JP2005037895A - Ic label - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC label that meets high durability and anti-water pressure characteristics. <P>SOLUTION: The IC label has a basic portion 2 of a flat IC chip package with an upper and lower surface, having an antenna circuit connected with the IC 6 (hereinafter to be referred to as the basic portion 2); an upper surface side layer group 21, having the watertight covering layer of a stress relaxation adhesive layer 16, waterproof barrier layer 1 and watertight covering layer 14, which cover at least the entire upper surface of the basic portion 2 and have surplus portions A, B so as to be positioned at the surface side at least; and a fixed part, which is a watertight fixed part, covering at least the entire lower surface of the basic portion 2 and having a surplus portion C of the fixed part, having an adhering surface to an adherend on the surface opposite to the surface covering the basic portion 2. Part of the surplus portion of the upper surface side layer group is bonded with part of the surplus portion of the fixed part so as to seal the circumference of the basic portion 2, and the adhering surface of the lower fixed part to the adherend is substantially flattened, by recessing the surplus portion of the upper surface side layer in the periphery, thereby enabling the stable adhesion to the adherend even under water pressure. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The IC label of the present invention relates to an IC label used for a label or the like attached to an article and performing data communication or the like by an external radio wave. In particular, the IC label of the present invention is also called a non-contact type IC label.

  In recent years, small electronic devices in which IC chips are mounted as new information recording media in commuter passes and the like used for personal information management, physical distribution management or commuting to school have been spreading. A commuter pass or the like carried by an individual is called an IC card, and when attached to an article, it is called an IC tag / label. In either case, it is a large-capacity variable information recording medium on which an IC chip is mounted, and is beginning to spread widely. Speaking strongly, the tag is attached to the article in a string shape, and the label is attached to the article with an adhesive or the like.

As an example of how to use an IC card carried by an individual, there is an example in which it is possible to pass through a ticket gate of a station without contact and a small amount can be settled with the same card.
Also, as an example of how to use IC tags and labels in the logistics field, in addition to product management / settlement, which has been done with barcodes, etc., information transmission from grasping the best-selling products to the manufacturing process is made quicker. Thus, an example in which an optimal product can be introduced at an optimal time is given. In this way, comprehensive IC label management such as inventory reduction, cost reduction and avoidance of out of stock is becoming mainstream.
Patent Document 1 shows an example of a conventional IC label.

JP 2001-66990 A (FIG. 1)

  As described above, IC labels are increasingly used in various areas. Some IC labels are also expected to be used in the sea, rivers, and the like, so high durability and water pressure resistance are required outdoors. However, the conventional IC labels described above have a high possibility of failure due to corrosion, circuit breakdown, connection failure, etc. during continuous use under such severe conditions. An object of the present invention is to provide an IC label having high durability and high water pressure resistance that does not break down even when continuously used under such severe conditions.

  An IC label according to the present invention has at least an antenna circuit to which an IC is connected, a flat IC chip mounting body basic portion having an upper surface and a lower surface, and an excess portion covering at least the entire upper surface of the IC chip mounting body basic portion. An upper surface side layer group having a stress relaxation adhesive layer, a water resistant barrier layer and a watertight coating layer having a watertight coating layer positioned at least on the surface side, and at least the entire lower surface of the basic part of the IC chip mounting body. A watertight fixing part having a fixing part surplus part, and having a fixing part having a surface to be attached to an adherend on a surface opposite to the surface covering the basic part of the IC chip mounting body. At least a part of the surplus part of the group and at least a part of the surplus part of the fixing part are joined so as to seal the periphery of the basic part of the IC chip mounting body, and the surplus part of the upper surface side layer group of the peripheral part is recessed. By An IC label covering substantially plane deposition surface of the adherend fixing portion of the lower side.

In addition, the water-resistant barrier layer is preferably a layer having at least one kind of synthetic resin film among polyvinylidene chloride resin, nylon resin, and polyacrylonitrile resin in order to obtain higher water resistance.
Further, it is preferable that the water-resistant barrier layer is a layer having at least one inorganic material film in order to obtain higher water resistance.
In addition, the watertight coating layer is preferably a layer having at least one synthetic resin film among vinyl chloride resin, polyolefin resin, fluorine resin, and silicone resin in terms of improving weather resistance.
In addition, the watertight fixing part and the stress relaxation adhesive layer are preferably an adhesive foam base material or a layer having a non-adhesive foam base material having an adhesive layer on both sides in order to improve the durability of the environment. .

  Further, the basic part of the IC chip mounting body includes at least an antenna circuit to which an IC is connected, a non-conductive permeable layer containing a permeable metal material, and a conductive layer positioned further on the fixed portion side of the non-conductive permeable layer. The basic part of the IC chip mounting body is preferable for ensuring communication performance when the adherend is a conductive material such as metal.

The water-resistant barrier layer has at least one synthetic resin film of polyvinylidene chloride resin, nylon resin, and polyacrylonitrile resin, and has a water vapor molecule permeability of 30 g / m ^{2 as} defined in JIS K7126 (1987). -24 h · atm or less and oxygen molecule permeability of 10 cc / m ² · 24 h · atm or less are preferred for improving durability under higher water pressure.

The water-resistant barrier layer has at least one inorganic material film, and has a water vapor molecule permeability of 30 g / m ² · 24 h · atm or less as defined in JIS K7126 (1987) and an oxygen molecule permeability of 10 cc. When it is not more than / m ² · 24 h · atm, it is preferable for improving durability under higher water pressure.

  The coating layer has an initial elongation specified in JIS Z0237 (1991) of 100% or more, a thickness of 20 μm or more and 150 μm or less, and 5 years in the outdoor exposure test A method specified in JIS K 7219 (1998). It is preferable to have an elongation rate of 80% or more with respect to the initial elongation rate in order to improve durability under more severe environmental conditions.

The fixed part and the stress relaxation adhesive layer have a density of 1 g / cm ³ or less, an initial elongation of 20% or more as defined in JIS Z0237 (1991), a tensile breaking strength of 30 N / cm ² or more, and JIS K 7219 ( In the outdoor exposure test A method specified in 1998), if it has an elongation rate of 80% or more and a tensile breaking strength with respect to the initial elongation rate after 5 years, durability under severer environmental conditions is improved. This is more preferable.
It is preferable that the second water-resistant barrier layer is further provided between the fixed portion and the lower surface of the IC chip mounting body basic portion because the water resistance is further improved.

  However, in the claims, the basic part of the IC chip mounting body is referred to as the upper surface and the lower surface. However, there is no distinction between the upper surface and the lower surface in the same part, and either surface may actually be the upper or lower surface. However, in the case of the basic part of the IC chip mounting body provided with the conductive layer as described in claim 6, the side on which the conductive layer is provided is the lower surface. In addition, the IC chip is more resistant to breakage against external stress on the circuit surface side than the surface without the circuit. In the present invention, a configuration as shown in FIG. 2 in which the circuit surface side is the coating layer side is preferable. More preferably, as shown in FIG. 2, it is more preferable to attach a reinforcing member or the like to a portion of the chip where there is no circuit.

  In the IC label of the present invention, the basic part of the IC chip mounting body including the antenna circuit to which the IC is connected is sandwiched between the upper surface side layer group 21 and the fixing layer 10, and the entire periphery is protected by each layer. Since the adherend surface of the layer is substantially flat and easily adheres to the adherend, water / dissolved gas does not enter even when used in water, electrical failure does not occur, and peeling, etc. An IC label excellent in durability without causing problems was obtained.

  The present inventors have at least a flat IC chip mounting body basic portion having an upper surface and a lower surface having an antenna circuit to which an IC is connected, and an excess portion covering at least the entire upper surface of the IC chip mounting body basic portion. An upper surface side layer group having a stress relaxation adhesive layer, a water-resistant barrier layer, and a watertight coating layer so that the watertight coating layer is located at least on the surface side, and a fixing portion covering at least the entire lower surface of the basic part of the IC chip mounting body A watertight fixing portion having a surplus portion, and having a fixing portion having a surface to be attached to an adherend on a surface opposite to the surface covering the basic portion of the IC chip mounting body, and an upper surface side layer group surplus At least a part of the part and at least a part of the fixed part surplus part are joined so as to seal the periphery of the IC chip mounting body basic part, and the upper surface side layer group surplus part of the peripheral part is recessed to form a lower side Fixing It discovered that the deposition surface can be substantially solved the above problem by the IC label as the plane of the adherend, and have the ability to provide an IC label of the present invention.

An outline of a non-contact type IC label suitable for use in the present invention and a circuit substrate used therein will be described below with reference to the drawings.
A basic configuration diagram of the IC label of the present invention is shown in FIGS. FIG. 1 is an example of a cross section of a basic part of an IC chip mounting body of an IC label according to the present invention. An adhesive layer is formed on one side of an inlet 15 (mainly composed of a support 4, a circuit pattern (not shown), and an IC 6). A non-conductive permeable layer 5 is laminated via 3b, and a conductive layer 9 is further laminated via an adhesive layer 3a to form a basic part of the mounting body. FIG. 2 is a cross-sectional view of an embodiment of an IC label of the present invention using the above-mentioned mounting body basic portion. It can be seen that the mounting body basic portion 2 is sandwiched between the upper surface side layer group 21 including the covering layer 14, the water-resistant barrier layer 1, and the stress relaxation adhesive layer 16 and the fixing portion 10.

The process up to the IC label having the configuration of the present invention will be described below. If the cover layer is simply superimposed on the surface of the IC mount body basic portion 2 and the adhesive layer is overlapped on the back side (not shown), the IC mount body basic portion made of an inlet 15 or a magnetically permeable metal material from the end face The edges of the metal are exposed, causing problems such as delamination and corrosion under the influence of the harsh environment.
Next, as shown in FIG. 3, a configuration in which the IC mount basic portion 2 was protected from both sides by the covering layer 14a and the covering layer 14b and the fixing portion 10 was provided on the covering layer 14b was examined. FIG. 3 is a cross-sectional view of another example of a possible non-contact IC label. However, in this configuration, a gap is formed between the end of the adhesion surface to the adherend and the adherend, and when adhering to the adherend, it becomes difficult to sufficiently adhere the end portion. The surface is easy to lift and may be easily peeled off.

  Next, as shown in FIG. 4, the surface of the IC label that is in contact with the adherend, that is, the C portion of the fixing portion is fixed to the fixing portion so that it adheres strongly to the adherend without peeling off from the peripheral portion like the IC label. It was attempted to solve the above problems by flattening as much as the central part. FIG. 4 is a cross-sectional view of yet another example of a possible non-contact IC label. As a result, a peripheral portion A + B of the covering layer portion opposite to the fixed portion, an IC label having a concave shape, which is called a surplus portion of the covering layer in this specification, was obtained.

  However, although the above-mentioned improvement has improved the overall durability, it has been found that when used in water with high water pressure, water and dissolved gas penetrate into the IC label, resulting in poor communication and reduced durability. As shown in FIG. 2, the present inventor provides durability and water resistance by providing an upper surface side layer group composed of a coating layer 14, a water resistant barrier layer 1, and a stress relaxation adhesive layer 16 on the upper surface of the inlet. I was able to make it an IC tag. Each layer used in the upper surface side layer group mainly includes a coating layer 14 = light resistance / weather resistance, a water resistance barrier layer 1 = low water / gas permeability, and a stress relaxation adhesive layer 16 = pressure deformation relaxation function. It is thought that each function is shared.

  In the case where the peripheral portion A + B of the present invention is an indented IC label, the basic part of the IC mounting body is not exposed and is covered with a material excellent in environmental resistance, so that the above-mentioned durability problem does not occur. Therefore, it can be considered that the IC label can be adhered with little influence on the shape of the adherend for the following reasons.

  When an IC label of this shape is used, the upper surface side layer group 21 and the fixing portion 10 are originally different in curvature when applied to a convex surface. Since the portion B is stretched and deformed to relieve stress, it is difficult for dropout and delamination. Conversely, when pasting on the concave surface, the curvatures of the upper surface side layer group 21 and the fixing portion 10 are similarly different and contraction stress is generated in the upper surface side layer group 21, but the stepped portion B at the boundary of the peripheral portion is contracted and deformed. It seems to be difficult to drop off and delamination to relieve.

Further, in the present invention, since the peripheral portion A + B of the basic portion of the IC mounting body is smoothly recessed, the IC mounting base having a relatively high height (thickness) as compared with the structure in which the overall height is increased. The part became more difficult to get caught.
In addition, since the IC label of the present invention may be applied to a three-dimensional convex surface like a shoulder of a gas cylinder, as shown in FIG. 5, when the IC mounting body is wide on both sides and the center portion is constricted, , The followability to the surface is improved, which is more preferable. FIG. 5 is a plan view of another embodiment of the IC label of the present invention. In addition, a rectangular shape may be used normally.

  First, 1. 1. From the circuit substrate to the formation of the inlet / IC chip mounting body basic part will be described. IC labeling materials and processes will be described.

1. Steps from formation of circuit substrate to basic part of inlet / IC chip mounting body Hereinafter, (1) the manufacturing process from circuit substrate to basic part of inlet / IC chip mounting body will be described step by step. Then, (2) assembly of the IC label will be described.

First, the metal foil and the support constituting the circuit substrate will be described in detail.
In the IC label of the present invention, an antenna circuit is provided on a support by etching and other methods for receiving and transmitting power and signals by radio waves, and combinations thereof, and electronic components such as IC chips and capacitors are mounted on the circuit. Or what is forming. This is the smallest component that can communicate and is called the inlet 15.

[Antenna circuit]
The antenna circuit is made by a technique such as etching or printing of copper or aluminum metal foil, conductive ink, metal wire, plating film, metal powder, or metal vapor deposition film as the material of the conductive portion. In general, metal foil, metal wire, and conductive ink are often used.

[Inlet support]
The inlet support 4 is selected from electrically insulating materials. The support can be roughly divided into a rigid substrate and a flexible substrate.
Rigid substrate is made by impregnating aramid fiber or glass fiber sheet with thermosetting resin such as epoxy resin, paper with thermosetting resin such as phenolic resin, and providing a metal foil on the surface and applying heat and pressure to cure. Manufactured. The rigid substrate has a high elastic modulus with respect to mechanical stress.
On the other hand, a flexible substrate is a film-like support that has a circuit made of metal foil, etc., and is used for printer heads and wiring in cars. Is used a lot.

[IC]
Examples of the IC chip 6 used in the present invention include a bare chip of 125 KHz, 4.9 MHz, 6.5 MHz, 13.56 MHz, 950 MHz (UHF band in Japan) 2.54 GHz band, and the like. The IC chip 6 used for the IC label is a form of a bare chip in which bumps are provided on the chip, die-bonded to a lead frame material that can also be used as a terminal part, and a gold wire or the like between the pad part of the chip and the lead frame After being wired, it is supplied in a form called a package chip that is sealed with an epoxy resin or the like or fixed on a film with terminals.

[Reinforcement]
Since the present invention is premised on use in a harsh environment, it is preferable to reinforce an IC chip portion that is easily damaged by external stress.
As the reinforcing material, a resin 7 or a metal plate 8 is generally used. As the resin, an epoxy resin, a UV curable resin, or the like is used to cover the entire surface of the chip portion and cure to reinforce. When the metal plate 8 is used, the chip portion is covered with the resin 7, and then the metal plate 8 is further attached to harden the resin and reinforce it. Either method can be applied from one side or both sides of the chip. The double-sided reinforcement is stronger, but the cost is further increased, so it is preferable to select it in consideration of the environment in which the IC label is used.

[Inlet]
As an example of the inlet 15, by using the main material, a part of the metal foil is removed on the support by an etching method to form a circuit pattern including a necessary antenna circuit, and then the IC chip 6 is connected to the circuit. Some are attached to the pattern.
In the present invention, a bare chip is heated by using a bonding resin such as ACF (Anisotropic Conductive Film), ACP (Anisotropic Conductive Paste), NCP (Non-Conductive Paste), or by using a metal such as solder. A regular connection method such as a connection method, a connection method using a conductive adhesive containing a metal powder such as silver or copper, ultrasonic bonding, welding, or thermocompression bonding between metals can be used.

  When the package chip described below is used, the antenna circuit is connected to the antenna circuit in the same manner as described above by heat connection using a metal such as solder, or contains metal powder such as silver or copper. It is possible to use a conventional connection method such as a method of connecting with a conductive adhesive, ultrasonic bonding, welding, or thermocompression bonding between metals.

  Although the inlet 15 can be used as it is as the IC chip mounting body basic portion 2 as it is, the inlet 15 is located further outside the non-conductive magnetic permeable layer and the non-conductive permeable magnetic layer described below. By adding a conductive layer, it is possible to make the IC chip mounting body basic portion 2 capable of communication even on a metal surface.

[Non-conductive magnetically permeable layer]
This layer is not always used. When the normal tag of the present invention in which the coating layer 14 and the fixing portion 10 are provided on both sides of the inlet 15 is used by being attached to an adherend such as a metal body, the metal of the adherend is removed from the reader / writer. Since the signal is absorbed, the signal is not transmitted to the inlet 15 and communication is not possible. In order to avoid this phenomenon, communication is possible by providing this layer on the back side of the inlet sheet as a signal path. The non-conductive magnetic permeable layer 5 is a non-electrically conductive sheet in which magnetic powder or flakes having a high magnetic permeability are kneaded into a resin, and is a layer in which a signal path is provided on the back side of the inlet sheet. The initial permeability mu _a nonconductive magnetically permeable layer greater than 1, it is good is preferably 2 or more. In practice, a magnetically permeable metal material having a high magnetic permeability is not continuously connected but exists discontinuously. In other words, the resin portion becomes the sea and becomes a layer containing magnetic powder in an island shape so that electrical conductivity does not occur. The term “electric conductivity” as used herein refers to a volume resistance value of about 10 ⁻² Ω · cm as a boundary. Since the sea-island structure is taken in this way, the resin portion corresponding to the sea is relatively soft, and since this layer is a thin layer of several tens of μm to several mm, it has a considerable flexibility. Nor.

  For example, when an amorphous alloy sheet having electrical conductivity is used instead of the non-conductive magnetic permeability layer, radio waves transmitted from the reader / writer are absorbed by the surface of the conductive amorphous alloy sheet, This is considered inconvenient because no signal or power is supplied to the antenna.

As the shape of the magnetically permeable material, magnetic powder or flake can be considered. Specific examples of materials that can be used include silicon steel, sendust alloy, Fe-Al alloy, electromagnetic soft iron, amorphous alloy, permalloy, carbonyl iron, and ferrite.
As the sendust / Fe—Al alloy, alpalm, hypermal, sendust, super sendust, and the like are used. As the electromagnetic soft iron, industrial pure iron, armco steel, low carbon steel and the like are used. As the amorphous alloy, cobalt-based, iron-based and nickel-based alloys can be used. As the composition of the amorphous alloy, 70 to 98% by weight of Co, Fe, and Ni are the main components, B, Si, and P are contained in a total of 2 to 30% by weight, and Al, Mn, Zr, and Nb are also contained. . As the permalloy, 78-Permalloy, 45-Permalloy, 36-Permalloy, Cr-Permalloy, Mo-Permalloy, Supermalloy, etc. can be used.

  The other component resin used for the non-conductive magnetic permeable layer 5 is polyethylene, chlorinated polyethylene, polypropylene, polyurethane, acrylic, styrene, silicone, PET, PEN, PET-G, ABS, vinyl chloride, and vinegar. Any resin such as bi, EVA, polycarbonate, alloy, etc., which is generally mixed with a pigment or the like, can be used.

  Other materials include auxiliary agents that improve the affinity (adhesiveness) between resin and magnetic powder, rust inhibitors, antioxidants, lubricants, mold release agents, antifoaming agents, wetting agents, curing agents, and UV absorbers. Such additives as required in the resin sheet production process and additives that improve durability and convenience may be included.

  There are roughly two methods for producing the non-conductive magnetic permeable layer 5. One method is a method of applying a magnetic paint on a base sheet, and the other is a method of kneading a magnetic powder into a liquid resin such as heat melting using a device such as a kneader. .

[Conductive layer]
This layer is also not always used. As described above, by using the non-conductive magnetic permeable layer 5, a signal path is provided on the back side of the inlet sheet, and communication is possible. Therefore, there is no problem if it is always placed on the metal surface of a specific material. However, in some cases, it may not be possible to envisage where to apply the resin material surface other than the metal surface. Considering versatility including such a case, it is preferable to further provide the conductive layer 9 on the opposite surface side of the non-conductive magnetic permeable layer 5 to the side where the inlet sheet 15 is present. More preferably, a conductive layer having a volume resistance of about 10 ⁻² Ω · cm or less can obtain better communication characteristics.

As the conductive layer 9 having a volume resistivity of about 10 ⁻² Ω · cm, a conductive foil in which a metal foil such as aluminum, copper, zinc, or an alloy, or metal powder such as silver, copper, or an alloy is dispersed in a resin. Ink, carbon sheet, carbon ink printing sheet, conductive resin sheet, conductive polymer sheet such as polyacetylene, and the like can be used. If the thickness of this layer is from several μm to several tens of μm, the above-described effects can be obtained, and keeping the thickness within this range prevents the flexibility even in the finished state of the label. There are few things.

[IC mounting body basic part]
As described above, the inlet 15 can be used as it is as the basic part 2 of the IC chip mounting body, but here, the non-conductive permeable layer 5 and the outer side of the non-conductive permeable layer (on the adherend side). The assembling of the basic part 2 of the IC chip mounting body to which the conductive layer 9 located on the substrate is added will be described. The inlet 15 with or without the reinforcement of the chip portion and the non-conductive magnetic permeable layer 5 are bonded together via the adhesive layer 3b. At this time, if a hole for inserting the chip portion on the inlet 15 is formed in a part of the non-conductive magnetic permeable layer 5, the surface smoothness of the completed IC label is improved. A conductive layer 9 is affixed on the inlet 15 via an adhesive 3a. When the inlet 15 is used as an assembly, the inlet 15 is once separated and used as an individual IC chip mounting body basic portion 2. As for the thickness of the basic part of the IC chip mounting body, a thinner one is more flexible and preferable. However, even when a non-conductive magnetic permeable layer or the like is provided so as to be attached to a metal surface, as described above. If the material, thickness, etc. of each layer are selected, it will have a certain degree of flexibility. Specifically, the flexibility was such that the IC label with a size of 30 × 60 mm square could be attached to a metal cylindrical object having an outer diameter of 100 mmφ with the circumferential direction as the long side.

2. IC Label Material / Process The material / process used from the basic part of the IC label mounting body described above to the IC label will be described below.

(Coating layer)
In the present invention, the upper surface side layer group 21 is provided on the upper surface of the inlet. The upper surface side layer group is provided in the order of watertight coating layer / water resistant barrier layer / stress relaxation adhesive layer / inlet or watertight coating layer / stress relaxation adhesive layer / water resistant barrier layer / inlet. In any case, the water-tight coating layer is located at least on the outermost surface side and is in contact with the external environment. The watertight coating layer 14 which is one of the features of the present invention is a base material for the outermost shell of the finished IC label. This watertightness means that water does not pass even if it receives water droplets such as rain or water jets, and almost all synthetic resin films with a thickness of several tens of μm satisfy these properties. Can do. In particular, it is preferable to use a watertight coating layer composed of a weather-resistant film 12 and a durable adhesive layer 13 in consideration of use in outdoor advertisements / signboards. As the weather-resistant film 12, a film premised on use outdoors such as a vinyl chloride-based, polyolefin-based, fluororesin-based, or silicone-based film that can cope with ultraviolet rays, wind and rain, temperature changes, and the like can be used. The weather resistant film 12 is a film of the above-mentioned material manufactured by a normal stretching method to improve durability, an unstretched film with little dimensional change due to environmental changes, and various functions such as light resistance, heat resistance and strength. Some have a multi-layer structure in which each layer is shared. Furthermore, a printing layer, a magnetic layer, a protective layer, and the like can be provided on the coating layer 14 as necessary. The coating layer 14 can be transparent, translucent, opaque, or colored depending on the application. Since this coating layer is composed of a film and an adhesive layer, if it is designed to have a certain thickness or less, usually several mm or less, it exhibits flexibility even if almost any material is used.

  The covering layer 14 is provided with a durable adhesive layer 13, and a material that does not peel off even in a harsh environment like the weather-resistant film 12 is selected. The function of the durable adhesive layer 13 used for the coating layer is in contact with the outermost coating layer, unlike other adhesive layers, and therefore (1) against ultraviolet rays transmitted through the coating layer, etc. Light resistance (2) It is preferable to have more excellent characteristics such as environmental resistance due to heat and humidity. As the adhesive having high light resistance and environmental resistance, it is preferable to use an acrylic or silicone adhesive. The durable adhesive layer 13 may further contain additives such as UV absorbers and radical absorbers.

  The coating layer used in the present invention has an adhesive strength with an adherend of 70% or more after 5 years in an outdoor exposure test defined in JIS K7219 (1998) A method. It is preferable that no change in color tone, cracks, etc., which is a problem in use of the surface for more than a year, is observed. By satisfying these conditions, it can withstand a poor environment that is exposed to direct sunlight and wind and rain for a long time when used outdoors, and it can also be used at high temperatures, low temperatures, and high temperatures in factories and warehouses. It can withstand long-term storage and use in harsh environments such as humidity.

  In general, such a coating layer composed of a film and an adhesive layer repeatedly contracts and expands due to environmental changes such as temperature and humidity, and stress is applied to the adhesive layer. There is a risk that partial peeling will occur and the whole will eventually peel off. The coating layer used in the present invention preferably has an elongation of 100% or more when pulled at a speed of 500 mm / min according to JIS Z0237 (1991) in order to relieve the stress as described above. In order to reduce the absolute value of stress, the thickness of the coating layer is preferably less than about 500 μm, and more preferably 150 μm or less. Moreover, when the thickness of the coating layer is too thin and 20 μm or less, the environmental resistance is deteriorated. The elongation after 5 years of the coating layer is preferably 80% or more of the initial value. The flexibility of the coating layer varies greatly depending on the polymer structure used for the coating layer. For example, when the polymer chain contains a rigid molecular structure, a molecular structure with many crystal parts, or a structure that crosslinks between polymers, it tends to be stiff and has a thickness of 500 μm or more. If it is, flexibility will decrease and it is not preferable. On the contrary, if it is 150 micrometers or less as mentioned above, since sufficient flexibility is easy to be obtained, it is preferable.

  Further, when displaying necessary information such as name, serial number, and delivery destination on this coating layer, it can be printed using a recording device. Examples of the recording device include an ink jet method, an ink ribbon method, a thermal transfer method, an electrophotographic method, and a laser engraving machine. When information is recorded on the surface, it is preferable to further overlap the surface of the coating layer 14 in order to improve the durability of the information.

(Water-resistant barrier layer)
The characteristic required for the water-resistant barrier layer which is one of the features of the present invention is that the permeation of water and dissolved gas in water is extremely low. Specifically, this water-resistant barrier layer has a water vapor molecule permeability of JIS K 7126 of 30 g / m ² · 24 h · atm or less and an oxygen molecule permeability of 10 cc / m ² · 24 h · atm or less. preferable. Considering only the water resistance barrier and gas permeability, the use of metal films such as aluminum vapor deposition films and aluminum foils used in confectionery bags and curry retort bags can be considered. However, when a metal is used as a water-resistant barrier layer, radio waves are shielded and communication performance is deteriorated. In the worst case, communication is disabled, and it is very difficult to use these films.
Accordingly, a water-resistant barrier layer that does not adversely affect such communication characteristics and can satisfy the water-resistant barrier properties as described above was sought. Details are described below.

  In the present invention, the water-resistant barrier layer can be preferably used in the present invention in which (1) a layer made of at least one specific synthetic resin film and (2) at least one inorganic material film and a synthetic resin film are laminated. The thicker the water-resistant barrier layer, the higher the water-resistant barrier property, but the less flexible. In order to improve flexibility and water barrier resistance, materials such as PVDC as described below that have a water barrier barrier on the molecular structure itself, or metals and ceramics that have a high water barrier barrier are used. There is a method of providing a thin and flexible material.

  In the water-resistant barrier layer (1) above, materials used for at least one specific synthetic resin film include polyvinylidene chloride (PVDC), nylon, and polyacrylonitrile resins. If there is at least one synthetic resin film composed of these resins and having a so-called water-resistant barrier property, the above performance can be ensured. These films are formed to a thickness of about 10 to 100 μm.

  Normally, it is difficult to handle a film composed of these resins alone due to lack of strength, etc. due to the lack of strength, etc. It is the structure which laminated | stacked as a film | membrane. Biaxially stretched polypropylene, biaxially stretched nylon, unstretched nylon, PET, cellophane, vinylon, etc. are used for the film used as the substrate. These base films having a thickness of 10 to several hundred μm are used. Examples of the laminating method include I) co-extrusion method, II) laminating method, and III) coating method.

I) Co-extrusion method This is a method in which different types of resins are melted and discharged from two or more extruders and bonded in a molten state to form a film. Actually, in many cases, a water-resistant barrier layer is formed by laminating a resin having a water-resistant barrier property such as PVDC and nylon and a polyolefin resin such as polyethylene or polypropylene.

II) Laminating method A method of laminating a base film and a film having a water-resistant barrier such as PVDC and nylon, and includes dry lamination, hot melt lamination, heat lamination, and the like.

III) Coating method This is a method of coating a base film with a resin having a barrier property such as PVDC in a solution state or a heat-melted state.

  The (2) water-resistant barrier layer is formed by laminating at least one inorganic material film on a film as a base material having the material and thickness described in (1), thereby forming at least one inorganic material film. It is obtained as a film having. As a method for laminating the inorganic material film, a vapor deposition method or a sol-gel coating method is employed. In this way, a kind of surface modification is performed by stacking the inorganic material films. A vapor deposition method will be described below as a typical example.

  An example of the water-resistant barrier layer produced by the vapor deposition method is shown in FIG. 6A, 6B, and 6C are cross-sectional views showing examples of the water-resistant barrier layer. As shown in FIG. 6A, the water-resistant barrier layer 1 is produced by providing a transparent ceramic-based inorganic material film 17 on a base material 19 by vapor deposition. This vapor deposition includes both PVD (physical vapor deposition) including so-called sputtering and CVD (chemical vapor deposition). The material used for the ceramic inorganic material film 17 obtained here is diamond-like carbon, alumina, silica, a mixture of alumina and silica, etc., and a barrier property comparable to that of a film vapor-deposited on a substrate is obtained. It is done. The inorganic material film 17 is usually provided with a thickness of 0.01 μm to 1 μm. The inorganic material film 17 is thin and has low physical strength. Therefore, in order to protect the surface of the inorganic material film 17 and improve the adhesive strength, the heat seal layer 18 is provided as shown in FIG. 6A as in the example of (1). In addition, two inorganic material films can be provided using a heat seal layer. This example is (2). As shown in FIG. 6 (b), two water-resistant barrier layers are bonded face to face with the heat seal layer 18 in between, and as an example of (3), FIG. ), The two inorganic material films 17 are bonded together with the adhesive layer 20 so that the inorganic material film is not exposed on the surface. This is preferable because it is possible to achieve both the surface protection of the inorganic material film 17 and the improvement of the adhesiveness due to the base material 19 protruding outside. The thickness of these heat seal layers and adhesive layers is 10 to several hundred μm, and more preferably 20 to 100 μm. The material of the heat seal layer is polyethylene, polypropylene, ethylene vinyl acetate, ionomer, or the like, and the adhesive used for the adhesive layer is the same as [Adhesive layer] described later.

The IC label used in the present invention assumes that the environment used is underwater. As a result, water enters the IC label and the electrical circuit is short-circuited, making it impossible to communicate, or gas molecules contained in the water enter the IC tag while being used in the water, and the adherend is recovered in the atmosphere. It is considered that when the pressure returns to normal pressure, the IC tag expands and adversely affects the IC tag. In order to prevent such a phenomenon from occurring, the water vapor permeability of JIS K 7126 (1987) is 30 g / m in the upper surface side layer group of the inlet sheet which is one of the constituent materials of the IC label. It is preferable to provide a water-resistant barrier layer of ² · 24 h · atm or less and an oxygen molecule permeability of 10 cc / m ² · 24 h · atm or less. When the water vapor molecule permeability is higher than this value, when the water depth exceeds 50 m, it is not preferable because the IC label is immersed in water and communication failure due to short circuit or corrosion tends to occur. Also, if the permeability of oxygen molecules is higher than this value, if the water depth exceeds 50m, dissolved gas can easily enter, and if it returns to normal pressure after returning to the surface of the water, bubbles are generated in the tag, resulting in durability such as interlayer separation and blistering. It is easy to lead to a decrease in the temperature. Furthermore, when using a water-resistant barrier layer with a water vapor permeability of 5 g / m ² · 24 h · atm or less and an oxygen molecule permeability of 5 cc / m ² · 24 h · atm or less, for use at deeper water depths, etc. Is more preferable.
In order to obtain such a low-permeability water-resistant barrier layer, it is possible to use two or more inorganic material films stacked as shown in FIGS. 6 (b) and 6 (c).

  In consideration of harsher conditions and long-term use, a second water-resistant barrier layer equivalent to this water-resistant barrier layer is placed between the fixed portion that covers the bottom surface of the IC chip mounting body and the bottom surface of the IC chip mounting body. It is more preferable to have. By adopting such a configuration, more excellent water resistance can be exhibited. An example of such a configuration is shown in FIG. FIG. 7 is a cross-sectional view of another embodiment of the IC label of the present invention. In FIG. 7, the members denoted by the same reference numerals as those in FIG. A first water-resistant barrier layer 1a and a second water-resistant barrier layer 1b are used. The two water-resistant barrier layers may be the same or similar. As shown in the figure, when the second water-resistant barrier layer 1 b is used, the second water-resistant barrier layer 1 b is located between the fixed portion 10 and the inlet 15. The second water-resistant barrier layer 1b preferably has the same area shape as the fixed portion 10 so as to cover the fixed portion 10 entirely. At this time, since the fixing part 10 has an adhesive function as described later, no adhesive layer is particularly required between the fixing part 10 and the second water-resistant barrier layer 1b. An adhesive layer for adhering the second water-resistant barrier layer 1b to the lower surface of the inlet 15 and the stress relaxation adhesive layer 16 may be inserted. However, since the stress relaxation adhesive layer 16 itself has an adhesive function, this adhesive layer is not always necessary. The type of adhesive that constitutes the adhesive layer is as described in the section of [Adhesive layer] described later.

Although it is conceivable to place the second water-resistant barrier layer 1b between the fixing portion 10 and the adherend, the main fixing is performed in order to fix the IC label with better durability against the adherend. Since the portion 10 is used, the second water-resistant barrier layer 1b is preferably positioned between the fixed portion 10 and the inlet 15 as shown in FIG.
The water-resistant barrier layer 1, 1a as a component in the upper surface side layer group 21 is disposed on the outermost surface side, that is, on the outer side with respect to the position in the upper surface side layer group. You just have to be satisfied with the condition. That is, as for the positional relationship between the water-resistant barrier layer and the stress relaxation adhesive layer, any layer may be disposed on the IC chip mounting body basic portion side.

  As a modification of the example shown in FIG. 7, FIG. 8 shows an example in which the first water-resistant barrier layer 1 a is located inside the stress relaxation adhesive layer 16, that is, on the side in contact with the inlet 15. FIG. 8 is a cross-sectional view of still another embodiment of the IC label of the present invention. In this example, the second water-resistant barrier layer 1 b is also disposed so as to be positioned between the fixed portion 10 and the inlet 15. In such an example, the heat seal layers 18 (see FIG. 6A) of the first and second water-resistant barrier layers are preferably disposed so as to face each other. It is very preferable to heat-bond the heat seal layers so as to face each other, because the first and second water-resistant barrier layers are strongly bonded to each other in the surplus portion C of the coating layer. Eventually, in this case, the inlet 15 is covered with an inorganic material film or the like that performs the main function of the water-resistant barrier layer, and is also covered with the heat seal layer.

(Stress relaxation adhesive layer)
In the example shown in FIG. 2, the stress relaxation adhesive layer 16 is used as an adhesive layer for bonding the inlet 15 and the water-resistant barrier layer 1. In the example shown in FIG. 8, the stress relaxation adhesive layer 16 is used as an adhesive layer for bonding the water-tight coating layer 14 and the water-resistant barrier layer 1a. The IC label of the present invention is subjected to many changes in pressure, which fluctuate greatly from the normally stored air to several tens of meters actually used. This stress relaxation adhesive layer acts to absorb stress caused by pressure fluctuations so that such pressure changes are not directly applied to the inlet 15 or the like.
As the thickness of the stress relaxation adhesive layer increases, the stress relaxation capability increases. However, if the thickness is too thick, the flexibility decreases, and therefore, the thickness is preferably 0.2 mm or more and less than 3 mm.

[Adhesive layer]
The adhesive layers 3a and 3b are layers having a function of adhering the inlet support 4 and the nonconductive magnetic permeable layer 5 or the nonconductive magnetic permeable layer 5 and the conductive layer 9. Adhesive resins used for the adhesive layer include those used as adhesives for acrylic resins, silicone resins, and rubber resins, as well as thermosetting resins such as epoxy resins, polyester, ABS, acrylic, and polyurethane. A dry laminating adhesive such as hot melt resin and thermosetting resin, moisture curable resin, and linear curable resin are preferable. In some cases, the adhesive layer may be adhered to each film with an adhesive for wet lamination. The thickness of the adhesive layer used here is preferably 100 μm or less, more preferably 30 μm or less in consideration of flexibility. An adhesive layer having a thickness of 5 μm or less requires good care because it has good flexibility but may have weak adhesive strength. On the other hand, when the thickness is larger than 100 μm, the thickness of the IC label becomes thick and the cost becomes high, which is not preferable. The adhesive used for the adhesive layer 3a is used for another adhesive layer, for example, an adhesive layer for bonding the second water-resistant barrier layer 1b and the lower surface of the inlet 15 in the state shown in FIG. May be.

〔Fixed part〕
The watertight fixing portion 10 has an action of firmly bonding the IC label of the present invention to the adherend. This watertightness means that the water does not pass even when it receives water droplets such as rain or water jets, and UV (ultraviolet rays) that the adhesive used in the fixing part is difficult to be decomposed by water. ) It means a solvent-free, solvent-based, or emulsion-based one using a curable resin or an EB (electron beam) curable resin. The watertight fixing part 10 is (1) a function for strongly attaching the IC mounting body basic part 2 to the article and holding it for a long time, and (2) a coating layer for protecting the IC mounting body basic part 2 from the harsh external environment. 14 is sealed at the peripheral portion, and has the two functions of not exposing any surface including the end face of the IC mounting body basic portion 2 to the outside.

Furthermore, in addition to these characteristics, the tensile breaking strength of the fixed part is preferably 30 N / cm ² or more. This is because when the IC label of the present invention is attached to the adherend, the IC label is not easily peeled off from the adherend due to the shearing stress caused by the rubbing between the articles.

  The fixing part 10 and the covering layer 14 are provided with a surplus part in the peripheral part more than covering the entire surface of the IC mount basic part 2. By making the covering layer 14 of this surplus part concave to the fixed part 10 side and sealing the IC mounting body basic part 2, the peripheral part A is thinner than the central part, and the part B toward the central part is Since the thickness is smoothly increased, the end of the IC label is less likely to get caught and peeled off, which is preferable.

  Regarding the relaxation of the difference in stress due to temperature changes accompanying environmental changes applied to the front and back of the fixed part, it is estimated that the stress is gradually relaxed in the thickness direction of the fixed part. It is considered preferable that the fixing portion has a certain thickness. From this point, the thickness of the fixed portion is preferably 0.1 mm or more and the upper limit is preferably less than 5 mm, and more preferably the thickness of the same portion is 0.2 mm or more and the upper limit is less than 3 mm. That is, if the thickness is less than 0.1 mm, the stress may not be sufficiently relaxed. If the thickness is too thick, the IC label is easily caught. Therefore, the upper limit is preferably up to several mm. Moreover, in order to ensure sufficient flexibility, it is preferable that the thickness of the fixing portion is thin. However, even if the thickness is about 5 mm, considerable flexibility can be ensured by using the following foamable substrate.

Such a fixing part 10 is preferably (1) a non-adhesive foam base material provided with an adhesive layer on both sides or (2) an adhesive foam base material. Similarly to the coating layer 4, the fixing portion 10 repeatedly contracts and expands due to environmental changes such as temperature and humidity, and stress is applied to the fixing portion 10. Similarly, it is preferable that the density is 1 or less, the elongation is 20% or more, and the tensile strength at break is 30 N / cm ² or more. The measuring method of elongation rate and tensile breaking strength is to obtain the elongation rate and breaking strength when a fixed part sample cut to 25 mm width is pulled at 300 mm / min according to JIS Z0237 (1999).

  The above (1) is a film or the like used as a substrate formed with bubbles or voids by some means, and itself does not have so-called adhesiveness. Examples include polyolefins (eg, polyethylene, polypropylene, etc.), polyvinyl chloride (eg, soft polyvinyl chloride, hard polyvinyl chloride, etc.), polyesters (eg, polyethylene terephthalate, modified polyethylene terephthalate (commercialized as PET-G)). Films such as polystyrene, polyurethane, cellophane, acrylic resin, etc., foamed film foamed with foaming agent, porous film with inorganic pigments, organic pigments, etc., and voids formed by stretching . Apply an aqueous solution containing urethane foam on a paper substrate, or print or print polystyrene, polyvinylidene chloride, polyvinyl chloride, acrylonitrile-based microcapsules and heat-treat them to foam, or metal roll and metal roll Paper such as foamed paper in which the paper layer part of the paper is foamed through the nip part formed by Or synthetic paper, nonwoven fabrics, etc. can be illustrated.

  An adhesive layer is provided on the surface of the foam. Some foams have innumerable voids on the surface. In this case, it is preferable that a part of the adhesive penetrates into the voids to increase the adhesive strength between the adhesive and the foam. . As the adhesive used for the adhesive, it is preferable to use an acrylic or silicone-based, solventless, solvent-based or emulsion-based adhesive or a similar foamable adhesive described below.

  As an example of (2), a synthetic resin imparted with adhesiveness by impregnating an adhesive into a resin such as polyolefin, polyvinyl chloride, polyester, polystyrene, polyurethane, cellophane, or acrylic shown as an example of (1) An adhesive tape in which a void portion is formed by foaming chemically or mechanically is mainly used. For example, an acrylic foam adhesive tape is obtained by foaming a foaming agent in an acrylic solution before curing and then curing the foaming agent, or by applying an inert gas such as nitrogen gas to the acrylic solution before curing. It is manufactured by mechanical foaming or the like by dispersing and mixing and curing it. Specifically, it is marketed by Sumitomo 3M Co. under the trade name VHB.

The fixing part used in the present invention has an initial elongation rate of 20% or more as defined in JIS Z0237 (1991) and a tensile strength at break of 30 N / cm ² or more, and is outdoors as defined in JIS K 7219 (1998). In the exposure test method A, it is preferable that the film has an elongation of 80% or more and a tensile breaking strength with respect to the initial elongation after 5 years. By satisfying these conditions, it can withstand a poor environment that is exposed to direct sunlight and wind and rain for a long time when used outdoors, and it can also be used at high temperatures, low temperatures, and high temperatures in factories and warehouses. It can withstand long-term storage and use in harsh environments such as humidity.

  By using such a foamed base material having a density of 1 or less for the fixing part 10 of the IC label of the present invention, the impact applied to the IC chip mounting body basic portion 2 from the outside and the vibration absorption are good and are not easily peeled off from the adherend. . Further, when a foam base material having an elongation of 20% or more is used for the fixing portion 10, the deformability is good and even a slight uneven surface can be adhered.

  When the adhesive layer is provided on both surfaces of the foam substrate of (1), there is an interface between the foam layer and the adhesive layer of the substrate, but the adhesive foam substrate of (2) has an integral structure, Compared with (1), the durability is considered to be higher. Of course, the method (2) is more preferable because it is not necessary to use another adhesive layer for bonding to the inlet 15 and the coating layer 14 of other constituent layers when producing an IC label.

  As the base material of the release layer 11 that covers the fixing portion 10, a film or paper that has been subjected to a release treatment such as silicone can be used.

[Bonding]
In order to assemble as an IC label, the IC chip mounting body basic portion 2 and various constituent materials are bonded together.
Specifically, the disassembled individual IC chip mounting body basic portions 2 are pasted between the upper surface side layer group 21 and the fixing portion 10.
The constituent materials may be bonded to each other in the form of a sheet, or the materials supplied by a roll can be bonded to each other.
When using an adhesive or each layer material provided with an adhesive in advance, the release paper is peeled off and bonded with a rubber nip roll or the like so that air does not enter. In this case, it should be noted that since a chip is mounted on the inlet 15, pressure is not applied more than necessary. Since various materials are bonded together, several steps are necessary.
When a hot melt adhesive is used, it is possible to sandwich a solid adhesive sheet between the materials and bond them at a time by hot pressing. In this method, it is necessary to select a material while paying attention to the heat resistance of the material.

  It is also possible to bond each material while applying an adhesive. Although it is similar to the method of bonding with an adhesive, heat may be applied to some extent to cure the adhesive. Compared with the method using an adhesive, the adhesion strength between layers can be improved and the uneven thickness of the inlet 15 can be reduced, but the process becomes complicated and the yield tends to decrease. Moreover, these methods can also be bonded together combining suitably.

[Punching]
In order to label one by one from the molded sheet, it can be cut into a label shape one by one with an electric, pneumatic, Thomson blade attached to a hydraulic press, and a male and female blade.

〔pasting〕
The IC label of the present invention thus prepared is used by peeling off the release layer 11 and overlaying and fixing the fixing portion 10 to the adherend. The IC label of the present invention is composed of a flexible upper surface side layer group, an IC mounting body basic portion, and a fixing portion. Therefore, the whole is flexible and follows and adheres even on a curved surface or uneven surface. I can do it.

  Hereinafter, the present invention will be described more specifically with reference to examples. However, the present invention is not limited thereto.

(Example 1)
The first embodiment will be described with reference to FIG. 1 described above. As shown in FIG. 1, a through hole portion (not shown) is further formed on an inlet support 4 (thickness: 50 μm) provided with a circuit pattern (not shown) including a loop antenna made of aluminum foil on a PET substrate by an etching method. ) Is used as a circuit board, a film-like ACF (not shown) is temporarily pasted on the electrical connection terminals of the circuit board, and the bare IC chips 6 are sequentially temporarily placed on the ACF by a face-down method. An inlet 15 with a cured layer was used. This inlet 15 was an ISO15693-compliant inlet (trade name: TagIT HFI mini, manufactured by Texas Instruments).

Next, the chip part of the inlet 15 obtained by the above operation is covered with an epoxy resin 7 (A1004 manufactured by Nagase Ciba) and a metal plate 8 (SUS304 100 μm thickness, 3 mmφ), and heated to 100 ° C. for 30 minutes to chip. Reinforcement was performed. Magnetic sheet produced by kneading silicon steel powder as a magnetic metal in chlorinated polyethylene to be the non-conductive magnetic permeable layer 5 provided with the adhesive layers 3a and 3b (trade name: noise countermeasure sheet PE72 manufactured by FDK, non-conductive Permeable magnetic layer thickness 250 μm, volume resistance value 10 ⁶ Ω · m, attached adhesive layers 3 b, 3 c thickness 45 μm), a 3.2 mmφ opening is formed at the position where the IC chip reinforcing portion of the inlet 15 is hit It was. The inlet 15 was bonded to the IC chip portion through the adhesive layer 3b so that the IC chip portion of the inlet 15 came to the hole portion of the non-conductive magnetic permeable layer 5. Next, an aluminum foil (produced by Toyo Aluminum Co., Ltd., aluminum part thickness 30 μm) to be the conductive layer 9 is bonded to the non-conductive magnetic permeable layer through the adhesive layer 3a, and the IC chip mounting body basic portion 2 shown in FIG. It was.

Next, the water-resistant barrier layer 1 (PVDC single film, trade name: HB Keiflex, thickness 15 μm, JIS K 7126 has a water vapor permeability of 1.0 g / m ² · 24 h · atm, an oxygen permeability of 1 cc / m ²・ 24h ・ atm, Kureha Chemical Co., Ltd.) on one side, coating layer 14 (trade name: Scotch Cal, thickness 85μm, made by Sumitomo 3M), stress relief adhesive layer 16 (trade name: VHB structural bonding tape Y on the opposite side) −4930, thickness 640 μm, manufactured by Sumitomo 3M Limited) was used as the upper surface side layer group 21. The IC chip mounting body basic portion 2 obtained as described above is placed between the upper surface side layer group 21 and the fixing portion 10 (trade name: VHB structural bonding tape Y-4930, thickness 640 μm, manufactured by Sumitomo 3M). As shown in FIG. 2, the end face of the basic part 2 of the IC chip mounting body was sandwiched as shown in FIG. 2, and punched out to a size of 30 mm × 54 mm with a Thomson blade to obtain the flexible IC label of the present invention.

The coating layer 14 used in this example was a vinyl chloride film provided with an acrylic durable adhesive layer 13. This coating layer has an initial elongation specified in JIS Z0237 (1991) of 100% or more and a thickness of 20 μm or more and 150 μm or less, and 5 in the outdoor exposure test A method specified in JIS K 7219 (1998). The performance of having an elongation of 80% or more with respect to the initial elongation after a year was satisfied. The joining tape used by the fixing portion 10 was an acrylic adhesive foam base as described above. This bonding tape also has an initial elongation of 20% or more as defined in JIS Z0237 (1991) and a tensile breaking strength of 30 N / cm ² or more, and 5 in the outdoor exposure test A method defined in JIS K 7219 (1998). After a year, it satisfied the performance of having an elongation rate of 80% or more and tensile breaking strength with respect to the initial elongation rate.

(Example 2)
Transparent vapor-deposited film (silica vapor-deposited film, trade name: Tech barrier H, thickness 12 μm, water vapor permeability of JIS K 7126 of 0.3 g / m ² · 24 h · atm, oxygen on the water-resistant barrier layer 1 of the upper surface side layer group 21 An IC label was obtained in the same manner as in Example 1 except that the transmittance was 0.5 cc / m ² · 24 h · atm (manufactured by Mitsubishi Chemical Kojin Bucks).

Example 3
Transparent vapor-deposited film (silica + alumina binary vapor-deposited film, product name: Ecosiale, thickness 12 μm, water vapor permeability of JIS K 7126 of 1 g / m ² · 24 h · atm, oxygen on the water-resistant barrier layer 1 of the upper surface side layer group 21 As shown in FIG. 6 (b), two sheets of light transmittance of 1 cc / m ² · 24 h · atm (manufactured by Toyobo Co., Ltd.) are used and bonded together by a low-density polyethylene layer 80 μm that becomes the adhesive layer 18 An IC label was obtained in the same manner as in Example 1 except that was used.

(Example 4)
A transparent vapor-deposited film (alumina vapor-deposited film, trade name: Fine Barrier-AT, thickness 12 μm, water vapor permeability of JIS K 7126 is 1 g / m ² · 24 h · atm, oxygen permeation) Example, except that the degree is 1.5 cc / m ² · 24 h · atm, manufactured by Reiko Co., Ltd., and double-sided adhesive tape (trade name: No. 500, thickness 170 μm, manufactured by Nitto Denko Corporation) is used for the fixing part 10 In the same manner as in Example 1, an IC label was obtained.

(Example 5)
The fifth embodiment will be described with reference to FIG. 8 described above. The upper surface and the lower surface of the IC chip mounting body basic portion 2 having the same configuration as the IC chip mounting body basic portion used in Example 1 are covered with water-resistant barrier layers 1a and 1b, respectively. As each water-resistant barrier layer, transparent vapor-deposited film (silica vapor-deposited film, trade name: Tech barrier H, thickness 12 μm, water vapor permeability of JIS K 7126 is 0.3 g / m ² · 24 h · atm, oxygen permeability is 0.5cc / m ² · 24h · atm (manufactured by Mitsubishi Chemical Kojin Bucks Co., Ltd.) was used. The single structure of the water-resistant barrier layer is the same as that shown in FIG. The water-resistant barrier layers 1a and 1b were each covered so that the polyethylene layer side faces the IC chip mounting body basic portion 2, and the portions of the two layers facing each other were thermocompression bonded under reduced pressure. In the figure, a bonding tape (trade name: VHB structural bonding tape Y-4930, thickness 640 μm, manufactured by Sumitomo 3M Limited) is applied as a stress relaxation adhesive layer 16 to the upper water-resistant barrier layer 1a, and a coating layer 14 is further formed thereon. A film (trade name: Scotch Cal, thickness 85 μm, manufactured by Sumitomo 3M) was attached. The water-resistant barrier layer 1a, the stress relaxation adhesive layer 16, and the coating layer 14 constitute an upper surface side layer group.
In the figure, a double-sided adhesive tape (trade name: No. 500, thickness 170 μm, manufactured by Nitto Denko Corporation) was attached to the lower water-resistant barrier layer 1b as the fixing portion 10 to obtain an IC label.

(Comparative Example 1)
The coating layer 14 of the upper surface side layer group 21 is a white PET film (trade name: U2, thickness 75 μm, manufactured by Teijin Ltd.) and an adhesive (Cybinol AT-560 / strongly adhesive acrylic emulsion, manufactured by Seiden Chemical Co., Ltd.) to a thickness of 20 μm. The coated layer is used as a water-resistant barrier layer 1 as a transparent vapor-deposited film (silica vapor-deposited film, trade name: Tech Barrier H, thickness 12 μm, JIS K 7126 has a water vapor permeability of 0.3 g / m ² · 24 h · atm An IC label was obtained in the same manner as in Example 1 except that oxygen permeability of 0.5 cc / m ² · 24 h · atm, manufactured by Mitsubishi Chemical Kojin Bucks Co., Ltd. was used.

(Comparative Example 2)
An IC label was obtained in the same manner as in Example 1 except that the water-resistant barrier layer 1 was removed from the upper surface side layer group 21.

(Comparative Example 3)
A layer of 9 μm-thick aluminum foil and 12 μm-thick PET film, which are intermediate products used for retort food packaging, bonded to the water-resistant barrier layer 1 of the upper surface side layer group 21 (thickness 25 μm, JIS K 7126 has a water vapor permeability of approx. An IC label was obtained in the same manner as in Example 1 except that 0 g / m ² · 24 h · atm, oxygen permeability ≈0 cc / m ² · 24 h · atm, manufactured by Toyo Aluminum Co., Ltd. was used.

(Comparative Example 4)
Aluminum vapor-deposited PET film (trade name: VM-PET 1200 (# 12), thickness 12 μm, water vapor permeability of JIS K 7126) of 0.7 g / An IC label was obtained in the same manner as in Example 1 except that m ² · 24 h · atm, oxygen permeability 0.7 cc / m ² · 24 h · atm, manufactured by Toyo Metallizing Co., Ltd. was used.

(Comparative Example 5)
Except that the double-sided adhesive tape (trade name: No. 500, thickness: 170 μm, manufactured by Nitto Denko Corporation) was used for the stress relaxation adhesive layer 16 of the upper surface side layer group 21 and the fixing portion 10, the same as in Example 1. An IC label was obtained.

(Comparative Example 6)
An IC label was obtained in the same manner as in Example 1 except that a double-sided adhesive tape (trade name: No. 500, thickness: 170 μm, manufactured by Nitto Denko Corporation) was used for the stress relaxation adhesive layer 16 of the upper surface side layer group 21. .

(Evaluation)
The samples prepared as the examples and comparative examples were measured by the following method.

1. Durability test In the state where the IC label is attached on a metal plate (SUS304 plate having a thickness of 1 mm), the following various durability tests are conducted. The IC label was evaluated.
[Weather resistance test]
According to JIS K7219 (1998), outdoor exposure was performed for 1 year at an inclination of 25 °.
[Water pressure test]
Seawater was put into a high-pressure vessel, the tag was submerged therein, pressurized to 0.5 MPa (gauge pressure), taken out after 30 minutes, and left in an air atmosphere for 30 minutes was repeated 500 times.
[Light resistance test]
An irradiation test was conducted for 5,000 hours using a sunshine carbon arc lamp type light resistance and weather resistance tester specified in JIS B7753 (1993).

2. Evaluation of IC label a) Measurement of communication feasibility The communication feasibility was performed by an evaluation apparatus in which a weak reader / writer (RI-K10-001A, manufactured by Texas Instruments) was connected to a personal computer. In each state, the reader / writer antenna and the label that can be read at a distance of 10 mm or more are marked with ◯, the one that is read in a distance range from 0 to 10 mm is △, and the one that is not readable at all is marked with ×. .
b) Appearance Visually, the difference in appearance before and after the test was sensory evaluated. Specifically, it was visually observed, and it was confirmed that there were no defects in appearance such as peeling, wrinkling, blistering.
The above measurement results are summarized in Table 1 below.

The communication test in the leftmost column in Table 1 was performed before the durability test.
In Comparative Example 1, in the light resistance test, the surface PET was cracked, rainwater soaked in, or could not communicate due to short circuit.
In Comparative Example 2, in the water pressure resistance test, water and dissolved gas entered through the coating layer and blistering occurred. Also, communication was not possible due to a short circuit.
Since the comparative example 3 cannot communicate, various durability tests were canceled.
In Comparative Example 4, the communication distance was shorter than that of a normal tag.
In Comparative Example 5, an edge lift occurred between the metal plate of the adherend and the end face of the fixed part in the weather resistance test. In the future, there is a high possibility of peeling off naturally or hitting an object.
Comparative Example 6 caused delamination between the water-resistant barrier layer 1 and the stress relaxation adhesive layer in the weather resistance test. There is a high possibility that water will enter from this part in the future and communication failure will occur.

Sectional drawing of an example of the IC mounting body basic part used for the IC label of this invention Sectional drawing of one Example of IC label of this invention Cross section of another example of possible IC labels Cross section of another example of possible IC labels The top view of another one Example of the IC label of this invention 6 (a), (b), and (c) are cross-sectional views showing examples of the water-resistant barrier layer, respectively. Sectional drawing of another one Example of the IC label of this invention Sectional drawing of another one Example of the IC label of this invention

Explanation of symbols

1, 1a, 1b Water-resistant barrier layer 2 IC chip package basic part 6 IC
10 Fixing part 14 Covering layer 16 Stress relaxation adhesive layer

Claims (7)

A flat IC chip mounting body basic portion having an upper surface and a lower surface having an antenna circuit to which an IC is connected, a stress relaxation adhesive layer having a surplus portion covering at least the entire upper surface of the IC chip mounting body basic portion, water resistance An upper surface side layer group having a barrier layer and a water-tight coating layer so that the water-tight coating layer is located at least on the surface side, and a water-tight coating having at least a fixed portion covering the entire lower surface of the basic part of the IC chip mounting body. A fixing portion having a fixing portion having a surface to be attached to the adherend on a surface opposite to the surface covering the IC chip mounting body basic portion, and at least a part of the upper surface side layer group surplus portion; At least a part of the fixed part surplus part is bonded so as to seal the periphery of the basic part of the IC chip mounting body, and the upper surface side layer group surplus part of the peripheral part is recessed to adhere the lower fixed part To the body IC labels substantially plane Chakumen. 2. The IC label according to claim 1, wherein the water-resistant barrier layer is a layer having at least one kind of synthetic resin film among polyvinylidene chloride resin, nylon resin, and polyacrylonitrile resin. 2. The IC label according to claim 1, wherein the water-resistant barrier layer is a layer having at least one inorganic material film. The said watertight coating layer is a layer having at least one kind of synthetic resin film among vinyl chloride resin, polyolefin resin, fluorine resin, and silicone resin. IC label. The IC according to any one of claims 1 to 4, wherein the watertight fixing portion and the stress relaxation adhesive layer are an adhesive foam base material or a layer having a non-adhesive foam base material having an adhesive layer on both sides. label. An IC chip in which the basic part of the IC chip mounting body includes at least an antenna circuit to which an IC is connected, a non-conductive permeable layer containing a permeable material, and a conductive layer positioned further on the fixed part side of the non-conductive permeable layer. The IC label according to any one of claims 1 to 5, which is a basic part of a mounting body. The IC label according to any one of claims 1 to 6, further comprising a second water-resistant barrier layer between the fixed portion and a lower surface of the IC chip mounting body basic portion.

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