JP2009140387A - Ic card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC card with excellent quality wherein a level difference specification and total thickness specification of a card base member and an IC module are secured stably by applied pressure, a temperature condition, etc. when fitting the IC module into the recess portion of the card base member to fix. <P>SOLUTION: The IC card includes a plastic card base member having the recess portion at a predetermined place and the IC module having an external connection terminal on one side of a module substrate and having an IC chip resin-molded on the other side. The recess portion of the plastic card base member has a first recess portion, a second recess portion close to the center of the bottom surface of the first recess portion, and a projection which is formed on the bottom surface surrounding the second recess portion and supports the IC module. The IC module is fitted into the recess portion such that the external connection terminal faces the outside of the card. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an IC card in which an IC module is bonded and fixed to a concave portion of a card substrate by wire bonding or the like. Specifically, the present invention relates to an IC card in which the level difference between the IC card surface on which the IC module is bonded and fixed to the concave portion of the card base and the external connection terminal of the IC module is uniform, and the bonding quality is stabilized.

  Conventionally, a card called a magnetic card is generally known for the purpose of storing and processing important and large amount of data such as a cash card.

  In recent years, the use of cards called IC cards in which an IC module formed by resin molding an IC chip on the lower surface of an IC substrate is mounted on these magnetic cards is increasing.

  Furthermore, in addition to the contact IC card used by connecting the terminal electrode of the IC card and an external device, the antenna is built in, and data is exchanged with the external device in a non-contact manner by radio waves or electrostatic coupling. The use of contact type IC cards is increasing. And since there is no need to insert and remove the card, the demand is increasing for the reason that the maintenance of the external device can be reduced.

  In addition, a composite IC card having a contact function with the former terminal electrode and a non-contact function for data communication by wireless communication is devised for the purpose of supporting a single purpose card for various purposes. Has been.

  The composite IC card is a card body composed of a card base material, an antenna sheet, and a card base material, a terminal electrode for contact communication, an IC module substrate, an IC chip having a contact communication function and a non-contact communication function, and an IC module side It consists of an IC module consisting of connection terminals.

  On the antenna sheet, an antenna for non-contact communication and a connection terminal on the antenna side are provided. The card base is provided with a mounting hole for the IC module, and the connection terminal on the IC module side of the IC module embedded in the mounting hole is connected to the connection terminal on the antenna side.

  Further, the composite IC card is generally manufactured as follows. An antenna sheet having a metal antenna for contactless communication formed by winding or etching and a connection terminal on the antenna side is sandwiched between card substrates and laminated. Thereafter, a mounting hole for the IC module is opened by counterboring or the like to manufacture a card body.

  At this time, the two antenna-side connection terminals for connection with the IC module are exposed inside the IC module mounting hole of the card body, and a conductive thermal adhesive layer is formed there. In addition, a thermal adhesive layer is also formed in a shallow and zagged portion of the IC module mounting hole.

  These IC cards are obtained by forming a recess in a card base made of a vinyl chloride resin or acrylonitrile-butadiene-styrene (ABS) resin and bonding and fixing an IC module to the recess.

This IC card is expected to store a large amount of important data, especially compared to magnetic cards, etc., and it is most necessary to prevent IC module failures (IC chip breakage, bonding wire breakage, etc.) It is.

  Further, the IC card is generally weak against bending stress, and a load applied to the card base is transmitted to the IC module. That is, the IC card owner generally stores it in a wallet or the like, and puts the wallet in a pocket such as trousers.

  For this reason, there has been a problem that the IC module itself as well as the IC module itself is affected by the bending of the IC card, and the function thereof is damaged. Therefore, in order to prevent these damage accidents, many methods for bonding and fixing the IC module to the concave portion of the card base have been studied.

  For example, in an IC card, a shallow first recess at a predetermined position of a card base and a deep second recess in the vicinity of the center thereof are cut stepwise to form a recess. An IC card is known in which an IC module in which an IC chip is resin-molded at the center of the lower surface of an IC substrate is bonded and fixed with an adhesive or the like in the recess.

In addition, the IC card is provided with a notch portion having the same depth as the concave portion that absorbs bending stress from the outside in the concave portion of the card base and outside the adhesive fixing region of the IC module. There has been proposed an IC card configured such that even if bending stress is applied to the base material, the base material is stopped at the notch and is not transmitted to the IC module (for example, see Patent Document 1).
Proposed in

  Furthermore, an IC card has also been proposed that prevents loss of important data due to a failure by adopting a structure that reduces the ratio of the IC module to bending stress applied to the IC card as much as possible (for example, patents). Reference 2).

  This IC card has a first recess and a stepped recess formed by a second recess in the vicinity of the center of the card base at a predetermined position by cutting or the like, and an IC module is fitted into this recess and bonded and fixed. It is.

  In order to prevent damage to the IC chip and disconnection of the bonding wire due to bending stress applied to the IC card, reinforcement is performed on the back surface side of the IC substrate 21 of the IC module and around the resin mold part through an adhesive film. A plate is provided, and is further fitted into and fixed to the concave portion of the card base material via an adhesive film.

Prior art documents are shown below.
Japanese Patent Laid-Open No. 2-80299 JP-A-10-29391

  When the IC module is fitted and fixed in the recess of the card base, there is a problem that the height of the IC module after bonding varies depending on the pressure and temperature conditions to be applied.

  For this reason, there is a problem that it is difficult to stably ensure the level difference between the design surface of the card base and the external connection terminal surface of the IC module.

  Further, the adhesive flows in the gap between the IC module and the first concave portion, and a convex portion higher than the design surface of the card substrate is generated. In addition, there is a problem that a card that does not satisfy the total thickness standard of the card is generated.

  The present invention has been made in view of the above-described conventional problems, and the problem is that, when the IC module is fitted and fixed in the concave portion of the card base, the pressure after application is changed depending on the pressure and temperature conditions applied. It is an object of the present invention to provide an IC card with excellent quality, in which the height difference of the IC module does not vary, and the step standard and the total thickness standard between the card base and the inserted IC module are stably secured.

In order to solve the above problems, the invention according to claim 1 of the present invention provides:
An IC card comprising an IC module having a plastic card base having a recess at a predetermined location, an external connection terminal on one side of the module substrate, and an IC chip molded with resin on the opposite side,
The concave portion of the plastic card substrate supports the IC module on the concave first concave portion, a concave second concave portion in the middle of the bottom surface of the first concave portion, and the bottom surface around the second concave portion. A convex part is formed,
The IC module is an IC card that is fitted in the recess so that the external connection terminal faces the outside of the card.

Next, the invention according to claim 2 of the present invention is as follows.
The IC module is bonded to the recess by an adhesive sheet,
2. The IC card according to claim 1, wherein a portion corresponding to the convex portion is removed from the adhesive sheet.

Next, the invention according to claim 3 of the present invention is
3. The IC card according to claim 1, wherein a height of the convex portion from the bottom surface is provided in any of 0.02 mm to 0.05 mm.

Next, the invention according to claim 4 of the present invention is
4. The IC card according to claim 1, wherein the convex portion is formed by providing a metal layer in a pattern on the bottom surface. 5.

  Since the IC card of the present invention has the above-described configuration, quality can be stabilized when the IC module and the card substrate are bonded and fixed.

  Further, when the IC module is fitted and fixed in the concave portion of the card base, the IC module can be produced uniformly without variations in the applied pressure and temperature conditions.

  Furthermore, an IC card with excellent quality satisfying the level difference between the design surface of the card base and the external connection terminal surface of the IC module, the total thickness standard of the card, and the like can be produced.

  The IC card of the present invention will be described in detail below with reference to the drawings along the embodiments.

FIG. 1 is a schematic diagram illustrating an example of a recess into which an IC module formed on a card substrate of an IC card of the present invention is fitted. (A) is the figure seen from the counterbore side of a recessed part, (b) said (a
It is a figure which shows the AA 'line cross section of).

  As shown in FIGS. 1 (a) and 1 (b), the IC card of the present invention has a recess 1 into which an IC module is fitted at an appropriate location of the card base 2.

  The concave portion 1 is formed by cutting a shallow first concave portion 3 and a deep second concave portion 4 in the vicinity of a central portion thereof in a step shape. A plurality of convex portions 5 are formed on the surface of the first concave portion 3 at the boundary portion between the first concave portion 3 and the second concave portion 4 which are cut in a step shape. The locations where the plurality of convex portions 5 are formed are not limited to the first concave portion 3 surface of the boundary portion 6 between the first concave portion 3 and the second concave portion 4. For example, as shown in FIG. 4, the convex portion 5 may be formed at a substantially central position between the left and right surfaces 7 and 8 and the upper and lower surfaces 9 and 11 of the first concave portion 3.

  Furthermore, instead of the plurality of convex portions 5 formed on the surface of the first concave portion 3, a metal pattern whose surface is coated with an adhesive sheet made of an insulating member may be formed. And when providing this metal pattern, the counterbore process which forms the 1st recessed part 3 surface turns into a plane process.

  As the metal material forming the metal pattern, for example, any one or two of a simple substance or a metal compound of a low melting point metal such as tin, bismuth, indium, lead, cadmium, tellurium, aluminum, silver, or a mixture thereof is used. More than one material is used.

  The card substrate 2 may be made of other materials as long as it can be formed into a sheet shape such as plastic resin, synthetic paper, and paper.

  As the plastic resin, resins such as polyvinyl chloride, ABS (acrylonitrile butadiene styrene), PET (polyethylene terephthalate), PC (polycarbonate), PE (polyimide), and epoxy are used. Moreover, you may mix glass fiber, a glass bead, or a titanium oxide, a pigment, calcium carbonate, etc. in these resin in order to adjust intensity | strength and a color.

  And the card | curd base material 2 can use the lamination sheet which laminated | stacked the single sheet | seat formed in the sheet form using the said resin, or the sheet | seat which consists of these resin. And as the card | curd base material 2, the direction of a lamination sheet is used preferably rather than a single-piece | unit sheet.

  The sheet is laminated by a normal laminating method, such as a wet lamination method, a sandwich lamination method, a dry lamination method, a thermal lamination method, a solventless lamination method, an extrusion lamination method, a T-die extrusion molding method, a T-die co-extrusion lamination method. This is done by the method, the inflation method, the co-extrusion inflation method and the like.

  Further, when laminating, the sheet is subjected to treatment such as corona treatment, ozone treatment, frame treatment, etc. in order to improve adhesion.

  Furthermore, when laminating the sheets, for example, an anchor coating agent such as polyethyleneimine, polybutadiene, or organic titanium, or polyurethane, polyacryl, polyester, epoxy, polyvinyl acetate, cellulose, etc. A known anchor coating agent, adhesive, and the like can be arbitrarily used.

  Moreover, the structure of the lamination sheet used for the card | curd base material 2 consists of a normal surface base material sheet, an intermediate | middle base material sheet, and a back surface base material sheet normally.

  For the front substrate sheet and the back substrate sheet, plastic resins for plastic cards generally used for conventional plastic cards with magnetic tape and IC cards, such as polyvinyl chloride, ABS (acrylonitrile butadiene styrene) A material made of a resin such as PET (polyethylene terephthalate), PC (polycarbonate), PE (polyimide), or epoxy can be used.

  Further, on the outside of the front substrate sheet and the back substrate sheet, a desired printed pattern composed of a pattern, a figure, a character, a symbol, and the like is printed. And you may provide the protective layer for protecting this printing surface. As this protective layer, a member on a sheet may be attached, or it may be coated with a resin or the like. Furthermore, an image receiving layer such as polyester may be provided on the front or back surface of the card for printing.

  The printing surface is formed using an ink composition such as a normal gravure ink composition, offset ink composition, letterpress ink composition, screen ink composition, etc., for example, gravure printing method, offset printing method, letterpress Printing methods such as printing method, silk screen printing method, ink jet printing method, etc. are used.

  Moreover, although the laminated sheet which laminated | stacked the sheet | seat which consists of resin is used for the card | curd base material 2, you may comprise by the injection molding method using the said resin. When the card substrate 2 is produced by an injection molding method, as general additives, for example, ultraviolet absorbers, antistatic agents, flame retardants, fireproofing agents, fungicides, pigments, fillers, etc. Can be used. The addition amount can be arbitrarily added from a very small amount to several tens of percent depending on the purpose.

  Further, the concave portion into which the IC module is fitted into the card base 2 is formed by counterboring or the like. And the depth of the 1st recessed part 3 of a recessed part is formed about 0.1-0.4 mm, and the depth of the 2nd recessed part 4 is formed about 0.3-0.6 mm from the card | curd base material 2 surface.

  Furthermore, it is formed on the first recess 3 surface. The height from the bottom surface of the plurality of convex portions is about 0.02 to 0.05 mm, and the size is about 0.5 to 1.5 mm.

  The appropriate height from the bottom surface of the convex portion is due to the following reason. That is, in order to obtain a sufficient adhesive force for bonding the IC module to the recess and to prevent the external connection terminal of the IC module from protruding from the card surface (so as to be treated as a defective product), the height is set to 0.02 to 0. It is preferable to set it to any one of 0.05 mm. If it is lower than this range, it will be difficult to obtain sufficient adhesive force. If it is higher than this range, the external connection terminal will protrude from the card surface (so that it will be treated as a defective product). Since it becomes easy, neither is preferable.

  Next, FIG. 2 is a schematic diagram illustrating an example of an IC module that is fitted into a concave portion of the card base of the IC card of the present invention. (A) is the figure seen from the resin mold side, (b) It is a figure which shows the cross section seen from the side surface side.

  As shown in FIGS. 7A and 7B, the IC module 1 shown in FIGS. 2A and 2B is in contact with one surface of the module substrate 23 for connection with an external device. A metal external connection terminal electrode 25 for communication is formed. An IC chip is mounted on the other surface, and a mold resin portion 24 is formed by molding the IC chip with a mold resin.

  Further, the module substrate 23 is provided with connection terminals connected to the antenna-side external connection terminal electrodes 25 on the mold resin portion 24 side of the module substrate 23.

  In addition, an outer peripheral portion 26 is formed on the mold resin portion 24 side of the module substrate 23 so as to overlap the first concave portion 3 surface of the concave portion 1 into which the module of the card base 2 is fitted.

  As the material of the module substrate 23, a glass epoxy substrate is usually used, but a film such as polyimide or a metal used for an IC lead frame may be adopted.

  Further, as the resin for molding the IC chip, the IC chip is protected by a mold resin made of epoxy resin or the like. As the sealing method, for example, various well-known methods for resin sealing of an IC such as a potting method or a transfer mold method are used.

  Further, the outer peripheral portion 26 surface of the module substrate 23 where the mold resin portion 24 is formed has an adhesive layer 21 excluding a portion overlapping with a plurality of convex portions formed on the first concave portion 3 surface. Is formed. And the part which overlaps with the some convex part currently formed in the said 1st recessed part 3 surface is the to-be-adhered layer 22.

  The adhesive used for the adhesive layer 21 is not particularly limited, and a thermosetting epoxy-based adhesive or the like is used, and the card substrate 2 and the heating head or ultrasonic wave are provided on the outer peripheral portion 26 surface of the module substrate 23. A resin layer that can be bonded by using an adhesive layer can also be used. For example, an epoxy-based, silicon-based, or polyester-based adhesive may be used, but is not particularly limited.

  The adhesive layer 21 formed on the outer peripheral surface 26 of the module substrate 23 can be formed using, for example, an adhesive sheet. Then, an adhesive sheet is attached to the outer peripheral portion 26 surface of the module substrate 23 of the IC module 20, and the attached adhesive sheet is extracted along the outer peripheral edge of the outer peripheral portion 26 of the module substrate 23.

  When the adhesive layer 21 is formed using the adhesive sheet, as shown in FIG. 5, the wound adhesive sheet has an outer peripheral shape of the mold resin portion 24 of the IC module 20 and an outer side of the outer peripheral edge. In the direction, a portion overlapping with the convex portion formed in the first concave portion of the concave portion formed in the card base is punched out.

  Then, at the same time as the mold resin portion 24 of the IC module 20 is inserted into the punched portion, the outer peripheral portion 26 surface of the module substrate 23 of the IC module 20 is adhered to the back side surface of the adhesive sheet, and the adhesive sheet is attached. A reel-shaped IC module 30 is formed.

  The outer peripheral edge of the outer peripheral portion 26 of the module substrate 23 of the IC module 20 is separated from the adhesive sheet 31 before the reel-like IC module 30 with the adhesive sheet attached is fitted into the recess 5 formed in the card base 2. Then, as shown in FIG. 3, the IC module 20 is bonded and fixed to the first concave portion 3 surface of the concave portion 5 formed in the card substrate 2 through the adhesive layer 21 formed by the adhesive sheet 31.

  As the adhesive sheet, for example, a sheet of nitrile rubber / phenolic resin or polyester resin having a thickness of about 60 μm is used. In addition, this adhesive sheet is temporarily bonded to the outer peripheral portion 26 of the module substrate 23 of the IC module 20 at a low temperature of about 120 ° C. Then, a reel-like IC module 30 to which the adhesive sheet is attached is formed.

In addition, the outer peripheral portion 26 of the module substrate 23 of the IC module 20 is bonded and fixed to the surface of the first concave portion 3 of the concave portion 5 formed on the card base 2 through the adhesive layer 21 by heating at around 170 ° C. However, the method is not particularly limited to a method using a heating head. For example, ultrasonic waves or the like can be used.

  Then, as shown in FIG. 8, the IC card 10 in which the IC module 20 is bonded and fixed to the card base 2 is produced.

  As described above, when the outer peripheral portion 26 of the module substrate 23 of the IC module 20 and the first concave portion 3 surface of the card base 2 are bonded and fixed, a plurality of convex portions are provided on the first concave portion 3 surface, or By providing convex portions made of a plurality of metal patterns on the outer peripheral portion 26 surface of the module substrate 23 of the IC module 20, the adhesive applied to the adhesive layer does not protrude from the surface of the card base 2.

  Further, a step between the surface of the card base 2 and the IC module 20 hardly occurs, and the total thickness of the IC card can be stabilized.

Hereinafter, the IC card of the present invention will be described with specific examples, but is not limited thereto.
<Example 1>
A laminated sheet made of PET (polyethylene terephthalate) and having a thickness of 0.70 mm was used as a card substrate. As shown in FIGS. 1A and 1B, a first recess 3 having a depth of about 0.20 mm from the surface of the card substrate 2 was formed at a predetermined location of the card substrate 2 by a counterbore process.

  And in the approximate center position of the boundary part of the 1st recessed part 3 surface of the boundary part of the 1st recessed part 3 and the 2nd recessed part 4, a vertical and horizontal 1 mm and height are 0.04 mm in several heights. A portion 5 is formed (the height of the convex portion 5 is appropriately determined depending on the dimensions of the IC module used and the thickness of the adhesive layer).

  Furthermore, a second recess 4 deeper than the first recess approximately 0.60 mm from the surface of the card base was formed in a stepped shape near the center of the first recess by a counterbore process.

  Next, the formation of the adhesive layer applied to the outer peripheral edge of the outer peripheral portion 26 of the module substrate 23 of the IC module 20 shown in FIG. 2 overlaps the convex portion of the first concave portion of the card base as shown in FIG. A 60 μ adhesive sheet 31 made of nitrile rubber / phenolic resin with a portion 32 punched out was used.

  Then, the adhesive sheet 31 is temporarily bonded to the outer peripheral edge of the outer peripheral portion 26 of the module substrate 23 of the IC module 20 at a temperature of about 120 ° C. Module 30 was created.

  The reel-shaped module 30 thus prepared is extracted from the adhesive sheet 31 in the shape of the outer peripheral edge of the outer peripheral portion 26 of the module substrate 23, and then the adhesive sheet 31 is made of a nitrile rubber / phenol resin in a concave portion of the card base. Placed.

  Then, a pressure of about 0.6 MPa was applied for about 1 to 2 seconds with a heating head at around 170 ° C., and the IC module 20 was adhered and fixed to a predetermined location on the card base.

Ten IC cards of the present invention were produced by the above method. The step between the surface on which the design of the card substrate 2 is printed and the external connection terminal surface of the IC module 20 and the IC
The total thickness of the card was measured and inspected.
<Evaluation results>
Conventionally, it has been difficult to ensure a step difference of ± 0.1 mm or less between the surface on which the design of the card base is printed and the external connection terminal surface of the IC module. All cards were within the step standard with a step standard of ± 0.1 mm or less. Further, all of the total thickness standards of IC cards, 0.76 ± 0.08, were also satisfied.
<Example 2>
The convex part provided in the opposite boundary side of the boundary part of the 1st recessed part 3 surface of the boundary part of the 1st recessed part 3 of the card base material of Example 1 and the 2nd recessed part 4 is made into a plane, The Ten C modules of the present invention were produced in the same manner as in Example 1 except that a metal pattern having a thickness (height) of 30 μm made of copper foil and nickel was formed at the position of the IC module facing the convex portion. Then, in the same manner as in Example 1, the level difference between the surface on which the design of the card substrate was printed and the external connection terminal surface of the IC module and the total thickness of the IC card were measured and inspected.
<Evaluation results>
As in Example 1, all the produced IC cards of the present invention were within the level difference standard with a level difference standard of ± 0.1 mm or less. Further, all of the total thickness standards of IC cards, 0.76 ± 0.08, were also satisfied.

Schematic explaining an example of the recessed part into which the IC module currently formed in the card | curd base material of the IC card of this invention is engage | inserted. (A) is the figure seen from the counterbore side, (b) is a figure which shows the AA 'line cross section of said (a). Schematic explaining an example according to the IC module of the present invention. (A) The figure seen from the resin module side, (b) The figure which shows the cross section seen from the side surface side. It is a schematic sectional drawing which shows the cross section of one Example of the IC card of this invention. Schematic explaining the other example of the recessed part in which the IC module currently formed in the card | curd base material of the IC card of this invention is engage | inserted. (A) The figure seen from the counterbore side of a recessed part, (b) The figure which shows the BB 'line cross section of the said (a). It is the schematic for demonstrating an example of the formation method of the adhesive bond layer given to the IC module inserted in the recessed part of the card | curd base material of the IC card of this invention. It is the schematic which shows the outline of another example of the IC module fitted in the recessed part of the card | curd base material of the IC card of this invention. Schematic explaining an example of the IC module fitted in the recessed part of the card | curd base material of the IC card of this invention. (A) The figure seen from the external connection terminal side, (b) The figure which shows the cross section seen from the side surface side. It is the schematic which shows the outline of one Embodiment of the IC card of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Concave part in which an IC module is inserted 2 ... Card base material 3 ... 1st recessed part 4 ... 2nd recessed part 5 ... Convex part 6 ... Boundary part 7 ... Right surface of 1st recessed part 8 ... Left surface of 1st recessed part 9 ... 1st recessed part 10 ... IC card 11 ... Upper surface of first recess 20 ... IC module 21 ... Adhesive layer 22 ... Adhesive layer (adhesive sheet deletion part)
DESCRIPTION OF SYMBOLS 23 ... Module substrate 24 ... Mold resin part 25 ... External connection terminal 26 ... Outer peripheral part 27 ... Wire bonding 28 ... Metal pattern 30 ... Reel-like IC module which stuck the adhesive sheet 31 ... Adhesive sheet 32 ... The part which overlaps with a convex part

Claims (4)

An IC card comprising an IC module having a plastic card base having a recess at a predetermined location and an external connection terminal on one side of the module substrate and a resin-molded IC chip on the opposite side,
The concave portion of the plastic card substrate supports the IC module on the concave first concave portion, the concave second concave portion in the middle of the bottom surface of the first concave portion, and the bottom surface around the second concave portion. A convex part is formed,
The IC module, wherein the IC module is fitted into the recess so that the external connection terminal faces the outside of the card. The IC module is bonded to the recess by an adhesive sheet,
The IC card according to claim 1, wherein the adhesive sheet has a portion corresponding to the convex portion removed.   The IC card according to claim 1, wherein a height of the convex portion from the bottom surface is provided in any of 0.02 mm to 0.05 mm.   The IC card according to any one of claims 1 to 3, wherein the convex portion is formed by providing a metal layer in a pattern on the bottom surface.

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