JP2005209009A - Japanese paper with ic chip buried therein and its manufacturing method - Google Patents
Japanese paper with ic chip buried therein and its manufacturing method Download PDFInfo
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- JP2005209009A JP2005209009A JP2004015764A JP2004015764A JP2005209009A JP 2005209009 A JP2005209009 A JP 2005209009A JP 2004015764 A JP2004015764 A JP 2004015764A JP 2004015764 A JP2004015764 A JP 2004015764A JP 2005209009 A JP2005209009 A JP 2005209009A
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Abstract
Description
本発明はＩＣチップを埋着した和紙、及び該和紙を製造する方法に関するものである。 The present invention relates to a Japanese paper in which an IC chip is embedded, and a method for manufacturing the Japanese paper.
紙にＩＣチップを埋め込んだものは色々知られている。例えば、特開２００２−２９８１１８号に係る「非接触方式のタグ部材が漉き込まれてなる用紙」は、用紙基材の紙層間に、非接触方式のタグ部材を漉き込まれた状態で内蔵することにより、用紙にタグ部材を貼着又は添付させる為の加工の手間を不要とし、タグ部材が剥ぎ取られたりする危険性を防止することが出来る。 Various types of IC chips embedded in paper are known. For example, “paper with non-contact type tag members interleaved” according to Japanese Patent Laid-Open No. 2002-298118 incorporates a non-contact type tag member interleaved between paper layers of a paper base material. This eliminates the need for processing for attaching or attaching the tag member to the paper, and prevents the tag member from being peeled off.
特開２００２−３２１４７５号に係る「証券」は、印刷可能な素材に証券の内容などを表すデータを記録した記録素子を備えることにより、紙幣や有価証券の内容を目で直接見ることによって確認出来るだけでなく、電子化された情報として容易に取出せるようにしている。 The “securities” according to Japanese Patent Laid-Open No. 2002-321475 can be confirmed by directly viewing the contents of banknotes and securities by providing a recording element that records data representing the contents of the securities on a printable material. As well as making it easy to extract information as electronic information.
特開２００２−３４２７３５号に係る「アンテナ部が漉き込まれている用紙」は、用紙に、導電性物質がアンテナとしての機能を備える状態でパルプ基紙中に漉き込むことにより、用紙の印刷デザインをアンテナパターンで阻害されることなく、製造工程が少なくて済むアンテナ部が漉き込まれている用紙である。
このように、ＩＣチップを埋め込んだ紙は色々と知られている。しかし、紙を製造する工程において該ＩＣチップをどのように埋め込むかが課題であり、埋め込み工程中にＩＣチップが損傷して機能しないようでは問題となる。そこで、本発明はこのような問題が起きないように、そして簡単な工程で、ＩＣチップを安く埋め込むことが出来る高品質の和紙、及びＩＣチップの埋め込んだ和紙を作る製造方法を提供する。 As described above, various types of paper in which an IC chip is embedded are known. However, how to embed the IC chip in the paper manufacturing process is a problem, and it becomes a problem if the IC chip is damaged and does not function during the embedding process. Therefore, the present invention provides a high-quality Japanese paper that can embed an IC chip at a low cost and a manufacturing method for producing a Japanese paper with an embedded IC chip so that such problems do not occur and in a simple process.
本発明はＩＣチップを埋め込んだ和紙の製造方法であり、埋め込み工程中にＩＣチップが損傷しないように、又ＩＣチップを埋め込んだ箇所の和紙の厚みが大きくならないように構成している。そこで、和紙はベース紙とカバー紙の２層で構成され、ベース紙にＩＣチップを貼着した状態でカバー紙が貼り合わされる。 The present invention is a method for manufacturing Japanese paper with an IC chip embedded therein, and is configured so that the IC chip is not damaged during the embedding process, and the thickness of the Japanese paper at the portion where the IC chip is embedded is not increased. Therefore, Japanese paper is composed of two layers of base paper and cover paper, and the cover paper is bonded to the base paper with an IC chip attached.
ところで、ベース紙には厚さを薄くしてＩＣチップが埋め込まれる溝空間が形成され、この溝空間の底に接着剤が塗布されてＩＣチップが貼着される。厚さを薄くした部位は、和紙製造装置の一部であるシリンダーの網目から紙料が流れ出難いようにシールを施すことで作ることが可能である。これは、和紙に透かし模様を作る場合と同じであるが、本発明ではこの技術を利用してＩＣチップを埋め込み、この部位が厚くならないようにしている。 By the way, a groove space in which the IC chip is embedded with a reduced thickness is formed in the base paper, and an adhesive is applied to the bottom of the groove space to attach the IC chip. The thinned portion can be made by applying a seal so that the stock does not easily flow out from the mesh of a cylinder that is a part of the Japanese paper manufacturing apparatus. This is the same as the case of making a watermark pattern on Japanese paper, but in the present invention, this technique is used to embed an IC chip so that this portion does not become thick.
製造工程では、上記ベース紙に設けている厚さの薄い部位を検出し、この部位に接着剤が塗布される。そして、リール巻きされているＩＣチップを引き出すと共に裁断し、各ＩＣチップは接着剤にて接着された状態でベース紙は巻き取られる。その後、別のカバー紙と接着剤にて貼り合わされて、ＩＣチップが埋め込まれた和紙が出来上がる。 In the manufacturing process, a thin part provided on the base paper is detected, and an adhesive is applied to this part. Then, the reel-wound IC chip is pulled out and cut, and the base paper is wound up with each IC chip bonded with an adhesive. After that, it is pasted with another cover paper with an adhesive, and a Japanese paper with an IC chip embedded therein is completed.
本発明が対象とする和紙はＩＣチップを埋着したものであり、和紙と一体化されている為に、ＩＣチップは簡単に剥ぎ取られることはない。そして、ベース紙に厚さを薄くした空間を作り、この空間にＩＣチップが接着された状態でカバー紙が貼り合わされる。厚さを薄くして作った溝空間にＩＣチップが嵌められてカバー紙が貼り合わされることから、出来上がった和紙の厚さは一定となる。そして、和紙製造工程中にＩＣチップが損傷するような環境下におくことはなく、品質の高い和紙が出来上がる。 The Japanese paper targeted by the present invention is an IC chip embedded therein, and since it is integrated with the Japanese paper, the IC chip is not easily peeled off. Then, a space with a reduced thickness is formed in the base paper, and the cover paper is bonded to the space with the IC chip bonded thereto. Since the IC chip is fitted in the groove space formed with a reduced thickness and the cover paper is bonded together, the thickness of the finished Japanese paper is constant. And it is not left in the environment where an IC chip is damaged during a Japanese paper manufacturing process, and high quality Japanese paper is completed.
図１は本発明に係る和紙の製造方法の一部を具体化したＩＣチップの接着装置を表している。同図の１は巻き出しリール、２は巻き取りリール、３，４は張力機構、５は接着剤を塗布するノズル、６はＩＣチップリール、７はＩＣチップの裁断機を夫々表している。 FIG. 1 shows an IC chip bonding apparatus embodying a part of the method for producing Japanese paper according to the present invention. In the figure, reference numeral 1 denotes an unwinding reel, 2 is a take-up reel, 3 and 4 are tension mechanisms, 5 is a nozzle for applying an adhesive, 6 is an IC chip reel, and 7 is an IC chip cutter.
ベース紙８は巻き出しリール１から巻き戻され、巻き取りリール２に巻き取られるが、巻き出しリール１と巻き取りリール２間には張力機構３，４が設けられて、ベース紙８がダブ付くことなく一定の張力が付勢されている。特に両張力機構３，４間のベース紙８は一定の張力と成っていて、接着剤が塗布され、裁断されたＩＣチップが接着され、しかも巻き取りリール２に巻き付くベース紙８も一定の張力が付勢されている状態で巻かれる。 The base paper 8 is rewound from the take-up reel 1 and taken up by the take-up reel 2. However, tension mechanisms 3 and 4 are provided between the take-up reel 1 and the take-up reel 2, so that the base paper 8 is doubled. A constant tension is applied without sticking. In particular, the base paper 8 between the tension mechanisms 3 and 4 has a constant tension, the adhesive is applied, the cut IC chip is adhered, and the base paper 8 wound around the take-up reel 2 is also constant. It is wound with tension applied.
ここで、ベース紙８には厚さが薄く成っている部位が形成され、この部位に接着剤が塗布されると共にＩＣチップリール６から巻き戻されて裁断されたＩＣチップが接着される。和紙を製造する工程において、細かい網目を有すシリンダーの外表面に網目を通過した紙料が付着して和紙となるが、この網目シリンダーの適当な箇所にシールを貼り付けて紙料の通過を抑制することで部分的に厚さが薄くなった和紙が出来上がる。 Here, a portion having a small thickness is formed on the base paper 8, and an adhesive is applied to the portion, and an IC chip that has been unwound from the IC chip reel 6 and cut is adhered. In the process of manufacturing Japanese paper, the paper material that has passed through the mesh adheres to the outer surface of the cylinder with a fine mesh, resulting in a Japanese paper. By suppressing it, Japanese paper with a partially reduced thickness is produced.
上記巻き出しリール１にはこのベース紙８がロール巻きされている。張力機構３はダンサロール９を備えている為に、駆動ロール１１とロール１２間のベース紙８はダブ付くことがないように一定の張力が付勢され、駆動ロール１１が回転することでベース紙８は移動するが、接着剤を塗布する際には停止し、又ＩＣチップ１３をベース紙８の溝空間に落として接着する際にも停止する。このように、ベース紙８が停止してもダンサロール９が降下することで、一定の張力は付勢された状態にある。 The base paper 8 is rolled around the unwinding reel 1. Since the tension mechanism 3 includes the dancer roll 9, the base paper 8 between the drive roll 11 and the roll 12 is energized with a certain tension so that the base paper 8 does not become dubbed. The paper 8 moves, but stops when the adhesive is applied, and also stops when the IC chip 13 is dropped into the groove space of the base paper 8 and bonded. Thus, even when the base paper 8 is stopped, the dancer roll 9 is lowered so that a certain tension is applied.
図２は５本のノズル５ａ，５ｂ・・にてベース紙８に接着剤を塗布する場合を示している。別の箇所にホットメルトタンク１４を備え、該ホットメルトタンク１４とはチューブ１５ａ，１５ｂ・・にて連結し、これらチューブ１５ａ，１５ｂ・・を介してホットメルトタンク１４内の接着剤が各ノズル５ａ，５ｂ・・から流れ出してベース紙８に塗布される。 FIG. 2 shows a case where an adhesive is applied to the base paper 8 with five nozzles 5a, 5b,. A hot melt tank 14 is provided at another location, and is connected to the hot melt tank 14 by tubes 15a, 15b,... 5a, 5b,... And applied to the base paper 8.
塗布される場合には、上記駆動ロール１１の回転が止まってベース紙８の移動も停止する。この状態で各ノズル５ａ，５ｂ・・は所定の距離だけ移動し、接着剤を塗布することが出来る。接着剤が塗布される箇所は厚さを薄くした溝空間であって、該溝空間はセンサーにて検出される。ここで、該ノズル５ａ，５ｂ・・の移動速度は限定しないが、約３０ｍ／分とし、移動距離が５０ｍｍとすれば、瞬間的に塗布することが可能となる。 In the case of application, the rotation of the drive roll 11 stops and the movement of the base paper 8 also stops. In this state, the nozzles 5a, 5b,... Can move by a predetermined distance to apply an adhesive. The location where the adhesive is applied is a groove space with a reduced thickness, and the groove space is detected by a sensor. Here, the moving speed of the nozzles 5a, 5b,... Is not limited, but if it is about 30 m / min and the moving distance is 50 mm, it is possible to apply instantaneously.
そして、接着剤が所定の溝空間の底に塗布されたベース紙８は、駆動ロール１１の回転にて移動を開始し、図１におけるＩＣチップ１３が切り落とされる箇所で再び停止する。ＩＣチップリール６から所定の長さ分が巻き戻されたところで裁断機７が作動してカッター１６が降下して裁断される。裁断されたＩＣチップ１３は落下して溝空間に落下し、塗布されている接着剤にて接着される。本発明では、裁断機の具体的な構造は限定せず、接着剤を塗布するノズル構造も自由である。 Then, the base paper 8 on which the adhesive is applied to the bottom of the predetermined groove space starts to move by the rotation of the drive roll 11 and stops again at the place where the IC chip 13 in FIG. 1 is cut off. When a predetermined length has been rewound from the IC chip reel 6, the cutting machine 7 is operated and the cutter 16 is lowered and cut. The cut IC chip 13 falls and falls into the groove space, and is bonded with the applied adhesive. In this invention, the specific structure of a cutting machine is not limited, The nozzle structure which apply | coats an adhesive agent is also free.
ここで、ＩＣチップリール６も６箇所に設けられ、裁断機７の作動で各ＩＣチップ１３，１３・・が裁断されて落下し、ベース紙８に接着され、そして巻き取りリール２に巻き取られる。巻き取りリール２に巻き取られる場合も、弛まないように張力機構４が備わっている。すなわち、ダンサロール１０が巻き取りリール２の回転に応じて昇降動し、常に一定の張力が付勢された状態で巻き取られる。 Here, IC chip reels 6 are also provided at six locations, and the IC chips 13, 13,... Are cut and dropped by the operation of the cutting machine 7, are bonded to the base paper 8, and are wound on the take-up reel 2. It is done. The tension mechanism 4 is provided so as not to loosen even when wound on the take-up reel 2. That is, the dancer roll 10 moves up and down according to the rotation of the take-up reel 2 and is always taken up in a state where a certain tension is applied.
そして、巻き取りリール２に巻き取られたベース紙８は別工程にて巻き戻され、カバー紙と張り合わされてＩＣチップを埋め込んだ和紙が出来上がる。図３は本発明に係る和紙製造方法を表す主な工程であり、
(ａ)はベース紙８の表面に溝空間１７が形成されている場合であり、この溝空間１７は和紙製造装置のシリンダーにて作られる。
(ｂ)は溝空間１７にノズル５によって接着剤１８が塗布された場合である。
(ｃ)は溝空間１８にＩＣチップ１３を収容して接着した場合である。
(ｄ)はカバー紙１９を貼り合わせてＩＣチップを埋め込み、所定の和紙が製作された場合である。
Then, the base paper 8 taken up by the take-up reel 2 is rewound in a separate process, and is pasted with a cover paper to complete a Japanese paper in which an IC chip is embedded. FIG. 3 is a main process showing the Japanese paper manufacturing method according to the present invention,
(a) is a case where a groove space 17 is formed on the surface of the base paper 8, and this groove space 17 is made by a cylinder of a Japanese paper manufacturing apparatus.
(b) is a case where the adhesive 18 is applied to the groove space 17 by the nozzle 5.
(c) shows a case where the IC chip 13 is accommodated in the groove space 18 and bonded.
(d) shows a case where a predetermined Japanese paper is manufactured by pasting the cover paper 19 and embedding the IC chip.
１ 巻き出しリール
２ 巻き取りリール
３ 張力機構
４ 張力機構
５ ノズル
６ ＩＣチップリール
７ 裁断機
８ ベース紙
９ ダンサロール
10 ダンサロール
11 駆動ロール
12 ロール
13 ＩＣチップ
14 ホットメルトタンク
15 チューブ
16 カッター
17 溝空間
18 接着剤
19 カバー紙
DESCRIPTION OF SYMBOLS 1 Unwinding reel 2 Take-up reel 3 Tension mechanism 4 Tension mechanism 5 Nozzle 6 IC chip reel 7 Cutting machine 8 Base paper 9 Dancer roll
10 Dancer roll
11 Drive roll
12 rolls
13 IC chip
14 Hot melt tank
15 tubes
16 cutter
17 Groove space
18 Adhesive
19 Cover paper
Claims (3)
In a method of manufacturing Japanese paper with embedded IC chips, the Japanese paper is composed of a base paper and a cover paper bonded together, and a groove space in which a portion of the outer surface of the mesh cylinder that covers the base paper is sealed to reduce the thickness Pull out from the unwinding reel wound with this base paper via a tension mechanism, detect the groove space provided in the base paper, apply the adhesive by flowing out from the nozzle, and move the base paper When the IC chip that has been unwound from the IC chip reel is cut off and bonded to the groove space, the base paper to which the IC chip is bonded is applied with a constant tension via a tension mechanism. A method for producing Japanese paper embedded with an IC chip, wherein the paper is wound around a take-up reel, the base paper is rewound from the take-up reel, and a cover paper is bonded together.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004015764A JP4069868B2 (en) | 2004-01-23 | 2004-01-23 | Manufacturing method of Japanese paper with embedded IC chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004015764A JP4069868B2 (en) | 2004-01-23 | 2004-01-23 | Manufacturing method of Japanese paper with embedded IC chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005209009A true JP2005209009A (en) | 2005-08-04 |
| JP4069868B2 JP4069868B2 (en) | 2008-04-02 |
Family
ID=34901137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004015764A Expired - Fee Related JP4069868B2 (en) | 2004-01-23 | 2004-01-23 | Manufacturing method of Japanese paper with embedded IC chip |
Country Status (1)
| Country | Link |
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| JP (1) | JP4069868B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006299470A (en) * | 2005-04-21 | 2006-11-02 | Oji Paper Co Ltd | Paper containing ic chip built therein and paper tape used for producing the same |
| JP2009532594A (en) * | 2006-04-07 | 2009-09-10 | グルッポ コルデノンス エッセ ピー アー | Security paper materials, particularly for labeling and packaging, and methods of manufacturing the same |
| WO2012036155A1 (en) * | 2010-09-16 | 2012-03-22 | 有限会社 小畑製紙所 | Production device for japanese paper added with ic tag |
| JP2020090735A (en) * | 2018-12-04 | 2020-06-11 | デュプロ精工株式会社 | Sheet forming device |
| JPWO2021210535A1 (en) * | 2020-04-14 | 2021-10-21 | ||
| WO2023100761A1 (en) * | 2021-12-03 | 2023-06-08 | 株式会社村田製作所 | Rfid tag pitch conversion apparatus |
-
2004
- 2004-01-23 JP JP2004015764A patent/JP4069868B2/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006299470A (en) * | 2005-04-21 | 2006-11-02 | Oji Paper Co Ltd | Paper containing ic chip built therein and paper tape used for producing the same |
| JP4710397B2 (en) * | 2005-04-21 | 2011-06-29 | 王子製紙株式会社 | IC chip built-in paper and paper tape used for its production |
| JP2009532594A (en) * | 2006-04-07 | 2009-09-10 | グルッポ コルデノンス エッセ ピー アー | Security paper materials, particularly for labeling and packaging, and methods of manufacturing the same |
| US8691051B2 (en) | 2006-04-07 | 2014-04-08 | Gruppo Cordenons S.P.A. | Security paper material, in particular for labelling and packaging, and manufacturing method thereof |
| WO2012036155A1 (en) * | 2010-09-16 | 2012-03-22 | 有限会社 小畑製紙所 | Production device for japanese paper added with ic tag |
| JP2012062599A (en) * | 2010-09-16 | 2012-03-29 | Obata Seishisho:Kk | Apparatus for producing japanese paper with ic tag enclosed |
| JP2020090735A (en) * | 2018-12-04 | 2020-06-11 | デュプロ精工株式会社 | Sheet forming device |
| JPWO2021210535A1 (en) * | 2020-04-14 | 2021-10-21 | ||
| WO2021210535A1 (en) * | 2020-04-14 | 2021-10-21 | 株式会社村田製作所 | Wireless communication device manufacturing system |
| JP7081729B2 (en) | 2020-04-14 | 2022-06-07 | 株式会社村田製作所 | Wireless communication device manufacturing system |
| WO2023100761A1 (en) * | 2021-12-03 | 2023-06-08 | 株式会社村田製作所 | Rfid tag pitch conversion apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4069868B2 (en) | 2008-04-02 |
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