JP2005242978A - Thread and sheet incorporating the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a thread capable of reducing probability of damage of an IC chip and improving flatness of the surface. <P>SOLUTION: In the thread in which the IC chip 10 at least capable of reading information in a non-contact state is mounted on a beltlike resin layer 20, a paper layer 50 formed with a hole 51 having thickness greater than that of the IC chip 10 and exposing the IC chip 10 is laminated on the resin sheet 21. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a thread that is affixed or inserted into securities, banknotes, and the like and used for authenticity determination, and a sheet incorporating the thread.

  In the past, counterfeit crimes have frequently occurred in securities such as prepaid cards, various admission tickets, gift certificates and stock certificates because they are widely distributed and can be exchanged relatively easily. In particular, in recent years, with the improvement and popularization of copying machines such as color copiers, counterfeit products that cannot be easily distinguished from genuine products can be manufactured relatively easily, and countermeasures against counterfeiting are required. Yes. Moreover, measures against counterfeiting are required not only for the above-mentioned securities but also for banknotes.

  As one of countermeasures against such counterfeiting, a technique for preventing forgery of securities or banknotes by attaching or inserting a member called a thread on the securities or banknotes is considered. In this technology, a thread formed by cutting a plastic film, thin paper, etc. to a width of about several millimeters is not exposed from the surface of securities or banknotes, or securities such that a part is exposed from the surface. It is inserted into the paper layer of the banknote, and the authenticity of the securities and banknotes is determined by the presence or absence of this thread.

Furthermore, in recent years, a technique for determining the authenticity of securities or bills using a thread on which an IC chip is mounted has been considered. In this technology, a thread in which an IC chip is bonded to one side of a film cut to a width of about several millimeters is inserted into a paper layer of securities or banknotes. By reading the information written on the chip, the authenticity of the securities or bills is determined (for example, see Patent Document 1).
JP 2002-319006 A

  However, in the thread as described above, since the IC chip is bonded to one side of the film cut to a width of about several millimeters, the area where the IC chip is mounted is different from the other area. As a result, the flatness of the thread surface is impaired and the IC chip is easily damaged.

  The present invention has been made in view of the problems of the conventional techniques as described above, and can reduce the possibility of breakage of the IC chip and improve the flatness of the surface. It is an object of the present invention to provide a thread and a sheet in which the thread is incorporated.

In order to achieve the above object, the present invention provides:
A thread in which an IC chip capable of reading at least information in a non-contact state is mounted on a belt-shaped first sheet base material,
A second sheet base material having a recess or a hole into which at least part of the IC chip enters is laminated on the first sheet base material.

  The hole has a size such that a value obtained by subtracting the volume of the IC chip from the volume of the hole is equal to or larger than the amount of the adhesive applied to the region facing the hole on the first sheet base material. It is characterized by having.

  The IC chip is at least partially covered with the adhesive.

  Further, at least one of the first and second sheet base materials is made of paper.

  In the present invention configured as described above, in a thread in which an IC chip capable of reading at least information in a non-contact state is mounted on a belt-shaped first sheet substrate, the first sheet substrate In this state, at least a part of the IC chip enters a recess or a hole formed in the second sheet substrate.

  Thus, the IC chip mounted on the first sheet base material partially enters the recess or hole formed in the second sheet base material stacked on the first sheet base material. Therefore, the possibility that the IC chip is damaged is reduced, and the flatness of the surface on which the second sheet base material is laminated is improved.

  In addition, since the size of the hole is obtained by subtracting the volume of the IC chip from the volume of the hole, the IC chip is bonded onto the first sheet base material in a region facing the hole on the first sheet base material. If the amount of the adhesive applied to the IC chip is equal to or greater than the amount of adhesive applied to the first sheet substrate, the adhesive applied to the area facing the IC chip leaks from the hole to the outside. It will not be put out.

  As described above, in the present invention, at least a part of the IC chip enters the thread in which the IC chip capable of reading at least information in a non-contact state is mounted on the belt-shaped first sheet base material. Since the second sheet base material in which such recesses or holes are formed is laminated on the first sheet base material, the possibility of breakage of the IC chip can be reduced, and the second sheet base material can be reduced. The flatness of the surface on which the materials are stacked can be improved.

  In the case where the hole has a size in which the value obtained by subtracting the volume of the IC chip from the volume of the hole is equal to or larger than the amount of the adhesive applied to the region facing the hole on the first sheet base material. When adhering the IC chip onto the first sheet base material, it is possible to prevent the adhesive applied to the area facing the IC chip from leaking out of the hole.

  Further, in the case where at least a part of the IC chip is covered with an adhesive, the IC chip can be further protected and the IC chip can be prevented from falling off.

  Embodiments of the present invention will be described below with reference to the drawings.

  1A and 1B are diagrams showing an embodiment of a thread according to the present invention, in which FIG. 1A is a top view and FIG. 1B is a cross-sectional view taken along line A-A ′ shown in FIG.

  In this embodiment, as shown in FIG. 1, the IC chip 10 is mounted and bonded on the resin layer 20 as the first sheet base material with the hot melt layer 30 made of hot melt as the adhesive. Further, a paper layer 50 as a second sheet base material in which a hole 51 is formed so that the IC chip 10 is exposed is laminated. The resin layer 20 is made of strip-shaped PET, and is bonded to the paper layer 50 by a hot melt layer 30. Further, the thickness of the paper layer 50 is equal to or greater than the thickness of the IC chip 10, and the size of the hole 51 is a hole when the paper layer 50 is laminated on the resin layer 20. The value obtained by subtracting the volume of the IC chip 10 from the volume of the portion 51 is the volume of the hot melt layer 30 in the region facing the hole 51, that is, the hot applied to the region facing the hole 51 on the resin layer 20. More than the amount of melt. Further, the IC chip 10 can write and read information in a non-contact state, and is written in the IC chip 10 by being brought close to an information writing / reading device provided outside. Information is read or information is written to the IC chip 10.

  In the thread configured as described above, for example, an adhesive (not shown) is applied to one surface, and is used by being affixed to securities or banknotes. Therefore, if one surface of the thread is made of a paper layer 50 or a layer made of nonwoven fabric and this surface is a surface to be affixed to securities or banknotes, the adhesiveness between the threads and securities or banknotes can be improved. it can. On the other hand, when the first sheet base material on which the paper layer 50 is laminated is the resin layer 20 made of a material such as PET as described above, the mechanical strength of the thread can be improved. The first and second sheet base materials to be laminated have the effects described above by being limited to the resin layer 20 and the paper layer 50, but the present invention is not limited to these.

  When a securities or banknote with a thread attached is brought close to the above-described information writing / reading device, for example, information written in the IC chip 10 is read, and based on the read information, the valuable information is read. The authenticity of securities and banknotes will be determined. Note that, in the IC chip 10, as described above, when the authenticity determination is performed only by the information written in the IC chip 10, the information written in the IC chip 10 may be read out in a non-contact state. It is not necessary to have a configuration in which information is written in a non-contact state.

  It is also conceivable to use the thread by inserting it into the paper layer of the securities or banknotes instead of sticking the threads as shown in FIG. 1 to the securities or banknotes. In that case, for example, paper made from at least two paper layers using a multi-tank type net paper machine is used as securities or banknotes, and threads are made between the paper layers when manufacturing securities or banknotes. Keep in mind. The securities and banknotes in which threads are inserted in this way are also used in the same manner as described above. Moreover, it is also conceivable to use a securities or banknotes in which a plurality of papers are stacked with a thread sandwiched between the stacked papers.

  It is also conceivable that a recess is formed in securities, bills or the like, and a thread as shown in FIG. 1 is fitted into the recess. The securities and banknotes in which threads are inserted in this way are also used in the same manner as described above.

  The thread as shown in FIG. 1 is not limited to securities, banknotes, etc. as described above, but is attached to a sheet-like one, as described above, punched, sandwiched, Alternatively, it is used by being incorporated into a sheet by being fitted.

  Below, the manufacturing method of the thread | sled mentioned above is demonstrated.

  FIG. 2 is a diagram for explaining a method of manufacturing the thread shown in FIG.

  First, the hot melt layer 30 is laminated on the resin sheet 21 by applying hot melt to the entire surface of the resin sheet 21 that becomes the resin layer 20 by being cut (FIG. 2A).

  Next, a paper layer 50 as a second sheet base material is laminated on the resin sheet 21 on which the hot melt layer 30 is laminated, and the paper layer 50 and the resin sheet 21 are heated by the hot melt layer 30 by heating and pressing. And glue. Here, the paper layer 50 is laminated on the resin sheet 21, and when the IC chip 10 is mounted on the resin sheet 21 later, a hole 51 is formed in a region facing the IC chip 10. (FIG. 2B). Further, the thickness of the paper layer 50 is equal to or greater than the thickness of the IC chip 10.

  Next, the IC chip 10 is mounted on the resin sheet 21 on which the paper layer 50 is laminated so that the IC chip 10 enters the hole 51 formed in the paper layer 50 (FIG. 2C). As a result, the IC chip 10 is exposed from the hole 51 formed in the paper layer 50. Further, since the thickness of the paper layer 50 is equal to or greater than the thickness of the IC chip 10, the IC chip 10 does not protrude beyond the surface of the paper layer 50.

  When the IC chip 10 is heated and pressed when the IC chip 10 is mounted on the resin sheet 21, the portion of the hot melt layer 30 that contacts the IC chip 10 and its surroundings are melted, thereby causing the IC chip 10 to be hot. The IC chip 10 is bonded onto the resin sheet 21 by being embedded in the melt layer 30 and then the hot melt layer 30 is cured (FIG. 2D). As a method for heating the IC chip 10, for example, it is conceivable to use a chip mounting machine having heat, and it is also possible to heat the peripheral part of the hole 51 into which the IC chip 10 enters as necessary. . At this time, the hot melt layer 30 applied in the hole portion 51 is melted, and wraps around the IC chip 10 in the hole portion 51 to cover the surface of the IC chip 10. Depending on the amount of hot melt layer 30 applied, the surface of IC chip 10 may not be covered by hot melt layer 30. At this time, a portion of the hot melt layer 30 that is melted by heating and pressurizing the IC chip 10 flows around the IC chip 10 in the hole 51 formed in the paper layer 50. However, since the size of the hole 51 is a value obtained by subtracting the volume of the IC chip 10 from the volume of the hole 51 is equal to or greater than the amount of hot melt applied to the region facing the hole 51, The flowing hot melt does not leak out of the hole 51.

  Moreover, after that, the resin layer 20 and the paper layer 50 may be heated while being pressed by a heat roller as necessary, and in that case, the hot melt layer 30 is melted again. Then, when the IC chip 10 is covered with the hot melt layer 30, the surface of the hot melt layer 30 is flattened. When the IC chip 10 is not covered with the hot melt layer 30, the resin layer 20 and The hot melt layer 30 between the paper layer 50 flows into the hole 51 and goes around the IC chip 10 to cover the surface of the IC chip 10.

  FIG. 3 is a diagram showing a state in which the IC chip 10 is mounted and bonded on the resin sheet 21 on which the paper layer 50 is laminated in the thread manufacturing process shown in FIG. It is omitted.

  As shown in FIG. 3, when the IC chip 10 is mounted on the resin sheet 21 on which the paper layer 50 is laminated, the IC chip 10 mounted and bonded on the resin sheet 21 is formed on the paper layer 50. The hole 51 is exposed.

  Thereafter, the paper layer 50 is laminated, and the resin sheet 21 on which the IC chip 10 is mounted and bonded is cut into a strip shape, thereby completing a thread roll.

  FIG. 4 is a diagram illustrating a state in which the resin sheet 21 on which the paper layer 50 is laminated is cut into a strip shape in the thread manufacturing process illustrated in FIG. 1.

  As shown in FIG. 4, when the resin sheet 21 on which the paper layer 50 is laminated is cut into a strip shape, a thread roll in which the IC chips 10 are linearly arranged is formed on the resin sheet 21, and this thread roll Is wound up and then cut into units to be pasted (for example, one IC chip 10 is included) when pasted on securities or banknotes, as shown in FIG. A thread is formed.

  In the thread manufactured by the manufacturing process described above, the exposed surface of the IC chip 10 can be protected, and the IC chip 10 can be prevented from falling off.

  In the present embodiment, the case where the entire exposed surface of the IC chip 10 is covered with the hot melt layer 30 has been described as an example, but the amount of the applied hot melt layer 30 and the degree of heating and pressurization. Thus, it is possible to cover only a part of the exposed surface of the IC chip 10 with the hot melt layer 30, and in this case, the IC chip 10 can be prevented from falling off.

  In this embodiment, since the thickness of the paper layer 50 is equal to or greater than the thickness of the IC chip 10, the entire IC chip 10 enters the hole 51 formed in the paper layer 50. 50 is made thinner than the thickness of the IC chip 10 so that a part of the IC chip 10 enters the hole 51 formed in the paper layer 50, or at least one of the IC chips 10 enters the paper layer 50. It is also possible to form a recess in which the portion enters and the paper layer 50 is laminated on the resin layer 20 so that the IC chip 10 enters the recess.

  In the present embodiment, the resin layer 20 made of PET is used. However, the present invention is not limited to this, and for example, one made of PET-G or PVC can be considered. It is also conceivable to use a resin layer made of PET, PET-G or PVC instead of the paper layer 50. When a resin layer 20 made of PET-G or PVC is used and a resin layer made of PET-G or PVC is used instead of the paper layer 50, these are bonded to each other by heating. Therefore, the hot melt layer 30 may be laminated only in the region of the resin sheet 21 where the IC chip 10 is mounted.

  Further, in the thread manufacturing method shown in FIG. 1, as described above, the resin sheet 21 that becomes the resin layer 20 by being cut, the paper layer 50 is laminated on the resin sheet 21, and further the IC chip 10. Is not limited to manufacturing a thread by cutting the substrate, and the hot melt layer 30 is substantially laminated on the belt-shaped resin layer 20 and the paper layer 50 is formed on the resin layer 20. Then, the IC chip 10 may be mounted on and adhered to the resin layer 20 by the hot melt layer 30.

  Further, the IC chip 10 is bonded to the resin layer 20 without being limited to the hot melt layer 30, for example, a layer made of an ultraviolet curable adhesive may be used. In that case, when the IC chip 10 is mounted on the resin sheet 21, ultraviolet rays are irradiated from the surface of the resin sheet 21 opposite to the surface on which the IC chip 10 is mounted, whereby an ultraviolet curable adhesive is obtained. Then, the IC chip 10 is bonded onto the resin sheet 21 by curing the adhesive. Further, when a layer made of an ultraviolet curable adhesive is used instead of the hot melt layer 30 as an adhesive for the resin layer 20 and the paper layer 50, the resin sheet 21 and the paper layer 50 are bonded. Then, ultraviolet rays are irradiated from the surface of the resin sheet 21, thereby melting the ultraviolet curable adhesive, and then the adhesive is cured to bond the resin sheet 21 and the paper layer 50. In these cases, the resin sheet 21 needs to be made of a material that transmits ultraviolet rays.

  Further, in this embodiment, by using the resin layer 20 as the first sheet base material, it is possible to prevent twisting or breaking of the sheet being conveyed when it is rubbed into another paper layer or bonded. When the paper layer 50 is used as the second sheet base material, the adhesiveness is improved and the film is difficult to peel off when the paper layer 50 is rubbed into another paper layer or bonded. Accordingly, by using one of the two sheet base materials to be laminated, one of which is made of resin and the other is made of paper, the sheet can be prevented from being twisted or broken, and has an effect of improving adhesion and being difficult to peel off. . As described above, the laminated structure is not limited to the present embodiment, and the same structure is possible even if the resin layer 20 that is the first sheet base material and the paper layer 50 that is the second sheet base material are reversed. Needless to say, it produces an effect. Furthermore, when only the improvement of adhesiveness is required, it is considered that the two sheet base materials to be laminated are made of paper. In order to improve the mechanical strength, the two sheets to be laminated are considered. It is also conceivable that the substrate is made of a resin.

It is a figure which shows one Embodiment of the thread | sled of this invention, (a) is a top view, (b) is A-A 'sectional drawing shown to (a). It is a figure for demonstrating the manufacturing method of the thread | sled shown in FIG. FIG. 2 is a diagram showing a state in which an IC chip is mounted and bonded on a resin sheet on which a paper layer is laminated in the thread manufacturing process shown in FIG. It is a figure which shows the state which cut the resin sheet on which the paper layer was laminated | stacked in the strip | belt shape in the manufacturing process of the thread | thread shown in FIG.

Explanation of symbols

10 IC chip 20 Resin layer 21 Resin sheet 30 Hot melt layer 50 Paper layer 51 Hole

Claims (5)

A thread in which an IC chip capable of reading at least information in a non-contact state is mounted on a belt-shaped first sheet base material,
A thread in which a second sheet base material having a recess or a hole into which at least a part of the IC chip enters is laminated on the first sheet base material. The thread of claim 1,
The hole has a size such that a value obtained by subtracting the volume of the IC chip from the volume of the hole is equal to or larger than the amount of adhesive applied to a region facing the hole on the first sheet base material. A thread characterized by that. The thread of claim 2,
The thread, wherein the IC chip is at least partially covered with the adhesive. The thread according to any one of claims 1 to 3,
At least one of the first and second sheet base materials is made of paper. The sheet | seat in which the thread | sled of any one of Claim 1 thru | or 4 was integrated.

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