JP5708069B2 - Manufacturing method of booklet cover with IC - Google Patents

Description

  The present invention relates to an IC booklet cover manufacturing method and an IC booklet cover manufacturing apparatus, which are used for booklets with an IC such as an electronic passport, and in particular, have an IC provided on the cover portion of the booklet.

  On the other hand, in recent years, personal information has been stored as digital data in an IC (integrated circuit), and an IC chip embedded in a booklet has been developed so that it can be read and written by a reader / writer. It has come to be. As a form to be embedded in a booklet, a form attached to a booklet cover or a form in which an inlay including an IC chip is sandwiched between pages and the pages on both sides are bonded is proposed (Patent Document 1).

  An inlay including an IC chip is a minimum unit of a non-contact IC medium for reading and writing to / from an IC chip without being limited to a passport, and includes an antenna for transmitting and receiving signals and an IC chip connected to the antenna. . The inlay is generally sandwiched between substrates made of resin or the like in order to protect the IC chip and the antenna (Patent Document 2).

  In the case of a booklet with an IC attached to the booklet cover, the booklet paper is combined with an IC booklet cover in which an inlay is bonded to a cover sheet (Patent Document 3). At this time, it is preferable from the viewpoint of easy opening and closing of the booklet that the inlay is separated on the front and back sides and the back portion is an opening. At this time, by providing an adhesive layer on the cover sheet side, it can be easily bonded with a press roll or the like.

  However, when the adhesive layer is exposed on the surface to be pressed and rolled, for example, by providing an opening in the inlay, the adhesive layer provided on the cover sheet is exposed, and the adhesive adheres to the manufacturing apparatus during bonding, and the product There is a problem that product defects occur due to contamination of the product.

Japanese Patent Laying-Open No. 2005-88569 JP 2005-63209 A International Publication No. 2004/080726 Pamphlet

  In view of the above-described problems, an object of the present invention is to provide an IC booklet cover manufacturing method and an IC booklet cover manufacturing apparatus that can easily bond a cover sheet and an inlay and reduce product defects. .

The invention according to claim 1 of the present application made in view of the above problems is a method for manufacturing an IC booklet cover in which a cover sheet and a base sheet including at least one IC module are bonded to each other. An adhesive layer is provided on a surface of the sheet bonded to the base sheet, and the base sheet is provided with an opening in the back portion of the booklet or separated into right and left at the back portion, and the base sheet is placed on the adhesive layer. The cover sheet and the base sheet are arranged so that the adhesive layer of the cover sheet is partially exposed, and the first roll having a width wider than the cover sheet is set to the cover sheet side, and a groove portion is provided. The laminated body is pressed and bonded by a press roll which is provided with a groove portion so that the roll does not come into contact with the exposed adhesive layer and the base sheet side. Which is a method for manufacturing a booklet cover with IC, wherein.
In the invention according to claim 2, the base sheet is connected to the first base material, the second base material, the IC module sandwiched between the first base material and the second base material, and the IC module. The method for manufacturing an IC booklet cover according to claim 1, further comprising an inlay including an antenna.
According to a third aspect of the present invention, an opening for placing an IC module is provided on at least one of the first and second substrates, and a protection is provided between the area of the opening and the IC module. a layer, and the cover sheet so that the protective layer is positioned on the outer surface, Ru manufacturing method der booklet with cover IC according to claim 2, characterized in that bonding the said base sheet .

  According to the manufacturing method and the manufacturing apparatus of the booklet cover with IC of the present invention, when the cover sheet and the base sheet are bonded together, the bonded layer is securely bonded to the exposed portion of the adhesive layer without bringing the roll into contact with the press roll. Can do. For this reason, an IC booklet cover with few product defects can be manufactured without contamination of the IC booklet cover by an adhesive layer material or the like adhering to the roll.

It is a schematic diagram which shows one Embodiment of a booklet cover with IC which concerns on this invention. It is a schematic diagram which shows one Embodiment of a booklet with IC which concerns on this invention. It is a schematic diagram which shows one Embodiment of the multi-faceted IC booklet cover which concerns on this invention. It is a cross-sectional schematic diagram which shows one Embodiment of a booklet cover with IC which concerns on this invention. It is a schematic diagram which shows one Embodiment of a booklet cover manufacturing apparatus with IC which concerns on this invention.

  1A and 1B are schematic views showing an embodiment of a booklet cover with an IC according to the present invention. In the booklet cover 100 with IC of the present invention, a cover sheet 101 and a base sheet 102 provided with at least one IC module are bonded together. In FIG. 1A, the cover sheet and the base sheet are displayed separately. The base sheet is separated into left and right at the back portion 101a of the cover sheet to which the booklet paper is fixed. The IC module may be provided on either one of the left and right base sheets. As shown in FIG. 2, a booklet paper 201 can be fixed to the IC booklet cover 100 at the back portion to form an IC booklet.

  The IC booklet cover can be formed as a multi-sided sheet having a plurality of IC booklet covers in order to improve productivity. As shown in FIGS. 3A and 3B, at least one IC module is provided for each IC booklet cover region. In the example of (A), two booklet cover units with ICs are arranged and cut into pieces by cutting at the boundary (S1) of each booklet cover with ICs. The example of (B) is a configuration example in which two IC-attached booklet cover units are arranged in the same manner, but the left and right base sheets are connected at the blank portion of the base sheet to form a single connection. Each IC booklet cover is cut into pieces by cutting at the boundary (S1) and the connecting portion (S2). In the following description, unless otherwise specified, the multi-faceted IC booklet cover and the individual IC booklet covers will be described without distinction.

  FIG. 4 is a schematic cross-sectional view taken along line S of the booklet cover 100 with IC shown in FIG. An adhesive layer 1012 is provided on the bonding surface of the cover sheet 101 to the base sheet 102. The base sheet 102 is arranged such that an opening is provided in the back portion of the booklet, or a cover sheet separated left and right at the back portion is provided on the adhesive layer so that the adhesive layer of the cover sheet is partially exposed. Has been. As a material for the adhesive layer, a polyester resin, a polyurethane resin, an acrylic resin, an epoxy resin, a vinyl resin, or other thermoplastic resin capable of heat sealing can be used. As the cover sheet base material 1011, a known general cover material such as a paper cloth, a cloth cloth, or a resin base material can be appropriately used. The adhesive layer can be formed by a known general coating method such as gravure printing, screen printing, or slit coating. The thickness of the adhesive layer is preferably not more than the thickness of the base sheet. For example, if the thickness of the adhesive layer is about 100 to 500 μm, the adhesive layer does not protrude onto the base sheet when a standard thickness base sheet is bonded, and even an uneven cover sheet can be bonded sufficiently. Can do.

  In the base sheet 102, an inlay 103 including an IC module 1031 and an antenna 1032 connected to the IC module is formed on at least one of the left and right sheets. In FIG. 4, an inlay sheet 1033 in which an antenna pattern and an IC module are formed is sandwiched between two base sheets. The base sheet base material 1021 is not limited as long as the base sheet base material has good adhesiveness with the adhesive layer of the cover sheet. For example, a porous polyolefin resin can be suitably used. By using a porous resin, the cover sheet is compressed by pressing at the time of bonding, and the laminate thickness becomes uniform. When two base materials of a base sheet are bonded together, it is common to provide an adhesive layer made of a thermoplastic resin on the surfaces to be bonded and to integrate them by heat pressing with a press roll.

  As an inlay formation method, an antenna pattern is formed by etching a metal foil on an inlay sheet, and an IC module is connected to this, or an antenna coil is drawn by embedding an insulation-coated conductor in a substrate, A common method is to connect the end of the conducting wire to the IC module. As another form, you may draw an antenna coil and mount an IC module directly on a base sheet base material, without using an inlay sheet.

  Further, in order to reduce the thickness of the IC module sandwiched between the base sheets, a counterbore hole or an opening may be provided in the IC module mounting portion of the base sheet base material. Furthermore, if the cover sheet side is the inside and the other is the outside of the two base sheets of the base sheet, an IC is exposed to the opening of the outer base sheet when an opening is provided in the outer base sheet base. The module portion may be sealed with a protective layer. As the protective layer, an insulating resin film can be suitably used. In particular, when the inlay sheet is provided with an opening as in the configuration shown in FIG. 4 and an IC module is disposed in the opening and connected to the antenna coil, the protective layer is formed on the IC module or the IC module and the antenna coil. If the inlay sheet and the IC module are not fixed by the protective layer so as to cover only the connecting portion of the cover, the load applied to the IC module against the pressure when the cover sheet 101 and the base sheet 102 are bonded together as will be described later. It is possible to suppress product defects.

  Next, an IC booklet cover manufacturing apparatus according to the present invention will be described. FIG. 5 is a schematic view for particularly explaining a bonding mechanism in the IC booklet cover manufacturing apparatus according to the present invention. The configuration example of FIG. 5 shows an IC booklet cover manufacturing apparatus in which two IC booklet cover units are arranged. The booklet cover manufacturing apparatus with an IC of the present invention includes two rolls (501, 502) for bonding the cover sheet 101 and the base sheet 102 with a press roll. The first roll 501 is disposed so as to hit the cover sheet side. The roll width of the first roll is preferably wider than the cover sheet so that the pressure is uniformly applied to the entire sheet. The first roll is preferably a metal roll having good thermal conductivity in order to heat-press at the time of bonding. The apparatus is connected to a heating device for controlling the temperature so that the surface of the first roll is equal to or higher than the melting temperature of the thermoplastic resin of the adhesive layer. Moreover, you may provide the drive mechanism for rotating a 1st roll.

  The second roll 502 is disposed so as to hit the base sheet side. The second roll is preferably a roll having a flexible surface such as a rubber roll so as not to damage the IC module when pressed. In the case of a rubber roll, a hardness in which Shore A is about 50 to 80 is preferable. The second roll is provided with a groove 5021 so that a region where the base sheet is opened or separated, that is, a region where the adhesive layer of the cover sheet 101 is exposed does not contact the roll. For example, a rubber roll in which rubber is wrapped around a portion other than the region of the groove portion of the roll core can be used. The width of the groove is larger than the width h of the exposed part. Considering the sheet misalignment, the width of the groove is preferably h + ΔG or more, where ΔG is the maximum misalignment value. Moreover, since there exists a possibility that adhesion | attachment of the cover sheet and base sheet of an exposure part vicinity may become inadequate when the width | variety of a groove part is too large, 2 h or less is preferable. The depth of the groove portion may be a depth that does not contact the adhesive layer exposed when the roll surface is deformed at the time of pressing. Further, the booklet cover manufacturing apparatus with IC may include a drive mechanism for rotating the second roll.

  As a configuration other than the above-described bonding mechanism, a conveying mechanism that conveys the cover sheet 101 and the base sheet 102, and a positioning mechanism that overlaps and aligns the cover sheet and the base sheet are appropriately positioned at a position before conveyance of the bonding mechanism. Provided. Further, a cutting mechanism for separating when the IC booklet cover unit is multifaceted or for adjusting the size of the IC booklet cover is provided at a position after the laminating mechanism is carried out.

  Next, a method for manufacturing an IC booklet cover according to the present invention will be described with reference to the manufacturing apparatus shown in FIG. First, the conveyed cover sheet 101 and base sheet 102 are superimposed and aligned. At this time, when the vertical and horizontal sizes of the cover sheet and the base sheet are the same, alignment is easy. Therefore, it is preferable that the left and right base sheets are connected as shown in FIG. When the left and right base sheets are separated, the left and right base sheets are overlapped with the cover sheet while maintaining the distance between the middle back portions.

The overlapped cover sheet 101 and base sheet 102 are inserted into the laminating mechanism so that the cover sheet faces the first roll and the base sheet faces the second roll. At this time, it is preferable to match the center line of the opening or separated region with the center line of the groove so that the region where the adhesive layer of the cover sheet 101 is exposed does not contact the roll. The pressure conveyance in the bonding mechanism may be performed by rotating and conveying either the first roll or the second roll, or rotating the first roll and the second roll in synchronization. You may drive. The thermocompression bonding is preferably performed at a heating temperature of 100 to 150 ° C. and a pressing pressure of about 1 to 10 kgf / cm ² .

  After bonding, the top, bottom, left and right edges are cut to adjust the size of the booklet cover with IC as necessary. In addition, when a plurality of booklet cover units with ICs are multi-faced, for example, as shown in FIG. 3B, the boundary between the left and right base sheet connecting portions and the booklet cover units with ICs is cut. Divide into pieces.

  Further, when the booklet paper 201 is added to form a booklet with an IC, it is preferable to make a booklet after aging treatment for several hours to several days after the press roll.

DESCRIPTION OF SYMBOLS 100 ... Booklet cover with IC 101 ... Cover sheet 102 ... Base sheet 103 ... Inlay 200 ... Booklet with IC 500 ... Booklet cover manufacturing apparatus with IC 501 ... First roll 502 ... Second roll 5022 .. Groove part of second roll

Claims (3)

A manufacturing method of a booklet cover with IC, wherein a cover sheet and a base sheet provided with at least one IC module are bonded together,
An adhesive layer is provided on the bonding surface of the cover sheet with the base sheet,
The base sheet is provided with an opening in the back part of the booklet or separated into right and left at the back part so that the adhesive layer of the cover sheet is partially exposed by providing the base sheet on the adhesive layer. Place and
The laminated body of the cover sheet and the base sheet has the first roll wider than the cover sheet as the cover sheet side, and the second roll having a groove is disposed so that the roll does not contact the exposed adhesive layer. A method of manufacturing a booklet cover with an IC, wherein the laminate is pressed and bonded with a press roll on the base sheet side.   The base sheet includes a first base material, a second base material, and an inlay including an IC module and an antenna connected to the IC module sandwiched between the first and second base materials. The manufacturing method of the booklet cover with IC of Claim 1 characterized by the above-mentioned. At least one of the first and second substrates is provided with an opening for mounting the IC module, and has a protective layer between the area of the opening and the IC module. The method for manufacturing an IC booklet cover according to claim 2, wherein the cover sheet and the base sheet are bonded together so as to be positioned on an outer surface .

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