JP2014067139A - Ic label - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC label used by being affixed to a commodity or its package, that cannot be read before purchase of the commodity but can be read after purchase of the commodity.SOLUTION: An IC label includes an inlet including an inlet base material, an antenna element provided on the inlet base material and an IC chip connected to the antenna element. An article side adhesion layer is provided on one surface of the inlet, and a metal layer is provided on the other surface of the inlet through a metal layer side adhesion layer.

Description

  The present invention relates to an IC (integrated circuit) label that is used by being attached to, for example, a product or its package.

In recent years, to control counterfeit goods such as relatively expensive products such as luxury liquor, consumables of electrical appliances, books, CDs, DVDs, etc., the product itself and its packaging have been packaged for various purposes such as logistics management and shoplifting prevention An IC label is attached to a case or the like.
The IC label has a configuration in which an IC inlet (non-contact IC medium) having a high security function is attached to a part of the adhesive surface of a sealed label (label base material). According to this IC label, individual identification is made possible by storing identification information unique to the IC chip embedded in the IC inlet.

In addition, the spread of IC readers is progressing, and it is becoming an environment that can be used by general consumers such as mobile phones incorporating IC readers. For example, it is a smartphone equipped with an NFC (Near Field Communication) chip having an IC reading function.
Therefore, as another use of such an IC label, in addition to the conventional anti-counterfeiting application, product information is stored in the IC chip, and the consumer himself / herself uses the IC reader to display product information such as advertisements, benefits, coupons, etc. It has become possible to use it.

JP 2003-150924 A JP 2002-083250 A

However, the non-contact communication method using the IC can read the IC information by bringing the reader close to a certain distance. Therefore, the IC information affixed to the product or package before purchasing the product can be read. May be read.
Accordingly, in the present invention, an IC label that can be read after purchase of a product while being unreadable before purchase of a product in an IC label used by being attached to the product or its package. It is an issue to provide.

  The present invention includes an inlet having an inlet base material, an antenna element provided on the inlet base material, and an IC chip connected to the antenna element, and an article-side adhesive layer is provided on one surface of the inlet. The IC label is characterized in that the metal layer is provided with a metal layer side adhesive layer on the other surface of the inlet.

  Further, the adhesive force of the metal layer side adhesive layer is lower than that of the article side adhesive layer.

  The metal layer side adhesive layer is characterized by comprising a pressure sensitive adhesive composition containing fine particles.

  Further, a release layer is provided between the inlet and the metal layer side adhesive layer.

  The metal layer has a thickness of 5 μm or more.

  Further, the antenna element of the inlet is a coiled antenna.

  The metal layer may cover 50% or more of the inlet antenna element.

  In addition, a magnetic layer is provided between the inlet and the article-side adhesive layer.

  According to the present invention, an IC label that can be read after purchase of a product while being unreadable before purchase of a product in an IC label that is used by being attached to the product or its package. It can be.

It is explanatory drawing which shows the outline of the IC label of this invention. It is a section explanatory view showing the outline of the IC label of the present invention. It is a section explanatory view showing the outline of the IC label of the present invention. It is a section explanatory view showing the outline of the IC label of the present invention. It is a section explanatory view showing the outline of the IC label of the present invention.

  Embodiments of an IC label according to the present invention will be described below with reference to the drawings.

FIG. 1 is an explanatory diagram showing an outline of an IC label according to the present invention. 2, 3, 4, and 5 are cross-sectional explanatory views showing the outline of the IC label of the present invention.
As shown in FIG. 2, an IC label 1 includes an IC inlet 2 capable of non-contact communication and an adhesive (adhesion) layer 7 for bonding to an adherend 9 such as a CD, DVD or book on one surface of the inlet. The metal layer 6 is provided on the other surface of the inlet 2 via the adhesive (adhesive) layer 8. 2 illustrates an example in which the adhesive (adhesive) layers 6 and 8 are formed directly on the inlet, but other layers are sandwiched between the inlet and the adhesive (adhesive) layers 6 and 8. Also good.
In this way, since the metal layer shields communication in the initial state of being attached to the adherend such as a product, it is possible to prevent unauthorized reading of the IC chip. When the metal layer on the upper side of the label is peeled off, the contents of the IC chip can be read.

  The inlet 2 includes an inlet base 3 and an IC chip (IC module) 4 that is electrically connected to the antenna element 5 on one surface of the inlet base 3.

  The inlet base material 3 may be a plastic base material such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), polyimide (PI). Further, a paper base material or the like may be used.

As the antenna element 5, a coil-type, dipole-type, or patch-type antenna element having a communication frequency in the UHF band (800 to 1000 MHz), 13.56 MHz, 2.45 GHz, or the like can be used.
The antenna element 5 is not particularly limited as long as it can form a circuit with a conductive material, and various antenna elements can be used. For example, a method of forming a metal thin film into a pattern by etching, a method of arranging a conductive wire, and a method of forming a conductive ink in a pattern by printing.

As a method of forming a metal thin film into a pattern by etching, a conductive thin film such as aluminum or copper is coated in a pattern with an etchant-resistant material, and the conductive thin film is partially removed with an etchant. A method of forming a conductive thin film in a pattern can be used. In addition, about the part where wiring crosses, a jumper line may be provided in the back of an inlet base material, and an opening for connection may be provided in an inlet base material, or it may be connected by bonding separately using a jumper wire member. May be.
Examples of the method for arranging the conductive wires include a method of forming a metal wire such as copper in a pattern with a wiring machine or the like. Note that the metal wire can be covered with an insulating coating, and a coiled antenna is preferable because it can be wired without performing jumper wire processing or the like at the portion where the antenna coil and the antenna coil intersect.
As a method of forming the conductive ink in a pattern by printing, it is preferable that the conductive ink is made of a conductive paste in which particles made of a conductive material are dissolved or dispersed in a binder. The conductive material described above is preferably silver-based, and examples of the conductive paste include an evaporative drying type silver paste that contains a binder resin, a solvent, and silver powder to obtain conductivity by contacting them. However, the conductive material is not limited to silver, but for example, a metal powder such as copper or nickel, a conductive carbon powder, a conductive fiber, a conductive whisker or the like dissolved or dispersed in a solvent together with a resin binder is used. it can. As a printing method, for example, it can be formed by printing by a printing method such as screen printing, flexographic printing, gravure printing, or offset printing. It is also possible to print conductive ink with a printer.

The IC chip of the present invention includes a so-called bare chip in which bumps for connection are formed on the chip, a so-called IC module in which the chip is mounted in a connection plate shape and sealed with a resin.
The IC chip is electrically connected to the antenna element and mounted on the inlet base material. Usually, the antenna element is mounted after being formed. When mounting, for example, when using an IC module, an opening is provided in the inlet base material in order to reduce the thickness of the IC module, and mounting is performed so that the chip portion of the IC module is partially accommodated in the opening. Can do.
Further, the IC chip has a non-contact communication function, and stores product information such as advertisements, points, privileges, etc., or addresses of product information in a memory unit.

An adhesive (adhesive) layer 7 is provided on one surface of the inlet 2 to be bonded to the adherend.
The adhesive (adhesive) layer 7 is a material having an adhesive strength of 180 N peel test when a 10 mm wide adhesive (adhesive) layer is attached to a stainless steel plate, 2N / 10 mm or more, preferably 3N / 10 mm or more. Can be used. This is a so-called medium-adhesive or strong-adhesive region. If it is within this range, it can be attached and held on the adherend, and the label itself peels off from the adherend when the metal layer described later is peeled off. Can be prevented.
Although it does not specifically limit as thickness of the adhesion | attachment (adhesion) layer 7, Although 0.1 micrometer-5 mm, Preferably it can provide in the range of 10-50 micrometers.

As the adhesive (adhesive) layer 7, a solvent type, an aqueous emulsion type, a hot melt type, or the like can be used.
The solvent type is mainly composed of natural rubber and synthetic rubber including block copolymer, rosin and its ester, tackifier resin such as terpene resin, softener such as phthalate ester and phosphate ester, toluene, N- Adhesion of rosin and its ester, terpene resin, etc. to acrylic resin mainly composed of polyacrylate obtained by radical polymerization in solvent mainly composed of ethyl acetate or toluene Some are made of a resin, a plasticizer such as a phthalate ester or a phosphate ester, and a curing agent such as a diisocyanate or an aziridinyl group compound.
As an aqueous emulsion type, an acrylic resin mainly composed of polyacrylate obtained by emulsion polymerization in water is made into an emulsion composed of additives such as antifoaming agent, leveling agent, thickener netine dispersion, etc. There is.
As the hot melt type (solvent-free type), there is one having an ethylene-vinyl acetate copolymer as a main component, and any of the above solvent type, aqueous emulsion type, and hot melt type (solvent-free type) can be used. Among them, the adhesive layer using the water-based emulsion type adhesive with acrylic resin as the main resin is more suitable in terms of flexibility between the rollers, and it can cope with environmental problems, safety and economy. It is a more advantageous pressure-sensitive adhesive from the viewpoint of the above.
In addition, polyvinyl acetate, ethylene-vinyl acetate copolymer, polyacrylate ester, polyvinyl chloride, natural rubber, synthetic rubber, vinyl acetate-acrylate copolymer, polyester, polyurethane, etc. A water-insoluble polymer material can also be used.
These materials can be set within the aforementioned adhesive strength range by optimization of additives, molecular weight, and the like.

  The adhesive (adhesive) layer 7 is preferably provided on the side of the inlet substrate where the antenna and IC chip are formed. By doing so, a surface on which a metal layer to be described later is provided can be flattened, and the metal layer can be easily peeled off when the metal layer is peeled later, and a structure that prevents destruction of the antenna or the like can be obtained.

A metal layer 6 is formed on the other surface of the inlet. The metal layer 6 is provided on the inlet 2 through an adhesive (adhesive) layer 8.
The metal layer 6 is not particularly limited as long as it can shield the non-contact communication of the inlet, but a material capable of shielding magnetic fields and radio waves such as aluminum and copper can be used.
As thickness, it is in the range of 0.1 micrometer-5 mm, Preferably it is 1 micrometer-1 mm. If it is 0.1 μm or less, it is difficult to shield magnetic fields and radio waves, and if it is 5 mm or more, it is too thick and the handling property as a label is inferior.
The metal layer 6 is preferably formed so as to overlap at least 50% or more of the antenna element 5. This is because within this range, it is possible to shield communication satisfactorily.

As the metal layer, it is possible to use a metal thin film, a film obtained by vapor-depositing a metal material on a support, or a film formed by printing an ink containing a metal material on a support.
As the support, a known plastic film or paper material such as PET, PP, or vinyl chloride can be used.

As the adhesive (adhesive) layer 8, it is preferable to use a layer having an adhesive strength lower than that of the adhesive (adhesive) layer 7.
The adhesive (adhesive) layer 8 has an adhesive strength of 180 N peel test when a 10 mm wide adhesive (adhesive) layer is attached to a stainless steel plate, 2N / 10 mm or less, preferably 1.5 N / 10 mm or less. A weakly sticky material can be used. Further, it is preferably 1 N / 10 mm or less lower than the adhesive (adhesive) layer 7.
By doing in this way, when peeling a metal layer, it can prevent that label itself peels.

As the adhesive (adhesive) layer 8, rubber-based, silicone-based, and urethane-based materials can be used as appropriate.
Moreover, it is good also as a pseudo-adhesion layer using the pressure sensitive adhesive composition which added microparticles | fine-particles. Since the pressure-sensitive adhesive composition to which fine particles are added can be easily peeled off, it is advantageous for peeling off the metal layer.
The adhesive base used in the pressure-sensitive adhesive composition to which fine particles are added is not particularly limited, and can be arbitrarily selected from those conventionally used for conventional pressure-sensitive adhesives such as natural rubber and synthetic rubber. In particular, natural rubber latex obtained by graft copolymerization of natural rubber with styrene and methyl methacrylate is suitable in terms of blocking resistance, heat resistance, wear resistance, and the like. .
The fine particles used in the pressure-sensitive adhesive composition are not compatible with the pressure-sensitive adhesive base used, that is, a fine particle filler that is incompatible with the pressure-sensitive adhesive base. It is preferable. Examples of such a fine filler include zinc oxide, titanium oxide, calcium carbonate, kaolin, activated clay, spherical alumina, wheat starch, silica, glass powder, and shirasu balloon. These materials may be used alone or in combination of two or more, but a combination of silica and another filler is particularly suitable.

Moreover, in order to make the adhesive (adhesive) layer 8 easy to peel, the release layer 8b and the adhesive (adhesive) layer body 8a can also be used. Since the adhesive (adhesive) layer body 8a has a release layer, it is not always necessary to use a weak adhesive material, and an adhesive (adhesive) material that is easily peelable can be used.
The release layer is not particularly limited as long as it can provide releasability. For example, a release layer made of a silicone-based release agent to which medium is added, an acrylic resin, a vinyl chloride resin, or a urethane type. A resin, a chlorinated rubber-based resin, or the like can be used, and an additive composed of either a polyester-based resin or a vinyl chloride-based resin can be added as necessary.

Further, the label substrate 11 may be used for the IC label 1. The position where the label base material 11 is provided is not particularly limited, but may be provided so as to be adjacent to the inlet base material, for example. Moreover, the label base material 11 can be bonded together with an adhesive (adhesive) agent. As the adhesive (adhesive) agent, a medium adhesive or strong adhesive material similar to the adhesive (adhesive) layer 7 can be used.
It is effective to use a label base material when the size (area) of the inlet base material is smaller than the size (area) of the label or when the mechanical strength of the inlet base material is insufficient.
Examples of the label substrate include vinyl chloride, vinyl chloride-vinyl acetate copolymer, a copolymer of terephthalic acid, cyclohexanedimethanol and ethylene glycol, a copolymer of terephthalic acid, isophthalic acid and ethylene glycol, or the like. Examples thereof include amorphous polyester made of a polymer alloy of a copolymer and polycarbonate and / or polyarylate, polyethylene terephthalate, polybutylene terephthalate, ABS resin, paper, impregnated paper, rubber base material and the like.

In addition, when using an adherend that includes a metal such as a CD or DVD, communication may be hindered if it is attached as it is. Therefore, the magnetic layer 10 can be used between the inlet 2 and the adhesive (adhesive) layer 7. For example, the magnetic layer can be provided directly on the side of the inlet base on which the antenna is provided.
The magnetic layer is not particularly limited as long as it contains a magnetic material, and examples thereof include a magnetic layer mixed with a resin or a solvent and applied.
The magnetic material is not particularly limited, and examples thereof include powders of iron or iron-containing alloys or compounds such as carbonyl iron powder, atomized powder such as permalloy, and reduced iron powder.

Next, specific examples of the present invention will be described.
<Example 1>
As an inlet base material, polyethylene terephthalate (PET) having a size of 18 × 50 μm and a thickness of 50 μm is used, and an antenna comprising an 8 × 37 mm size 12 coiled antenna made of copper foil formed on one surface by an etching method. An element was formed. In addition, about the part which a coil cross | intersects, the PET side of strip-shaped PET with copper foil was arrange | positioned on a coil, and it was made conductive by caulking. An IC chip was connected to the end of the antenna coil and mounted to obtain an inlet.
A hard Al sheet having a size of 18 × 50 μm and a thickness of 60 μm was bonded to the other surface of the inlet base material through a pseudo-adhesive layer containing natural rubber, silica particles, and wheat starch so as to cover the entire antenna. The adhesive layer had a strength of 1 N / 10 mm.
Next, it was bonded to the adherend made of an acrylic plate on the antenna surface of the inlet via an adhesive layer made of an acrylic adhesive. The adhesive layer had a strength of 3 N / 10 mm.

<Example 2>
As an inlet base material, polyethylene terephthalate (PET) having a size of 18 × 50 μm and a thickness of 50 μm is used, and an antenna comprising an 8 × 37 mm size 12 coiled antenna made of copper foil formed on one surface by an etching method. An element was formed. In addition, about the part which a coil cross | intersects, the PET side of strip-shaped PET with copper foil was arrange | positioned on a coil, and it was made conductive by caulking. An IC chip was connected to the end of the antenna coil and mounted to obtain an inlet.
A hard Al sheet having a size of 18 × 50 μm and a thickness of 60 μm was bonded to the other surface of the inlet base material through an adhesive layer composed of a release varnish mainly composed of a silicone-based release agent and an acrylic adhesive. The adhesive layer had a strength of 0.8 N / 10 mm.
Next, it was bonded to the adherend made of an acrylic plate on the antenna surface of the inlet via an adhesive layer made of an acrylic adhesive. The adhesive layer had a strength of 3 N / 10 mm.

<Example 3>
It was created in the same manner as in Example 1 except that the size of the metal layer was changed to 6 × 37 μm and changed so as to cover 75% of the antenna coil.

<Example 4>
The metal layer was prepared in the same manner as in Example 1 except that the size of the metal layer was changed to 5.2 × 37 μm and changed so as to cover 65% of the antenna coil.

<Evaluation>
About the sample of Examples 1-4, the state of communication was confirmed using RW for reading (TR3XM-SU01 made from TAKAYA) before peeling a metal layer and after peeling.
Results In all the samples of Examples 1 to 4, communication was impossible before the metal layer was peeled off, but communication was possible after the metal layer was peeled off.

1 ... IC label 2 ... Inlet 3 ... Inlet base material 4 ... IC chip (IC module)
5... Antenna element 6... Metal layer 7... Adhered side adhesion (adhesion) layer 8... Metal layer side adhesion (adhesion) layer 8 a. 8b ... peeling layer 9 ... adherend 10 ... magnetic layer

Claims (8)

An inlet having an inlet base material, an antenna element provided on the inlet base material, and an IC chip connected to the antenna element;
An article-side adhesive layer is provided on one surface of the inlet,
An IC label, wherein the metal layer is provided with a metal layer side adhesive layer on the other surface of the inlet.   2. The IC label according to claim 1, wherein the adhesive force of the metal layer side adhesive layer is lower than that of the article side adhesive layer.   The IC label according to claim 2, wherein the metal layer side adhesive layer is made of a pressure sensitive adhesive composition containing fine particles.   The IC label according to claim 1, further comprising a release layer between the inlet and the metal layer side adhesive layer.   The thickness of the said metal layer is 5 micrometers or more, The IC label in any one of Claims 1-4 characterized by the above-mentioned.   6. The IC label according to claim 1, wherein the antenna element of the inlet is a coiled antenna.   The IC label according to any one of claims 1 to 6, wherein the metal layer covers 50% or more of the antenna element of the inlet.   The IC label according to claim 1, further comprising a magnetic layer between the inlet and the article-side adhesive layer.