JP2011128694A - Rf label and method for sticking the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for sticking an RF label, which prevents an increase in cost of the RF label and forms a gap between an inlet part of the RF label and an article even if the RF label is stuck to the article in a substantially close contact state. <P>SOLUTION: Both ends of the RF label 1 where an adhesive layers 11 are laminated at both ends of an inlet layer 10 with an IC chip 100 and an antenna 101 mounted thereon are folded back to form fold-back parts 15 at both sides of the RF label 1. The adhesive layers 11 of the RF label 1 are stuck onto the article such that the RF label 1 is supported by the fold-back parts 15. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an RF label used in an RFID system and an RF label attaching method.

  Application of an RFID (Radio Frequency IDentification) system that performs data transmission and power supply in a contactless manner to physical distribution management is being studied. When applying the RFID system to logistics management, instead of the conventional barcode printing, an RF label with an IC chip and an antenna is attached to the item to be managed, and data is read from multiple RF labels at once. In this way, logistics management can be speeded up and labor-saving.

  In the RFID system, data transmission and power supply are performed in a non-contact manner. Therefore, when the surface to which the RF label is attached is a metal surface, such as when the article is a gas cylinder, the IC chip mounted on the RF label due to the influence of the metal It is known that less power is supplied and the RF label becomes inoperable.

  Even when an RF label is attached to a metal surface, it has already been studied to enable the RF label to operate. For example, a magnetic material (for example, an as-cast amorphous) is used between the RF label and the metal surface. Patent Document 1 discloses an invention that reduces the influence of the metal surface provided between them.

  Further, Patent Document 2, Patent Document 3 and Patent Document 4 disclose an invention in which the influence of an article is reduced by attaching an RF label so that an inlet portion on which an IC chip and an antenna are mounted is kept away from the article. Yes.

  The invention disclosed in Patent Document 2 is an invention in which the inlet part is kept away from the article by attaching the RF label to the article so that the inlet part on which the IC chip and the antenna are mounted is T-shaped. It is.

  Further, the invention disclosed in Patent Document 3 uses an RF label in which an inlet portion on which an IC chip and an antenna are mounted and an attachment portion to be attached to an article are connected in a convex shape so that the inlet portion is extracted from the article. This is an invention in which the inlet part is kept away from the article by being attached to the sheet.

  Furthermore, in the invention disclosed in Patent Document 4, an RF label in which at least a portion where an antenna is mounted is formed in a mountain shape is attached to an article so that the mountain portion protrudes, so that at least the antenna is removed from the article. It is an invention designed to keep away.

JP 2004-38702 A JP 2 0 0 6-2 7 7 5 2 4 JP 2 0 0 7-3 4 8 6 8 JP 2 0 0 7-1 6 4 3 9 9

  However, the invention disclosed in Patent Document 1 has a problem that the cost of the RF label increases because it is necessary to provide the RF label with a magnetic material. Further, in the inventions of Patent Document 2 to Patent Document 4, when an RF label is attached to an article, a portion where the inlet portion of the RF label is mounted protrudes, which is an obstacle during transportation / display of the article. There is.

  Therefore, the present invention does not increase the cost of the RF label on which the IC chip and the antenna are mounted, and even if the RF label is attached to the article in a state of close contact, the gap between the inlet portion of the RF label and the article is removed. It is an object of the present invention to provide an RF label and a method for attaching the RF label.

  According to a first aspect of the present invention for solving the above-described problem, an inlet layer on which an IC chip and an antenna are mounted, and both ends of an RF label in which an adhesive layer is laminated on opposite ends are folded back on both sides of the RF label. After forming the portion, the RF label attaching method is characterized in that the adhesive layer of each of the RF labels is attached to an article so that the RF label is supported by the folded portion.

  According to the first invention described above, if the RF label is not a very weak RF label such as a thin paper, the both ends of the RF label are folded back, and the adhesive layers of the RF label are attached to the article. The RF label can be supported by the folded portion formed by folding both ends of the RF label when it is affixed to the RF label, and the RF label is affixed to the article in a state of forming a portal shape. It will be.

  Affixing the RF label to an article in a state where a portal shape is formed, a gap is formed between the RF label and the article even if the RF label is attached to the article in a state of close contact, Even if the attachment surface of the article to which the RF label is attached is a metal surface, the influence of the metal surface is reduced and the RF tag can be operated. Further, the RF label does not require a magnetic material such as amorphous, and can be realized with the same structure as a general RF label, so that the manufacturing cost of the RF label does not increase.

  Furthermore, the second invention is such that an inlet layer on which an IC chip and an antenna are mounted, an adhesive layer for attaching to an article, and a release layer for protecting the adhesive layer are laminated at least in order, and the adhesive layer is opposed to the adhesive layer. It is the RF label characterized by being laminated | stacked on the both ends.

  The second invention relates to an RF label used in the RF label attaching method described in the first invention. In order to realize the RF label attaching method described in the first invention, an IC is provided. It is necessary to laminate an inlet layer on which a chip and an antenna are mounted, an adhesive layer provided at both ends in the left-right direction, and a release layer that protects the adhesive layer at least in order on the RF label.

  The RF label according to the second invention, wherein protective layers are laminated on both surfaces of the inlet layer.

  As in the third invention, the inlet layer can be protected from pressure, friction, and the like by laminating protective layers on both sides of the inlet layer.

  As described above, according to the present invention, the cost of the RF label on which the IC chip and the antenna are mounted is not increased, and the RF label inlet can be used even when the RF label is attached to an article in a close contact state. It is possible to provide an RF label and a method for attaching the RF label that can provide a gap between the part and the article.

The figure explaining the RF label in this embodiment. The figure explaining the affixing method of RF label. The figure explaining the basic label structure of RF label. The figure explaining the modification of the label structure of RF label. The figure explaining the modification of RF label.

  From this, the embodiments of the present invention will be described to the extent that those skilled in the art of the present invention can understand the contents of the present invention and implement the present invention.

  FIG. 1 is a diagram for explaining an RF label 1 in this embodiment, FIG. 1 (a) is a diagram for explaining the surface of the RF label 1, and FIG. 1 (b) is a diagram for explaining the back surface of the RF label 1. FIG.

  The RF label 1 illustrated in FIG. 1 is a long range type (communication distance is 1 m or more) RFID system using a frequency band of UHF band (860 MHz to 930 MHz) or microwave band (2.5 GHz or 5.8 GHz). It is an RF label that has been developed so that it can operate even when the surface to which an article is attached is a metal surface, such as a gas cylinder.

  As shown in FIG. 1A, the RF label 1 has a structure in which an inlet layer 10 on which an IC chip 100 and an antenna 101 are mounted is at least laminated. In the RF label 1, an adhesive layer is provided on the back surface of the RF label, as shown in FIG. 1B, whereas an adhesive layer is provided on the back surface to be attached to an article to be managed by the RFID system. Is not provided, and a rectangular adhesive layer 11 is provided on each of the left and right ends of the surface of the RF label 1 as shown in FIG.

  As shown in FIG. 1A, the length in the width direction of the antenna 101 mounted on the inlet layer 10 of the RF label 1 is close to the length in the width direction of the RF label 1, and is a rectangular adhesive layer. 11 is aligned with the position of the end of the antenna 101.

  In FIG. 1 (a), the inlet layer 10 is shown as if it can be seen from the surface of the RF label 1, but this is shown in order to explain the inside of the RF label 1. In fact, the surface of the RF label 1 is generally laminated with an opaque layer, and the inlet layer 10 cannot be visually observed from the surface of the RF label 1.

  FIG. 2 is a diagram for explaining a method of attaching the RF label 1 shown in FIG. When affixing the RF label 1 illustrated in FIG. 1 to an article, first, the surface of the RF label 1 on which the adhesive layer 11 is provided is directed to the front (FIG. 2A), and then the RF label 1 After the folded portions 15 are formed on both sides of the RF label 1 by folding the both ends of the RF label 1 so that the adhesive layer 11 provided on both ends of the substrate faces the attachment surface of the article (FIG. 2 ( b)) Adhesive layers provided at both ends of the RF label 1 are attached to the article so that the RF label 1 is supported by the folded portion 15 of the RF label 1 (FIG. 2C).

  As shown in FIG. 2C, the folded portion 15 of the RF label 1 that is supported when the RF label 1 is attached to an article has an antenna 101 of the inlet layer 10 laminated on the RF label 1. Since the end portion is included, the folded portion 15 has rigidity enough to support the RF label 1, and the RF label 1 is attached to the article in a state of forming a gate shape.

  As can be seen from FIG. 2 (c), the RF label 1 is affixed to the article in a state in which the portal shape is formed. Since a gap is formed between the one inlet layer 10 and the article, even if the attachment surface of the article to which the RF label 1 is attached is a metal surface, the influence of the metal surface is reduced and the RF tag 1 operates. Further, the RF label 1 does not require a magnetic material such as amorphous, and the RF label 1 can be realized with the same structure as the general RF label 1, so that the manufacturing cost of the RF label 1 does not increase.

  FIG. 3 is a diagram for explaining a basic label structure of the RF label 1 shown in FIG. As shown in FIG. 3, the basic label structure of the RF label 1 includes an inlet layer 10 on which the IC chip 100 and the antenna 101 are mounted, and rectangular shapes provided at both ends of the RF label 1 in the left-right direction. A label structure in which an adhesive layer 11 and a release layer 12 that protects the adhesive layer 11 are sequentially laminated. The inlet layer 10 and the adhesive layer 11 are bonded together by the adhesive layer 11 itself, and the adhesive layer 11 and the release layer 12 are temporarily bonded. When the RF label 1 is attached to an article, the release layer 12 is peeled off and used.

  As described above, since the adhesive layer 11 is laminated on both sides of the RF label 1, there is a space between the adhesive layer 11 and the release layer 12.

  In FIG. 1, the adhesive layer 11 of the RF label 1 is rectangular, but the shape of the adhesive layer 11 of the RF label 1 is not limited to a rectangle, and peeling caused by the rigidity of the folded portions 15 formed on both sides of the RF label 1. The shape of the pressure-sensitive adhesive layer 11 of the RF label 1 may be arbitrary as long as an adhesive strength greater than the force is sufficiently obtained.

  From here, the Example of RF label 1 is demonstrated. FIG. 4 is a diagram illustrating a modification of the label structure of the RF label 2 in the embodiment. The label structure of the RF label 2 illustrated in FIG. 4 is a label structure based on the label structure of the RF label 1 illustrated in FIG. 3. The first protective layer 23, the IC chip 200, and the antenna 201 are included in the label structure. A label structure in which a mounted inlet layer 20, a second protective layer 24, an adhesive layer 21 provided at both ends in the left-right direction of the RF label 1, and a release layer 22 that protects the adhesive layer are laminated in order. In the body, the first protective layer 22 and the inlet layer 20 and the inlet layer 20 and the second protective layer 24 are respectively bonded together using an adhesive or the like, and the second protective layer 24 and the adhesive layer 21 are the adhesive layer 21 itself. The adhesive layer 21 and the release layer 21 are pasted together in a temporarily bonded state, and the RF label 2 preferably has a width of about 5 to 50 mm and a length of about 50 to 200 mm.

  In the label structure of the present embodiment, PEN, PEN or polyimide having a thickness of 38 to 100 μm can be used as the base material of the inlet layer 20. The material of the antenna 201 formed on the base material of the inlet layer 20 is preferably aluminum, copper, silver, or carbon. The thickness of the antenna 201 is preferably 50 to 150 μm. , I.CODE SLI made by Philippe can be used.

  In the label structure of the RF label 2, the thickness of the adhesive layer 21 is preferably about 1 to 500 μm, an acrylic adhesive or a rubber adhesive can be used as the adhesive, and the release layer 22 has silicon on the surface. A coated paper or film (PET, PP, PE) having a thickness of 10 to 500 μm can be used.

  The first protective layer 23 and the second protective layer 24 laminated on the label structure of the RF label 2 illustrated in FIG. 4 are layers laminated to protect the inlet layer 20 from pressure, rubbing, etc. As the first protective layer 23 and the second protective layer 24, a film (PET, PP) or paper (Yupo, Crisper) having a thickness of 10 to 200 μm can be used.

  When the RF label 2 is affixed to the metal surface of the article, if about one quarter of the whole is folded back, a gap that is not affected by the eddy current generated on the metal surface by the radio wave for operating the RF label 2 ( 0.5 mm to 10 mm) can be formed.

  The present invention is not limited to the embodiments described so far, and various modifications and changes can be made.

  FIG. 5 is a diagram for explaining a modification of the RF label. As described with reference to FIG. 2, when both sides of the RF label 1 are folded so as to include a part of the end of the antenna 101, the antenna 101 may be disconnected depending on the material and thickness of the antenna 101.

  At this time, like the RF label 3 shown in FIG. 5A, the IC chip 31 and the antenna 32 are mounted at a position where the folded portion 33 formed on both sides of the RF label 3 is not formed. As shown in b), if both ends of the RF label 3 are folded so that the end of the antenna 301 is not included so that the RF label 3 can be attached to the article, both sides of the RF label 3 are attached. Even if it is folded, the antenna 301 is not disconnected.

1, 2, 3 RF label 10, 20 Inlet layer 100, 200 IC chip 101, 201 Antenna 11, 21 Adhesive layer 12, 22 Release layer 23 First protective layer 24 Second protective layer 15 Folded part

Claims (3)

  An inlet layer on which an IC chip and an antenna are mounted, and both ends of an RF label in which adhesive layers are laminated on opposite ends are folded, and folded portions are formed on both sides of the RF label, and then the RF label is folded. A method of attaching an RF label, wherein the adhesive layer of each of the RF labels is attached to an article so as to be supported by a part.   An inlet layer on which an IC chip and an antenna are mounted, an adhesive layer for attaching to an article, and a release layer that protects the adhesive layer are stacked at least in order, and the adhesive layer is stacked on opposite ends. Feature RF label. The RF label according to claim 2, wherein protective layers are laminated on both sides of the inlet layer.