JP4522746B2 - Method and apparatus for manufacturing metal-compatible IC labels - Google Patents

Description

The present invention relates to a non-contact IC label that can receive information from the outside and transmit information to the outside using electromagnetic waves as a medium, such as an information recording medium for RFID (Radio Frequency IDentification).
In particular, the metal-compatible IC label according to the present invention is suitably used when affixing to a metal article.

Conventionally, an identification IC label in which an antenna coil and an IC chip storing information are electrically connected is known as an RFID label for RFID.
When these IC labels receive an electromagnetic wave from a reader / writer, an electromotive force is generated in the antenna coil by a resonance action, and the IC chip in the IC label is activated by this electromotive force, and information in the chip is converted into a signal. A signal is transmitted from the antenna coil of the IC label.
A signal transmitted from the IC label is received by the antenna of the reader / writer, sent to the data processing device via the controller, and data processing such as identification is performed.

  In order for these IC labels to operate, the electromagnetic wave transmitted from the reader / writer must be sufficiently taken into the antenna coil of the IC label to induce an electromotive force greater than the operating electromotive force of the IC chip. When the label is attached to the surface of the metal article, the magnetic flux is parallel to the surface of the metal article on the surface of the metal article. For this reason, since the magnetic flux crossing the antenna coil of the IC label is reduced and the induced electromotive force is lowered, there is a problem that the IC chip is not operated due to being lower than the operating electromotive force of the IC chip (for example, Non-Patent Document 1 reference.).

  FIG. 4 is a schematic diagram showing the flow of magnetic flux when an IC label is placed on the surface of a metal article. Since the magnetic flux 42 generated from the reader / writer 41 is parallel on the surface of the metal article 43, the magnetic flux passing through the antenna coil 45 of the IC label 44 placed on the surface of the metal article 43 is reduced. Since the induced electromotive force decreases, the IC chip 46 does not operate.

  Therefore, in order to operate even when placed on a metal article, an antenna coil is wound around a ferrite core so that the axis of the antenna coil is parallel to the direction of magnetic flux on the surface of the metal article. And a method of increasing the induced electromotive force by increasing the magnetic flux passing through the antenna coil surface has been proposed (for example, see Patent Document 1).

  FIG. 5 is a perspective view of an IC tag according to an embodiment of Patent Document 1. An antenna coil 52 is wound around a rectangular ferrite core 56, and a portion of the substrate 55 is not wound around the substrate 55 via a substrate 55. An IC chip 53 and a capacitor 54 are mounted on the top. When the flat portion of the rectangular ferrite core 56 (the lower surface in FIG. 5) is attached to the surface of the metal article, magnetic flux parallel to the surface of the metal article passes through the ferrite core 56 and passes through the antenna coil 52 at a right angle. Therefore, a required induced voltage is generated and the IC chip 53 is activated.

  On the other hand, an antenna coil is formed in a flat shape, and magnetic flux is passed through a magnetic core member provided on the lower surface of the antenna coil, whereby the magnetic flux is passed through the antenna coil formed in a flat shape and guided to the antenna coil. There is a proposal for generating an electromotive force and providing a conductive member on the lower surface of the magnetic core member to prevent the effect of the article to be placed on the IC label (for example, see Patent Document 2).

FIG. 6 is a cross-sectional view showing an embodiment of Patent Document 2. In FIG. The IC label antenna coil 61 is composed of a conductor 61 a wound in a spiral shape in a plane, a plate-like or sheet-like magnetic core member 63 bonded to one surface of the antenna coil 61, and the magnetic core member 63. A conductive material portion 64 is provided on the lower surface. The magnetic core member 63 crosses a part of the antenna coil 61 on the other surface of the substrate on which the antenna coil 61 is provided, and one end portion is exposed to the outside of the antenna coil 61 and the other end portion is The antenna coil 61 is laminated so as to come to the center (inside) 62.
When the magnetic core member 63 is laminated in this way, the magnetic flux enters from one end of the magnetic core member 63 and exits from the other end, so that the magnetic flux emitted from the other end is inside the antenna coil 61. The induced electromotive force is generated in the antenna coil 61 formed by the conductor 61a. For this reason, even if this IC label is attached to the surface of the article 65 and the magnetic flux direction around the IC label is parallel to the surface of the antenna coil 61 of the IC label, the magnetic flux passes through the antenna coil 61. This induces a voltage sufficient to operate the IC chip, so that the IC chip operates reliably.

  Further, in this embodiment, since the conductive member 64 is laminated and bonded to the other surface of the substrate on which the antenna coil 61 is provided so as to cover the magnetic core member 63, the conductive member 64 passes radio waves to the article. Will be shielded. Therefore, the antenna coil 61 is less affected regardless of whether or not the article 65 is a metal, and even if the surface of the article 65 is made of metal, it is caused by eddy currents generated on the metal surface. Loss does not occur, and the RFID tag operates reliably even when attached to the metal article 65.

However, in Patent Document 1, if the diameter of the antenna coil 52 is increased in order to increase the magnetic flux passing through the antenna coil 52 in order to increase the induced electromotive force, there is a problem that the thickness of the IC label increases.
On the other hand, since Patent Document 2 is provided with a magnetic core member and a conductive member on one surface of the substrate, there is a problem that the thickness of the IC label also increases in this case.
Supervised by Nobuyuki Teraura, “Development and Application of RF Tags-Future of Wireless IC Chips”, First Edition, CMC Publishing, February 28, 2003, p121, Fig. 2 Japanese Patent Laying-Open No. 2003-317052 (FIG. 1) Japanese Patent Laying-Open No. 2003-108966 (FIG. 1)

  The present invention has been made in view of the above circumstances, and suppresses an increase in the thickness of an IC label, and even when placed on an article such as a metal, the electromotive force sufficiently exceeds the operating electromotive force of the IC chip. An object is to provide a metal-compatible IC label that can be induced and used.

In order to solve this problem, a method for manufacturing a metal-compatible IC label according to the present invention includes a second adhesive layer, a second substrate, a first adhesive layer, and a waste paper on one side of a long release paper. A first supply step for supplying the first continuous paper stacked in the order of the length of the first continuous paper, and the first adhesive layer by removing the discarded paper from the first continuous paper prepared by the first supply step An adhesive layer exposing step of exposing the antenna coil, and an antenna coil and an IC chip that are electrically connected to each other are provided on one surface of the electrically insulating first substrate, and magnetically covers the antenna coil and the IC chip. An inlet pasting step in which an inlet provided with a body layer is sequentially pasted on the exposed surface of the first adhesive layer prepared by the release paper exposing step via the magnetic layer; Third adhesive layer on one side of A second supply step for supplying the second continuous paper in which the paper is stacked in the longitudinal direction thereof, and a second supply step in which the paper is removed from the second continuous paper fed out in the second supply step and exposed. At least a bonding process for bonding the three adhesive layers and the other surface of the first substrate, and a die cutting process for punching out a portion to be an IC label from the laminate formed by the bonding process. It is characterized by being.
According to this configuration, the second substrate with release paper is supplied while removing the waste paper, the IC inlets are sequentially fed one by one, and the operation of assembling the IC inlet into a predetermined position on the second substrate is relied on manually. In order to punch out IC labels in-line after supplying the upper paper while removing the waste paper and pasting the upper paper to the other surface of the first substrate, A large amount of IC labels can be manufactured efficiently and with high quality.

The metal-compatible IC label manufacturing apparatus according to the present invention is formed by first stacking a second adhesive layer, a second substrate, a first adhesive layer, and a waste paper on one side of a long release paper. A first supply means for supplying continuous paper in the longitudinal direction, an adhesive layer exposing means for removing the paper and exposing the first adhesive layer, and one surface of the electrically insulating first substrate, An electrically connected antenna coil and an IC chip are provided, and an inlet formed with a magnetic layer so as to cover the antenna coil and the IC chip is exposed to the first adhesive through the magnetic layer. Inlet sticking means for sequentially sticking to the surface, and second supply means for supplying, in the longitudinal direction, second continuous paper in which paper is stacked on one side of a long upper sheet via a third adhesive layer And the second continuous paper is removed and exposed. At least a sticking means for sticking the third adhesive layer and the other surface of the first substrate, and a die cutting means for punching out a portion to be an IC label from the laminate formed by the sticking means. It is characterized by having.
According to this configuration, the second substrate with release paper is supplied while removing the discarded paper, the IC inlets are sequentially fed one by one, the IC inlet is attached to a predetermined position of the second substrate, and the second substrate Since the function of punching the IC label in-line after sticking the upper paper from which the paper is removed on the other side is summarized in a compact manner, a relatively inexpensive device can be obtained.

  As described above, according to the present invention, the induction layer sufficient to operate the IC chip on the antenna coil even when placed on a metal article is formed by forming the magnetic layer. Electric power is generated. In addition, since the magnetic layer can be formed thin, a metal-compatible IC label having a thinner thickness than conventional metal-compatible IC labels can be provided.

  The metal-compatible IC label manufacturing method according to the present invention punches a product in-line while supplying substrates continuously and automatically incorporating IC inlets, so that a large number of IC labels can be efficiently and high-quality. Can be manufactured.

  In addition, the metal-compatible IC label manufacturing apparatus according to the present invention is compactly integrated with a continuous substrate supply function, an IC inlet progressive feeding and substrate pasting function, an upper paper sticking function, and a product punching function. Therefore, a relatively inexpensive device can be obtained.

Hereinafter, an embodiment of a metal-compatible IC label of the present invention, a manufacturing method thereof, and a manufacturing apparatus will be described with reference to the drawings.
In addition, this form is specifically described in order to better understand the gist of the invention, and does not limit the present invention unless otherwise specified.

FIG. 1 is a schematic cross-sectional view of an embodiment of a metal-compatible IC label of the present invention.
In FIG. 1, an antenna coil 3 and an IC chip 4 are provided on one surface of an electrically insulating first substrate 2, and the antenna coil 3 and the IC chip 4 are electrically connected. On one surface of the first substrate 2, a magnetic layer 5 is provided so as to cover the antenna coil 3 and the IC chip 4, and the first adhesive layer 6 and the first adhesive are interposed via the magnetic layer 5. An electrically insulating second substrate 7 is provided via an agent layer 6, a second adhesive layer 8 is provided via the second substrate 7, and a release paper 9 is provided via the second adhesive layer 8. On the other hand, an upper paper 11 is provided on the other surface of the first substrate 2 via a third adhesive layer 10.

  The first substrate 2 in this embodiment is a woven fabric, non-woven fabric, mat, paper or a combination thereof, or a resin varnish made of inorganic or organic fibers such as glass fibers, alumina fibers, polyester fibers, polyamide fibers, etc. Composite base material molded by impregnating, polyamide resin base material, polyester resin (PET, PEN, etc.) base material, polyolefin resin base material, polyimide resin base material, ethylene / vinyl alcohol copolymer base material, Polyvinyl alcohol resin base material, polyvinyl chloride resin (PVC, etc.) base material, polyvinylidene chloride resin base material, polystyrene resin base material, polycarbonate resin (PC) base material, acrylonitrile butadiene styrene copolymer resin base Materials, plastic base materials such as polyethersulfone resin base materials, Or selected from known materials such as matte treatment, corona discharge treatment, plasma treatment, ultraviolet irradiation treatment, electron beam irradiation treatment, flame plasma treatment and ozone treatment, or various surface treatments such as easy adhesion treatment. Can be used. An electrically insulating film or sheet made of polyethylene terephthalate (PET) or polyimide is preferably used.

The antenna coil 3 can be formed on one surface of the first substrate 2 by screen-printing in a predetermined pattern using polymer-type conductive ink or by etching a conductive foil.
Examples of the polymer-type conductive ink used in the present invention include resin particles containing conductive fine particles such as silver powder, gold powder, platinum powder, aluminum powder, palladium, rhodium and the like, and carbon powder (carbon black, carbon nanotube, etc.). In general, those blended in can be mentioned. If a thermosetting resin is used as this resin composition, a coating film can be obtained at 200 ° C. or less, for example, about 100 to 150 ° C., and the route through which the electricity of the obtained coating film flows is due to contact of conductive fine particles. However, a resistance value on the order of 10 ⁻⁵ Ω · cm can be obtained.
In addition to the thermosetting type, the polymer type conductive ink of the present invention may be a known type such as a photo-curing type, a penetration drying type, or a solvent volatile type. In addition, when a photocurable resin is included in the resin composition, the curing time can be shortened and the efficiency can be improved. Specifically, for example, a conductive resin fine particle is contained in an amount of 60% by mass or more, and a thermoplastic resin alone or a blend resin composition of a thermoplastic resin and a crosslinkable resin (particularly a crosslinkable resin composed of polyester and isocyanate) is used. A resin containing 10% by mass or more, that is, a solvent volatile type or a crosslinked / thermoplastic combined type (however, the thermoplastic type is 50% by mass or more), or containing 50% by mass or more of conductive fine particles, Resin (such as epoxy resin phenol-curing system or epoxy resin sulfonium salt-curing system) or a blended resin composition of thermoplastic resin and crosslinkable resin, ie, crosslinkable or crosslinkable / thermoplastic combined A mold or the like can be suitably used. Further, when bending resistance is further required in a conductive circuit such as an antenna portion, a flexibility imparting agent can be blended in the polymer type conductive ink used in the present invention. Specific examples of the flexibility imparting agent used in the present invention include, for example, a polyester flexibility imparting agent, an acrylic flexibility imparting agent, a urethane flexibility imparting agent, and a polyvinyl acetate flexibility. Examples thereof include an imparting agent, a thermoplastic elastomer-based flexibility imparting agent, a natural rubber-based flexibility imparting agent, a synthetic rubber-based flexibility imparting agent, and a mixture of two or more thereof.

  When the antenna coil 3 is formed by etching, a copper foil is prepared on the entire surface of one surface of an electrically insulating substrate. Then, an etching resistant paint is printed on the copper foil in a desired pattern by a silk screen method. Usually, since the antenna coil 3 is formed in a spiral shape or a rectangular shape, the etching resistant paint is printed in a spiral shape or a rectangular shape. Thereafter, after drying and solidifying the etching resistant paint, it is immersed in an etching solution to dissolve and remove the copper foil not coated with the etching resistant paint, and the copper foil portion coated with the etching resistant paint is removed on one side of the substrate. The antenna coil 3 is formed on the surface.

  Next, the IC chip 4 is mounted on a predetermined position of the first substrate 2 via a conductive adhesive (not shown), and a predetermined pressure is applied to the IC chip 4 to thereby apply the IC chip 4 and the first substrate 2 to each other. Are bonded by an adhesive (not shown), and the antenna coil 3 and the IC chip 4 are electrically connected at a contact point provided on the back surface of the IC chip 4.

  The magnetic layer 5 is formed by applying and drying a magnetic paint containing powder or flakes made of a magnetic material. Here, as the powder of the magnetic material to be included in the magnetic paint, carbonyl iron powder, atomized powder such as permalloy, reduced iron powder and the like are used. As the flakes of magnetic material, the above powder is refined with a ball mill or the like to form a powder, and then the flakes obtained by mechanically flattening the powder, or a molten iron-based or cobalt-based amorphous alloy is added to a water-cooled copper plate. Use flakes obtained by collision.

A magnetic coating material in which these magnetic powders and magnetic flakes are kneaded and dispersed together with at least an organic solvent and a binder is used.
In the present embodiment, a thermoplastic resin, a thermosetting resin, a reactive resin, or the like can be used as the binder. Examples of the thermoplastic resin include vinyl chloride, vinyl acetate, vinyl chloride-vinyl acetate copolymer. Vinyl chloride-vinylidene chloride copolymer, vinyl chloride-acrylonitrile copolymer, acrylic ester-acrylonitrile copolymer, acrylic ester-vinyl chloride-vinylidene chloride copolymer, acrylic ester-vinylidene chloride copolymer, Methacrylic acid ester-vinylidene chloride copolymer, methacrylic acid ester-vinyl chloride copolymer, methacrylic acid ester-ethylene copolymer, polyvinyl fluoride, vinylidene chloride-acrylonitrile copolymer, acrylonitrile-butadiene copolymer, polyamide Resin, polyvinyl butyral, cellulose Conductor (cellulose acetate butyrate, cellulose diacetate, cellulose triacetate, cellulose propionate, nitrocellulose), styrene-butadiene copolymer, polyurethane resin, polyester resin, amino resin, synthetic rubber, and the like.
Examples of thermosetting resins or reactive resins include phenolic resins, epoxy resins, polyurethane curable resins, urea resins, melamine resins, alkyd resins, silicone resins, polyamine resins, urea formaldehyde resins, and the like.

  Using these magnetic paints, the antenna coil 3 and the IC chip 4 are applied so as to be slightly hidden on the surface of the first substrate 2 on which the antenna coil 3 and the IC chip 4 are provided by a screen printing method or the like. The IC inlet 12 with the magnetic layer 5 is formed by allowing the magnetic layer 5 to stand at room temperature after coating or heating to a predetermined temperature and time to solidify by drying.

Subsequently, an electrically insulating second substrate 7 is prepared. As the material of the second substrate 7, the same material as that of the first substrate 2 can be used. An adhesive is applied to both surfaces of the second substrate 7 (formation of the first adhesive layer 6 and the second adhesive layer 8), and then a release paper 9 is applied to one surface (second adhesive layer 8). The IC inlet 12 is attached to the other surface (first adhesive layer 6) via the magnetic layer 5.
Thereafter, an upper paper 11 having an adhesive (third adhesive layer 10) applied to the back surface is attached to the other surface of the first substrate 2 (the surface on which the antenna coil 3 and the IC chip 4 are not provided). By sticking via an adhesive (third adhesive layer 10), the metal-compatible IC label 1 of the present invention is obtained.

Hereinafter, the manufacturing method and manufacturing apparatus of the metal corresponding | compatible IC label of this invention are demonstrated.
FIG. 2 is a diagram schematically showing the configuration of the manufacturing apparatus for the metal-compatible IC label 1 according to the embodiment of the present invention.
In the manufacturing apparatus of the present embodiment, paper is affixed to one surface of the second substrate 7 via the first adhesive layer 6, and release paper is affixed to the other surface via the second adhesive layer 8. In addition, a first supply means 21 for supplying the first continuous paper 20 is provided.
The first continuous paper 20 supplied from the first supply means 21 is sent to the inlet pasting means 23 after the surface paper 20a is peeled off and taken up by the take-up portion 22.
As shown in FIG. 3, the inlet sticking means 23 includes a stacker (holding means) 31 that holds a number of IC inlets 30 (corresponding to 12 in FIG. 1) stacked in the vertical direction. Below the stacker 32, an inlet drawer (extraction means) 32 for taking out the IC inlets 30 one by one from a large number of IC inlets 30 is provided. The inlet drawer 32 is configured to be able to reciprocate along the vertical direction, and the tip heads 32a are sequentially drawn out by the suction action of the IC inlets 30 positioned at the lowermost side of the multiple IC inlets 30 stacked on the stacker 31 ( Take out).

  Here, the lower side surface of the IC inlet 30 is a surface to be affixed on the first continuous paper 20b and is formed flat. Therefore, the tip head 32a of the inlet drawer 32 can suck the center portion of the lower surface of the IC inlet 30 with a sufficient suction force, and the IC inlets 30 can be reliably pulled out one by one from the stacker 31. At this time, the IC inlet 30 bends instantaneously, but since the IC module and the antenna are positioned away from the central portion of the IC inlet 30, they are not damaged by the suction of the tip head 32a. Moreover, since it is the structure which pulls out sequentially from the lowest side of many IC inlet 30, IC inlet 30 can be supplied to the stacker 31 at any time also in the middle of work.

  The IC inlet 30 drawn from the stacker 31 by the inlet drawing machine 32 is placed in a guide groove 33 a formed in the rail member 33. Note that the width dimension of the guide groove 33 a is set slightly larger than the corresponding dimension of the IC inlet 30. And the inlet drawer 32 is comprised so that it can approach the stacker 31 through the through-hole 33b of the perpendicular direction formed in the rail member 33. As shown in FIG. The inlet sticking means 23 includes an extrusion block 34 that is positioned in the guide groove 33a of the rail member 33 and can reciprocate along the guide groove 33a.

  For example, the extrusion block 34 driven by an air cylinder moves to the right side in the drawing along the guide groove 33a, so that the IC inlet 30 pulled out from the stacker 31 and placed in the guide groove 33a Feeding is performed until the tip substantially comes into contact with the abutting portion 33c of the guide groove 33a. As described above, the rail member 33 and the pushing block 34 constitute moving means for moving the IC inlet 30 taken out from the large number of IC inlets 30 to a predetermined position. Further, the stacker (holding means) 31, the inlet drawer (extraction unit) 32, the rail member 33, and the extrusion block 34 (moving means) selectively take out the IC inlets 30 one by one from the large number of IC inlets 30. Thus, a feeding means for sequentially feeding to a predetermined position is configured.

  Furthermore, the inlet sticking means 23 includes a suction block 35 for sucking and gripping the IC inlet 30 positioned so that the tip thereof substantially comes into contact with the abutting portion 33c of the guide groove 33a by suction. The suction block 35 has a cubic shape corresponding to the rectangular shape of the IC inlet 30, and a sponge 35 a as a cushioning material is attached to the lower surface of the suction block 35. A suction port (not shown) for sucking and holding the IC inlet 30 is provided at the center of the lower surface of the suction block 35.

  For example, the suction block 35 driven by an air cylinder is configured to be movable in the vertical direction and in the horizontal direction along the guide groove 33a. In this way, the suction block 35 is lowered toward the IC inlet 30 positioned so that the front end substantially contacts the abutting portion 33c of the guide groove 33a, and the IC inlet 30 is sucked and held on the lower surface of the suction block 35. At this time, the suction force from the suction block 35 acts on the central portion of the IC inlet 30, but the IC inlet 30 is not damaged due to the suction force by the buffering action of the sponge 35a.

  The suction block 35 that sucks and holds the IC inlet 30 moves up, and then moves to above the paper 20b of the first continuous paper 20 along the horizontal direction in the drawing. At this time, the suction block 35 moves laterally along a horizontal guide (not shown), and stops at a predetermined position above the sheet 20b by the action of a stopper (not shown), for example. Thereafter, the suction block 35 is lowered and presses the IC inlet 30 sucked and held against the surface of the paper 20b.

  In the first continuous paper 20, the second adhesive layer 6 is exposed on the surface of the paper 20b with the discarded paper 20a being peeled off. Therefore, when the suction block 35 presses the IC inlet 30 against the surface of the paper 20b and stops the suction operation, the IC inlet 30 is affixed to the surface of the paper 20b. Thus, the suction block 35 constitutes a moving pressing means for moving the IC inlet 30 fed to a predetermined position and sequentially pressing the IC inlet 30 against the surface of the paper 20b of the first continuous paper 20.

  On the other hand, the first continuous paper 20 is intermittently conveyed along the longitudinal direction by a sensor (not shown) reading a timing mark 20d formed on one side of the surface of the paper 20b. In this way, by repeating the above-described inlet pasting operation and intermittent conveying operation, the IC inlets 30 are sequentially pasted on the surface of the paper 20b with a predetermined pitch at intervals.

  In FIG. 3, for the sake of clarity, only one inlet pasting mechanism including one feeding unit and one moving pressing unit is shown, but the flow direction (supply direction) of the continuous paper 20 is shown. It is also possible to arrange the inlet pasting mechanisms along a plurality of rows. In this case, the same number of IC inlets 30 as the number of inlet sticking mechanisms can be simultaneously stuck on the surface of the paper 20b.

  In addition, the intervals along the flow direction of the first continuous sheet 20 of the plurality of inlet pasting mechanisms can be adjusted so that the intervals between the plurality of IC inlets 30 simultaneously pasted on the surface of the sheet 20b can be adjusted. It is preferable that Furthermore, a plurality of inlet pasting mechanisms can be configured so as to be compatible with IC inlets 30 of various sizes.

  Referring to FIG. 2 again, the first continuous paper 20 to which the IC inlets 1 are sequentially pasted at intervals via the inlet pasting means 23 is a pasting means 27 composed of a pair of pasting rollers 27a and 27b. Sent to. On the other hand, the manufacturing apparatus of the present embodiment includes second supply means 25 for supplying, as the second continuous paper 24, for example, the second continuous paper 24 in which the paper is affixed to the upper paper via an adhesive layer. ing. The second continuous paper 24 has a three-layer structure, and a discard paper 24a provided on the upper side and an upper paper 24b provided on the lower side are bonded together with an adhesive layer. Here, the upper sheet 24b constitutes the front sheet of the IC label 1.

  The second continuous paper 24 supplied from the second supply means 25 is sent to the sticking means 27 after the discarded paper 24 a is peeled off and taken up by the take-up unit 26. Note that the adhesive layer is exposed on the surface of the second continuous paper 24b (the surface in contact with the paper waste 24a) with the paper waste 24a peeled off. Thus, in the sticking means 27, the first continuous paper 20 and the second continuous paper 24 pass between the pair of sticking rollers 27a and 27b, so that the adhesive layer of the second continuous paper 24b and the first continuous paper 24 The surface of the continuous paper 20b to which the IC inlet 30 is attached is overlapped and attached.

  Here, in order to reduce the load on the IC inlet 30 when passing between the pair of sticking rollers 27a and 27b, that is, in order to reduce the nip pressure acting on the IC inlet 30, the sticking roller 27a. And a sponge (not shown) as a cushioning material is wound around at least one of 27b. Further, in each guide roller provided on the downstream side of the sticking means 27, the roller diameter is set to a relatively large value in order to reduce the bending stress acting on the IC inlet 30 having a relatively weak characteristic to bending deformation ( For example, the diameter is set to about 80 mm.

  The composite paper (20b, 24b) that is superposed and pasted via the sticking means 27 is sent to the die cutting means 28. In the die cutting means 28, unnecessary portions of the composite paper (20b, 24b) die-cut and die-cut along the outer shape of one IC label 1 (paper 20b and paper 24b other than the area of the IC label 1) Is wound around the winding means 29.

As described above, in the present embodiment, in the inlet pasting means 23, the IC inlets 30 are selectively taken out one by one from the large number of IC inlets 30 and sequentially fed to a predetermined position, and then fed to a predetermined position. The IC inlet 30 can be moved and pressed against the surface of the first continuous paper 20 on the surface of the paper 20b so that the IC can be attached in sequence. Therefore, the work of incorporating the IC inlet 30 into the paper can be automatically performed without relying on manual work, and a large number of IC labels 1 can be manufactured efficiently and with high quality.
In FIG. 3 of the present embodiment, the IC inlet 30 is supplied in a cassette type, but it is needless to say that a continuous type supply and a cutting method using a cutter or the like may be adopted. The magnetic layer may be formed by in-line coating and drying.

  The metal-compatible IC label manufacturing apparatus described above can be similarly applied to so-called IC tags. Therefore, the “IC label” in the present invention is not limited to the normal form of the IC label that is used by being peeled off from the mount, and is also applicable to an IC tag having a form incorporated between two sheets of paper. can do.

It is a schematic diagram which shows an example of the cross section of the metal corresponding | compatible IC label which concerns on this invention. It is a figure which shows schematically the structure of the manufacturing apparatus of the metal corresponding | compatible IC label which concerns on this invention. It is an expansion perspective view which shows in detail the structure of the inlet sticking part of the manufacturing apparatus of the metal corresponding | compatible IC label which concerns on this invention. It is a schematic diagram which shows the flow of the magnetic flux at the time of mounting a normal IC label on the surface of a metal article. It is a perspective view which shows an example of the conventional metal corresponding | compatible IC label. It is sectional drawing which shows another example of the conventional metal corresponding | compatible IC label.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Metal corresponding | compatible IC label, 2 1st board | substrate, 3 Antenna coil, 4 IC chip, 5 Magnetic body layer, 6 1st adhesive bond layer, 7 2nd board | substrate, 8 2nd adhesive bond layer, 9 Release paper, 10 3rd Adhesive layer, 11 Top paper, 12 IC inlet, 20 First continuous paper, 20a Discard paper, 20b Paper, 20d Timing mark, 21 First supply means, 22 Winding means, 23 Inlet sticking means, 24 Second continuous paper 24a waste paper, 24b paper, 26 winding means, 27 sticking means, 27a, 27b sticking roll, 28 die cutting means, 29 winding means, 30 IC inlet, 31 stacker, 32 pulling means, 32a tip head, 33 rail member, 33a guide groove, 33b through hole, 33c abutting part, 34 extrusion block, 35 suction block, 35a sponge.

Claims (2)

A method of manufacturing a non-contact IC label in which a transmitting / receiving antenna coil and an IC chip are mounted on a substrate,
A first supply step for supplying, in the longitudinal direction, a first continuous paper layered in the order of the second adhesive layer, the second substrate, the first adhesive layer, and the discarded paper on one surface of the long release paper When,
An adhesive layer exposing step of exposing the first adhesive layer by removing the discarded paper from the first continuous paper prepared by the first supply step;
On one surface of the electrically insulating first substrate, an antenna coil and an IC chip that are electrically connected to each other are provided, and an inlet that is provided with a magnetic layer so as to cover the antenna coil and the IC chip, An inlet pasting step of sequentially pasting the exposed surface of the first adhesive layer prepared by the release paper exposing step via the magnetic layer;
A second supply step for supplying, in the longitudinal direction, a second continuous paper in which discarded paper is stacked on one side of a long upper paper via a third adhesive layer;
A pasting step of pasting the third adhesive layer exposed by removing the paper from the second continuous paper fed out by the second feeding step and the other surface of the first substrate;
A method for producing a metal-compatible IC label, comprising at least a die-cutting step of punching out a site to be an IC label from the laminate formed by the sticking step. A non-contact IC label manufacturing apparatus in which a transmitting / receiving antenna coil and an IC chip are mounted on a substrate,
A first supply means for supplying, in the longitudinal direction, a first continuous paper layered in the order of a second adhesive layer, a second substrate, a first adhesive layer, and a waste paper on one surface of a long release paper; ,
An adhesive layer exposing means for removing the waste paper and exposing the first adhesive layer;
On one surface of the electrically insulating first substrate, an antenna coil and an IC chip that are electrically connected to each other are provided, and an inlet that is provided with a magnetic layer so as to cover the antenna coil and the IC chip, Inlet sticking means for sequentially sticking to the exposed surface of the first adhesive through the magnetic layer;
A second supply means for supplying, in the longitudinal direction, a second continuous paper in which discarded paper is stacked on one surface of a long upper paper via a third adhesive layer;
A sticking means for sticking the third adhesive layer exposed by removing the second continuous paper and the other surface of the first substrate;
An apparatus for producing a metal-compatible IC label, comprising at least die-cutting means for punching out a portion to be an IC label from the laminate formed by the sticking means.

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