JP2008287694A - Manufacturing method and device of conductive member for contactless type data carrier - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To accurately bond a conductive layer to a base material, in manufacturing a conductive member for contactless-type data carriers. <P>SOLUTION: A superimposing step of superposing a conductor 3 on a nonconductive base material 2 so that a nonconductive thermoplastic adhesive layer 6, preformed on a surface of one of the conductor 3 and the nonconductive base material 2, is interposed between them, a punching step of punching the conductor into a prescribed pattern on the base material, and a bonding step of bonding the conductor in the pattern onto the base material by heat are performed in order. By having only a part of the thermoplastic adhesive layer fused to temporarily bond the conductor to the base material prior to the punching step, the conductive layer is bonded accurately to the base material. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method and an apparatus for manufacturing a non-contact data carrier conductive member such as an antenna or a bridge.

  A wireless tag or the like used for a product is manufactured using a non-contact data carrier conductive member such as an antenna.

  Conventionally, when forming an antenna or the like which is a conductive member for a non-contact data carrier with a predetermined pattern, a resist pattern is formed on a metal foil such as aluminum or copper which is a conductor laminated on a base material, and then A pattern such as an antenna is obtained by a chemical method of etching a conductor.

  Since this chemical method involves a complicated manufacturing process and a problem that chemicals such as an etchant must be used, a method of forming an antenna directly from a metal foil using a punching blade has recently been used. It has been. This is to form a thermoplastic adhesive layer in a pattern such as an antenna on a base material such as a synthetic resin film, overlay a metal foil on this, and punch a conductor on the base material in a pattern such as an antenna with a punching blade, Thereafter, the conductor is heated and bonded to the substrate in a pattern such as an antenna. Then, an antenna etc. can be obtained by removing the unnecessary part of a conductor from a base material (for example, refer patent document 1).

JP 2006-277700 A

  In the latter manufacturing method, after the conductor is punched with a punching blade, it is heat-bonded on the substrate for the following reason. That is, if this order is changed and heat bonding is performed with a pattern such as an antenna first, heat is transmitted to the conductor, and unnecessary portions of the conductor are easily bonded to the base material with an adhesive. When an unnecessary part is removed by punching with a punching blade, the unnecessary part is hardly peeled off from the base material. This makes it impossible to form an appropriate antenna or the like on the conductor. If the conductor is punched first, heat is not easily transmitted to unnecessary portions of the conductor when heat-bonding later, and the unnecessary portions are difficult to adhere to the base material, so that it is easy to remove from the base material. Therefore, manufacture of an antenna etc. will be simplified.

  However, if the conductor is punched first and then adhered to the substrate, the necessary part of the conductor adheres to the punching blade side and separates from the substrate together with the punching blade. There is a problem that heat adhesion to the material is hindered, the conductor is likely to be wrinkled and broken, and the yield is reduced accordingly. In addition, in order to perform proper punching while preventing the lifting phenomenon of the necessary parts of the conductor due to the punching blade, it is necessary to finely adjust the protrusion amount of the cutting edge of the punching blade in advance. For example, it takes a long time to prepare for the manufacturing process, resulting in a decrease in manufacturing efficiency.

  Therefore, an object of the present invention is to provide means for solving such problems.

  In order to solve the above problems, the present invention employs the following configuration.

  That is, the invention according to claim 1 includes a non-conductive thermoplastic adhesive layer (6) formed in advance on one surface of either the conductor (3) or the non-conductive substrate (2). A superposition step of overlapping the conductor (3) and the base material (2) so as to sandwich, a punching step of punching the conductor (3) into a predetermined pattern on the base material (2), and In the method for manufacturing a conductive member for a non-contact type data carrier, in which a conductor (3) is bonded to the substrate (2) by heating and bonding in the above pattern, the thermoplastic adhesive layer is formed before the punching step. Only the part of (6) is melted, and the conductor (3) is temporarily bonded to the substrate (2).

  As described in claim 2, in the method for manufacturing a non-contact type data carrier conductive member according to claim 1, the temporary adhesion is performed by attaching the thermoplastic adhesive layer (6) at a plurality of locations in the pattern. It is also possible to carry out by melting in the form of dots.

  As described in claim 3, in the method of manufacturing a non-contact data carrier conductive member according to claim 1, the temporary adhesion is performed by attaching the thermoplastic adhesive layer (6) at a plurality of locations in the pattern. It is also possible to carry out by melting in a line.

  As described in claim 4, in the method for manufacturing a non-contact data carrier conductive member according to claim 1, the unnecessary portion (3e) of the conductor (3) is separated from the base material (2). It is also possible to further include a separating step.

  According to a fifth aspect of the present invention, in the method for manufacturing a non-contact type data carrier conductive member according to the first aspect, the bonding step can be performed by a heating die having a shape in which the pattern is slightly reduced. .

  As described in claim 6, in the method for manufacturing a non-contact data carrier conductive member according to claim 2 or 3, temporary bonding can be further performed at a plurality of locations outside the pattern. It is.

  Further, the invention according to claim 7 includes a non-conductive thermoplastic adhesive layer (6) formed in advance on one surface of either the conductor (3) or the non-conductive substrate (2). Overlaying means (8a, 8b) for overlapping the conductor (3) and the base material (2) and punching the conductor (3) in a predetermined pattern on the base material (2) so as to sandwich In a non-contact type data carrier conductive member manufacturing apparatus including punching means (12a) and bonding means (12b) for heat-bonding the conductor (3) to the base material (2) in the pattern. Before the punching of the conductor (3) by the punching means (12a), only a part of the thermoplastic adhesive layer (6) is melted by the temporary bonding means (9) to remove the conductor (3). It is characterized by being temporarily bonded to the substrate (2).

  8. The manufacturing apparatus for a non-contact data carrier conductive member according to claim 7, wherein the thermoplastic adhesive layer (6) is formed into the pattern by the temporary bonding means (9). It is also possible to temporarily bond the conductor (3) to the substrate (2) by melting it in a dot shape at a plurality of locations.

  9. The manufacturing apparatus for a non-contact data carrier conductive member according to claim 7, wherein the thermoplastic adhesive layer (6) is formed into the pattern by the temporary bonding means (9). It is also possible to temporarily bond the conductor (3) to the base material (2) by melting it linearly at a plurality of locations.

  According to a tenth aspect of the present invention, in the apparatus for manufacturing a non-contact type data carrier conductive member according to the seventh aspect, after the conductor (3) is punched out, the conductor (3) It is also possible that a separating means (16) for separating the unnecessary portion (3e) is further provided.

  As described in claim 11, in the apparatus for manufacturing a non-contact type data carrier conductive member according to claim 7, the bonding means (12b) includes a heating die having a shape in which the pattern is slightly reduced. It is also possible.

  As described in claim 12, in the apparatus for manufacturing a non-contact data carrier conductive member according to claim 8 or 9, the temporary bonding means (23) includes the thermoplastic adhesive layer (6). It is possible to temporarily bond the conductor (3) to the substrate (2) even at a plurality of locations outside the pattern.

  According to the invention which concerns on Claim 1, the nonelectroconductive thermoplastic adhesive layer (6) previously formed in any one surface of a conductor (3) and a nonelectroconductive base material (2) is interposed. A superposition step of overlapping the conductor (3) and the base material (2) so as to sandwich, a punching step of punching the conductor (3) into a predetermined pattern on the base material (2), and In the method for manufacturing a conductive member for a non-contact type data carrier, in which a conductor (3) is bonded to the substrate (2) by heating and bonding in the above pattern, the thermoplastic adhesive layer is formed before the punching step. Since only a part of (6) is melted and the conductor (3) is temporarily bonded to the substrate (2), the pattern can be punched and bonded accurately, and the antenna to be manufactured, etc. Can increase the yield. Moreover, since the conductor (3) can be punched without being displaced on the base material (2), the position of the punching blade, the protruding amount of the blade edge, etc. can be easily adjusted, and the preparation time for manufacturing The manufacturing efficiency can be improved.

  As described in claim 2, in the method for manufacturing a non-contact type data carrier conductive member according to claim 1, the temporary adhesion is performed by attaching the thermoplastic adhesive layer (6) at a plurality of locations in the pattern. When it is performed by melting in a dot shape, air can be prevented from being sealed between the conductor (3) and the base material (2) in the bonding step.

  As described in claim 3, in the method of manufacturing a non-contact data carrier conductive member according to claim 1, the temporary adhesion is performed by attaching the thermoplastic adhesive layer (6) at a plurality of locations in the pattern. When it is performed by melting in a linear form, it is possible to prevent air from being trapped between the conductor (3) and the base material (2) in the bonding step. Moreover, temporary adhesion of the conductor (3) can be performed more accurately.

  As described in claim 4, in the method for manufacturing a non-contact data carrier conductive member according to claim 1, the unnecessary portion (3e) of the conductor (3) is separated from the base material (2). In the case of further including a separation step, the conductive member for the non-contact type data carrier is stored with the unnecessary portion (3e) attached after the pattern formation, and the unnecessary portion (3e) is removed immediately before use. be able to.

  As described in claim 5, in the method for manufacturing a non-contact type data carrier conductive member according to claim 1, when the bonding step is performed by a heating die having a slightly reduced shape of the pattern. The thermoplastic adhesive layer (6) under the contour line of the pattern is hardly melted, and the unnecessary portion (3e) of the conductor (3) can be prevented from adhering to the substrate (2).

  As described in claim 6, in the method for manufacturing a non-contact type data carrier conductive member according to claim 2 or claim 3, temporary bonding is further performed at a plurality of locations outside the pattern. The unnecessary portion (3e) outside the pattern of the conductor (3) can be prevented from separating from the base material (2) in the punching process. As a result, breakage of the pattern of the conductor (3) in the punching process, adhesion of an unnecessary portion (3e) on the pattern in the bonding process, and the like are prevented, and the yield of the non-contact data carrier conductive member is improved. .

  According to the invention which concerns on Claim 7, the nonelectroconductive thermoplastic adhesive layer (6) previously formed in the surface of either one of a conductor (3) and a nonelectroconductive base material (2) is interposed. Overlaying means (8a, 8b) for overlapping the conductor (3) and the base material (2) and punching the conductor (3) in a predetermined pattern on the base material (2) so as to sandwich In a non-contact type data carrier conductive member manufacturing apparatus including punching means (12a) and bonding means (12b) for heat-bonding the conductor (3) to the base material (2) in the pattern. Before the punching of the conductor (3) by the punching means (12a), only a part of the thermoplastic adhesive layer (6) is melted by the temporary bonding means (9) to remove the conductor (3). It is characterized by being temporarily bonded to the base material (2). It can be performed down the punching an adhesive and accurately, thus it is possible to increase the yield of the antenna or the like to be manufactured. Further, since the conductor (3) can be punched without being displaced on the base material (2), the position of the punching blade as the punching means (12a), the protruding amount of the blade tip, etc. can be easily adjusted. Manufacturing preparation time can be shortened and manufacturing efficiency can be increased.

  8. The manufacturing apparatus for a non-contact data carrier conductive member according to claim 7, wherein the thermoplastic adhesive layer (6) is formed into the pattern by the temporary bonding means (9). In the case where the conductor (3) is temporarily bonded to the substrate (2) by melting in a dot shape at a plurality of locations, the conductor (3) and the substrate (2) in the bonding step It is possible to prevent air from being trapped in between.

  9. The manufacturing apparatus for a non-contact data carrier conductive member according to claim 7, wherein the thermoplastic adhesive layer (6) is formed into the pattern by the temporary bonding means (9). When the conductor (3) is temporarily bonded to the base material (2) by melting in a linear shape at a plurality of locations, the conductor (3) and the base material (2) in the bonding step It is possible to prevent air from being trapped in between. Moreover, temporary adhesion of the conductor (3) can be performed more accurately.

  According to a tenth aspect of the present invention, in the apparatus for manufacturing a non-contact type data carrier conductive member according to the seventh aspect, after the conductor (3) is punched out, the conductor (3) ) Is further provided with a separating means (16) for separating the unnecessary portion (3e), the non-contact type data carrier conductive member is stored with the unnecessary portion (3e) attached after pattern formation. The unnecessary part (3e) can be removed immediately before use.

  As described in claim 11, in the apparatus for manufacturing a non-contact type data carrier conductive member according to claim 7, the bonding means (12b) includes a heating die having a shape in which the pattern is slightly reduced. If it is assumed, it is difficult to melt the thermoplastic adhesive layer (6) under the outline of the pattern so that the unnecessary portion (3e) of the conductor (3) does not adhere to the base material (2). it can.

  As described in claim 12, in the apparatus for manufacturing a conductive member for a non-contact type data carrier according to claim 8 or 9, the thermoplastic adhesive layer (6) is formed by a temporary bonding means (23). If the conductor (3) can be temporarily bonded to the substrate (2) even at a plurality of locations outside the pattern, the unnecessary portion (3e) outside the pattern of the conductor (3) is punched out ( It is possible to prevent the unnecessary portion (3e) from separating from the base material (2) when the punching means (12a) is separated from the base material (2). This prevents breakage of the pattern when the pattern is punched, accumulation of the unnecessary portion (3e) in the punching blade, adhesion of the unnecessary portion (3e) onto the pattern at the time of bonding, and the like. The yield of the conductive member for use is improved.

  The best mode for carrying out the present invention will be described below with reference to the drawings.

<Embodiment 1>
As shown in FIG. 1 to FIG. 4, thermoplastic adhesive layers 6 and 7 are respectively provided on the front and back surfaces of the non-contact type data carrier conductive member 1 or the non-conductive base material 2 of the material sheet 1a. The conductors 3 and 4 having the same pattern are laminated and fixed on the thermoplastic adhesive layers 6 and 7, respectively.

  The non-conductive substrate 2 is formed of a synthetic resin sheet or a sheet in which various synthetic resin sheets are laminated. The thickness of the base material 2 is approximately 12 μm to 250 μm. The base material 2 is formed in a rectangular shape in the illustrated example, but may have other desired shapes. For example, polyethylene terephthalate (PET) can be used as the synthetic resin.

  The conductors 3 and 4 are made of, for example, aluminum foil. The thickness of the aluminum foil is about 6 μm to 50 μm. As the conductors 3 and 4, foils such as aluminum alloy, copper, and copper alloy can be used in addition to aluminum foil.

  Of the conductors 3 and 4, the conductor 3 on the surface of the substrate 2 is formed in an antenna pattern and a capacitor electrode pattern, respectively. In addition, the conductors 4 on the back surface of the base member 2 among the conductors 3 and 4 are respectively formed in a bridge pattern and a pattern of the other electrode of the capacitor. 1 to 4A and 4B, reference numeral 3a denotes a conductor corresponding to the antenna pattern, reference numeral 3b denotes a conductor corresponding to one electrode pattern of the capacitor, and reference numeral 4a corresponds to a bridge pattern. The conductor, 4b, indicates a conductor corresponding to the pattern of the other electrode of the capacitor.

  The antenna pattern is a spiral pattern in the illustrated example, but other patterns such as a bar-shaped pattern, a pad-shaped pattern, and a cross-shaped pattern can be used depending on the communication frequency band.

  The bridge pattern is an elongated rectangle in the illustrated example, but can be appropriately changed to other shapes. The conductor 4a constituting the bridge is provided on the opposite side to the conductor 3a constituting the antenna pattern in the illustrated example, but an insulating layer made of a thermoplastic adhesive layer or the like is disposed on the conductor 3a of the antenna. It is also possible to laminate.

  The capacitor pattern is formed in a long and narrow rectangle for one electrode, while the other electrode is formed in a number of electrically connected strips. After the non-contact type data carrier conductive member 1 is completed, the resonance frequency as the non-contact type data carrier conductive member 1 is adjusted by cutting the conductor 4c at the connecting portion between the strips to adjust the capacitance. Can be corrected to an optimum value.

  The laminated sheet shown in FIG. 4 (A) is a material sheet 1a of the non-contact type data carrier conductive member 1, and as shown in FIGS. 4 (B) and 3, a conductor 3c corresponding to the pattern at both ends of the antenna. And the conductor 4a corresponding to the bridge pattern are joined to ensure electrical continuity between the conductors 3 and 4.

  This electrical continuity is performed by performing ultrasonic welding, heating press, or the like in the thickness direction of the substrate 2 between the conductor 3c corresponding to the pattern at both ends of the antenna and the conductor 4a corresponding to the bridge pattern. Is called. Thereby, the recessed part 5 formed in one conductor 3 penetrates the base material 2 and is joined to the other conductor 4. Reference numeral 5a in the figure denotes a joint.

  As shown in FIG. 1, the conductor 3a of the antenna pattern in the material sheet 1a of the conductive member 1 for non-contact data carrier includes a conductor 3d corresponding to the IC chip connection electrode. As shown in FIG. 3, the IC chip 10 is placed on the conductor 3d of the IC chip connection electrode and electrically connected.

  The non-contact type data carrier conductive member 1 in which the IC chip 10 is mounted on the substrate 2 has a label-like IC when the front and back surfaces of the substrate 2 are covered with a desired coating layer for label (not shown). It is a tag or an IC card.

  Next, a method and apparatus for manufacturing the non-contact data carrier conductive member shown in FIGS. 1 and 4A will be described.

  Here, description will be made by taking as an example the formation of the conductor 3 such as the antenna pattern in the material sheet 1a of the conductive member 1 for the non-contact type data carrier.

  As shown in FIG. 5, this manufacturing method includes a superimposing step (I) in which the conductor 3 and the substrate 2 are superposed so as to sandwich the non-conductive thermoplastic adhesive layer 6 therebetween, and the thermoplastic bonding. Temporary bonding step (II) in which only a part of the agent layer 6 is melted to temporarily bond the conductor 3 to the substrate 2 and punching step (III) in which the conductor 3 is punched in a predetermined pattern such as an antenna on the substrate 2 Then, an adhesion process (IV) for heating and bonding the conductor 3 to the base material 2 in the above pattern and a separation process (V) for separating the unnecessary portion 3e of the conductor 3 from the base material 2 are sequentially performed. Yes. Hereinafter, each process and an apparatus for performing each process will be described.

(I) Superimposition process First, the continuous body of the base material 2 and the continuous body of the conductor 3 which is metal foil are prepared. A thermoplastic adhesive layer 6 is laminated on one surface of the conductor 3 of the metal foil by applying a thermoplastic adhesive in advance and drying it. The thermoplastic adhesive layer 6 may be laminated on one side of the continuous body of the substrate 2.

  The substrate 2 is a PET film having a thickness of about 12 μm to 250 μm. Instead of PET, other resins, paper, and the like can be used, and a laminate thereof can also be used.

  As the metal foil, an aluminum foil having a thickness of about 6 μm to 50 μm is used. As the metal foil, aluminum foil, foil of aluminum alloy, copper, copper alloy, etc. can be used.

  The thermoplastic adhesive that becomes the thermoplastic adhesive layer 6 is, for example, hot melt, and is applied to one side of the metal foil or the substrate 2 as the conductor 3 to a thickness of about 1 μm to 5 μm and dried. The thermoplastic adhesive layer 6 is formed solid on a metal foil or a substrate, but may be applied in a pattern corresponding to a predetermined pattern such as the antenna.

  Each continuous body of the conductor 3 and the base material 2 is unwound from a winding roll (not shown), and is passed through nip rollers 8a and 8b as superimposing means so that the thermoplastic adhesive layer 6 is in contact with the base material 2. Superimposed.

  Although not shown in the figure, a marginal punch hole is formed in each continuum of the conductor 3 and the substrate 2, and both continuums are sent in one direction by a pin wheel (not shown) provided with a pin fitted into the marginal punch hole. ing. The pin wheel is disposed downstream of the nip rollers 8a and 8b. In the first embodiment, the pin wheel is intermittently driven, whereby both continuums run intermittently at the same speed in the direction of the arrow. The feed pitch p for this intermittent travel is illustrated in FIG.

(II) Temporary Adhesion Step A flat press machine is disposed on the downstream side of the nip rollers 8a and 8b when viewed in the traveling direction of the continuous body of the conductor 3 and the base material 2. The flat press board includes an upper mold 12 and a lower mold 13 and faces each other with a continuous body in which both molds 12 and 13 are in close contact with each other.

  The upper die 12 is provided with a large number of elongated protrusions 9 corresponding to patterns within one pitch p as temporary bonding means. An electric heating wire (not shown) for heating the protrusion 9 is embedded in the upper mold 12. As shown in FIG. 6, the protrusions 9 are formed on the upper mold 12 at a predetermined interval and arrangement so as to fit within the antenna pattern and the one electrode pattern of the capacitor.

  The lower mold 13 is formed with a flat surface for receiving a large number of protrusions 9. The lower mold 13 and the upper mold 12 sandwich a superposed body in which the upper and lower continuous strips are in close contact with each other.

  The superposed body is sent to the downstream side by one pitch p and temporarily stopped. Therefore, the upper die 12 of the flat press plate reciprocates in the vertical direction, and the protrusion 9 heats and presses the conductor 3 on the substrate 2. Thereby, the thermoplastic adhesive layer 6 of the superposed body is melted in a dot shape at a plurality of locations in the pattern, and the conductor 3 is temporarily bonded to the substrate 2. The shape of temporary bonding by the individual protrusions 9 is circular in the illustrated example, but may be other shapes such as a quadrangle.

(III) Punching process A punching blade 12a corresponding to a pattern such as an antenna is fixed to the upper mold 12 of the flat press board, and a flat surface is formed on the lower mold 13 to receive the punching blade 12a. The flat surface of the lower mold 13 is formed of a sheet such as PET.

  When the superposed body in which the upper and lower continuous strips are in close contact with each other further advances and stops intermittently by one pitch p, the upper die 12 of the flat press plate reciprocates in the vertical direction, and the conductor 3 is moved on the continuous body of the substrate 2. The continuum is punched with a pattern such as an antenna.

  At this time, since the continuum of the conductor 3 is temporarily bonded onto the continuum of the base material 2, it is punched into an accurate pattern without causing a positional shift.

  In addition, since the continuum of the conductor 3 is constrained on the continuum of the base material 2, the conductor 3 is moved to the upper mold when the upper mold 12 is raised even if the punching blade 12 a protrudes greatly toward the lower mold 13. 12 does not separate from the base material 2 by being dragged by 12. For this reason, the protrusion amount of the punching blade 12a can be made relatively large so that the conductor 3 can be punched accurately, and at the same time, the punching blade 12a for preventing dragging of the conductor 3 as in the prior art can be finely performed. There is no need for adjustment, and the production of the pattern can be started promptly.

(IV) Adhesion Step On the upper die 12 of the flat press board, a convex portion 12b corresponding to the antenna pattern is formed adjacent to the punching blade 12a. In the upper mold 12, an electric heating wire (not shown) for heating the convex portion 12b is embedded.

  After the pattern of the antenna or the like is punched out, the superimposed body is further sent downstream by one pitch p and temporarily stopped. Therefore, the upper die 12 of the flat press plate reciprocates in the vertical direction, and the portion of the conductor 3 punched out with the antenna pattern is pressed onto the base material 2 while being heated. Thereby, the thermoplastic adhesive layer 6 corresponding to the pattern of the antenna under the conductor 3 is melted, and the portion corresponding to the pattern of the antenna or the like of the conductor 3 is bonded onto the substrate 2.

  In this bonding process, necessary portions corresponding to the pattern of the antenna or the like of the conductor 3 are already temporarily bonded to the base material 2, so that the pattern of the conductor 3 is accurately bonded to the base material 2 and the conductor 3 is displaced. And wrinkles and breakage are prevented. Further, air can be prevented from being sealed between the conductor 3 and the substrate 2 in the bonding step.

  As shown in FIG. 8, the convex portion 12b of the upper mold 12 for carrying out this bonding step is formed as a heating mold having a shape obtained by slightly reducing the pattern of the antenna or the like. This makes it difficult for the thermoplastic adhesive layer 6 below the pattern outline to melt and prevents the unnecessary portion 3e of the conductor 3 from adhering to the substrate 2, and the conductor 3 in the subsequent separation step can be prevented. Removal of the unnecessary part 3e is simplified.

  The continuous body in which the bonding process and the punching process are completed is then wound and stored in an overlapped state, or sent to the next separation process.

(V) Separation process In addition to the guide roller 14, a separation device is disposed on the downstream side of the flat press plate as viewed in the traveling direction of the continuous body of the superposed conductor 3 and base material 2.

  The separation device includes a suction tube 15 and a separation roller 16. When the continuous body of the base material 2 arrives at the place where the suction pipe 15 and the separation roller 16 are installed, the unnecessary portion 3e of the conductor 3 is sucked by the suction pipe 15, while the continuous body of the base material 2 is guided to the separation roller 16. While running in reverse. Thereby, the unnecessary part 3e of the conductor 3 is appropriately peeled off from the continuous body of the base material 2, and is collected in a collection box (not shown) to which the suction pipe 15 is connected. When the antenna pattern is spiral, the unnecessary portion 3e of the conductor 3 is also generated in a spiral shape. However, when sucked by the suction tube 15 in this manner, the spiral unnecessary portion 3e can be collected smoothly.

  A nozzle 17 for ejecting a gas such as air is disposed at a place where the unnecessary portion 3 e of the conductor 3 is separated from the continuous body of the base material 2. The gas ejected from the nozzle 17 is blown toward the boundary between the continuum of the base material 2 and the unnecessary portion 3e of the conductor 3, whereby the removal and removal of the unnecessary portion 3e of the conductor 3 is promoted. .

  Thereafter, the continuum of the base material 2 is supplied to an apparatus similar to the apparatus shown in FIG. 5, and the continuum of other conductors 4 is superimposed on the back side thereof, so that the bridge pattern shown in FIG. It is formed on the conductor 4 on the back side.

  The provisional bonding can also be performed on the conductor 4 on the back side, and in this case, the upper mold 12 provided with the projections 11 having the arrangement and shape as shown in FIG. 7 can be used. As a result, the conductor 4a corresponding to the bridge pattern and the conductor 4b corresponding to the capacitor electrode pattern are each temporarily bonded onto the substrate 2.

  Further, in the bonding step, as shown in FIG. 9, an upper mold 12 can be used as a heating mold having a shape in which the convex portion 12c is slightly reduced from the pattern such as the bridge.

  Thereafter, the continuum of the base material 2 is subjected to a peeling process to remove the unnecessary portion 3e from the conductor 3, and the conductors 3 and 4 on the front and back sides of the base material 2 as shown in FIG. It is given to the process etc. which join, or is attached to the mounting process of IC chip 10.

<Embodiment 2>
As shown in FIGS. 10 and 11, in the second embodiment, the temporary bonding of the conductor 3 is performed by melting the thermoplastic adhesive layer 6 linearly at a plurality of locations in the pattern. In FIG.10 and FIG.11, the codes | symbols 18 and 19 show the protrusion formed in each upper mold | type as temporary adhesion means.

  As shown in the figure, depending on the location of the pattern, the protrusion 9 can be provided on the upper mold 12 as in the case of the first embodiment, and dot-like temporary bonding can be performed.

  Thus, temporary adhesion of the conductor 3 is performed more accurately by performing the temporary adhesion linearly.

  Adhesion of the conductor 3 to the base material 2 can be performed by the convex portions 12b and 12c shown in FIGS.

  In addition, in FIG.10 and FIG.11, the same part as the case of Embodiment 1 is shown using the same code | symbol, and the overlapping description is abbreviate | omitted.

<Embodiment 3>
As shown in FIG. 12, in the third embodiment, unlike the first embodiment shown in FIG. 5, temporary bonding, punching, and bonding are sequentially performed on the conductor 3 by a roll press.

  In FIG. 12, reference numerals 20, 21, and 22 denote a temporary bonding roll, a punching roll, and an adhesive roll, respectively. The projection 9, the punching blade 12a, and the convex are the same as the upper mold 12 of the flat press board in the first embodiment. The part 12b is provided on the peripheral surfaces of the respective rolls 20, 21, and 22. Further, receiving rolls 20a, 21a, and 22a corresponding to the lower mold 13 of the flat press plate are provided for the temporary bonding roll 20, the punching roll 21 and the bonding roll 22, respectively.

  As shown in FIG. 12, the superposed body of the continuous body of the base material 2 and the continuous body of the conductor 3 that is the metal foil is drawn between the temporary bonding roll 20 and the receiving roll 20a while continuously running. 6 or the same temporary adhesion as shown in FIG. Subsequently, the superimposed body is drawn between the punching roll 21 and the receiving roll 21a, and the conductor 3 is punched into a pattern such as an antenna by the punching blade 12a. Subsequently, it is drawn between the bonding roll 22 and the receiving roll 22a and is thermoplastically bonded to the same shape as the pattern of the antenna or the like by the convex portion 12b on the bonding roll 22 having the pattern as shown in FIG. The agent layer 6 is melted, and the metal foil conductor 3 punched out on the melted thermoplastic adhesive layer 6 is pressed and bonded.

  Subsequently, the superposed body is processed in a predetermined pattern on the back surface through the separation step V in the same manner as in the first embodiment. For processing the back surface, a roll having the protrusions 11 and the protrusions 19 arranged in the same manner as shown in FIG. 7 or FIG. 11 and a roll having the convex portions 12b having the same pattern as shown in FIG. 9 are used.

  In addition, in FIG. 12, the same parts as those in the first and second embodiments are denoted by the same reference numerals, and redundant description is omitted.

<Embodiment 4>
Another manufacturing method and apparatus for the non-contact type data carrier conductive member shown in FIGS. 1 and 4A will be described.

  As in the case of the first embodiment, the formation of the conductor 3 such as an antenna pattern on the material sheet 1a of the non-contact data carrier conductive member 1 will be described as an example.

  As shown in FIG. 13, this manufacturing method includes a superimposing step (I) in which the conductor 3 and the substrate 2 are superposed so that the non-conductive thermoplastic adhesive layer 6 is sandwiched therebetween, and a predetermined antenna or the like. In-pattern temporary adhesion step (II) in which only a part of the thermoplastic adhesive layer 6 is melted in the pattern and the conductor 3 is temporarily adhered to the substrate 2, and a part of the thermoplastic adhesive layer 6 outside the pattern An external pattern temporary bonding step (III) in which only the conductor 3 is melted and temporarily bonded to the substrate 2; a punching step (IV) in which the conductor 3 is punched in a predetermined pattern such as an antenna on the substrate 2; An adhesive process (V) in which 3 is heated and bonded to the base material 2 in the above pattern and a separation process (VI) in which the unnecessary portion 3e of the conductor 3 is separated from the base material 2 are sequentially performed. Hereinafter, each process and an apparatus for performing each process will be described.

(I) Superimposition process First, the continuous body of the base material 2 and the continuous body of the conductor 3 which is metal foil are prepared. A thermoplastic adhesive layer 6 is laminated on one surface of the conductor 3 of the metal foil by applying a thermoplastic adhesive in advance and drying it. The thermoplastic adhesive layer 6 may be laminated on one side of the continuous body of the substrate 2.

  The substrate 2 is a PET film having a thickness of about 12 μm to 250 μm. Instead of PET, other resins, paper, and the like can be used, and a laminate thereof can also be used.

  As the metal foil, an aluminum foil having a thickness of about 6 μm to 50 μm is used. As the metal foil, aluminum foil, foil of aluminum alloy, copper, copper alloy, etc. can be used.

  The thermoplastic adhesive that becomes the thermoplastic adhesive layer 6 is, for example, hot melt, and is applied to one side of the metal foil or the substrate 2 as the conductor 3 to a thickness of about 1 μm to 5 μm and dried. The thermoplastic adhesive layer 6 is formed solid on a metal foil or a substrate, but may be applied in a pattern corresponding to a predetermined pattern such as the antenna.

  Each continuous body of the conductor 3 and the base material 2 is unwound from a winding roll (not shown), and is passed through nip rollers 8a and 8b as superimposing means so that the thermoplastic adhesive layer 6 is in contact with the base material 2. Superimposed.

  Although not shown in the figure, a marginal punch hole is formed in each continuum of the conductor 3 and the substrate 2, and both continuums are sent in one direction by a pin wheel (not shown) provided with a pin fitted into the marginal punch hole. ing. The pin wheel is disposed downstream of the nip rollers 8a and 8b. In the first embodiment, the pin wheel is intermittently driven, whereby both continuums run intermittently at the same speed in the direction of the arrow. The feed pitch p for this intermittent travel is illustrated in FIG.

(II) In-Pattern Temporary Adhesion Step A flat press plate is disposed on the downstream side of the nip rollers 8a and 8b when viewed in the running direction of the continuous body of the conductor 3 and the base material 2. The flat press board includes an upper mold 12 and a lower mold 13 and faces each other with a continuous body in which both molds 12 and 13 are in close contact with each other.

  The upper die 12 is provided with a large number of elongated protrusions 9 corresponding to patterns within one pitch p as temporary bonding means. An electric heating wire (not shown) for heating the protrusion 9 is embedded in the upper mold 12. As shown in FIG. 14, the protrusions 9 are formed on the upper mold 12 at a predetermined interval and arrangement so as to be within the antenna pattern and the pattern of one electrode of the capacitor.

  The lower mold 13 is formed with a flat surface for receiving a large number of protrusions 9. The lower mold 13 and the upper mold 13 sandwich a superposed body in which the two upper and lower continuous bodies are in close contact with each other.

  The superposed body is sent to the downstream side by one pitch p and temporarily stopped. Therefore, the upper die 12 of the flat press plate reciprocates in the vertical direction, and the protrusion 9 heats and presses the conductor 3 on the substrate 2. Thereby, the thermoplastic adhesive layer 6 of the superposed body is melted in a dot shape at a plurality of locations in the pattern, and the conductor 3 is temporarily bonded to the substrate 2. The shape of temporary bonding by the individual protrusions 9 is circular in the illustrated example, but may be other shapes such as a quadrangle.

(III) Out-of-Pattern Temporary Adhesion Process In the upper mold 12, in addition to the protrusion 9 as a temporary adhering means, another protrusion 23 having the same or smaller width or thickness as the protrusion 9 has an antenna within one pitch p. A large number are provided so as to follow the outline of the pattern in the pattern and outside the pattern of one electrode of the capacitor. That is, it is provided corresponding to the unnecessary portion 3 e of the conductor 3.

  When the superimposed body is sent to the downstream side by one pitch p and temporarily stopped, the upper die 12 of the flat press plate reciprocates in the vertical direction, and the protrusion 23 heats the unnecessary portion 3e of the conductor 3 onto the substrate 2. Then press. As a result, the superposed thermoplastic adhesive layer 6 is melted in the form of dots at a plurality of locations outside the pattern, and the unnecessary portion 3 e of the conductor 3 is temporarily bonded to the substrate 2. The shape of temporary bonding by the individual protrusions 23 is circular in the illustrated example, but may be other shapes such as a quadrangle.

  Since the projection 23 for temporary adhesion outside the pattern is attached to the upper mold 12 in the same phase as the projection 9 for temporary adhesion within the pattern, the temporary adhesion process outside the pattern is performed simultaneously with the temporary adhesion process within the pattern. .

  In addition, it is possible to provide the upper mold 12 so that the projection 23 for temporary adhesion outside the pattern is out of phase with the projection 9 for temporary adhesion within the pattern by one pitch p. In that case, unnecessary portions outside the pattern are temporarily bonded after the inside of the pattern is temporarily bonded.

(IV) Punching process A punching blade 12a corresponding to a pattern such as an antenna is fixed to the upper mold 12 of the flat press board, and a flat surface is formed on the lower mold 13 to receive the punching blade 12a. The flat surface of the lower mold 13 is formed of a sheet such as PET.

  When the superposed body in which the upper and lower continuous strips are in close contact with each other further advances and stops intermittently by one pitch p, the upper die 12 of the flat press plate reciprocates in the vertical direction, and the conductor 3 is moved on the continuous body of the substrate 2. The continuum is punched with a pattern such as an antenna.

  At this time, since the inside of the pattern in the continuum of the conductor 3 is temporarily bonded onto the continuum of the base material 2, it is punched into an accurate pattern without causing a positional shift.

  Further, since the outside of the pattern in the continuum of the conductor 3 is temporarily bonded onto the continuum of the base material 2, the unnecessary portion 3e of the conductor 3 is removed from the punching blade 12a even when the punching blade 12a is separated from the base material 2. It remains on the substrate 2 against the separating force. Therefore, when the pattern is punched, the pattern is not broken and the unnecessary portion 3e is not accumulated in the punching blade 12a. In addition, an accident in which the unnecessary portion 3e adheres to the pattern in the next bonding process is prevented.

  Further, the protrusion of the punching blade 12a can be made relatively large so that the conductor 3 can be accurately punched, and at the same time, the fine adjustment of the punching blade 12a to prevent the dragging of the conductor 3 as in the prior art. Is no longer necessary, and the production of the pattern can be started promptly.

(V) Bonding Step On the upper die 12 of the flat press board, a convex portion 12b corresponding to the antenna pattern is formed adjacent to the punching blade 12a. In the upper mold 12, an electric heating wire (not shown) for heating the convex portion 12b is embedded.

  After the pattern of the antenna or the like is punched out, the superimposed body is further sent downstream by one pitch p and temporarily stopped. Therefore, the upper die 12 of the flat press plate reciprocates in the vertical direction, and the portion of the conductor 3 punched out with the antenna pattern is pressed onto the base material 2 while being heated. Thereby, the thermoplastic adhesive layer 6 corresponding to the pattern of the antenna under the conductor 3 is melted, and the portion corresponding to the pattern of the antenna or the like of the conductor 3 is bonded onto the substrate 2.

  In this bonding process, necessary portions corresponding to the pattern of the antenna or the like of the conductor 3 are already temporarily bonded to the base material 2, so that the pattern of the conductor 3 is accurately bonded to the base material 2 and the conductor 3 is displaced. And wrinkles and breakage are prevented. Further, air can be prevented from being sealed between the conductor 3 and the substrate 2 in the bonding step.

  As shown in FIG. 8, the convex portion 12b of the upper mold 12 for carrying out this bonding step is formed as a heating mold having a shape obtained by slightly reducing the pattern of the antenna or the like. This makes it difficult for the thermoplastic adhesive layer 6 below the pattern outline to melt and prevents the unnecessary portion 3e of the conductor 3 from adhering to the substrate 2, and the conductor 3 in the subsequent separation step can be prevented. Removal of the unnecessary part 3e is simplified.

  The continuous body in which the bonding process and the punching process are completed is then wound and stored in an overlapped state, or sent to the next separation process.

(VI) Separation process In addition to the guide roller 14, a separation device is disposed on the downstream side of the flat press plate as viewed in the running direction of the continuous body of the superposed conductor 3 and base material 2.

  The separation device includes a suction tube 15 and a separation roller 16. When the continuous body of the base material 2 arrives at the place where the suction pipe 15 and the separation roller 16 are installed, the unnecessary portion 3e of the conductor 3 is sucked by the suction pipe 15, while the continuous body of the base material 2 is guided to the separation roller 16. While running in reverse. The temporary fixing force of the unnecessary portion 3e to the base material 2 is small, and the unnecessary portion 3e of the conductor 3 is appropriately peeled off from the continuous body of the base material 2 and is recovered in a recovery box (not shown) to which the suction pipe 15 is connected. When the antenna pattern is spiral, the unnecessary portion 3e of the conductor 3 is also generated in a spiral shape. However, when sucked by the suction tube 15 in this manner, the spiral unnecessary portion 3e can be collected smoothly.

  A nozzle 17 for ejecting a gas such as air is disposed at a place where the unnecessary portion 3 e of the conductor 3 is separated from the continuous body of the base material 2. The gas ejected from the nozzle 17 is blown toward the boundary between the continuous body of the base material 2 and the unnecessary portion 3e of the conductor 3, so that the unnecessary portion 3e of the conductor 3 can be easily moved from the temporary bonding position. Peel off.

  After that, the continuum of the base material 2 is supplied to an apparatus similar to the apparatus shown in FIG. 13, and the continuum of other conductors 4 is superimposed on the back side thereof, so that the bridge pattern and the like shown in FIG. It is formed on the conductor 4 on the back side.

  The provisional adhesion can also be performed for the formation on the conductor 4 on the back side. In this case, the projections 11 for temporary adhesion in a pattern and the projections 24 for temporary adhesion outside a pattern having the arrangement and shape shown in FIG. The upper mold 12 provided with can be used. As a result, the conductor 4a corresponding to the bridge pattern and the conductor 4b corresponding to the capacitor electrode pattern are temporarily bonded onto the substrate 2 inside and outside the pattern, respectively.

  Further, in the bonding step, as shown in FIG. 9, an upper mold 12 can be used as a heating mold having a shape in which the convex portion 12c is slightly reduced from the pattern such as the bridge.

  Thereafter, the continuum of the base material 2 is subjected to a peeling process to remove the unnecessary portion 3e from the conductor 3, and the conductors 3 and 4 on the front and back sides of the base material 2 as shown in FIG. It is given to the process etc. which join, or is attached to the mounting process of IC chip 10.

<Embodiment 5>
As shown in FIGS. 16 and 17, in the fifth embodiment, the temporary bonding of the conductor 3 is performed by melting the thermoplastic adhesive layer 6 linearly at a plurality of locations inside and outside the pattern. In FIGS. 16 and 17, reference numerals 18 and 19 denote protrusions formed on the upper molds as the intra-pattern temporary bonding means, and reference numerals 25 and 26 denote protrusions formed on the upper molds as the extra-pattern temporary bonding means. Indicates.

  As shown in the figure, depending on the location of the pattern, the protrusion 9 can be provided on the upper mold 12 as in the case of the first embodiment, and dot-like temporary bonding can be performed.

  Thus, temporary adhesion of the conductor 3 is performed more accurately by performing the temporary adhesion linearly.

  Adhesion of the conductor 3 to the base material 2 can be performed by the convex portions 12b and 12c shown in FIGS.

  In addition, in FIG.16 and FIG.17, the same part as the case of Embodiment 1 is shown using the same code | symbol, and the overlapping description is abbreviate | omitted.

<Embodiment 6>
As shown in FIG. 18, in the sixth embodiment, unlike the fourth embodiment shown in FIG. 13, temporary bonding, punching, and bonding are sequentially performed on the conductor 3 by a roll press.

  In FIG. 18, reference numerals 20, 21, and 22 denote a temporary bonding roll, a punching roll, and an adhesive roll, respectively. The projections 9 and 23, and the punching blade 12a, similar to the upper die 12 of the flat press panel in the fourth embodiment. And the convex part 12b is provided in the surrounding surface of each roll 20,21,22.

  The protrusion 9 in the temporary bonding roll is a protrusion for intra-pattern temporary bonding, and the protrusion 23 is a protrusion for temporary bonding outside the pattern.

  Further, receiving rolls 20a, 21a, and 22a corresponding to the lower mold 13 of the flat press plate are provided for the temporary bonding roll 20, the punching roll 21 and the bonding roll 22, respectively.

  As shown in FIG. 18, the superposed body of the continuous body of the base material 2 and the continuous body of the conductor 3 that is the metal foil is drawn between the temporary bonding roll 20 and the receiving roll 20a while continuously running. 14 or the same temporary adhesion as shown in FIG. Subsequently, the superimposed body is drawn between the punching roll 21 and the receiving roll 21a, and the conductor 3 is punched into a pattern such as an antenna by the punching blade 12a. Subsequently, it is drawn between the bonding roll 22 and the receiving roll 22a and is thermoplastically bonded to the same shape as the pattern of the antenna or the like by the convex portion 12b on the bonding roll 22 having the pattern as shown in FIG. The agent layer 6 is melted, and the metal foil conductor 3 punched out on the melted thermoplastic adhesive layer 6 is pressed and bonded.

  Subsequently, the superposed body is processed in a predetermined pattern on the back surface through the separation step VI in the same manner as in the first embodiment. For processing the back surface, a roll having protrusions 24 and ridges 25 arranged in the same manner as shown in FIG. 15 or 17 and a roll having convex portions 12b having the same pattern as shown in FIG. 9 are used.

  In addition, in FIG. 18, the same part as the case of Embodiment 3 and 4 is shown using the same code | symbol, and the overlapping description is abbreviate | omitted.

It is a surface view of the raw material sheet | seat of the electroconductive member for non-contact-type data carriers manufactured with the method and apparatus which concerns on this invention. It is a reverse view of the raw material sheet shown in FIG. It is a surface view of the electroconductive member for non-contact type data carriers which mounted IC chip. 1A is a cross-sectional view taken along line IVA-IVA in FIG. 1, and FIG. 4B is a cross-sectional view taken along line IVB-IVB in FIG. It is a schematic front view of the apparatus for forming patterns, such as an antenna shown in FIG. It is a top view which shows arrangement | positioning of the processus | protrusion for temporarily adhering a conductor about the surface of a raw material sheet | seat. It is a top view which shows arrangement | positioning of the processus | protrusion for temporarily adhering a conductor about the back surface of a raw material sheet | seat. It is a top view which shows the shape of the convex part for adhere | attaching a conductor on the surface of a raw material sheet. It is a top view which shows the shape of the convex part for adhere | attaching a conductor on the back surface of a raw material sheet. It is a top view which shows arrangement | positioning of the protrusion for performing temporary bonding which concerns on Embodiment 2 of this invention about the surface of a raw material sheet | seat. It is a top view which shows arrangement | positioning of the protrusion for performing temporary adhesion which concerns on Embodiment 2 of this invention about the back surface of a raw material sheet | seat. It is a schematic front view similar to FIG. 5 which shows Embodiment 3 of this invention. It is a schematic front view which shows the manufacturing apparatus which concerns on Embodiment 4 of this invention for forming patterns, such as an antenna shown in FIG. It is a top view which shows arrangement | positioning of the processus | protrusion for temporarily adhering a conductor about the surface of a raw material sheet in Embodiment 4 of this invention. It is a top view which shows arrangement | positioning of the processus | protrusion for temporarily adhering a conductor about the back surface of a raw material sheet in Embodiment 4 of this invention. It is a top view which shows arrangement | positioning of the protrusion for performing temporary adhesion which concerns on Embodiment 5 of this invention about the surface of a raw material sheet | seat. It is a top view which shows arrangement | positioning of the protrusion for performing temporary adhesion which concerns on Embodiment 5 of this invention about the back surface of a raw material sheet | seat. It is a schematic front view similar to FIG. 12 showing Embodiment 6 of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 2 ... Base material 3 ... Conductor 3e ... Unnecessary part of conductor 6 ... Thermoplastic adhesive layer 9, 23 ... Protrusion 12a ... Punching blade 12b ... Convex part

Claims (12)

  A superimposing step of superimposing the conductor and the substrate so as to sandwich a non-conductive thermoplastic adhesive layer formed in advance on one surface of the conductor and the non-conductive substrate; In a method for manufacturing a conductive member for a non-contact type data carrier, in which a punching step of punching the conductor into a predetermined pattern on the substrate and an adhesion step of thermally bonding the conductor to the substrate in the pattern are sequentially performed. A method for producing a conductive member for a non-contact type data carrier, wherein only a part of the thermoplastic adhesive layer is melted and the conductor is temporarily bonded to the substrate before the punching step.   2. The method of manufacturing a conductive member for a non-contact type data carrier according to claim 1, wherein the temporary adhesion is performed by melting the thermoplastic adhesive layer in a dot shape at a plurality of locations in the pattern. A method for manufacturing a conductive member for a contact data carrier.   2. The method of manufacturing a conductive member for a non-contact type data carrier according to claim 1, wherein the temporary bonding is performed by melting the thermoplastic adhesive layer linearly at a plurality of locations in the pattern. A method for manufacturing a conductive member for a contact data carrier.   2. The non-contact data carrier conductive member according to claim 1, further comprising a separation step of separating an unnecessary portion of the conductor from the base material. Manufacturing method.   2. The method of manufacturing a conductive member for a non-contact type data carrier according to claim 1, wherein the bonding step is performed by a heating mold having a shape in which the pattern is slightly reduced. Method.   4. The non-contact type data carrier conductive member according to claim 2, wherein the temporary bonding is further performed at a plurality of locations outside the pattern. Manufacturing method.   Superimposing means for superimposing the conductor and the substrate so as to sandwich a non-conductive thermoplastic adhesive layer formed in advance on one surface of the conductor and the non-conductive substrate, Production of a non-contact type data carrier conductive member comprising punching means for punching the conductor into a predetermined pattern on the base material, and adhesive means for heat-bonding the conductor to the base material in the pattern. In the apparatus, before punching the conductor by the punching means, only a part of the thermoplastic adhesive layer is melted by the temporary bonding means and the conductor is temporarily bonded to the substrate. An apparatus for manufacturing a conductive member for a contact data carrier.   8. The manufacturing apparatus of a conductive member for a non-contact type data carrier according to claim 7, wherein the thermoplastic adhesive layer is melted in a dot-like manner at a plurality of locations in the pattern by the temporary bonding means. An apparatus for manufacturing a non-contact data carrier conductive member, wherein the apparatus is temporarily bonded to the substrate.   8. The non-contact data carrier conductive member manufacturing apparatus according to claim 7, wherein the thermoplastic adhesive layer is melted linearly at a plurality of locations in the pattern by the temporary bonding means. An apparatus for manufacturing a non-contact data carrier conductive member, wherein the apparatus is temporarily bonded to the substrate.   8. The non-contact data carrier conductive member manufacturing apparatus according to claim 7, further comprising a separating means for separating an unnecessary portion of the conductor from the base material after the conductor is punched out. An apparatus for manufacturing a conductive member for a non-contact type data carrier.   8. The non-contact type data carrier conductive member according to claim 7, wherein the bonding means includes a heating die having a shape slightly reduced from the pattern. Manufacturing equipment.   10. The apparatus for manufacturing a conductive member for a non-contact type data carrier according to claim 8 or 9, wherein the temporary adhering means applies the conductor to the substrate even at a plurality of locations outside the pattern. An apparatus for manufacturing a conductive member for a non-contact data carrier, characterized by being temporarily bonded to the substrate.

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