JP2000062355A - Postcard with non-contact ic recording medium and method for mailing the medium via postcard - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a postcard to be mailed with a non-contact IC recording medium by the postcard and a method for mailing the medium by the postcard. SOLUTION: A non-contact IC module 8 is provided between two transparent films 3 and 4 laminated and adhered. A label 1 having a releasably adhered opaque front sheet 11 provided on a transparent film upper part of upside of the films 3, 4 and an adhesive layer 12 provide on a transparent film lower part of a lower side is provided. The label 1 is adhered to a postcard sheet 16 via the adhesive layer 12. Sew lines 17 are formed on an area periphery of the module 8 of the films 3, 4 and on the area of the sheet 16 adhered to the periphery.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a postcard having a non-contact IC recording medium in which a non-contact IC module capable of non-contact communication with an external processing device is incorporated, and a non-contact IC recording medium thereof. It's about how to mail in.

[0002]

2. Description of the Related Art Conventionally, for example, a non-contact type I has been used as a non-contact IC recording medium for contactlessly communicating with an external processing device.
The C card is generally known. These non-contact ICs
The card is usually made of plastic, for example, a 0.76 mm-thick card made of a polyvinyl chloride base material is connected to a data communication coil for inputting and outputting signals without contact and to the data communication coil. Semiconductor integrated circuit (IC
Generally, a non-contact type IC card composed of a chip is built in to form a non-contact type IC card. Since these non-contact type IC cards are usually made of plastic, it is necessary to process and mold the card base material depending on the shape of the built-in non-contact IC module. It is also a factor that hinders the trends in each industry that are trying to improve service by introducing a customer service system. Recently, non-contact IC
The module can be made thinner, and using a polyethylene terephthalate substrate as the card substrate, for example, 0.25 m
A non-contact type IC card having a thickness of m has also been developed.

When an issuer issues these non-contact type IC cards to a customer, a part of the upper side of the continuous form on which guidance texts, etc. accompanying the card is printed is made of a polyvinyl chloride base material. A continuous foam with a card in which a non-contact type IC card having a thickness of 76 mm is removably attached with an adhesive tape is known. This non-contact type IC
The card is used in a contactless customer service system. The continuous form with a card is put on a printer or the like to print out the address, address, name, etc. of the card user on the surface of the continuous form, and then the continuous form. The marginal punches provided on both sides of the sheet are cut off and separated from the horizontal perforations provided for each unit printing of the continuous form into unit sheets for each customer.

After that, the unit paper with the non-contact type IC card is sealed in a window opening envelope, and the non-contact type IC card and the guide text are sent to the customer by mail.
However, in the above method, the continuous foam and the non-contact type IC card are manufactured separately, and then the step of sticking the non-contact type IC card on the continuous form is performed. It is a continuous foamed product that is manufactured with a lot of labor, time and cost. Moreover, the contactless IC card has a relatively high product price, and it takes a lot of time and processing to send the contactless IC card, which is troublesome. Therefore, a contactless customer service system is introduced to improve the service. However, the current situation is that even if one tries to achieve this, it cannot be easily implemented.

[0005]

Therefore, a non-contact type IC
When manufacturing a card, the manufacturing process becomes complicated, and when performing the step of sticking the card on the continuous form,
There is a risk that another card, which is not originally intended to be pasted on the continuous form, may be mistakenly pasted on the continuous form, so it is necessary to carefully manage and check the manufacturing process, and it takes time and effort to manufacture. The manufacturing efficiency was also poor. Further, since the non-contact type IC card is laminated on the continuous form, the thickness of the non-contact type IC card attached part is extremely thicker than other continuous form parts. When printing on a continuous form, the non-contact type IC card is caught in the printer or pressed by the pressure of the feed roller, which causes the IC section in the non-contact type IC card and the coil for data communication. It may be adversely affected and cause a failure of the non-contact type IC card.

Further, when the non-contact type IC card is sent by mail, the non-contact type IC card must be enclosed in an envelope or the like, and the work for mailing such as enclosing and sealing is required. It took a lot of time, time, and cost to manufacture the IC recording medium and mail the non-contact IC recording medium. The present invention is intended to solve the problems of the conventional techniques as described above, and has a non-contact IC module portion for non-contact communication with the outside such as a conventional non-contact type IC card. To provide a non-contact IC recording medium which is not a conventional plastic card substrate but a non-contact IC recording medium composed of a label and a postcard paper substrate, and a method of mailing the noncontact IC recording medium as a postcard. With the goal.

[0007]

In order to achieve the above-mentioned object, a postcard having a non-contact IC recording medium according to the present invention has a non-contact IC module between two transparent films laminated and adhered. An opaque sheet is provided on the upper part of the transparent film above the two transparent films and is releasably attached, and is adhered to the lower part of the transparent film below the two transparent films. A label having an agent layer, the label being adhered to a postcard sheet by the adhesive layer, and being adhered to the peripheral area of the two transparent films including the non-contact IC module and the peripheral area. A cut-out sewing machine is formed in the area of the postcard paper.

According to the method of mailing a non-contact IC recording medium according to the present invention in a postcard, a non-contact IC module is provided between two transparent films laminated and adhered together.
It has an opaque front sheet releasably attached to the upper part of the transparent film on the upper side of the two transparent films, and has an adhesive layer under the transparent film on the lower side of the two transparent films. The label is affixed to the upper part of the postcard paper portion containing the concealment information and mailed as a postcard, the recipient of the postcard peels off the front sheet of the label, and the label and the postcard sheet formed with It is characterized in that the cutout portion is used as a non-contact IC recording medium by cutting out from the sewing machine.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION A non-contact IC module used in the present invention is a reception / transmission coil for receiving and transmitting signals at least in a non-contact manner, and a semiconductor integrated circuit (IC chip) connected to the reception / transmission coil. It is possible to perform communication of data information with an external processing device in a contactless manner by, for example, an electromagnetic induction system or radio waves.

Further, the two transparent films sandwiching the non-contact IC module between them and laminated and adhered from the vertical direction of the non-contact IC module are not particularly limited in material as long as they can be seen through. PE (polyethylene), PET (polyethylene terephthalate), P
P (polypropylene) or the like can be used. When laminating and adhering the above-mentioned two transparent films, an adhesive layer may be formed on each of the surfaces where the two transparent films to be laminated overlap each other, or the non-contact IC module may be adhered. The transparent films may be bonded to each other by applying heat and pressure to the other regions of the two transparent films excluding the region sandwiching the transparent film. Any method can be used as long as the two transparent films are bonded. It's okay.

[0011]

Embodiments of a postcard having a non-contact IC recording medium and a method of mailing a non-contact IC recording medium according to the present invention will be described below in detail with reference to the drawings.
1 is a sectional view showing an embodiment of a label used for a postcard having a non-contact IC recording medium of the present invention, FIG. 2 is a sectional view showing an embodiment of a postcard having a non-contact IC recording medium of the present invention, FIG. 2 is a cross-sectional view showing a state in which the cover sheet is peeled from the state of FIG. 2, FIG. 4 is a cross-sectional view showing a state of cutting the non-contact IC recording medium from the state of FIG. 3 by a cutting machine, and FIG. 5 is a postcard in the present invention. 6 is a plan view of the rear surface of the postcard of FIG. 5, FIG. 7 is a plan view of the front surface of the postcard of FIG. 5 in which the non-contact IC recording medium is cut off, and FIG. 8 is the non-contact of FIG. It is a top view of the back surface of an IC recording medium.

First, an embodiment of a postcard having a non-contact IC recording medium of the present invention will be described with reference to the drawings. FIG. 1 shows a sectional view of an embodiment of a label 1 used for a postcard having a non-contact IC recording medium of the present invention. Label 1
Is a PET having an adhesive layer 2a with a thickness of 50μ on the lower surface.
A transparent film 3 made of (polyethylene terephthalate) and a transparent film 4 made of PE (polyethylene) having a thickness of about 100 μ having an adhesive layer 2 b having a thickness of 50 μ on the upper surface are polymerized to form the adhesive layers 2 a and 2 b. It is bonded and integrated by. Also, the transparent films 3 and 4 described above.
As shown in FIG. 1, between the adhesive layers 2a and 2b respectively provided on the semiconductor integrated circuit (IC
Chip) 5 and the terminal pad 6 of the semiconductor integrated circuit (IC chip) 5 are connected to a data communication coil 7 made of a coated copper wire having a diameter of 10 μ by solder bump processing, and a non-contact IC module 8 is formed. It is built in while being sandwiched.

On top of the transparent film 3, an opaque paper sheet 11 having a concealing layer 9 and a peelable adhesive layer 10 on the lower surface side.
Is peelably attached. The front paper 11 includes the transparent film 3, the front paper 11, the concealing layer 9, and the peelable adhesive layer 1 from the transparent film 3.
When peeling off the 0 part, the front cover 1
A slit 14 is formed in a part of 1. The slit 14 is not always necessary and may be formed as needed depending on the application. The concealment layer 9 on the back surface of the front sheet 11 prevents various information written on the upper part of the postcard sheet 16 from being read from the outside of the front sheet 11 through the front sheet 11. It may be a printing layer such as a tint block or solid printing, or may be an aluminum foil layer.

In the postcard 15 having the non-contact IC recording medium of the present invention, as shown in FIG. 2, the label 1 with the release paper 13 peeled off is provided on the adhesive layer 12 above the postcard paper 16 at a predetermined position. It is attached by. A cut-out sewing machine 17 is formed in the peripheral area of the two transparent films 3 and 4 including the non-contact IC module 8 and in the area of the postcard paper 16 adhered to the peripheral area. The cut-out sewing machine 17 is formed so as to surround the portion in which the non-contact IC module 8 is built in.
Alternatively, the shape may be rectangular as shown in FIG. 2, or any other shape such as an ellipse or a triangle may be selected. Further, the cut-out sewing machine 17 is peeled off by providing a long cutout portion 17a and a short cutout portion 17b as shown in FIG. 5 in order to easily cut out the portion of the non-contact IC recording medium 18 from the postcard paper 16. Easy to peel off when doing.

Postcard paper 16 at the position where the label 1 is attached
As shown in FIG. 5, for example, the usage start date 21 of the membership card is printed or printed on the front side of the postcard, and the front side of the postcard paper 16 until the postcard reaches the recipient as shown in FIG. In the meantime, information content that the third party does not want the third party to know the content of the postcard, such as the member name 19 and the member number 20, is printed or printed. By sticking the label 1 on the portion of the postcard paper 16 in which the information content that the third party does not want to know is described, the described information can be concealed. . On the surface of the front cover 11 of the label 1, precautions for peeling off the front cover 11 are printed as shown in FIG.

As described above, the postcard having the non-contact IC recording medium of the present invention is constituted by sticking the label 1 having the non-contact IC module on the postcard paper 16.

Next, the method of mailing the non-contact IC recording medium according to the present invention by postcard will be described. The sender of the postcard addresses the address, name, etc. of the recipient on the front side of the postcard paper 16 as shown in FIG. The member name 19 and the member number 20 are printed or printed on the back side of the postcard paper 16 with the above mentioned. Then, on the portion on the back side of the postcard paper 16 on which the member name 19, the member number 20 and the like are printed or printed,
After sticking the label 1 as shown in FIG. 6, a cut-out sewing machine 17 is formed on the postcard paper 16 and the two transparent films 3 and 4 of the label 1 and mailed as a postcard.

As shown in FIG. 3, the recipient of the postcard first removes the opaque front sheet 11 which is releasably attached to the upper portion of the transparent film 3 together with the concealing layer 9 and the peelable adhesive layer 10 from the transparent film. 4 is peeled off from the upper part, and then, as shown in FIG. 4, a part of the postcard paper 16 and the two transparent films 3 and 4 of the label 1 is integrally cut from the cut-out sewing machine 17 so that the cut part is not contacted. IC recording medium 1
Own and use as 8. The non-contact IC recording medium 18 is
On the front side, for example, the usage start date 21 of the membership card is printed or printed, and from the back side, the transparent film 3,
The member name 19, member number 20 and the like can be visually confirmed through 4 and the semiconductor integrated circuit (IC
It is visible from the outside that the chip 5 and the non-contact IC module 8 such as the data communication coil 7 are built in.

The non-contact IC recording medium 18 receives and transmits a signal between the non-contact IC module 8 built in the non-contact IC recording medium 18 and an external processing device (not shown), and is transmitted from the external processing device. Corresponding to the generated signal, collation with the information recorded in the memory of the non-contact IC module 8 in advance is performed, and various information processing thereafter is possible only when the collation matches. The present invention can be applied to various non-contact systems without being limited to the above embodiment of the sports club.

When the main body of the postcard 15 having the non-contact IC recording medium of the present invention is used as a non-contact type information medium, the post card shape is not cut out from the cut-out sewing machine 17. It can be carried as it is and used in various non-contact type customer service systems.

The postcard 15 having the non-contact IC recording medium of the present invention may be prepared by using either postcard paper or continuous paper. Especially when continuous paper is used, a marginal punch used when the continuous paper is fed by the printer is formed near both ends of the continuous paper,
Further, if horizontal perforations for separating the continuous paper into each unit paper piece are provided at a predetermined interval, it is efficient in processing a large number of postcards. Further, at that time, since the postcard paper can continuously print various information on the front and back surfaces of the postcard paper by the printer, in addition to the address of the postcard, various information is also recorded on the part of the postcard paper to which the label 1 is attached. Can be printed, so it is very efficient.

[0022]

As described above in detail, the postcard having the non-contact IC recording medium of the present invention and the method of mailing the non-contact IC recording medium by post card are, for example, non-contact type IC cards. A non-contact IC module for communicating with the outside by contact is built in the label and configured.
The label and the postcard paper can be mailed together as a postcard by adhering the label and the postcard paper together, and the label and the postcard paper can be cut out from the cutting machine formed on the postcard so that the noncontact IC recording in a card shape or the like is easy to carry. It can be possessed and used as a medium. In addition, as in the case of sending a conventional contactless IC card by mail, a contactless IC
The card does not need to be enclosed in an envelope or the like, and can be mailed by postcard. In addition, you can hide various information on postcard paper by attaching a label to the information part and mail it without being read by a third party. It is a postcard with high security that can be prevented. Further, since a part of the postcard paper is a non-contact IC recording medium, it is possible to easily make various designs by printing on the postcard paper, and cut out various shapes according to the need or application. By cutting a non-contact IC recording medium of various shapes by forming a sewing machine, the non-contact IC of a free shape I
The C recording medium can be manufactured, and the shape of the non-contact IC recording medium can be widely selected as compared with the conventional non-contact type IC card. Therefore, the non-contact IC of the present invention
The method of mailing a postcard having a recording medium and a contactless IC recording medium by postcard can be widely used in various contactless customer service systems and the like.

[0023]

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing an embodiment of a label used for a postcard having a non-contact IC recording medium of the present invention.

FIG. 2 is a sectional view showing an embodiment of a postcard having a non-contact IC recording medium of the present invention.

FIG. 3 is a cross-sectional view showing a state in which a cover sheet is peeled from the state of FIG.

FIG. 4 is a cut-out state from the state of FIG.
FIG. 3 is a cross-sectional view showing a state in which a C recording medium is cut out.

FIG. 5 is a plan view of the surface of a postcard according to the present invention.

6 is a plan view of the back surface of the postcard of FIG. 5. FIG.

FIG. 7 is a plan view of the surface of the postcard of FIG. 5 with the non-contact IC recording medium cut off.

8 is a plan view of the back surface of the non-contact IC recording medium of FIG.

[Explanation of symbols]

1 label 2a adhesive layer 2b adhesive layer 3 transparent film 4 transparent film 5 Semiconductor integrated circuits (IC chips) 6-terminal pad 7 Data communication coil 8 Non-contact IC module 9 Concealment layer 10 Peelable adhesive layer 11 front paper 12 Adhesive layer 13 Release paper 14 slits 15 Postcard with non-contact IC recording medium 16 postcard paper 17 cutting machine 17a Notch 17b Not cut 18 Non-contact IC recording medium 19 Member name 20 membership number 21 Start date of use

Claims (2)

[Claims] 1. A non-contact IC module is provided between two transparent films that are laminated and adhered together, and an opaque film that is releasably attached to the upper part of the transparent film above the two transparent films. A label having a surface paper and having an adhesive layer under the transparent film below the two transparent films; and the label adhered to a postcard paper by the adhesive layer, A non-contact IC recording medium, wherein a cut-out sewing machine is formed in a peripheral area of a sheet of transparent film including the non-contact IC module and a peripheral area of the postcard paper adhered to the peripheral area. Postcards to have. 2. An opaque non-contact IC module is provided between two laminated and adhered transparent films, and is peelably attached to an upper part of the transparent film above the two transparent films. A label having a surface postcard and having an adhesive layer under the transparent film under the two transparent films is attached to the upper part of the postcard paper portion in which the concealment information is written, and mailed as a postcard. The recipient of the postcard peels off the front cover sheet of the label and cuts out from the cut-out sewing machine formed on the label and the postcard paper, so that the cut-out portion is used as a non-contact IC recording medium. A method of mailing the contactless IC recording medium as a postcard.