JP2007175625A - Method of applying polymer-melted material, method of manufacturing laminated body and method of manufacturing electronic information recording body - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of applying a polymer-melted material, method of manufacturing a laminated body and a method of manufacturing an information recording boy, the methods which achieve cost reduction and facilitation of manufacture of products, achieve prevention of contamination of manufacturing steps and deterioration in appearance of the products, dispensing with application of a polymer-melted material onto a blank part in excess to reduce the cost of materials and prevention of the occurrence of defective articles at manufacturing steps. <P>SOLUTION: The method of applying the polymer-melted material in which a polymer-dissolved material being the polymer-melted material is applied from an extrusion type coater head onto the object to be coated, is characterized in that when the application of the polymer-dissolved material is completed, the supply of the polymer-dissolved material is stopped and simultaneously the coater head is parted relatively from the object to be coated at the speed higher than the conveying speed of the object to be coated, so that the coater head is parted from the applied polymer-dissolved material. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a coating method in which an adhesive of a polymer melt is applied to the surface of a sheet material, a manufacturing method of a laminate formed by laminating a plurality of sheet materials through the adhesive, and a manufacturing method of an electronic information recording body In particular, a polymer melt coating method for encapsulating an electronic information recording medium such as an IC chip, an antenna or the like through an adhesive between front and back sheet materials, a laminate manufacturing method, and an electronic information recording body It relates to the manufacturing method.

  In general, as a method of applying a polymer melt adhesive to the surface of various plastic film sheets, there is a method using a spin coater, roll coater, blade coater, die coater or the like. In particular, when a reactive adhesive such as a moisture curing type is used, it is preferable to use a die coater in order to prevent unnecessary curing reaction from proceeding before coating.

  In addition, it is known to produce a laminate by bonding a plurality of sheet materials with a press device or the like through an adhesive layer. For example, for use in building materials such as door panels and wall materials, recording on optical disks, etc. There are card applications such as materials and IC cards with built-in electronic components between plastic substrates.

Further, an electronic information recording card using a hot-melt type adhesive and a manufacturing method thereof are disclosed in, for example, Japanese Patent Laid-Open Nos. 10-147087 and 2002-157561. In this case, an adhesive is applied to one or both of the substrates, each substrate is moved from the adhesive application device to a press or a laminating device, and the substrates are bonded together.
Japanese Patent Laid-Open No. 10-147087 JP 2002-157561 JP

  As a generally known press and laminating method, there are a flat plate press apparatus and a roll laminating apparatus, and in a press apparatus for laminating sheet-like sheets batchwise, the manufacturing time becomes long and the productivity is inferior. A continuous laminating system using sheets is advantageous.

  However, in the laminating method in which both the front and back sheet materials are continuous sheet materials, a special printing device must be prepared in advance when format printing is performed on the surface, which is disadvantageous in terms of versatility and cost, There are problems such as difficulty in ensuring printing accuracy.

  Therefore, a laminate is manufactured by laminating using a sheet material that has been subjected to format printing with a conventional printing apparatus using at least one sheet material as a sheet-like sheet. Is applied, the linear adhesive called “string drawing” is generated at the rear end portion. This protruding portion causes process contamination when the sheet is handled in a subsequent process, and further causes contamination of the surface of the sheet, which causes a quality defect. In order to avoid “stringing”, a method of increasing the margin of the sheet is also used, but this is a production problem such as extra material cost and unnecessarily handling a large size sheet.

  In addition, even in an electronic information recording body manufactured by bonding an antenna substrate having an IC chip and an antenna circuit mounted on a substrate between sheet materials via an adhesive layer, between the predetermined electronic information recording bodies The existing blank sheet material and adhesive are discarded, which increases costs.

For example, it is known that polymer melts used for adhesives exhibit viscoelastic behavior. On the other hand, when the polymer melt is applied with an extrusion type coater head, if the polymer melt and the coater head are separated after the application is completed, the “string drawing” between the polymer melt and the coater head is poor. "Phenomenon occurs. This is due to a mechanical relaxation phenomenon called “spinning property” of the polymer solution. Therefore, as a result of researches by researchers, the coating method in which a polymer melt, particularly a hot-melt adhesive, is applied to an object to be coated using an extrusion-type coater head represents the viscoelasticity of the adhesive. It has been found that if the adhesive and the coater head are separated at a speed that does not correspond to the relaxation time, the behavior due to the elasticity of the adhesive is exhibited, so that the “string drawing” phenomenon does not occur, and the present invention has been achieved.
The present invention has been made in view of the above points, such as reduction of material cost, easy handling in manufacturing, elimination of process contamination and appearance quality deterioration, and elimination of application to extra blank portions. The object is to provide a polymer melt coating method, a laminate manufacturing method, and an electronic information recording method manufacturing method capable of reducing material costs and preventing the creation of defective products in the manufacturing process. Yes.

  In order to solve the above problems and achieve the object, the present invention is configured as follows.

The invention according to claim 1 is a coating method in which a polymer solution is applied to an object to be coated with an extrusion type coater head.
At the same time as stopping the supply at the end of the application of the polymer melt,
The polymer melt characterized in that the coater head and the object to be coated are separated from the polymer melt to which the coater head is coated by relatively separating at a speed faster than a conveyance speed of the object to be coated. It is a body application method.

The invention according to claim 2 stops the supply of the polymer melt at the end of coating, and at the same time leaves the polymer melt coated with the coater head,
2. The method for coating a polymer melt according to claim 1, wherein the moving direction in which the coater head moves away from the polymer melt is opposite to the transport direction of the object to be coated.

The invention according to claim 3, at the same time as stopping the supply of the polymer melt at the end of coating, leaving the coater head from the polymer melt coated,
2. The method for coating a polymer melt according to claim 1, wherein the moving direction in which the coater head moves away from the polymer melt is an upward direction with respect to the transport direction of the object to be coated. .

The invention according to claim 4 is an application method in which a polymer melt is applied to an object to be coated with an extrusion type coater head.
The coating of the polymer melt is performed while the coating object or the coater head is moving, and at the same time as the supply is stopped at the end of the coating,
Either the coating object or the coater head is moved at a speed faster than the conveying speed of the coating object or the coater head during coating.

  The invention according to claim 5 is the polymer melt coating method according to any one of claims 1 to 4, wherein the polymer melt is a hot-melt adhesive. is there.

  The invention described in claim 6 is characterized in that a hot melt adhesive is intermittently applied to a predetermined position by an extrusion type coater head on the object to be coated which is a continuous body. 6. The method for coating a polymer melt according to claim 5.

The invention according to claim 7 is a laminate in which a sheet material in a single wafer state is attached to the hot melt adhesive from above the hot melt adhesive corresponding to the hot melt adhesive applied to a predetermined position of the article to be coated. In the manufacturing method,
7. A method for manufacturing a laminate, wherein the method for applying the hot melt adhesive is the application method according to claim 6.

According to an eighth aspect of the present invention, an IC chip and an antenna circuit are mounted on a substrate on a hot melt adhesive applied to a predetermined position of an object to be coated by the coating method according to the sixth aspect. Place the board that will be
Similarly, another electronic sheet recording material applied with an adhesive by the application method according to claim 6 is attached.

  With the above configuration, the present invention has the following effects.

    According to the first aspect of the present invention, when the coating of the polymer melt is terminated, the coater head and the object to be coated are relatively separated at a speed faster than the conveying speed of the object to be coated. By removing the thread from the polymer melt to which the coating has been applied, it prevents the process contamination and appearance quality deterioration by applying “string pulling” that the applied polymer melt protrudes to the specified position. Therefore, the material cost can be reduced.

  In the invention according to claim 2, at the same time as stopping the supply of the polymer melt at the end of the coating, the coater head is moved from the polymer melt as the coating in the direction opposite to the conveying direction of the coating. Can be relatively separated at a speed faster than the conveyance speed of the object to be coated. The material cost can be reduced, such as eliminating the need to apply the ink to the extra blank area.

In the invention according to claim 3, at the same time as the provision of the polymer melt is stopped at the end of coating, the coater head is moved upward from the polymer melt as the coating material in the conveying direction of the coating material. Therefore, it can be relatively separated at a speed faster than the conveyance speed of the object to be coated. Deterioration is eliminated, and material costs such as extra blank space can be reduced.
In the invention of claim 4, the polymer melt is applied while the object to be coated or the coater head is moving, and at the same time the supply is stopped at the end of the coating, once the movement of the object to be coated or the coater head is stopped, By moving either the coated object or the coater head at a speed faster than the coated object or coater head transport speed during coating, the applied polymer melt is prevented from sticking out to the specified position. By doing so, process contamination and appearance quality deterioration can be eliminated, and material costs such as extra blank space can be reduced.

  In the invention according to claim 5, the polymer melt is a hot melt adhesive, and particularly in a high viscosity material that exhibits viscoelastic behavior such as a hot melt adhesive, "string drawing" can be suppressed. .

  In the invention according to the sixth aspect, even when the hot melt adhesive is intermittently applied to a predetermined position by a coater head with respect to an object to be applied which is a continuous body, “thread” is applied between the applied hot melt adhesives. Since there is no “drawing”, process contamination and appearance quality deterioration can be eliminated, and material costs can be reduced, such as no extra blank portions being applied.

  In the invention according to claim 7, in response to the hot melt adhesive applied to a predetermined position of the article to be coated, a sheet material in a single wafer state is pasted on the hot melt adhesive to obtain a desired Since the laminated body is bonded only through the hot melt adhesive only at the minimum necessary, the material cost can be reduced and the handling in manufacturing becomes easy. In addition, one is a single-wafer sheet, and the size of the sheet material can be changed by synergy with high-precision intermittent application, and defective products are created in the manufacturing process such as unapplied to the faulty part and IC inlet not arranged. Can be prevented.

  In the invention according to claim 8, the IC chip and the antenna circuit are mounted on the substrate on the hot melt adhesive applied to a predetermined position of the object to be coated by the coating method according to claim 6. The other sheet material to which the adhesive is applied by the coating method according to claim 6 is applied, and only a desired minimum is laminated through the hot melt adhesive. Since the bodies are bonded together, material costs can be reduced and handling in manufacturing becomes easy. In addition, one is a single-wafer sheet, and the size of the sheet material can be changed in synergy with high-precision intermittent application, and defective products are created in the manufacturing process such as non-application to the failed part and IC inlet non-arrangement. Can be prevented.

  Hereinafter, embodiments of the polymer melt coating method, the laminate manufacturing method, and the electronic information recording method manufacturing method of the present invention will be described. The embodiment of the present invention shows the most preferable mode of the invention. However, the present invention is not limited to this.

  As the polymer melt, for example, an adhesive can be used. As an example of a laminate manufacturing method and application to an electronic information recording body, there is a card application, specifically, a business card, name plate, passport, examination card, telephone card, identification card, driver's license, commuter pass, A card including a cash card, an IC card, etc., which is generally about the size of a hand, and is often carried around. Here, an example of an employee card of a company to which an IC card is applied will be described, but the application example is not limited to this form.

  An IC card contains an IC unit in a recess provided in a part of a base made of a synthetic resin such as vinyl chloride resin. Depending on the electrical contact between the IC and the external circuit, the contact type and non-contact type There is a type. However, if the contact terminal is exposed on the card surface as in the contact type, the contact surface may be deteriorated, the contact may be defective, and power supply to the IC card and data signal input / output may not be performed. .

  In view of this, an IC card having a configuration in which an electromagnetic wave is generated and / or received by an antenna coil for exchanging electrical signals in a non-contact manner has appeared.

  FIG. 1 is a plan view showing an example of such a contactless IC card having no metal terminal on the surface. In the figure, an IC card 1 is provided with a module substrate 2 on which an IC chip 2a and an antenna 2b as a signal transmitting / receiving unit for R / W (read / write) are mounted on a base material 2c. Since the IC chip 2a has a weak point pressure strength, it is also preferable to have a reinforcing plate in the vicinity of the IC chip. The key information portion 3 of the IC card 1 is attribute identification information for identifying the IC card 1 and other cards, and is, for example, a code number given to the surface of the IC card 1. The character information section 4 of the IC card 1 is a name, a workplace, an issue date, and the like attached to the surface of the IC card 1, and the image information section 5 is image information such as a face.

  FIG. 2 is a cross-sectional view schematically showing the layer configuration of the IC card. The module substrate 2 in which the IC chip 2a and the antenna 2b are mounted on the base material 2c is enclosed in the adhesive layers 6 and 7 interposed between the first sheet material 10 and the second sheet material 20. This is a configuration of the IC card 1.

  As the sheet material of the IC card 1 composed of the first sheet material 10 and the second sheet material 20, a sheet material such as resin or paper can be used. This sheet material is, for example, polyethylene terephthalate resin, polyethylene resin, polypropylene resin, acrylonitrile butadiene styrene copolymer resin, polyvinyl chloride resin, polyphenylene sulfide resin, polyimide resin, fine paper, matte paper, coated paper, synthetic paper, etc. It is. Further, the surface sheet portion may be subjected to easy adhesion treatment (primer application, corona discharge treatment, plasma treatment, etc.) in order to enhance the adhesion with the adhesive.

  The module substrate is an intermediate inlet provided with a mounting portion for an antenna or an IC chip on a base material, and may include a capacitor in some cases. As the substrate, for example, an insulating plastic sheet having a thickness of about 10 to 100 μm and made of a resin such as epoxy, glass epoxy, polyimide, polycarbonate, PVC, PET, or ABS is generally used. In addition, as a connection body between the IC chip and the antenna, a gold bump or nickel bump is used for the input / output terminal of the IC chip, and for example, a direct connection of both ends of a coil of an antenna formed by winding a copper wire is self-crimping. It is also possible to use a structure in which the two nonwoven fabric sheets having the properties are integrated with each other.

  For example, examples of the non-woven sheet member include a mesh woven fabric such as a non-woven fabric, and a plain woven fabric, a twill woven fabric, and a satin woven fabric. In addition, a fabric having pile called moquette, plush velor, seal, velvet, or suede can be used. Materials include polyamides such as nylon 6, nylon 66 and nylon 8, polyesters such as polyethylene terephthalate, polyolefins such as polyethylene, polyvinyl alcohols, polyvinylidene chloride, polyvinyl chloride, polyacrylonitrile, acrylamide, methacryl Acrylics such as amides, synthetic resins such as polycyanide vinylidene, polyfluoroethylene, and polyurethane, natural fibers such as silk, cotton, wool, cellulose, and cellulose ester, recycled fibers (rayon, acetate), aramid fibers The fiber which combined the 1 type (s) or 2 or more types chosen from among these is raised. Of these fiber materials, rayon that is preferably polyamide-based such as nylon 6 or nylon 66, acrylic-based such as polyacrylonitrile, acrylamide or methacrylid, polyester-based such as polyethylene terephthalate, cellulose-based as recycled fiber, or cellulose ester-based And acetate and aramid fibers.

  Self-compression bonding means that when a compressive force is applied to a flexible substrate at room temperature or under heating, each fiber constituting the flexible substrate is bonded, and a plurality of flexible substrate materials are stacked to apply a compressive force. In some cases, the superimposed flexible substrate materials are bonded to each other. For example, when the fibers constituting the nonwoven fabric are coated with PET-G, the nonwoven fabric is pressed by heating at a temperature equal to or higher than the melting point of PET-G. The sheet material is self-bonded.

  In addition, since the nonwoven sheet material has compressibility in the thickness direction, when the two nonwoven sheet materials are compressed in the thickness direction with the IC chip and antenna connection body interposed therebetween, the two nonwoven sheet materials Since the concave portion for embedding the connection body is formed on the inner surface of the non-woven fabric, and the surface of the nonwoven fabric sheet material can be formed flat, the information carrier such as a non-contact type IC card having a flat surface and excellent aesthetics is produced. be able to.

  The antenna exchanges data with an external reader / writer in a non-contact manner. The shape, number of turns, etc. are the size of the antenna coil on the receiving side, and how far away it can travel (communication distance) It depends on what frequency radio wave is received (communication frequency).

  In addition, since the IC chip has a weak point pressure applied locally, it is preferable to have a metal reinforcing plate as a reinforcing structure in the vicinity of the IC chip or a ring-shaped reinforcing member around the IC chip.

  The thickness of the module substrate is preferably 10 to 300 μm, more preferably 30 to 300 μm, still more preferably 30 to 250 μm.

  As the adhesive used in the present invention, for example, an epoxy two-component mixed type, a UV curable adhesive, a hot melt adhesive, preferably a moisture curable reactive hot melt adhesive is used. As the hot melt resin, ethylene vinyl copolymer resin, polyolefin, polyester, acrylamide, polyurethane and the like can be used. When the card substrate which is a laminate is easily warped, or when a layer susceptible to high-temperature processing such as an image receiving layer for image formation by thermal transfer is provided on the card surface, the image receiving layer is formed when the bonding temperature is too high. The temperature of the sheet material and the adhesive when pasting through an adhesive due to problems such as damage, thermal contraction of the sheet material, and deterioration of dimensions and positional accuracy during pasting. Are preferably bonded at 80 ° C. or lower, more preferably 10 to 80 ° C., and still more preferably 20 to 80 ° C. Among adhesives that adhere at low temperatures, specifically, a reactive hot melt adhesive is preferable. Particularly preferred in the present invention is a photocurable hot melt adhesive, which is activated by irradiating it with an energy beam such as an electron beam or an ultraviolet ray as disclosed in JP-A-2001-56849. It consists of a photoreactive component that causes polymerization or crosslinking reaction by a photocationic polymerization initiator and a hot melt adhesive component. As a lamp serving as a light source for initiating the reaction, a low-pressure mercury lamp, a medium-pressure mercury lamp, a high-pressure mercury lamp, an ultrahigh-pressure mercury lamp, a microwave mercury lamp, a metal halide lamp, or the like including an emission wavelength of 300 to 500 nm can be used.

  Next, an electronic information recording body manufacturing apparatus will be described. FIG. 3 shows an embodiment of an IC card manufacturing apparatus.

  The IC card manufacturing apparatus is provided with a feed shaft 50 for feeding the roll-shaped second sheet material 20, and the second sheet material 20 is guided and conveyed by guide rollers 51 and 52. An adhesive application device 41 for applying an adhesive to the second sheet material 20 fed from the feed shaft 50 is disposed. An adhesive is supplied and applied onto the second sheet material 20 from the adhesive application device 41, and then the module substrate 2 is supplied.

  Further, in the IC card manufacturing apparatus, the first sheet material 10 in a single sheet state is stored in a stack on the sheet storage unit 500, and the first sheet material 10 is transferred from the sheet storage unit 500 by the feeding roller 501. Sent out. An adhesive is applied to the first sheet material 10, and the first sheet material 10 sent out from the feed roller 501 is placed on the adhesive of the second sheet material 20 from above the module substrate 2. Is done.

  In this IC card manufacturing apparatus, a pressure unit 72, a coating unit 90, a coating liquid drying unit 95, a cutting unit 74, and a punching unit 73 are arranged on the transport path 100 along the transport direction.

  In the pressure unit 72, a pair of bonding rollers 72a and a plurality of pairs of pressure rollers 72b are arranged. The first sheet material 10 and the second sheet material 20 are bonded together by the pair of bonding rollers 72a, and the first sheet material 10 and the second sheet material bonded by a plurality of pairs of pressure rollers 72b. A predetermined pressure is applied to the first sheet material 10 and the second sheet material 20 which are conveyed under pressure and bonded together, and are brought into close contact with each other.

  The image receiving layer coating solution container 30 is provided above the coating unit 90, and a supply roller 31 a is provided in the image receiving layer coating solution container 30. The image receiving layer coating solution 33 is provided from the supply roller 31 a through the intermediate roller 31 b. Is supplied to the application roller 32, and by the reverse rotation of the application roller 32, the image receiving layer coating liquid 33 is applied to one surface side of the first sheet material 10, and the image receiving layer is formed on the surface by the reverse coater method.

  The application unit 90 is provided with a writing layer coating solution container 60 below, and a writing roller 61a is provided in the writing layer coating solution container 60, and the writing layer coating is applied from the supply roller 61a through the intermediate roller 61b. The liquid 63 is supplied to the application roller 62, and the writing layer application liquid 63 is applied to one surface side of the second sheet material 20 by the reverse rotation of the application roller 62, and a writing layer is formed on the surface by the reverse coater method.

  The coating liquid drying unit 95 vaporizes the solvent of the image receiving layer of the first sheet material 10 and the writing layer of the second sheet material 20 to form a coating layer on both sides.

  The cutting portion 74 includes a cutter upper die 74a and a cutter lower die 74b that are vertically opposed to each other. The cutter upper die 74a is provided so as to be movable up and down, and the first sheet material 10 and the second sheet material 20 are heated. The sheet 84 is cut in a welded state, and the sheet 84 is fed to the punching unit 73.

  The punching unit 73 includes a card punching upper die 73a and a card punching lower die 73b that are arranged facing each other in the vertical direction. The card punching upper die 73a is movable in the vertical direction so that the first sheet material 10 and the second sheet material 20 are integrated after being completely heat-welded, and thereafter punched to the size of the IC card 1. It has become. In the lower part of the card punching lower die 73b, there is provided a storage portion 85 for sequentially stacking and storing, for example, 4 to 100 IC cards 1 that have been punched from the sheet 84.

  The adhesive application device 41 is configured as shown in FIGS. 4 is a perspective view showing an embodiment of an adhesive application device, FIG. 5 is an enlarged view of the adhesive application device, FIG. 6 is an enlarged view of a lip tip, and FIG. 7 is a view showing a state of application at the end of application. FIG. 8 is a view showing a state of application at the end of application according to another embodiment, and FIG. 9 is a view showing a state where “string pulling” in which the adhesive protrudes to a predetermined position is suppressed.

  The adhesive application device 41 of this embodiment uses an extrusion type coater head 200 and is configured by joining an upper lip 201 and a lower lip 202 of the coater head 200, and the adhesive is pumped from the adhesive tank 203. It is supplied to the adhesive flow path 204 of the upper lip 201 by driving 250. A manifold 204a is formed at the joint between the upper lip 201 and the lower lip 202, the adhesive is spread to the coating width inside the coater head 200, passes through the slit-like flow path 204b, and the adhesive outlet of the lip tip 204d. 204c is discharged.

  As shown in FIGS. 4 and 9, the adhesive 300 is secondly formed by forming an adhesive liquid pool in the space D1 between the lip tip 204d and the second sheet material 20 that is the object to be coated. Is applied to the sheet material 20 to form the adhesive layer 7. The adhesive layer 7 is formed by applying the adhesive 300 intermittently so that a predetermined interval W1 is provided on the second sheet material 20 and a predetermined margin W2 is provided on the left and right end portions in the width direction. .

  A plurality of module substrates 2 are supplied on the adhesive layer 7, and the plurality of module substrates 2 are arranged at predetermined intervals. The first sheet material 10 in a single wafer state is placed on the adhesive of the second sheet material 20 from above the module substrate 2, and the first sheet material 10 is formed larger than the adhesive layer 7, and The width direction is wider than the second sheet material 20.

  The first embodiment includes an application position detection unit 400, a control unit 401, and a drive unit 402. The application position detection unit 400 sends information on the application length of the adhesive 300 in the conveyance direction to the control unit 401. The control unit 401 controls the pump 250 to apply the adhesive 300, and stops the driving of the pump 250 and stops the supply of the adhesive 300 when the application of the adhesive 300 is completed based on the application length information. . At the same time as the supply is stopped at the end of the coating [FIG. 7 (a)], the driving means 402 is controlled to move the coater head 200 at a lower speed than the conveying speed of the second sheet material 20 in the conveying direction of the second sheet material 20. The coater head 200 and the second sheet material 20 move the coater head 200 in the direction opposite to the conveying direction of the second sheet material 20, and the coater head 200 and the second sheet material 20 The two sheets 20 are relatively separated at a speed faster than the conveying speed of the sheet material 20 (FIG. 7B). In this embodiment, the coater head 200 and the second sheet material 20 are relatively separated at a speed faster than the conveying speed of the second sheet material 20, and the moving direction of the coater head 200 is not particularly limited. As shown in FIG. 8, it may be moved upward in the conveying direction.

  Thus, at the same time as the supply is stopped when the application of the adhesive 300 is finished, the coater head 200 and the second sheet material 20 are relatively separated at a speed faster than the conveying speed of the second sheet material 20. That is, the separation speed between the coater head 200 and the adhesive 300 is a speed obtained by adding the conveyance speed of the second sheet material 20 and the movement speed of the coater head 200 after the application is completed, and this speed is the second sheet material 20. 9, by separating the application terminal portion of the adhesive 300 from the portion remaining on the coater head 200 at this speed, as shown in FIG. 9, the applied adhesive 300 is in a predetermined position. “Thread pulling” that protrudes can be suppressed as indicated by a solid line. Conventionally, "string pulling" that protrudes in the conveying direction and the left and right width direction as indicated by the two-dot chain line has occurred in the adhesive 300, but in this embodiment, "thread pulling" that protrudes can be suppressed, It is possible to reduce material costs, such as eliminating process contamination and deterioration of appearance quality, and eliminating application to extra blank areas.

  In the second embodiment, as shown in FIG. 10, the second sheet material 20 is placed on the coating table 400 [FIG. 10A], and the second sheet material 20 or the coater head 200 moves. The adhesive 300 is applied [FIG. 10B], and the supply is stopped at the end of the application. At the same time, the control means 401 controls the driving means 402 to temporarily move the second sheet material 20 or the coater head 200. After the stop, the second sheet material 20 is separated from the applied adhesive 300 in a direction away from the coater head 200 at a moving speed or more during application [FIG. 10 (c)]. In this embodiment, the second sheet material 20 is moved away from the coater head 200. However, the second sheet material 20 may be moved by the coater head 200, and the direction is not particularly limited. preferable. Thus, at the same time as the supply is stopped at the end of coating, the movement of the second sheet material 20 or the coater head 200 is temporarily stopped, and then the second sheet material 20 or the coater head 200 is moved. By separating the applied adhesive 300, as shown in FIG. 9, it is possible to suppress “threading” that the applied adhesive 300 protrudes to a predetermined position.

  In the first to third embodiments, the polymer melt adhesive 300 is preferably a hot-melt adhesive, but the coater head 200 is also used in a high-viscosity product such as a hot-melt adhesive. You can suppress being pulled by.

  Further, even if the hot melt adhesive is intermittently applied to a predetermined position as shown in FIG. 4 with the extrusion type coater head 200 on the second sheet material 20 of the continuous object. There is no “stringing” between the applied hot melt adhesives.

  In addition, in correspondence with the hot melt adhesive applied to a predetermined position of the second sheet material 20, the first sheet material 10 in a single wafer state is stuck on the hot melt adhesive to produce a laminate. To do. In the production of this laminated body, the first sheet material 10 in a single wafer state is pasted on the hot melt adhesive corresponding to the hot melt adhesive applied to a predetermined position of the second sheet material 20. Since only the necessary minimum necessary is bonded through the hot melt adhesive, the material cost can be reduced and the manufacturing handling becomes easy. In addition, one is a single-wafer sheet, and the size of the sheet material can be changed in synergy with high-precision intermittent application, and defective products are created in the manufacturing process such as non-application to the failed part and IC inlet non-arrangement. Can be prevented.

  Further, a module substrate 2 in which an IC chip and an antenna circuit are mounted on a base material 2c is placed on a hot melt adhesive applied to a predetermined position of the second sheet material 20, and the adhesive is similarly applied. The other sheet-fed first sheet material 10 applied is pasted to produce an electronic information recording body. In the manufacture of the electronic information recording body, a module substrate 2 in which an IC chip 2a and an antenna 2b are mounted on a base material 2c on a hot melt adhesive applied to a predetermined position of the second sheet material 20. The other sheet-fed first sheet material 10 to which the adhesive is applied in the same manner, and only the desired minimum necessary is bonded through the hot melt adhesive, thereby reducing the material cost. Handling in manufacturing becomes easy. In addition, one is a single-wafer sheet, and the size of the sheet material can be changed in synergy with high-precision intermittent application, and defective products are created in the manufacturing process such as non-application to the failed part and IC inlet non-arrangement Can be prevented.

Examples of the present invention and comparative examples are shown below.
[Example]
A 0.05 mm hot melt adhesive is applied onto a 0.18 mm thick PET sheet that is continuously conveyed, and a maximum thickness of 0.3 mm is transmitted and received on the 0.04 mm thick PET sheet. An IC module on which an antenna coil and an IC chip are placed is placed on the sheet in a three-row layout, and then hot melt bonding with a thickness of 0.35 mm is placed on the other sheet-like PET sheet with a thickness of 0.18 mm. The sheet | seat which apply | coated the agent layer was bonded together in the direction where a hot-melt-adhesive faces, and the laminated body which has a some IC card was created. The hot melt adhesive layer used was a moisture curable polyurethane hot melt, and the viscosity at the time of application was 35000 mPa · sec. At this time, the hot melt adhesive was continuously applied to the PET sheet being continuously conveyed so as to be equal to or shorter than the length of the sheet-like PET sheet to be bonded and to the sheet interval.

At the timing when intermittent application of hot melt adhesive on the PET sheet being continuously conveyed is completed, the supply of hot melt adhesive is stopped and the extrusion type coater head is placed in the opposite direction to the sheet conveying direction. As a result, no streak-like stringing phenomenon was observed at the rear end of the coating. For this reason, there was no protrusion of the hot melt adhesive between the sheet-like PET sheets to be bonded in the subsequent process, and the conveyance roller and the laminate were not soiled.
[Comparative example]
The production method of the laminate is the same as that in the example, but only the supply of the hot melt adhesive is stopped at the timing when the intermittent application of the hot melt adhesive onto the PET sheet being continuously conveyed is completed. A laminate was prepared with the coater head fixed.

  A plurality of streak-like stringing phenomena occurred in the width direction at a maximum of 18 mm from the rear end of the hot melt adhesive. Since the interval between the sheet-like PET sheets to be pasted in the subsequent process is set to 10 mm, the hot melt adhesive is exposed between the PET sheets and not only adheres to the transport roller but also transfers to the surface of the laminate that is transported sequentially. By doing so, the surface of the laminate was contaminated.

  The present invention relates to a coating method in which an adhesive of a polymer melt is applied to the surface of a sheet material, a manufacturing method of a laminate formed by laminating a plurality of sheet materials through the adhesive, and a manufacturing method of an electronic information recording body The material cost can be reduced, the handling in manufacturing is easy, the process contamination and appearance quality degradation are eliminated, and the material cost can be reduced such that it is not applied to the extra blank area. It is possible to prevent creation of defective products.

It is a top view which shows an example of the non-contact-type IC card without a metal terminal on the surface. It is sectional drawing which shows the layer structure of an IC card typically. It is a figure which shows embodiment of the manufacturing apparatus of an IC card. It is a perspective view which shows embodiment of an adhesive agent coating apparatus. It is an enlarged view of an adhesive agent coating apparatus. It is a lip tip enlarged view. It is a figure which shows the state of application | coating at the time of completion | finish of application | coating. It is a figure which shows the state of the application | coating at the time of completion | finish of application | coating of other embodiment. It is a figure which shows the state in which the "string drawing" which an adhesive protrudes to a predetermined position is suppressed. It is a figure which shows other embodiment of an adhesive agent coating apparatus.

Explanation of symbols

1 IC card
2 Module board
2a IC chip
2b antenna
2c Base material
3 Key information section
4 Character information section
5 Image information section
6,7 Adhesive layer
10 First sheet material
20 Second sheet material
41 Adhesive applicator
200 coater head
203 Adhesive tank
250 pump
300 Adhesive
400 Application position detection means
401 Control means
402 Drive means

Claims (8)

In a coating method of applying a polymer solution to an object to be coated with an extrusion type coater head,
At the same time as stopping the supply at the end of the application of the polymer melt,
The polymer melt characterized in that the coater head and the object to be coated are separated from the polymer melt to which the coater head is coated by relatively separating at a speed faster than a conveyance speed of the object to be coated. Body application method. At the same time as stopping the supply of the polymer melt at the end of coating, the coater head is separated from the coated polymer melt,
2. The method for coating a polymer melt according to claim 1, wherein the moving direction in which the coater head is separated from the polymer melt is opposite to the transport direction of the coating object. At the same time as stopping the supply of the polymer melt at the end of coating, the coater head is separated from the coated polymer melt,
2. The method for coating a polymer melt according to claim 1, wherein a moving direction in which the coater head is separated from the polymer melt is an upward direction with respect to a transport direction of the object to be coated. In a coating method in which a polymer melt is applied to an object to be coated with an extrusion type coater head,
The coating of the polymer melt is performed while the coating object or the coater head is moving, and at the same time as the supply is stopped at the end of the coating,
A method for applying a polymer melt, wherein either the object to be coated or the coater head is moved at a speed faster than a conveying speed of the object to be coated or the coater head during coating.   5. The method for applying a polymer melt according to claim 1, wherein the polymer melt is a hot melt adhesive.   6. The hot melt adhesive is intermittently applied to a predetermined position with an extrusion-type coater head on the object to be coated which is a continuous body according to any one of claims 1 to 5. The method for applying the polymer melt as described. In the manufacturing method of the laminate in which the sheet material in a single wafer state is attached from above the hot melt adhesive in correspondence with the hot melt adhesive applied to a predetermined position of the object to be coated,
7. A method for manufacturing a laminate, wherein the method for applying the hot melt adhesive is the application method according to claim 6. On the hot melt adhesive applied to a predetermined position of the object to be coated by the coating method according to claim 6, a substrate on which an IC chip and an antenna circuit are mounted is placed on the substrate,
7. A method for producing an electronic information recording body, characterized in that another sheet material sheet coated with an adhesive is attached by the coating method according to claim 6.