, (a) the IC chip built-in tape 1 is placed on one of the base sheet surfaces, the resin is applied to the other base sheet surface to be joined, Or (b) a method in which a resin layer is provided on the surface of the base material sheet in advance, and after that, the IC chip built-in tape 1 is disposed and laminated with another base material sheet, (C) The IC chip built-in tape 1 is disposed on the surface of any one of the substrate sheets, and another substrate sheet is stacked thereon with a film or powder resin interposed therebetween, and then the film or Examples include a method in which powders are heated and melted to bond base sheets together. Considering the stability of bonding, work efficiency and the like, the method (b) is most preferable.

  In addition, when using a film-like resin, a vacuum method, a low-temperature laminating method using a thermal primer treatment, etc. are adopted, and when using a powdery bonding agent, electrostatic coating, mesh roll type spraying method, thermal spraying method, spraying method Screen printing or the like can be employed.

(Second Embodiment of IC Chip Built-in Sheet)
FIGS. 9 and 10 are schematic configuration diagrams of the second embodiment of the IC chip built-in sheet according to the present invention, FIG. 9 is a plan view, and FIG. 10 is a cross-sectional view taken along the line IX-IX ′ of FIG.
As shown in FIG. 9 and FIG. 10, the IC chip built-in sheet of this embodiment is composed of the IC chip built-in tape 1 and the sheet-like material 2 according to the present invention. It is inserted inside the object 2. However, a part of the IC chip built-in tape 1 is exposed in the open window portion 2 a provided in the sheet-like material 2. In the present embodiment, a paper-making character 3 is further applied to the window space 2a.

As a method of manufacturing the IC chip built-in sheet according to the present embodiment, a belt mechanism having a groove through which the IC chip built-in tape 1 is inserted at the tip of the convex portion of the guide having irregularities is formed on the paper suspension on the papermaking wire. Method of burying (Japanese Patent Publication No. 5-085680), a compressed air nozzle is built in a rotating drum on a long paper machine wire, and the slurry on the IC chip built-in tape 1 previously inserted into the wet paper is intermittently compressed air. To expose the IC chip built-in tape 1 (Japanese Patent Application Laid-Open No. 06-272200), using a net processed into a concavo-convex shape for the upper net of the circular net paper machine, and using the IC chip built-in tape 1 on the concavo-convex portion of the net surface For example, there is a method (US Pat. No. 4,462,866) in which the IC chip built-in tape 1 is drawn into the window opening portion while being brought into contact.
Furthermore, when producing a laminated paper consisting of at least two layers, the outermost paper layer and the inner paper layer, using a multi-tank type paper machine, the outermost paper layer (or the inner paper layer) A window opening portion is formed between the paper layers immediately before the window opening portion is intermittently formed on the inner paper layer (or the outermost paper layer) without the window opening portion. Further, a method of exposing the IC chip built-in tape 1 may be employed.

(Third and fourth embodiments of the IC chip built-in sheet)
FIG. 11 and FIG. 12 are sectional views showing a schematic configuration of the third embodiment and the fourth embodiment of the IC chip built-in sheet according to the present invention.
As shown in FIGS. 11 and 12, the IC chip built-in sheets of these embodiments are also composed of the IC chip built-in tape 1 and the sheet-like material 2 according to the present invention.
In the third embodiment shown in FIG. 11, the IC chip built-in tape 1 is attached to a groove provided in the sheet-like object 2. On the other hand, in the fourth embodiment shown in FIG. 11, the IC chip built-in tape 1 is attached to the surface of the sheet-like object 2.
The third embodiment is preferable to the fourth embodiment because the IC chip built-in tape 1 can be protected from mechanical external force by the groove. The depth of the groove can be appropriately changed depending on the thickness and material of the IC chip, the IC chip built-in tape 1 and the sheet-like material 2, but is preferably about 0.5 to 2 times the thickness of the IC chip.

  As a method of manufacturing the IC chip built-in sheet according to the third embodiment, only the paper layer of the portion into which the IC chip built-in tape 1 is inserted is thinned to form a groove for inserting the IC chip built-in tape 1. It is effective. Specifically, a known papermaking technique can be used. For example, soldering a wire, metal, resin, paper, etc. on the upper net of a circular mesh cylinder, or applying a paint or resin to the net to close the mesh, making the paper mesh itself uneven. A method of attaching a mold using a photosensitive resin to a net, a method of spraying compressed air on a portion where a groove is to be formed in a wet paper state, a rubbing roll on a portion of a wet paper in which a groove is to be formed The method of rubbing is mentioned.

1. About manufacturing method of IC chip carrying tape An IC chip wafer having a side of about 0.4 mm to 0.6 mm, which is called a so-called microchip, is selected. The IC chip wafer is of a general 6-inch size or 8-inch size. The thickness of the wafer is generally about 600 microns, but the silicon surface is polished up to 50 microns (generally a thickness of about 50 to 150 microns). In order to make an electrical connection on the circuit surface side, a so-called bump-like bump (usually made of gold or made of gold-plated nickel) is prepared and attached. An adhesive release sheet is applied to the polished silicon surface. (Purpose of preventing chips from being separated after dicing) Dicing is performed with a blade blade having a thickness of 25 to 40 microns from the top with the circuit surface facing upward.

2. A plastic sheet to be used as a base paper for the carrier tape is prepared, and a metal foil (mainly made of copper or aluminum) having a thickness of about 20 to 30 microns is applied on both sides, and etching is performed so that a predetermined antenna shape remains. In this manner, a continuous carrier tape base paper with an antenna is prepared.

3. The adhesive sheet of the release sheet is irradiated with ultraviolet rays or the like to eliminate the adhesiveness, and at the same time, the IC chip is mounted at a predetermined position of the antenna (position where the antenna and the bump can be connected) with a chip mounting machine. As the mounting method, an ultrasonic bonding method is used in the case of an aluminum antenna, and ACF or ACP adhesive is used in the case of a copper antenna.

4). In this way, the original carrier tape is completed. At this time, a coiled antenna is required for the electromagnetic induction communication type using 13.56 MHz wavelength, and a dipole antenna (single bar) is used for the radio communication type using UHF or 2.45 GHz. Antenna. These are rolled up into a carrier tape.

5. In general, many microchips are 2.45 GHz, and the following description will be made with a 2.45 GHz microchip in mind.
The IC chip carrier tape is formed into a tape shape by cutting the inlet-mounted carrier tape described in 4 above into one inlet piece again.

6). The width of 3 to 30.0 mm is appropriate for the IC chip-supporting tape in consideration of the strength at the time of papermaking and the papermaking conditions. Thickness is 50 microns or more. The tape is made of paper, plastic, or a combination thereof. 4). The inlet created in step 1 has the thickest tip. Therefore, at the chip mounting portion of the inlet insertion tape, the depth is about 40 to 150 microns with a laser or the like (depending on the desired thickness of the chip thickness and the total thickness of the IC chip holding tape), which is slightly larger than the chip size. Make a hole in advance.

7). The carrier tape created in item 4 is cut into individual pieces, each is face down (turned over), and the inlet of each piece is aligned with the chip hole of the insertion tape and mounted. The mounting method includes a method in which an adhesive is potted in advance in the created chip hole to fix the chip, and a method in which the antenna itself is bonded to the IC chip holding tape. There is also a method of using an adhesive instead of adhesion.

8). In this way, an IC chip carrying tape with chip inlets inserted at regular intervals is completed.

Hereinafter, the present invention will be described in more detail using examples, but the present invention is not limited to these examples.
Example 1
(Manufacture of IC chip built-in sheets)
IC chip built-in paper was manufactured by three-layer papermaking at a papermaking speed of 30 m / min using a circular paper machine equipped with a three-layer cylinder bat. In this case, the first layer and the second layer (paper dry weight each 70 g / ^{m 2)} is抄合not in the usual way, combining the third layer (the paper dry weight 70 g / ^{m 2)} paper making At that time, an IC chip carrying tape (width 6 mm, thickness 155 μm) was inserted to manufacture an IC chip built-in sheet.

Example 2
IC chip built-in paper was manufactured by three-layer papermaking at a papermaking speed of 30 m / min using a circular paper machine equipped with a three-layer cylinder bat. In this case, the first layer and the second layer (paper dry weight each 70 g / ^{m 2)} is抄合not in the usual way, combining the third layer (the paper dry weight 70 g / ^{m 2)} paper making At that time, the same IC chip holding tape as in Example 1 was inserted.
The third layer cylinder was assembled by placing marks on the cylinder surface so that 10 mm square open windows were formed at predetermined intervals at the position where the IC chip carrying tape was inserted. As a result, an IC chip built-in sheet in which the IC chip carrying tape inserted in the paper layer can be seen from the paper surface at predetermined intervals was manufactured.

Example 3
IC chip built-in paper was manufactured by three-layer papermaking at a papermaking speed of 30 m / min using a circular paper machine equipped with a three-layer cylinder bat. In this case, the first layer and the second layer (dry weight each 50 g / ^{m 2} paper) is抄合not in the usual way, combining the third layer (the paper dry weight 50 g / ^{m 2)} paper making At that time, an IC chip carrying tape (width 6 mm, thickness 90 μm) was inserted.
In the second layer cylinder, a continuous continuous mark having a width of 12 mm was attached to the circumference of the cylinder in order to form a non-adhered portion of the papermaking raw material having a width of 12 mm at the insertion position of the IC chip carrying tape. As a result, an IC chip built-in sheet having a width of 12 mm and no sheet material adhering and no bulge in the tape portion was produced.

Example 4
An ethylene-vinyl acetate copolymer bonding agent (trade name “Cybinol DBA107” manufactured by Seiden Chemical Co., Ltd.) is applied to a paper having a basis weight of 100 g / m ² with a roll coater so that the coating amount is 13 g / m ^2. When the paper having a basis weight of 100 g / m ² was bonded to the paper, the IC chip carrying tape used in Example 1 was inserted between both papers to produce an IC chip built-in sheet.

  The IC chip built-in sheet of the present invention can be effectively used for banknotes, gift certificates, checks, stock certificates, passports, identification cards, logistics tags, and the like.

IC chip tape according to the present invention-top view IC chip tape according to the present invention / side view The top view which shows schematic structure of 1st Embodiment of the IC chip built-in sheet | seat concerning this invention. Sectional drawing which shows schematic structure of 1st Embodiment of the IC chip built-in sheet | seat concerning this invention. The top view which shows schematic structure of the modification of 1st Embodiment of the IC chip built-in sheet | seat concerning this invention. Sectional drawing which shows schematic structure of the modification of 1st Embodiment of the IC chip incorporation sheet | seat concerning this invention. The top view which shows schematic structure of the other modification of 1st Embodiment of IC chip built-in sheet concerning this invention. Sectional drawing which shows schematic structure of the other modification of 1st Embodiment of IC chip built-in sheet concerning this invention The top view which shows schematic structure of 2nd Embodiment of the IC chip incorporation sheet | seat concerning this invention. Sectional drawing which shows schematic structure of 2nd Embodiment of the IC chip built-in sheet | seat concerning this invention. Sectional drawing which shows schematic structure of the other modification of 3rd Embodiment of IC chip built-in sheet concerning this invention Sectional drawing which shows schematic structure of the other modification of 4th Embodiment of IC chip built-in sheet | seat concerning this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... IC chip built-in tape 2 ... Sheet-like thing 3 ... Paper-making character 10-IC chip 11-External antenna 12-IC chip and external antenna connection lead wire 20-Tape body

Claims (5)

An IC chip carrying tape with an external antenna embedded in a tape in which a chip portion of an IC chip with an antenna joined to an IC chip with a side of 0.6 mm or less with a built-in memory is narrowly slit. An IC chip built-in sheet, which is inserted inside.   2. The IC chip built-in sheet according to claim 1, wherein the IC chip-carrying tape with an external antenna is inserted into a sheet-like material with a part thereof exposed.   2. The IC chip built-in sheet according to claim 1, wherein the tape material is paper or a laminate of paper and film.   An IC chip carrying tape with an external antenna embedded in a tape in which a chip portion of an IC chip with an antenna joined to an IC chip with a side of 0.6 mm or less with a built-in memory is narrowly slit is a sheet-like material. An IC chip built-in sheet characterized by being attached to the sheet. 5. The IC chip built-in sheet according to claim 4, wherein the tape material is paper or a laminate of paper and film.

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