JPS6136893A - Manufacture of planar resonance circuit - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Detailed Description of the Invention (Field of Application of the Invention) The present invention relates to a method for manufacturing a planar resonant circuit, and in particular, a method for manufacturing a planar resonant circuit as a resonant tag used in a shoplifting prevention device that utilizes a resonance phenomenon. Regarding.

(Prior Art) A conventional planar resonant circuit 1 of this type, as shown in FIGS. 1 to 3, forms a resonant circuit pattern consisting of an inductor 3 and a capacitor 4 on the front and back surfaces of a dielectric substrate web 2. This is what I did. However, in the conventional manufacturing method of simultaneously manufacturing the resonant circuit pattern on the front and back sides of the dielectric substrate web 2, the inductor 3 and capacitor 4 portion on the front side (first repeating circuit pattern) and the capacitor 4 portion on the back side (first repeating circuit pattern) Two repeating circuit patterns) must be manufactured at the same speed even though the etching amounts are significantly different from each other, resulting in various problems such as complicated processes, low production efficiency, and low yields.

(Object of the Invention) The present invention has been made in view of the above-mentioned problems, and its purpose is to etch the first repeating circuit pattern and the second repeating circuit pattern at an appropriate speed corresponding to the amount of etching of each. The object of the present invention is to provide a method for manufacturing a planar resonant circuit that can improve production efficiency, yield, and stabilize quality by performing etching processing separately.

(Summary of the Invention) That is, the present invention involves separately creating a first repeating circuit pattern and a second repeating circuit pattern on independent first and second continuous substrate webs, and then bonding them together under certain conditions. In addition, a planar resonant circuit having a resonant circuit is manufactured by a wheel which is further separated into individual planar resonant circuits.

(Example) Next, the present invention will be explained in more detail based on the drawings.

First, in the present invention, as shown in FIG. 4, a material web 12 is prepared by bonding a conductive film 11 to a strip-shaped substrate web 10. The substrate web 10 preferably has a thickness of 15 to 30 microns, and the most basic pattern is a dielectric film, such as polyethylene, polystyrene, polypropylene, or other suitable plastic film material as a dielectric.

The conductive film 11 preferably has a thickness of 7 to 50 microns, and is made of aluminum foil, copper foil, tin foil, or the like.

A method of bonding these two members 10.11 is to attach the conductive film 11 on the substrate web 10 without using an adhesive.
There is a method of pasting them together using a hot roll. Of course, adhesive may also be used. Alternatively, the substrate web 10 and the conductive film 11 melt-extruded by an extrusion method may be bonded together using a cooling roll.

Two material webs 12 formed in this way are prepared separately, and the inductor 1 and capacitor 4 are placed on one material web 12.
A first circuit web 14 having a first repeating circuit pattern 13 is created by forming a plate (conductive region) serving as a portion of the circuit by an etching method.

This method is illustrated in FIGS. 5 and 6. That is, a circuit pattern corresponding to the inductor 3 and capacitor 4 is printed on the conductive film 11 using corrosion-resistant ink 15. As this printing method, any method such as gravure printing, screen printing, offset printing, or letterpress printing can be used.The portion of the conductive film 11 that is not printed with the zero-order corrosion-resistant ink 15 is removed by etching. Then, as shown in FIG. 6, a first circuit web 14 having a predetermined repeating circuit pattern 3 is created.

Similarly, the second circuit web 17 is created by separately forming the second repetitive circuit pattern 16, i.e. the plate (conductive area) forming part of the capacitor 4.

First and second circuit webs 14.17 thus formed
are pressed together between predetermined rolls 18 as shown in FIG. For this bonding, a method of thermocompression bonding may be used, or an adhesive may be used.

Thus, as shown in FIG. 8, a first repetitive circuit pattern 13 and a second repetitive circuit pattern 16 are formed on the front and back surfaces of the substrate web 1o.
If necessary, a protective film 19.20 (supporting film) of any thickness is laminated to the surface, and each repetitive circuit pattern is formed into a single resonant circuit. If it is cut as much as possible, a single planar resonant circuit will be formed.

Note that the circuit can be formed not only by using a dielectric film as the substrate web, but also by using polyester, nylon, polypropylene, or other plastic films suitable for flexible support materials as the support film.

Next, this method will be explained based on FIG. 9.

In this method, a dielectric substrate web 21 is used as the first substrate web, a support film 22 is used as the second substrate web, and the first and second circuit webs 21 are connected to each other in the same manner as described above.
3.24 can be bonded together. However, in this case, the first and second repetitive circuit patterns 13.16
is required to be separated by a dielectric substrate web 21.

Furthermore, as shown in FIG. 1O, a planar resonant tag can be similarly manufactured by using a support film 22 as the substrate web and interposing a dielectric substrate web 21 therebetween. In this case, the dielectric substrate web 21 may be prepared in advance, but the dielectric substrate web 21 melt-extruded by an extrusion method may be used as the first circuit web 21.
It may also be made to be interposed between the second circuit web 24 and the second circuit web 24 and bonded together using a cooling roll.

The repetitive circuit pattern may be formed by etching, but it may also be formed by using conductive ink or by hot stamping or pressing.

(Effects of the Invention) The effects of the invention described below will be explained in comparison with the prior art.

(1) First, according to the present invention, the printing process can be simplified and productivity can be improved. With the conventional method in which conductive films are simultaneously formed on both the front and back sides of a dielectric film, it is extremely difficult to align the first and second repeating circuit patterns (front, back, left, and right) because a photoswitch for positioning cannot be used. However, there are problems in that the number of man-hours increases and the defective rate increases. However, in the present invention, there is no need to align the first and second substrate webs during the printing process, and the alignment itself is performed after etching and when the photoswitch is fully usable, so the efficiency of alignment work is improved. do.

(2) Furthermore, the etching process can be rationalized and optimized.

In the conventional method, since the first and second repetitive circuit patterns are different, the amount of etching is different. However, since it is necessary to etch at the same time, etching is performed at the same speed.
If the etching process is carried out at an etching speed suitable for the repetitive circuit pattern on one side, the repetitive circuit pattern on the other side will be over-etched, causing circuit disconnections and capacity defects, or under-etched, resulting in incomplete circuits and short circuits. Productivity was extremely low and the defective rate was high. However, in the present invention, since the first and second repetitive circuit patterns are formed separately, a car can be manufactured at etching speeds suitable for each, thereby solving the above-mentioned disadvantages.

(3) Furthermore, reinforcing processing after etching, which was always necessary in the past, becomes unnecessary. In other words, in the past, the dielectric film itself was also the support for the repetitive circuit pattern, but due to the conditions of the dielectric, it was difficult to ensure the strength as a support, so after etching, it was separately laminated with reinforcing paper, etc. was required, increasing the number of man-hours. However, in the present invention, since it is not necessary to provide at least one of the film materials with a dielectric material, a support film material having the required strength can be used. Therefore, processing for the purpose of reinforcement after etching is completed can be omitted.

(4) Furthermore, it is possible to correct variations in frequency as a resonant circuit during bonding in the same process. That is, this frequency variation is mainly caused by variation in the thickness of the dielectric film (variation in the capacitor path).

However, in the present invention, when the first and second repetitive circuit patterns are pasted together, the thickness variations in the dielectric can be corrected by passing them between heated rolls kept at a constant interval.

(5) Furthermore, conventional etching machines require a very special etching machine and advanced technology to form etching on both sides at the same time, but according to the present invention, etching is performed on one side and can be done using a general etching machine and using normal techniques. Processing becomes possible.

As described above, according to the present invention, production efficiency, quality stability, and yield can be improved, and a highly productive planar resonant circuit can be manufactured.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram of a planar resonant circuit, FIG. 2 is a top view, FIG. 3 is a back view, FIGS. 4 to 10 are explanatory diagrams of the present invention, and FIG. An explanatory diagram of the material web, FIG. 5 is a cross-sectional view during printing with corrosion-resistant ink in the etching process,
Figure 6 is a cross-sectional view of the repeating circuit pattern after etching.
FIG. 7 is an explanatory diagram illustrating the bonded state of the circuit web, FIG. 8 is a cross-sectional explanatory diagram of the bonded state, FIG. 9 is a cross-sectional diagram illustrating another pattern of bonding, and FIG. FIG. 7 is a cross-sectional explanatory diagram illustrating still another pattern of bonding. Explanation of symbols ■... Planar resonant circuit 2.21 Italy 11 Dielectric substrate film 3... Φ inductor 4... Fist capacitor 10...
Substrate web 11.Conductive film 12.Material web 13.16.Repetitive circuit pattern 14.17.23.24.25.Circuit web 15.
ψ・Corrosion-resistant ink 18φ・80-L 19.20.2
2.--Support film patent applicant SATO Co., Ltd. Figure 6 Figure 7 Figure d Figure 8 Figure 9 Figure η

Claims (7)

[Claims] (1) A first circuit web is formed by etching a first repeating circuit pattern including at least one inductor and a conductive region functioning as part of at least one capacitor onto the conductive surface of the first substrate web. Separately from the first circuit web, a second repeating circuit pattern including a conductive region functioning as part of at least one capacitor is etched onto the conductive surface of the second substrate web to form a second circuit web; The first and second circuit webs are pasted together at predetermined relative positions and with a predetermined thickness, and each repetitive resonant circuit pattern is separated to form an independent planar resonant circuit. A method for manufacturing a planar resonant circuit. (2) The method for manufacturing a planar resonant circuit according to claim 1, wherein the first and second substrate webs are dielectric. (3) The first and second circuit webs are laminated together such that the first and second repeating circuit patterns are separated by either the first or second substrate web. 2. A method for manufacturing a planar resonant circuit according to item 2. (4) The first and second circuit webs are bonded together such that the first and second repeating circuit patterns are separated by the first and second substrate webs. A method for manufacturing a planar resonant circuit as described in . (5) The method for manufacturing a planar resonant circuit according to claim 1, wherein one of the first and second substrate webs is a dielectric and the other is a support film. (6) The first and second circuit webs are bonded together such that the first and second repetitive circuit patterns are separated by a substrate web made of a dielectric material.
A method for manufacturing a planar resonant circuit as described in . (7) etching a first repeating circuit pattern including at least one inductor and a conductive region functioning as part of at least one capacitor onto the conductive surface of the first substrate web comprising the support film; a circuit web and, separate from the first circuit web, a second repeating circuit pattern including a conductive region functioning as part of at least one capacitor, is etched onto the conductive surface of a second substrate web comprising a support film; The first and second circuit webs are bonded together at a predetermined relative position and with a predetermined thickness with a third substrate web made of a dielectric material interposed, and each repetitive resonance A method for manufacturing a planar resonant circuit, comprising separating circuit patterns to form independent planar resonant circuits.