JP5083091B2 - Method and apparatus for forming non-contact data carrier conductive member - Google Patents

Description

  The present invention relates to a method and an apparatus for forming a circuit pattern which is a conductive member for a non-contact data carrier.

  A wireless tag or the like attached to a product or the like is configured by a non-contact data carrier conductive member.

  Conventionally, when a circuit such as an antenna which is a conductive member for a non-contact data carrier is formed in a predetermined pattern on a base material, a resist pattern is formed on a metal foil such as aluminum or copper which is a conductor laminated on the base material. After that, the circuit pattern is obtained by a chemical method of etching the conductor.

  This chemical method has a complicated manufacturing process and has a problem that chemicals such as an etching agent must be used. Recently, a mechanical method for forming a circuit directly from a metal foil using a punching blade is used. Is used.

  There are two general methods for this mechanical method.

  One of them is to form a thermoplastic adhesive layer in the same pattern as the circuit pattern on a base material such as a synthetic resin film, superimpose a metal foil on it, and heat bond the circuit pattern of the conductor to the base material. Thereafter, a conductor is punched into a circuit pattern on the base material with a punching blade, and finally an unnecessary portion of the conductor is removed from the base material to obtain a circuit (see, for example, Patent Document 1). .

  However, since this mechanical method is performed using a processing cylinder having a punching blade, a heating cylinder having a convex heat transfer body, etc., a punching blade corresponding to a circuit pattern on the processing cylinder or heating cylinder, It is difficult to accurately form a convex heat transfer body, and it is difficult to accurately manufacture a circuit pattern.

  In order to solve such problems, the present inventors have formed a predetermined pitch between an adhesive portion that heat-bonds a conductor to a base material in a circuit pattern and a punching portion that punches the conductor into a circuit pattern on the base material. A single upper die arranged in the above was prepared, and this upper die was attached to a flat press board and moved up and down relative to the lower die. A continuous base material on which conductors are superposed is intermittently fed between the upper and lower molds in the flat press board at the above pitch, and the upper mold and lower mold in the flat press board I tried to press. As a result, a circuit such as an antenna was accurately formed on the continuous base material at a constant pitch.

  Another mechanical method is to form a thermoplastic adhesive layer in the same pattern as the circuit pattern on a base material such as a synthetic resin film, and superimpose a metal foil on the layer to form a conductor on the base material. The circuit pattern of the conductor is punched with a punching blade, and then the circuit pattern of the conductor is heated and bonded to the base material, and finally an unnecessary portion of the conductor is removed from the base material to obtain a circuit (for example, , See Patent Document 2).

  However, the latter mechanical method is also performed using a processing cylinder having a punching blade, a heating cylinder having a convex heat transfer body, etc., as in the former mechanical method. It is difficult to accurately form a punching blade or a convex heat transfer body corresponding to the circuit pattern on the heating cylinder, and it is difficult to accurately manufacture the circuit pattern.

  Also, in the former mechanical method, the circuit pattern of the conductor is heat bonded to the substrate and then punched with a punching blade on the substrate, because if it is punched first, the circuit pattern will shift in the subsequent bonding process. However, if this is to be heat-bonded in the same pattern as the circuit pattern first as in the former, heat is transferred to the conductor and unnecessary parts of the conductor are also attached to the substrate with adhesive. It becomes easy to adhere, and when the conductor is later punched with a punching blade and the unnecessary part is removed, the unnecessary part is hardly peeled off from the substrate. This makes it impossible to accurately form a circuit on the conductor.

  Therefore, if the conductor is punched first as in the latter mechanical method, heat will not easily be transferred to the unnecessary portion of the conductor when heat-bonding later, and this unnecessary portion will not be easily bonded to the substrate. , Easy to remove from the substrate. Therefore, the manufacture of the circuit is simplified.

  However, if the conductor is punched first as in the latter mechanical method and then adhered to the substrate, the necessary part of the conductor adheres to the punching blade side and separates from the substrate together with the punching blade. Thus, there is a problem that the heat adhesion to the base material is hindered, the conductor is likely to be wrinkled or broken, and the yield is lowered accordingly. In addition, in order to perform appropriate punching while preventing the lifting phenomenon of the necessary part of the conductor by such a punching blade, it is necessary to finely adjust the protruding amount of the cutting edge of the punching blade in advance, and therefore the circuit However, it takes a long time to prepare for the manufacturing process, resulting in a decrease in manufacturing efficiency.

  In order to solve the problems of the latter mechanical method, the present inventors have conducted intensive research, and as a result, before punching the conductor into a circuit pattern, only a part of the thermoplastic adhesive layer is melted to remove the conductor. It came to mind that the conductor was temporarily bonded to the substrate, and then the conductor was punched into a circuit pattern on the substrate, and finally the conductor was heat bonded to the substrate with the circuit pattern. Then, a temporary bonding portion that temporarily bonds the conductor to the base material, a punching portion that punches the conductor into the circuit pattern, and an adhesive portion that heat-bonds the conductor to the base material with the circuit pattern are arranged at a predetermined pitch. An upper die was prepared, and the upper die was attached to a flat press board and moved up and down relative to the lower die. A continuous base material on which conductors are superposed is intermittently fed between the upper and lower molds in the flat press board at the above pitch, and the upper mold and lower mold in the flat press board I tried to press. As a result, peeling of unnecessary portions of the conductor is simplified, and a circuit such as an antenna is accurately formed on the continuous base material at a constant pitch.

Japanese Patent Laying-Open No. 2006-277700 (pages 24 to 25, FIG. 7) Japanese Patent Laying-Open No. 2005-340773 (pages 21-22, FIG. 27)

  When a circuit pattern such as an antenna is formed on a conductor using the above-described upper mold, a large number of antennas and the like can be efficiently manufactured for each pitch on the substrate.

  However, as described above, according to the former mechanical method, the bonded portion and the punched portion are fixed to the upper mold at the same interval as the pitch, and according to the latter mechanical method, Since the adhesive part, punched part and adhesive part are fixed at the same pitch as the above-mentioned pitch, there is no problem when manufacturing a large number of circuit patterns alone. When a large number of webs or the like are used as a base material and a circuit pattern of a conductor is to be formed on these, there is a problem that the upper die and the flat press plate are enlarged because the pitch is large.

  Moreover, since the interval between circuit patterns becomes large by any mechanical method, there arises a problem that a large number of unnecessary portions of the conductor are generated.

  Furthermore, regardless of the mechanical method, many upper molds with different pitches are prepared according to changes in circuit pattern shape and size, book cover size, package type and size, etc. There is a problem of having to.

  Therefore, an object of the present invention is to provide means for solving such problems.

  In order to solve the above problems, the present invention employs the following configuration.

  In addition, in order to make an understanding of this invention easy, the code | symbol of drawing is attached | subjected with a parenthesis, However, This invention is not limited to this.

  That is, the invention according to claim 1 is a non-conductive thermoplastic adhesive layer (9) formed in advance on one surface of either the conductor (8, 8a) or the continuous non-conductive substrate (1a). ), The conductor (8, 8a) is superimposed on the base material (1a), and the base material (1a) is intermittently traveled in one direction. The bonding step of melting the thermoplastic adhesive layer (9) and bonding the conductors (8, 8a) to the base material (1a) is performed by the flat press disk for bonding (36), and the substrate (1a) For the non-contact type data carrier, the punching step of punching the conductors (8, 8a) into the circuit pattern is performed by the punching flat press machine (11) arranged on the downstream side of the bonding flat press machine (36). A method for forming a conductive member is employed.

  The invention according to claim 2 is a non-conductive thermoplastic adhesive layer (9) formed in advance on one surface of the conductor (8, 8a) and the continuous non-conductive substrate (1a). ) With the conductors (8, 8a) overlaid on the base material (1a), causing the base material (1a) to intermittently run in one direction, and the thermoplastic adhesive layer (9). A temporary bonding step for temporarily bonding the conductor (8, 8a) to the substrate (1a) by melting only a part of the substrate is performed by the temporary pressing flat plate (10), and on the substrate (1a). The punching step of punching the conductors (8, 8a) into a predetermined circuit pattern is performed by a punching flat press disk (11) arranged on the downstream side of the temporary bonding flat press disk (10). 8 and 8a) are bonded to the base material (1a) by heating with the circuit pattern. And carrying out the punching flat press platen (11) bonding a flat press platen disposed on the downstream side of (12).

  In the method for forming a conductive member for a non-contact type data carrier according to claim 1 or 2, the conductor (8, 8a) is placed on the substrate (1a). By attaching to the substrate at a predetermined interval, the conductor (8, 8a) and the substrate (1a) can be superposed.

  The method for forming a conductive member for a non-contact type data carrier according to claim 1 or 2, wherein the conductor (8) is supplied onto the substrate (1a). It is also possible to carry out while cutting the continuous conductor (8a) into a sheet at predetermined intervals.

  5. The method for forming a conductive member for a non-contact type data carrier according to claim 2, wherein the temporary bonding is performed by reducing the thermoplastic adhesive layer (9) to a predetermined circuit pattern. It can be carried out by melting in the region, or by melting the thermoplastic adhesive layer (9) in a dotted or linear manner at a plurality of locations in the circuit pattern.

  As described in claim 6, in the method for forming a non-contact data carrier conductive member according to claim 1, an unnecessary portion (2z) of the conductor (8, 8a) from the base material (1a). It is possible to further include a separation step of separating the.

  According to a seventh aspect of the present invention, in the method for forming a non-contact data carrier conductive member according to the first aspect, the bonding step is performed by a heating convex portion (20) having a slightly reduced shape of the circuit pattern. It is also possible.

  As described in claim 8, in the method for forming a conductive member for a non-contact type data carrier according to claim 1, it is possible to perform temporary adhesion outside the circuit pattern simultaneously with adhesion within the circuit pattern. It is.

  According to a ninth aspect of the present invention, in the method for forming a conductive member for a non-contact type data carrier according to the second aspect, the temporary adhesion is performed by the heating convex portion (20) having a slightly reduced shape of the circuit pattern. It is also possible.

  According to a tenth aspect of the present invention, in the method for forming a non-contact data carrier conductive member according to the second aspect, the temporary adhesion outside the circuit pattern may be performed simultaneously with the temporary adhesion within the circuit pattern. Is possible.

  Further, the invention according to claim 11 is a non-conductive thermoplastic adhesive layer (9) formed in advance on one surface of either the conductor (8, 8a) or the continuous non-conductive substrate (1a). ) With the conductors (8, 8a) on the base material (1a) and intermittent travel means (13) for intermittent travel of the base material (1a) in one direction, and a predetermined circuit. A flat press plate for bonding (36) for bonding the conductors (8, 8a) to the substrate (1a) by dissolving the thermoplastic adhesive layer (9) in a reduced area of the pattern, and the substrate (1a) ) Non-contact type data comprising a punching flat press machine (11) disposed downstream of the bonding flat press machine (36) for punching the conductor (8, 8a) into a predetermined circuit pattern. A carrier conductive member forming apparatus is employed.

  The invention according to claim 12 is a non-conductive thermoplastic adhesive layer (9) formed in advance on one of the surfaces of the conductor (8, 8a) and the continuous non-conductive substrate (1a). ) With the conductors (8, 8a) on the base material (1a) and the base material (1a) intermittently running in one direction, and the thermoplasticity. A flat press disk (10) for temporary bonding that melts only a part of the adhesive layer (9) to temporarily bond the conductors (8, 8a) to the substrate (1a), and the substrate (1a) Punching flat press platen (11) disposed downstream of the temporary bonding flat press platen (10) for punching the conductor (8,8a) into a predetermined circuit pattern, and the conductor (8,8a). ) Of the above-mentioned flat press machine for punching (11) Employing the forming apparatus of the non-contact type data carrier conductive members; and a flat press platen adhesive disposed in the flow side (12).

  In the apparatus for forming a conductive member for a non-contact type data carrier according to claim 11 or claim 12, the conductor (8, 8a) is placed on the base material (1a). It is also possible to superimpose the conductor (8, 8a) and the base material (1a) by adhering them to each other at a predetermined interval.

  As described in claim 14, in the apparatus for forming a conductive member for a non-contact type data carrier according to claim 11 or 12, supply of the conductor (8) onto the base material (1a). It is also possible to perform the cutting while cutting the continuous conductor (8a) into a single sheet at a predetermined interval by the cutting machine (17).

  15. The non-contact data carrier conductive member forming apparatus according to claim 12, wherein the temporary bonding flat press disk (10) is the thermoplastic adhesive layer (9). Has a heating projection (20) for temporarily adhering the conductor (8, 8a) to the substrate (1a) by melting in a reduced area of the circuit pattern, or the thermoplastic adhesive layer (9). Has protrusions (18) or protrusions (30) for temporarily bonding the conductors (8, 8a) to the substrate (1a) by melting them in a dotted or linear manner at a plurality of locations in the circuit pattern. Can be.

  In the apparatus for forming a conductive member for a non-contact type data carrier according to claim 11 or 12, as described in claim 16, the base material (1a) after the conductor (8, 8a) is punched out. It is also possible to further provide separation means (22, 23, 24) for separating the unnecessary portion (2z) of the conductor from the above.

  18. The non-contact type data carrier conductive member forming apparatus according to claim 11, wherein the bonding flat press disk (12) is a heating device having a shape in which the circuit pattern is slightly reduced. It can be provided with a convex part (20).

  As described in claim 18, in the non-contact data carrier conductive member forming apparatus according to claim 12, the temporary bonding flat press disk (10) has a shape obtained by slightly reducing the circuit pattern. It can be provided with a heating projection (20).

  In the apparatus for forming a conductive member for a non-contact type data carrier according to claim 11, the conductor (8, 8a) is placed on the substrate (1a) outside the circuit pattern. The protrusions (32) or the ridges (34) may be provided on the bonding flat press plate (36) so as to be temporarily bonded.

  In the apparatus for forming a conductive member for a non-contact type data carrier according to claim 12, the conductor (8, 8a) may be attached to the base material (1a) even outside the circuit pattern. The protrusion (32) or the protrusion (34) may be provided on the temporary bonding flat press plate (10) so as to be temporarily bonded to the surface.

  According to the present invention, when a circuit pattern such as an antenna is formed on the conductor (8, 8a), the circuit pattern of a large number of conductors (8, 8a) on the substrate (1a) is efficiently arranged at a predetermined pitch. Of course, it can be manufactured well, a web with many book covers connected, a web with many package blanks connected as a base material (1a), and conductor (8, 8a) on these antennas When the circuit pattern is to be formed, even if the pitch is large, the bonding step and the punching step are performed by separate flat press machines (36, 11), or the temporary bonding step, the punching step, and the bonding step. Are performed by separate flat press machines (10, 11, 12), so that the upper mold (10a, 11a, 12a) and the flat press machine (10, 11, 12) are enlarged or the specifications are changed. There is the advantage that there is no need that. Even if the circuit pattern size, book cover size, package type, etc. change, the spacing between the flat press plates (10, 11, 12) can be adjusted, or the spacing can be left as it is. This change can be easily dealt with by loosening the web between the press panels (10, 11, 12).

  Further, in the present invention, the conductor (8) and the substrate (1a) are superposed by attaching the sheet-like conductor (8) on the substrate (1a) at a predetermined interval. In this case, the generation of unnecessary portions of the conductor (8) can be greatly reduced even if the distance between circuit patterns such as antennas is large.

  The best mode for carrying out the present invention will be described below with reference to the drawings.

<Embodiment 1>
In FIG. 1 thru | or FIG. 5, the code | symbol 1 shows the nonelectroconductive base material which comprises the cover of books, such as a magazine. The cover is made of, for example, a rectangular sheet made of a sheet of a single paper layer, a sheet of a synthetic resin layer, a laminated sheet of a paper layer and a synthetic resin layer, or the like. A conductor 2 having a circuit pattern including an antenna or the like, which is a conductive member for a non-contact type data carrier, is attached to an inner surface or a corner of the outer surface of the base material 1 serving as a cover. The code | symbol 3 shows the image printed in the location off the location where the conductor 2 of the circuit pattern was stuck.

  In FIG. 1, the circuit pattern of the conductor 2 is drawn exaggerated to be larger than the size of the cover.

  As shown in FIGS. 5 (A) and 5 (B), thermoplastic adhesive layers 3 and 4 are formed in circuit patterns on the inner and outer surfaces of the base material 1 as a cover, respectively, and these thermoplastic adhesive layers 3 and 4 are formed. The conductors 2 and 5 of the circuit pattern are laminated and fixed from above.

  The conductors 2 and 5 are made of, for example, aluminum foil. The thickness of the aluminum foil is about 6 μm to 50 μm. As the conductors 2 and 5, foils such as aluminum alloy, copper, and copper alloy can be used in addition to aluminum foil.

  Of the conductors 2 and 5, the conductor 2 on the outer surface of the substrate 1 is formed in an antenna pattern and a capacitor electrode pattern, respectively. Of the conductors 2 and 5, the conductor 5 on the inner surface of the substrate 1 is formed in a bridge pattern and the other electrode pattern of the capacitor, respectively. 1 to 5A and 5B, reference numeral 2a represents a conductor corresponding to the antenna pattern, reference numeral 2b represents a conductor corresponding to the pattern of one electrode of the capacitor, and reference numeral 5a corresponds to a bridge pattern. A conductor, reference numeral 5b, indicates a conductor corresponding to the pattern of the other electrode of the capacitor.

  The antenna pattern is a spiral pattern in the illustrated example, but other patterns such as a bar-shaped pattern, a pad-shaped pattern, and a cross-shaped pattern can be used depending on the communication frequency band.

  The bridge pattern is an elongated rectangle in the illustrated example, but can be appropriately changed to other shapes. The conductor 5a constituting the bridge is provided on the opposite side to the conductor 2a constituting the antenna pattern in the illustrated example, but an insulating layer made of a thermoplastic adhesive layer or the like is provided on the conductor 2a of the antenna. It is also possible to laminate.

  The capacitor pattern is formed in a long and narrow rectangle for one electrode, while the other electrode is formed in a number of electrically connected strips. After the circuit pattern of the non-contact data carrier conductive member is completed, the capacitance is adjusted by cutting the conductor 5c at the connecting portion between the strips, and the resonance as the non-contact data carrier conductive member is achieved. The frequency can be corrected to an optimum value.

  In the base material 1 of the cover sheet to which the conductor 2 having the circuit pattern shown in FIG. 5 (A) is attached, as shown in FIGS. 5 (B) and 4, the conductor 2c corresponding to the pattern at both ends of the antenna; By joining the conductor 5a corresponding to the bridge pattern, electrical conduction between the conductors 2 and 5 is ensured.

  This electrical continuity is performed by performing ultrasonic welding, heating press, or the like in the thickness direction of the substrate 1 between the conductor 2c corresponding to the pattern at both ends of the antenna and the conductor 5a corresponding to the bridge pattern. Is called. Thereby, the recessed part 6 formed in one conductor 2 penetrates the base material 1 and is joined to the other conductor 5. Reference numeral 6a in the figure denotes a joint.

  As shown in FIG. 2, the antenna pattern conductor 2a attached to the substrate 1 includes a conductor 2d corresponding to the IC chip connection electrode. As shown in FIG. 4, the IC chip 7 is placed on the conductor 2d of the IC chip connection electrode and electrically connected.

  A conductor 2 having a circuit pattern as a conductive member for a non-contact type data carrier in which an IC chip 7 is mounted on the base material 1 has a desired coating layer (not shown) on the inner and outer surfaces of the base material 1 as required. By being covered with, it functions as an IC tag.

  Next, a method and apparatus for forming the circuit pattern conductor 2 which is the non-contact type data carrier conductive member shown in FIGS. 1, 2 and 5A will be described.

  As shown in FIGS. 6, 7, and 8, in this forming method, the sheet-like conductor 8 is continuously formed so as to sandwich a non-conductive thermoplastic adhesive layer 9 previously formed on one surface thereof. The superposition process (I) for superimposing on the base material 1a is performed, and the continuous base material 1a on which the sheet-like conductors 8 are superposed is intermittently traveled in one direction while being thermoplastically bonded within a reduced area of a predetermined circuit pattern. An adhesion step (II) in which the agent layer 9 is melted and the conductor 8 is bonded to the substrate 1a is performed by the bonding flat press board 36, and a punching step (III) in which the conductor 8 is punched into a circuit pattern on the substrate 1a. Performing a separation step (IV) for separating unnecessary portions 2z as a circuit pattern of the conductor 8 from the substrate 1a by a punching flat press 11 disposed on the downstream side of the bonding flat press 10 It is.

  Hereinafter, each process and an apparatus for performing each process will be described.

(I) Superimposition process First, the continuous body 1a of the base material 1 and the conductor continuous body 8a which is metal foil are prepared. In FIG. 6, the code | symbol 1b shows the roll which wound up the continuous body 1a of the base material 1, and the code | symbol 8b shows the winding roll which wound up the continuous body 8a of the conductor. A thermoplastic adhesive layer 9 is laminated on one side of the conductor continuous body 8a by applying a thermoplastic adhesive in advance and drying it. The thermoplastic adhesive layer 9 may be laminated on one side of the continuous body 1a of the substrate 1.

  The continuous body 1a of the base material 1 is a continuous paper that can be used as a cover of a book in this case. Instead of a single paper substrate, a laminate of resin layers can be used.

  As the metal foil, an aluminum foil having a thickness of about 6 μm to 50 μm is used. As the metal foil, aluminum foil, foil of aluminum alloy, copper, copper alloy, etc. can be used.

  The thermoplastic adhesive that becomes the thermoplastic adhesive layer 9 is, for example, a hot-melt adhesive, and is applied to one side of a metal foil that is a conductor or a substrate that is a non-conductor with a thickness of about 1 μm to 5 μm. Dried. The thermoplastic adhesive layer 9 is solidly formed on a metal foil or substrate, but may be applied in a pattern corresponding to a predetermined circuit pattern including an antenna or the like.

  The continuous body 1a of the base material 1 is unwound from the winding roll 1b by intermittent running means and is intermittently fed in one direction.

  The intermittent running means is constituted by various intermittent feed rollers 13 and guide rollers 14 respectively disposed on the bonding flat press plate 36 and the punching flat press plate 11. The intermittent feed roller 13 is rotated by a servo motor or the like. Further, a camera 15 is disposed on each flat press platen 36, 11 as a sensor for detecting the position of each cover on the continuous base material 1a. For example, the servo motor that drives the intermittent feed roller 13 is controlled based on the cover position information detected by each camera 15 capturing the print image 3 shown in FIG. 1, for example.

  In addition, a marginal punch hole may be formed in the substrate continuous body 1a, and the substrate continuous body 1a may be intermittently fed in one direction by a pin wheel provided with a pin fitted into the marginal punch hole. In that case, the camera 15 can be omitted.

  The conductor continuous body 8a is fed out from the winding roll 8b by a nip roller 16 by a predetermined length, and is cut into sheet-like conductors 8 by a cutter 17 as shown in FIG.

  The cutting machine 17 has an upper blade 17a and a lower blade 17b that are arranged so as to sandwich the conductor continuous body 8a from above and below. The cutting machine 17 is made of a conductor that is fed out from the winding roll 8b by a predetermined length by the nip roller 16. The continuous body 8a is cut at predetermined lengths by the upper blade 17a and the lower blade 17b. In this way, by cutting and using the conductor continuous body 8a by a predetermined length, it is possible to reduce the generation of the unnecessary portion 2z generated in the conductor.

  The cut sheet-shaped conductor 8 falls by its own weight onto the base material continuum 1a located below, and as shown in FIG. 8 (I), its own weight is applied to the surface of this base material continuum 1a. It adheres by blowing air.

  As the cutting machine, in addition to the above-mentioned guillotine type that crosses the upper and lower blades 17a, 17b, a continuous body 8a of a conductor with a force that does not cut the base material on the continuous body 1a of a single blade. It is possible to use a half-cut type that pushes down and a slitter type that crosses a rotating circular blade and cuts the conductor continuous body 8a.

  It should be noted that the conductors formed in a sheet form from the beginning are stacked, and the conductors 8 are supplied one by one on the base material continuous body 1a from a pile of the sheet conductors 8 by a sucker or the like. May be. Moreover, you may make it supply on the continuous body 1a of a base material with the continuous form, without cut | disconnecting what was drawn out from the winding roll 8b.

  Thus, the continuous body 1a of the base material on which the sheet-like conductors 8 are stacked with the thermoplastic adhesive layer 9 on the lower side is intermittently conveyed to the downstream side by driving the intermittent feeding roller 13. .

(II) Bonding Step As shown in FIG. 6, a bonding flat press plate 36 is disposed on the downstream side of the cutting machine 17 when viewed in the traveling direction of the continuous body 1 a of the base material 1. The flat pressing plate 36 for bonding includes an upper die 36a and a lower die 36b, and faces the substrate continuous body 1a to which the sheet-like conductors 8 are attached in the vertical direction.

  As shown in FIG. 6 (II), the upper mold 36a is provided with heating convex portions 20 having a shape obtained by slightly reducing the circuit pattern as an adhesive means corresponding to one circuit pattern. In addition, a large number of elongated protrusions 32 serving as temporary bonding means are provided corresponding to the outside of the circuit pattern.

  More specifically, as shown in FIG. 9, the predetermined distance is set so that the heating projection 20 fits in the conductor 2 a corresponding to the antenna pattern and in the conductor 2 b corresponding to the one electrode pattern of the capacitor. The upper mold 10a is formed by arrangement. In addition, a large number of protrusions 32 are formed so as to correspond to locations deviated from the circuit pattern in the conductors 2a and 2b. The protrusion 32 of the temporary bonding means is provided as necessary and can be omitted.

  An electric heating wire (not shown) for heating the heating projection 20 and the protrusion 32 is embedded in the upper die 36a.

  The lower die 36b is formed with a flat surface for receiving a large number of protrusions 32. Between the lower mold 36b and the upper mold 36a, the overlapping portion of the sheet-like conductor 8 and the continuous body 1a of the base material 1 enters.

  As shown in FIG. 6 (II), the intermittent feed roller 13 is disposed so as to sandwich the flat pressing plate 36 for bonding from the upstream side and the downstream side, and the print image 3 on each cover of the substrate 1 is captured. The camera 15 is arranged on the upstream side of the bonding flat press board 36.

  The rotation of the intermittent feed roller 13 is controlled based on the position information of the cover detected from the image taken by the camera 15, whereby one cover on the continuous body 1 a of the substrate 1 is accurately positioned between the upper and lower molds 36 a and 36 b. Pause while positioned.

  Therefore, the upper die 36a of the bonding flat press plate 36 reciprocates in the vertical direction, and the heating convex portion 20 and the protrusion 32 of the upper die 36a heat the sheet-like conductor 8 onto the continuous body 1a of the base material 1 and press it. To do. As a result, as shown in FIG. 8 (II), the thermoplastic adhesive layer 9 of the conductor 8 is melted within a range in which the circuit pattern is slightly reduced within the circuit pattern, and the conductor 8 is within the range within the range. Bonded to one continuous body 1a. Further, the thermoplastic adhesive layer 9 of the conductor 8 is melted in the form of dots at a plurality of locations outside the pattern, and the conductor 8 is temporarily bonded to the continuous body 1 a of the substrate 1.

  As shown in FIG. 9, the heating projection 20 of the upper die 36a for carrying out this bonding step is formed in a shape slightly reduced from the circuit pattern. This makes it difficult for the thermoplastic adhesive layer 9 below the contour of the circuit pattern to melt, and prevents the unnecessary portion 2z of the conductor 8 from adhering to the continuous body 1a of the base material 1. Removal of the unnecessary portion 2z of the conductor 8 is simplified.

  The continuous body 1a of the base material 1 to which the sheet-like conductor 8 is bonded within the circuit pattern and temporarily bonded outside the circuit pattern travels in one direction by driving all the intermittent feed rollers 13, thereby The conductor 8 is conveyed to the next punching flat press 11.

(III) Punching Step As shown in FIG. 6 (III), a punching flat press machine 11 is disposed downstream of the bonding flat press machine 10 as viewed in the traveling direction of the continuous body 1a of the base material 1. The

  The punching flat press disk 11 includes an upper die 11a and a lower die 11b, and the single-wafer conductor 8 bonded or temporarily bonded to the continuous body 1a of the base material 1 by the bonding flat press disk 10 is used as the base material 1. The continuum 1a is sandwiched between and confronted.

  As shown in FIG. 6 (III), a punching blade 19 corresponding to a circuit pattern such as an antenna is fixed to the upper mold 11a, and a flat surface for receiving the punching blade 19 is formed on the lower mold 11b. The flat surface of the lower mold 10b is formed of a sheet such as PET.

  As shown in FIG. 6 (III), the intermittent feed roller 13 is disposed so as to sandwich the punching flat press disk 11 from the upstream side and the downstream side, and the printed images of the respective covers on the continuous body 1a of the substrate 1 Is arranged upstream of the punching flat press platen 11.

  The rotation of the intermittent feed roller 13 is controlled based on the position information of the cover detected from the image taken by the camera 15, whereby one cover on the continuous body 1 a of the substrate 1 is accurately positioned between the upper and lower molds 11 a and 11 b. The continuous body 1a of the base material 1 is temporarily stopped in a state where the positioning is performed.

  Therefore, the upper die 11a of the punching flat press platen 11 reciprocates in the vertical direction, and the punching blade 19 of the upper die 11a includes a pattern of an antenna or the like on the continuous body 1a of the base material 1 with the single-wafer-like conductor 8. Punched into a circuit pattern.

  At this time, the conductor 8 is bonded onto the continuum 1a of the base material 1 and is also temporarily bonded, so that it is punched into an accurate circuit pattern without causing misalignment as shown in FIG. 8 (III). .

  Further, since the sheet-like conductor 8 is bonded on the continuous body 1a of the base material 1 and is constrained by temporary bonding, the punching blade 19 is not affected even if it protrudes greatly toward the lower mold 11b. When the mold 11a is raised, the conductor 8 is dragged by the upper mold 11a and does not separate from the continuous body 1a of the substrate 1. For this reason, it becomes possible to perform the punching of the conductor 8 accurately by making the protrusion amount of the punching blade 19 relatively large, and at the same time, the fineness of the punching blade 19 for preventing the dragging of the conductor 8 as in the prior art. No adjustment is required, and the production of the circuit pattern can be started quickly.

  The continuum 1a of the base material 1 on which the conductor 2 on which the bonding process and the punching process are completed is wound up and stored in a continuous state or sent to the next separation process.

(IV) Separation Step As shown in FIG. 7, the punching flat press disc 11 is more than the punching press plate 11 as viewed in the traveling direction of the continuous body 1a of the base material 1 on which the conductor 2 on which the bonding step and the punching step are completed is carried. A guide roller 21 is provided on the downstream side, and the continuous body 1 a of the base material 1 is sent to the separation device through the guide roller 21.

  The separation device includes a suction tube 22 and a separation roller 23. When the continuous body 1a of the base material 1 arrives at the place where the suction tube 22 and the separation roller 23 are installed, the unnecessary portion 2z of the conductor 8 is sucked by the suction pipe 22, while the continuous body 1a of the base material 1 is attracted to the separation roller 23. Travels in reverse while being guided. Thereby, the unnecessary part 2z of the conductor 8 is appropriately peeled off from the continuous body 1a of the base material 1 and is recovered in a recovery box (not shown) to which the suction pipe 22 is connected. When the antenna pattern in the circuit pattern is spiral, the unnecessary portion 2z of the conductor 8 is also generated in a spiral shape, but when sucked by the suction tube 22 in this way, the spiral unnecessary portion 2z is smoothly recovered. be able to.

  A nozzle 24 for ejecting a gas such as air is disposed at a place where the unnecessary portion 2z of the conductor 8 is separated from the continuous body 1a of the base material 1 as necessary. The gas ejected from the nozzle 24 is blown toward the boundary between the continuum 1a of the substrate 1 and the unnecessary portion 2z of the conductor 8, thereby promoting the peeling and removal of the unnecessary portion 2z of the conductor 8. The FIG. 8 (IV) shows a state in which the unnecessary portion 2z is removed and only the conductor 2 of the circuit pattern remains on the continuous body 1a of the substrate 1.

  Thereafter, the continuous body 1a of the base material 1 is supplied to an apparatus similar to the apparatus shown in FIGS. 6 and 7, and another sheet-like conductor similar to the conductor 8 is superimposed on the back side thereof. A conductor 5 having a circuit pattern including the bridge pattern shown in FIG. 2 is formed.

  For the formation of the conductor 5 on the back side, the above-described adhesion can be performed. In this case, an upper mold 28 provided with a heating projection 27 and further a projection 33 as shown in FIG. 10 can be used. The upper mold 28 is attached to a flat press machine similar to the flat press machine for bonding in the first embodiment. As a result, the conductor 5a corresponding to the bridge pattern and the conductor 5b corresponding to the capacitor electrode pattern are respectively bonded within the pattern on the continuous body 1a of the substrate 1, and are temporarily bonded outside the pattern. .

  As shown in FIG. 10, the heating convex portion 27 is formed in a shape slightly reduced from the pattern such as the bridge. The protrusion 33 is disposed around the heating convex portion 27. The upper die 28 having the heating convex portions 27 and the protrusions 33 is attached to a heating flat press plate similar to the heating flat press plate 12. Thereby, the conductor 5a corresponding to the bridge pattern and the conductor 5b corresponding to the electrode pattern of the capacitor are respectively bonded onto the continuous body 1a of the substrate 1.

  Thereafter, the continuous body 1a of the base material 1 is subjected to a peeling step to remove unnecessary portions from the sheet-like conductor, and the conductors 2 and 5 on the front and back sides of the base material 1 as shown in FIG. Is attached to the process of bonding the IC chip 7 or the like, or is attached to the mounting process of the IC chip 7.

  Finally, the base material 1 of the cover is cut from the continuum 1a of the base 1 on the lane marking 29 shown in FIG. 8, and this cover is sent to the bookbinding process.

<Embodiment 2>
The conductor 2 having the circuit pattern, which is the non-contact data carrier conductive member shown in FIGS. 1, 2 and 5A, can also be formed by the method and apparatus described below.

  As shown in FIG. 11, FIG. 7 and FIG. 12, this forming method is continuous through a non-conductive thermoplastic adhesive layer 9 formed in advance on one side of a sheet-like conductor 8 or a continuous conductor. The superimposing step (I) for superimposing the sheet-like base material 1a is performed, and the continuous base material 1a on which the sheet-like conductors 8 are superposed is intermittently run in one direction, and only a part of the thermoplastic adhesive layer 9 is obtained. The temporary bonding step (II) for temporarily bonding the conductor 8 to the substrate 1a by melting the substrate 8 is performed by the temporary pressing flat press board 10, and the punching step (III) for punching the conductor 8 into the circuit pattern on the substrate 1a is performed. The punching flat press platen 11 performs the bonding step (IV) in which the conductor 8 is heated and bonded to the substrate 1a with the above circuit pattern by the punching flat press platen 11 arranged on the downstream side of the temporary bonding flat press platen 10. Flat press machine for bonding located downstream Performed by two, and performs separation step of separating (V) unnecessary unnecessary portion 2z as a circuit pattern of the conductive member 8 from the substrate 1a.

  Hereinafter, each process and an apparatus for performing each process will be described.

(I) Superimposition process First, the continuous body 1a of the base material 1 and the conductor continuous body 8a which is metal foil are prepared.

  In FIG. 11, the code | symbol 1b shows the roll which wound up the continuous body 1a of the base material 1, and the code | symbol 8b shows the winding roll which wound up the continuous body 8a of the conductor. A thermoplastic adhesive layer 9 is laminated on one side of the conductor continuous body 8a by applying a thermoplastic adhesive in advance and drying it. The thermoplastic adhesive layer 9 may be laminated on one side of the continuous body 1a of the substrate 1.

  The continuous body 1a of the base material 1 is a continuous paper that can be used as a cover of a book in this case. Instead of a single paper substrate, a laminate of resin layers can be used.

  As the metal foil, an aluminum foil having a thickness of about 6 μm to 50 μm is used. As the metal foil, aluminum foil, foil of aluminum alloy, copper, copper alloy, etc. can be used.

  The thermoplastic adhesive that becomes the thermoplastic adhesive layer 9 is, for example, a hot-melt adhesive, and is applied to one side of a metal foil that is a conductor or a substrate that is a non-conductor with a thickness of about 1 μm to 5 μm. Dried. The thermoplastic adhesive layer 9 is solidly formed on a metal foil or substrate, but may be applied in a pattern corresponding to a predetermined circuit pattern including an antenna or the like.

  The continuous body 1a of the base material 1 is unwound from the winding roll 1b by intermittent running means and is intermittently fed in one direction.

  The intermittent running means is constituted by various intermittent feed rollers 13 and guide rollers 14 that are arranged for each flat press 10, 11, 12. The intermittent feed roller 13 is rotated by a servo motor or the like. Further, a camera 15 is disposed on each flat press 10, 11, 12 as a sensor for detecting the position of each cover on the continuous base material 1 a. For example, the servo motor that drives the intermittent feed roller 13 is controlled based on the cover position information detected by each camera 15 capturing the print image 3 shown in FIG. 1, for example.

  In addition, a marginal punch hole may be formed in the substrate continuous body 1a, and the substrate continuous body 1a may be intermittently fed in one direction by a pin wheel provided with a pin fitted into the marginal punch hole. In that case, the camera 15 can be omitted.

  The conductor continuous body 8a is fed out from the winding roll 8b by a nip roller 16 by a predetermined length, and is cut into sheet-like conductors 8 by a cutter 17 as shown in FIG.

  The cutting machine 17 has an upper blade 17a and a lower blade 17b that are arranged so as to sandwich the conductor continuous body 8a from above and below. The cutting machine 17 is made of a conductor that is fed out from the winding roll 8b by a predetermined length by the nip roller 16. The continuous body 8a is cut at predetermined lengths by the upper blade 17a and the lower blade 17b. In this way, by cutting and using the conductor continuous body 8a by a predetermined length, it is possible to reduce the generation of the unnecessary portion 2z generated in the conductor.

  The cut sheet-shaped conductor 8 falls by its own weight onto the base material continuum 1a located below, and, as shown in FIG. 12 (I), its own weight is applied to the surface of the base material continuum 1a. It adheres by blowing air.

  As the cutting machine, in addition to the above-mentioned guillotine type that crosses the upper and lower blades 17a, 17b, a continuous body 8a of a conductor with a force that does not cut the base material on the continuous body 1a of a single blade. It is possible to use a half-cut type that pushes down and a slitter type that crosses a rotating circular blade and cuts the conductor continuous body 8a.

  It should be noted that the conductors formed in a sheet form from the beginning are stacked, and the conductors 8 are supplied one by one on the base material continuous body 1a from a pile of the sheet conductors 8 by a sucker or the like. May be. Moreover, you may make it supply on the continuous body 1a of a base material with the continuous form, without cut | disconnecting what was drawn out from the winding roll 8b.

  Thus, the continuous body 1a of the base material on which the sheet-like conductors 8 are stacked with the thermoplastic adhesive layer 9 on the lower side is intermittently conveyed to the downstream side by driving the intermittent feeding roller 13. .

(II) Temporary Bonding Step As shown in FIG. 11, the temporary bonding flat press disk 10 is disposed on the downstream side of the cutting machine 17 when viewed in the traveling direction of the continuous body 1 a of the base material 1. The temporary bonding flat press disk 10 includes an upper mold 10a and a lower mold 10b, and faces the substrate continuous body 1a to which the sheet-like conductors 8 are attached in the vertical direction.

  As shown in FIG. 11 (II), the upper mold 10a is provided with a large number of elongated protrusions 18 corresponding to one circuit pattern as temporary bonding means. An electric heating wire (not shown) for heating the protrusion 18 is embedded in the upper mold 10a. More specifically, as shown in FIG. 13, a predetermined interval is set so that a large number of protrusions 18 can be accommodated in the conductor 2a corresponding to the antenna pattern and in the conductor 2b corresponding to the one electrode pattern of the capacitor. The upper mold 10a is formed by arrangement.

  The lower mold 10b is formed with a flat surface for receiving a large number of protrusions 18. Between the lower mold 10b and the upper mold 10a, the overlapped portion of the sheet-like conductor 8 and the continuous body 1a of the substrate 1 enters.

  As shown in FIG. 11 (II), an intermittent feed roller 13 is arranged so as to sandwich the temporary press flat press 10 from the upstream side and the downstream side, and the print image 3 on each cover of the substrate 1 is captured. The camera 15 is disposed upstream of the temporary bonding flat press disk 10.

  The rotation of the intermittent feed roller 13 is controlled based on the position information of the cover detected from the image taken by the camera 15, whereby one cover on the continuous body 1 a of the base 1 is accurately placed between the upper and lower molds 10 a and 10 b. Pause while positioned.

  Therefore, the upper die 10a of the temporary bonding flat press board 10 reciprocates in the vertical direction, and the protrusion 18 of the upper die 10a heats and presses the sheet-like conductor 8 on the continuous body 1a of the base material 1. As a result, as shown in FIG. 12 (II), the thermoplastic adhesive layer 9 of the conductor 8 is melted in the form of dots at a plurality of locations in the pattern, and the conductor 8 is temporarily bonded to the continuous body 1a of the substrate 1. Is done. The shape of temporary bonding by the individual protrusions 18 is circular in the illustrated example, but may be other shapes such as a quadrangle.

  The continuous body 1a of the base material 1 to which the sheet-like conductor 8 is temporarily bonded travels in one direction when all the intermittent feed rollers 13 are driven, whereby the temporarily bonded conductor 8 is next punched. It is conveyed to the flat press board 11 for use.

(III) Punching Step As shown in FIG. 11 (III), a punching flat press platen 11 is disposed downstream of the temporary bonding flat press platen 10 as viewed in the traveling direction of the continuous body 1a of the base material 1. Is done.

  The punching flat press machine 11 includes an upper die 11a and a lower die 11b, and the sheet-like conductor 8 temporarily bonded to the continuous body 1a of the base material 1 by the temporary bonding flat press disk 10 is connected to the base material 1 continuously. Face with the body 1a.

  As shown in FIG. 11 (III), a punching blade 19 corresponding to a circuit pattern such as an antenna is fixed to the upper mold 11a, and a flat surface for receiving the punching blade 19 is formed on the lower mold 11b. The flat surface of the lower mold 11b is formed of a sheet such as PET.

  As shown in FIG. 11 (III), an intermittent feed roller 13 is arranged so as to sandwich the punching flat press disk 11 from the upstream side and the downstream side, and a printed image of each cover on the continuous body 1a of the substrate 1 Is arranged upstream of the punching flat press platen 11.

  The rotation of the intermittent feed roller 13 is controlled based on the position information of the cover detected from the image taken by the camera 15, whereby one cover on the continuous body 1 a of the substrate 1 is accurately positioned between the upper and lower molds 11 a and 11 b. The continuous body 1a of the base material 1 is temporarily stopped in a state where the positioning is performed.

  Therefore, the upper die 11a of the punching flat press platen 11 reciprocates in the vertical direction, and the punching blade 19 of the upper die 11a includes a pattern of an antenna or the like on the continuous body 1a of the base material 1 with the single-wafer-like conductor 8. Punched into a circuit pattern.

  At this time, since the conductor 8 is temporarily bonded onto the continuous body 1a of the base material 1, as shown in FIG. 12 (III), it is punched into an accurate circuit pattern without causing a positional shift.

  Further, since the sheet-like conductor 8 is temporarily bonded and restrained on the continuous body 1a of the base material 1, the conductor 8 is raised when the upper mold 11a is raised even if the punching blade 19 protrudes greatly toward the lower mold 11b. Is not pulled away from the continuous body 1a of the base material 1 by being dragged by the upper mold 11a. For this reason, it becomes possible to perform the punching of the conductor 8 accurately by making the protrusion amount of the punching blade 19 relatively large, and at the same time, the fineness of the punching blade 19 for preventing the dragging of the conductor 8 as in the prior art. No adjustment is required, and the production of the circuit pattern can be started quickly.

  After the sheet-like conductor 8 is punched into a predetermined circuit pattern, the continuous body 1a of the substrate 1 travels in one direction by driving all the intermittent intermittent feed rollers 13, and the circuit pattern after punching is formed. The conductor 2 is conveyed to the next flat pressing plate 12 for bonding.

(IV) Adhesion Step As shown in FIG. 11 (IV), an adhesion flat press machine 12 is disposed downstream of the punching flat press machine 11 as viewed in the running direction of the continuous body 1a of the substrate 1. The The bonding flat press 12 includes an upper mold 12a and a lower mold 12b, and a sheet-like conductor 8 temporarily bonded to the continuous body 1a of the substrate 1 and punched into a predetermined circuit pattern is formed by these upper and lower molds 12a and 12b. Then, the continuum 1a of the substrate 1 is sandwiched between and opposed to each other.

  As shown in FIG. 11 (IV), the upper mold 12a is provided with a convex portion 20 corresponding to the circuit pattern as an adhesive means. An electric heating wire (not shown) for heating the convex portion 20 is embedded in the upper mold 12a.

  As shown in FIG. 15, the heating projection 20 of the upper mold 12a for carrying out this bonding step is formed in a shape slightly reduced from the circuit pattern. This makes it difficult for the thermoplastic adhesive layer 9 below the contour of the circuit pattern to melt, and prevents the unnecessary portion 2z of the conductor 8 from adhering to the continuous body 1a of the base material 1. Removal of the unnecessary portion 2z of the conductor 8 is simplified.

  The lower mold 12b is formed with a flat surface that receives the heating projection 20 of the upper mold 12a. The conductor 8 enters between the lower mold 12b and the upper mold 12a in a state where the conductor 8 overlaps the continuous body 1a of the substrate 1.

  As shown in FIG. 11 (IV), an intermittent feed roller 13 is arranged so as to sandwich the flat press disk 12 for bonding from the upstream side and the downstream side, and the print image 3 on each cover of the substrate 1 is captured. A camera 15 is disposed on the upstream side of the bonding flat press 12.

  The rotation of the intermittent feed roller 13 is controlled based on the position information of the cover detected from the image taken by the camera 15, whereby one cover on the continuous body 1 a of the base material 1 is accurately positioned between the upper and lower molds 12 a and 12 b. Pause in the positioned state.

  Therefore, the upper die 12a of the flat press board 12 reciprocates in the vertical direction, and the conductor 2 punched out in the circuit pattern in the sheet-like conductor 8 is pressed onto the continuous body 1a of the substrate 1 while being heated. . As a result, the thermoplastic adhesive layer 9 corresponding to the circuit pattern on the lower surface of the conductor 2 is melted, and the conductor 2 of the circuit pattern is bonded onto the continuous body 1a of the substrate 1 as shown in FIG. The

  In this bonding process, since the necessary portion that is the conductor 2 of the circuit pattern is temporarily bonded to the continuum 1a of the substrate 1, the conductor 2 of the circuit pattern is accurately bonded to the continuum 1a of the substrate 1. The occurrence of displacement, wrinkles, and breakage of the conductor 2 is prevented. In addition, air can be prevented from being sealed between the conductor 2 and the continuous body 1a of the base material 1 in the bonding step.

  The continuum 1a of the base material 1 on which the conductor 2 on which the bonding process and the punching process are completed is wound up and stored in a continuous state or sent to the next separation process.

(V) Separation process As shown in FIG. 7, as compared to the flat press disk 12 for bonding as viewed in the direction in which the continuous body 1 a of the base material 1 on which the conductor 2 on which the bonding process and the punching process have been carried travels travels. A guide roller 21 is provided on the downstream side, and the continuous body 1 a of the base material 1 is sent to the separation device through the guide roller 21.

  The separation device includes a suction tube 22 and a separation roller 23. When the continuous body 1a of the base material 1 arrives at the place where the suction tube 22 and the separation roller 23 are installed, the unnecessary portion 2z of the conductor 8 is sucked by the suction pipe 22, while the continuous body 1a of the base material 1 is attracted to the separation roller 23. Travels in reverse while being guided. Thereby, the unnecessary part 2z of the conductor 8 is appropriately peeled off from the continuous body 1a of the base material 1 and is recovered in a recovery box (not shown) to which the suction pipe 22 is connected. When the antenna pattern in the circuit pattern is spiral, the unnecessary portion 2z of the conductor 8 is also generated in a spiral shape, but when sucked by the suction tube 22 in this way, the spiral unnecessary portion 2z is smoothly recovered. be able to.

  A nozzle 24 for ejecting a gas such as air is disposed at a place where the unnecessary portion 2z of the conductor 8 is separated from the continuous body 1a of the base material 1 as necessary. The gas ejected from the nozzle 24 is blown toward the boundary between the continuum 1a of the substrate 1 and the unnecessary portion 2z of the conductor 8, thereby promoting the peeling and removal of the unnecessary portion 2z of the conductor 8. The FIG. 12 (V) shows a state in which the unnecessary portion 2z is removed and only the conductor 2 of the circuit pattern remains on the continuous body 1a of the substrate 1.

  Thereafter, the continuum 1a of the base material 1 is supplied to an apparatus similar to the apparatus shown in FIGS. 11 and 7, and another sheet-like conductor similar to the conductor 8 is superimposed on the back side. A conductor 5 having a circuit pattern including the bridge pattern shown in FIG. 2 is formed.

  For the formation of the conductor 5 on the back side, the above temporary bonding can be performed. In this case, the upper mold 26 provided with the projections 25 having the arrangement and shape as shown in FIG. 14 can be used. The upper die 26 is attached to a flat press plate similar to the above-described temporary press flat plate. As a result, the conductor 5a corresponding to the bridge pattern and the conductor 5b corresponding to the capacitor electrode pattern are temporarily bonded onto the continuous body 1a of the substrate 1, respectively.

  Further, in the bonding process, as shown in FIG. 16, an upper mold 28 can be used in which the convex portion 27 is a heating convex portion having a shape slightly reduced from the pattern such as the bridge. This upper die 28 is attached to a flat press machine similar to the above-described flat press machine 12 for bonding. Thereby, the conductor 5a corresponding to the bridge pattern and the conductor 5b corresponding to the electrode pattern of the capacitor are respectively bonded onto the continuous body 1a of the substrate 1.

  Thereafter, the continuous body 1a of the base material 1 is subjected to a peeling step to remove unnecessary portions from the sheet-like conductor, and the conductors 2 and 5 on the front and back sides of the base material 1 as shown in FIG. Is attached to the process of bonding the IC chip 7 or the like, or is attached to the mounting process of the IC chip 7.

  Finally, the base material 1 of the cover is cut from the continuum 1a of the base 1 on the partition line 29 shown in FIG. 12, and this cover is sent to the bookbinding process.

<Embodiment 3>
In the third embodiment, the temporary adhesion of the sheet-like conductor 8 shown in FIG. 11 (II) is performed by melting the thermoplastic adhesive layer 6 linearly at a plurality of locations in the pattern.

  As shown in FIG. 17, a ridge 30 is formed on the upper mold 10 a used for the temporary press flat press for forming the circuit pattern on the front side, instead of the protrusion 18 in the first embodiment. Further, as shown in FIG. 18, protrusions 31 are formed in place of the protrusions 25 on the upper die 26 used in the temporary press flat press for forming the circuit pattern on the back side.

  As shown in the figure, depending on the location of the circuit pattern, it is also possible to provide the protrusions 25 on the upper molds 10a and 26 and add point-like temporary adhesion as in the case of the second embodiment.

  Thus, temporary adhesion of the sheet-like conductor 8 is more accurately performed by performing the temporary adhesion linearly.

  Adhesion of the sheet-like conductor 8 to the base material 1 can be performed by the protrusions 20 and 27 shown in FIGS. 15 and 16.

  In addition, in FIG.17 and FIG.18, the same part as the case of Embodiment 2 is shown using the same code | symbol, and the overlapping description is abbreviate | omitted.

<Embodiment 4>
In the fourth embodiment, in addition to temporary bonding within the circuit pattern, temporary bonding is also performed outside the circuit pattern.

  That is, the upper mold 10a shown in FIG. 19 is used in place of the upper mold 10a of the temporary bonding flat press panel 10 shown in FIG. In the upper mold 10a, in addition to the protrusion 18 as a temporary adhering means, another protrusion 32 having the same or smaller width or thickness as the protrusion 18 has a pattern outline inside and outside the pattern of the antenna or the like. A large number are provided so as to correspond to the unnecessary portion 2z of the sheet-like conductor 8.

  Further, as shown in FIG. 20, the upper die 26 of the temporary bonding flat press 10 for forming the circuit pattern on the back side has the same or smaller width as the protrusion 25 in addition to the protrusion 25 as a temporary bonding means. Alternatively, many other protrusions 33 having a thickness are provided corresponding to the unnecessary portions 2z of the sheet-like conductor 8 so as to follow the outline of the pattern outside the pattern of one electrode of the capacitor.

  In FIG. 11, when the continuous body 1a of the base material 1 is sent to the downstream side and temporarily stopped, the upper die 10a shown in FIG. The unnecessary portion 2z inside and outside the circuit pattern of the sheet-like conductor 8 is heated and pressed on the substrate 1. As a result, the thermoplastic adhesive layer 9 on the back surface of the sheet-like conductor 8 is melted in the form of dots at a plurality of locations inside and outside the circuit pattern, and the necessary portion and the unnecessary portion 2z of the sheet-like conductor 8 are respectively attached to the substrate 1. Temporarily bonded.

  The shape of temporary bonding by the individual protrusions 18 and 32 is circular in the illustrated example, but may be other shapes such as a quadrangle.

  In the next punching step, the circuit pattern is punched into the sheet-like conductor 8 by the punching flat press 11 as in the case of the second embodiment. At this time, since the inside of the circuit pattern in the conductor 8 is temporarily bonded onto the continuous body 1a of the base material 1, it is punched into an accurate pattern without causing a positional shift. Further, since the outside of the circuit pattern in the sheet-like conductor 8 is also temporarily bonded onto the continuum 1a of the base material 1, the unnecessary portion 2z of the conductor 8 is also the punching blade when the punching blade 19 is separated from the base material 1. It remains on the substrate 1 against 19 separation forces. Accordingly, when the pattern is punched, the pattern is not broken and the unnecessary portion 2z is not accumulated in the punching blade 19. In addition, an accident that the unnecessary portion 2z adheres to the pattern in the next bonding step is prevented.

  Then, the continuous body 1a of the base material 1 is sent to the formation process of the bridge pattern etc. shown in FIG. 3 through the adhesion process of FIG. 11 (IV). The bridge pattern and the like are formed on the back side of the continuous body 1a of the base material 1. In this case, an upper die 26 shown in FIG. 16 is used as a flat press plate corresponding to the temporary press flat plate 10. As a result, the conductor 5a corresponding to the bridge pattern and the conductor 5b corresponding to the capacitor electrode pattern are temporarily bonded onto the substrate 1 inside and outside the pattern, respectively.

  In addition, in FIG.19 and FIG.20, the same part as the case of Embodiment 1 is shown using the same code | symbol, and the overlapping description is abbreviate | omitted.

<Embodiment 5>
As shown in FIGS. 21 and 22, in the fifth embodiment, the temporary adhesion of the sheet-like conductor 8 melts the thermoplastic adhesive layer 9 linearly at a plurality of locations inside and outside the circuit pattern. Is done. 21 and 22, reference numerals 30 and 31 denote protrusions formed on the upper molds as the in-pattern temporary bonding means, and reference numerals 34 and 35 are formed on the upper molds 10a and 26 as the out-of-pattern temporary bonding means. Shows the ridge.

  As shown in the figure, depending on the location of the pattern, it is also possible to provide the protrusions 18 and 25 on the upper molds 10a and 26 as in the case of the second embodiment, and add a spot-like temporary bond.

  Thus, temporary adhesion of the sheet-like conductor 8 is more accurately performed by performing the temporary adhesion linearly.

  In addition, in FIG.21 and FIG.22, the same part as the case of Embodiment 2 is shown using the same code | symbol, and the overlapping description is abbreviate | omitted.

  The present invention is not limited to the various embodiments described above, and various modifications can be made within the scope of the gist of the present invention. For example, in the above embodiment, the object on which the non-contact type data carrier conductive member is formed is the cover of a book, but the present invention can also be applied to a package blank or the like. In addition, although the conductor is supplied as a single sheet on the substrate, it is also possible to supply a continuous conductor as a substrate.

1 is an external view of a cover of a book provided with a non-contact data carrier conductive member manufactured by the method and apparatus according to the present invention. It is the elements on larger scale of the outer surface of a cover in FIG. It is the elements on larger scale of the inner surface of a cover. It is a surface view of the electroconductive member for non-contact type data carriers which mounted IC chip. (A) is a cross-sectional view taken along the line VA-VA in FIG. 2, and (B) is a cross-sectional view taken along the line VB-VB in FIG. It is a schematic front view which shows the first half part of the apparatus for forming the circuit pattern which is a conductive member for non-contact type data carriers shown in FIG. It is a schematic front view which shows the second half part of the apparatus for forming the circuit pattern which is a conductive member for non-contact type data carriers shown in FIG. It is a top view showing each process shown in FIG.6 and FIG.7. It is a top view of the upper mold | type used with the flat press disk for adhesion | attachment, when forming a circuit pattern in the outer surface of a base material. It is a top view of the upper mold | type used with the flat press board for adhesion | attachment, when forming a circuit pattern in the inner surface of a base material. It is a schematic front view which shows the first half part of the apparatus which concerns on Embodiment 2 of this invention. It is a schematic plan view showing the process performed by the first half part and second half part of the apparatus which concerns on Embodiment 2 of this invention. It is a top view of the upper mold | type used with the flat press disk for temporary bonding, when forming a circuit pattern in the outer surface of a base material. It is a top view of the upper mold | type used with the flat press disk for temporary bonding, when forming a circuit pattern in the inner surface of a base material. It is a top view of the upper mold | type used with the flat press disk for adhesion | attachment, when forming a circuit pattern in the outer surface of a base material in the method which concerns on Embodiment 2 of this invention. It is a top view of the upper mold | type used with the flat press disk for adhesion | attachment, when forming a circuit pattern in the inner surface of a base material in the method which concerns on Embodiment 2 of this invention. It is a top view of the upper mold | type used with the flat press disk for temporary bonding, when forming a circuit pattern in the outer surface of a base material in the method which concerns on Embodiment 3 of this invention. It is a top view of the upper mold | type used with the flat press disk for temporary bonding, when forming a circuit pattern in the inner surface of a base material in the method which concerns on Embodiment 3 of this invention. It is a top view of the upper mold | type used with the flat press disk for temporary bonding, when forming a circuit pattern in the outer surface of a base material in the method which concerns on Embodiment 4 of this invention. It is a top view of the upper mold | type used with the flat press disk for temporary bonding, when forming a circuit pattern in the inner surface of a base material in the method which concerns on Embodiment 4 of this invention. It is a top view of the upper mold | type used with the flat press disk for temporary bonding, when forming a circuit pattern in the outer surface of a base material in the method which concerns on Embodiment 5 of this invention. It is a top view of the upper mold | type used with the flat press disk for temporary bonding, when forming a circuit pattern in the inner surface of a base material in the method which concerns on Embodiment 5 of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1a ... Continuous nonelectroconductive base material 2z ... Unnecessary part of conductor 8 ... Sheet-fed conductor 8a ... Continuous body conductor 9 ... Thermoplastic adhesive layer 10 ... Flat press board 11 for temporary bonding 11 ... For punching Flat press machine 12, 36 ... Flat press machine for bonding 17 ... Cutting machine 18, 32 ... Projection 20 ... Heating convex part 22 ... Suction tube 23 ... Separation roller 24 ... Nozzle 30, 34 ... Projection

Claims (20)

  The conductor is superposed on the substrate so that a non-conductive thermoplastic adhesive layer formed in advance on either surface of the conductor and the continuous non-conductive substrate is sandwiched therebetween. The base material is intermittently run in one direction, the thermoplastic adhesive layer is melted in a reduced area of a predetermined circuit pattern, and an adhesive step for adhering the conductor to the base material is performed by an adhesive flat press disk. A method of forming a conductive member for a non-contact type data carrier, wherein the punching step of punching the conductor into the circuit pattern is performed by a punching flat press disk disposed downstream of the bonding flat press disk. .   The conductor is superposed on the substrate so that a non-conductive thermoplastic adhesive layer formed in advance on either surface of the conductor and the continuous non-conductive substrate is sandwiched therebetween. The material is intermittently run in one direction, and a temporary bonding step for temporarily bonding the conductor to the base material by melting only a part of the thermoplastic adhesive layer is performed by a flat press disk for temporary bonding. A punching step of punching the conductor into a predetermined circuit pattern is performed by a punching flat press disk disposed downstream of the temporary bonding flat press disk, and the conductor is heated and bonded to the substrate with the circuit pattern. A method for forming a non-contact type data carrier conductive member, wherein the bonding step is performed by a bonding flat press plate disposed downstream of the punching flat press plate.   3. The method for forming a conductive member for a non-contact data carrier according to claim 1 or 2, wherein the conductor and the base material are adhered to the base material at predetermined intervals. A method of forming a conductive member for a non-contact type data carrier, characterized in that the superposition is performed.   3. The method for forming a conductive member for a non-contact type data carrier according to claim 1 or 2, wherein the conductor is supplied onto the base material by cutting the continuous conductor into sheets at a predetermined interval. A method of forming a conductive member for a non-contact type data carrier, which is performed while   3. The method for forming a conductive member for a non-contact type data carrier according to claim 2, wherein the temporary adhesion is performed by melting the thermoplastic adhesive layer in a reduced area of a predetermined circuit pattern, or the thermoplastic adhesion. A method for forming a conductive member for a non-contact data carrier, wherein the agent layer is melted in a dotted or linear manner at a plurality of locations in the circuit pattern.   The method for forming a conductive member for a non-contact type data carrier according to claim 1 or 2, further comprising a separation step of separating an unnecessary portion of the conductor from the base material. A method for forming a conductive member for a carrier.   2. The non-contact type data carrier conductive member according to claim 1, wherein the bonding step is performed by a heating convex portion having a shape obtained by slightly reducing the circuit pattern. Forming method.   2. The non-contact type data carrier conductive member according to claim 1, wherein the non-contact type data carrier conductive member is temporarily bonded outside the circuit pattern simultaneously with bonding within the circuit pattern. Forming method.   3. The method for forming a non-contact data carrier conductive member according to claim 2, wherein the temporary adhesion is performed by a heating convex portion having a slightly reduced shape of the circuit pattern. Forming method.   3. The method for forming a conductive member for a non-contact type data carrier according to claim 2, wherein the temporary adhesion outside the circuit pattern is performed simultaneously with the temporary adhesion within the circuit pattern. Member forming method.   The base material is superimposed on the base material so that a non-conductive thermoplastic adhesive layer formed in advance on either surface of the conductive material or the continuous non-conductive base material is sandwiched between the base material and the base material. Intermittent traveling means for intermittently traveling in one direction, an adhesive flat press plate for melting the thermoplastic adhesive layer in a reduced area of a predetermined circuit pattern and bonding the conductor to the substrate, and on the substrate A non-contact type data carrier conductive member forming apparatus, comprising: a punching flat press plate disposed downstream of the bonding flat press plate for punching the conductor into a predetermined circuit pattern.   The base material is superimposed on the base material so that a non-conductive thermoplastic adhesive layer formed in advance on either surface of the conductive material or the continuous non-conductive base material is sandwiched between the base material and the base material. Intermittent running means for intermittent running in one direction, a flat press disk for temporary bonding that temporarily melts only a part of the thermoplastic adhesive layer and temporarily bonds the conductor to the base material, and the above on the base material. A punching flat press disk disposed on the downstream side of the temporary bonding flat press disk for punching the conductor into a predetermined circuit pattern, and the punching flat press for thermally bonding the conductor to the substrate with the circuit pattern. An apparatus for forming a conductive member for a non-contact type data carrier, comprising: a flat press plate for bonding disposed downstream of the plate.   13. The non-contact data carrier conductive member forming apparatus according to claim 11 or 12, wherein the conductor is attached to the base material at a predetermined interval, thereby overlapping the conductor and the base material. An apparatus for forming a conductive member for a non-contact type data carrier, wherein the forming is performed.   13. The non-contact data carrier conductive member forming apparatus according to claim 11 or claim 12, wherein the conductor is supplied onto the base material by cutting the continuous conductor at a predetermined interval by a cutting machine. An apparatus for forming a conductive member for a non-contact type data carrier, which is performed while cutting into leaves.   13. The apparatus for forming a conductive member for a non-contact type data carrier according to claim 12, wherein the flat press disk for temporary bonding dissolves the thermoplastic adhesive layer in a reduced area of the circuit pattern, thereby allowing the conductor to be formed in the circuit pattern. The conductor is temporarily bonded to the substrate by having heating projections that are temporarily bonded to the substrate or by melting the thermoplastic adhesive layer in a dotted or linear manner at a plurality of locations in the circuit pattern. An apparatus for forming a conductive member for a non-contact type data carrier, characterized by having protrusions or protrusions.   13. The non-contact data carrier conductive member forming apparatus according to claim 11 or 12, further comprising separation means for separating unnecessary portions of the conductor from the base material after the conductor is punched out. An apparatus for forming a conductive member for a non-contact type data carrier.   12. The non-contact type data carrier conductive member forming apparatus according to claim 11, wherein the flat pressing plate for bonding includes a heating convex portion having a shape obtained by slightly reducing the circuit pattern. A device for forming a conductive member for a data carrier.   13. The non-contact type data carrier conductive member forming apparatus according to claim 12, wherein the temporary bonding flat press plate includes a heating convex portion having a shape obtained by slightly reducing the circuit pattern. Forming device for conductive member for type data carrier.   12. The non-contact type data carrier conductive member forming apparatus according to claim 11, wherein a protrusion or a protrusion is provided on the bonding flat press plate so as to temporarily bond the conductor to the substrate outside the circuit pattern. An apparatus for forming a conductive member for a non-contact type data carrier.   13. The non-contact type data carrier conductive member forming apparatus according to claim 12, wherein a protrusion or a protrusion is temporarily bonded to the substrate so that the conductor is temporarily bonded to the substrate even outside the circuit pattern. An apparatus for forming a conductive member for a non-contact type data carrier, which is provided in

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