JP2024048361A - Antenna pattern manufacturing method and antenna pattern - Google Patents

Abstract

A plurality of coil-shaped antenna patterns are continuously formed on a continuous substrate.
[Solution] A method for manufacturing a coil-shaped antenna pattern compatible with the HF band, which involves forming a first portion on one side of a continuous body of a folded base material divided by a fold line, forming a second portion and a third portion on the other side, forming an insulating layer covering a portion of the first portion, overlapping one side of the folded base material with the other side at the fold line to electrically connect the first portion and the second portion, and electrically connecting the ends of the first portion with the third portion while insulating the overlapping portion of the conductor portion in the first portion with the insulating layer, thereby producing a coil-shaped antenna pattern.
[Selected Figure] Figure 1

Description

The present invention relates to a method for manufacturing an antenna pattern and an antenna pattern.

In fields such as product manufacturing, management, and distribution, tags that have product-related information printed visibly on them and are attached to products, and labels that have product-related information printed visibly on them and are affixed to products, are used. In recent years, RFID (Radio Frequency Identification) technology, which transmits and receives information by non-contact communication from an IC chip that has identification information written on it, has been applied to various fields and is becoming more prevalent in these fields as well.

WO 2017/159222 discloses a method for producing an antenna pattern on a substrate by laminating a metal foil for forming an antenna onto a continuous substrate, forming a cut along the periphery of the antenna pattern, and removing unnecessary parts of the metal foil that do not form the antenna pattern.

International Publication No. 2017/159222

For example, in the case of a coil-shaped antenna pattern that complies with the HF band, after cutting out the shape of the antenna, it is necessary to form a bridge (jumper part) to insulate the conductor part of the antenna and to electrically connect the ends of the antenna.

For this reason, it was difficult to continuously form multiple coil-shaped antenna patterns on a continuous substrate using only the method described in WO 2017/159222.

Therefore, the present invention aims to continuously form multiple coil-shaped antenna patterns on a continuous substrate.

According to one aspect of the present invention, there is provided a method for manufacturing an antenna pattern for forming a coil-shaped antenna pattern corresponding to the HF band on a substrate, the method comprising: an adhesive coating step of coating an inner periphery of a first portion of the coil-shaped antenna pattern on one side of the substrate in a width direction relative to the transport direction of the substrate; and coating an inner periphery of a second portion of the coil-shaped antenna pattern and an inner periphery of a third portion of the coil-shaped antenna pattern on the other side of the substrate in the width direction relative to the transport direction of the substrate; and an adhesive coating step of disposing a metal foil continuum constituting the first portion, the second portion, and the third portion on the adhesive-coated surface of the substrate. A method for manufacturing an antenna pattern is provided, the method including: a metal foil arrangement step of forming cuts in the continuum of the metal foil arranged on the continuum along the outer periphery of the first portion, the outer periphery of the second portion, and the outer periphery of the third portion; a removal step of removing a portion of the continuum of the metal foil that does not constitute the coil-shaped antenna pattern; a step of forming an insulating layer in a predetermined region of the first portion; a step of applying a conductive adhesive to electrically connect the first portion, the second portion, and the third portion; and a step of overlapping the one side and the other side in the width direction of the continuum to electrically connect the first portion, the second portion, and the third portion to form the coil-shaped antenna pattern.

According to one aspect of the present invention, multiple coil-shaped antenna patterns can be continuously formed on a continuous substrate.

FIG. 1 is a plan view illustrating a part of a continuous body having an antenna pattern according to an embodiment of the present invention, with a portion cut away. FIG. 2 is a schematic diagram illustrating a manufacturing apparatus for implementing the method for manufacturing an antenna pattern according to an embodiment of the present invention. FIG. 3 is a schematic diagram illustrating a manufacturing apparatus for implementing the method for manufacturing an antenna pattern according to an embodiment of the present invention. FIG. 4 is a plan view illustrating a part of the work (continuum) after the removal step has been performed in the method for manufacturing the antenna pattern. FIG. 5 is a plan view illustrating a part of a work (continuum) after the application of an ultraviolet-curable adhesive in the overlapping step in the method for manufacturing an antenna pattern. FIG. 6 is a plan view illustrating a first modified example of the division of the coil-shaped antenna pattern. FIG. 7 is a plan view illustrating a second modified example of the division of the coil-shaped antenna pattern. FIG. 8 is a plan view illustrating a third modified example of the division of the coil-shaped antenna pattern. FIG. 9 is a plan view illustrating a fourth modified example of the division of the coil-shaped antenna pattern.

The embodiments described below are not limited to the drawings described in the Brief Description of the Drawings.

A first aspect of the present invention is a method for manufacturing an antenna pattern for forming a coil-shaped antenna pattern corresponding to the HF band on a substrate, the method comprising: applying an adhesive to the inside of a periphery line corresponding to a first portion of the coil-shaped antenna pattern on one side of the substrate in a width direction relative to the conveying direction of the substrate; and applying the adhesive to the inside of a periphery line corresponding to a second portion of the coil-shaped antenna pattern and the inside of a periphery line corresponding to a third portion of the coil-shaped antenna pattern on the other side of the substrate in the width direction relative to the conveying direction of the substrate; and applying a metal foil continuum constituting the first portion, the second portion, and the third portion to the surface of the substrate to which the adhesive has been applied. a cutting process for forming cuts in the continuum of the metal foil arranged on the continuum along the outer periphery of the first portion, the outer periphery of the second portion, and the outer periphery of the third portion; a removing process for removing a portion of the continuum of the metal foil that does not constitute the coil-shaped antenna pattern; a process for forming an insulating layer in a predetermined region of the first portion; a process for applying a conductive adhesive for electrically connecting the first portion, the second portion, and the third portion; and a process for forming the coil-shaped antenna pattern by overlapping the one side and the other side of the continuum in the width direction.

According to a first aspect of the present invention, the adhesive is applied to the continuous substrate in the adhesive application process in the area where the first, second and third parts are to be placed, and in the area inside the outer periphery of the first, second and third parts.

Next, in the metal foil placement process, a continuous piece of metal foil is superimposed on the continuous piece coated with adhesive.

Then, in the cutting process, the first part, the second part and the third part are formed.

Next, in the removal process, unnecessary portions of the metal foil continuum that do not constitute the first, second, and third portions are removed.

Next, in the insulating layer formation process, the conductor portion where the third portion overlaps is covered with an insulating layer, except for the connection end of the first portion.

Next, in the process of applying a conductive adhesive, a conductive layer is formed to electrically connect the first part, the second part, and the third part.

Next, one side of the continuous body in the width direction is overlapped with the other side, and the first part, the second part, and the third part are electrically connected to produce a continuous body on which a coil-shaped antenna pattern is formed.

As described above, according to a first aspect of this embodiment, the first, second and third parts, which are shapes obtained by dividing the coil-shaped antenna pattern, are formed on one side (first surface) and the other side (second surface) of the substrate, and when the one side and the other side are deployed, an insulating layer that constitutes the jumper portion is formed.

By dividing the coil shape into a first portion and a second portion, there are no discontinuous portions of the metal foil that would occur if the coil shape were cut out as is, and the metal foil has a continuous shape. This means that in the removal process, the unnecessary portions can be removed without the metal foil being left behind on the continuum.

Furthermore, according to a first aspect of this embodiment, the coil-shaped antenna pattern and bridge portion are completed by folding one side of the substrate in half at the fold line, so that the coil-shaped antenna pattern can be formed continuously in a series of conveying processes without a separate process for forming the bridge portion.

A second aspect of the present invention is a method for manufacturing an antenna pattern according to the first aspect, in which an opening for mounting an IC chip is formed in the continuum in the cutting step.

According to a second aspect of the present invention, in the process of forming the first, second, and third parts of a workpiece in which a continuous body of metal foil is bonded to a continuous body of a base material, openings can be formed simultaneously, thereby reducing the number of steps in the manufacturing process of the antenna pattern.

A third aspect of the present invention is a method for manufacturing an antenna pattern according to the first or second aspect, in which at least a part of the portion of the antenna pattern that extends in a direction intersecting the transport direction is the second portion.

According to a third aspect of the present invention, the first portion does not have any discontinuous portions of the metal foil, and the metal foil has a continuous shape, so that in the removal process, the unnecessary portions can be removed without the metal foil being left behind on the continuous body.

A fourth aspect of the present invention is a method for manufacturing an antenna pattern according to the first or second aspect, in which the coil-shaped antenna pattern is divided into two parts along a line along the conveying direction, one of which is the first part and the other is the second part.

According to a fourth aspect of the present invention, the length of the conductor portion extending in a direction intersecting the conveying direction of the antenna pattern can be shortened in the first and second parts, so that when removing unnecessary parts of the metal foil in the removal process, the metal foil located between the lines of the conductor portion extending in a direction intersecting the conveying direction is less likely to tear.

A fifth aspect of the present invention is a method for manufacturing an antenna pattern according to the first or second aspect, in which the coil-shaped antenna pattern is divided into two parts at an arbitrary angle relative to the conveying direction, one of which is the first part and the other is the second part.

According to a fifth aspect of the present invention, when removing unnecessary portions of the metal foil in the removal process, a pulling stress is applied to the metal foil located between the wires of the conductor portion extending in a direction intersecting an arbitrary angle with the conveying direction in a direction intersecting the pulling direction, so that the metal foil located between the wires of the conductor portion is less likely to tear.

A sixth aspect of the present invention is a method for manufacturing an antenna pattern according to the first or second aspect, in which the first portion is an odd-numbered winding portion in the antenna pattern, and the second portion is an even-numbered winding portion in the antenna pattern.

According to a sixth aspect of the present invention, the width of the metal foil in the inter-wire portion is increased, making it difficult for the metal foil located in the inter-wire portion of the conductor to tear.

A seventh aspect of the present invention is a coil-shaped antenna pattern compatible with the HF band, comprising a first portion formed on a first substrate, an insulating layer formed to cover at least a portion of the first portion, a second portion formed on a second substrate, and a third portion formed on the second substrate and connecting the ends formed on the first portion, in which, when the first substrate and the second substrate are superimposed, the first portion and the second portion are electrically connected, the portion where the conductor portion of the first portion and the third portion overlap is insulated by the insulating layer, and the ends formed on the first portion are electrically connected by the third portion.

According to a seventh aspect of the present invention, a first part, a second part, and a third part, which are shapes obtained by dividing a coil-shaped antenna pattern, are formed on a first substrate part and a second substrate part, and the coil-shaped antenna pattern and a bridge part are completed by overlapping the first substrate part and the second substrate part, thereby providing an antenna pattern that can be easily formed through a simple process.

An eighth aspect of the present invention is the antenna pattern according to the seventh aspect, in which the first portion formed on the first substrate has an IC chip connection portion to which an IC chip is connected, and the second substrate has an opening formed therein through which the IC chip connection portion is exposed when the first substrate and the second substrate are superimposed.

According to an eighth aspect of the present invention, by overlapping the first substrate portion and the second substrate portion, an antenna pattern is provided that allows the IC chip connection portion on which the IC chip is mounted to be exposed through the opening. In addition, by forming an opening in the second substrate, the protrusion of the IC chip mounted on the IC chip connection portion of the first portion can be contained within the thickness of the second substrate, thereby reducing the protrusion of the IC chip.

A ninth aspect of the present invention is the antenna pattern according to the seventh or eighth aspect, in which the antenna pattern is a rectangular coil, and at least a portion of the short side is the second portion.

According to a ninth aspect of the present invention, when the portion formed on the first substrate is overlapped with the portion formed on the second substrate, the connection portion is concentrated in at least a portion of the short side direction of the rectangular coil formed on the second substrate, making it easy to align the portions when overlapping.

A tenth aspect of the present invention is the antenna pattern according to the seventh or eighth aspect, in which the antenna pattern is a rectangular coil, and the antenna pattern is divided in two in the longitudinal direction along a line, one side of which is the first portion formed on the first substrate, and the other side is the second portion formed on the second substrate.

According to a tenth aspect of the present invention, an antenna pattern is provided in which a coil antenna can be formed by overlapping a first substrate portion and a second substrate portion. By dividing the antenna into two, a first portion 21 and a second portion 22 having approximately the same area are obtained, resulting in an antenna pattern that can be easily aligned when overlapping the portions.

An eleventh aspect of the present invention is the antenna pattern according to the seventh or eighth aspect, in which the first portion is an odd-numbered winding portion in the antenna pattern, and the second portion is an even-numbered winding portion in the antenna pattern.

According to an eleventh aspect of the present invention, an antenna pattern is provided in which a coil antenna can be formed by overlapping a first substrate portion and a second substrate portion. By further narrowing the gap between the odd-numbered winding portions and the even-numbered winding portions, the antenna pattern is made smaller overall.

[Antenna pattern]
An antenna pattern 1 manufactured by the method for manufacturing an antenna pattern according to this embodiment will be described.

Figure 1 is a plan view illustrating an antenna continuum 10 having an antenna pattern 1 according to an embodiment of the present invention, with a portion cut away.

Antenna pattern 1 is a coil-shaped antenna pattern formed on a substrate 11 that is folded in half.

In this embodiment, the coil-shaped antenna pattern 1 is a coil antenna that complies with the HF band of 3 MHz to 30 MHz, and can be used as an antenna for wireless communication that supports near field communication (NFC) with a communication distance of approximately 10 cm using a specific frequency band of 13.56 MHz, for example.

In this embodiment, materials that can be used as the substrate 11 (the same applies to the continuum C described below) include papers such as fine paper and coated paper, resin films such as polyvinyl chloride, polyethylene terephthalate, polypropylene, polyethylene, and polyethylene naphthalate, or multilayer films called synthetic paper, which are made by laminating multiple layers of these resin films.

The thickness of the substrate 11 is preferably 25 μm or more and 300 μm or less. When paper is used as the substrate 11, the thickness can be 50 μm or more and 260 μm or less within the above range, and is usually preferably 70 μm or more and 110 μm or less. When a resin film is used as the substrate, the thickness can be 25 μm or more and 200 μm or less within the above range. An appropriate thickness can be selected from these depending on the application.

In this embodiment, the coil-shaped antenna pattern 1 is formed from metal foil and has a first portion 12, a second portion 13, and a third portion 14.

The metal that constitutes the metal foil can be any conductive metal that is typically used to form antennas. Examples include copper and aluminum.

From the viewpoint of reducing manufacturing costs, it is preferable to use aluminum. Also, from the viewpoint of the overall thickness of the RFID inlay or the overall thickness when formed into an RFID medium, and from the viewpoint of manufacturing costs, it is preferable that the thickness of the metal foil is 3 μm or more and 25 μm or less. In this embodiment, aluminum foil having a thickness of 20 μm is used.

The first portion 12 is a part of a continuous coil shape with a connection end 12A formed at one end and a connection end 12B formed at the other end, and has a shape in which a part of the conductor portion in the width direction of the coil shape is cut out. In addition, an IC chip connection portion 15 is formed on a part of the conductor arranged at the outermost part of the first portion 12.

The first portion 12 is formed on one side (referred to as the first surface 11A) of the folded base material 11, which is partitioned by the fold line V (see FIG. 4).

The second portion 13 is a portion of the widthwise conductor portion cut out from the first portion 12, which is a continuous coil shape. In this embodiment, the second portion 13 constitutes at least a portion of the short side of the rectangular coil, and is formed on the second surface 11B.

The second portion 13 is formed on the other side (referred to as the second surface 11B) of the folded base material 11 defined by the fold line V, at a position that will connect to the first portion 12 formed on the first surface 11A when the first surface 11A and the second surface 11B are superimposed.

In this embodiment, the first surface 11A of the substrate 11 corresponds to the first substrate portion. The second surface 11B corresponds to the second substrate portion. In this embodiment, the first surface 11A as the first substrate portion of the substrate 11 and the second surface 11B as the second substrate portion are connected.

When the first surface 11A and the second surface 11B are overlapped by the bend line V, the first portion 12 and the second portion 13 are connected, completing a continuous coil shape.

The third portion 14 constitutes a jumper portion for electrically connecting the connection end 12A and the connection end 12B of the first portion 12 to form a coil shape on a plane.

The third portion 14 is also formed on the second surface 11B. In this embodiment, the third portion 14 is formed on the second surface 11B at a position that connects the connection ends 12A, 12B of the first portion 12 when the first surface 11A and the second surface 11B are overlapped.

In this embodiment, the fold line V has perforations in which cut sections that pass through the continuum C of the base material 11 and uncut sections that do not pass through are arranged alternately.

The fold line V when the first surface 11A and the second surface 11B are unfolded corresponds to one end 10A of the antenna continuum 10 shown in Figure 1, which is the shape after they are stacked together.

In this embodiment, an opening 16 is formed in the second surface 11B so that the IC chip connection portion 15 in the first portion 12 can be exposed through the second surface 11B when the first surface 11A and the second surface 11B are superimposed.

An insulating layer 17 is formed on a portion of the first portion 12 to prevent a short circuit between the conductor portion of the first portion 12 and the third portion 14.

In addition, a conductive layer 18 is disposed at the connection portion where the first portion 12 and the second portion 13 are connected.

As a result, with the first surface 11A and the second surface 11B of the folded base material 11 overlapped, the first portion 12 and the second portion 13 are electrically connected by the conductive layer 18, completing a continuous coil shape.

In addition, the conductor portion of the first portion 12 where the conductor portion and the third portion 14 overlap is covered with an insulating layer 17. Therefore, when the first surface 11A and the second surface 11B are overlapped by the bend line V, the third portion 14 is not short-circuited with the conductor portions other than the connection ends 12A and 12B of the first portion 12, and the connection ends 12A and 12B of the first portion 12 are connected to the third portion 14 (jumper portion). This forms the coil-shaped antenna pattern 1.

After the first surface 11A and the second surface 11B are overlapped, an adhesive layer 19 is applied to the second surface 11B in order to bond them together.

When the first surface 11A and the second surface 11B are overlapped, an IC chip (not shown in FIG. 1) is mounted on the IC chip connection portion 15 exposed from the opening 16, thereby forming an RFID inlay.

In the absence of the opening 16, the mounted IC chip would protrude from the substrate 11. On the other hand, in this embodiment, the opening 16 is formed in the second surface 11B, so that the protrusion of the IC chip mounted on the IC chip connection portion 15 of the first surface 11A can be contained within the thickness of the second surface 11B. This allows the IC chip to be protected by the opening 16, and the protrusion of the IC chip from the substrate 11 can be reduced. Furthermore, the overall thickness of the coil-shaped antenna pattern 1 can also be reduced.

Note that FIG. 1 shows a cut-out portion of second surface 11B when first surface 11A and second surface 11B are superimposed on each other, and second portion 13, third portion 14, opening 16, and adhesive layer 19 are formed on second surface 11B before first surface 11A and second surface 11B are superimposed on each other.

[Method of manufacturing antenna pattern]
Hereinafter, a method for manufacturing an antenna pattern 1 according to an embodiment of the present invention will be described with reference to the drawings.

Figures 2 and 3 are schematic diagrams illustrating a manufacturing apparatus 100 for implementing a method for manufacturing an antenna pattern. Note that although the manufacturing apparatus 100 is shown divided in Figures 2 and 3, it is actually one continuous device.

The manufacturing method of the antenna pattern 1 according to this embodiment is a manufacturing method for forming a coil-shaped antenna pattern compatible with the HF band on a substrate, and includes an adhesive application process P1 for applying an adhesive to a substrate 11 continuum C to attach a metal foil continuum M constituting the antenna pattern, a metal foil arrangement process P2 for arranging the metal foil continuum M on the substrate 11 continuum C, a cutting process P3 for forming a cut along the outer periphery of the shape of the antenna pattern in the metal foil continuum M arranged on the substrate 11 continuum C, and a removal process P4 for removing unnecessary portions Mb of the metal foil, as shown in FIG. 2.

Figure 4 is a plan view illustrating a portion of the workpiece (continuum C) after removal process P4 has been performed in the manufacturing method of antenna pattern 1.

The manufacturing method of the antenna pattern also includes an insulating layer forming process P5 for forming an insulating layer 17 in a predetermined region of the first portion 12, a conductive ink application process P6 for applying a conductive ink as a conductive adhesive to form a conductive layer 18 for electrically connecting the first portion 12, the second portion 13, and the third portion 14, and a superposition process P7 for superposing one side (first surface 11A) and the other side (second surface 11B) in the width direction W of the continuum C.

Figure 5 is a plan view illustrating a portion of the workpiece (continuum C) after the application of the ultraviolet-curable adhesive in the overlapping process P7 in the manufacturing method of the antenna pattern 1.

In the adhesive application process P1 shown in FIG. 2, while the continuum C of the substrate 11 is being transported, adhesive A is applied to one side of the width direction W of the continuum C of the substrate 11 relative to the transport direction F, inside the perimeter line corresponding to the first portion 12 of the antenna pattern 1. In addition, adhesive A is applied to the other side of the width direction W of the continuum C, inside the perimeter line corresponding to the second portion 13 of the antenna pattern 1, and inside the perimeter line corresponding to the third portion 14 of the antenna pattern 1.

Here, one side of the continuum C of the substrate 11 corresponds to the first surface 11A in Figures 1 and 4, and the other side corresponds to the second surface 11B in Figures 1 and 4.

That is, in the region where the first portion 12, the second portion 13, and the third portion 14 of the continuum C of the substrate 11 shown in FIG. 4 are formed, adhesive A is applied to the inside of the outer periphery of the first portion 12, the second portion 13, and the third portion 14.

As shown in FIG. 2, the adhesive application process P1 is performed by an adhesive application unit 110. The arrow F in FIG. 2 indicates the conveying direction of the continuum C.

The adhesive coating unit 110 has an adhesive tank 111 that stores adhesive, a feed roller 112 that feeds adhesive A from the adhesive tank 111, a plate roller 113 that receives adhesive A from the feed roller 112 and transfers it to the continuous body C, and an impression cylinder 114. The adhesive coating unit 110 also has a UV lamp 115 that irradiates the adhesive A with ultraviolet light.

The plate roller 113 is a plate on which a convex pattern 113a corresponding to the shape of the adhesive A to be applied to the continuous body C of the substrate 11 is formed and wound around the plate cylinder. The plate roller 113 has multiple convex patterns 113a formed on it.

The multiple raised patterns 113a are aligned in the feed direction and width direction of the printing roller 113. This allows the adhesive A for the first portion 12, the second portion 13, and the third portion 14 to be simultaneously transferred and applied to the continuum C. Each raised pattern 113a is shaped to fit inside the respective outer peripheries of the first portion 12, the second portion 13, and the third portion 14 arranged on the substrate 11.

The thickness of the adhesive A applied to the continuum C is preferably 3 μm or more and 25 μm or less. If it is 3 μm or more, sufficient adhesive strength is obtained to adhere the first portion 12, the second portion 13, and the third portion 14, and if it is 25 μm or less, the adhesive A will not protrude outside the outer periphery of the first portion 12, the second portion 13, and the third portion 14 due to pressure application. From this perspective, the thickness of the adhesive A is more preferably 3 μm or more and 10 μm or less.

The application position of the adhesive A applied to the area in the continuum C where the first portion 12, the second portion 13, and the third portion 14 are to be arranged is positioned so that the upstream margin in the conveying direction F is wider than the downstream margin in the conveying direction F in the intended area.

If the margins are too wide, the edges of the first part 12, the second part 13, and the third part 14 may lift up or peel off. If the margins are too narrow, the adhesive A may protrude from the outer periphery of the first part 12, the second part 13, and the third part 14.

From this perspective, it is preferable that the upstream margin in the conveying direction F is 50 μm or more and 300 μm or less, and the downstream margin in the conveying direction F is 30 μm or more and 100 μm or less (however, the upstream margin in the conveying direction must be greater than the downstream margin in the conveying direction).

Although not shown in FIG. 2, prior to the adhesive application process P1, a process is carried out to print a reference mark that can be used as a reference for positioning when applying the adhesive to the continuum C and for positioning the cut position when forming the cut for the antenna portion.

Examples of adhesives A that can be used in the adhesive application process P1 include acrylic adhesives, urethane adhesives, silicone adhesives, and rubber adhesives. In this embodiment, it is preferable to use an ultraviolet-curing adhesive, from the viewpoint of applying the adhesive to the transported continuous body C using a flexographic printing or letterpress printing method. In addition, a screen printing method can also be used.

The adhesive strength of adhesive A is preferably 500 gf/25 mm or more in the 180° peel test (JIS Z 0237), more preferably 800 gf/25 mm or more, and even more preferably 1000 gf/25 mm or more. The upper limit of adhesive strength is preferably 2000 gf/25 mm.

In the metal foil placement process P2, a metal foil continuum M is placed on top of the surface of the base material 11 continuum C on the inside of the outer periphery of the first portion 12, the second portion 13, and the third portion 14 on which adhesive A has been applied.

The metal foil placement process P2 is performed by the metal foil placement unit 120. The metal foil placement unit 120 has a pressure roller 121 and a support roller 122.

In the metal foil placement process P2, the metal foil continuum M, which is transported along a transport path separate from the transport path of the continuum C, is superimposed on the surface of the continuum C on which the adhesive A is applied, and is inserted between the pressure roller 121 and the support roller 122 to be bonded together.

Since no adhesive A is present outside the outer periphery of the first portion 12, the second portion 13, and the third portion 14, the metal foil continuum M is not adhered to the continuum C except in the areas that form the first portion 12, the second portion 13, and the third portion 14.

In the cutting process P3, cuts are made in the metal foil continuum M arranged on the base material 11 continuum C along the outer periphery of the first portion 12, the outer periphery of the second portion 13, and the outer periphery of the third portion 14. In addition to the cuts along the outer periphery, an opening 16 for mounting an IC chip and perforations as a fold line V are also made in the cutting process P3.

The cutting step P3 is performed by the cutting unit 130. The cutting unit 130 has a die roll 131 for forming the first portion 12, the second portion 13, the third portion 14, the opening 16 for mounting an IC chip, and perforations as the fold line V in the metal foil continuum M arranged on the continuum C, and an anvil roller 132 that backs up the die roll 131.

The surface of the die roll 131 is formed with a convex blade portion 131a in the shape of the outer circumferential line of the first portion 12, the second portion 13, and the third portion 14. Also, a convex blade portion 131b is formed for forming the opening 16. Also, a convex blade portion 131c is formed for forming the perforation as the fold line V.

The blade height of the convex blade portion 131b from the surface of the die roll 131 is set to a height that can cut only the metal foil. In addition, the blade heights of the convex blade portion 131b and the convex blade portion 131c are set to a height that can cut the substrate 11 and the metal foil.

As a result, the die roll 131 and the anvil roller 132 can sandwich and continuously transport the workpiece, which is made up of a continuous body C of base material 11 bonded to a continuous body M of metal foil, while simultaneously forming the first portion 12, the second portion 13, the third portion 14, the opening 16, and the perforations, thereby reducing the number of steps in the manufacturing process of the antenna pattern 1.

These convex blades 131a, 131b, and 131c can be flexible dies. They can also be made up of engraving blades, embedding blades, etc.

In the removal process P4, unnecessary portions Mb of the metal foil continuum M that do not constitute the antenna pattern 1 are removed.

The removal process P4 is performed by the removal unit 140. The removal unit 140 includes peel rollers 141 and 142. The unnecessary portion Mb of the metal foil is aligned with a portion of the peel roller 141 to change the conveying direction, and the workpiece is aligned with a portion of the peel roller 142 to be conveyed in a direction different from the conveying direction of the unnecessary portion Mb, thereby separating the unnecessary portion Mb of the metal foil from the workpiece made of the continuum C and the continuum M.

The unnecessary parts Mb are collected, regenerated, and reused as a continuous body of metal foil M.

The removal unit 140 also includes a brush 143 for removing the portion cut out from the workpiece to form the opening 16, and a suction unit 144, located upstream of the peel rollers 141 and 142 in the transport direction F.

The brush 143 is provided at a position where the opening 16 on the surface of the continuum C passes through so as to slide against the workpiece. The suction part 144 is provided on the opposite side of the brush 143 across the workpiece.

As a result, the brush 143 comes into contact with the part of the base material 11 that was cut out in the cutting process P3 and the unnecessary part Mb of the metal foil attached to that part of the base material 11, and these are pushed out to the opposite side from the workpiece and sucked up and removed by the suction part 144. This allows the opening 16 to be formed in the workpiece.

By providing the brush 143 and the suction section 144 upstream of the peel rollers 141, 142 in the conveying direction F, the portion of the base material 11 that was cut out from the workpiece to form the opening 16 can be removed before the unnecessary portion Mb is peeled off.

This allows the unnecessary portion Mb to be smoothly separated from the workpiece. In addition, when the unnecessary portion Mb separated from the workpiece is regenerated, no part of the base material 11 other than the metal foil is included in the recovered material.

By going through the removal process P4, a workpiece is obtained in which a first portion 12, a second portion 13, and a third portion 14 made of metal foil are attached to predetermined positions of a continuum C of a substrate 11, as shown in FIG. 4.

Next, in the insulating layer forming process P5 shown in FIG. 3, an insulating layer 17 is formed to cover a predetermined position of the first portion 12. The conductor portion overlapping with the third portion 14, other than the connecting ends 12A and 12B of the first portion 12, is covered with the insulating layer 17 so that the third portion 14 as a jumper portion does not short-circuit with the conductor portion other than the connecting ends 12A and 12B of the first portion 12.

The insulating layer formation process P5 is carried out by the insulating layer formation unit 151.

The insulating layer forming unit 151 includes a pot 151a for storing insulating material B, a delivery roller 151b for delivering insulating material B from the pot 151a, a plate roller 151c and an impression cylinder 151d for receiving insulating material B from the delivery roller 151b and applying it to a continuous body C, and a UV lamp 151e for irradiating insulating material B with ultraviolet light.

The insulating layer 17 is formed in the area where the third portion 14 contacts the conductor portion of the first portion 12 other than the connection ends 12A and 12B of the first portion 12 when the first surface 11A and the second surface 11B are superimposed (see FIG. 5).

The plate roller 151c has a plate on which a convex pattern 151f corresponding to the shape of the insulating material B to be applied to the continuous body C of the substrate 11 is wound around the plate cylinder.

As the insulating material B, for example, a general-purpose ultraviolet-curing ink, medium, or varnish can be used. The thickness of the insulating layer is preferably 2 μm or more and 50 μm or less. If it is less than 2 μm, there is a risk of insufficient insulation. Also, if it exceeds 50 μm, it will be too thick for an RFID inlay, and if a label is manufactured using this, high-quality printing will not be possible with a general-purpose label printer, etc.

The conductive ink application process P6 is then carried out by the conductive ink application unit 152.

In the conductive ink application process P6, conductive ink D is applied to form a conductive layer 18 for electrically connecting the first portion 12, the second portion 13, and the third portion 14.

The conductive ink application unit 152 has a pot 152a that stores conductive ink D, a delivery roller 152b that delivers conductive ink D from the pot 152a, and a plate roller 152c and an impression cylinder 152d that receive the conductive ink D from the delivery roller 152b and apply it to the continuous body C. A conductive layer 18 made of conductive ink D is formed at the connection between the first portion 12 and the second portion 13 and at the connection between the connection ends 12A and 12B of the first portion 12 and the third portion 14 (see FIG. 5).

The plate roller 152c has a plate on which a convex pattern 152f corresponding to the shape of the conductive ink D to be applied to the continuous body C of the substrate 11 is wound.

The conductive ink application unit 152 is not limited to the above-mentioned method, and may be a method of ejecting a fixed amount from a nozzle.

Any conductive adhesive can be used as the conductive ink D. One example is SX-ECA48, a low-temperature curing flexible conductive adhesive manufactured by Cemedine Co., Ltd. Alternatively, a conductive double-sided adhesive tape can be used. A paste containing metal powder can also be applied. Furthermore, the conductive ink D can be printed by inkjet printing.

In the overlapping process P7, one side (first surface 11A) and the other side (second surface 11B) in the width direction W of the continuum C are bonded together, and the first portion 12, the second portion 13, and the third portion 14 are electrically connected to form a coil-shaped antenna pattern 1 on the continuum C of the base material 11 that has been folded in half.

The overlapping process P7 is performed by the overlapping unit 160. The overlapping unit 160 has an inkjet nozzle 161 that applies an ultraviolet-curable adhesive to bond the first surface 11A and the second surface 11B of the continuum C of the substrate 11, and a UV lamp 162 that irradiates the ultraviolet-curable adhesive with ultraviolet light.

The UV-curable adhesive used in this embodiment exhibits adhesiveness when irradiated with UV light. Because the UV-curable adhesive has high fluidity before irradiation with UV light, it can be applied by inkjet printing.

Because the adhesive layer can be formed by inkjet printing, as shown in Figure 5, it can be easily realized even if the area where the adhesive layer is to be formed (coated area S1) and the area where the adhesive layer cannot be formed (non-coated area S2) are designed in a fine pattern.

The overlapping unit 160 also has a partition plate 163 that contacts along a fold line V formed on the continuum C, and rollers 164A, 164B, 165A, and 165B that are arranged in a V shape.

It also has a pair of rollers 166A, 166B that press the overlapped continuum C in the overlapping direction.

The partition plate 163 is pressed against the folded line V of the work being transported, and the work passes between a pair of rollers 164A, 164B and rollers 165A, 165B arranged in a V shape at different angles, causing the ends of the continuum C in the width direction W to bend closer to each other, and the first surface 11A and the second surface 11B to overlap as the work is transported in the transport direction F.

Next, the rollers 166A and 166B press the continuous body C in the overlapping direction, thereby bonding the first surface 11A and the second surface 11B together.

In this embodiment, the workpiece is rotated horizontally around the conveying direction as the axis of rotation by passing through rollers 167A, 167B and rollers 168A, 168B. The workpiece is guided between pressure roller 169A and support roller 169B, and is further pressurized by pressure roller 169A and support roller 169B.

It is preferable that the pressing force applied by the pressure roller 169A and the support roller 169B be 2 kg/cm or more and 6 kg/cm or less.

As a result, the first surface 11A and the second surface 11B of the continuum C are firmly bonded together, and the first portion 12, the second portion 13, and the third portion 14 are joined together to form the antenna continuum 10.

The work (antenna continuum 10) is pressed by pressure roller 169A and support roller 169B, and then wound up by winding roller 102.

In addition, after overlapping and before pressure is applied by the pressure roller 169A and the support roller 169B, a unit may be provided to perform a process of adjusting the width of the work after folding by removing slight misalignments between the first surface 11A and the second surface 11B that occur due to overlapping.

[Action and Effect]
The effects of the manufacturing apparatus 100 for carrying out the above-described method for manufacturing the antenna pattern 1 will be described.

According to the manufacturing device 100 that executes the manufacturing method of the antenna pattern 1 described above, the continuous body C of the substrate 11 that is fed from the feed roller 101 passes between the plate roller 113 and the impression cylinder 114 in the adhesive application process P1, so that the adhesive A is applied to the area where the first part 12, the second part 13, and the third part 14 are to be arranged, and to the area inside the outer periphery of the first part 12, the second part 13, and the third part 14.

Next, in the metal foil placement process P2, a metal foil continuum M is superimposed on the continuum C to which the adhesive A has been applied.

Next, in the cutting process P3, the workpiece consisting of the continuous body C and the metal foil continuous body M is cut into the first portion 12, the second portion 13, the third portion 14, and the opening 16 by a die roll 131 having a convex blade portion 131a formed thereon in the shapes of the first portion 12, the second portion 13, the third portion 14, and the opening 16.

Next, in the removal process P4, unnecessary portions Mb of the metal foil continuum M that do not constitute the first portion 12, the second portion 13, and the third portion 14 are removed.

Next, in the insulating layer forming process P5, the conductor portions overlapping with the third portion 14 are covered with an insulating layer 17, except for the connection ends 12A and 12B of the first portion 12, so that the third portion 14 as a jumper portion does not short-circuit with the conductor portions other than the connection ends 12A and 12B of the first portion 12.

Next, in the conductive ink application process P6, a conductive layer 18 is formed to electrically connect the first portion 12, the second portion 13, and the third portion 14.

Next, in the overlapping process P7, one side (first surface 11A) and the other side (second surface 11B) in the width direction W of the continuum C are overlapped to electrically connect the first portion 12, the second portion 13, and the third portion 14, thereby producing the antenna continuum 10 in which the coil-shaped antenna pattern 1 is formed.

The antenna continuum 10 is pressurized by the pressure roller 169A and the support roller 169B, and then wound up by the winding roller 102.

By carrying out the above steps, a coil-shaped antenna pattern 1 can be formed on the continuum C of the substrate 11.

According to the manufacturing method of the antenna pattern 1 of this embodiment, the first part 12, the second part 13, and the third part 14, which are shapes obtained by dividing the coil-shaped antenna pattern, are formed on the first surface 11A and the second surface 11B of the folded base material 11, and when the first surface 11A and the second surface 11B are unfolded, the insulating layer 17 that constitutes the jumper portion is formed.

By dividing the coil shape into a first portion 12 and a second portion 13, the metal foil is continuous in the continuous region X shown in FIG. 4. Since there are no discontinuous parts of the metal foil that would be created if the coil shape were cut out as is, in the removal process P4, the unnecessary part Mb can be removed without the metal foil being left behind on the workpiece.

Furthermore, according to the manufacturing method of the antenna pattern 1 according to this embodiment, the first surface 11A and the second surface 11B are folded in half at the fold line V to complete the coil-shaped antenna.

According to the manufacturing method of antenna pattern 1, when first surface 11A and second surface 11B are overlapped, the connection portion between first portion 12 and second portion 13 is concentrated in second portion 13, which is at least a part of the short side direction of the rectangular coil, making it easy to align them when overlapping.

In addition, according to the manufacturing method of the antenna pattern 1 of this embodiment, the bridge portion of the coil-shaped antenna is completed by folding the first surface 11A and the second surface 11B in half at the fold line V. This allows the coil-shaped antenna to be formed continuously in a series of conveying processes without performing a process for forming the bridge portion.

In addition, compared to manufacturing methods that use a crimping tool to form a bridge section, or manufacturing methods that prepare and connect a separate jumper section, this method does not damage the base material and can reduce manufacturing man-hours.

In addition, in the overlapping process P7, the ultraviolet-curable adhesive is applied by inkjet printing, and then ultraviolet light is irradiated to develop adhesiveness. Because the adhesive layer can be formed by inkjet printing, it is easy to realize an application pattern in which the area where the adhesive layer is to be formed (coated area S1) and the area where the adhesive layer cannot be formed (non-coated area S2) are finely separated, as shown in Figure 5.

[Division of antenna pattern]
In the manufacturing method according to the embodiment of the present invention, it is sufficient to form a coil-shaped antenna pattern by folding the base material in half. Modified examples 1 to 3 of the division form of the first part, the second part, and the third part for forming the coil-shaped antenna pattern by folding the base material in half will be described below.

<Modification 1>
6 is a plan view illustrating a first modification of the divided form of the first, second and third parts for forming the coil-shaped antenna pattern by folding it in half. For ease of understanding, FIG. 6 shows the state of the workpiece after the removal step P4 in the above-mentioned manufacturing apparatus 100.

Variation 1 is an example in which the coil-shaped antenna pattern 2 is divided into two along the transport direction F, with the structure on one side being formed as the first part 21 on the first surface 11A, and the structure on the other side being formed as the second part 22 on the second surface 11B.

The third part 23 constitutes a jumper part that connects the connection ends 21A and 21B of the first part 21. The third part 23 is formed on the second surface 11B.

This type of division allows the length of the conductor portion Z1 extending in the width direction W of the continuum C to be shortened in the first portion 21 and the second portion 22, making it possible to make the metal foil located between the lines of the conductor portion Z1 extending in the width direction W less likely to tear when removing the unnecessary portions Mb of the metal foil in the removal process P4.

<Modification 2>
Fig. 7 is a plan view for explaining modified example 2 of the divided form of the coil-shaped antenna pattern. Fig. 7 shows the state of the workpiece after the removal step P4.

Variation 2 is an example in which the coil-shaped antenna pattern 3 is divided into two at an arbitrary angle relative to the transport direction F, and one of the structures is formed on the first surface 11A as the first part 31, and the other structure is formed on the second surface 11B as the second part 32.

The third part 33 constitutes a jumper part that connects the connection ends 31A and 31B of the first part 31. The third part 33 is formed on the second surface 11B.

With this type of division, when removing the unnecessary portions Mb of the metal foil in the removal process P4, a pulling stress is applied to the metal foil located between the lines of the conductor portion Z2 extending in a direction intersecting an arbitrary angle with the conveying direction F in a direction intersecting the pulling direction, making it difficult for the metal foil located between the lines of the conductor portion Z2 to tear.

<Modification 3>
Fig. 8 is a plan view for explaining a modified example 3 of the division form of the coil-shaped antenna pattern. Fig. 8 shows the state of the workpiece after the removal step P4.

Variation 3 is an example in which the odd-numbered winding portions of the coil-shaped antenna pattern 4 are formed as first portions 41 on the first surface 11A, and the even-numbered winding portions are formed as second portions 42 on the second surface 11B.

The third part 43 constitutes a jumper part that connects the connection ends 41A and 41B of the first part 41. The third part 43 is formed on the second surface 11B.

As a result, even if an antenna pattern is designed with narrow gaps between the wires of the metal foil, by forming the winding portion separately on the first surface 11A and the second surface 11B, the width of the metal foil in the inter-wire portion during formation is increased, making it possible to make the metal foil located between the wires of the conductor less likely to tear.

<Modification 4>
In the above-described embodiment and variant example 1-3, the first surface 11A as the first substrate portion and the second surface 11B as the second substrate portion of the substrate 11 are connected, and an antenna pattern is formed by folding the substrate 11 so that the substrate 11 is overlapped with the first substrate portion. However, it is not essential that the first substrate portion and the second substrate portion are connected.

In other words, the first substrate part and the second substrate part may be folded in half and overlapped, or the first substrate part and the second substrate part may be prepared as separate, separate substrates, and the antenna pattern may be formed by overlapping and bonding the separate substrates together.

Figure 9 is a plan view illustrating variant 4 of the division of the coil-shaped antenna pattern.

In the antenna pattern 5 shown in FIG. 9, parts that have the same function as the configuration shown in FIG. 4 are given the same numbers and detailed descriptions are omitted.

The substrate 50 applied to the antenna pattern 5 shown in FIG. 9 has a first substrate portion 51 and a second substrate portion 52. A first portion 61 is formed on the surface 51A of the first substrate portion 51. A second portion 62 and a third portion 65 are formed on the surface 52A of the second substrate portion 52.

The antenna pattern 5 shown in FIG. 9 includes a first portion 61 formed on the first substrate portion 51, an insulating layer 63 covering the first portion 61, a second portion 62 formed on the second substrate portion 52, and a third portion 65 formed on the second substrate portion 52 and connecting the connection ends 64A, 64B together.

When the first substrate portion 51 and the second substrate portion 52 are overlapped, the first portion 61 formed on the first substrate portion 51 and the second portion 62 formed on the second substrate portion 52 are electrically connected. The portion where the conductor portion of the first portion 61 and the third portion 65 overlap is covered with the insulating layer 63, so no short circuit occurs.

The third portion 65 formed on the second substrate portion 52 is insulated from the first portion 61 by the insulating layer 63, and the connection ends 64A, 64B formed on the first portion 61 can be electrically connected to each other.

As described above, the antenna pattern 5 can also be formed by stacking the first substrate part 51 and the second substrate part 52 that are prepared separately.

[Other embodiments]
Although the present embodiment has been described above, the above embodiment merely shows one application example of the present invention, and is not intended to limit the technical scope of the present invention to the specific configuration of the above embodiment. The above-mentioned embodiment of the present invention can be modified in various ways without departing from the spirit of the present invention.

The shape of the coil-shaped antenna pattern is not limited to the shapes shown in Figures 1, 6, 7, 8, and 9. For example, the overall shape of the coil may be circular. Also, part of the antenna pattern may include a so-called meander shape.

In the illustrated example, the IC chip connection portion 15 for mounting the IC chip and the opening 16 formed corresponding to the IC chip connection portion 15 are formed in the outermost conductor portion of the coil-shaped antenna pattern, but the IC chip connection portion 15 and the opening 16 formed corresponding to the IC chip connection portion 15 may also be formed in the innermost conductor portion.

In the manufacturing process of the antenna pattern, the order of the insulating layer forming process P5 and the conductive ink application process P6 may be reversed.

In the overlapping process P7, printing using a plate can also be applied instead of inkjet printing.

1, 2, 3, 4, 5 Antenna pattern 10 Antenna continuum 11 Base material (folded in half base material)
LIST OF SYMBOLS 11A First surface 11B Second surface 12 First portion 12A, 12B Connection end 13 Second portion 14 Third portion 15 IC chip connection portion 16 Opening 17 Insulating layer 18 Conductive layer 19 Adhesive layer 21 First portion 21A, 21B Connection end 22 Second portion 23 Third portion 31 First portion 31A, 31B Connection end 41 First portion 41A, 41B Connection end 42 Second portion 43 Third portion 50 Substrate 51 First substrate portion 51A Substrate surface 52 Second substrate portion 52A Substrate surface 61 First portion 62 Second portion 63 Insulating layer 64A, 64B Connection end 65 Third portion 100 Manufacturing apparatus 101 Feed-out roller 102 Wind-up roller 110 Adhesive coating unit 111 Adhesive tank 112 Pay-out roller 113 Plate roller 113a Convex pattern 114 Impression cylinder 115 UV lamp 120 Metal foil arrangement unit 121 Pressing roller 122 Support roller 130 Cutting unit 131 Die roll 131a Convex blade portion 132 Anvil roller 140 Removal unit 141 Peel roller 142 Peel roller 143 Brush 144 Suction unit 151 Insulation layer coating unit 151a Pot 151b Pay-out roller 151c Plate roller 151d Impression cylinder 151e UV lamp 151f Convex pattern 152 Conductive ink coating unit 152a Pot 152b Pay-out roller 152c Plate roller 152d Impression cylinder 160 Overlay unit 161 Inkjet nozzle 162 UV lamp 163 Partition plate 164A, 164B, 165A, 165B, 166A, 166B, 167A, 167B, 168A, 168B Roller 169A Pressure roller 169B Support roller P1 Adhesive coating process P2 Metal foil arrangement process P3 Cutting process P4 Removal process P5 Insulation layer formation process P6 Conductive ink coating process P7 Overlaying process A Adhesive B Insulating material C Continuum of substrate D Conductive adhesive F Transport direction M Continuum of metal foil Mb Unnecessary portion of metal foil V Folded line X Continuum area Z1, Z2 Conductive wire portion

Claims (11)

A method for manufacturing an antenna pattern for forming a coil-shaped antenna pattern compatible with the HF band on a substrate, comprising the steps of:
an adhesive coating step of coating an adhesive on one side of the width direction of the continuous body of the substrate relative to the transport direction of the continuous body of the substrate, on an inside of a periphery line corresponding to a first portion of the coil-shaped antenna pattern, and coating an adhesive on the other side of the width direction of the continuous body of the substrate relative to the transport direction, on an inside of a periphery line corresponding to a second portion of the coil-shaped antenna pattern and an inside of a periphery line corresponding to a third portion of the coil-shaped antenna pattern;
a metal foil arrangement step of arranging a continuous body of metal foil constituting the first portion, the second portion, and the third portion on a surface of the continuous body on which the pressure-sensitive adhesive is applied;
a cutting step of forming cuts in the continuous body of the metal foil arranged on the continuous body along the outer circumferential line of the first portion, the outer circumferential line of the second portion, and the outer circumferential line of the third portion;
a removing step of removing a portion of the metal foil continuum that does not constitute the coil-shaped antenna pattern;
forming an insulating layer on a predetermined area of the first portion;
applying a conductive adhesive to electrically connect the first portion, the second portion, and the third portion;
a step of overlapping the one side and the other side in the width direction of the continuum to electrically connect the first portion, the second portion, and the third portion to form the coil-shaped antenna pattern;
A method for manufacturing an antenna pattern having the above structure. A method for manufacturing an antenna pattern according to claim 1, comprising the steps of:
In the cutting step, an opening for mounting an IC chip is formed in the continuous body.
A method for manufacturing an antenna pattern. A method for manufacturing an antenna pattern according to claim 1, comprising the steps of:
At least a part of a portion of the antenna pattern extending in a direction intersecting the transport direction is the second portion.
A method for manufacturing an antenna pattern. A method for manufacturing an antenna pattern according to claim 1, comprising the steps of:
the coil-shaped antenna pattern is divided into two parts along a line extending in the transport direction, one side being the first portion and the other side being the second portion;
A method for manufacturing an antenna pattern. A method for manufacturing an antenna pattern according to claim 1, comprising the steps of:
the coil-shaped antenna pattern is divided into two at an arbitrary angle with respect to the conveying direction, one side being the first portion and the other side being the second portion;
A method for manufacturing an antenna pattern. A method for manufacturing an antenna pattern according to claim 1, comprising the steps of:
the first portion is an odd-numbered winding portion in the antenna pattern,
The second portion is an even-numbered winding portion in the antenna pattern.
A method for manufacturing an antenna pattern. A coil-shaped antenna pattern compatible with the HF band,
A first portion formed on a first substrate portion;
an insulating layer formed so as to cover at least a portion of the first portion;
A second portion formed on the second base material portion;
a third portion formed on the second base material portion and connecting the ends formed on the first portion;
Equipped with
When the first substrate portion and the second substrate portion are overlapped with each other, the first portion and the second portion are electrically connected to each other, a portion where the conductor portion in the first portion and the third portion overlap is insulated by the insulating layer, and the ends formed on the first portion are electrically connected to each other by the third portion.
Antenna pattern. 8. The antenna pattern of claim 7,
the first portion formed on the first base material portion has an IC chip connection portion to which an IC chip is connected,
an opening is formed in the second base material portion, through which the IC chip connection portion is exposed when the first base material portion and the second base material portion are superimposed on each other;
Antenna pattern. 8. The antenna pattern of claim 7,
The antenna pattern is a rectangular coil, and at least a part of the short side direction is the second portion.
Antenna pattern. 8. The antenna pattern of claim 7,
the antenna pattern is a rectangular coil, and one side of the antenna pattern obtained by dividing the antenna pattern into two parts along a line along the longitudinal direction is the first part formed on the first substrate, and the other side is the second part formed on the second substrate.
Antenna pattern. 8. The antenna pattern of claim 7,
the first portion is an odd-numbered winding portion in the antenna pattern,
The second portion is an even-numbered winding portion in the antenna pattern.
Antenna pattern.

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