JP2006343878A - Ic tag and mounting structure of ic tag - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC tag and a mounting structure of the IC tag capable of protecting an inlet from external force and preventing damage on an IC chip. <P>SOLUTION: The IC tag 10 is provided with a high-rigidity member 14 having high-rigidity arranged at one side of the inlet 11 and a pressure relieving layer 20 which is arranged at a side opposite to the high-rigidity member 14 of the inlet 11 and relieves pressure applied on the inlet 11. When external force is applied on the IC tag 10, a local impact is relieved by the high-rigidity member 14, and the inlet 11 can be protected so that the pressure applied on the whole is relieved by the pressure relieving layer 20. Accordingly, damage on the IC chip 3 can be prevented. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an IC tag that is directly or indirectly attached to an identification object and performs non-contact information communication, and an IC tag attachment structure.

  Conventionally, this type of IC tag includes an IC chip that records and holds information and an antenna, and can read information in a non-contact manner by wireless communication using a dedicated reader. . IC tags are small, have a large amount of information that can be stored, and can be recognized individually, so it is necessary to manage the process of products and products in factories, manage the distribution status, and identify individuals. It is also used for various tickets.

In recent years, the use of such IC tags has spread to various fields. For example, examples of use in harsh outdoor environments such as management of containers, pallets, and building materials for transportation are increasing. Yes.
A conventional IC tag is attached to the surface of an article to be identified such as a product or a pallet with an adhesive or the like. However, in the process of distribution or the like, the IC chip or antenna is damaged and stored due to impact or pressure. There was a problem that it was impossible to read the information that was being used. Further, there has been a problem that the information display for backup written on the display surface of the IC tag disappears due to long-term use or impact.

Patent Document 1 and Patent Document 2 are examples of preventing damage to an IC tag due to impact or pressure. However, Patent Document 1 is effective when pressure is applied to the entire IC tag, but there is a problem that the IC chip and the like are damaged when pressure is applied locally. Patent Document 2 is also effective for local pressure, but has a problem that the structure of the IC tag is complicated, the manufacturing process is complicated, and it is difficult to provide a large amount at a low cost.
JP-A-2005-71063 JP 2005-100114 A

  An object of the present invention is to provide an IC tag and an IC tag mounting structure that can protect an inlet from external force and prevent damage to an IC chip or the like.

The present invention solves the above problems by the following means. In addition, in order to make an understanding easy, although the code | symbol corresponding to the Example of this invention is attached | subjected and demonstrated, it is not limited to this.
The invention of claim 1 is an IC tag that is directly or indirectly attached to an identification object (100, 300) and performs non-contact information communication, and includes an IC chip (3) and the above-mentioned substrate layer (1). An inlet (11) provided with an antenna (2) connected to an IC chip, an adhesive layer (12) disposed on one side of the inlet and capable of being attached to an object to be attached (14); It is an IC tag provided with the pressure relaxation layer (20) which is arrange | positioned on the opposite side to the said adhesion layer of the said inlet, and relieves the pressure added to the said inlet.
According to a second aspect of the present invention, there is provided the IC tag according to the first aspect, wherein a peeling member (21) temporarily attached so as to be peelable is provided on the sticking layer (12). It is a tag.
The invention of claim 3 is an IC tag that is directly or indirectly attached to the identification object (100, 300) and performs non-contact information communication. The IC chip (3) An IC tag comprising an inlet (11) provided with an antenna (2) connected to an IC chip, and a highly rigid member (14) disposed on one side of the inlet and having high rigidity.
The invention of claim 4 is an IC tag that is directly or indirectly attached to the identification object (100, 300) and performs non-contact information communication. The IC chip (3) An inlet (2) connected to an IC chip is fixed, and is disposed on one side of the inlet, and is a highly rigid member (14) having high rigidity and disposed on the opposite side of the inlet from the highly rigid member. And an IC tag comprising a pressure relaxation layer (20) for relaxing the pressure applied to the inlet.
According to a fifth aspect of the present invention, in the IC tag according to any one of the first to fourth aspects, the pressure relaxation layer (20) can be contracted to at least 1/10 of a volume in a free state. It is an IC tag characterized by being.
The invention of claim 6 is the IC tag according to any one of claims 1 to 5, wherein the IC tag is provided between the high-rigidity member (14) and the inlet (11). An IC tag comprising an information display layer (13) for displaying information including a pattern, wherein the information display layer is visually or optically readable from the high-rigidity member side.
The invention according to claim 7 is the IC tag according to claim 6, wherein the high-rigidity member (14) is transparent or translucent.
The invention according to claim 8 is the IC tag according to any one of claims 1 to 7, wherein the bonding is formed between the high-rigidity member (14) and the information display layer (13). It is an IC tag characterized by having a sticking layer (12).
The invention of claim 9 is the IC tag according to claim 8, wherein the affixing layer (12) is transparent or translucent.
The invention of claim 10 is the IC tag according to any one of claims 6 to 9, wherein the information display layer (13) displays unique information (13a). Is an IC tag.
The invention of claim 11 is the IC tag according to any one of claims 6 to 10, wherein the information display layer (13) is a layer capable of non-contact printing by external energy. The IC tag characterized by the above.
The invention of claim 12 is the IC tag according to any one of claims 1 to 11, wherein the inlet (11) is waterproofed. is there.
The invention of claim 13 is the IC tag according to claim 12, characterized in that the inlet (11) has at least the antenna (2) and the IC chip (3) covered with a waterproof layer. It is an IC tag.
According to a fourteenth aspect of the present invention, in the IC tag according to the sixth to thirteenth aspects, the information display layer (13) includes at least one ultraviolet absorber on the side opposite to the inlet (11). The IC tag is characterized in that a layer is provided.
The invention of claim 15 is an IC tag mounting structure for mounting the IC tag according to any one of claims 1 to 14 to the identification object (100, 300), wherein the identification object Includes an attachment portion (101) for attaching the IC tag (10), and includes a fixing means (110) for fixing the IC tag to the attachment portion, and the IC tag includes the information display layer (13). Is fixed by the fixing means so as to be visually readable or optically readable.
The invention of claim 16 is the IC tag mounting structure according to claim 15, wherein the mounting portion (101) is a hole that can accommodate the IC tag. It is.
According to a seventeenth aspect of the present invention, in the IC tag mounting structure according to the sixteenth aspect, the surface of the high-rigidity member (14) and the surface of the identification object (100) are approximately the IC tag (10). The IC tag mounting structure is characterized by being embedded so as to match.
The invention of claim 18 is the IC tag mounting structure according to any one of claims 15 to 18, further comprising a positioning portion (102) for determining a position of the high-rigidity member (14). An IC tag mounting structure characterized by the above.

According to the present invention, the following effects can be obtained.
(1) The pressure relaxation layer is disposed on the opposite side of the inlet attachment layer and relaxes the pressure applied to the inlet, so that an external force is applied to the IC tag and the inlet can be prevented from being damaged.
(2) Since the peeling member is temporarily attached to the sticking layer so as to be peelable, it can be provided as a label and is easy to work.
(3) Since the high-rigidity member is arranged on one side of the inlet and has high rigidity, when a local external force is applied to the IC tag from the side where the high-rigidity member is provided, the inlet is protected, and the IC It is possible to prevent the chip and the like from being damaged.
(4) The high-rigidity member is disposed on one side of the inlet and has high rigidity, and the pressure relaxation layer is disposed on the opposite side of the high-rigidity member of the inlet and relieves pressure applied to the inlet. The inlet can be protected from a local external force applied, pressure applied to the entire IC tag, and the like, and the IC chip and the like can be prevented from being damaged.
(5) Since the pressure relaxation layer can shrink to at least 1/10 of the volume in the free state, the pressure applied to the inlet can be sufficiently relaxed. Accordingly, it is possible to prevent the IC chip or the like from being damaged due to pressure applied to the inlet.
(6) The information display layer is provided between the high-rigidity member and the inlet, displays information including characters and / or symbols, and can be visually or optically read from the high-rigidity member side. Therefore, the display of the information display layer can be protected together with the inlet by the highly rigid member.
(7) Since the high-rigidity member is transparent or translucent, the display of the information display layer can be visually observed through the high-rigidity member, and optical reading is also possible.
(8) Since the affixing layer is formed between the high-rigidity member and the information display layer, the high-rigidity member and the information display layer can be easily joined.
(9) Since the affixing layer is transparent or translucent, the display of the information display layer can be visually confirmed, and optical reading is also possible.
(10) Since the information display layer displays unique information, it can provide information unique to the identification target object. Therefore, it is possible to identify the identification object as a single unit.
(11) Since the information display layer is a layer capable of non-contact printing by external energy, printing can be performed even if there is a peeling member, an adhesive layer, or the like between the information display layer and the printing means. Therefore, it is possible to print in a state where the peeling member is temporarily pasted on the pasting layer.
(12) Since the inlet is waterproofed, the inlet can be prevented from being short-circuited by getting wet, etc., and the IC chip or the like being damaged.
(13) Since at least the antenna and the IC chip are covered with the waterproof layer, the inlet can prevent the IC chip or the like from being damaged by being wetted with water or the like.
(14) Since a layer containing at least one ultraviolet absorber is provided on the side opposite to the inlet of the information display layer, it is possible to prevent the display of the information display layer from fading due to ultraviolet rays. Therefore, it is possible to display information for backup required for a case where the IC tag is damaged, for a long period of time.
(15) The identification object is provided with a mounting portion for mounting the IC tag, and includes a fixing means for fixing the IC tag to the mounting portion, so that the information display layer can be visually or optically read. Since it is an IC tag mounting structure that is fixed by a fixing means, it displays information such as a barcode for backing up information stored in the IC tag, information that needs to be provided visually, and the like. It can be securely fixed to objects.
(16) Since the attachment portion is a hole that can accommodate the IC tag, the IC tag can be protected from an external force and can be more reliably fixed.
(17) Since the IC tag is embedded so that the surface of the high-rigidity member and the surface of the identification target are substantially coincident with each other, it is difficult to receive external force and the reliability of the IC tag can be improved. The finish is also beautiful.
(18) Since the positioning portion determines the position of the high-rigidity member, the IC tag can be easily attached, and the working efficiency can be improved. The finish is also beautiful.

  The purpose of the present invention is to provide an IC tag and an IC tag mounting structure that can protect the inlet from external force and prevent damage to the IC chip, etc., and a highly rigid and highly rigid member is disposed on one side of the inlet. This was realized by arranging a pressure relaxation layer for relaxing the pressure applied to the inlet on the opposite side of the inlet from the high-rigidity member.

FIG. 1 is a diagram for explaining an embodiment 1 of an IC tag according to the present invention.
FIG. 2 is a diagram illustrating an IC tag and an IC tag mounting structure according to the first embodiment. FIG. 2A is a plan view of an IC tag attached to a concrete block, and FIG. 2B is a diagram schematically showing a cross section cut along an arrow AA in FIG.
The IC tag 10 of this embodiment is accommodated in a mounting hole 101 provided in the concrete block 100, and the surface of the IC tag 10 is substantially flush with the surface of the concrete block 100. The IC tag 10 is fixed and attached to the concrete block 100 with an adhesive 110. In the present embodiment, as shown in FIG. 2, the IC tag 10 shows an example in which the adhesive 110 is applied and fixed between the mounting hole 101 and the high-rigidity member 14 described later. Not limited to this, the adhesive 110 may be filled and fixed between the IC tag 10 and the mounting hole 101.
The IC tag 10 includes an inlet 11, an adhesive layer 12, an information display layer 13, a high-rigidity member 14, and the like.

Here, the IC tag will be described.
IC tags can be roughly classified into the following four types depending on the frequency band used for non-contact communication.
(1) 125 kHz to 135 kHz band The IC tag in this frequency band is mainly used in the FA (Factor Automation) field and the like, and is the RFID (Radio Frequency Identification) system with the longest history.
Communication method: Electromagnetic induction Tag shape: Coil antenna wound in a mandrel shape, Number of coil turns: Several tens of turns Communication distance: Up to about 1 m (2) 13.56 MHz band IC tags in this frequency band are currently most widely used ing.
Communication method: electromagnetic induction Tag shape: antenna coil, number of coil turns: about 3 to 10 turns Communication distance: up to about 70 cm (3) 860 MHz to 960 MHz band (UHF band)
IC tags in this frequency band have been adopted by major distribution companies in Europe and the United States, and are rapidly gaining attention.
Communication method: Microwave method Tag shape: Dipole antenna (Antenna length: about 16cm)
Deformed dipole (antenna length: about 5-10cm)
Patch antenna (antenna length: about 5-10cm)
Communication distance: Up to about 10 m (4) 2.45 GHz band IC tags in this frequency band are used for container management and the like because they have a relatively long communication distance.
Communication method: Microwave method Tag shape: Dipole (Antenna length: approx. 6cm)
Communication distance: about 2 m at maximum This embodiment will be described using an IC tag having a frequency band of 13.56 MHz and having an antenna coil of about 3 to 10 turns as an example, but any of the above four types of IC tags Or an IC tag using a communication frequency other than these.

FIG. 3 is a diagram for explaining the inlet used for the IC tag of this embodiment. FIG. 3A is a plan view of the inlet, and FIG. 3B is a diagram schematically showing a cross section of the inlet.
The inlet 11 includes an antenna coil 2 formed on the base film 1 by etching or the like, and an IC chip 3 to which both end portions 2a and 2b of the antenna coil 2 are connected. The base film 1 is a thin sheet-like member formed of polyethylene terephthalate or the like. The antenna coil 2 is made of aluminum or the like.

Returning to FIG. 2, the affixing layer 12 is a layer that is disposed on one side of the inlet 11 and that can be affixed to the high-rigidity member 14 described later. This affixing layer 12 is transparent or translucent, and is formed of an adhesive such as polyacrylic acid ester, rubber-based pressure-sensitive adhesive, or silicone pressure-sensitive adhesive.
The high-rigidity member 14 is a plate-like member made of transparent polycarbonate, and has a role of protecting the inlet 11. The high-rigidity member 14 of the present embodiment uses a 2.0 mm-thick plate formed of polycarbonate ace (manufactured by Chuchu Plastic Industry Co., Ltd.), which is a polycarbonate resin. This is transparent or translucent in order to ensure the strength necessary to prevent the destruction of the inlet 11 when receiving external force and to make the information displayed on the information display layer 13 visible or optically readable. The material that can be selected.

The polycarbonate used for the high-rigidity member 14 has a high strength with a bending strength of 93.1 MPa, a bending elastic modulus of 2350 MPa, an Izod impact strength of 780 J / m, and a high transparency with a total light transmittance of 89%. ing.
In addition, if the high-rigidity member 14 has high rigidity and high impact resistance and is transparent or translucent, for example, the same polycarbonate resin Stella (manufactured by Mitsubishi Plastics, Inc.) is used. It is also possible to use materials other than polycarbonate resin. For example, an acrylic resin (bending strength 108 to 118 MPa, bending elastic modulus 2940 to 3040 MPa, Izod impact strength 19.6 to 29.4 J / m, total light transmittance 92%) may be used. Tempered glass may be used.

The information display layer 13 is provided between the inlet 11 and the affixing layer 12, and is optically read by a dedicated reader such as a serial number such as a production number, an expiration date, a company name, a symbol such as a logo, a logo mark, or a barcode. It is a layer that displays information such as symbols to be read. Of the information 13a and 13b displayed by the information display layer 13, the information 13a is unique (unique) information for a single identification target such as a manufacturing number of the concrete block 100 to which the IC tag is attached. A method for forming the information 13a will be described later.
The background layer 15 is provided on the back side (inlet 11 side) of the information display layer 13 and is joined to the inlet 11 via the adhesive layer 16. The background layer 15 is a layer that makes it easy to visually recognize the display of the information display layer 13. In this embodiment, the background layer 15 uses an opaque white sheet-like member. However, in order to make the information display on the information display layer 13 easily visible, the color may be changed as appropriate. A pattern may be provided as a background.

The protective layer 18 is a layer that is bonded to the back surface side of the inlet 11 (the side opposite to the adhesive layer 12) by the adhesive layer 17 and protects the inlet 11. The protective layer 18 is made of a sheet or film member such as polyethylene or polypropylene.
The pressure relaxation layer 20 is bonded to the back side of the protective layer 18 (the side opposite to the attachment layer 12) via the adhesive layer 19, and relieves pressure applied to the inlet 11.
The pressure relaxation layer 20 of this example uses peach urethane (manufactured by Nisshinbo Industries, Inc.), which is a soft urethane having a thickness of 2.0 mm. The reason for using this peach urethane is to obtain an effect of lowering the pressure applied to the inlet 11 by the elastic deformation of the pressure relaxation layer 20 when an external force is applied. It is selected as a material with properties. The pressure relaxation layer 20 of the present embodiment can be shrunk to a volume of 10% or less of the volume in a free state, can prevent high pressure from being applied to the inlet 11, and can prevent damage to the inlet 11.
The pressure relaxation layer 20 may be made of a material other than soft urethane as long as it has excellent buffering properties (rebound resilience of less than 20%). For example, rubber, various foams, etc. can be used.
In FIG. 2, the end of the IC tag 10 is shown in a cut shape because it is schematically shown, but in reality, the base film 1 and the background layer 15 are joined to each other by the adhesive layer 16 at both ends. Has been.

The high-rigidity member 14 and the pressure relaxation layer 20 described above both have an effect of protecting the inlet 11, but the required physical property values are contradictory. The reason for this combination will be described below.
First, since the high-rigidity member 14 is provided on the outermost surface side of the IC tag 10, a normally considered external force is applied to the high-rigidity member 14. The high-rigidity member 14 is provided to prevent the external force from concentrating on a part of the inlet 11 when a strong local external force is applied. For example, when it is struck by something like a stick with a sharp tip, it plays the role of dispersing the external force throughout the inlet 11. Since the external force is distributed and applied, for example, the force applied to the IC chip 3 that is most easily damaged can be reliably reduced, and the function of the inlet 11 can be maintained.

  On the other hand, when a very strong external force is applied to the high-rigidity member 14, the pressure relaxation layer 20 receives strong pressure due to the inlet 11 being sandwiched between the high-rigidity member 14 and the concrete block 100 that is the identification target. It plays a role to prevent that. As described above, since the pressure relaxation layer 20 has a buffering property, when a very strong external force is applied to the high-rigidity member 14, it is elastically deformed and a strong pressure is applied to the inlet 11. Can be prevented.

  As described above, the IC tag of this embodiment is configured by providing the high-rigidity member 14 on the outermost surface side and providing the pressure relaxation layer 20 between the inlet 11 and the concrete block 100 that is the identification object. 10 is a harsh environment in which the inlet 11 can be prevented from being damaged regardless of whether a local strong external force is applied or a very strong external force is applied as a whole. Even underneath, high reliability can be secured.

According to the present embodiment, since the high-rigidity member 14 and the pasting layer 12 are transparent, the information 13a and 13b displayed on the information display layer 13 can be viewed from the surface side of the high-rigidity member 14. Therefore, the barcode displayed on the information display layer 13 can also be optically read using a dedicated reader.
Furthermore, according to the present embodiment, the high rigidity member 14 and the pressure relaxation layer 20 can prevent the IC chip 3 and the like from being damaged even when a strong external force is applied from the high rigidity member 14 side.

(Method for forming information on information display layer)
FIG. 4 is a diagram schematically showing a process of displaying information on the information display layer. FIG. 4A is a side view, and FIG. 4B is a perspective view.
The IC tag 10U is in a state before the information 13a is formed on the information display layer 13. Note that the information 13b is formed in the information display layer 13 in advance.
A separator 21 is temporarily attached to the IC tag 10U and wound up in a roll shape. The separator 21 is a transparent peeling member temporarily attached to the sticking layer 12 so as to be peelable. In this embodiment, the separator 21 is a transparent peeling member, but a semi-transparent material may be used.

  The printer 200 is a printer that forms information 13a on the IC tag 10U, and can form information 13a on the information display layer 13 through the separator 21 in a non-contact manner. In the present embodiment, the printer 200 performs printing with a laser beam, but is not particularly limited as long as information can be printed on the information display layer 13 through the separator 21 in a non-contact manner using external energy. For example, a pressure-sensitive printer or a thermal printer can be used.

  Since the separator 21 is transparent, the information 13a and 13b formed on the information display layer 13 can be confirmed by visual observation or optical reading without peeling off the IC tag 10U from the separator 21. Therefore, it is possible to easily check whether the information 13a printed by the printer 200 is correct or incorrect and information when the IC tag is attached.

(IC tag provision form and attachment process)
As a form of providing the IC tag, (A) the IC tag 10A temporarily attached to the separator 21 and not laminated with the high-rigidity member 14 and the pressure relaxation layer 20, and (B) temporarily attached to the separator 21 and the pressure relaxation layer 20 Are stacked, but the high-rigidity member 14 is divided into the IC tag 10B which is a separate member, and (C) the IC tag 10C where the high-rigidity member 14 and the pressure relaxation layer 20 are laminated.
Hereinafter, the attachment process of IC tag 10 is demonstrated for every provision form.

(IC tag provision form A)
FIG. 5 is a diagram schematically illustrating an example of an IC tag attachment process according to the present embodiment.
The IC tag 10A shown in FIG. 5 is provided in the above-described IC tag 10 without the high-rigidity member 14 and the pressure relaxation layer 20, and is temporarily attached to the separator 21 by the attachment layer 12. It is wound into a roll.
For the sake of explanation, in FIG. 5 and FIG. 6 to be described later, the IC tag 10A and the IC tag 10B are shown exaggerated and enlarged, but they are actually thin and do not hinder winding.
The operator peels off the IC tag 10 </ b> A in this form of provision from the separator 21 and affixes the high-rigidity member 14 to the affixing layer 12. The pressure relaxation layer 20 is laid on the bottom of the concrete block 100 facing the opening of the mounting hole 101, the adhesive layer 19 is formed on the protective layer 18, and the IC tag 10 </ b> A is accommodated in the mounting hole 101. At this time, the protective layer 18 is joined to the pressure relaxation layer 20 by the adhesive layer 19.
Next, as shown in FIG. 2 (b), the operator applies adhesive 110 or the like between the high-rigidity member 14 and the attachment hole 101 to seal the attachment hole 101, and the high-rigidity member 14, the IC tag 10 </ b> A, and the pressure relaxation layer 20 are fixed to the attachment hole 101.

  In the attachment process according to this form of provision, an example in which the adhesive 110 is applied between the high-rigidity member 14 and the attachment hole 101 has been shown. It may be filled. Moreover, in this provision form, although the adhesion layer 19 was formed in the protective layer 18 in the attachment process, and the pressure relaxation layer 20 and the protective layer 18 were joined, the adhesion layer 19 may be abbreviate | omitted suitably. .

By adopting such an IC tag provision form, the member used by the worker for the high-rigidity member 14 and the pressure relaxation layer 20 according to the environment in which the concrete block 100 to which the IC tag is to be installed is installed, the period of use, and the like Can be selected as appropriate.
Further, the pressure relaxation layer 20 is not limited to a sheet-like material, and a resin or the like that fills the mounting hole 101 can be used.

(IC tag provision form B)
FIG. 6 is a diagram schematically illustrating an example of an IC tag attachment process according to the present embodiment.
The IC tag 10B shown in FIG. 6 is provided in a state in which only the high-rigidity member 14 is not provided in the above-described IC tag 10, and is wound up in a state of being temporarily attached to the separator 21 by the adhesive layer 12. It has been.
The operator peels off the IC tag 10 </ b> B of this provision form from the separator 21, affixes the high-rigidity member 14 to the affixing layer 12, and accommodates it in the attachment hole 101 provided in the concrete block 100. The adhesive 110 is applied between the high-rigidity member 14 and the attachment hole 101 to seal the attachment hole 101, and the high-rigidity member 14 and the IC tag 10B are fixed to the attachment hole 101.
By providing such an IC tag providing form, the number of members brought into the work site where the operator attaches the IC tag can be reduced and the working time can be shortened as compared with the attaching step shown in FIG. it can.

FIG. 7 is a diagram schematically illustrating an example of an IC tag attachment process according to the present embodiment.
The IC tag 10 </ b> C shown in FIG. 7 is provided in a state where the high-rigidity member 14 is pasted on the pasting layer 12 in advance. The operator accommodates the IC tag 10C in this state in the mounting hole 101, applies the adhesive 110 between the high-rigidity member 14 and the mounting hole 101, and seals the mounting hole 101. The tag 10C is fixed to the attachment hole 101.
By adopting such an IC tag provision form, the worker only has to bring the IC tag 10C and the adhesive 110 to the work site, and the work time can be greatly shortened and work efficiency can be improved.

  In the present embodiment, an optimal process can be appropriately selected from the examples of the mounting process as described above, from the ease of work, the availability of members, and the like.

FIG. 8 is a diagram for explaining an example 2 of an IC tag and an IC tag mounting structure according to the present invention. FIG. 8A is an enlarged view of a mounting portion of the IC tag, and FIG. 8B is a diagram schematically showing a cross section cut along an arrow BB in FIG. 8A.
In addition, in each Example shown below including a present Example, the part which fulfill | performs the same function as Example 1 is attached | subjected the same code | symbol, and the overlapping description is abbreviate | omitted suitably.
In the present embodiment, as in the first embodiment, the IC tag 10 is accommodated in the mounting hole 101 provided in the concrete block 100 and sealed with the adhesive 110. In this embodiment, the mounting hole 101 is used. Further, a high-rigidity member receiving portion 102 for determining the position of the high-rigidity member 14 is formed in the opening.
By providing the high-rigidity member receiving portion 102, the position of the high-rigidity member 14 can be easily determined, and the surface of the high-rigidity member 14 and the concrete block 100 can be attached while simplifying the mounting work of the IC tag 10. The finish can be beautiful on the same side.

FIG. 9 is a diagram for explaining a third embodiment of the IC tag and the IC tag mounting structure according to the present invention. Fig.9 (a) is an enlarged view of the part to which the IC tag is attached, and FIG.9 (b) is a figure which shows typically the cross section cut | disconnected by the arrow CC of Fig.9 (a).
In FIG. 9, the IC tag 10 is exaggerated for the sake of explanation, but it is actually thin and does not hinder use.
In the present embodiment, the IC tag 10 is attached to the concrete block 300 as in the first embodiment. However, the IC tag 10 is different from the first embodiment in that the mounting hole 101 is not formed in the concrete block 300. .
The IC tag 10 of this embodiment is fixed to the concrete block 300 by being attached to the surface of the concrete block 300 and sealing the edge portion of the IC tag 10 with an adhesive 110.
According to the present embodiment, even when it is difficult to provide the mounting hole 101 in the concrete block 300 or the like to which the IC tag 10 is to be attached, it is possible to attach the IC tag 10 provided with visually or optically readable information. it can.
In addition, the mounting structure is more susceptible to external force than the first and second embodiments, but the high rigidity member 14 and the pressure relaxation layer 20 are provided. The inlet 11 can be sufficiently protected.

(Modification)
The present invention is not limited to the embodiments described above, and various modifications and changes are possible, and these are also within the equivalent scope of the present invention.
(1) In each embodiment, an example in which an IC tag is attached to a concrete block has been shown. However, the present invention is not limited thereto, and may be attached to, for example, a transportation pallet, container, building material, various products, etc. do not do.

(2) In each embodiment, the information displayed on the information display layer has been shown to be non-rewritable. However, the present invention is not limited to this. For example, the information display layer may be easily rewritable using a dedicated printer or the like. Good.

(3) In each embodiment, the IC tag uses a 13.56 MHz frequency band and has an example of an IC tag having an antenna coil of about 3 to 10 turns. There is no particular limitation on the communication method, its shape, and the like.

(4) In each of the examples, the IC tag has shown an example in which the base film and the background layer are joined by the adhesive layer. Alternatively, the waterproof effect may be enhanced by covering the entire inlet with a waterproof film as a waterproof layer.

(5) In each of the embodiments, the example in which the pasting layer is formed so as to cover the entire inlet has been described. However, the present invention is not limited to this. It may be formed. By forming the affixing layer in this manner, information on the information display layer can be visually or optically readable even when the affixing layer is opaque.

(6) In each embodiment, the example in which the high-rigidity member is the outermost surface of the IC tag has been described. However, the present invention is not limited thereto, and a peelable surface protective layer may be provided on the outermost surface side of the high-rigidity member. The surface protective layer is peeled off after completion of the attachment of the IC tag, whereby the surface of the high-rigidity member can be prevented from becoming dirty or damaged during the attachment work of the IC tag.

(7) In Example 1 or Example 2, the IC tag has an example having a pressure relaxation layer. However, the present invention is not limited to this, and an adhesive having a buffer property is provided in the space between the IC tag and the mounting hole. Filling and omitting the pressure relaxing layer may reduce the number of members to improve work efficiency and reduce production costs.

(8) In Example 1 or Example 2, the example in which the pressure relaxation layer is in contact with the bottom surface of the attachment hole portion is shown, but the present invention is not limited thereto, and a space is provided between the pressure relaxation layer and the bottom surface of the attachment hole portion. May be present.

(9) In each embodiment, an example in which an adhesive is used as the fixing means for fixing the IC tag has been shown. do not do.

(10) In FIG. 7 of Example 1, the provision form in which the high-rigidity member and the pressure relaxation layer are stacked on the inlet is shown as an example of the provision form of the IC tag. However, the present invention is not limited to this. The layer may be provided as a separate member and temporarily attached to the separator with an adhesive layer. By setting it as such a provision form, the optimal member for a pressure relaxation layer can be suitably selected according to the shape of an attachment hole part, the environment where the identification target object is used, etc.

(11) In each of the embodiments, at least one layer containing an ultraviolet absorber may be provided on any layer on the surface side of the information display layer to prevent discoloration of display by ultraviolet rays. The ultraviolet absorbing material may be mixed with a highly rigid member or an affixing layer, or a transparent or translucent layer containing the ultraviolet absorbing material may be laminated on the surface side of the information display layer.

It is a figure explaining Example 1 of the IC tag by this invention. It is a figure explaining the attachment structure of the IC tag and IC tag of Example 1. FIG. It is a figure explaining the inlet used for the IC tag of a present Example. It is the figure which showed typically the process of displaying information on an information display layer. It is a figure which shows typically an example of the attachment process of the IC tag of a present Example. It is a figure which shows typically an example of the attachment process of the IC tag of a present Example. It is a figure which shows typically an example of the attachment process of the IC tag of a present Example. It is a figure explaining Example 2 of the attachment structure of the IC tag and IC tag by this invention. It is a figure explaining Example 3 of the attachment structure of the IC tag and IC tag by this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Base film 2 Antenna coil 3 IC chip 10 IC tag 11 Inlet 12 Adhering layer 13 Information display layer 14 High-rigidity member 15 Background layer 16, 17, 19 Adhesive layer 18 Protective layer 20 Pressure relaxation layer 21 Separator 100, 300 Concrete block 101 Mounting hole 102 High-rigidity member receiving part 110 Adhesive 200 Printer

Claims (18)

An IC tag that is directly or indirectly attached to an identification object and performs non-contact information communication,
An inlet provided with an IC chip and an antenna connected to the IC chip on a base material layer;
An affixing layer disposed on one side of the inlet and capable of being affixed to an object to be affixed;
An IC tag comprising: a pressure relaxation layer that is disposed on a side of the inlet opposite to the attachment layer and that relieves pressure applied to the inlet. The IC tag according to claim 1,
A release member that is temporarily attached to the attachment layer so as to be peelable is provided,
IC tag characterized by An IC tag that is directly or indirectly attached to an identification object and performs non-contact information communication,
An inlet provided with an IC chip and an antenna connected to the IC chip on a base material layer;
A highly rigid member that is disposed on one side of the inlet and has high rigidity;
IC tag comprising An IC tag that is directly or indirectly attached to an identification object and performs non-contact information communication,
An inlet in which an IC chip and an antenna connected to the IC chip are fixed to a base material layer;
A high-rigidity member that is disposed on one side of the inlet, and a high-rigidity member that is highly rigid; and a pressure-relaxation layer that is disposed on the opposite side of the high-rigidity member of the inlet and relieves pressure applied to the inlet;
IC tag comprising In the IC tag according to any one of claims 1 to 4,
The pressure relief layer is shrinkable to at least 1/10 of the volume in a free state;
IC tag characterized by In the IC tag according to any one of claims 1 to 5,
An information display layer is provided between the high-rigidity member and the inlet, and displays information including characters and / or symbols,
The information display layer is visually or optically readable from the high-rigidity member side;
IC tag characterized by The IC tag according to claim 6,
The high-rigidity member is transparent or translucent;
IC tag characterized by In the IC tag according to any one of claims 1 to 7,
Having an adhesive layer formed between the high-rigidity member and the information display layer;
IC tag characterized by The IC tag according to claim 8,
The affixing layer is transparent or translucent;
IC tag characterized by In the IC tag according to any one of claims 6 to 9,
The information display layer displays unique information,
IC tag characterized by In the IC tag according to any one of claims 6 to 10,
The information display layer is a layer capable of non-contact printing by external energy;
IC tag characterized by In the IC tag according to any one of claims 1 to 11,
The inlet is waterproofed,
IC tag characterized by The IC tag according to claim 12,
The inlet has at least the antenna and the IC chip covered with a waterproof layer;
IC tag characterized by The IC tag according to any one of claims 6 to 13,
A layer containing at least one ultraviolet absorber is provided on the opposite side of the information display layer from the inlet;
IC tag characterized by An IC tag mounting structure for mounting the IC tag according to any one of claims 1 to 14 to the identification object,
The identification object is provided with a mounting portion for attaching the IC tag,
A fixing means for fixing the IC tag to the mounting portion;
The IC tag is fixed by the fixing means so that the information display layer is visually or optically readable.
An IC tag mounting structure characterized by the above. In the attachment structure of the IC tag according to claim 15,
The mounting portion is a hole that can accommodate the IC tag;
An IC tag mounting structure characterized by the above. The IC tag mounting structure according to claim 16, wherein
The IC tag is embedded so that the surface of the high-rigidity member and the surface of the identification target are substantially coincided with each other;
An IC tag mounting structure characterized by the above. In the attachment structure of the IC tag according to any one of claims 15 to 18,
Comprising a positioning part for determining the position of the highly rigid member;
An IC tag mounting structure characterized by the above.

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