KR101173784B1 - Method for manufacturing combicard - Google Patents

Abstract

The present invention includes forming a hole for connecting a chip on board (COB) and an antenna connection part to a transparent sheet, and placing an antenna on the sheet to expose the antenna connection part through the hole to form an inlay layer. And electrically connecting the antenna connection part exposed through the hole and the terminal of the COB, applying UV resin to one surface of the inlay layer or the bottom of the upper surface printing paper to which the COB is connected, the inlay layer. Attaching the upper surface printing paper to one surface of the sheet, irradiating ultraviolet rays to pass through the inlay layer, curing the UV resin, and bonding the lower surface printing paper to the other surface of the inlay layer, wherein the upper surface printing paper includes: The present invention relates to a combination card manufacturing method, characterized in that the first perforations are formed to expose the COB to the outside, the present invention According to an effect that prevents the dimple phenomenon it is faster and easier to be able to manufacture the combination of the card improves the reliability and productivity.

Description

Combi card manufacturing method {METHOD FOR MANUFACTURING COMBICARD}

The present invention relates to a method of manufacturing a combination IC card.

In general, an IC card may be defined as a card having an IC chip (Intergrated Circuit Chip) having the ability to process a specific transaction by having a microprocessor, a card operating system, a security module, and a memory. The application field of the IC card has been widely applied in various fields such as communication, finance, transportation, and electronic commerce.

These IC cards can be classified in various ways according to their classification criteria, but can be classified into contact cards, contactless cards, and contact / contactless cards according to the way data is read from the card. Among the cards that are currently being distributed in the mainstream of the electronic money market, the dual-use cards are, in particular, a combined dual-use card in which a part of a physical contact / contactless card can be shared in one card. CombiCard is mainly distributed.

The configuration of the combination card is shown in a sectional view of FIG. 1A and a plan view of FIG. 1B. As shown in the combination card, a resin inlay layer 10 (Inlay) is inserted between the backside printing paper 40 printed with the back shape of the card and the frontside printing paper 20 with the front shape of the card inserted therein. An antenna coil 14 is inserted in the inlay layer, and both terminals 15 and 15 'of the antenna coil 14 are connected to the input / output terminals 17 and 17' of the IC chip 22 and a conductive adhesive. 23, and the input / output terminals 17 and 17 'of the IC chip 22 and the terminals 15 and 15' of the antenna coil 14 are kept electrically conductive. In addition, transparent overlay layers 30 and 50 are attached to surfaces of the backside printing paper 40 and the frontside printing paper 20. COB (Chip on Board, 16) is a form in which the IC chip 22 is attached to the base film 21, as shown in Figure 1a Combi card is milled to mount the COB.

In the manufacturing process of the combination card having the above-described configuration and operation, the process occupying a substantial portion of the overall process is the contact between the input and output terminals 17, 17 'of the IC chip 22 and the antenna coil 14 As a process of bringing (15,15 ') into contact with each other, the method of adhering them using a conductive adhesive has been widely used. By the way, the combination card manufactured by the above method has the following problems.

First, due to the non-development of a conductive adhesive for a card (conductive glue), the adhesive used in a general PCB circuit has a problem in that drying conditions, conductivity, adhesive strength, etc., do not meet the required levels of use of the card. As the material of the card does not meet the curing conditions of the adhesive, the adhesive strength is reduced after the IC chip is attached, and there is a problem that the contact point of the IC chip and the antenna coil is short-circuited due to physical stress. There was also a problem of detachment from the surface.

In order to solve this problem, there is a method to prevent short circuit by soldering the contact point of IC chip and antenna coil by hand, but this method must be done by hand, so productivity is very low and production cost also increases. there was.

Second, there is a problem that the RF function of the combination card is degraded. This is because there is no conductive adhesive dedicated to the card as described above, the resistance component generated while connecting the contact interferes with the natural frequency of the combination card has a problem that the RF function of the card is degraded.

It was developed in order to solve the above problem is shown in Figure 2 as a method of directly bonding the antenna coil terminal and IC chip terminal. However, such a method also includes the front overlay layer 30, the front print paper 20, and the inlay layer 10 in the process of thermally compressing the front overlay layer 30, the front print paper 20, and the inlay layer 10. Thermal deformation occurs in the grooves 1 and the holes 2 already formed in each of the grooves 1 and holes 2, so that the size and shape of the grooves 1 and the holes 2 are often changed, so that COB cannot be mounted. In addition, it is difficult to align the sheets in the process of bonding a plurality of sheets at the same time, such as the front overlay layer 30, the front printing paper 20 and the inlay layer 10, the back printing paper 40 and the back overlay layer 50 at the same time Afterwards, there was a problem that a dimple phenomenon occurs in which the position of the sheet is changed or the card surface is wrinkled due to thermal deformation.

The present invention has been made to solve the above problems, and can be manufactured by an automated system rather than manual, while preventing the short circuit of the contact point of the IC chip and the antenna coil, dimple phenomenon due to thermal deformation It is an object of the present invention to provide a method for manufacturing a combination card that can be prevented.

In order to solve the above problems, the present invention,

(1) forming a hole for connecting a chip on board (COB) and an antenna connection to a transparent sheet; Placing an antenna on the sheet to expose the antenna connection through the hole to form an inlay layer; Electrically connecting the antenna connection part exposed through the hole and a terminal of the COB; Applying a UV resin to one surface of the inlay layer or the bottom of the upper surface printing paper to which the COB is connected; Attaching the top printing paper to one surface of the inlay layer; Irradiating ultraviolet rays to pass through the inlay layer to cure the UV resin to impart adhesion between the inlay layer and the top printing paper; And bonding a lower surface printing paper to the other surface of the inlay layer, wherein the upper printing paper has a first perforation part formed to expose the COB to the outside.

(2) the method according to (1), further comprising the step of bonding a transparent coating layer to the top printing paper and the bottom printing paper; the coating layer attached to the top printing paper to the second to expose the COB to the outside It provides a combination card manufacturing method characterized in that the perforated portion is formed.

(3) The method of (1), wherein the bonding of the lower surface printing paper, the step of applying the UV resin on the other surface of the inlay layer or the lower surface of the lower surface printing paper; Attaching the lower surface printing paper to the other surface of the inlay layer; And irradiating ultraviolet rays through the lower surface printing paper to cure the UV resin, wherein the lower surface printing paper is formed of a material capable of transmitting ultraviolet rays.

(4) The combination of (1), wherein the bonding of the lower surface printing paper is performed by applying an adhesive between the inlay layer and the lower surface printing paper, or attaching a hot melt sheet and laminating by applying heat and pressure. It provides a card manufacturing method.

(5) In the step (2), the step of bonding the coating layer, the upper surface printing paper or the lower surface printing paper by applying a UV resin and attaching the coating layer is characterized in that the UV resin is cured by irradiating UV light It provides a combination card manufacturing method.

(6) The method of the above (1), wherein the hole is provided using a milling machine or a punching machine provides a combination card manufacturing method.

According to the present invention can be manufactured by an automated system, not by hand, by using a UV resin can quickly and easily manufacture a combi card to improve the productivity, to prevent short circuit of the contact even in the physical impact or bending, Dimples do not occur due to heat deformation, thereby improving reliability.

1 is a view showing the configuration of a conventional combination card,
2 is a view showing a manufacturing a combination card by a conventional welding process,
3 is a flow chart showing the flow of the combination card manufacturing method according to the present invention,
4 is a top and bottom perspective view and side cross-sectional view of a chip on board (COB),
5 is a perspective view showing one embodiment of a hole formed in a transparent sheet,
6 is a perspective view showing an inlay layer formed by arranging an antenna on a sheet;
7 is a view showing electrically connecting the connecting portion of the antenna and the COB,
8 is a view showing bonding the top printing paper by applying and curing the UV resin,
9 is a view showing bonding to the lower surface printing paper by coating and curing the UV resin,
10 is a view showing bonding of the coating layer on the outside of the upper and lower printing paper.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and like reference numerals designate like parts throughout the specification.

3 is a flow chart showing the flow of the combination card manufacturing method according to the present invention.

As shown in FIG. 3, the method of manufacturing a combination card according to the present invention includes a hole 110 for connecting a COB (chip on board) 200 and an antenna connector 121 to a transparent sheet 100. Forming step (S10), forming an inlay layer 130 by placing the antenna 120 on the sheet 100 so that the antenna connection portion 121 is exposed through the hole 110 (S20), Electrically connecting the antenna connection part 121 exposed through the hole 110 and the terminal 210 of the COB 200 (S30), and the inlay layer 130 to which the COB 200 is connected. Applying the UV resin 300 to one side or the bottom of the top printing paper 400 (S40), the step of attaching the top printing paper 400 on one surface of the inlay layer (S50), the inlay Irradiating ultraviolet rays to pass through the layer 130 to cure the UV resin 300 (S60), bonding the lower surface printing paper 500 to the other surface of the inlay layer 130 (S70), and Bonding the transparent coating layer 600 to the top printing paper 400 and the bottom printing paper 500 may be configured (S80).

First, a hole 110 for connecting the COB 200 and the antenna connection part 121 is formed in a transparent sheet 100 (S10).

In the sheet 100, the hole 110 may be formed to allow the molding part 220 of the COB 200 to pass therethrough, and the antenna 120 and the COB 200 may be formed through the hole 110. It must be formed so that it can be electrically connected.

In the COB 200, as illustrated in FIG. 4, a chip 240 in a wafer state is disposed on the main board 230, and a molding part 220 is formed thereon. The molding part 220 does not necessarily mean molding, but is used to include anything for protecting the chip 240 including potting. Among the COBs 200, the COB 200 used in the combination card has two terminals 210 connected to the antenna 120 on the main board 230, and the opposite side of the main board 230 is formed. It becomes the electrode surface 250 for external terminals.

The hole 110 may be formed in various shapes, and FIG. 5 is a diagram illustrating an embodiment of the hole 110. As shown in FIG. 5, in order to mount the molding unit 220 of the COB 200 to the sheet 100, the sheet 100 is deleted in a square shape with a size corresponding to the molding unit 220, and a part of both sides thereof is removed. By further eliminating the semicircle to form the hole 110, a space for connecting the connecting portion 121 of the antenna 120 and the terminal 210 of the COB 200 may be secured.

The hole 110 may be formed quickly and precisely by performing a process of deleting the sheet 100 using a milling or punching machine.

Next, as shown in FIG. 6, the antenna 120 is formed in the transparent sheet 100, and the connection portion 121 of the antenna 120 is disposed to be exposed to the outside through the hole 110. A layer 130 is formed (S20).

Next, the antenna connection part 121 exposed through the hole 110 and the terminal 210 of the COB 200 are electrically connected (S30).

FIG. 7 is a diagram illustrating the electrical connection between the connecting portion 121 of the antenna 120 and the terminal 210 of the COB 200.

FIG. 7A illustrates a perspective view before connecting the COB 200 and the antenna 120 to electrically connect the inlay layer 130 and the COB 200 in an inverted state. In order to connect the antenna 120 of the COB 200 and the inlay layer 130 in a normal state without upside down, the lower part of the COB 200 is obscured by the electrode surface 250 of the COB 200. This is because soldering is difficult.

Therefore, as shown in FIG. 7B, the inlay layer 130 and the COB 200 are turned upside down, and the connection part 121 of the antenna 120 and the terminal of the COB 200 are moved through an automated process from the top. It is preferable to electrically connect the contact R of 210 with solder, a conductive adhesive, or the like. When this connection is made, since the junction between the antenna connection 121 and the terminal 210 of the COB 200 is made strong at one point (R), the breakdown rate of the contact point (R) can be drastically reduced even under bending or physical stress. have.

Next, as shown in FIG. 8, the UV resin 300 is applied to one surface of the inlay layer 130 to which the COB 200 is connected or to the bottom of the top printing paper 400 (S40). At this time, the inlay layer 130 may work even when the inverted state, but in this case, since the coated UV resin 300 may flow down, the inlay layer 130 may be flipped again to recover the original state as shown in FIG. 8. It is preferable.

The UV resin 300 has a vinyl group in the resin molecular structure, that is, an unsaturated group such as C = C. When light (ultraviolet) is received, the photoinitiator is activated to crosslink and polymerize (Gel) through an initiation reaction of free radicals. It means resin which raises and hardens.

When the inlay layer 130 and the printing layer are bonded by using the curing property of the UV resin 300 as described above, productivity is improved as compared to a method of applying an adhesive or the like and laminating with heat and pressure. That is, since the UV resin 300 can be cured within a few seconds, productivity is higher than that of the conventional method requiring several minutes to several hours, and since the UV resin 300 can work at a low temperature, there is less fear of deformation due to high temperature and high pressure. In addition, since high temperature thermal energy is not required, energy efficiency is improved, and environmental pollution problems caused by volatilization of the adhesive at a high temperature are not generated.

When the UV resin 300 is applied to one surface of the inlay layer 130 to which the COB 200 is connected, the UV resin 300 is not applied to the electrode surface 250 for the external terminal of the COB 200. Be careful. This is because when the UV resin 300 is buried on the electrode surface 250, contact failure may occur when contacting the external terminal.

It is also possible to apply the UV resin 300 to the bottom of the top printing paper 400 instead of the inlay layer 130, wherein the top printing paper 400, the first perforated part to expose the COB (200) to the outside 410 should be formed. That is, even in this case, the electrode surface 250 of the COB 200 is not covered by the upper surface printing paper 400 and should be exposed to the outside, so that the upper surface printing paper 400 is previously corresponded to the electrode surface 250. It is punched to form a first punched portion 410.

After the UV resin 300 is applied as described above, the inlay layer 130 and the top printing paper 400 are attached to each other (S50). At this time, it is preferable to remove bubbles or the like present in the UV resin 300 by pressing the inlay layer 130 and the upper surface printing paper 400 attached using a roller or the like up and down.

Meanwhile, in order for the electrode surface 250 of the COB 200 to be exposed to the outside through the first punching portion 410 of the upper surface printing paper 400, the size of the first punching portion 410 may be fine. Since it can only be formed larger than the electrode surface 250 of the) is a small empty space (V) is created. In this case, in the case of lamination by applying heat and pressure, a dimple phenomenon occurs in which the printing paper is wrinkled by penetrating or deforming the empty space (V).

However, in the case of the present invention, as shown in FIG. 8, when the inlay layer 130 and the top printing paper 400 are attached, the UV resin 300 fills this empty space V, and then UV As the resin 300 is cured, dimples of wrinkles due to deformation of printing paper are prevented.

The upper surface of the printing paper 400 is bonded by curing the applied UV resin 300 by irradiating ultraviolet rays using a UV lamp or the like under the transparent inlay layer 130 (S60).

Subsequently, as shown in FIG. 9, the lower surface printing paper 500 is bonded to the other surface of the inlay layer 130 (S70).

As a method of bonding the lower surface printing paper 500 to the other surface of the inlay layer 130, the method of using the UV resin 300 as in the case of the upper surface printing paper 400 and the method of laminating by thermal compression as in the past have.

The method using the UV resin 300 is a step of applying the UV resin 300 on the other surface of the inlay layer 130 or the bottom surface of the lower surface printing paper 500, the lower surface printing paper on the other surface of the inlay layer 130 Attaching the 500 and irradiating ultraviolet rays through the lower surface printing paper 500 may be configured to cure the UV resin 300, wherein the lower surface printing paper 500 can transmit ultraviolet rays. It must be formed of a material that is present. Unlike the case of the upper surface printing paper 400 which could irradiate ultraviolet rays through the transparent inlay layer 130, the upper surface of the inlay layer 130 is already covered with the upper surface printing paper 400 in the case of the lower surface printing paper 500. This is because ultraviolet light must be irradiated from the lower surface of the lower surface printing paper 500, and thus the ultraviolet light must pass through the lower surface printing paper 500.

On the other hand, in the case of the lower surface printing paper 500 may be bonded by using a conventional lamination method. That is, the UV resin 300 fills the empty space (V) in the step of bonding the upper surface printing paper 400, and since the UV resin 300 is cured through ultraviolet irradiation, the components are firmly fixed. This is because the dimple phenomenon does not occur even when the lower surface printing paper 500 is bonded by using the lamination method by thermal compression.

Next, as shown in FIG. 10, the transparent coating layer 600 is bonded to the outer side of the top printing paper 400 and the bottom printing paper 500 (S80).

At this time, the second perforated part 610 is formed in the coating layer 600 attached to the upper surface printing paper 400 to expose the electrode surface 250 of the COB 200 to the outside.

The coating layer 600 may be adhered using various conventional methods such as a lamination method. However, since the coating layer 600 is transparent, the UV resin 300 may be coated and irradiated with UV rays to harden the coating layer 600, thereby allowing a faster and simpler bonding.

100: sheet 110: hole
120: antenna 121: antenna connection
130: inlay layer 200: COB
300: UV resin 400: top printing paper
410: first hole 500: lower surface printing paper
600: coating layer 610: second hole

Claims (6)

Forming a hole for connecting a chip on board (COB) and an antenna connection to the transparent sheet;
Placing an antenna on the sheet to expose the antenna connection through the hole to form an inlay layer;
Electrically connecting the antenna connection part exposed through the hole and a terminal of the COB;
Applying a UV resin to one surface of the inlay layer or the bottom of the upper surface printing paper to which the COB is connected;
Attaching the top printing paper to one surface of the inlay layer;
Irradiating ultraviolet rays to pass through the inlay layer to cure the UV resin to impart adhesion between the inlay layer and the top printing paper; And
Bonding the lower surface printing paper to the other surface of the inlay layer;
Combination card manufacturing method characterized in that the upper printing paper is formed with a first perforated portion to expose the COB to the outside.
The method of claim 1,
Bonding a transparent coating layer to the top printing paper and the bottom printing paper;
Combi card manufacturing method characterized in that the coating layer attached to the top printing paper is formed with a second perforation portion to expose the COB to the outside.
The method of claim 1,
Bonding the lower surface printing paper,
Applying UV resin to the bottom surface of the other surface or the bottom surface of the inlay layer;
Attaching the lower surface printing paper to the other surface of the inlay layer; And
And irradiating ultraviolet rays through the lower surface printing paper to cure the UV resin.
Combination card manufacturing method characterized in that the lower surface printing paper is formed of a material capable of transmitting ultraviolet rays.
The method of claim 1,
Bonding the lower surface printing paper,
Combination card manufacturing method characterized in that the adhesive is applied between the inlay layer and the lower surface printing paper or a hot melt sheet is attached and applied by heat and pressure.
The method of claim 2,
Bonding the coating layer,
Combination card manufacturing method characterized in that the UV resin is applied to the upper surface printing paper or the lower surface printing paper and the coating layer is attached and then irradiated with ultraviolet rays to cure the UV resin.
The method of claim 1,
Combination card manufacturing method characterized in that the hole is formed using a milling machine or a punching machine.

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