KR100746703B1 - A Smart-card making method for prevention of its dimple - Google Patents

Abstract

The present invention relates to the manufacture of contact and contactless smart card or combination card, that is, smart card that can be used in contact or contactless,

More specifically, in the manufacturing of smart cards stacked in a sheet arrangement, the contact portion of the upper and lower sheets where the non-contact COB module is embedded, or COB, is located in order to prevent dimples occurring on the back of the mounting portion of the COB module. A convex layer that can act as a cushion is formed on the back side of the printing sheet in which the dam part of the module is located, and then the upper protective film and the printing sheet, the thickness control layer, the lower printing sheet and the lower protective film are laminated in a suitable configuration for the card. The present invention relates to a chip card manufacturing method using a sheet having a convex layer formed as a constituent layer of a stack in a step of sequentially stacking a smart card.

The present invention in the manufacture of a smart card by forming a convex layer that can act as a cushion to prevent dimples on the back of the printing sheet in which the dam portion of the COB module is located; The upper protective layer and the printing layer as the upper layer, the thickness control layer suitable for the thickness of the dam portion of the COB module as the middle layer, and the lower printed layer and the lower protective layer formed with the convex layer for preventing dimples at the lower layer are sequentially matched, and then laminated. The sheets located on the backside of the COB module in the process of forming a laminate by heat and pressure in the laminator by mounting the COB module and placing them between the mirror plates by attaching them with a soldering iron, etc. The dimple is not formed in the portion.

Smart card, COB module, lamination, dimple-proof convex layer

Description

Dimple prevention structure when mounting smart card chip {A Smart-card making method for prevention of its dimple}

1 is a process chart showing a conventional smart card manufacturing process,

2 is a process chart showing a smart card manufacturing process according to the present invention,

3 is a plan view showing a prefabricated smart card manufacturing process according to the present invention

4 is a process chart showing a conventional combination card manufacturing process,

5 is a process chart showing a combination card manufacturing process according to the present invention;

Figure 6 is a plan view showing the form of each component sheet required to manufacture a prefabricated combination card according to the present invention,

7 is a plan view of the back printing sheet having a convex layer for preventing dimples according to the present invention;

8 is a cross-sectional view showing a convex layer for preventing dimples in a COB module and a card according to the present invention;

9 is a cross-sectional view showing a convex layer for preventing dimples inside a card and a COB module applied to the present invention of the combination card;

10 is a cross-sectional view showing a COB module applied to the present invention smart card,

11 is a cross-sectional view showing the configuration of a dimple prevention convex layer applied to a non-contact chip (COB module) embedded in the present invention;

[Explanation of symbols on the main parts of the drawings]

10: lower protective layer 20: lower printed layer

25: dimple prevention convex layer 30: antenna coil insertion layer

31 antenna coil 32 dam position penetration

33: antenna terminal (conductive fiber) 34: antenna terminal (coil)

35 thickness control layer 37 dam penetrating portion of the COB module

40: upper printed layer

42: penetrating portion of the COB module position of the upper printed layer

50: upper protective layer

52: COB module position penetrating portion of the upper protective layer

70: card body 72: recessed groove formed in the card body

100: COB module 101: dam portion of the COB module

104: terminal of the COB module 108: conductive adhesive

111: hot-melt tape 112: ACF

The present invention relates to a combination smart card that can be used as a contact smart card or contact or contactless,

More specifically, a cushion is provided on upper and lower seat portions in which the COB module is located in order to prevent dimples occurring when the contactless chip (COB module) and COB module mounted in the smart card stacked in a sheet arrangement are mounted. After forming a convex layer for preventing dimples, and stacking the upper printing sheet and protective film, the thickness control layer, the lower printing layer and the lower protective film in a stacked configuration of a sheet suitable for the card to form a smart card The present invention relates to a manufacturing method for preventing dimples generated during chip card manufacturing by applying a sheet having a convex layer for preventing dimples on a portion where a COB module is mounted.

That is, the lower printing sheet in which the dam part of the COB module is located in order to prevent dimples generated at the COB module dam position when the COB module is mounted or thermally compressed in the contact smart card or the contact or non-contact combination smart card. A convex layer is formed on the back portion to prevent dimples.

Commonly used types of smart cards include a contact IC card (integrated circuit card) that transmits and receives data through contacts exposed on the surface and a contactless RF card that transmits and receives data wirelessly using a built-in antenna coil. There is a non-contact card.

In general, a smart card is a card made of transparent or opaque synthetic resin sheets such as PVC, ABS, PC, PETG, PET, and the lower protective layer 10, lower printed layer 20, upper printed layer 40 and the upper protective layer of the card Contact IC card and lower protective layer 10, the lower printed layer 20, the antenna coil insertion layer 30 where the antenna coil is positioned, the upper printed layer 50 is sequentially stacked from the bottom to the top There is a contact and contactless combination card having a structure in which the card upper protective layer 50 is sequentially stacked from the bottom to the top.

1 shows a conventional smart card manufacturing process.

Referring to the conventional smart card manufacturing method with reference to this, each of the lower protective layer 10, the lower printed layer 20, the upper printed layer 40 and the card upper protective layer 50 after each stacked sequentially Pressing to form one laminate, applying appropriate heat and pressure is compressed and punched to configure the card body 70.

When the card body 70 is configured, the recessed groove 72 is formed in the card body 70 where the COB module 100 is located, and the hot-melt tape 111 is attached to the recessed groove 72. The rectangular COB module 100 is inserted into the recessed groove 72.

When the rectangular COB module 100 is inserted into the recessed groove 72, the hot-melt tape 111 treated on the back side of the COB module 100 by applying heat and pressure on the COB module 100. The card body 70 is glued to complete one smart card.

However, the smart card manufactured by the above method has a problem in that a dimple phenomenon occurs on the back of the card to which the COB module 100 is attached.

4 shows a conventional combination card manufacturing process.

First, the antenna coil 31 is wound around the edge of the antenna coil insertion layer 30, and a part of the antenna coil 34 connected to the antenna coil is formed.

When the antenna terminal 34 is formed, each of the lower card protection layer 10, the lower printing layer 20, the antenna coil insertion layer 30, the upper printing layer 40, and the upper card protection layer 50 are sequentially formed. After lamination, the card main body 70 is constructed by pressing and forming a single lamination plate to compress and punch by applying appropriate heat and pressure.

When the card main body 70 is constructed, recessed grooves 72 formed in the card main body are formed in the portion where the antenna terminal 34 of the antenna coil 31 is located in the card main body 70, and the recessed grooves 72 are formed. After apply | coating a viscous conductive adhesive 108 to the antenna terminal 34 of the antenna coil 31 exposed inward, the rectangular COB module 100 is inserted into the recessed groove 72.

When the rectangular COB module 100 is inserted into the recessed groove 72, the hot-melt tape 111 and the card body 70 which are treated by the COB module 100 by applying heat and pressure on the COB module 100 are added. At the same time, the combination of the antenna terminal 34 of the antenna coil 31 and the terminal 104 of the COB module 100 is electrically connected to each other by curing the conductive adhesive 108.

However, the combination card manufactured by the above method has a problem in that a dimple phenomenon occurs on the back of the card to which the COB module 100 is attached.

Therefore, the present invention provides a better appearance by providing a simple dimple prevention convex layer to overcome the dimple phenomenon appearing in the conventional non-contact chip, smart card and combination card manufacturing process described above to minimize the appearance defects in the manufacturing process The purpose is to increase the productivity and provide a good smart card and combination card to consumers.

The present invention is a convex layer for preventing dimples, which can act as a cushion on the back printing sheet or COB module dam portion formed in the stacking of various smart cards and combination cards, and the contact portions of upper and lower printed layers contacting the non-contact COB module embedded. Forming a process;

The dimple-preventing convex layer formed in the above process is formed by stacking the upper protective film and the print layer (sheet) suitable for the card, the thickness control layer and the lower print layer and the protective film having the convex layer for preventing dimples formed on the back side. After registration, the COB module is mounted or the sheet which is embedded with the dimple prevention convex layer is composed of the upper and lower sheets of the COB module. Forming a laminate by contacting the mirror plate with heat and pressure in the laminator;

 In this way, the laminated plate formed by using the sheet having the convex layer for preventing dimples does not cause dimples on the back of the IC chip, and manufactures a smart card or a combi card with a good card appearance on the back of the COB module by punching the COB module in the correct position. It is characterized by.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

Here, the same components as in the prior art will be described using the same names and symbols as in the prior art.

2 is a process chart showing a smart card manufacturing process according to the present invention.

First, looking at each layer constituting the card body 70 as follows.

There is an upper protective layer 50 followed by an upper printed layer 40. It consists of a lower printed layer 20 and a lower protective layer 10 in which a convex layer 25 is formed to suitably fit the thickness adjusting layer 35 for adjusting the thickness of the card and prevent dimples.

Then, the laminated sheets are bonded and fixed with heat or the like using a tool so as not to shake and move. Then, the laminated sheets are made and integrated by appropriate heat and pressure, and then punched in place to form the card main body 70. A recess groove 72 is formed where the COB module is located, and a rectangular COB module 100 having a hot-melt tape 111 attached thereto is inserted into the recess groove 72.

When the rectangular COB module 100 is inserted into the recessed groove 72, the hot-melt tape 111 and the card body 70 that are treated by the COB module 100 by applying heat and pressure on the COB module 100 are formed. Glued to complete one smart card.

3 is a plan view showing a prefabricated smart card manufacturing process according to the present invention.

There is an upper protective layer 50 in which the COB module position penetrating portion 52 of the upper printing layer is formed, followed by an upper printing layer 40 in which the penetrating portion 42 is formed.

The lower printed layer 20 and the lower protective layer having the convex layer 25 formed therein to suitably fit the thickness adjusting layer 35 having the dam position penetrating portion 37 for adjusting the thickness of the card in the middle and preventing dimples. It consists of (10).

Then, the laminated sheets are bonded and fixed by heat using a tool so as not to shake and move. Then, the COB module 100 with the hot-melt tape 111 is attached to the recessed grooves 72 with appropriate heat and pressure. After laminating the lamination board with proper heat and pressure in the laminator, it is integrated and punched in place to complete the smart card.

5 is a process chart showing a combination card manufacturing process according to the present invention.

The upper layer of the antenna coil insertion layer 30 having the antenna coil 31 and the antenna terminal 34 formed thereon is an upper printed layer 40 and a card upper protective layer 50, and a lower layer is a convex layer for preventing dimples ( The lower printed layer 20 and the lower protective layer 10 having the 25 formed thereon are sequentially stacked, and then pressed to form a single laminated plate to be compressed and punched by applying appropriate heat and pressure to form a card body 70.

When the card main body 70 is constructed, recessed grooves 72 formed in the card main body are formed in the portion where the antenna terminal 34 of the antenna coil 31 is located in the card main body 70, and the recessed grooves 72 are formed. After applying the viscous conductive adhesive 108 to the antenna terminal 34 of the antenna coil 31 exposed inward, the rectangular COB module 100 with the hot-melt tape 111 is attached to the recess groove 72. Insert in

When the rectangular COB module 100 is inserted into the recess 72, the hot-melt tape 111 and the card body 70 that are treated by the COB module 100 by applying heat and pressure on the COB module 100 are added. One combi card without dimples by connecting the antenna terminal 34 of the antenna coil 31 and the terminal 104 of the COB module 100 electrically connected to each other by curing the conductive adhesive 108 at the same time. Is completed.

Figure 6 is a plan view showing the form of each component sheet required to manufacture a prefabricated combination card according to the present invention.

Looking at each laminated sheet from the upper layer, there is an upper protective layer 50 having a COB module position penetrating portion 52 and then an upper printed layer 40 having a penetrating portion 42.

The antenna coil insertion layer 30 of the antenna coil 31 is bonded or energized by the COB module 100 and the ACF 112 or bonded to the hot-melt tape 111 and energized by the conductive adhesive 108. .

And a lower printed layer 20 having a convex layer 25 formed thereon to suitably fit the antenna coil thickness adjusting layer 35 having the COB module dam 101 through hole 37 formed therein and to prevent dimples; It is composed of a lower protective layer (10). Each laminated sheet is bonded and fixed with heat using a tool so as not to shake, and then laminated sheets are made and integrated by appropriate heat and pressure, and then punched in place to complete the combination card.

As described above, when the smart card COB module 100 and the combination card COB module 100 are attached, the dimple prevention convex layer 25 as shown in FIG. 7 is formed by the chip laminating device or the lamination of the card by the laminator. need.

As a material which comprises the dimple prevention convex layer 25, it is as follows.

The dimple-preventing convex layer 25 has a good dimple-preventing effect as long as it is an elastic material. Various vinyl adhesive tapes (e.g. PVC, PP, etc.) and paper tapes showed good dimple prevention effects, but especially emulsion type vinyl-acetate aqueous resins, UV coating agents or UV inks (e.g., polyurethan-acrylate) The dimple prevention effect was excellent in the application example.

Hereinafter, the present invention will be described in detail with reference to preferred embodiments of the present invention.

Example 1

In the case of adhesive tapes, commercially available tapes are paper, PVC, PP, etc., and the thickness is 0.05∼0.20mm, the components are rubber, hot-melt, vinyl, and the thickness is 0.01∼0.03mm.

The adhesive tape is cut from a suitable square area of 0.5 cm 2 to 1.6 cm 2 and pasted on the back surface of the sheet to prevent dimples to form the dimple prevention convex layer 25.

The sheet thus formed was laminated together with a plurality of sheets to perform the process of mounting the COB module 100, and as a result, the dimple prevention effect against heat and pressure was excellent.

Example 2

In applying the emulsion type vinyl-acetate-based aqueous resin to the back side of the sheet or the back side of the lower print sheet 20 to prevent dim by screen printing, the area should be 0.5 cm2 to 1.5 cm2. The height of the convex layer forms the convex layer 25 in the range of 40 to 120 m.

This method was poor in drying and workability due to the ink characteristics of the aqueous type, but the sheet formed with the dimple-preventing convex layer 25 formed in this manner was stacked together with a plurality of sheets, and thus the COB module 100 was mounted. The dimple prevention effect against was excellent.

Example 3

 UV printing varnish (polyester-acrylate, urethane-acrylate, epoxy-acrylate) is applied to the back surface of the sheet to prevent dimples or to the back of the lower printed sheet 20 by screen printing. In this case, the area is 0.5 cm 2 to 1.5 cm 2, and the height of the convex layer is about 40 μm to 120 μm to form the convex layer 25.

This method has the advantage of increasing the precision and productivity by drying the convex layer formed using UV light. The dimple-preventing convex layer formed thereon was formed by stacking the sheets together with a plurality of sheets to perform the process of mounting the COB module 100. As a result, the dimple prevention effect against heat and pressure was excellent.

As described above, the sheet having the convex layer 25 formed therebetween to prevent dimples between the laminated sheets is formed by the lower printed layer 20 of the COB module 100 or the upper and lower sheets of the non-contact chip embedded. Smart card and combi card to overcome the dimples on the back of the COB module 100 in the card and combi card manufacturing process, to provide a better appearance, to minimize the appearance defects in the manufacturing process and to increase productivity accordingly. Can be provided.

As described above, by providing the convex layer for preventing the dimple phenomenon according to the present invention to eliminate the dimple phenomenon on the back of the COB module that appears during the lamination processing of the contactless COB module to be embedded or when the COB module is mounted in the smart card and combination card manufacturing process, It is to provide an effect of improving the quality and productivity by providing a better appearance.

Claims (7)

In stacking a plurality of sheets constituting the card body 70 of the smart card and the combination card, the COB module 100 and the dam portion of the lower printed layer 20 or the lower printed layer 20 on which the COB module 100 is mounted. Dimple prevention structure when chip mounting, characterized in that the lamination so that the dimple prevention convex layer (25) is formed in a portion where the 101 is located. The non-contact COB module 100 and the dam portion 101 to be embedded is laminated so that the dimple prevention convex layer 25 is formed in one portion of the lower printed layer 20 and the upper printed layer 40. Dimple-proof structure when chip mounting for cards. The plastic film (eg, PVC, PP, etc.) according to claim 1 or 2, wherein the dimple-preventing convex layer 25 is formed on the printing layer of the portion where the COB module 100 and the dam portion 101 are located. Cards characterized in that the convex layer is formed by using an adhesive tape based on synthetic resin, paper, emulsion type vinyl-acetate-based aqueous resin, polyurethane-acrylate-based UV coating agent or UV ink. Dimple-proof structure for chip mounting. The method according to claim 1 or 2, wherein in forming the dimple prevention convex layer 25 in the portion where the dam portion 101 of the COB module 100 is located, the area is within 0.5 cm 2 to 1.6 cm 2, and the thickness is 40 μm. Dimple prevention structure when chip mounting for a card, characterized in that formed in 120㎛. 4. The dimple-proof structure for chip mounting of a card according to claim 3, wherein the adhesive tape has a thickness of 0.05-0.20 mm, a component of which is rubber, hot-melt and vinyl, and has a thickness of 0.01-0.03 mm. 5. The card according to claim 4, wherein the card is formed by screen printing and a quantitative dispenser by forming the convex layer 25 for preventing dimples in the sheet of the portion where the dam portion 101 of the COB module 100 is located. Dimple-proof structure for chip mounting. [3] The convex layer 25 of claim 1 or 2, wherein the laminated printed layer or sheet comprises a transparent or opaque synthetic resin sheet made of PVC, PC, PETG, PET, ABS, or the like. Dimple-proof structure when mounting chip for card.

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