KR20040049981A - Method for Manufacturing IC Card by Laminating a Plurality of Foils - Google Patents

Abstract

PURPOSE: A method for manufacturing an IC card by layering foils is provided to remove a step for digging out a groove again after layering the foils, firmly join the COB(Chip On Board) and a card plate, occur no gap between the COB and the card plate, and firmly join an electrode of the COB and an antenna. CONSTITUTION: The COB(200) is placed by facing an electrode surface of a terminal in the COB downwardly. At least more than two foils(300,400,500) having a hole(301) of the same area as the COB are layered by inserting the COB into the hole. A back side cover foil(600) having no hole is layered to an opposite side of the surface exposing the electrode surface of the terminal in the COB of the layered foils, and the foils are compressed.

Description

IC card manufacturing method by laminating foil {Method for Manufacturing IC Card by Laminating a Plurality of Foils}

Field of invention

The present invention relates to an IC card. More specifically, the present invention relates to an IC card in which at least two or more foils having a hole corresponding to a COB are stacked and pressed together.

Background of the Invention

Cards equipped with data and programs required for COBs, that is, IC cards, are being used in more and more fields because of their convenience and excellent information holding ability. Such an IC card generally includes a contact type IC card in which information is input and output by contacting a terminal for a card reader with an electrode, a contactless IC card having an antenna therein and capable of entering and exiting information without contacting the card reader terminal; It is divided into a combination type IC card capable of both the contact and contactless cards.

In the conventional method of manufacturing such an IC card, as shown in FIG. 1, a plurality of foils (also called sheets) are stacked to form a card, and then a COB (Chip On Board) 200 is formed. An appropriately sized groove 800 is excavated through a milling process so that it can be mounted, the COB 200 is inserted into the groove 800, and finally covered with at least one cover foil. In such a process, a process of digging a groove 800 for the COB 200 is required in a card base in which a plurality of foils are stacked to form a single end, thereby substantially working in duplicate. In particular, in the manufacture of a combination type IC card, after inserting the COB into the groove with the electrode terminal for contact terminals exposed to the outside, the antenna winding the antenna electrode and the conductive wire of the COB in a constant shape As the electrical connection was required, it was not at all inconvenient for the operator to connect both ends of the antenna and the antenna electrode of the COB without being visible from above. That is, while the end of the antenna is exposed inside the groove, the COB is inserted into the groove with the molding part facing downward, and the antenna electrodes formed on the main board of the COB should be electrically connected to both ends of the antenna. In this case, the COB is positioned between the operator's eyes and the groove, that is, the antenna connection, to obscure the operator's field of view. Accordingly, conventionally, a conductive paste (adhesive) is applied to both ends of the antenna exposed inside the groove and the COB is inserted and then compressed, or a hot melt sheet is attached and the COB is inserted. It was bonded by heat pressing.

However, through this type of adhesion, the electrical connection between the antenna connection portion and the COB electrode is not satisfactory, which may cause a problem that, as the IC card is used for a long time, the electrical connection may be broken or the COB itself may be detached from the card. . In addition, in order to insert the COB into the grooves formed in the laminated foil, the area of the grooves must be structurally slightly larger than the area of the COB, so that a gap between the COB and the grooves is formed in the completed IC card. It exists. Due to this gap, there is a possibility of penetration of moisture, and in the case where the card is bent, the COB can be released from the card plate through the gap portion.

It is an object of the present invention to provide a method of manufacturing an IC card which does not have to be dug again after laminating foils.

An object of the present invention is to provide an IC card manufacturing method in which a COB and a card plate can be strongly bound.

An object of the present invention is to provide an IC card manufacturing method in which a gap does not occur between a COB and a card plate.

Still another object of the present invention is to provide a method of manufacturing an IC card in which an electrode of an COB and an antenna electrode can be strongly bound.

The above and other objects of the present invention can be achieved by the present invention described below.

1 is a configuration diagram showing a manufacturing process of a conventional IC card.

FIG. 2 (A) is a perspective view showing one specific example of the manufacturing process of the IC card according to the present invention, and FIG. 2 (B) is a sectional view thereof.

FIG. 3 (A) is a perspective view showing another specific example of the manufacturing process of the IC card according to the present invention, and FIG. 3 (B) is a sectional view thereof.

4 (A) and 4 (B) are plan views showing one specific example of the second hole formed in the antenna sheet, respectively.

Brief description of the main symbols in the drawings

100: IC card 200: COB (Chip On Board)

210: main board 211: electrode surface for contact terminals

212: antenna electrode 220: molding part

300: front cover foil 301: first hole

400: antenna foil 401: second hole

402: center portion 403: outer protrusion

404: inner projection 405: side hole

410: winding antenna 411: antenna connection

500: core foil 501: third hole

600: backside cover foil

700: hot melt sheet

710: sheet hole 720: center hole

800: home

Summary of the Invention

A first feature of the IC card manufacturing method according to the present invention is that it does not include the step of digging a laminated foil. To this end, one or more foils having holes of a size corresponding to the COB are laminated and pressed. Specifically, the COB is positioned so that the electrode surface for the terminal of the COB faces downward, and laminated with at least two or more foils having holes of substantially the same area as the COB so that the COB fits into the holes, Laminating foils having no holes, and pressing the laminated foils.

A second feature of the IC card manufacturing method according to the present invention is that the electrical connection between the antenna and the COB electrode is easy, and additional adhesives are simple to use. That is, the antenna electrode of the antenna foil and the antenna electrode of the COB are connected while the antenna electrode of the COB is located upward. Specifically, the COB is positioned such that the electrode surface for the contact terminal of the COB is facing downwards, and at least one foil having a first hole having an area substantially the same as the mainboard of the COB causes the electrode portion of the COB to be positioned. And the antenna foil having a second hole and an antenna formed at a point corresponding to the position of the first hole so that the second hole is inserted into the molding portion of the COB. Laminated on the foil and electrically connecting both ends of the antenna to the antenna electrode of the COB, and the foil having no hole is formed on the surface of the laminated foil in which the electrode surface of the terminal of the COB is exposed to the outside. Laminating on the opposite side and compressing the laminated foils, at least through the second hole the molding of the COB and the antenna electrode Make sure it's exposed up.

Detailed Description of the Invention

Hereinafter, with reference to the accompanying drawings will be described a preferred embodiment according to the present invention.

FIG. 2 (A) is a perspective view showing one specific example of the manufacturing process of the IC card according to the present invention, and FIG. 2 (B) is a sectional view thereof. The IC card 100 according to the present invention is formed by stacking a plurality of foils. First, a substantially flat working plate (not shown) is laid on the floor and the COB 200 is placed on the working plate. The working plate is preferably a metal plate having a constant thickness, which will be described later, which is advantageous in that it is easy to press and apply heat to the working plate. The COB 200 is generally used, and a chip in a wafer state is disposed on the main board 210, and a molding part 220 is formed thereon. The molding part 220 does not necessarily mean molding, but is used to include anything for protecting the chip, including potting. Of these COB 200, the COB 200 used in the contact card is the lower side of the main board 210, that is, the opposite side on which the molding unit 220 is formed is the electrode surface 211 for the external terminal, the combination The COB 200 used in the card for the combi has two antenna electrodes 212 formed on the main board 210 to be connected to the antenna wire 410, and the lower surface of the main board 210 is similarly formed. It becomes an electrode surface 211 for an external terminal. When the COB 200 is placed on the working plate, the terminal electrode surface 211 of the COB 200 faces the working plate, and thus the molding part 220 is visible from above. Hereinafter, a method of manufacturing a combination type IC card will be described first.

The lower surface of the sheet formed on both sides of the hot melt double-sided sheet 700, that is, the adhesive material to be melted and bonded when heat is applied to the portions except the molding part 220 and the antenna electrode 212 of the COB 200, The upper surface is bonded to the core foil 500 which will be described later. Preferably, an oil paper is formed on the upper surface of the hot melt double-sided sheet 700 so that the oil paper is easily detached and adhered to the core foil 500. The hot melt sheet 700 is not larger than the outermost edge portion of the COB 200, that is, the main board 210 portion, preferably the outermost edge of the hot melt sheet 700 is the main board ( By substantially coinciding with the outermost rim of 210, the portion bonded to the core foil 500 is as wide as possible. Preferably, the antenna connection part 411 and the antenna to be described below are formed by forming a sheet hole 710 or a? -Shaped groove in a portion where the hot melt sheet 700 contacts the antenna electrode 212. The electrode 212 may be electrically connected by ultrasonic welding, adhesion through a conductive adhesive, and soldering, and the center portion of the hot melt sheet 700 may be substantially connected to the area of the molding part 220. A central hole 720 of the same size is formed.

After placing the COB 200 bonded to one surface of the hot melt sheet 700 on the work plate, the first hole 301 having substantially the same size as the main board 210 of the COB 200 is formed. The front cover foil 300 having the cover is placed on the working plate such that the first hole 301 is inserted into the main board 210. At this time, it is preferable that the first hole 301 and the main board 210, that is, the outermost edge portion of the COB 200 be closer to each other, to match the size of the hole. The front cover foil 300 is for protecting the IC card 100 according to the present invention from moisture and the like, and is preferably a transparent coating film. As will be described below, the step of covering the front cover foil 300 may be omitted as necessary.

After the front cover foil 300 is laid, the antenna foil 400 having the antenna 410 is stacked on the front cover foil 300. In this case, a second hole 401 is formed in the antenna foil 400, and the size of the second hole 401 is that the molding part 220 and the antenna electrode 212 of the COB 200 are formed from above. When you see it, you can expose it. In this case, the second hole 401 may be formed in the same manner as the first hole 301, and it is important to expose the molding part 200 and the antenna electrode 212 even when the second hole 401 is formed in various shapes. . Although the antenna connection part 411 is formed in the shape of ?? in this figure, the present invention is not limited thereto, and the second hole 401 may be formed such that a portion corresponding to the antenna end portion corresponds to the antenna electrode 212. It is important to form so as to project properly into the interior. However, the technical configuration related to the connection between the antenna connection portion and the antenna electrode is a technology that can be easily implemented by those skilled in the art. Preferably, the stacking thickness of the front cover foil 300 and the antenna foil 400 is equal to the thickness of the main board 210 of the COB 200. The antenna foil 400 may be laminated after forming the antenna 410 in advance, or may form the antenna 410 after laminating a foil in which the antenna 401 is not formed. Unless otherwise described, the antenna foil 400 is interpreted to include both of the above two cases.

After laminating the antenna foil 400, the oil paper attached to the top surface of the hot melt sheet 700 may be peeled off (the oil paper may be peeled off before or after laminating the front core foil). It is necessary to electrically connect the antenna connecting portion 411 and the antenna electrode 212 of the COB 200. At this time, it is preferable to perform strong bonding using ultrasonic welding, soldering, conductive adhesive, etc., but if necessary, a portion of the end of the antenna 411 which does not contact the antenna electrode 212 is hot melted. It may be sufficient by adhering to the top surface of the sheet 700.

After electrically connecting the antenna connecting portion 411 and the antenna electrode 212 of the COB 200, the core foil 500 is stacked thereon. A third hole 5010 is formed in the core foil 500 so that the molding part 220 of the COB 200 can be inserted in. Preferably, the third hole 501 is formed with the molding part 220. By substantially the same area and the thickness of the core foil 500 and the molding portion 220 is the same, the thickness of the front cover foil 300 and the antenna foil 400 laminated the COB (200) In the case where the thickness of the main board 210 is equal to the thickness of the main board 210, there is little play between the COB 200, the front cover foil 300, the antenna foil 400, and the core foil 500.

After stacking the core foil 500, the back side cover foil 600 is stacked thereon. The back side cover foil 600 plays substantially the same role as the front cover foil 300, and is preferably a transparent coating film. In general, the IC card is printed on the surface of the card for the purpose of notifying the user or other advertising, etc., in the case of the IC card according to the present invention the bottom surface of the antenna foil 400 or the core Printing is performed on the top surface of the foil 500, and the portions printed by the cover foils 300 and 600 may be protected.

After laminating | stacking the back side cover foil 600, the other working board (substantially flat metal plate) is put on it, and both said working boards are crimped | bonded. At this time, by heating the working plate at a constant temperature to ensure that the plurality of foils are pressed well to each other, and also the top surface of the hot melt sheet 700 can be adhered to the core foil 500 well. The hot melt sheet 700 also serves to minimize the clearance between the third hole 501 formed in the core foil 500 and the first and second holes 301 and 401.

In the above description, when the IC card according to the present invention is implemented in a combination type, the front cover foil 300, the antenna foil 400, the core foil 500, and the back side cover foil 600 are described as being stacked. In addition, the front cover foil 300 or the back side cover foil 600 may be omitted, and further foils may be inserted between the foils, and various numbers of foils may be stacked according to a user's needs. Can be. The material of the foil may be variously used as needed in the field of the present invention.

Hereinafter, a case in which the IC card according to the present invention is implemented as a contact card will be described. In the case of the contact card, the COB 200 does not have the antenna electrode 212 as described above, and thus the antenna 410 is not formed in the antenna foil 400. In the case of using a hot melt sheet, the sheet hole 710 for the antenna electrode 212 is not formed. Other than that is substantially the same as the manufacturing method of the combination type IC card mentioned above. That is, the COB 200 is placed on the working plate, and the front core foil 300 having the first hole 301 is laid thereon, and the second hole 401 is formed thereon and the antenna is not formed instead. Foil 400 is laminated. The size of the second hole 401 is preferably larger than that of the molding part 220, and more preferably, is substantially the same as the size of the first hole 301. Thereafter, the core foil 500 having the third hole 501 corresponding to the molding part 220 is laminated, and finally the back side cover foil 600 is laminated.

In addition, in the above, the COB 200 was first placed on the working plate, and after that, the front cover foil 300 and the antenna foil 400 were stacked, but the front cover foil 300 and the antenna foil 400 were The COB 200 may be inserted into the holes 301 and 401 after first stacking the first hole 301 and the second hole 401 properly. In this case, when the antenna foil 400 is stacked on the front cover foil 300, the COB 200 may be inserted after flipping the stacked foils 300 and 400. The other procedure is substantially the same as the method for manufacturing the combination type and contact IC card described above.

FIG. 3 (A) is a perspective view showing another specific example of the manufacturing process of the IC card according to the present invention, and FIG. 3 (B) is a sectional view thereof. In the manufacturing method of the IC card according to FIG. 3, the step of applying the hot melt sheet 700 is changed, unlike in FIG. 2, the lower surface of the hot melt sheet 700 directly adheres to the COB 200. Instead of stacking the front cover foil 300 and the antenna foil 400 on the COB 200, the top surface of the COB 200 may be formed through the second hole 401 of the antenna foil 400. To bond. In this case, the hot melt sheet 700 still needs a center hole 720 for exposing the molding part 220, but a sheet hole 710 for exposing the antenna electrode 212 needs to be formed. There is no. That is, while stacking the antenna foil 400, the operator can electrically connect the antenna connecting portion 411 and the antenna electrode 212 of the COB 200 while securing a sufficient field of view. The hot melt sheet 9700 is adhered thereon. Accordingly, the hot melt sheet 700 may be larger than the second hole 401, and the core sheet 500 may be formed by using the hot melt sheet 700 having a larger area than the second hole 401. It can increase the adhesion with the. In the case where the hot melt sheet 700 is bonded after laminating the antenna coil 400 in this manner, it is preferable that the second hole has the form shown in FIG. 4 (B) as described below. .

4 (A) and 4 (B) are plan views showing one specific example of the second hole formed in the antenna sheet, respectively. In the antenna foil 400 of the combination IC card according to the present invention, a second hole 401 is formed, and the second hole 401 is formed by the connection portion 411 of the antenna winding 410 and the COB 200. Preferably, the antenna electrode 212 is formed to be visible to the operator, that is, from above. Accordingly, in the second hole 401, as shown in FIG. 4 (A) (in the figure, the inside of the closed curve portion is a hole and the outside thereof is an antenna foil), and the COB 200 A central portion 402 having a size greater than or equal to the area of the molding portion is formed so that the molding portion 220 may be exposed from above, and both sides of the central portion 402 so that the antenna electrode 212 may be exposed from above. Outwardly projecting outward projections (403) are formed in each. The connecting portion 411 of the antenna winding 410 is formed to cross the outer protrusion 403, the operator is the antenna electrode positioned below and the antenna connecting portion 411 through the hole of the outer protrusion 403. 212 is electrically connected. For reference, the surface on which the antenna winding 410 is formed is directed downward on both sides of the antenna foil 400, in other words, the surface on which the antenna winding 410 is formed is a surface stacked on the front cover foil 300. Preferably, the center points of the outer protrusion 403, the hot melt sheet hole 710, and the antenna electrode 212 are positioned in the same plane.

When the hot melt sheet 700 is applied after the antenna foil 400 is stacked, the second hole 401 formed in the antenna foil 400 is the fourth (B) diagram (reference to this figure). In the closed curve portion is a hole and the outside thereof is an antenna foil. At this time, in the second hole 401, a central hole 402 having a size larger than the area of the molding part is formed so that the molding part 220 of the COB 200 can be exposed from above, that is, the operator's field of view. And a pair of inner protrusions 404 protrude from both sides of the central hole 402 and at a predetermined interval up and down the sides. That is, the four inner protrusions 404 are a part of the antenna foil 400, and the connection portion 411 of the antenna winding 410 is formed between the pair of inner protrusions of the center hole 402. It serves as a side hole 405 formed at the edge. The connecting portion 411 of the antenna winding 410 is formed to cross the side hole 405. That is, first, after stacking the antenna foil 400 having only a pair of side holes 405, the operator connects the antenna connection part 411 and the antenna electrode 212 of the COB 200 through the side holes 405. Are electrically connected to each other, and then a second hole 401 having a shape like the fourth (B) is formed in the antenna foil 400 using a puncher or the like. Then, the hot melt sheet 700 is adhered to the second hole 401, but the molding part 220 is exposed to the outside and uses a sheet 700 having a size greater than or equal to the second hole 401.

According to the present invention, there is no step of digging again after laminating the foil, and the COB and the card plate can be strongly bound, there is no gap between the COB and the card plate, and the electrode and antenna electrode of the COB can be strongly bound. It has the effect of providing the IC card manufacturing method.

Simple modifications or changes of the present invention can be easily carried out by those skilled in the art, and all such modifications or changes can be seen to be included in the scope of the present invention.

Claims (29)

In the method of manufacturing the IC card by laminating two or more foils, the electrode surface of the COB terminal is exposed to the outside of the IC card, Position the COB such that the electrode surface for the terminal of the COB faces downward; Stacking at least two or more foils having holes of substantially the same area as the COB so that the COB fits in the holes; A foil having no holes formed is laminated on a surface opposite to a surface on which the electrode surface of the COB of the laminated foils is exposed to the outside; And Compressing the laminated foils; An IC card manufacturing method comprising the steps. The method of claim 1, wherein the step of stacking at least two or more foils so that the COB fits into the holes Laying down a first foil for coating the IC card; And Stacking a second foil on the first foil; An IC card manufacturing method comprising the steps. 3. The method of claim 1, further comprising the step of laying a substantially flat working plate on the floor, and positioning the COB such that the electrode surface of the terminal of the COB is face down on the working plate. IC card manufacturing method characterized in that. 4. The method of claim 3, further comprising placing another substantially flat working plate on the laminated foils, and pressing the two working plates. The method of manufacturing an IC card according to claim 4, wherein heat is applied to the working plate placed on the laminated foil and compressed. 6. The method of claim 5, further comprising bonding one side of a hot melt double sided sheet to the COB by applying heat, wherein the other side of the hot melt double sided sheet is heated on the COB by applying heat to the working plate. IC card manufacturing method characterized in that to be bonded to the laminated foil. The electrode terminal for the contact terminal of the COB having a molding part, the antenna electrode for the contactless terminal, and the electrode surface for the contact terminal is exposed outside the IC card, the antenna for the contactless terminal is mounted inside the IC card, and In the method of manufacturing the IC card by laminating two or more foils, Position the COB such that the electrode surface for the contact terminal of the COB faces downward; Stacking at least one or more foils having a first hole of substantially the same area as the main board of the COB such that the first hole is fitted in an electrode portion of the COB; An antenna foil having a second hole and an antenna formed at a point corresponding to the position of the first hole is laminated on the laminated foil so that the second hole is fitted into a molding portion of the COB; Electrically connecting a connecting portion of the antenna to an antenna electrode of the COB; A foil having no holes formed is laminated on a surface opposite to a surface on which the electrode surface of the COB of the laminated foils is exposed to the outside; And Compressing the laminated foils; And wherein the molding part and antenna electrode of the COB are exposed upwardly through the second hole. 8. The method of claim 7, wherein the step of stacking at least two or more foils so that the COB fits into the holes Laying down a first foil for coating the IC card; And Stacking a second foil on the first foil; An IC card manufacturing method comprising the steps. The method of claim 7 or 8, further comprising the step of laying a substantially flat working plate on the floor, and positioning the COB on the working plate such that the electrode surface of the terminal of the COB faces downward. IC card manufacturing method. 10. The IC card manufacturing method according to claim 9, further comprising placing another substantially flat working plate on the laminated foils, and pressing the two working plates. 11. The method of manufacturing an IC card according to claim 10, wherein heat is applied to the working plate placed on the laminated foil and compressed. 12. The method of claim 11, further comprising the step of applying heat to one side of the hot melt double sided sheet to the COB, wherein the other side of the hot melt double sided sheet is heated above the COB by applying heat to the working plate. IC card manufacturing method characterized in that to be bonded to the laminated foil. The hot melt sheet of claim 12, wherein the hot melt sheet is adhered to the COB prior to laminating at least one or more foils having the first apertures, wherein the hot melt sheet is substantially outside the outer edge of the main board of the COB. Bonded to cover the main board so as not to cover and at the same time bonded so as not to cover the molding portion and the antenna electrode of the COB. The IC card manufacturing method according to claim 13, wherein both ends of the antenna are electrically connected to the antenna electrode of the COB through any one of ultrasonic welding, adhesion through a conductive adhesive, and solder welding. The hot melt sheet of claim 12, wherein the hot melt sheet is adhered to the COB after electrically connecting a connecting portion of the antenna to an antenna electrode of the COB, wherein the hot melt sheet may cover at least the main board of the COB. Bonded so as to be bonded so as not to cover the molding portion of the COB at the same time. In the method of manufacturing the IC card by laminating two or more foils, the electrode surface of the COB terminal is exposed to the outside of the IC card, Stacking at least two or more foils each having holes of substantially the same area as the COB; Inserting the COB into the hole; A cover foil having no holes formed is laminated on a surface opposite to a surface on which the terminal electrode surface of the COB of the laminated foil is exposed to the outside; And Compressing the laminated foils; An IC card manufacturing method comprising the steps. 17. The method of claim 16, wherein laminating at least two or more foils Laying down a first foil for coating the IC card; And Stacking a second foil on the first foil; An IC card manufacturing method comprising the steps. 18. The method of claim 17, wherein inserting the COB into the hole Flip the laminated foils; And And a terminal electrode surface of the COB is exposed to the outside through a hole formed in the first foil. 87. The IC card manufacturing according to any one of claims 16 to 87, further comprising placing a substantially flat working plate under and over the laminated foils, respectively, and pressing both working plates. Way. 20. The IC card manufacturing method according to claim 19, wherein the working plate is heated and compressed. 21. The method of claim 20, further comprising the step of applying heat to one side of the hot melt double sided sheet to the COB, wherein the other side of the hot melt double sided sheet is placed on the COB by applying heat to the working plate. IC card manufacturing method characterized in that to be bonded to the laminated foil. The electrode terminal for the contact terminal of the COB having a molding part, the antenna electrode for the non-contact terminal, and the electrode surface for the contact terminal appears outside the IC card, the antenna is mounted inside the IC card, and the two or more foils In the method of manufacturing the IC card by laminating, Stacking at least one or more foils having a first hole of substantially the same area as the motherboard of the COB; An antenna foil having a second hole and an antenna formed at a point corresponding to the position of the first hole is laminated on the laminated foil so that the second hole corresponds to the first hole; Inserting the COB into the holes of the laminated foils such that the molding portion of the COB fits into the second hole and the antenna electrode portion of the COB fits into the first hole; Electrically connecting a connecting portion of the antenna to an antenna electrode of the COB; A cover foil having no holes formed is laminated on a surface opposite to a surface on which the terminal electrode surface of the COB of the laminated foil is exposed to the outside; And Compressing the laminated foils; And a step, wherein at least a molding part of the COB and an antenna electrode are exposed upwardly through the second hole. 23. The method of claim 22, wherein laminating at least two or more foils Laying down a first foil for coating the IC card; And Stacking a second foil on the first foil; An IC card manufacturing method comprising the steps. The method of claim 23, wherein inserting the COB into the hole Flip the laminated foils; And And a terminal electrode surface of the COB is exposed to the outside through a hole formed in the first foil. 25. The manufacture of an IC card according to any one of claims 22 to 24, further comprising the step of respectively placing a substantially flat working plate under and over the laminated foils, and pressing both working plates. Way. An IC card manufacturing method according to claim 25, wherein the working plate is heated and compressed. 27. The method of claim 26, wherein the hot melt sheet is adhered to the COB prior to laminating at least one or more foils having the first apertures, wherein the hot melt sheet is substantially outside the outer edge of the main board of the COB. Bonded to cover the main board without being covered, and at the same time bonded to not cover the molding portion and the antenna electrode of the COB. 28. The IC card manufacturing method according to claim 27, wherein the both ends of the antenna are electrically connected to the antenna electrode of the COB through any one of ultrasonic welding, adhesion through a conductive adhesive, and solder welding. 27. The apparatus of claim 26, wherein the hot melt sheet is adhered to the COB after electrically connecting a connection of the antenna to an antenna electrode of the COB, wherein the hot melt sheet may cover at least the main board of the COB. Bonded so as to be bonded so as not to cover the molding portion of the COB at the same time.