JP3145356U - RFID label - Google Patents

Abstract

An RFID label that is prohibited from being illegally used by being peeled off after being pasted once can be manufactured easily and at low cost.
In an RFID label, a release layer is provided on the entire back surface of a substrate, and an antenna and an IC chip mounted on the release layer are covered with an adhesive layer. If the RFID label 10 is attached to the article 30 and then peeled off, the base material 11 is peeled off together with the peeling layer 12, and if the adhesive layer 15 left on the article 30 is forcibly peeled off, the communication function unit is destroyed. And cannot be reused.
[Selection] Figure 3

Description

  The present invention is an RFID label that is attached to an adherend and performs data communication using electromagnetic induction or radio waves, and is prohibited from being peeled off from the attached adherend and reused. Alternatively, the present invention relates to an RFID label that can prevent fraud such as label replacement.

  Conventionally, a label-like non-contact data carrier disclosed in the following Patent Document 1 is known as an RFID label having the above-described fraud prevention function. In this data carrier, an antenna made of a metal thin film on a substrate and an IC chip mounted on the metal thin film are covered with an adhesive layer, so that the metal thin film is easily broken partially between the substrate and the metal thin film. It has been destroyed. When the data carrier attached to the article is peeled off, the easily destroyed portion of the antenna is cut and broken, so that even if it is attached again and data communication is performed, communication failure occurs and it cannot be reused. It has become.

  However, in order to manufacture this data carrier, an easy destruction process must be performed between the base material and the metal thin film in advance before the metal thin film antenna is formed on the base material. That is, as an easy-fracture process, for example, a process of providing a part where no adhesive is applied to the base material (adhesive non-applied part), or a part where a base material is applied with a release agent such as silicone or fluororesin (exfoliant application part) The processing which provides is needed. Further, at the time of this processing, it is necessary to accurately perform positioning to match the position where the antenna is formed and the position of the easy destruction process (adhesive non-application part or release agent application part). For this reason, there existed a problem that manufacture was difficult and manufacturing cost became high.

JP 2000-105806 A

  The present invention has been made to solve the above-described problems, and the object of the present invention is to easily and inexpensively manufacture an RFID label that prohibits unauthorized use after it has been pasted and then peeled off. There is in doing so.

  In order to achieve the above object, the RFID label of the present invention is provided with a release layer on the entire back surface of the substrate, and an antenna made of a conductive thin film and an IC chip connected to the antenna on the release layer. Is covered with an adhesive layer.

  The release layer is for facilitating separation of the communication function unit including the antenna and the IC chip and the base material, and can be formed by applying a release agent on the entire back surface of the base material and drying it. As the release agent constituting the release layer, for example, a release OP varnish containing a silicone component in an ultraviolet curable varnish or an oily varnish can be used.

  In addition, the RFID label of the present invention is provided with a peelable pseudo-adhesion layer on the entire back surface of the substrate, and an antenna made of a conductive thin film and an IC chip connected to the antenna are formed on the pseudo-adhesion layer. It is covered with an adhesive layer.

  The pseudo-adhesion layer is also for facilitating separation of the communication part consisting of an antenna and an IC chip and the base material, and by adhering a two-layer resin film that is detachably bonded to the back surface of the base material. Can be formed. As a material of the resin film, for example, a synthetic resin film such as a polyethylene (PE) film or a polyethylene terephthalate (PET) film can be used.

  Since the RFID label of the present invention is provided with a release layer or a pseudo-adhesion layer on the entire back surface of the base material, if the base material is peeled off after being attached to an adherend, the base material is a boundary surface of the release layer or the pseudo-adhesion layer. Is peeled off. At this time, since the antenna and the IC chip are held on the adherend by the adhesive layer, the communication function is not destroyed, but the adhesive layer remains on the adherend, so the antenna made of a conductive thin film It is actually impossible to peel it off the adherend without destroying it.

  As is clear from the above configuration, the RFID label of the present invention cannot be peeled off from the attached adherend and reused. Therefore, fraud such as illegal acquisition or falsification of data, or label replacement. Actions can be prevented. In addition, with respect to the manufacturing method, it is only necessary to provide a peeling layer or a pseudo-adhesive layer on the entire back surface of the base material, and there is no need for a positioning process to match the position of the antenna and the application position of the adhesive or release agent as in the past. Therefore, it can be manufactured easily and at low cost.

  Embodiments of the present invention will be described below with reference to the drawings.

[First Embodiment]
FIG. 1 is a plan view showing an external appearance of the RFID label of the first embodiment, FIG. 2 is a cross-sectional view showing a laminated structure of the label, and FIG. 3 is a cross-sectional view showing a state when the label is used.

  As shown in FIG. 1, the RFID label 10 of the present embodiment has a release layer 12 (see FIG. 2) provided on the entire back surface of a substrate 11, and an antenna 13 mounted on the release layer 12. And the communication function part composed of the IC chip 14 is covered with the adhesive layer 15.

  The base material 11 is formed by molding an insulating material having appropriate flexibility and strength into a required shape. As the material of the base material 11, for example, paper such as high-quality paper, coated paper, and synthetic paper, and synthetic resin sheets such as polyethylene terephthalate (PET), polypropylene (PP), and hard PVC can be used.

  The release layer 12 is obtained by applying a release agent to the entire back surface of the base material 11 and drying it in order to separate the communication function unit and the base material 11. As the release agent constituting the release layer 12, for example, a release OP varnish containing a silicone component in an ultraviolet curable varnish or an oily varnish can be used.

  The antenna 13 generates electric power for starting the IC chip 14 and receives signals from the antenna of the reader / writer. The antenna 13 is formed of a conductive thin film having a predetermined pattern shape laminated on the peeling layer 12. Yes. As the formation method, a method of printing the antenna portion by screen printing, ink jet printing or intaglio printing with conductive ink containing, for example, silver paste, graphite, carbon or the like on the release layer 12 can be employed. Alternatively, a method of depositing copper foil or aluminum foil on the release layer 12 and leaving only the antenna portion by etching may be employed. As the shape of the antenna 13, a shape suitable for the data transmission method between the reader / writer and the RFID label 10 is selected. In this embodiment, since the electromagnetic induction method is adopted, the coil antenna has a square loop shape. However, the shape of the loop is not limited to a square shape, and may be a circle or an ellipse. When the microwave method is adopted, A linear dipole antenna may be used.

  The IC chip 14 is an electronic component for communicating various data with a reader / writer. The IC chip 14 incorporates a CPU, ROM, RAM, and EEPROM, and its terminals are electrically connected to the antenna 13 by a conductive adhesive. Has been. The CPU analyzes the signal received from the antenna of the reader / writer, executes the process, and transmits the execution result to the reader / writer. The ROM is a read-only memory that stores an execution program of the CPU, the RAM is a working memory that temporarily stores data, and the EEPROM is a non-volatile memory that stores various types of communicated data in a rewritable manner.

  The adhesive layer 15 is for attaching the RFID label 10 to an adherend, and is formed by applying an adhesive on the release layer 12 so as to cover the antenna 13 and the IC chip 14. As the type of adhesive, for example, various adhesives selected from rubber (natural rubber, SBR, butyl rubber) adhesives, acrylic (solvent type, emulsion type) adhesives, hot melt adhesives, silicone adhesives, etc. An agent can be used, but an emulsion type acrylic pressure-sensitive adhesive having a strong adhesive strength that cannot be removed cleanly after being applied is preferable. In addition, in order to protect the sticking surface of the adhesion layer 15, the release paper 20 is temporarily attached to the RFID label 10 so that peeling is possible until it is used.

  The RFID label 10 according to the present embodiment is configured as described above. When the RFID label 10 is used, first, the release paper 20 temporarily attached to the application surface of the RFID label 10 is peeled off and attached to the article 30 to be managed. wear. As shown in FIG. 3A, the RFID label 10 is attached to the article 30 by the adhesive layer 15 on the back surface, and the communication function unit including the antenna 13 and the IC chip 14 is held on the article 30. As a result, when radio waves are radiated from a reader / writer antenna (not shown), an electromagnetic field is generated in the vicinity of the antenna 13, and various data are generated between the reader / writer and the RFID label 10 by the electromotive force induced in the antenna 13 by this electromagnetic field. Can be communicated.

  On the other hand, it is impossible to remove the RFID label 10 from the article 30 and reuse it for illegal purposes. That is, when the RFID label 10 affixed to the article 30 is to be peeled off, only the base material 11 is peeled off and separated together with the release layer 12 as shown in FIG. The reason is that the base material 11 and the release layer 12 are completely adhered by the penetration of the release agent into the base material 11, whereas the adhesive is repelled by the slippery surface of the release layer 12 and penetrates. This is because the adhesion between the release layer 12 and the adhesive layer 15 is weak. As described above, when the RFID label 10 is to be removed from the article 30, the communication function unit including the antenna 13 and the IC chip 14 remains attached to the article 30, so that the RFID label 10 can be peeled off and reused. become unable.

  Further, if the adhesive layer 15 left on the article 30 is forcibly removed, the communication function unit is destroyed. That is, since the antenna 13 and the IC chip 14 are firmly adhered to the article 30 by the adhesive layer 15, when the adhesive layer 15 is to be peeled off as shown in FIG. It will be cut and broken. Therefore, since the RFID label 10 once attached to the article 30 cannot be peeled off and reused, it is possible to prevent illegal acts such as illegal acquisition or alteration of data, or replacement of the RFID label 10 with another article 30. be able to.

[Second Embodiment]
FIG. 4 is a cross-sectional view showing a laminated structure of the RFID label of the second embodiment, and FIG. 5 is a cross-sectional view showing a state when the label is used.

  As shown in FIG. 4, the RFID label 10 of this embodiment is characterized in that a pseudo adhesive layer 16 (see FIG. 5) is provided on the entire back surface of the substrate 11.

  The pseudo adhesive layer 16 is composed of two upper and lower resin films 17 and 18 that are thermocompression-bonded so as to be separated from each other in order to separate the communication function unit and the base material 11. 11 is adhered to the back surface of an adhesive layer 19 formed by applying an adhesive on the entire surface. As a material of the resin films 17 and 18, for example, a synthetic resin film such as a polyethylene (PE) film or a polyethylene terephthalate (PET) film can be used. Also, the antenna 13 and the IC chip 14 are mounted on the lower resin film 18 in the same manner as in the first embodiment, and an adhesive is applied on the lower resin film 18 so as to cover the antenna 13 and the IC chip 14. An adhesive layer 15 coated with is provided. Other configurations are the same as those of the first embodiment.

  The RFID label 10 according to the present embodiment is configured as described above. When the RFID label 10 is used, first, the release paper 20 temporarily attached to the application surface of the RFID label 10 is peeled off and attached to the article 30 to be managed. wear. As shown in FIG. 5A, the RFID label 10 is attached to the article 30 by the adhesive layer 15 on the back surface, and the communication function unit including the antenna 13 and the IC chip 14 is held on the article 30. As a result, similar to the first embodiment, various data can be communicated between the reader / writer and the RFID label 10.

  On the other hand, it is impossible to remove the RFID label 10 from the article 30 and reuse it for illegal purposes. That is, when the RFID label 10 affixed to the article 30 is to be peeled off, the base material 11 is separated via the pseudo-adhesion surface of the pseudo-adhesion layer 16 as shown in FIG. The reason is that, in the pseudo-adhesive layer 16 bonded to the base material 11, the two resin films 17 and 18 are thermocompression bonded, and the adhesive force between the boundary surfaces of the two layers is set so as to be peeled off by hand. Because. As described above, when the RFID label 10 is to be removed from the article 30, the communication function unit including the antenna 13 and the IC chip 14 remains attached to the article 30, so that the RFID label 10 can be peeled off and reused. become unable.

  Further, even if the resin film 18 and the adhesive layer 15 left on the article 30 are to be peeled off, the resin film 18 is firmly adhered to the article 30 by the adhesive layer 15, so that as shown in FIG. It cannot be peeled off. Therefore, also in this embodiment, the RFID label 10 once attached to the article 30 cannot be peeled off and reused. Therefore, illegal acquisition or alteration of data, or replacement of the RFID label 10 with another article 30 or the like. Can be prevented.

The top view which shows the external appearance of the RFID label of 1st Embodiment. Sectional drawing which shows the laminated structure of the RFID label of 1st Embodiment. Sectional drawing which shows the state at the time of use of the RFID label of 1st Embodiment. The external view which shows the laminated structure of the RFID label of 2nd Embodiment. Sectional drawing which shows the state at the time of use of the RFID label of 2nd Embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 RFID label 11 Base material 12 Release layer 13 Antenna 14 IC chip 15 Adhesion layer 16 Pseudo adhesion layer 17 Resin film 18 Resin film 19 Adhesion layer 20 Release paper 30 Article

Claims (2)

  An RFID label characterized in that a peeling layer is provided on the entire back surface of the substrate, and an antenna made of a conductive thin film and an IC chip connected to the antenna are covered with an adhesive layer on the peeling layer. .   A peelable pseudo-adhesion layer is provided on the entire back surface of the substrate. On this pseudo-adhesion layer, an antenna made of a conductive thin film and an IC chip connected to the antenna are covered with an adhesive layer. Feature RFID label.

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