JP2011133953A - Non-contact ic label - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a non-contact IC label for stably mounting an IC chip on a thermally shrinkable base material, and deteriorating communication function of an IC tag while deforming a label base material when a seal label is peeled from an adhered body by using heat. <P>SOLUTION: The non-contact IC label is provided with: a label base material 1 with an adhesive layer 5 formed thereon to be adhered to an adhered body; and a non-contact IC medium 7 formed in the label base material. The label base material is made of thermally shrinkable materials, and has a notch 2. The non-contact IC medium is configured of an antenna 9 and an IC strap 72. The antenna is provided in contact with the label base material. The IC strap is structured by connecting an IC chip 3 to a lead wire 4 formed on a base film 8 having no heat shrinkability. The antenna and the IC strap are electro-magnetically coupled with each other. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a non-contact IC label that is used for authenticity determination by being attached to a product or its package, and more particularly, a non-contact IC that leaves a trace and disables a communication function when trying to peel off from an adherend. Regarding labels.

In recent years, in order to determine the authenticity of relatively expensive products such as high-grade liquor and consumables for electrical appliances, etc. A non-contact IC label is affixed.
However, when a fraudulent company handles a fraudulent product that forges a legitimate article, it is authorized for the purchaser by attaching a similar label to the fraudulent article. This makes it difficult to distinguish an article from an illegal article.

  Therefore, a non-contact IC label equipped with an IC tag and a seal label that can detect the presence or absence of forgery accompanied by a heating process by using a base material having heat shrinkability has been proposed (for example, Patent Documents). 1).

Japanese Patent Laid-Open No. 2008-301912

  However, in the sealed label using the non-contact IC label as described above, when the IC chip is directly mounted on the heat-shrinkable base material, the base material is contracted and deformed by the heat pressure at the time of mounting the IC chip. Therefore, it is difficult to process properly. In addition, when the base material and the IC tag are provided separately, if the label is peeled off using heat, the base material cannot be reused due to shrinkage and deformation, but the IC tag can be taken out. It is possible to use it by attaching it to a forged label. Therefore, the authenticity determination function is lowered.

  The present invention is proposed in view of such circumstances, and the problem to be solved by the present invention is that it is possible to stably mount an IC chip on a heat-shrinkable substrate, and An object of the present invention is to provide a non-contact IC label capable of reducing the communication function of an IC tag at the same time as the label base material itself is deformed by the action of peeling the sealed label from the adherend using heat.

  As means for solving the above-mentioned problems, the invention according to claim 1 is directed to a label base material provided with an adhesive layer for attaching to an adherend and a non-contact IC provided on the label base material. A label base material is made of a material having heat shrinkability and is provided with a cut, and a non-contact IC medium is composed of an antenna and an IC strap, and the antenna is the label base material. The IC strap is connected to the lead wire provided on the base film on which the IC strap is not heat-shrinkable, and the antenna and the IC strap are electromagnetically coupled. Is a non-contact IC label characterized by

According to a second aspect of the present invention, the cut provided in the label base material is provided at a location where the antenna and the IC strap are electromagnetically coupled, and the planar shape of the cut has a bending point. The non-contact IC label according to claim 1, wherein the non-contact IC label is a line segment.

  The invention according to claim 3 is the non-contact IC label according to claim 1 or 2, wherein the antenna is formed of conductive ink.

Since the non-contact IC label according to the present invention has the above-described configuration, even if the seal label is stored with a predetermined identification information on the IC chip, the label base is not removed even if the seal label is peeled off from the patch using heat. Since the material is deformed and the communication function of the non-contact IC medium is further lowered at that time, the trace can be reliably left, and illegal acts such as counterfeiting by using the IC label can be effectively prevented. .
Further, the non-contact IC label of the present invention can be used properly without being deformed during the manufacturing process because the IC chip can be mounted on a base film having no heat shrinkability.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic plan view seen from the cut side for demonstrating embodiment of this invention, Comprising: (a), (b) shows a different example, respectively. FIG. 2 is an example of a schematic cross-sectional view for explaining an embodiment of the present invention, and is a cross-sectional view along X-X ′ in FIG. It is another example of the schematic cross section for demonstrating embodiment of this invention, Comprising: (a) is sectional drawing before the thermal deformation along YY 'of FIG.1 (b), (b) These are sectional drawings after the thermal deformation of the same location. It is a model top view which shows the IC strap incorporated in the non-contact IC label which concerns on this invention. 6 is a schematic cross-sectional view showing a non-contact IC label according to Comparative Example 2. FIG.

  Hereinafter, a non-contact IC label in an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a schematic plan view of a non-contact IC label 10 for explaining an embodiment of the present invention as viewed from the side of a notch 2 described later, excluding a printing layer 11, and FIG. It is a schematic cross section which shows the cross section which follows XX 'of). 3 is another example of the non-contact IC label 10 for explaining the embodiment of the present invention. FIG. 3A shows a state before thermal deformation along YY ′ in FIG. It is a schematic cross section, (b) is a schematic cross section after the thermal deformation of the same location.

The non-contact IC label 10 includes a rectangular sheet-like label substrate 1.
Of the two main surfaces of the label substrate 1, one main surface 1a is provided with a print layer 11 on which various information such as the name of the adherend is printed.
Moreover, the adhesive layer 5 for affixing the label base material 1 to a to-be-adhered body is provided in the other main surface 1b of the label base material 1 with the adhesive material.

Further, an IC tag for performing wireless communication is provided as a non-contact IC medium 7 on the other main surface 1b of the label substrate 1, and the adhesive layer 5 is coated on the surface thereof.
Although the adhesive layer 5 is coated on the surface of the non-contact IC medium 7, the present invention is not limited to this, and a part of the non-contact IC medium 7 may be provided on the surface of the adhesive layer 5.
Further, a release sheet 6 that can be easily peeled off when the non-contact IC label 10 is used is temporarily adhered to the surface of the adhesive layer 5. As the release sheet 6, a separator is used in which a release agent layer such as silicon resin is laminated on a paper or plastic sheet by coating or the like.
For the reasons described later, it is necessary to use a method in which the label base material 1 is not heated during the adhesive processing. For example, a method of sticking an adhesive tape coated on the separator is used.

  The label substrate 1 is made of a material that contracts and deforms by heat, and a generally stretched resin film is used. The thickness is preferably in the range of 50 μm to 100 μm. This can be said to be a range in which the strength as a base material is moderately high and thermal shrinkage is easy. Examples of the material include OPS (stretched polystyrene), stretched PP (polypropylene), and stretched PET (polyethylene terephthalate).

  The non-contact IC medium 7 usually includes an antenna formed of a metal such as aluminum or copper, and an IC chip that is mounted at the center in the longitudinal direction of the antenna and is electrically connected to the antenna. However, in the present invention, the non-contact IC medium 7 is composed of the antenna 9 and the IC strap 72, the antenna 9 is provided in contact with the other main surface 1b of the label base 1, and the IC strap 72 is heated. An IC chip 3 is connected to a lead wire 4 that forms a loop-like circuit provided on a base film 8 that does not have shrinkage, and the antenna 9 and the lead wire 4 of the IC strap 72 are connected to each other. It has a structure in which communication characteristics can be obtained by electromagnetic coupling.

  Conventionally, since heat and pressure are applied when the IC chip 3 is bonded to the antenna 9, when the label substrate 1 has heat shrinkability, it cannot be directly bonded to the antenna 9 provided in contact therewith. . However, as shown in the present invention, if the IC chip is not directly mounted on the antenna in contact with the heat-shrinkable base material, labeling can be performed without thermally deforming the label base material.

  In addition, as a method for constructing a non-contact IC label having a heat-shrinkable base material separately from the structure of the non-contact IC label 10 of the present invention, a non-contact IC medium is independent from the heat-shrinkable label base material. There is a way to set up. However, in such a configuration, the label base material is deformed by heat, but the non-contact IC medium can be reused without being destroyed. However, since the non-contact IC label 10 having the structure of the present invention is provided with the antenna 9 in contact with the label base 1, when the label base 1 contracts due to heat, the antenna 9 and the lead wire 4. It is possible to reduce the communication characteristics due to fluctuations in the junction between the two.

In the present invention, the antenna 9 is provided in contact with the heat-shrinkable label substrate 1 and a separately prepared IC strap 72 is electromagnetically coupled to the antenna 9. Further, the notch 2 is provided on the label base material 1, and at this time, the notch 2 is provided so as to be applied to the edge of the antenna 9 and also to the portion where the antenna 9 and the IC strap 72 are laminated.
Due to the above structure, the antenna 9 is also deformed at the same time when the label base material 1 is contracted and deformed by heat. However, since the deformation around the notch 2 is particularly large as shown in FIG. It can be expected to change greatly. At the same time, since the distance between the antenna 9 and the IC strap 72 varies, the generation efficiency of the voltage difference in the longitudinal direction of the antenna decreases, the condition of impedance matching between the antenna and the IC chip deteriorates, or Since the electrical connection between the antenna and the IC chip is broken, the operation of the IC chip is stopped, or information reading from the IC chip is not performed normally.

  As described above, the action of trying to peel off the sealed label from the adherend using heat causes the label base material itself to be deformed, and the deformation can be visually confirmed, and the communication function of the IC tag is lowered. IC chip information cannot be read normally.

Note that it is effective and desirable to provide the notch 2 at a location where the antenna 9 and the lead wire 4 of the IC strap 72 are electromagnetically coupled, and the planar shape of the notch is not a simple straight line. It is preferable that the line segment has a bending point such as a V shape or a U shape. Thereby, the influence of the shrinkage | contraction and deformation | transformation of the label base material by a heat | fever becomes large, visual confirmation becomes easier, and the fall of a communication function becomes large reliably. For example, the cross-sectional shape before thermal deformation along YY ′ of FIG. 1B as shown in FIG. 3A is the same as the cross-sectional shape after thermal deformation of the same portion as shown in FIG. The change is particularly large at the incision 2 part, and the visual confirmation and the deterioration of the communication function become clear.

  An antenna 9 which is one of the components of the non-contact IC medium 7 is directly provided on the label base 1. The antenna 9 forms a pattern by printing conductive ink. The conductive material in the conductive ink is preferably silver-based, and includes a binder resin, a solvent, silver powder, and evaporative drying type silver paste that obtains conductivity by contact thereof, such as screen printing, flexographic printing, It can be formed by printing by a printing method such as gravure printing or offset printing. It is also possible to draw conductive ink with an inkjet printer. By selecting the pattern formation method and pattern specifications, the antenna can be more easily broken and the IC label can be made thinner and smoother. In addition, an antenna may be formed using a film forming method such as vacuum deposition or sputtering of a metal thin film such as aluminum and a photolithography method.

  The antenna 9 is formed, for example, in the form of two strips, and the IC chip 3 of the IC strap 72 is placed at a planar position between them. For example, when the radio wave to be transmitted / received has a frequency equal to or higher than the microwave, the antenna 9 transmits / receives a radio wave when the wavelength of the use frequency is λ and the length in the longitudinal direction of the antenna 9 is set near λ / 2 It can be formed as an efficient dipole antenna. For example, when the use frequency of radio waves is 2.45 GHz, the optimum length in the longitudinal direction of the antenna 9 in the dipole type is about 50 mm to 60 mm. The non-contact IC medium 7 receives a radio wave from an information reading device (not shown) by an antenna 9 and supplies a potential difference generated in the longitudinal direction of the antenna 9 to the IC chip 3.

  FIG. 4 is a schematic plan view showing an IC strap 72 built in the non-contact IC label according to the present invention. As shown in FIG. 4, the IC strap 72 has a structure in which the IC chip 3 is electrically joined to the lead wire 4 formed on the base film 8 as a base material having no heat shrinkability. At this time, since the length of the lead wire 4 is short, a communication function cannot be obtained by the IC strap 72 alone, and a communication function can be obtained only when coupled with the antenna 9. The lead wire 4 is preferably provided with a T-shaped slit 41 as shown in FIG. This constitutes a loop-shaped circuit that is important for impedance matching conditions with the IC chip 3, and good communication characteristics can be obtained. At this time, the IC chip 3 and the slit 41 need to be provided so as not to overlap the antenna 9 so as not to deteriorate the communication function.

  Further, when the heat is used to peel off, the base film 8 of the IC strap 72 can be deformed in conjunction with the deformation of the label substrate 1 to prevent the IC strap from being used again. At this time, the base film 8 is preferably a film having a thickness of 20 μm or less in order to follow the shrinkage of the label substrate 1 even though the base film 8 itself does not have heat shrinkability.

  The IC chip 3 is formed in, for example, a square shape, and the side portion has a length dimension of 0.4 mm and a height dimension of 0.1 mm. In addition, the length dimension of a side part can be suitably changed instead of 0.4 mm.

When a radio wave having an intensity sufficient to supply power sufficient for the operation of the IC chip 3 is irradiated, the IC chip 3 enters an operating state. The IC chip 3 returns information held by the IC chip 3 to the information reading device in accordance with a timing signal or command superimposed on the radio wave from the information reading device. The information reader reads the information stored in the IC chip 3 by measuring the intensity of this re-radiation. Such a procedure for transmitting timing signals and commands from the information reading device to the IC chip 3 and a procedure for transmitting information from the IC chip 3 to the information reading device are referred to as an air protocol and are appropriately set in advance.
When the frequency used is less than the microwave frequency, for example, 13.56 MHz, a coiled antenna is frequently used instead of a dipole antenna.

  The lead wire 4 can be formed by the same method as the antenna 9 described above, for example, by forming a conductive ink by printing or using a metal thin film such as aluminum.

  The lead wire 4 and the IC chip 3 are connected via an electrical junction. As the electrical junction, ACP (anisotropic conductive paste), ACF (anisotropic conductive film), or the like can be used. These are composed of metal particles and an adhesive binder, and electrical connection is realized by curing the adhesive binder under heat and pressure conditions. In addition, there is a method of fusing using ultrasonic waves.

  As described above, the non-contact IC label in the present invention can be mounted with a stable IC chip even when a label base material having heat shrinkability is used, and the label base material is shrunk and deformed by heat. Using materials, the antenna and IC strap on the label base material are laminated to form a non-contact IC medium, and the function as an IC tag is expressed. Because it is provided, if the IC label is peeled off from the sticker using heat, the label base material contracts and deforms and the appearance can be confirmed, and at the same time, the communication function as an IC tag is also lowered. Can do. Therefore, since it is possible to visually and electrically confirm the trace of the label being peeled off, the non-contact IC label of the present invention has an excellent authenticity determination function and can further enhance the forgery prevention effect. It becomes.

Next, specific examples of the non-contact IC label of the present invention will be described.
Example 1
<Label substrate>
A pattern was printed by offset printing on a label substrate (width 60 mm, length 39 mm) made of a 90 μm thick OPS (stretched polystyrene) film (“EPS45T” manufactured by CI Kasei Co., Ltd.). Two strip antennas (length 25 mm, width 2.8 mm, gap 3 mm) were printed on the other main surface using Ag paste (XA-3106, manufactured by Fujikura Kasei Co., Ltd.).
<IC strap>
On the other hand, on a 38 μm thick PET film (width 5 mm), an aluminum thin film lead wire (length 7 mm) having a 3 mm length slit was formed by etching. This lead wire and an IC chip having a gold bump were melted and bonded using ultrasonic waves to produce an IC strap.
<Labeling>
An IC strap was laminated on the antenna provided on the label base material so that an IC chip was inserted between the two strip antennas. On top of that, polyethylene is laminated on one side of kraft paper, and an acrylic adhesive with 12000mN / 25mm adhesive strength coated on a silicon-treated separator (thickness 112μm) is laminated on it. It was.
Finally, as shown in FIG. 1 (a), an IC label A was produced by providing a V-shaped cut with a punching die.

(Example 2)
<Label substrate>
OPS (stretched polystyrene) film with a thickness of 90 μm (“EPS” manufactured by CI Kasei Co., Ltd.)
45T ") was printed on a label substrate (width 60 mm, length 39 mm) by offset printing. Two strip antennas (length 25 mm, width 2.8 mm, gap 3 mm) were printed on the other main surface using Ag paste (XA-3106, manufactured by Fujikura Kasei Co., Ltd.).
<IC strap>
On the other hand, on a PET film (width 5 mm) having a thickness of 38 μm, a lead wire (length 7 mm) having a 3 mm long slit was formed by screen printing using Ag paste. An IC strap was manufactured by using an anisotropic conductive adhesive at the connecting portion between the lead wire and the IC chip having the gold bump, and connecting them by thermocompression bonding (180 ° C., 7.4 kPa, 10 seconds). .
<Labeling>
An IC strap was laminated on the antenna provided on the label base material so that an IC chip was inserted between the two strip antennas. On top of that, polyethylene is laminated on one side of kraft paper, and an acrylic adhesive with 12000mN / 25mm adhesive strength coated on a silicon-treated separator (thickness 112μm) is laminated on it. It was.
Finally, as shown in FIG. 1B, an IC label B was produced by providing a U-shaped cut with a punching die.

Below, the comparative example of this invention is demonstrated.
(Comparative Example 1)
The pattern was printed on a label base material (width 60 mm, length 39 mm) made of a 90 μm thick OPS (stretched polystyrene) film (“EPS45T” manufactured by CI Kasei Co., Ltd.). An antenna was printed on the other main surface using an Ag paste, and an IC chip was bonded thereon by thermocompression bonding (180 ° C., 7.4 kPa, 10 seconds) using an anisotropic conductive adhesive. Further, an adhesive layer was formed thereon, and the outline contour was cut out to produce an IC label C.

(Comparative Example 2)
The pattern printing layer 11 was printed on the label base material 1 made of a label base material (width 60 mm, length 39 mm) made of a 90 μm-thick OPS (stretched polystyrene) film (“EPS45T” manufactured by CI Kasei Co., Ltd.). As shown in FIG. 5, the adhesive layer 5 was applied to the other main surface, and an IC tag 7 ′ having an etching antenna 9 ′ formed on a PET base material as the base film 8 was laminated thereon. On top of that, polyethylene is laminated on one side of kraft paper, and an acrylic adhesive with an adhesive strength of 12000 mN / 25 mm coated on a silicon-treated separator 6 (thickness: 112 μm) is applied thereon. Combined. Thereafter, the outer contour was cut out to produce an IC label D.

(Comparative Example 3)
A pattern was printed on a label substrate made of art paper having a thickness of 90 μm. Thereafter, in the same manner as the IC label A of Example 1, an antenna, an IC strap, and an adhesive layer were formed on the other main surface. Thereafter, the outer contour was cut out to produce an IC label E.

The IC labels A, B, C, D, and E of Examples 1 and 2 and Comparative Examples 1, 2, and 3 produced in this manner were attached to a box containing a product.
At this time, the IC labels A, B, D, and E could be confirmed by a reader, but the IC label C of Comparative Example 1 showed deformation of the label base material due to heating when the IC chip was joined. In addition, communication of the IC chip was impossible.
The IC labels A, B, D, and E that were communicable were then carefully removed from the box using the heat of the dryer.

  In the IC labels A and B of the examples, first, it was possible to visually confirm the deformation of the label base material at the cut portion. Next, an attempt was made to read the IC chip information using the communication device. However, the reading distance was reduced, and normal communication became impossible.

  On the other hand, in the IC label D of Comparative Example 2, it was possible to confirm the deformation of the label base material, but it was possible to communicate without destroying the built-in IC tag. Further, the forged IC label D could be produced by removing the IC tag from the IC label D and pasting it with the forged label base material.

  Further, in the IC label E of Comparative Example 3, by using heat to soften the adhesive material, the cutter blade can be easily inserted between the IC label adhesive materials without causing the label substrate to break. I was able to remove the label and reuse the label. Even though the seal was released, the communication function could be read without any problem.

  The technical scope of the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention.

DESCRIPTION OF SYMBOLS 1 ... Label base material 2 ... Cut 3 ... IC chip 4 ... Lead wire 5 ... Adhesive layer 6 ... Release sheet (separator)
7 ... Non-contact IC media (IC tag)
7 ′... IC tag (non-contact IC medium) described in Comparative Example 2
8 ... Base film 9 ... Antenna 9 '... Antenna 10 described in Comparative Example 2 ... Non-contact IC label 11 ... Print layer 41 ... Slit 72 ... IC strap D ... IC label described in comparative example 2

Claims (3)

A label base material provided with an adhesive layer for attaching to an adherend, and a non-contact IC medium provided on the label base material,
The label base material is made of a material having heat shrinkability and is provided with a cut.
The non-contact IC medium includes an antenna and an IC strap, the antenna is provided in contact with the label base material, and the IC strap is provided on a lead wire provided on a base film having no heat shrinkability. A non-contact IC label, wherein the antenna and the IC strap are electromagnetically coupled.   The notch provided in the label base material is provided at a location where the antenna and the IC strap are electromagnetically coupled, and the planar shape of the notch is a line segment having a bending point. The non-contact IC label according to 1.   The non-contact IC label according to claim 1, wherein the antenna is formed of a conductive ink.

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