JP2010079800A - Radio tag label - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To efficiently operate an RFID system by preventing a non-communicable radio tag label. <P>SOLUTION: The radio tag label T includes, in the order from the upper surface side toward a sticking object, a protection layer 201 for protecting an inlet 110; the inlet 110 including a radio tag circuit element To; a substrate 202 on which the inlet 110 is disposed; a strong adhesive material layer 203 for performing main sticking to the sticking object; a release paper (release material layer) 204 covering the strong adhesive material layer 203 and to be peeled in the main sticking; and a weak adhesive material layer 205 for performing temporary sticking to the sticking object in a manner such that attachment and detachment can be performed thereto twice or more. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a wireless tag label including a wireless tag circuit element capable of wireless communication of information with the outside.

  2. Description of the Related Art Conventionally, an RFID (Radio Frequency Identification) system that performs transmission and reception of information in a contactless manner with respect to a wireless tag circuit element that stores information is known. In general, the RFID circuit element is formed as a RFID label on a label-like material, and this RFID tag label is often affixed to a target article for classification and organization of various documents and articles, for example.

  In recent years, when peeling off the RFID label affixed to the target article, a two-layer adhesive material layer is provided via an intermediate substrate so that the tag-side antenna or IC circuit portion of the RFID tag label does not remain on the target article side. A wireless tag label is proposed (Patent Document 1).

Specifically, the RFID label described in Patent Document 1 includes an adhesive material layer between an inlet provided with a tag-side antenna or an IC circuit unit and an intermediate base material, and an adhesive material layer between the intermediate base material and a target article. Respectively. In addition, this RFID label forms a weakly releasable surface on the surface in contact with the adhesive material layer on the target article side in the intermediate substrate. With such a configuration, when the RFID label is peeled from the target article, the upper part (the part including the intermediate base material and the inlet) is separated and peeled from the intermediate base material.
JP 2008-33383 A

  The wireless tag label may not operate normally due to the influence of the attached environment. Specifically, the environment in which the RFID label does not operate normally may be affected by the reading direction due to the orientation of the antenna and the physical properties of the target article. In such an environment, it is desirable for the operation of the RFID system that the RFID tag label is peeled off and then attached again, so that the RFID label is not wasted.

  However, in the prior art described in Patent Document 1 described above, even if the upper part is peeled off from the intermediate base material by the two adhesive layers, it is not considered to apply the RFID label again. Therefore, when the RFID label does not operate normally, there is a problem that a new RFID label must be prepared.

  In order to solve the above-described problems, an object of the present invention is to provide a RFID label that can prevent the RFID label from being wasted by allowing the RFID label to be easily attached again.

  In order to solve the above-described problems and achieve the object, a wireless tag label according to the invention of claim 1 is a wireless tag label having a wireless tag circuit element to which a tag-side antenna is connected. A strong adhesive material layer is provided on the RFID tag circuit element side and a weak adhesive material layer is provided on the application target side toward the application target direction of the RFID tag.

  The RFID label according to the invention of claim 2 is the invention according to claim 1, wherein the RFID label is attached between the strong adhesive material layer and the weak adhesive material layer to the sticking object by the strong adhesive material layer. Is further provided with a peelable release material layer, wherein the release material layer has a peel strength required for peeling from the strong adhesive material layer greater than the peel strength from the weak adhesive material layer. And

  According to a third aspect of the present invention, the RFID label according to the first or second aspect of the invention is characterized in that the release material layer includes a release knob in which a part of the outer edge protrudes from the label body. .

  The RFID label according to the invention of claim 4 is the invention according to any one of claims 1 to 3, wherein the weak adhesive material layer is provided on at least a part of a sticking surface for the sticking target. Features.

  The wireless tag label according to the invention of claim 5 is a wireless tag label having a wireless tag circuit element to which a tag-side antenna is connected, wherein a strong adhesive material layer and a weak adhesive material layer are provided on a sticking surface of the wireless tag circuit element. An adhesive layer provided is provided.

  According to a sixth aspect of the present invention, in the radio tag label according to the fifth aspect of the invention, the adhesive material layer includes the strong adhesive material layer around the weak adhesive material layer.

  The RFID label according to the invention of claim 7 is the invention according to claim 5 or 6, further comprising a release material layer that covers the adhesive material layer and is capable of being peeled off when being applied to the object to be applied. The layer is characterized in that a half-cut line is provided at the boundary between the release material layer for the weak adhesive material layer covering the weak adhesive material layer and the release material layer for the strong adhesive material layer covering the strong adhesive material layer. To do.

  According to the first aspect of the present invention, it is possible to perform re-sticking (temporary sticking) a plurality of times with the weak adhesive material layer on the sticking target, and to make the main sticking with the strong adhesive material layer, so that it is suitable for an environment that can operate normally. Can be affixed to.

  According to the second aspect of the present invention, when re-sticking to the temporary sticking by the weak adhesive material layer, it is possible to prevent the strong adhesive material layer from being exposed, and thus it is possible to perform temporary sticking a plurality of times.

  According to the third aspect of the present invention, after the temporary sticking with the weak adhesive material layer, when the main sticking is performed with the strong adhesive material layer, the strong sticking material layer can be easily exposed and the main sticking can be performed.

  According to the fourth aspect of the present invention, the RFID label can be temporarily attached while saving the adhesive material used for the weak adhesive material layer.

  According to the invention of claim 5, since the strong adhesive material layer and the weak adhesive material layer are provided on the application surface of the RFID circuit element, the RFID tag label is temporarily attached while saving the amount of the adhesive material used. Can be pasted.

  According to the invention of claim 6, since the RFID label can be temporarily attached with the weak adhesive material layer and then the strong adhesive material layer around the weak adhesive material layer can be permanently attached, the use of the adhesive material While saving the amount, the book can be uniformly attached to the object to be attached.

  According to the invention of claim 7, since the release material layer is provided with a half-cut line, the release material layer is appropriately peeled off during temporary attachment with the weak adhesive material layer and main attachment with the strong adhesive material layer. Can be affixed to the target of application

  As described above, according to the RFID label according to the present invention, wireless communication can be easily performed in an environment where communication cannot be performed normally due to proximity to metal or the orientation of the tag antenna is different from the reading direction of the reader. By enabling reattachment of the tag label, communication can be performed without wasting the RFID label, so that the RFID system using the RFID tag label can be efficiently operated.

  Exemplary embodiments of a RFID label according to the present invention will be explained below in detail with reference to the accompanying drawings.

(Embodiment 1)
The RFID label according to the present invention will be described with reference to FIGS. FIG. 1 is a plan view showing an example of a RFID label according to the first embodiment of the present invention. FIG. 2 is a cross-sectional view schematically showing the layer structure of the RFID label shown in FIG.

  In FIG. 1, the RFID label T has an inlet 110 including a RFID circuit element To including an IC circuit unit 101 for storing information and a tag-side antenna 102 connected to the IC circuit unit 101. . This RFID label T is affixed to an article to be affixed by a weak adhesive material layer 205 or a strong adhesive material layer 203 described later. Then, the user reads the information from the IC circuit unit 101 by an external device such as a wireless tag communication device (not shown), thereby managing the article with the wireless tag label T attached. In the description of FIG. 1, the inlet 110 includes the RFID tag circuit element To, but the present invention is not limited to this. Specifically, for example, the tag side antenna 102 is printed on a substrate 202 to be described later, and the RFID circuit element To is provided on the substrate 202 by connecting the IC circuit unit 101 to the tag side antenna. It is good.

  Specifically, the IC circuit unit 101 stores information such as a tag ID (identification information) of the RFID label T. The IC circuit unit 101 returns information by modulating the radio wave received by the tag-side antenna 102 with an information signal and reflecting it.

  The tag side antenna 102 receives an interrogation signal output from an external device such as a wireless tag communication device (not shown). The tag-side antenna 102 transmits the response signal modulated by the IC circuit unit 101 to an external device such as a wireless tag communication device (not shown). In the description of FIG. 1, the shape of the tag-side antenna 102 is linear, but the present invention is not limited to this, and a known antenna used for a wireless tag label such as a loop shape can be used.

  As shown in FIG. 2, the RFID label T includes a protective layer 201 that protects the inlet 110 and the RFID circuit element To from the upper surface side (upper side in FIG. 2) toward the application target (lower side in FIG. 2). Including the inlet 110, the substrate 202 on which the inlet 110 is disposed, the strong adhesive material layer 203 for performing the main application to the object to be applied, and the release paper that covers the strong adhesive material layer 203 and is peeled off during the main application. (Peeling material layer) 204, a weak adhesive material layer 205 for temporarily attaching to the object to be attached a plurality of times, and a release paper that covers the weak adhesive material layer 205 and is peeled off during temporary attachment ( And a release material layer) 206.

  The protective layer 201 is made of, for example, transparent PET (polyethylene terephthalate), and may have a structure in which printing or the like is performed on the back surface. And the protective layer 201 protects the inlet 110 arrange | positioned between the board | substrates 202 from damage by external irritation | stimulation.

  For the strong adhesive layer 203, for example, a solvent-type acrylic adhesive is used, and for the weak adhesive layer 205, for example, an emulsion-type acrylic adhesive is used. The acrylic pressure-sensitive adhesive material includes an acrylic polymer, a curing agent, a tackifier, an additive, and the like.

  The weak adhesive material layer 205 is applied to the object to be applied with an adhesive force weaker than that of the strong adhesive material layer 203, and the application and peeling can be repeated a plurality of times. In other words, the RFID label T is configured to be temporarily pasted by the weak adhesive material layer 205 so as to be peelable from the pasting target. More specifically, for example, the weak adhesive material layer 205 has an adhesive strength of about 0.5 N / 25 mm in adhesive strength measurement (temperature: 23 ± 2 ° C., humidity 50 ± 5%) in accordance with JIS standards. It is good.

  The strong adhesive material layer 203 is affixed to the object to be applied with a stronger adhesive force than the weak adhesive material layer 205. Specifically, for example, the strong adhesive material layer 203 may be configured to have an adhesive strength of about 5.1 N / mm or more in an adhesive strength measurement based on JIS standards. Further, the strong adhesive material layer 203 is covered with the release paper 204, and is attached to the application target when the release paper 204 is peeled and exposed. That is, the RFID label T is temporarily pasted symmetrically by the weak adhesive layer 205, and then the main label is attached by the strong adhesive layer 203 after the release paper 204 is peeled off.

  The release paper 204 is provided between the weak adhesive material layer 205 and the strong adhesive material layer 203, and is peeled off together with the weak adhesive material layer 203 when the RFID label T is attached to the application target by the strong adhesive material layer 203. The The release paper 204 has a configuration in which the peel strength required for peeling from the strong adhesive layer 203 is greater than the peel strength from the weak adhesive layer 205.

  That is, the adhesive force between the strong adhesive material layer 203 and the release paper 204 is larger than the adhesive force between the weak adhesive material layer 205 and the release paper 204. With such a configuration, even when the RFID label T is temporarily peeled off after being temporarily attached to the sticking target by the weak adhesive material layer 205, the release paper 204 and the weak adhesive material layer 205 are removed from the RFID label T. Without being separated, the weak adhesive material layer 405 enables re-sticking (temporary sticking) to the sticking target.

  For example, when the RFID label T is first applied to an application target, the release paper 206 covering the weak adhesive material layer 205 is peeled to expose the weak adhesive material layer 205 on the application target side. Then, temporary attachment is performed on the object to be attached by the weak adhesive material layer 205. Then, communication with the RFID label T is performed by a RFID tag communication device (not shown), and it is confirmed whether the RFID tag T can be normally communicated.

  If the RFID label T temporarily attached to the sticking target cannot communicate normally, the RFID label T is peeled off from the sticking target by separating the sticking target and the weak adhesive material layer 205. Then, another pasting place to be pasted is searched, the weak adhesive material layer 205 is temporarily pasted to the pasting target, and the confirmation of the communication operation is repeated.

  On the other hand, if the RFID label T temporarily attached to the application target can be normally communicated, the release paper 204 covering the strong adhesive material layer 203 is subsequently peeled off, and the release paper 204 and the weak adhesive are removed from the strong adhesive material layer 203. The material layer 205 is separated and the strong adhesive material layer 203 is exposed to the application target side. Then, the strong adhesion material layer 203 is used to perform the actual pasting on the pasting target.

  As described above, since the RFID label according to the first embodiment of the present invention can be temporarily attached to the object to be attached by the weak adhesive material layer, the RFID label operates normally due to the influence of the environment of the object to be attached. Even if it is not, it can be reapplied many times so that an environment that operates normally can be obtained. Further, since the main sticking can be performed on the sticking target by the strong adhesive material layer, an efficient RFID system can be realized without wasting the RFID label. In other words, since the RFID label can be reattached so that normal communication can be performed in an environment where the RFID label cannot communicate normally, waste of the RFID label can be prevented.

(Other variations)
In Embodiment 1 of the present invention, in particular, the state in which the release paper 206 is also provided on the application target side (lower side in FIG. 2) of the weak adhesive material layer 205 has been described in a state before being applied to the application target. With this configuration, the RFID label T can be prepared one by one. Moreover, the structure which piles up and prepares the several RFID label T without providing release paper in the sticking object side of the weak adhesive material layer 205 may be sufficient. Specifically, a weak adhesive material layer of the RFID label T and a protective layer of another RFID label T are laminated and pasted. With such a configuration, a plurality of RFID label T can be prepared together. Further, the release paper on the application target side of the weak adhesive material layer 205 is not necessary, and the cost can be reduced.

  Further, in Embodiment 1 of the present invention, the weak adhesive material layer is provided on the entire lower surface of the release paper, but the weak adhesive material layer may be provided on at least a part of the application surface for the application target. Good. In this way, the adhesive material can be saved.

(Embodiment 2)
Next, Embodiment 2 of the present invention will be described. In the second embodiment of the present invention, the case where the shape of the release paper is different for the RFID label T shown in the first embodiment will be described. FIG. 3 is a cross-sectional view schematically showing the layer structure of the RFID label according to the second embodiment of the present invention.

  In FIG. 3, the RFID label T includes a protective layer 301, an inlet 110, a substrate 302, and a strong adhesive material layer 303 from an upper surface side (upper side in FIG. 3) toward a sticking target (lower side in FIG. 3). , A multi-layer structure including a release paper 304, a weak adhesive material layer 305, and a release paper 306. Note that the protective layer 301, the inlet 110, the substrate 302, the strong adhesive material layer 303, the release paper 304, the weak adhesive material layer 305, and the release paper 306 are respectively shown in FIG. The description of the same parts as the substrate 202, the strong adhesive material layer 203, the release paper 204, the weak adhesive material layer 205, and the release paper 206 is omitted.

  The release paper 304 includes a release knob 306 protruding from the main body of the RFID label T at a part of the outer edge. The knob 306 is used when the release paper 304 is peeled from the strong adhesive layer 303. Specifically, after being temporarily attached by the weak adhesive material layer 305, the knob 306 is pinched by the user, and the strong adhesive material layer 303 and the release paper 304 are peeled off.

  As described above, according to the RFID label according to the second embodiment of the present invention, in addition to the function described in the first embodiment, the structure including the knob for peeling, the strong adhesive material layer, The release paper can be easily peeled off. In other words, since the temporary attachment and the main attachment can be easily performed, the convenience of the RFID label T can be improved.

(Embodiment 3)
Next, a third embodiment of the present invention will be described. In the third embodiment of the present invention, the case where the strong adhesive material layers 203 and 303 and the weak adhesive material layers 205 and 305 are formed on the same surface in the RFID label T shown in the first and second embodiments will be described. To do. FIG. 4 is a cross-sectional view schematically showing the layer structure of the RFID label according to the third embodiment of the present invention. FIG. 5 is an explanatory view showing the AA arrow of the RFID label shown in FIG.

  In FIG. 4, the RFID label T includes a protective layer 401 that protects the inlet 110 from the upper surface side (upper side in FIG. 4) toward the sticking target (lower side in FIG. 4), and the inlet 110 that includes the RFID circuit element To. A pressure sensitive adhesive layer 410 including a substrate 402 on which the inlet 110 is disposed, a strong adhesive material layer 403 for performing main attachment to an application target, and a weak adhesive material layer 405 for performing temporary attachment, and an adhesive material layer And a multi-layer structure including release paper 404 covering 403. The protective layer 401, the inlet 110, the substrate 402, the strong adhesive material layer 403, the release paper 404, and the weak adhesive material layer 405 are respectively the protective layer 201, the inlet 110, the substrate 202, and the strong adhesive material layer 405 shown in FIG. A description of the same parts as the adhesive material layer 203, the release paper 204, and the weak adhesive material layer 205 will be omitted.

  As shown in FIG. 5, the adhesive material layer 410 includes a weak adhesive material layer 405 at the center of the same surface, and a strong adhesive material layer 403 around the weak adhesive material layer 403. Specifically, the adhesive material layer 410 is provided on the base application target side, for example, the weak adhesive material layer 405 is applied in a state where the portion corresponding to the base material of the strong adhesive material layer 403 is masked, The strong adhesive layer 403 is masked and a weak adhesive layer 405 is applied. Alternatively, a substantially sheet-like adhesive material layer in which the strong adhesive material layer 403 is applied and then the weak adhesive material layer 405 is applied, or the strong adhesive material layer 403 and the weak adhesive material layer 405 are previously formed. It is good also as 410 being stuck on a base material and forming.

  The release paper 404 is provided with a half-cut line at the boundary between a portion corresponding to the weak adhesive material layer 405 and a portion corresponding to the strong adhesive material layer 403. By adopting such a configuration, in the third embodiment, only the release paper 404 corresponding to the weak adhesive material layer 405 can be peeled off, and the RFID label T can be temporarily attached to the application target. And after temporary sticking, it is the structure which can peel off the release paper 404 corresponding to the strong adhesive material layer 403, and can perform this sticking.

  Specifically, the RFID label T is temporarily attached by removing the part of the release paper 406 corresponding to the weak adhesive material layer 405 and leaving the part of the release paper 404 corresponding to the strong adhesive material layer 403 as it is. More specifically, only the inner part from the half-cut line of the release paper 404 corresponding to the weak adhesive material layer 405 is peeled off, and the surrounding release paper 406 corresponding to the strong adhesive material layer 403 is left. Keep it. By doing in this way, at the time of temporary sticking, it sticks to the sticking object by the weak adhesive material layer 403 so that the surroundings are not stuck to the sticking object, so that it can be stuck again.

  And temporary sticking is performed to the sticking target by the weak adhesive material layer 403 exposed to the sticking target. Thereafter, communication with the RFID label T is performed using a RFID tag communication device (not shown), and it is confirmed whether the RFID tag T can be normally communicated. When the RFID label T temporarily attached to the sticking target cannot communicate normally, the RFID label T is peeled off from the sticking target by separating the sticking target and the weak adhesive material layer 405. Then, another pasting place of the pasting target is searched, and the weak adhesive material layer 405 is temporarily pasted to the pasting target, and the confirmation of the communication operation is repeated.

  On the other hand, when the RFID label T temporarily attached to the application target can be normally communicated, the release paper 404 covering the strong adhesive material layer 403 is peeled off, and the strong adhesive material layer 403 and the weak adhesive material layer are peeled off. The entire surface of the adhesive material layer 410 made of 405 is exposed to the application target side. The actual application of the RFID label T is applied to the application target by the entire surface of the adhesive material layer 410.

  As described above, the weak adhesive material layer 405 and the strong adhesive material layer 403 are configured on the same surface so that temporary attachment and main attachment can be performed, and thus the attachment is performed from the inlet 110 (tag-side antenna 102) at the time of temporary attachment. The distance to the target and the distance from the inlet 110 (tag-side antenna 102) at the time of final pasting to the target to be pasted are kept uniform. That is, the temporary pasting can be performed in a state where the environment for performing the main pasting is accurately reproduced.

  As described above, according to the RFID label according to the third embodiment of the present invention, in addition to the functions described in the first embodiment, the weak adhesive material layer and the strong adhesive material layer are provided on the same surface. An efficient RFID system can be realized while saving material.

(Other variations)
In Embodiment 3 of the present invention, in particular, the weak adhesive material layer is provided near the center of the application surface to which the RFID label T is applied, and the strong adhesive material layer is provided around the weak adhesive material layer, but the present invention is not limited thereto. Specifically, for example, as shown in FIGS. 6 and 7, the RFID label T may be temporarily attached and permanently attached to the object to be attached.

  FIG. 6 is a cross-sectional view schematically showing the layer structure of the RFID label according to the modification of the third embodiment of the present invention. FIG. 7 is an explanatory view showing the RFID label shown in FIG. In FIG. 6, the RFID label T includes a multi-layer including a protective layer 601, an inlet 110, a substrate 602, an adhesive material layer 610 composed of a strong adhesive material layer 603 and a weak adhesive material layer 605, and a release paper 606. Formed in the structure. Note that the protective layer 601, the inlet 110, the substrate 602, the strong adhesive material layer 603, the release paper 604, the weak adhesive material layer 605, and the adhesive material layer 610 are respectively the protective layer 401 and the inlet 110 shown in FIG. The description of the same parts as those of the substrate 402, the strong adhesive layer 403, the release paper 404, the weak adhesive layer 405, and the adhesive layer 410 is omitted.

  As shown in FIG. 7, the adhesive material layer 610 includes a strong adhesive material layer 603 and a weak adhesive material layer 605 in an inverted U shape alternately on the same surface. The release paper 606 is provided with a half-cut line at the boundary between the portion corresponding to the weak adhesive material layer 605 and the portion corresponding to the strong adhesive material layer 603. With such a configuration, only the release paper 606 corresponding to the weak adhesive material layer 605 can be peeled off, and the RFID label T can be temporarily attached to the application target. And after temporary sticking, it is the structure which can peel off the release paper 606 corresponding to the strong adhesive material layer 603, and can make this sticking.

  Moreover, the shape of a strong adhesive material layer and a weak adhesive material layer is not restricted to FIG. 6 and FIG. Specifically, for example, shapes as shown in FIGS. 8 and 9 (strong adhesive material layers 803 and 903 and weak adhesive material layers 805 and 905) may be used. FIG. 8 is an explanatory diagram (part 1) illustrating another shape of the adhesive layer according to the modification of the third embodiment of the present invention. FIG. 9 is an explanatory diagram (part 2) illustrating another shape of the adhesive layer according to the modification of the third embodiment of the present invention. As shown in the modified examples shown in FIGS. 6 to 9, by forming the strong adhesive layer 603, 4803, 903 and the weak adhesive layer 605, 805, 905 in various shapes on the same surface, Can increase the sex.

It is a top view which shows an example of the RFID tag label concerning Embodiment 1 of this invention. FIG. 2 is a cross-sectional view schematically showing a layer structure of the RFID label shown in FIG. 1. It is sectional drawing which represents typically the layer structure of the RFID label concerning Embodiment 2 of this invention. It is sectional drawing which represents typically the layer structure of the RFID label concerning Embodiment 3 of this invention. It is explanatory drawing which shows the AA arrow of the RFID label shown in FIG. It is sectional drawing which represents typically the layer structure of the RFID label concerning the modification of Embodiment 3 of this invention. It is explanatory drawing which shows the BB arrow of the RFID label shown in FIG. It is explanatory drawing (the 1) which shows the other shape of the adhesive material layer concerning the modification of Embodiment 3 of this invention. It is explanatory drawing (the 2) which shows the other shape of the adhesive material layer concerning the modification of Embodiment 3 of this invention.

Explanation of symbols

T RFID tag 101 IC circuit unit 102 Tag antenna 110 Inlet Ta, Tb area tag 201, 301, 401, 601 Protective layer 202, 302, 402, 602 Substrate 203, 303, 403, 603, 803, 903 Weak adhesive material layer 204, 206, 304, 306, 404, 604 Release paper 205, 305, 405, 605, 805, 905 Strong adhesive layer 306 Knob 410, 610 Adhesive layer

Claims (7)

A wireless tag label having a wireless tag circuit element to which a tag side antenna is connected,
A wireless tag label comprising a strong adhesive material layer on the RFID circuit element side and a weak adhesive material layer on the application target side from the RFID circuit element toward the application target direction of the RFID label. A peeling material layer is further provided between the strong pressure-sensitive adhesive layer and the weak pressure-sensitive adhesive layer when peeled off by the strong pressure-sensitive adhesive layer to the object to be pasted,
The release material layer is
2. The RFID label according to claim 1, wherein a peel strength necessary for peeling from the strong adhesive material layer is larger than a peel strength from the weak adhesive material layer. The release material layer is
The RFID label according to claim 1 or 2, further comprising a peeling knob having a part of the outer edge protruding from the label main body. The weak adhesive layer is
The RFID label according to any one of claims 1 to 3, wherein the RFID label is provided on at least a part of a sticking surface for the sticking target. A wireless tag label having a wireless tag circuit element to which a tag side antenna is connected,
A wireless tag label comprising: an adhesive material layer provided with a strong adhesive material layer and a weak adhesive material layer on a sticking surface of the RFID circuit element. The adhesive layer is
The RFID label according to claim 5, wherein the strong adhesive material layer is provided around the weak adhesive material layer. Covering the adhesive material layer, and further comprising a release material layer that can be peeled off when pasted to the application target,
The release material layer is
The half-cut line is provided at a boundary between the release material layer for the weak adhesive material layer covering the weak adhesive material layer and the release material layer for the strong adhesive material layer covering the strong adhesive material layer. The RFID label according to 5 or 6.