JP7353985B2 - Circuit patterns, RFID inlays, RFID labels and RFID media - Google Patents

Description

The present invention relates to a circuit pattern of an antenna section in an RFID inlay.

In the fields of product manufacturing, management, distribution, etc., tags with visible product information printed on them and labels attached to products, etc. are used. There is. In recent years, RFID (Radio Frequency Identification) technology, which transmits and receives information through non-contact communication from an IC chip in which identification information is written, has been applied to various fields, and is becoming pervasive in these fields as well.

RFID includes an electromagnetic induction method using a 135 kHz band, a 13.56 MHz band, etc., and a radio wave method using a UHF band. When the communication distance is relatively short, such as in a non-contact IC card, the electromagnetic induction method is often used.

The electromagnetic induction method obtains an induced electromotive force by electromagnetic induction using a coil antenna whose starting end and end end are connected to form a closed circuit.

As shown in JP2001-312709A, an example of a method for manufacturing a coil antenna for HF band RFID is as follows. First, a base film made of PET or the like with a metal foil pasted on one side is prepared. Next, a coil-shaped antenna pattern is formed by etching. Subsequently, the inner peripheral end and the outer peripheral end of the coil antenna are electrically connected using a jumper wire.

In the above method, it was necessary to prepare jumper wires. Furthermore, since the coil antenna and the jumper wire are connected using a caulking jig or the like, the base film at the connection portion may be punctured and damaged, or may bulge, resulting in an increase in thickness.

Additionally, it was necessary to select a base material that could withstand the etching process applied to form the coil antenna. In addition, since the RFID inlay base material is penetrated by electrically connecting from the front surface to the back surface of the RFID inlay base material by caulking, the penetrated portion may become a damaged part of the base material. Ta.

For this reason, such RFID inlays require measures such as covering with another base material to prevent damage to the base material. In order to prevent such damage, a method has been adopted in which a bridge is formed between the inner and outer ends of the coil antenna via an insulating layer, but this increases the number of parts and man-hours.

Therefore, an object of the present invention is to expand the options for base materials for RFID inlays and to form circuit patterns without damaging the base materials for RFID inlays.

According to an aspect of the present invention, there is provided a circuit pattern used for an RFID inlay, which includes a base material, an antenna part formed on the base material in the shape of a rectangular coil using metal foil, and a circuit pattern connected to the antenna part. a coil antenna formed on the same plane as the antenna part and having a bridge part as a jumper wire for connecting both ends of the antenna part to form a closed circuit, the bridge part being formed on the same plane as the antenna part; a base portion formed at an outer corner of one end on the outer peripheral side of the section; a folded piece extending from the base portion to the outside of the rectangle and folded back to the base portion; and an end portion of the folded piece. a bridge part-side conductive part formed at the corner part of the antenna part, and an antenna part-side conductive part formed at the other end on the inner peripheral side of the corner part of the antenna part, and the conductive part is connected to the base part and a part of the antenna part. In the above, an insulating layer is coated, and the folded piece is bent over a portion of the base portion and the antenna portion coated with the insulating layer, so that the conductive portion on the bridge portion side and the conductive portion on the antenna portion side are formed. A circuit pattern is provided in which the base portion is electrically connected to the base portion and the entire surface of the base portion is covered by the folded piece .

According to an aspect of the present invention, it is possible to expand the selection of base materials for RFID inlays and to form a circuit pattern without damaging the base materials for RFID inlays.

FIG. 1 is an external view illustrating an RFID inlay including a circuit pattern manufactured using a circuit pattern manufacturing method according to an embodiment of the present invention. FIG. 2 is a schematic diagram of a circuit pattern manufacturing apparatus that executes a circuit pattern manufacturing method according to an embodiment of the present invention. FIG. 3 is a plan view illustrating a coil antenna arranged in a continuous body. FIG. 4 is a plan view illustrating a part of the continuous body obtained through the bridge formation preparation step in the circuit pattern manufacturing apparatus shown in FIG. 2. FIG. 5 is a cross-sectional view taken along the line VV for explaining the continuum shown in FIG. FIG. 6 is a plan view illustrating a part of the continuous body obtained through the bending process in the circuit pattern manufacturing apparatus shown in FIG. 2. FIG. 7 is a cross-sectional view taken along the line VII-VII for explaining the continuum shown in FIG. FIG. 8 is a partially cutaway plan view of the RFID label according to the embodiment of the present invention. FIG. 9 is a cross-sectional view taken along line IX-IX, illustrating the RFID label shown in FIG. 8. FIG. 10 is a cross-sectional view illustrating an RFID label according to an embodiment of the present invention. FIG. 11 is a cross-sectional view illustrating an RFID label according to an embodiment of the present invention. FIG. 12 is a cross-sectional view illustrating an RFID medium according to an embodiment of the present invention.

[Circuit pattern]
A circuit pattern 1 and an RFID inlay 10 manufactured using the circuit pattern manufacturing method according to the present embodiment will be described. FIG. 1 is an external view illustrating an RFID inlay 10 including a circuit pattern 1 manufactured using a circuit pattern manufacturing method according to an embodiment of the present invention.

In this embodiment, the RFID inlay 10 shown in FIG. 1 before the IC chip 20 is mounted is referred to as a circuit pattern 1.

The circuit pattern 1 includes a base material 11 and a coil antenna 12. The coil antenna 12 includes an antenna part 13 formed by forming a coil of metal foil on a base material 11, and a jumper wire for connecting one end on the outer circumferential side and the other end on the inner circumferential side of the antenna part 13 to form a closed circuit. It has a bridge part 14 as a. The bridge part 14 is connected to the antenna part 13 and is formed on the same plane as the antenna part 13.

An antenna section-side conductive section 17 is formed at one end on the inner peripheral side of the antenna section 13 . Further, the bridge portion 14 includes a base portion 14a and a folded piece 14b that is folded back at the fold line W with respect to the base portion 14a (see FIG. 3). A bridge portion side conductive portion 16 is formed at the end of the folded piece 14b.

Further, the circuit pattern 1 has an insulating layer 15 coated on a predetermined area of the antenna section 13. Further, in the circuit pattern 1, the bridge portion 14 is bent onto the insulating layer 15, and the bridge portion side conductive portion 16 and the antenna portion side conductive portion 17 are overlapped, and a conductive adhesive layer (hereinafter referred to as a conductive layer 18) is formed. ) is electrically connected.

[RFID inlay]
As shown in FIG. 1, the RFID inlay 10 according to this embodiment includes an RFID (Radio Frequency Identification) IC chip 20 connected to the antenna section 13 of the circuit pattern 1. Further, by performing predetermined processing on the RFID inlay 10, RFID media such as tags, labels, wristbands, etc. can be manufactured. Details of the RFID label and RFID medium will be described later.

[Circuit pattern manufacturing method]
Hereinafter, a method for manufacturing a circuit pattern 1 according to an embodiment of the present invention will be described using the drawings. FIG. 2 is a schematic diagram of a circuit pattern manufacturing apparatus 100 that executes a method for manufacturing a circuit pattern 1 according to an embodiment of the present invention.

As shown in FIG. 2, the method for manufacturing the circuit pattern 1 according to the present embodiment includes an adhesive coating step P1 of applying an adhesive A to the continuous body C of the base material 11 while conveying the continuous body C. , a metal foil placement step P2 of arranging the metal foil continuum M on the surface of the continuum C coated with the adhesive A, and forming cuts for the antenna portion 13 and the bridge portion 14 in the metal foil continuum M. A cutting step P3, a removing step P4 of removing unnecessary portions Mb that do not constitute the antenna section 13 and the bridge section 14 from the continuous body M of metal foil, and an insulating layer 15 in the area where the bridge section 14 is superimposed on the antenna section 13. The method includes a bridge formation preparation step P5 in which a conductive layer 18 is formed, and a bending step P6 in which the bridge portion 14 is bent onto the formed insulating layer 15 and conductive layer 18.

Further, the method for manufacturing the circuit pattern 1 includes a pressurizing step P7 in which the antenna portion 13 remaining on the continuum C is pressurized. Arrow F in FIG. 2 indicates the conveyance direction of the continuous body C.

The adhesive coating process P1 shown in FIG. 2 is executed by the adhesive coating unit 110. The adhesive coating unit 110 includes an adhesive tank 111 that stores adhesive, a feed roller 112 that feeds out adhesive A from the adhesive tank 111, and receives the adhesive A from the feed roller 112 and transfers it onto a continuous body C. It has a plate roller 113 and an impression cylinder 114. The adhesive coating unit 110 also includes a UV lamp 115 that irradiates the adhesive A with ultraviolet light.

The plate roller 113 is a plate having a convex pattern 113a formed thereon corresponding to the shape of the adhesive A applied to the continuous body C of the base material 11, which is wound around a plate cylinder. A plurality of convex patterns 113a are formed on the plate roller 113. The plurality of convex patterns 113a are arranged side by side in the feeding direction and the width direction of the plate roller 113. Thereby, adhesives for a plurality of antenna parts can be transferred and applied onto the continuous body C at the same time. Each convex pattern 113a has a shape that fits inside the outer circumferential line of the antenna section 13 arranged on the base material 11.

The thickness of the adhesive A applied to the continuous body C is preferably 3 μm or more and 25 μm or less. If it is 3 μm or more, sufficient adhesive force can be obtained to adhere the antenna portion 13, and if it is 25 μm or less, it will not protrude outside the outer circumferential line of the antenna portion 13 due to pressure. From this viewpoint, the thickness of the adhesive A is more preferably 3 μm or more and 10 μm or less.

FIG. 3 is a plan view illustrating the coil antenna 12 formed on the continuum C.

In the continuum C shown in FIG. 3, the coating position of the adhesive A is positioned such that the margin on the upstream side in the conveyance direction of the adhesive A located below the antenna part 13 is wider than the margin on the downstream side in the conveyance direction. be done.

If the margin is too wide, the edge portion of the antenna section 13 may rise or peel off. Furthermore, if the margin is too narrow, the adhesive A may protrude from the outer periphery of the antenna section 13. From this point of view, the margin on the upstream side in the transport direction is preferably 50 μm or more and 300 μm or less, and the margin on the downstream side in the transport direction is preferably 30 μm or more and 100 μm or less (however, the margin on the upstream side in the transport direction > transport fill the downstream margin).

In the continuous body C, the adhesive A is not applied to the position corresponding to the folded piece 14b of the bridge portion 14.

Although not shown in FIG. 2, before the adhesive coating step P1, positioning is performed when applying the adhesive to the continuous body C, and incisions are made when forming the notch for the antenna part. A step is performed to print a fiducial mark that can be used as a reference for positioning the position.

In this embodiment, materials that can be used as the base material 11 (the same applies to the continuum C described later) include papers such as high-quality paper and coated paper, polyvinyl chloride, polyethylene terephthalate, polypropylene, polyethylene, polyethylene naphthalate, etc. Examples include a single resin film or a multilayer film called synthetic paper, which is formed by laminating a plurality of these resin films.

The thickness of the base material 11 is preferably 25 μm or more and 300 μm or less. When paper is used as the base material, within the above range, the thickness can be 50 μm or more and 260 μm or less, and usually preferably 70 μm or more and 110 μm or less. Moreover, when using a resin film as a base material, it can be 25 micrometers or more and 200 micrometers or less within the said range. An appropriate one can be selected from these depending on the purpose.

Examples of the adhesive A that can be applied in the adhesive coating step P1 include acrylic adhesives, urethane adhesives, silicone adhesives, rubber adhesives, and the like. In this embodiment, it is preferable to use an ultraviolet curing adhesive from the viewpoint of coating the conveyed continuous body C using a flexo printing or letterpress printing method. In addition, a screen printing method is also applicable.

The adhesive strength of adhesive A is preferably 500 gf/25 mm or more, more preferably 800 gf/25 mm or more, and still more preferably 1000 gf/25 mm or more in a 180° peel test (JIS Z 0237). . The upper limit of the adhesive force is preferably 2000 gf/25 mm.

The metal foil placement process P2 is executed by the metal foil placement unit 120. The metal foil arrangement unit 120 has a pressing roller 121 and a support roller 122. In the metal foil placement step P2, the metal foil continuum M conveyed by a conveyance path different from the conveyance path of the continuum C is superimposed on the surface of the continuum C coated with the adhesive A, and the pressure roller It is inserted between 121 and support roller 122 and bonded together. Since no adhesive is present outside the outer circumferential line of the antenna section 13 and at a position corresponding to the lower side of the bridge section 14, the continuous body M of metal foil is a continuous body except for the area forming the antenna section 13. It is not attached to C.

As the metal constituting the metal foil, any conductive metal that is normally used for forming an antenna part can be used. Examples include copper and aluminum. From the viewpoint of reducing manufacturing costs, it is preferable to use aluminum. Further, from the viewpoint of the entire thickness of the RFID inlay 10 or the entire thickness when formed on the RFID medium, and manufacturing cost, the thickness of the metal foil is preferably 3 μm or more and 25 μm or less. In this embodiment, aluminum foil with a thickness of 20 μm is used.

The continuous body C to which the continuous body M of metal foil is attached is guided by the roller 123 and sent to the cutting step P3.

The cutting process P3 is executed by the cutting unit 130. The cutting unit 130 includes a die roll 131 that forms cuts for the antenna section 13 and the bridge section 14 in a continuous body M of metal foil arranged on the continuous body C, and an anvil roller 132 that backs up the die roll 131. On the surface of the die roll 131, a convex blade portion 131a in the shape of the outer circumferential line of the antenna portion 13 is formed. The convex blade portion 131a can be a flexible die. In addition to this, it can also be constructed with a carving blade, a implantable blade, etc.

The cutting unit 130 divides the antenna part 13 by cutting the convex blade part 131a into the continuous body M of metal foil while sandwiching and continuously conveying the workpieces made up of the continuous body C and the continuous body M. Thereby, a cut can be formed in the continuous body M of metal foil.

The removal process P4 is performed by the removal unit 140. The removal unit 140 includes peel rollers 141 and 142. The unnecessary portion Mb of the metal foil is placed along a part of the peel roller 141 to change the conveyance direction, and the workpiece is placed along a part of the peel roller 142 to be conveyed in a direction different from the conveyance direction of the unnecessary portion Mb. By doing so, the unnecessary portion Mb of the metal foil is separated from the work consisting of the continuous body C and the continuous body M. After the unnecessary portion Mb is collected, it is subjected to recycling processing and used again as a continuous body M of metal foil.

The bridge formation preparation step P5 is formed by the bridge formation unit 150. The bridge forming unit 150 includes an insulating layer coating unit 151 and a conductive layer coating unit 152.

The insulating layer coating unit 151 includes a pot 151a that stores the insulating material B, a feeding roller 151b that feeds out the insulating material B from the pot 151a, and a plate roller that receives the insulating material B from the feeding roller 151b and coats it on the continuous body C. 151c, an impression cylinder 151d, and a UV lamp 151e that irradiates the insulating material B with ultraviolet light.

The insulating layer 15 is formed in a region where the bridge portion 14 is folded and overlapped with the antenna portion 13 . The plate roller 151c is a plate having a convex pattern 151f formed thereon corresponding to the shape of the insulating material B applied to the continuous body C of the base material 11, which is wound around a plate cylinder.

As the insulating material B, for example, general-purpose ultraviolet curing ink, medium, or varnish can be used. The thickness of the insulating layer is preferably 2 μm or more and 50 μm or less. If the thickness is less than 2 μm, the antenna portion 13 may not be completely covered, and the insulation may be incomplete. Moreover, if it exceeds 50 μm, the RFID inlay becomes too thick, and when a label is manufactured using this, high-quality printing cannot be performed using a general-purpose label printer or the like.

The conductive layer coating unit 152 includes a pot 152a that stores the conductive adhesive D, a feeding roller 152b that feeds out the conductive adhesive D from the pot 152a, and a continuous body C that receives the conductive adhesive D from the feeding roller 152b. It has a plate roller 152c and an impression cylinder 152d for coating. A conductive layer 18 made of conductive adhesive D is formed on the antenna section side conductive section 17.

The plate roller 152c is a plate on which a convex pattern 152f corresponding to the shape of the conductive adhesive D coated on the continuous body C of the base material 11 is wound around a plate cylinder.

Note that the conductive layer coating unit 152 is not limited to the above-mentioned method, but may also be of a method of discharging a fixed amount from a nozzle.

As the conductive adhesive D, any conductive adhesive can be used. An example is SX-ECA48, a low temperature curing flexible conductive adhesive manufactured by Cemedine Co., Ltd. In addition, conductive adhesive double-sided tape can also be used. Alternatively, a paste containing metal powder may be applied. Furthermore, the conductive material may be printed by inkjet.

FIG. 4 is a plan view illustrating a part of the continuum obtained through the bridge formation preparation step P5 in the circuit pattern manufacturing apparatus 100 shown in FIG. 2. Further, FIG. 5 is a cross-sectional view taken along the line VV for explaining the continuum shown in FIG. 4.

As shown in FIG. 4, in the antenna part 13, an insulating layer 15 is formed in a region where the folded piece 14b of the bridge part 14 is overlapped, and a conductive layer 18 is formed in the antenna part side conductive part 17.

Further, as shown in FIG. 5, the insulating layer 15 is coated to cover the surface of the antenna section 13 and a portion of the base section 14a. Note that, as shown in FIG. 5, the folded piece 14b side of the bridge portion 14 is not attached to the continuous body C and is slightly raised.

The bending process P6 is performed by the bending unit 160. The bending unit 160 has a roller 161 that changes the conveying direction of the continuous body C, and a bending section 162 that turns up the bridge section 14. Further, the bending unit 160 includes a roller 163 that changes the conveyance direction of the continuous body C.

The tip of the bending part 162 is arranged so as to fit between the bridge part 14 and the continuous body C, which have been lifted up by turning the conveying direction of the continuous body C by the roller 161, and the continuous body C is conveyed. This obstructs the bridge portion 14 from moving in the transport direction. As a result, when the continuous body C is transported, the bridge portion 14 is pushed back upstream in the transport direction, turned over, and bent. The bent portion 162 is formed of an elastic spatula member, for example. The bent portion 162 may be a brush. In addition, a mechanism that blows high-pressure air toward the folded piece 14b may be used.

FIG. 6 is a plan view illustrating a part of the continuous body obtained through the bending process P6 in the circuit pattern manufacturing apparatus 100 shown in FIG. Further, FIG. 7 is a cross-sectional view taken along the line VII-VII for explaining the continuum shown in FIG. 6.

As shown in FIG. 6, the bridge portion 14 is folded onto the insulating layer 15. Thereby, as shown in FIG. 7, the bridge part 14 can electrically connect the bridge part side conductive part 16 and the antenna part side conductive part 17 without shorting with the antenna part 13.

The pressurizing process P7 is executed by the pressurizing unit 170. The pressure unit 170 includes a pressure roller 171 and a support roller 172. In the pressure unit 170, the workpiece is sandwiched between the pressure roller 171 and the support roller 172 and pressurized, so that the adhesive A is spread over the entire surface of the antenna section 13 disposed on the continuous body C. The pressure is preferably 2 kg/cm or more and 6 kg/cm or less.

After the pressing step P7, the workpiece in which the coil antenna 12 is arranged on the continuous body C of the base material 11 is wound up by the winding roller 102.

Next, the operation of the circuit pattern manufacturing apparatus 100 that executes the method for manufacturing the circuit pattern 1 described above and the effects thereof will be described.

According to the circuit pattern manufacturing apparatus 100 that executes the method for manufacturing the circuit pattern 1 described above, the continuous body C of the base material 11 fed out from the feeding roller 101 is connected to the plate roller 113 and the impression cylinder in the adhesive coating step P1. 114 , the adhesive A is applied to an area where the antenna part 13 is planned to be placed and which is inside the outer circumferential line of the antenna part 13 .

Next, in the metal foil arrangement step P2, a continuous body M of metal foil is superimposed on the continuous body C coated with the adhesive A.

Subsequently, in the cutting step P3, the workpiece consisting of the continuous body C and the continuous body M of metal foil is cut by a die roll 131 in which a convex blade part 131a in the shape of the outer periphery of the antenna part 13 and the bridge part 14 is formed. Cuts for the antenna portion 13 and bridge portion 14 are formed.

Next, in the removal step P4, unnecessary portions Mb of the continuous body M of metal foil that do not constitute the antenna portion 13 and the bridge portion 14 are removed.

Next, in a bridge formation preparation step P5, an insulating layer 15 is formed in a region where the bridge part 14 is superimposed on the antenna part 13, and a conductive layer 18 is formed in the antenna part side conductive part 17.

Next, in a bending step P6, the bridge portion 14 is bent onto the insulating layer 15 and the conductive layer 18.

Subsequently, in a pressurizing step P7, the coil antenna 12 arranged on the continuum C is pressurized.

Through the above steps, the coil antenna 12 having the bridge portion 14 can be formed on the continuous body C of the base material 11.

According to the method for manufacturing a circuit pattern according to the present embodiment, since the metal foil is attached to the base material 11 using the adhesive A, the metal foil is attached to both sides of the conventional base material for RFID inlay such as PET. Compared to the method of processing metal foil into a coiled antenna by etching or the like, inexpensive materials such as paper can also be used as the base material.

Further, according to the method for manufacturing a circuit pattern according to the present embodiment, since the bridge portion can be formed by bending the metal foil, the circuit pattern 1 can be formed without damaging the base material, compared to the case where a caulking jig or the like is used. can be manufactured. Furthermore, there is no need to prepare a separate jumper wire.

[RFID inlay manufacturing method]
Next, a method for manufacturing an RFID inlay according to an embodiment of the present invention will be described. The method for manufacturing the RFID inlay 10 according to this embodiment includes an IC chip mounting step of mounting the IC chip 20 on the workpiece manufactured by the method for manufacturing the circuit pattern 1 described above.

In the attachment process, the IC chip 20 is fixed to a specific position of the antenna section 13 using a conductive material. As a method for joining the IC chip 20, for example, baking joining using an anisotropic conductive paste or a conductive film can be used.

[RFID label (1)]
FIG. 8 is a partially cutaway plan view of the RFID label 200 according to the embodiment of the present invention. FIG. 9 is a cross-sectional view taken along the line IX-IX, illustrating the RFID label 200 shown in FIG. 8.

The RFID label 200 is constructed using an RFID inlay 10 having a circuit pattern 1. The circuit pattern 1 includes a base material 11 and a coil antenna 12. The coil antenna 12 includes an antenna part 13 formed in a coil shape using metal foil on the base material 11, and is connected to the antenna part 13 and formed on the same plane as the antenna part 13, making the antenna part 13 a closed circuit. It has a bridge part 14 for.

The RFID inlay 10 is obtained by mounting the IC chip 20 on the circuit pattern 1 described above using an anisotropic conductive adhesive E.

In the RFID label 200 according to the embodiment of the present invention, a separator 202 is temporarily attached to the surface of the base material 11 on which the circuit pattern 1 is formed via an adherend adhesive 201.

In the RFID label 200, the surface of the base material 11 on which the coil antenna 12 and the like are not provided is not processed in any way.

Thereby, the RFID label according to this embodiment can be directly printed on a base material using a general-purpose label printer, and can be attached to an adherend.

[Method for manufacturing RFID label (1)]
Next, a method for manufacturing the RFID label 200 according to the embodiment of the present invention will be described. The method for manufacturing the RFID label 200 according to the present embodiment includes forming the coil antenna 12 of the RFID inlay 10 on which the circuit pattern 1 is formed, following the method for manufacturing the circuit pattern 1 and the method for manufacturing the RFID inlay 10 described above. It includes a step of temporarily attaching a separator 202 to the surface via an adherend adhesive 201.

[RFID label (2)]
FIG. 10 is a cross-sectional view illustrating an RFID label 300 according to an embodiment of the present invention. The RFID label 300 is constructed using an RFID inlay 10 having a circuit pattern 1. In the RFID label 300 according to the embodiment of the present invention, a separator 302 is temporarily attached to the surface of the base material 11 on which the circuit pattern 1 is formed via an adherend adhesive 301.

Further, an outer base material 304 having a printed surface is laminated on the opposite surface of the base material 11 to the surface on which the circuit pattern 1 is formed, with an adhesive for outer base material or an adhesive for outer base material 303 interposed therebetween.

Thereby, the RFID label according to this embodiment can be printed on the outer base material 304 and can be attached to an adherend.

[Method for manufacturing RFID label (2)]
Next, a method for manufacturing the RFID label 300 according to the embodiment of the present invention will be described. The method for manufacturing the RFID label 300 according to the present embodiment includes following the method for manufacturing the circuit pattern 1 and the method for manufacturing the RFID inlay 10 described above. Temporarily attaching the separator 302 via the agent 301, and placing the outer base material 304 having a printed surface on the opposite side of the base material 11 to the surface on which the circuit pattern 1 is formed, with the printed surface facing outward. and laminating via an outer base material adhesive or an outer base material adhesive 303.

[RFID label (3)]
FIG. 11 is a cross-sectional view illustrating an RFID label 400 according to an embodiment of the present invention. The RFID label 400 is constructed using an RFID inlay 10 having a circuit pattern 1. In the RFID label 400 according to the embodiment of the present invention, an outer base material 402 is laminated on the surface of the base material 11 on which the circuit pattern 1 is formed via an adherend adhesive or an adherend adhesive 401. There is. Furthermore, a separator 404 is temporarily attached onto the outer base material 402 with an adhesive 403 interposed therebetween.

[Method for manufacturing RFID label (3)]
Next, a method for manufacturing the RFID label 400 according to the embodiment of the present invention will be described. The manufacturing method of the RFID label 400 according to the present embodiment includes following the manufacturing method of the circuit pattern 1 and the manufacturing method of the RFID inlay 10 described above, and applying an adhesive for an adherend to the surface of the base material 11 on which the circuit pattern 1 is formed. The method includes a step of laminating an outer base material 402 via an adhesive 401 or an adherend adhesive 401, and a step of temporarily attaching a separator 404 onto the outer base material 402 via an adhesive 403.

[RFID medium]
FIG. 12 is a cross-sectional view illustrating an RFID medium 500 according to an embodiment of the present invention. The RFID medium 500 is constructed using an RFID inlay 10 having a circuit pattern 1.

The RFID medium 500 according to the embodiment of the present invention includes a first outer substrate laminated on the surface of the substrate 11 on which the circuit pattern 1 is formed via an outer substrate adhesive or an outer substrate adhesive 501. material 502, and a second outer base material 504 that is laminated on the opposite surface of the base material 11 to the surface on which the circuit pattern 1 is formed via an outer base material adhesive or an outer base material adhesive 503; has.

[RFID medium manufacturing method]
Next, a method for manufacturing the RFID medium 500 according to the embodiment of the present invention will be described. The method for manufacturing the RFID medium 500 according to the present embodiment includes, following the method for manufacturing the circuit pattern 1 and the method for manufacturing the RFID inlay 10 described above, an adhesive for outer base material is applied to the surface of the base material 11 on which the circuit pattern 1 is formed. A step of laminating the first outer base material 502 via an adhesive 501 for outer base materials or an adhesive for outer base materials on the surface opposite to the surface on which the circuit pattern 1 of the base material 11 is formed. and laminating a second outer base material 504 via a base material adhesive 503.

In this embodiment, the first outer base material 502 and the second outer base material 504 protect the antenna section 13 and the IC chip 20 arranged on the base material 11, and also protect tags (particularly apparel tags). This determines the format of labels, wristbands, tickets, etc. The thickness and material can be selected depending on the desired use.

In the method for manufacturing an RFID medium according to the present embodiment, an emulsion adhesive, a solvent adhesive, and a hot melt adhesive are used as adhesives for bonding the first and second outer base materials to the RFID inlay 10. can be used. Moreover, an adhesive can also be used. As the adhesive, acrylic adhesive, urethane adhesive, silicone adhesive, rubber adhesive, etc. can be used. Further, as the adhesive, adhesives such as acrylic adhesive, urethane adhesive, silicone adhesive, rubber adhesive, etc. can be used.

[Other embodiments]
The embodiments of the present invention described above can be modified in various ways without departing from the spirit of the present invention.

In the present embodiment, as shown in FIG. 5, it has been described that the insulating layer 15 is coated to cover a portion of the antenna portion 13 and a portion of the base portion 14a. However, the insulating layer 15 may be applied to the folded piece 14b of the bridge portion 14.

In the bridge formation preparation step P5, the order of the step of forming the insulating layer 15 and the step of forming the conductive layer 18 may be reversed.

Although the embodiments of the present invention have been described above, the above embodiments merely show a part of the application examples of the present invention, and the purpose is to limit the technical scope of the present invention to the specific configuration of the above embodiments. isn't it.

This application claims priority based on Japanese Patent Application No. 2018-016234 filed with the Japan Patent Office on February 1, 2018, and the entire contents of this application are incorporated herein by reference.

Claims (5)

A circuit pattern used in an RFID inlay,
base material and
an antenna part formed in the shape of a rectangular coil by metal foil on the base material; and an antenna part connected to the antenna part and formed on the same plane as the antenna part, and both ends of the antenna part are connected to form a closed circuit. a coil antenna having a bridge part as a jumper wire for
The bridge portion is
a base portion formed at an outer corner of one end of the outer peripheral side of the antenna portion;
a folded piece extending from the base to the outside of the rectangle and folded back to the base;
a bridge part side conductive part formed at the end of the folded piece;
an antenna part side conductive part formed at the other end on the inner peripheral side of the corner part of the antenna part;
has
An insulating layer is coated on the base portion and a portion of the antenna portion,
The folded piece is bent over a portion of the base portion and the antenna portion coated with the insulating layer, so that the bridge portion side conductive portion and the antenna portion side conductive portion are electrically connected , and the folded piece the entire surface of the base portion is covered by the piece;
circuit pattern. An RFID inlay comprising an antenna part and an IC chip connected to the antenna part,
a base material, the antenna part formed in a rectangular coil shape with metal foil on the base material, and the antenna part connected to the antenna part and formed on the same plane as the antenna part, and connecting both ends of the antenna part. a coil antenna having a bridge part as a jumper wire to create a closed circuit;
The bridge portion is
a base portion formed at an outer corner of one end of the outer peripheral side of the antenna portion;
a folded piece extending from the base to the outside of the rectangle and folded back to the base;
a bridge part side conductive part formed at the end of the folded piece;
an antenna part side conductive part formed at the other end on the inner peripheral side of the corner part of the antenna part;
has
An insulating layer is coated on the base portion and a portion of the antenna portion,
The folded piece is bent over a portion of the base portion and the antenna portion coated with the insulating layer, so that the bridge portion side conductive portion and the antenna portion side conductive portion are electrically connected , and the folded piece a circuit pattern in which the entire surface of the base portion is covered by a piece ;
the IC chip arranged on the base material and connected to the circuit pattern;
RFID inlay with. An RFID label having an RFID inlay, the label comprising:
a base material having a printed surface; an antenna part formed on the base material in the shape of a rectangular coil of metal foil; and an antenna part connected to the antenna part and formed on the same plane as the antenna part. A coil antenna having a bridge part as a jumper wire for connecting both ends to form a closed circuit,
The bridge portion is
a base portion formed at an outer corner of one end of the outer peripheral side of the antenna portion;
a folded piece extending from the base to the outside of the rectangle and folded back to the base;
a bridge part side conductive part formed at the end of the folded piece;
an antenna part side conductive part formed at the other end on the inner peripheral side of the corner part of the antenna part;
has
An insulating layer is coated on the base portion and a portion of the antenna portion,
The folded piece is bent over a portion of the base portion and the antenna portion coated with the insulating layer, so that the bridge portion side conductive portion and the antenna portion side conductive portion are electrically connected , and the folded piece a circuit pattern in which the entire surface of the base portion is covered by a piece ;
an IC chip arranged on the base material and connected to the circuit pattern;
a separator temporarily attached to the surface of the base material on which the circuit pattern is formed via an adherend adhesive;
RFID label with. An RFID label having an RFID inlay, the label comprising:
a base material, an antenna part formed in the shape of a rectangular coil by metal foil on the base material, and connected to the antenna part and formed on the same plane as the antenna part, making the antenna part a closed circuit. a coil antenna having a bridge portion for
The bridge portion is
a base portion formed at an outer corner of one end of the outer peripheral side of the antenna portion;
a folded piece extending from the base to the outside of the rectangle and folded back to the base;
a bridge part side conductive part formed at the end of the folded piece;
an antenna part side conductive part formed at the other end on the inner peripheral side of the corner part of the antenna part;
has
An insulating layer is coated on the base portion and a portion of the antenna portion,
The folded piece is bent over a portion of the base portion and the antenna portion coated with the insulating layer, so that the bridge portion side conductive portion and the antenna portion side conductive portion are electrically connected , and the folded piece a circuit pattern in which the entire surface of the base portion is covered by a piece ;
an IC chip arranged on the base material and connected to the circuit pattern;
a separator temporarily attached to either the surface on which the circuit pattern is formed and the opposite surface of the base material via an adherend adhesive;
an outer base material laminated via an outer base material adhesive or an outer base material adhesive on the opposite surface to the surface to which the separator is temporarily attached;
RFID label with. An RFID medium having an RFID inlay, the RFID medium comprising:
a base material, an antenna part formed in the shape of a rectangular coil by metal foil on the base material, and connected to the antenna part and formed on the same plane as the antenna part, making the antenna part a closed circuit. a coil antenna having a bridge portion for
The bridge portion is
a base portion formed at an outer corner of one end of the outer peripheral side of the antenna portion;
a folded piece extending from the base to the outside of the rectangle and folded back to the base;
a bridge part side conductive part formed at the end of the folded piece;
an antenna part side conductive part formed at the other end on the inner peripheral side of the corner part of the antenna part;
has
An insulating layer is coated on the base portion and a portion of the antenna portion,
The folded piece is bent over a portion of the base portion and the antenna portion coated with the insulating layer, so that the bridge portion side conductive portion and the antenna portion side conductive portion are electrically connected , and the folded piece a circuit pattern in which the entire surface of the base portion is covered by a piece ;
an IC chip arranged on the base material and connected to the circuit pattern;
a first outer base material laminated on the surface of the base material on which the circuit pattern is formed via an outer base material adhesive or an outer base material adhesive;
a second outer base material laminated via an outer base material adhesive or an outer base material adhesive on a surface opposite to the surface on which the circuit pattern of the base material is formed;
RFID medium with.

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