JP2004355519A - Ic label - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC label having excellent impact resistance to an externally applied impact force when stuck on a relatively hard adherend, such as a cargo. <P>SOLUTION: The IC label comprises an adhesive member 5 for an adherend, an inlet packaging an IC chip 2 provided with a reinforcing member 3 covering at least the surface opposite of a mounting surface on a circuit board with a circuit provided on an inlet backing 1, and a cushioning foam substrate 7, arranged thereon in this order. The IC chip is protected with the reinforcing member, an impact is absorbed by the foam substrate, and thus the IC label with excellent impact resistance can be obtained. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【００４０】
［評価］
本願発明の構成により、耐衝撃性に優れたＩＣラベルが得られる理由としては以下のように考えられる。ＩＣラベル表面に外部から加えられた衝撃力は、その上部にある各層が衝撃力に対して十分な反発力を持つほどの厚みや硬さがある場合を除いて、ＩＣチップ２に伝達されるまでに、吸収されることにより徐々に弱まると考えられ、実施例１と比較例１の強度試験結果の差は、発泡性基材７による衝撃力の吸収効果と推察される。
また、実施例２と比較例２の強度試験結果の比較より、耐衝撃性を向上させるためには、外部から加わる衝撃力を、ＩＣチップ２に伝達されるまでの層で十分に弱めた方がより効果的であり、発泡性基材７はＩＣチップ２よりも力の加わる側により近くになるように配置することが必要と考えられる。
【００４１】
実施例２と比較例３の強度試験結果の比較から、補強部材３を配置することは耐衝撃性の向上に対して十分な効果がみられた。ＩＣチップ２に補強部材３を接続固定することで強固となり、折れ、割れが発生しにくくなると考えられる。
しかしながら、比較例３と比較例４の強度試験結果の比較では、比較例４における補強部材３の効果はあまり見られなかった。実施例３の強度試験結果を合わせて考えると、補強効果を向上させるためには、ＩＣチップ２と補強部材３を一体化させることが望ましい。また、補強部材３をＩＣチップ２の実装面に対して反対側の面に配置することが好ましい。
【００４２】
さらに、ＩＣチップ２と補強部材３の接続体をより強固にするためには、できる限り密着させることが望ましく、ＩＣチップ２と補強部材３の間に存在する硬化性樹脂８はその厚みができるだけ薄いほうが効果的であると考えられる。
実施例２と実施例３の強度試験結果の比較から、外部からの衝撃力に対しては、力の加わる面の反対側を補強部材によって補強するほうがより効果的であると考えられる。補強部材を構成する金属等の比較的硬い物よりも、インレット支持体１の比較的柔らかい物を介して衝撃力を受ける方が、ＩＣチップ２は破損しにくくなると推察される。
【００４３】
【発明の効果】
本発明の構成にれば、従来技術により得られるＩＣラベルと比較して、耐衝撃性に優れたＩＣラベルが得られるため、比較的硬い被着物に貼付けられた状態で、外部から衝撃力が加わる様な環境においても破損することなく、幅広い用途で使用することが可能になった。
【図面の簡単な説明】
【図１】本発明によるＩＣラベルの一実施例の断面図。
【図２】図１に示したＩＣラベルの補強部分を示したＡ−Ａ’断面図。
【図３】本発明によるＩＣラベルの別の一実施例の断面図。
【図４】ＩＣラベルの一比較例の断面図。
【図５】ＩＣラベルの別の一比較例の断面図。
【符号の説明】
１ インレット支持体
２ ＩＣチップ
３ 補強部材
５ 被着体用粘着部材
６ 中間層
７ 発泡性基材
８ 硬化性樹脂
９ 粘着部材[0001]
TECHNICAL FIELD OF THE INVENTION
INDUSTRIAL APPLICABILITY The present invention incorporates an inlet on which a IC chip is mounted on a circuit board, and is used for distribution management use, product management use, and the like, which is used by being attached to articles, article cases, pallets, and other transportation equipment. It relates to an IC label to be used.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, an automatic recognition management system using a barcode is used for merchandise management in distribution, sales, and the like. The barcode is an information of an arrangement state of images (bars), and the information can be read by a dedicated barcode reader. For this reason, for example, merchandise management and distribution management are performed by attaching a barcode recording merchandise information to the merchandise. However, the barcode has a problem that a large amount of information cannot be described, the information cannot be updated, and forgery is easy. Therefore, in recent years, a system called RFID (Radio Frequency Identification) has attracted attention. This system can write a larger amount of information compared to a barcode by using an IC chip, and communicates with a reader / writer (read / write device) via radio waves, so that the IC chip Various systems have been proposed because the described information can be updated.
[0003]
Patent Document 1 proposes a physical distribution management system using an IC label. However, there is a problem that an external force is applied to the IC chip to cause cracks and breakage, thereby making communication with the reader / writer impossible. Patent Document 2 discloses an IC card comprising: a protection member for covering an IC chip; and a reinforcing member harder than the protection member for reinforcing at least a portion of the protection member surrounding the IC chip. A module has been proposed. This is intended to protect the IC chip from bending deformation due to external stress. Patent Document 3 proposes an IC card having a microporous synthetic resin film as the outermost layer. This is intended to protect the IC chip from external pressure applied during printing when printing is performed after IC card molding.
[0004]
[Patent Document 1]
JP-A-2002-154618 (Claims, page 3-4, FIG. 1)
[Patent Document 2]
JP-A-11-11061 (Claim 1, pages 2-3)
[Patent Document 3]
JP-A-2000-251004 (pages 2-3)
[0005]
[Problems to be solved by the invention]
Patent Documents 2 and 3 using an IC instead of a conventionally used barcode, and an IC label obtained by applying an adhesive treatment to an IC card or an inlet sheet of an IC card to an article is actually attached to the article. I tried using it. In the end, after use, communication was not possible. Due to the vibration during transportation during use, these may collide with each other or the article case to which the IC label is attached, or when the article is placed on the IC label when attached to the top of the pallet, It was presumed that the so-called external impact applied the IC chip and destroyed it. That is, the IC card disclosed in Patent Document 2 and the like is proposed for the purpose of protecting the IC chip from bending deformation due to external stress applied to both ends of the card, and is supposed as a method for reinforcing the impact force applied to the IC chip. It was not done.
[0006]
The IC card disclosed in Patent Document 3 and the like aims to protect the IC chip from external pressure applied during printing. Therefore, it was presumed that the method was insufficient for protection against a larger impact, which is considered to occur when used for distribution management purposes as described above. According to the present invention, there is provided an IC label having excellent impact resistance against an externally applied impact force while being attached to a relatively hard adherend such as luggage, which the above-mentioned IC cards were not assumed. The purpose is to do.
[0007]
[Means for Solving the Problems]
The IC label according to the present invention includes an adhesive for an adherend and an inlet on which an IC chip provided with a reinforcing member that covers at least a surface opposite to a mounting surface side is mounted on a circuit board provided with a circuit on an inlet support. And a foamable base material having a cushioning property are arranged at least in this order.
Furthermore, an intermediate layer provided between the IC chip mounting surface side of the inlet and the pressure-sensitive adhesive layer for an adherend may be further provided.
Further, the foamable base material may be an adhesive foamed base material.
Further, the pressure-sensitive adhesive member for an adherend may be a member composed of a pressure-sensitive adhesive layer on the reinforcing member side, a support for the pressure-sensitive adhesive member, and a pressure-sensitive adhesive layer on the adherend side.
The pressure-sensitive adhesive member for an adherend may be a member composed of only a pressure-sensitive adhesive layer.
In some cases, the inlet support side of the inlet may be configured to face the pressure-sensitive adhesive layer for an adherend.
[0008]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a sectional view showing an embodiment of the IC label of the present invention.
[0009]
A circuit (not shown) such as an antenna and a capacitor is provided on the inlet support 1 to form a circuit board, and an IC chip 2 is mounted thereon to perform communication with a reader / writer via a radio wave. The one which enables reading and rewriting of information described in the IC chip 2 corresponds to a heart part such as an IC card and is called an inlet. The outer shape of an IC chip tends to be smaller from about 5 mm square recently, and even less than 1 mm square is seen. The thickness also ranges from several hundred μm to less than 100 μm. The shape of the inlet is generally a rectangle of several tens of mm square or a disk having a diameter of the same.
[0010]
Examples of the inlet support 1 include polyolefin resin polymers such as polyethylene, polypropylene, polybutene, polystyrene, polymethylpentene, ethylene-propylene copolymer, ethylene-butylene copolymer, propylene-butene copolymer, polyvinylidene fluoride, Fluororesin polymers such as polytetrafluoroethylene, polyurethane, phenolic polyether, cellulose acetate, acrylonitrile polymer, amide resin, polyester resin, glass epoxy resin, polycarbonate, acrylonitrile butadiene styrene, polyethylene naphthalate (PEN ), Polyphenylsulfide, paper or the like, or a mixture thereof. Further, a mixture of the above substances and an inorganic substance may be used. Thicknesses of about 30 to 60 μm are often used.
[0011]
Examples of a method for providing a circuit such as an antenna circuit on the inlet support 1 include a winding method, an etching method, and a paste screen printing method. In particular, an etching method using copper or aluminum and a screen printing method using a paste containing silver particles are suitable for mass production in terms of the manufacturing method, and thus are preferred as the circuit forming method of the present invention.
[0012]
The reinforcing member 3 only needs to have a mechanical strength capable of protecting the IC chip 2, and examples thereof include a metal material such as stainless steel, a plastic material such as epoxy resin, a ceramic material, and a composite material thereof. A metal material such as stainless steel is preferable as the reinforcing member 3 of the present invention because of its reinforcing effect against an external impact and being suitable for mass production by punching with a die. Examples of the shape of the reinforcing member 3 include a triangular shape, a square shape, a round shape, and the like, and it is preferable that the reinforcing member 3 is slightly larger than the planar shape of the IC chip. When connecting and fixing the IC chip 2 and the reinforcing member 3, it is not necessary to consider the arrangement direction, so that a round shape is preferable as the reinforcing member 3 of the present invention from the viewpoint of work efficiency. The thickness of the reinforcing member 3 is preferably in the range of 50 μm to 250 μm. If the thickness is less than 50 μm, it is difficult to obtain a sufficient reinforcing effect against external impact. If the thickness is more than 250 μm, irregularities are likely to be generated on the surface of the IC label or the adhesive member 5 for the adherend. Problems tend to occur when printing or pasting to an adherend.
[0013]
Examples of the curable resin 8 for connecting and fixing the IC chip 2 and the reinforcing member 3 include a thermosetting resin, an ultraviolet curable resin, and a humidity curable resin. The thermosetting resin is particularly preferable as the curable resin 8 of the present invention because it can be cured in a short time and can be easily handled at room temperature.
[0014]
The following two types of base materials can be considered as the foamable base material 7. {Circle around (1)} A film or the like used as a substrate in which bubbles or voids are formed by some means, and which itself does not have so-called tackiness. {Circle around (2)} A material which is formed of a synthetic resin and has a void portion formed therein, and has adhesiveness itself, and does not require an adhesive means such as an adhesive when forming a label in combination with other constituent layers. In the present specification, such a foamable substrate is referred to as an adhesive foamed substrate.
[0015]
Examples of (1) are polyolefin (eg, polyethylene, polypropylene, etc.), polyvinyl chloride (eg, soft polyvinyl chloride, hard polyvinyl chloride, etc.), polyester (eg, polyethylene terephthalate (PET), modified polyethylene terephthalate (PET-G)). Etc.), a foamed film formed by blending a foaming agent with a resin such as polystyrene, polyurethane, cellophane, and acrylic, and foaming the resin, and blending an inorganic pigment, an organic pigment, and the like with the resin to form a void by stretching. Films such as porous films. An aqueous solution containing urethane foam resin is applied on a paper base, or microcapsules of polystyrene, polyvinylidene chloride, polyvinyl chloride, and acrylonitrile are printed or printed and foamed by heat treatment. Paper, such as foamed paper, in which the paper layer portion of the paper is foamed by passing through a nip formed by the above. Alternatively, synthetic papers and nonwoven fabrics can be exemplified.
[0016]
An example of (2) is a synthetic resin obtained by impregnating a resin, such as polyolefin, polyvinyl chloride, polyester, polystyrene, polyurethane, cellophane, or acrylic, shown in the example of (1) with an adhesive to impart adhesiveness. The main component is a pressure-sensitive adhesive tape in which a void portion is formed by foaming chemically or mechanically. For example, acrylic foam pressure-sensitive adhesive tape, a foaming agent is foamed in an acrylic solution before curing, and then a chemical foaming method by curing it, or an inert gas such as nitrogen gas is added to the acrylic solution before curing. It is manufactured by a mechanical foaming method or the like by dispersing and mixing and hardening it. Such a situation is described in the section of the prior art in JP-A-2002-80802. Specifically, it is commercially available from Sumitomo 3M under the trade name VHB.
[0017]
The porosity of any type of foamable substrate is preferably 20 to 90%. If the porosity exceeds 90% and is too high, the base material is likely to be completely compressed without absorbing external impacts. On the other hand, if the porosity is lower than 20%, it is difficult to obtain a cushioning property for absorbing an external impact, and the external impact directly affects the IC chip 2.
[0018]
The porosity A [%] of the foamable base material is an apparent volume [cm] calculated from the external dimensions of the foamable base material. ³ ] To B, true volume [cm ³ ] Is C (the true volume C can be determined by measuring the increased volume when the foamable base material is submerged in a liquid such as alcohol), and is calculated by the following equation. Things.
: A (%) = [(B−C) / B] × 100
The thickness of the foamable substrate 7 is preferably from 50 μm to 600 μm, and more preferably from 100 μm to 400 μm. If the thickness is less than 50 μm, sufficient cushioning properties may not be obtained because the thickness is small. On the other hand, although it depends on the specifications of the final product, for example, in an IC card, ISO / ICE 10536-1 (1992) specifies that the thickness is 840 μm or less. This level is considered to be the upper limit, as it may be caused. Among the above two types of foamable base materials, the latter one does not require the use of a separate adhesive for bonding to the other constituent layers, such as the inlet and the surface base material 4, when manufacturing an IC label. Is more preferable for the reason.
[0019]
The following two types of members can be considered as the adherend members 5 and 9 for the adherend. (1) A pressure-sensitive adhesive layer formed on both sides of a support for a pressure-sensitive adhesive member. {Circle around (2)} One formed only with an adhesive layer.
Examples of the support for the adhesive member used in (1) include resin films such as polyolefin, polyvinyl chloride, polyester, polystyrene, polyurethane, cellophane, and acrylic, papers, synthetic papers, nonwoven fabrics, and laminates thereof. Objects can be exemplified. The pressure-sensitive adhesive used for the pressure-sensitive adhesive layer may be a rubber type, an acrylic type, a silicone type, a vinyl ether type, a urethane type or the like, and the mold may be a solvent type, an emulsion type or a hot melt type.
In addition, in order to form an adhesive layer on the surface of the adhesive member support, a coating machine or a printing machine such as a comma coater, a reverse coater, a gravure coater, a reverse gravure coater, a kiss coater, a knife coater, a bar coater, and a lip coater. Examples of the method include a method of directly applying the composition to the surface of the support for an adhesive member or transferring a composition applied to a release sheet.
[0020]
Examples of (2) include the use of the pressure-sensitive adhesive applied to a release sheet transferred by a coating machine or a printing machine, and the use of the adhesive foam base material shown as an example of the foam base material 7. Can be exemplified.
The thickness of any of the adhesive members is preferably 5 to 150 μm. If the thickness is less than 5 μm, sufficient adhesive strength cannot be obtained, and thus peeling tends to occur. On the other hand, if the thickness is too large, the total thickness of the IC label may exceed the specification range. Of the two types of pressure-sensitive adhesive members, the former is preferable as the pressure-sensitive adhesive member of the present invention because workability during lamination is better.
[0021]
Examples of the intermediate layer 6 include polyolefin resin-based polymers such as polyethylene, polypropylene, polybutene, polystyrene, polymethylpentene, ethylene-propylene copolymer, ethylene-butylene copolymer, propylene-butene copolymer, polyvinylidene fluoride, and polyvinylidene. Fluororesin polymer such as tetrafluoroethylene, polyurethane, phenolic polyether, cellulose acetate, acrylonitrile polymer, amide resin, polyester resin, glass epoxy resin, polycarbonate, acrylonitrile butadiene styrene, polyethylene naphthalate, polyphenyl A simple substance or a mixture of sulfide, paper and the like can be exemplified. Further, a mixture of the above substances and an inorganic substance may be used.
[0022]
Examples of the surface substrate 4 include those similar to the intermediate layer 6, but it is also possible to use the foamable substrate 7 as the surface substrate. Further, an ink jet receiving layer, a thermal transfer receiving layer, a thermosensitive layer, a printing layer, and the like can be provided on the surface substrate according to the purpose of use.
[0023]
In addition, when the adherend is a metal itself or includes a metal material, communication via radio waves may be hindered. In such a case, a non-conductive magnetically permeable layer as described below and a conductive layer if necessary between the inlet and the adherend, and if a conductive layer is used, the same layer is used as the adherend. Can be interposed so as to be closer to each other. Specifically, in the example of the IC label shown in FIG. 1, the IC label can be provided between the intermediate layer 6 and the pressure-sensitive adhesive layer 5 for an adherend via a thin adhesive member as appropriate.
[0024]
(Non-conductive magnetically permeable layer)
For the non-conductive magnetically permeable layer, a non-conductive sheet made by kneading metal magnetic powder or flakes having high magnetic permeability into a resin is used. Initial permeability μ of non-conductive magnetically permeable layer _a Is greater than 1, preferably 2 or more. In practice, a magnetically permeable metal material having a high magnetic permeability exists discontinuously without being continuously connected. In other words, a layer containing magnetic powder is formed in an island shape with the resin portion as the sea so that electric conductivity does not occur. Here, the electric conductivity means a volume resistance value of 10 ² On the order of Ω · cm, if it is lower than this resistance value, it has electrical conductivity, and if it is higher, it is non-conductive.
[0025]
This is because when an electrically conductive amorphous alloy sheet is used instead of a non-conductive magnetically permeable layer, for example, radio waves emitted from a reader / writer are reflected on the electrically conductive amorphous alloy sheet surface, and the IC label This is considered to be inconvenient because no signal and power are supplied to the antenna.
[0026]
Magnetic powder and flakes can be considered as the shape of the magnetically permeable metal material. As specific materials, silicon steel, sendust alloy, Fe-Al alloy, electromagnetic soft iron, amorphous alloy, permalloy, and carbonyl iron can be used.
As the sendust / Fe-Al alloy, alpalm, hypermal, sendust, super sendust, or the like is used. As the soft magnetic iron, industrial pure iron, armco steel, low carbon steel, or the like is used. Cobalt-based, iron-based, and nickel-based amorphous alloys can be used. The composition of the amorphous alloy contains Co, Fe, and Ni in a total amount of 70 to 98% by weight as a main component, and contains B, Si, and P in a total amount of 2 to 30% by weight, and further contains Al, Mn, Zr, and Nb. . As the permalloy, 78-Permalloy, 45-Permalloy, 36-Permalloy, Cr-Permalloy, Mo-Permalloy, Supermalloy and the like can be used.
[0027]
The resin which is the other component used in the non-conductive magnetically permeable layer is polyethylene, chlorinated polyethylene, polypropylene, polyurethane, acrylic, styrene, silicone, PET, PEN, PET-G, ABS (acrylonitrile-butadiene-styrene). ), Vinyl chloride, vinyl chloride acetate, EVA (ethylene vinyl alcohol), polycarbonate, alloy and the like, and any resin generally used by mixing a pigment or the like can be used.
Other materials include auxiliary agents for improving the affinity (adhesion) between the resin and the magnetic powder, and antioxidants, lubricants, release agents, defoamers, wetting agents, curing agents, and UV absorbers. An additive necessary for the manufacturing process or an additive for improving durability and convenience may be included.
The method of manufacturing the non-conductive magnetically permeable layer is roughly classified into two methods. One method is to apply a magnetic coating material on a base material sheet, and the other is to knead a magnetic resin into a liquid-like resin by using a device such as a kneader or the like to form a sheet. .
[0028]
(Conductive layer)
The conductive layer is preferably provided to prevent a change in communication performance regardless of whether the adherend contains a metal or a metal or not.
Volume resistance value 10 ^-2 Examples of the conductive layer of about Ω · cm or less include a metal foil such as aluminum, copper, zinc, and an alloy, a conductive ink in which a metal powder such as silver, copper, and an alloy is dispersed in a resin, a carbon sheet, and a carbon ink. A printing sheet, a conductive resin sheet, a conductive polymer sheet such as polyacetylene, or the like can be used. More preferably, the volume resistance value is 10 ^-2 A conductive layer of about Ω · cm or less can obtain good communication characteristics.
[0029]
Each layer, inlet support, foamable substrate, intermediate layer, surface substrate, and the like used in the IC label of the present invention is particularly thick and almost flexible unless a hard material is selected. Since it is a film-like material, even if it is assembled as an IC label, it is entirely flexible and can follow and adhere even to a curved surface or a surface with some irregularities.
[0030]
【Example】
Hereinafter, the present invention will be described more specifically with reference to Examples, but of course, the present invention is not limited thereto.
[0031]
Example 1
Example 1 will be described with reference to FIG. A loop antenna circuit or the like is formed from a 30 μm aluminum foil on an inlet support 1 (SA: PET, manufactured by Teijin Limited) having a thickness of 25 μm by an etching method to form a circuit board, and ACF (anisotropic conductive adhesive) is formed thereon. ) (Not shown), an IC chip 2 (I-codeII: manufactured by Philips) was mounted in a face-down manner to produce an inlet. Further, a curable resin 8 (A-1002: manufactured by Nagase Ciba) is potted on the IC chip 2, and a reinforcing member 3 (SUS301: thickness 100 μm, size 5 mmφ) is temporarily placed thereon, and is heated and cured. Thus, the IC chip 2 and the reinforcing member 3 were connected and fixed, thereby producing a reinforced inlet. Up to this point, the components are assembled by the members 1, 2, 3, and 8 in FIG. 1, and in fact, the components are assembled in a direction opposite to the state of FIG.
[0032]
Adhesive member 5 for adherend having a release sheet adhered to the back surface (DFPETC25 / L8W: double-sided adhesive tape manufactured by Oji Tack Co., Ltd., thickness 65 μm, support for this adhesive member uses PET 25 μm), and intermediate layer 6 (U2498W: After adhering an adhesive member 9 (DFPETC25 / L8W: double-sided adhesive tape, thickness of 65 μm, PET support of adhesive member is 25 μm, manufactured by Oji Tack Co., Ltd.) to a PET (75 μm, manufactured by Teijin Limited), the IC is pressed with a 6 mmφ punch. A hollow portion corresponding to the chip 2 and the reinforcing member 3, a reinforced inlet, and a foamable base material 7 (VHB Y-4914: double-sided pressure-sensitive adhesive tape for structure, thickness 250 μm, manufactured by Sumitomo 3M Limited) , And a surface substrate 4 (Yupotak: Yupo thickness: 110 μm, manufactured by Oji Tack Co., Ltd.) are laminated in order, and pressed with a rubber roll and adhered. Combined to give the IC label punched in the card shape of 54mm × 86mm in the mold.
[0033]
Example 2
An IC label was obtained in the same manner as in Example 1, except that the thickness of the foamable base material 7 of Example 1 was changed to 400 μm (VHBY-4604: double-sided adhesive tape for structure, manufactured by Sumitomo 3M Limited).
[0034]
Example 3
Embodiment 3 will be described with reference to FIG. The same procedure as in Example 2 was performed except that the lamination order of the inlet support 1 and the intermediate layer 6 was changed, and the surface of the inlet support 1 on which the IC chip 2 was mounted was disposed on the foamable base material 7 side. To obtain an IC label.
[0035]
Example 4
A double-sided adhesive tape (DFPETC25 / L8W: 65 μm, Oji Tack Co., Ltd.) was applied on both sides of a microporous synthetic resin film (trade name: Tesulin SP1000: thickness 254 μm, material polyolefin, manufactured by PPG). IC label was obtained in the same manner as in Example 2 except that the product was changed to a product obtained by laminating the same.
[0036]
Comparative Example 1
An IC label was obtained in the same manner as in Example 1 except that the foamable base material 7 of Example 1 was changed to PET (U2498W: manufactured by Teijin Limited) having a thickness of 250 μm.
Comparative Example 2
Comparative Example 2 will be described with reference to FIG. FIG. 4 is a sectional view of Comparative Example 2. This example is the same as Example 2 except that the foamable substrate 7 that was located between the surface substrate 4 and the inlet support 1 in Example 2 was arranged below the adhesive member 5 for an adherend. To obtain an IC label.
[0037]
Comparative Example 3
An IC label was obtained in the same manner as in Example 2 except that the reinforcing member 3 of Example 2 was not used.
Comparative Example 4
Comparative Example 4 will be described with reference to FIG. FIG. 5 is a sectional view of Comparative Example 4. An IC label was obtained in the same manner as in Example 2, except that the reinforcing member 3 was disposed between the inlet support 1 and the foamable base material 7 and was not directly fixed to the IC chip.
With respect to the samples of various IC labels obtained as described above, a strength test was performed by the following test method.
[0038]
[Strength test]
An IC label formed on a metal block having a thickness of 85 mm is placed, and a metal ball made of SUS304 having a mass of 28.7 g and a diameter of 19.05 mm (3/4 inch) is dropped from a certain height on the chip portion. Communication was confirmed with a reader / writer connected to a personal computer at each height, and the height at which communication was disabled was measured. Table 1 shows the evaluation results of the obtained IC labels.
[0039]
[Table 1]

[0040]
[Evaluation]
The reason why an IC label excellent in impact resistance can be obtained by the configuration of the present invention is considered as follows. The externally applied impact force on the IC label surface is transmitted to the IC chip 2 unless each layer on the IC label has a thickness or hardness enough to have a sufficient repulsive force against the impact force. By the time, it is considered that the strength is gradually weakened by the absorption, and the difference between the strength test results of Example 1 and Comparative Example 1 is presumed to be the effect of absorbing the impact force by the foamable base material 7.
Also, comparing the strength test results of Example 2 and Comparative Example 2, it was found that in order to improve the impact resistance, the impact force applied from the outside was sufficiently weakened in the layer until it was transmitted to the IC chip 2. Is more effective, and it is considered necessary to arrange the foamable base material 7 so as to be closer to the side on which the force is applied than the IC chip 2.
[0041]
From a comparison of the strength test results of Example 2 and Comparative Example 3, it was found that arranging the reinforcing member 3 had a sufficient effect on improving the impact resistance. It is considered that the reinforcing member 3 is connected and fixed to the IC chip 2 so that the reinforcing member 3 becomes strong, and breakage and cracks hardly occur.
However, in the comparison between the strength test results of Comparative Example 3 and Comparative Example 4, the effect of the reinforcing member 3 in Comparative Example 4 was not so much seen. Considering the strength test results of Example 3, it is desirable to integrate the IC chip 2 and the reinforcing member 3 in order to improve the reinforcing effect. Further, it is preferable that the reinforcing member 3 is disposed on a surface opposite to the mounting surface of the IC chip 2.
[0042]
Further, in order to further strengthen the connection between the IC chip 2 and the reinforcing member 3, it is desirable to make the connection as close as possible, and the thickness of the curable resin 8 existing between the IC chip 2 and the reinforcing member 3 should be as small as possible. It is believed that thinner is more effective.
From a comparison of the strength test results of Example 2 and Example 3, it is considered that it is more effective to reinforce the opposite side of the surface to which the force is applied with a reinforcing member against an external impact force. It is presumed that the IC chip 2 is less likely to be damaged when it receives an impact force through the relatively soft material of the inlet support 1 than a relatively hard material such as metal that forms the reinforcing member.
[0043]
【The invention's effect】
According to the configuration of the present invention, since an IC label having excellent impact resistance can be obtained as compared with an IC label obtained by the conventional technique, an external impact force can be obtained in a state where the IC label is attached to a relatively hard adherend. It can be used in a wide range of applications without being damaged even in such an environment.
[Brief description of the drawings]
FIG. 1 is a sectional view of an embodiment of an IC label according to the present invention.
FIG. 2 is an AA ′ cross-sectional view showing a reinforcing portion of the IC label shown in FIG. 1;
FIG. 3 is a sectional view of another embodiment of the IC label according to the present invention.
FIG. 4 is a sectional view of a comparative example of an IC label.
FIG. 5 is a sectional view of another comparative example of the IC label.
[Explanation of symbols]
1 Inlet support
2 IC chip
3 Reinforcement members
5 Adhesive member for adherend
6 middle class
7 Foamable base material
8 Curable resin
9 Adhesive members

Claims (6)

An adhesive member for an adherend,
An inlet mounted with an IC chip provided with a reinforcing member for covering at least a surface opposite to the mounting surface side on a circuit board provided with a circuit on the inlet support;
Foamable base material having cushioning properties,
At least in this order. The IC label according to claim 1, further comprising an intermediate layer provided between the IC chip mounting surface side of the inlet and the pressure-sensitive adhesive layer for an adherend. 3. The IC label according to claim 1, wherein the foamable base material is an adhesive foamed base material. 4. The IC label according to claim 1, wherein the adhesive member for an adherend is a member composed of an adhesive layer on the reinforcing member side, a support for the adhesive member, and an adhesive layer on the adherend side. 5. 4. The IC label according to claim 1, wherein the adhesive member for an adherend is a member composed of only an adhesive layer. 6. The IC label according to claim 1, wherein the inlet support side of the inlet is configured to face the pressure-sensitive adhesive layer for an adherend.

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