JP4505379B2 - Method for producing cardboard with IC inlet - Google Patents

Description

  The present invention relates to a method for manufacturing a cardboard with an IC inlet, which manufactures a cardboard with an IC inlet in which one IC is provided on the cardboard.

In recent years, for merchandise management and logistics management, a non-contact type IC that can read or write data without contact is sometimes provided in a merchandise or a packaging body that packs the merchandise. As the non-contact type IC, an IC inlet including a circuit element having an IC and an antenna connected to the circuit element is widely used.
Examples of the method of providing the package with the IC inlet include a method of directly attaching the IC inlet to a cardboard box or a paper box. In addition, a method is proposed in which an IC inlet is attached in advance to a tear tape, which is a cardboard box opening tape with an adhesive layer formed on a high-strength base material, and the tear tape is attached to a package. (For example, refer to Patent Document 1).
JP 2003-81344 A

By the way, it is sufficient that one IC is provided for each cardboard, and when a plurality of ICs are provided, waste occurs. However, the method described in Patent Document 1 does not describe a method for providing only one IC on a cardboard, and may provide a plurality of ICs or may not provide one.
In order to install only one IC on the cardboard, a tear tape winding body with an IC inlet pre-attached with an IC inlet at the same interval as the length of the cardboard in the flow direction is manufactured, and from the tear tape winding body It is conceivable that a tear tape with an IC inlet is fed to a corrugated cardboard continuous sheet and adhered. However, since corrugated cardboard has various shapes, in such a method, a tear tape winding body with an IC inlet must be manufactured in accordance with the shape of each corrugated cardboard. Therefore, since there are many types of tiered tape windings with IC inlets, it is not practical.
The present invention has been made in view of the above circumstances, and a method of manufacturing a cardboard with an IC inlet that can manufacture a cardboard with an IC inlet provided with only one IC without using a tear tape winding body with an IC inlet. The purpose is to provide.

A method for producing a cardboard with an IC inlet according to the present invention is a method for producing a cardboard with an IC inlet for producing a cardboard with an IC inlet in which an IC is provided on the cardboard,
IC inlet pasting step of sticking an IC inlet to a tear tape made of an adhesive tape at the same interval as the length of the cardboard in the flow direction to obtain a tear tape with an IC inlet;
A tear tape adhering step of adhering the tear tape with the IC inlet along the flow direction of the cardboard continuous sheet;
Possess a cutting step for cutting the corrugated cardboard continuous sheet of cardboard flow direction length,
In the IC inlet attaching process, the cutting of the corrugated cardboard continuous sheet in the cutting process is detected by a sensor, and the IC inlet is attached to the tear tape at the same interval as the interval at which the cutting is detected .
Alternatively, the method for producing a cardboard with an IC inlet of the present invention is a method for producing a cardboard with an IC inlet for producing a cardboard with an IC inlet in which an IC is provided on the cardboard,
IC inlet pasting step of sticking an IC inlet to a tear tape made of an adhesive tape at the same interval as the length of the cardboard in the flow direction to obtain a tear tape with an IC inlet;
A tear tape adhering step of adhering the tear tape with the IC inlet along the flow direction of the cardboard continuous sheet;
A cutting step of cutting a corrugated cardboard continuous sheet with a length in the cardboard flow direction;
Before the IC inlet attaching process, detection marks are formed in advance on the cardboard continuous sheet at the same interval as the length in the cardboard flow direction,
The IC inlet attaching step, the detection mark is detected by the sensor, characterized by attaching the IC inlets at the same intervals as those for detecting the detection mark a tear tape.

  According to the method for producing a corrugated cardboard with an IC inlet of the present invention, a corrugated cardboard with an IC inlet provided with only one IC can be produced without using a tear tape winding body with an IC inlet.

(First embodiment)
1st Embodiment of the manufacturing method of the cardboard with an IC inlet of this invention is described.
FIG. 1 shows an apparatus for manufacturing a cardboard with an IC inlet used in the method for manufacturing a cardboard with an IC inlet according to this embodiment. This corrugated board manufacturing apparatus 1 with an IC inlet includes a corrugated continuous sheet feeding means 10 for supplying a corrugated cardboard continuous sheet 11a, an IC inlet adhering means 20 for adhering an IC inlet 22a to a tear tape 21, and a tier with an IC inlet. A tear tape crimping means 30 for crimping the tape 26 to the corrugated cardboard continuous sheet 11a, and a cutter 40 for cutting the corrugated cardboard continuous sheet 11a to which the tear tape 26 with the IC inlet is adhered by the length in the flow direction of the corrugated cardboard 100 with the IC inlet; A sensor 50a installed in the vicinity of the cutter 40 for detecting the cutting of the corrugated cardboard continuous sheet 11a by the cutter 40, and a control means 60 for controlling the IC inlet adhering means 20 based on a signal from the sensor 50a. It is configured.

The corrugated cardboard continuous sheet feeding means 10 in the corrugated cardboard manufacturing apparatus 1 with the IC inlet includes a rotational driving roll 12 that rotates and a canvas belt 13 that rotates using the rotational driving roll 12 as a drive source and contacts the corrugated continuous sheet 11a. It comprises.
The IC inlet sticking means 20 is an IC inlet-attached adhesive tape wound by winding an IC inlet-attached adhesive tape 22c (see FIG. 2) in which the IC inlet 22a is attached to the base material 22b via an adhesive. The support 22, the piston 23 that is pressed against the tear tape 21, the support 24 that is provided on the side opposite to the piston 23 side of the tear tape 21, and the base material for the adhesive tape 22 with IC inlet And a substrate take-up roll 25 for taking up 22b. The IC inlet 22a of the adhesive tape 22c with IC inlet has a support portion 22d, an antenna portion 22e formed on the support portion 22d, and an IC 22f connected to the antenna portion 22e (see FIG. 2). . The piston 23 and the substrate winding roll 25 are activated or stopped based on an instruction from the control means 60. Moreover, in the IC inlet sticking means 20, the adhesive tape 22c with an IC inlet is disposed so that the IC inlet 22a is located on the tear tape 21 side.
The tear tape pressing means 30 is a pair of rolls that sandwich the corrugated cardboard continuous sheet 11a and the tear tape 26 with IC inlet.

In the manufacturing method of the corrugated cardboard with IC inlet using the manufacturing apparatus 1, first, the tear tape 26 with IC inlet (or the tear tape 21) is attached to the continuous corrugated cardboard sheet 11 a before the tear tape pressing means 30. Next, the rotary drive roll 12 of the corrugated cardboard continuous sheet feeding means 10 is rotated to rotate the canvas belt 13. Thereby, the corrugated-cardboard continuous sheet 11a which contacts the canvas belt 13 is fed at about 200 to 300 m / min toward the cutter 40. Next, the corrugated cardboard continuous sheet 11a and the tear tape 26 with IC inlet attached to the corrugated cardboard continuous sheet 11a are sandwiched between the tear tape crimping means 30, and these are crimped. Subsequently, by continuously feeding the corrugated cardboard continuous sheet 11a by the corrugated cardboard continuous sheet feeding means 10, the tear tape 26 with the IC inlet fed from the tear tape winding body 21a is aligned along the flow direction of the corrugated cardboard continuous sheet 11a. Apply continuously.
Next, in the cutting step, the continuous corrugated cardboard sheet 11 a to which the IC inlet-attached tier tape 26 is attached is cut by the cutter 40 with the length in the flow direction of the cardboard 100 with the IC inlet. The cardboards 100 with IC inlets obtained by cutting are stacked and temporarily stored, and then sent to a box making process for printing, punching, and assembling.

  In this method of manufacturing the corrugated cardboard 100 with IC inlet, in the IC inlet adhering process, the cutting of the corrugated cardboard continuous sheet 11a in the cutting process is detected by the sensor 50a, and the IC inlet 22a is tiered at the same interval as the cutting is detected. Adhere to 21. Thus, in order to stick the IC inlet 22a to the tear tape 21 at the same interval as the interval at which the cutting of the corrugated cardboard continuous sheet 11a is detected, for example, the following method can be adopted.

First, when the cutting of the corrugated cardboard continuous sheet 11a is detected by the sensor 50a, a detection signal is transmitted from the sensor 50a to the control means 60. Upon receipt of the detection signal from the sensor 50a, the control means 60 issues an instruction to operate the piston 23 and the substrate take-up roll 25 of the IC inlet sticking means 20 immediately or after a certain time, and the IC inlet sticking. Start the process.
In the IC inlet attaching step, first, the piston 23 is moved in the direction of the tear tape 21, and the tip of the piston 23 is pressed against the surface of the adhesive tape 22c with IC inlet on the base material 22b side. Thereby, the IC inlet 22a previously arranged between the piston 23 and the tier tape 21 is pressed against the tier tape 21 fed out from the tier tape winding body 21a. Then, the IC inlet 22a of the adhesive tape 22c with IC inlet is transferred to the tier tape 21 and attached. For example, in the case of the present embodiment, the IC inlet 22a attached at this time is provided on the cardboard 100 with an IC inlet obtained by cutting three times ahead.
Next, the piston 23 is pulled back to separate the adhesive tape 22c with the IC inlet from the tear tape 21, and the substrate 22b of the adhesive tape 22c with the IC inlet is wound up by the substrate take-up roll 25, and the IC inlet on the substrate 22b. 22a is moved between the piston 23 and the tier tape 21 to prepare for the adhering of the next IC inlet 22a.

In the present embodiment, the adhesive force of the adhesive layer of the tier tape 21 is preferably stronger than the adhesive force of the adhesive layer of the adhesive tape 22c with an IC inlet because the IC inlet 22a can be easily transferred to the tier tape 21.
It does not restrict | limit especially as the adhesive which forms the base material 22b of the adhesive tape 22c with an IC inlet, and an adhesive layer, A well-known thing can be used. Further, the shape of the IC inlet 22a is not particularly limited, and may be a rectangular IC inlet or a square IC inlet.
The corrugated cardboard 100 with an IC inlet is not particularly limited, but a corrugated cardboard forming a wrap round type cardboard box is suitable for the present invention.

  In the first embodiment described above, the IC inlet 22a is attached to the tear tape 21 at the same interval as the interval at which cutting of the corrugated cardboard continuous sheet 11a is detected. Therefore, without using the tear tape winding body with the IC inlet, A cardboard 100 with an IC inlet provided with only one IC can be manufactured. That is, the manufacturing method of the present embodiment is a method in which only one IC is provided on the cardboard by using the cutting of the continuous cardboard sheet 11a once per cardboard.

(Second Embodiment)
Next, a second embodiment of the method for producing a cardboard with an IC inlet according to the present invention will be described.
FIG. 3 shows an apparatus for manufacturing a cardboard with an IC inlet used in the method for manufacturing a cardboard with an IC inlet according to this embodiment. This corrugated board manufacturing apparatus 2 with an IC inlet has a corrugated cardboard continuous sheet feeding means 10 for feeding a corrugated cardboard continuous sheet 11b on which a detection mark (not shown) is formed by printing, and an IC inlet 22a is adhered to a tier tape 21. IC inlet sticking means 20 for performing, tear tape pressing means 30 for pressing the tear tape 26 with IC inlet to the corrugated cardboard continuous sheet 11b, and the corrugated cardboard continuous sheet 11b having the IC inlet attached tear tape 26 adhered to the corrugated cardboard with IC inlet A cutter 40 for cutting with a length in the flow direction of 100, a sensor 50b that is disposed between the corrugated continuous sheet feeding means 10 and the tear tape pressing means 30, and detects a detection mark on the corrugated continuous sheet 11b, and a sensor 50b IC inlet sticking based on signal from Is configured by including a control means 60 for controlling the stage 20.
In the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals as those in FIG.

In the second embodiment, the operations in the IC inlet attaching process, the tear tape attaching process, and the cutting process are the same as those in the first embodiment, but in this embodiment, the detection mark of the corrugated cardboard continuous sheet 11a is a sensor. It differs from 1st Embodiment by the point which sticks IC inlet 22a to the tear tape 21 by the same space | interval as the space | interval which detects by 50b and detects the detection mark. In order to attach the IC inlet 22a to the tear tape 21 at the same interval as the detection mark detection interval, for example, the following method can be employed.
First, before the IC inlet adhering step, detection marks are formed on the corrugated cardboard continuous sheet 11b at the same interval as the flow direction of the corrugated cardboard 100 with the IC inlet. Examples of the method for forming the detection mark include a method in which printing is performed in advance on the liner base paper constituting the corrugated cardboard continuous sheet 11b. As a printing method in this case, gravure printing or flexographic printing is preferable. In the cardboard pattern printing, the liner base paper may be printed in advance. In this case, the detection mark can be printed at the same time. The shape of the detection mark is not particularly limited, and a conventionally known mark can be used.

  In the IC inlet sticking step, the detection mark of the continuous cardboard sheet 11a is detected by the sensor 50b, and a detection signal is transmitted from the sensor 50b to the control means 60. Upon receiving the detection signal from the sensor 50b, the control means 60 issues an instruction to operate the piston 23 and the substrate take-up roll 25 of the IC inlet sticking means 20 immediately or after a certain time, and the IC inlet sticking. Start the process.

  In the second embodiment described above, detection marks are formed on the cardboard continuous sheet 11b at the same interval as the length of the cardboard in the flow direction, and at the same intervals as the detection marks of the cardboard continuous sheet 11b are detected by the sensor. The IC inlet 22a is adhered to the tear tape 21. Therefore, it is possible to manufacture the cardboard 100 with an IC inlet provided with only one IC without using the tear tape winding body with the IC inlet.

  Note that the present invention is not limited to the first and second embodiments described above. For example, the IC inlet sticking means is not limited to the IC inlet sticking means 20 described above. For example, the suction nozzle 71 for sucking the IC inlet 71a and the suction nozzle 71 as shown in FIGS. The supporting arm 72, the moving means 73 for moving the tip of the suction nozzle 71 between the IC inlet storage position 73a and the tear tape 21 via the arm 72, and the tear tape 21 on which the IC inlet 71a is placed are sandwiched. IC inlet sticking means 70 including a press roll 74 may be used.

Even when this IC inlet sticking means 70 is used, the cutting or detection mark of the cardboard continuous sheet 11a is detected by the sensor 50a or the sensor 50b, and the IC inlet 22a is stuck on the tear tape 21 at the same interval as the detection interval. Can be worn.
That is, the detection mark of the cardboard continuous sheet 11a is detected by the sensor 50a, or the detection mark is detected by the sensor 50b, and a detection signal is transmitted from the sensor 50a or the sensor 50b to the control means 60. Upon receiving the detection signal, the control means 60 issues an instruction to operate the suction nozzle 71 of the IC inlet sticking means 70 immediately or after a certain time, and starts the IC inlet sticking process.

  In the IC inlet attaching step, first, the IC inlet 71a is sucked by the suction nozzle 71 and pulled up at the IC inlet storage position 73a. Next, the tip of the suction nozzle 71 is moved onto the tear tape 21 by the moving means 73, and the IC inlet 71 a is moved onto the tear tape 21. After the movement, the suction of the suction nozzle 71 is stopped, the IC inlet 71a is dropped from the suction nozzle 71, and the IC inlet 71a is placed on the running tier tape 21. Then, the IC inlet 71a and the tear tape 21 are sandwiched by the press roll 74, and these are crimped to obtain the tear tape 26 with the IC inlet. When this IC inlet sticking means 70 is used, it is necessary to run the tear tape 21 in the horizontal direction only at least at the part where the IC inlet 71a is stuck.

In the first embodiment described above, the IC inlet 22a attached to the tier tape 21 in the IC inlet attaching step is provided in the corrugated cardboard 100 with the IC inlet obtained by cutting three times ahead. The cardboard with IC inlet obtained by cutting four times or more is not limited to three times and may be provided in the cardboard 100 with IC inlet obtained by cutting once or twice. 100 may be provided.
In the second embodiment described above, the sensor 50b is disposed between the corrugated continuous sheet feeding means 10 and the tear tape pressing means 30. However, the sensor 50b is disposed on the upstream side of the corrugated continuous sheet feeding means 10. Alternatively, it may be arranged downstream of the tear tape crimping means 30.

It is a figure which shows typically the manufacturing apparatus of the cardboard with an IC inlet used in 1st Embodiment of the manufacturing method of the cardboard with an IC inlet which concerns on this invention. It is sectional drawing which shows an example of an adhesive tape with an IC inlet. It is a figure which shows typically the manufacturing apparatus of the cardboard with an IC inlet used in 2nd Embodiment of the manufacturing method of the cardboard with an IC inlet which concerns on this invention. It is a top view which shows the other example of an IC inlet sticking means. It is a side view of the IC inlet sticking means of FIG.

Explanation of symbols

11a, 11b Corrugated cardboard continuous sheet, 21 tear tape, 22a IC inlet, 22c Adhesive tape with IC inlet, 26 Tier tape with IC inlet, 100 Corrugated cardboard with IC inlet

Claims (2)

A method for manufacturing a cardboard with an IC inlet for manufacturing a cardboard with an IC inlet, wherein an IC is provided on the cardboard,
IC inlet pasting step of sticking an IC inlet to a tear tape made of an adhesive tape at the same interval as the length of the cardboard in the flow direction to obtain a tear tape with an IC inlet;
A tear tape adhering step of adhering the tear tape with the IC inlet along the flow direction of the cardboard continuous sheet;
Possess a cutting step for cutting the corrugated cardboard continuous sheet of cardboard flow direction length,
In the IC inlet attaching process, the cutting of the continuous cardboard sheet in the cutting process is detected by a sensor, and the IC inlet is attached to the tear tape at the same interval as the interval at which the cutting is detected . Production method. A method for manufacturing a cardboard with an IC inlet for manufacturing a cardboard with an IC inlet, wherein an IC is provided on the cardboard,
IC inlet pasting step of sticking an IC inlet to a tear tape made of an adhesive tape at the same interval as the length of the cardboard in the flow direction to obtain a tear tape with an IC inlet;
A tear tape adhering step of adhering the tear tape with the IC inlet along the flow direction of the cardboard continuous sheet;
Possess a cutting step for cutting the corrugated cardboard continuous sheet of cardboard flow direction length,
Before the IC inlet attaching process, detection marks are formed in advance on the cardboard continuous sheet at the same interval as the length in the cardboard flow direction,
In the IC inlet attaching step, the detection mark is detected by a sensor, and the IC inlet is attached to the tear tape at the same interval as the interval at which the detection mark is detected .

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