KR100968139B1 - A process of manufacture for display card - Google Patents

A process of manufacture for display card Download PDF

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KR100968139B1
KR100968139B1 KR1020080035740A KR20080035740A KR100968139B1 KR 100968139 B1 KR100968139 B1 KR 100968139B1 KR 1020080035740 A KR1020080035740 A KR 1020080035740A KR 20080035740 A KR20080035740 A KR 20080035740A KR 100968139 B1 KR100968139 B1 KR 100968139B1
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South Korea
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paper
hot melt
liquid crystal
resin sheet
crystal display
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KR1020080035740A
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Korean (ko)
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KR20090110121A (en
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강성일
강희준
이재희
이정재
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주식회사 제이디씨텍
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07701—Constructional details, e.g. mounting of circuits in the carrier the record carrier comprising an interface suitable for human interaction
    • G06K19/07703—Constructional details, e.g. mounting of circuits in the carrier the record carrier comprising an interface suitable for human interaction the interface being visual
    • G06K19/07707—Constructional details, e.g. mounting of circuits in the carrier the record carrier comprising an interface suitable for human interaction the interface being visual the visual interface being a display, e.g. LCD or electronic ink
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/75252—Means for applying energy, e.g. heating means in the upper part of the bonding apparatus, e.g. in the bonding head

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

본 발명은 디스플레이를 위한 액정 표시부, IC칩, 박막 배터리 등으로 구성된 PCB와 상하 인쇄지, 상하 코팅지를 적층시켜 제조하여 작업의 효율을 최대한 높여줄 수 있도록 한 디스플레이카드 제조방법에 관한 것이다.The present invention relates to a display card manufacturing method for manufacturing a PCB consisting of a liquid crystal display, an IC chip, a thin film battery, and the like, and a top and bottom printing paper and a top and bottom coated paper laminated for the display to maximize the work efficiency.

전술한 본 발명의 특징은, 합성수지시트(11)에 핫멜트(40)를 도포하는 도포단계(S10); 핫멜트(40)가 도포된 합성수지시트(11)에 액정 표시부(12), IC칩(13), CPU(14), 박막 배터리(15) 등을 전기적 결선되게 배열하는 배열단계(S20); 액정 표시부(12), IC칩(13), CPU(14), 박막 배터리(15) 등이 배열된 합성수지시트(11)를 100~150℃의 온도를 갖는 히팅롤러(50)로 열 압압하여 PCB판(10)을 형성하는 PCB구성단계(S30); 상기 단계(S30)의 PCB판(10) 상하부에 핫멜트가 도포된 인쇄지(20a)(20b)를 적층시키고, 인쇄지(20a)(20b)의 상하부에 핫멜트가 도포된 상하부 코팅지(30a)(30b)를 적층시키는 적층단계(S40); 상기 단계(S40)에서 순차적으로 적층된 상부코팅지(30a), 상부인쇄지(20a), PCB판(10), 하부인쇄지(20b) 및 하부코팅지(30b)를 100~150℃의 온도를 갖는 히팅히팅롤러(50)를 통과시켜 열 압착시켜 부착하는 부착단계(S50)로 이루어짐을 특징으로 하는 디스플레이카드의 제조방법에 의하여 달성될 수 있는 것이다.Features of the present invention described above, the coating step of applying a hot melt 40 to the synthetic resin sheet 11 (S10); An arrangement step (S20) of arranging the liquid crystal display unit 12, the IC chip 13, the CPU 14, the thin film battery 15, and the like to be electrically connected to the synthetic resin sheet 11 to which the hot melt 40 is applied; The composite resin sheet 11 having the liquid crystal display 12, the IC chip 13, the CPU 14, the thin film battery 15, and the like is thermally pressed by a heating roller 50 having a temperature of 100 to 150 ° C. PCB configuration step of forming a plate (10) (S30); Laminating printing paper 20a, 20b coated with hot melt on the upper and lower portions of the PCB board 10 in step S30, and upper and lower coated paper 30a having hot melt applied on the upper and lower portions of the printing paper 20a, 20b ( A stacking step (S40) of stacking 30b); The upper coated paper 30a, the upper printed paper 20a, the PCB board 10, the lower printed paper 20b, and the lower coated paper 30b sequentially stacked in the step S40 have a temperature of 100 to 150 ° C. It can be achieved by the manufacturing method of the display card, characterized in that consisting of the attachment step (S50) of passing through the heating and heating roller 50 is pressed.

디스플레이, 카드  Display, card

Description

디스플레이카드의 제조방법{A process of manufacture for display card}A process of manufacture for display card

본 발명은 디스플레이카드의 제조방법에 관한 것으로서, 더욱 구체적으로는 디스플레이를 위한 액정 표시부, IC칩, 박막 배터리 등으로 구성된 PCB와 상하 인쇄지, 상하 코팅지를 적층시켜 제조하여 작업의 효율을 최대한 높여줄 수 있도록 한 디스플레이카드 제조방법에 관한 것이다.The present invention relates to a manufacturing method of a display card, and more specifically, to manufacture a PCB consisting of a liquid crystal display unit, an IC chip, a thin film battery, and the like for the display by laminating the upper and lower printing paper, the upper and lower coated paper to maximize the work efficiency. The present invention relates to a display card manufacturing method.

일반적으로 플라스틱카드는 신용카드(credit card), 현금카드(cash card), 교통카드와 같이 현금을 대신하여 사용할 수 있을 뿐 아니라 대용량의 정보를 수록할 수 있는 집적회로 칩들이 내장된 카드는 병원의 진료카드, 각종 멤버카드 등으로 활용되는 것으로서 현대에는 다양한 용도의 플라스틱 카드들이 널리 사용된다.In general, plastic cards can be used in place of cash, such as credit cards, cash cards, and transportation cards, as well as cards with integrated circuit chips that can contain large amounts of information. As a medical card and various member cards, plastic cards of various purposes are widely used in modern times.

이중에서도 플라스틱카드에 액정 표시부가 구비되어 카드에 충전된 잔액을 사용자가 확인할 수 있어 최근에 개발되어 상용화된 플라스틱카드이다.Among them, the liquid crystal display is provided on the plastic card, so that the user can check the remaining balance of the card.

이와 같은 액정 플라스틱카드는 0.8∼0.9mm 두께를 갖는 카드의 내부에 액정 표시부, IC칩, CPU, 박막 배터리와 같은 부품들이 내장되는 것이므로 매우 정밀한 조립과정을 거쳐야 한다.Such a liquid crystal plastic card requires a very precise assembly process because components such as a liquid crystal display, an IC chip, a CPU, and a thin film battery are embedded in a card having a thickness of 0.8 to 0.9 mm.

종래에는 CNC와 같은 밀링기계를 사용하여 카드에 필요한 수납홈을 가공한 후 부품들을 수납시킬 때 접착제를 사용 접착시키고 접착제가 경화되면 표면에 인쇄시트를 접착시켜 플라스틱카드를 제조하였다.Conventionally, using a milling machine, such as a CNC machined the necessary grooves for the card after the parts are stored in the adhesive using adhesive and when the adhesive is cured to produce a plastic card by adhering the printing sheet on the surface.

그러나, 종래와 같이 CNC와 같은 밀링기계를 사용하여 수납홈을 가공하는 경우에는 작업이 까다로워 상당한 불량품이 발생되는 등의 문제점이 발생되었을 뿐 아니라 부품들을 접착시키는데 사용된 접착제의 경화시간이 길어 작업성이 현저히 저하되었으므로 결국 작업의 효율을 높여줄 수 없었다.However, when machining the receiving groove using a milling machine such as a CNC as in the prior art, not only the problem is difficult, such as a considerable defect is generated, but also the hardening time of the adhesive used to bond the components is long, This deteriorated significantly, which in turn could not increase the efficiency of the work.

본 발명은 상기한 문제점을 감안하여 창안한 것으로서, 그 목적은 디스플레이를 위한 액정 표시부, IC칩, 박막 배터리 등으로 구성된 PCB와 상하 인쇄지, 상하 코팅지를 적층시켜 제조하여 작업의 효율을 최대한 높여줄 수 있도록 한 디스플레이카드 제조방법을 제공함에 있는 것이다.The present invention has been made in view of the above problems, the object of which is to manufacture a laminated PCB and the upper and lower printing paper, the upper and lower coated paper consisting of a liquid crystal display, an IC chip, a thin film battery for display to maximize the work efficiency It is to provide a method for manufacturing a display card.

상기한 목적을 달성하기 위한 본 발명의 특징은, 합성수지시트(11)에 핫멜트(40)를 도포하는 도포단계(S10); 핫멜트(40)가 도포된 합성수지시트(11)에 액정 표시부(12), IC칩(13), CPU(14), 박막 배터리(15) 등을 전기적 결선되게 배열하는 배열단계(S20); 액정 표시부(12), IC칩(13), CPU(14), 박막 배터리(15) 등이 부착된 합성수지시트(11)를 140~170℃의 온도를 갖는 히팅롤러(50)로 열 압압하여 PCB판(10)을 형성하는 PCB구성단계(S30); 상기 단계(S30)의 PCB판(10), 상하부인쇄지(20a)(20b)를 140~170℃의 온도를 갖는 히팅롤러(50)를 통과시켜 열 압착하는 부착단계(S50)로 이루어진 디스플레이카드의 제조방법에 있어서, 상기 단계(S30)의 PCB판(10) 상하부에 핫멜트가 도포된 인쇄지(20a)(20b)를 적층시키고, 인쇄지(20a)(20b)의 상하부에 핫멜트가 도포된 상하부 코팅지(30a)(30b)를 적층시키는 적층단계(S40)를 더 포함하고, 상기 부착단계(S50)에서 순차적으로 적층된 상부코팅지(30a), 상부인쇄지(20a), PCB판(10), 하부인쇄지(20b) 및 하부코팅지(30b)를 히팅프레스(60)를 사용하여 압착함을 특징으로 하는 디스플레이카드의 제조방법에 의하여 달성될 수 있는 것이다.Features of the present invention for achieving the above object, the coating step of applying a hot melt 40 to the synthetic resin sheet (11) (S10); An arrangement step (S20) of arranging the liquid crystal display unit 12, the IC chip 13, the CPU 14, the thin film battery 15, and the like to be electrically connected to the synthetic resin sheet 11 to which the hot melt 40 is applied; The synthetic resin sheet 11 to which the liquid crystal display 12, the IC chip 13, the CPU 14, the thin film battery 15, and the like are attached is heat-pressed by a heating roller 50 having a temperature of 140 to 170 ° C. PCB configuration step of forming a plate (10) (S30); Display card consisting of the step (S50) of the step (S50) of the PCB board 10, the upper and lower printing paper (20a, 20b) of the step (S30) through the heating roller 50 having a temperature of 140 ~ 170 ℃ In the manufacturing method of, the printing paper 20a, 20b coated with the hot melt on the upper and lower PCB board 10 of the step (S30), the hot melt is applied to the upper and lower portions of the printing paper (20a, 20b) Further comprising a lamination step (S40) for laminating the upper and lower coated paper (30a) (30b), the upper coating paper (30a), the upper printing paper (20a), the PCB plate 10 sequentially stacked in the attachment step (S50) , The lower printing paper 20b and the lower coating paper 30b may be achieved by the method of manufacturing a display card, which is characterized by compressing using a heating press 60.

이상에서 상술한 바와 같은 본 발명은, 각 부품들을 점착제 부착하여 PCB판(10)을 구성하고, 상부코팅지(30a), 상부인쇄지(20a), PCB판(10), 하부인쇄지(20b) 및 하부코팅지(30b)를 140~170℃의 온도를 갖는 히팅롤러(50)로 압착하여 부착시키는 것이므로 종래와 같이 CNC와 같은 밀링기계를 사용하여 카드에 필요한 수납홈을 가공하는 기술에 비하여 수납홈의 형성이 신속 간편하게 이루어지면서도 불량률을 최소화시킬 수 있을 뿐 아니라, 각 부품들의 고정작업이 신속하게 이루어져 작업의 효율을 최대한 높여 줄 수 있는 것으로서 스마트디스플레이카드에서 액정 표시부(12)의 가공작업이 매우 간편하게 이루어져 스마트디스플레이카드의 대외 경쟁력을 최대한 높여줄 수 있는 등의 이점이 있는 것이다.According to the present invention as described above, each component is attached to the adhesive to configure the PCB plate 10, the upper coated paper (30a), the upper printing paper (20a), the PCB board 10, the lower printing paper (20b) And the lower coated paper (30b) is pressed by the heating roller 50 having a temperature of 140 ~ 170 ℃ is attached to the receiving groove compared to the technology for processing the receiving groove for the card using a milling machine, such as CNC conventionally Not only minimizes the defect rate, but also makes it possible to fix each part quickly so that the efficiency of the work can be improved as much as possible. There is an advantage such that it can be made simply to increase the external competitiveness of the smart display card as possible.

이하, 상기한 목적을 달성하기 위한 바람직한 실시예를 첨부된 도면에 의하여 상세히 설명하면 다음과 같다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 1 내지는 도 3b에서 도시한 바와 같이, 합성수지시트(11)의 표면에 핫멜트(40)를 도포하였다(S10).As shown in Figure 1 to Figure 3b, the hot melt 40 was applied to the surface of the synthetic resin sheet 11 (S10).

상기 핫멜트(40)는 핫라미네이팅용 건성 점착제를 사용하였으며, 건성 점착제의 종류는 여러 종류가 있는 것으로서 이를 한정하지는 않는다.The hot melt 40 used a dry adhesive for hot laminating, the type of dry adhesive is not limited to this as there are several types.

이어서, 핫멜트가 도포된 합성수지시트(11)에 액정 표시부(12), IC칩(13), CPU(14), 박막 배터리(15) 등을 전기적 결선되게 배열하였다(S20).Subsequently, the liquid crystal display 12, the IC chip 13, the CPU 14, the thin film battery 15, and the like were arranged on the synthetic resin sheet 11 coated with hot melt (S20).

상기 각 부품들은 디스플레이카드(1)에서 액정 표시부(12)를 디스플레이하는 필수 구성요소이고, 이러한 부품들의 조합은 이미 알려진 공지의 기술사상이므로 자세한 기능의 설명은 생략하였다.Each of the components is an essential component for displaying the liquid crystal display unit 12 in the display card 1, and a combination of these components is known in the art.

이어서 액정 표시부(12), IC칩(13), CPU(14), 박막 배터리(15) 등을 합성수지시트(11)에 견고하게 부착하기 위하여 140~170℃의 온도를 갖는 히팅롤러(50)로 열 압압하여 PCB판(10)을 형성하였다(S30).Next, in order to firmly attach the liquid crystal display unit 12, the IC chip 13, the CPU 14, the thin film battery 15 and the like to the synthetic resin sheet 11, the heating roller 50 having a temperature of 140 to 170 ° C. Thermal pressing to form a PCB board 10 (S30).

여기서 상기 히팅롤러(50) 대신에 히팅프레스(60)를 이용하여 액정 표시부(12), IC칩(13), CPU(14), 박막 배터리(15) 등을 합성수지시트(11)에 140~170℃의 온도로 열 압압하여 PCB판(10)을 형성할 수도 있는 것이다.Here, the liquid crystal display 12, the IC chip 13, the CPU 14, the thin film battery 15, and the like may be formed on the synthetic resin sheet 11 using the heating press 60 instead of the heating roller 50. It is also possible to form the PCB board 10 by thermal pressing at a temperature of ℃.

이어서, 상기 단계(S30)의 PCB판(10)의 상하부에 각각 핫멜트가 도포된 상부 인쇄지(20a)와 하부 인쇄지(20b)를 적층시키고, 상부 인쇄지(20a) 상부에 핫멜트가 도포된 상부 코팅지(30a)를 적층시키며, 하부 인쇄지(20b) 하부에 핫멜트가 도포된 하부 코팅지(30b)를 적층시켰다(S40).Subsequently, the upper printing paper 20a and the lower printing paper 20b each having hot melt applied thereto are laminated on the upper and lower portions of the PCB board 10 in step S30, and the hot melt is coated on the upper printing paper 20a. The upper coated paper 30a was laminated, and the lower coated paper 30b coated with hot melt was laminated on the lower printed paper 20b (S40).

여기서, 상기 상부 인쇄지(20a)를 PCB판(10)의 상부에 접착시킬 때 액정 표시부(12)가 위치한 부위를 펀칭하여 투시공을 형성하거나 투명창이 형성되도록 인쇄하여 접착시켜 액정 표시부(12)의 식별이 용이하게 이루어질 수 있도록 하는 것이다.Here, when the upper printing paper 20a is adhered to the upper portion of the PCB plate 10, the liquid crystal display 12 is formed by punching a portion where the liquid crystal display 12 is located to form a through-hole or by printing a transparent window to form the adhesive. The identification of the is to be made easily.

이어서, 상기 단계(S40)에서 순차적으로 적층된 상부코팅지(30a), 상부인쇄지(20a), PCB판(10), 하부인쇄지(20b) 및 하부코팅지(30b)를 140~170℃의 온도를 갖는 히팅롤러(50)를 통과시켜 열 압착시켜 디스플레이카드를 제조하였다(S50).Subsequently, the upper coated paper 30a, the upper printed paper 20a, the PCB board 10, the lower printed paper 20b, and the lower coated paper 30b sequentially stacked in the step S40 at a temperature of 140 to 170 ° C. Passed through the heating roller 50 having a thermal compression was produced a display card (S50).

여기서 히팅롤러(50) 대신에 히팅프레스(60)를 이용하여 순차적으로 적층된 상부코팅지(30a), 상부인쇄지(20a), PCB판(10), 하부인쇄지(20b) 및 하부코팅지(30b)를 140~170℃의 온도로 열 압착하여 디스플레이카드를 제조할 수도 있는 것이다.Here, the upper coated paper 30a, the upper printed paper 20a, the PCB board 10, the lower printed paper 20b, and the lower coated paper 30b sequentially stacked using the heating press 60 instead of the heating roller 50. ) Can be manufactured by thermally compressing the display card at a temperature of 140 to 170 ° C.

한편 상기 PCB판(10)의 액정 표시부(12), IC칩(13), CPU(14), 박막 배터리(15) 등을 합성수지시트(11) 대신에 상기 상부 인쇄지(20a) 하부 또는 하부 인쇄지(20b) 상부에 부착하여 구성할 수도 있는 것이다.Meanwhile, the liquid crystal display 12, the IC chip 13, the CPU 14, and the thin film battery 15 of the PCB board 10 may be printed on the lower or lower portion of the upper printing paper 20a instead of the synthetic resin sheet 11. It may be attached to the upper portion of the paper (20b).

전술한 구성으로 이루어진 본 발명은, 각 부품들을 핫멜트로 부착하여 PCB판(10)을 구성하고, 상부코팅지(30a), 상부인쇄지(20a), PCB판(10), 하부인쇄지(20b) 및 하부코팅지(30b)를 140~170℃의 온도를 갖는 히팅롤러(50)로 열 압착하여 부착시키는 것이므로 종래와 같이 CNC와 같은 밀링기계를 사용하여 카드에 필요한 수납홈을 가공하는 기술에 비하여 수납홈의 형성이 신속 간편하게 이루어지면서도 불량률을 최소화시킬 수 있을 뿐 아니라 부품들의 고정작업이 신속하게 이루어져 작업의 효율을 최대한 높여줄 수 있는 것으로서 스마트디스플레이카드에서 액정 표시부(12)의 가공작업이 매우 간편하게 이루어지는 것이다.According to the present invention having the above-described configuration, each component is attached to the hot melt to form a PCB board 10, the upper coated paper (30a), the upper printing paper (20a), the PCB plate 10, the lower printing paper (20b) And the lower coated paper 30b is thermally compressed and adhered to the heating roller 50 having a temperature of 140 to 170 ° C., so that the lower coated paper 30b is stored in comparison with a technology of processing a receiving groove required for a card using a milling machine such as CNC. Not only can the groove be quickly and easily formed, but also the failure rate can be minimized, and the fixing work of the parts can be performed quickly to maximize the work efficiency. Therefore, the processing of the liquid crystal display 12 in the smart display card is very easy. It is done.

도면중 미 설명 부호 16은 액정 표시부(12)를 온(on), 오프(off)시키는 버튼이다.In the figure, reference numeral 16 denotes a button for turning on and off the liquid crystal display 12.

이상에서는 본 발명의 바람직한 실시예에 대하여 도시하고 또한 설명하였으나, 본 발명은 상기한 실시예에 한정되지 아니하며, 청구범위에서 청구하는 본 발명의 요지를 벗어남이 없이 당해 본 발명이 속하는 분야에서 통상의 지식을 가진 자라면 누구든지 다양한 변형 실시가 가능한 것은 물론이고, 그와 같은 변경은 기재된 청구범위 내에 있게 된다.Although the preferred embodiments of the present invention have been illustrated and described above, the present invention is not limited to the above-described embodiments, and the present invention is not limited to the above-described embodiments without departing from the spirit of the present invention as claimed in the claims. Various modifications can be made by those skilled in the art, and such modifications are intended to fall within the scope of the appended claims.

도 1은 본 발명의 일실시예를 예시한 흐름도,1 is a flowchart illustrating an embodiment of the present invention;

도 2a∼2f는 본 발명의 일실시예를 예시한 디스플레이카드의 제조과정을 순차적으로 나타낸 사시도,2a to 2f are perspective views sequentially illustrating a manufacturing process of a display card illustrating one embodiment of the present invention;

도 3a, 3b는 본 발명의 다른 실시예를 예시한 디스플레이카드의 제조과정 중 히팅프레스 단계를 나타낸 사시도Figure 3a, 3b is a perspective view showing a heating press step in the manufacturing process of the display card illustrating another embodiment of the present invention

* 도면의 주요부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings

1 : 디스플레이카드 10 : PCB판1: Display Card 10: PCB Board

11 : 합성수지시트 12 : 액정 표시부11 synthetic resin sheet 12 liquid crystal display

13 : IC칩 14 : CPU13: IC chip 14: CPU

15 : 박막배터리 20a : 상부 인쇄지15: thin film battery 20a: upper printing paper

20b : 하부 인쇄지 30a : 상부 코팅지20b: lower printing paper 30a: upper coating paper

30b : 하부 코팅지 40 : 핫멜트30b: lower coated paper 40: hot melt

50 : 히팅롤러 60 : 히팅프레스50: heating roller 60: heating press

Claims (3)

삭제delete 합성수지시트(11)에 핫멜트(40)를 도포하는 도포단계(S10); 핫멜트(40)가 도포된 합성수지시트(11)에 액정 표시부(12), IC칩(13), CPU(14), 박막 배터리(15) 등을 전기적 결선되게 배열하는 배열단계(S20); 액정 표시부(12), IC칩(13), CPU(14), 박막 배터리(15) 등이 부착된 합성수지시트(11)를 140~170℃의 온도를 갖는 히팅롤러(50)로 열 압압하여 PCB판(10)을 형성하는 PCB구성단계(S30); 상기 단계(S30)의 PCB판(10), 상하부인쇄지(20a)(20b)를 140~170℃의 온도를 갖는 히팅롤러(50)를 통과시켜 열 압착하는 부착단계(S50)로 이루어진 디스플레이카드의 제조방법에 있어서,An application step (S10) of applying the hot melt 40 to the synthetic resin sheet 11; An arrangement step (S20) of arranging the liquid crystal display unit 12, the IC chip 13, the CPU 14, the thin film battery 15, and the like to be electrically connected to the synthetic resin sheet 11 to which the hot melt 40 is applied; The synthetic resin sheet 11 to which the liquid crystal display 12, the IC chip 13, the CPU 14, the thin film battery 15, and the like are attached is heat-pressed by a heating roller 50 having a temperature of 140 to 170 ° C. PCB configuration step of forming a plate (10) (S30); Display card consisting of the step (S50) of the step (S50) of the PCB board 10, the upper and lower printing paper (20a, 20b) of the step (S30) through the heating roller 50 having a temperature of 140 ~ 170 ℃ In the manufacturing method of 상기 단계(S30)의 PCB판(10) 상하부에 핫멜트가 도포된 인쇄지(20a)(20b)를 적층시키고, 인쇄지(20a)(20b)의 상하부에 핫멜트가 도포된 상하부 코팅지(30a)(30b)를 적층시키는 적층단계(S40)를 더 포함하고, 상기 부착단계(S50)에서 순차적으로 적층된 상부코팅지(30a), 상부인쇄지(20a), PCB판(10), 하부인쇄지(20b) 및 하부코팅지(30b)를 히팅프레스(60)를 사용하여 압착함을 특징으로 하는 디스플레이카드의 제조방법.Laminating printing paper 20a, 20b coated with hot melt on the upper and lower portions of the PCB board 10 in step S30, and upper and lower coated paper 30a having hot melt applied on the upper and lower portions of the printing paper 20a, 20b ( 30b) further includes a lamination step (S40) for laminating, and the upper coated paper 30a, the upper print paper 20a, the PCB board 10, and the lower print paper 20b sequentially stacked in the attaching step (S50). ) And the lower coated paper (30b) is pressed using a heating press (60). 삭제delete
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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100814498B1 (en) * 2007-05-30 2008-03-18 주식회사 제이디씨텍 The manufacturing method of metal sticker accessories smart card and metal sticker accessories smart cards thereby
KR20080027120A (en) * 2006-09-22 2008-03-26 소프트픽셀(주) Electronic card and method for fabricating thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080027120A (en) * 2006-09-22 2008-03-26 소프트픽셀(주) Electronic card and method for fabricating thereof
KR100814498B1 (en) * 2007-05-30 2008-03-18 주식회사 제이디씨텍 The manufacturing method of metal sticker accessories smart card and metal sticker accessories smart cards thereby

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