JP2013035190A - Booklet with ic and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a booklet with IC the state of which can easily be maintained when being opened or closed.SOLUTION: This booklet with IC includes a cover base material 11, an inlay sheet 14 accumulated on the cover base material, which is separated at the rear part and both the IC 15 and an antenna 16 are fixed on at least one part of the separated one, a shape-keeping layer 12 consisting of fiber base material accumulated extending across both parts of the separated inlay sheet, and the booklet paper body 17 accumulated on the shape-keeping layer. In addition, the shape-keeping layer is adhered to the cover base material with liquid paste.

Description

  The present invention relates to a booklet having a forgery prevention function, and more particularly to a booklet that requires a high security function such as a passport.

  In recent years, personal information has been stored as digital data in an IC (integrated circuit), and an IC chip embedded in a booklet has been developed so that it can be read and written by a reader / writer. In particular, electronic passports are used in various countries. It has become like this. As a form to be embedded in a booklet, a form attached to a booklet cover or a form in which an inlet including an IC chip is sandwiched between pages and pages on both sides are bonded is proposed (Patent Document 1).

  An inlet including an IC chip is a minimum unit of a non-contact IC medium for reading and writing to and from an IC chip without being limited to a passport, and includes an antenna for transmitting and receiving signals and an IC chip connected to the antenna. . In general, the inlet is sandwiched between substrates made of resin or the like in order to protect the IC chip and the antenna (Patent Document 2).

  In the case of a booklet with an IC attached to the booklet cover, the booklet paper is combined with an IC booklet cover in which an inlet is bonded to a cover sheet to form an IC booklet (Patent Document 3). In Patent Document 3, the punched inlet is bonded to the back portion of the cover sheet and the left and right spread portions to form a cover member with an IC.

  By the way, in a security booklet such as a passport, for example, it is required that the booklet can be easily opened and closed for identification. However, since the form of the cover is limited from the viewpoint of portability and durability, it is difficult to satisfy this requirement. For example, when an inlet is bonded to a cover sheet and folded (closed), the cover sheet is gradually repelled due to repulsion.

Japanese Patent Laying-Open No. 2005-88569 JP 2005-63209 A Patent No. 4471971

  In view of the above problems, an object of the present invention is to provide a booklet with an IC that can easily maintain the state when the booklet is opened and closed from the viewpoint of security.

The invention according to claim 1, which has been made to solve the above-described problems, includes a cover base material, a shape retention layer made of a fibrous base material, laminated on the entire surface of the cover base material, and a shape retention layer. An IC comprising a laminated inlay sheet separated by a back portion and having an IC and an antenna fixed to at least one of the separated parts, and a booklet paper laminated over both of the separated inlay sheets. This is a booklet.
Further, the invention according to claim 2 is separated from the cover base material, the inlay sheet laminated on the cover base material, separated at the back portion, and the IC and the antenna fixed to at least one of the separated parts. It is a booklet with IC provided with the form maintenance layer which consists of a fibrous base material laminated over both inlay sheets, and the booklet book paper laminated on the form maintenance layer.
The invention according to claim 3 is characterized in that the shape retention layer is made of a paper base material, and the thread of the paper base material coincides with the spine direction of the booklet. It is a booklet.
The invention according to claim 4 is the booklet with an IC according to any one of claims 1 to 3, wherein a printing pattern is provided on an adhesive surface of the form retention layer with the inlay sheet. .
The invention according to claim 5 is the booklet with an IC according to claim 1, wherein the form retention layer and the cover base material are bonded with water glue.
The invention according to claim 6 is the booklet with IC according to claim 2, wherein the shape holding layer portion straddling the back portion on the inlay sheet is provided with a space not fixed to the cover base material side. is there.
Further, the invention according to claim 7 is a fibrous base material, which is laminated across both an inlay sheet in which an IC and an antenna are fixed to at least one of the separated back parts and the separated inlay sheet. A booklet member with an IC, wherein the inlay sheet and the shape retention layer are fixed by a resin adhesive layer.
The invention according to claim 8 is the booklet with IC according to claim 7, wherein the shape holding layer is made of a paper base material, and the thread of the paper base material coincides with the back direction of the booklet member. It is a member.

  According to the present invention, a booklet is formed by laminating a cover member on a member having a shape-retaining layer composed of a fibrous base material laminated across an inlet sheet separated at a back portion, thereby comprising a fiber-related base material. The form-retaining layer can buffer the repulsion of the cover base material when the booklet is opened and closed, so that the booklet can be easily maintained when the booklet is opened and closed.

It is a schematic diagram which shows the laminated structure of the booklet with IC which concerns on this invention. It is a schematic diagram which shows sectional drawing in the S surface of the booklet with IC of FIG. It is a schematic diagram which shows the other laminated structure of the booklet with IC which concerns on this invention. It is a schematic diagram which shows sectional drawing in the S surface of the booklet with IC of FIG. It is a schematic diagram which shows the example of the inlet concerning this invention. It is sectional drawing which shows the other laminated structure of the booklet with IC which concerns on this invention. It is a schematic diagram for demonstrating the individualization process of the booklet member with IC which concerns on this invention. It is a figure which shows the time passage of the open degree of this invention structure and comparative structure in an Example.

  FIG. 1 is a schematic view showing a laminated structure of a booklet with IC according to the present invention, and FIG. 2 is a schematic view showing a cross-sectional view of the booklet with IC of FIG. The booklet with an IC according to the present invention shown in the figure is separated by a cover base material 11 and a back portion 21 laminated on the cover base material, and an IC 15 and an antenna 16 are fixed to at least one of the separated parts. 14 and a form-retaining layer 12 made of a fibrous base material that is laminated over both of the separated inlay sheets, and a facing (booklet paper 17) laminated on the form-retaining layer. Here, the back portion is a portion that is deformed by opening and closing the booklet, and that the inlay sheet is separated by this amount means that there is no inlay sheet layer in the back portion.

  FIG. 3 is a schematic diagram showing another stacked structure of the booklet with IC according to the present invention, and FIG. 4 is a schematic diagram showing a cross-sectional view of the booklet with IC of FIG. The booklet with an IC according to the present invention shown in the figure includes a cover base material 11, a shape retention layer 12 made of a fibrous base material, which is laminated on the entire surface of the cover base material, and a back layer laminated on the shape retention layer. The inlay sheet 14 separated by the portion 21 and having the IC 15 and the antenna 16 fixed to at least one of the separated parts 21 and the booklet paper 17 stacked over both of the separated inlay sheets are provided. That is, the arrangement of the shape-retaining layers is different from the booklet with IC shown in FIGS. However, it is common in that the inlay sheets separated at least at the back portion are laminated so as to be connected by the adjacent shape-retaining layers.

  The inlay sheet 14 is separated into two regions at the back portion and laminated on the cover base material 11. As will be described later, it is preferable that the cover base material and the inlay sheet are bonded together after the form retention layer 12 and the inlay sheet are bonded together. At least one region of the inlay sheet includes an IC 15 and an antenna 16 (hereinafter, this combination is referred to as an inlet) connected to the IC. In the example of FIGS. 1 to 4, the inlet is configured by sandwiching the inlet between a first base material 14 a and a second base material 14 b constituting the inlay sheet. The inlet may be provided with an antenna pattern directly on the first substrate, or may be separately provided with an antenna sheet on which the antenna pattern is formed, and may be sandwiched between the first and second substrates. .

  FIG. 5 shows an example of the inlet 30 in which an antenna pattern is provided on the antenna sheet 31. In the configuration example of FIG. 5, the antenna pattern 16 is provided on one surface of the antenna sheet 31, and connection vias 32 are provided at the intersections of the patterns and are electrically connected by jumper wires 33 on the other surface. As the antenna sheet 31, a polyester film substrate such as polyethylene terephthalate (PET) or polyethylene naphthalate (PEN), a polyimide substrate, an acrylic substrate, or a vinyl chloride substrate can be used. Moreover, a hard base material using engineering plastics such as polycarbonate can also be used. A paper substrate may also be used.

  As a material of the antenna 16, a known metal material such as aluminum, copper, gold, silver, or a conductive material can be used. The pattern of the antenna 16 can be formed by an etching method, a plating method, a printing method, or a pattern vapor deposition method. Etching is performed by bonding a metal foil such as aluminum or copper on the antenna substrate, or forming a metal thin film such as aluminum or copper by vapor deposition or sputtering, and forming a mask pattern on the metal foil or metal thin film. This is a method of patterning into an antenna shape by etching. The printing method is a method of printing a conductive ink, and is not particularly limited as long as it is a method capable of fine patterning, but a screen printing method can be suitably used. When a paper substrate is used as the antenna sheet, a printing method can be suitably used as a method for forming the antenna. The plating method is a method in which a catalyst layer is formed by patterning and then formed by electrolysis or electroless plating. The pattern vapor deposition method is a method of forming an antenna pattern in a pattern by a vapor deposition method or a sputtering method using a mask having an opening. Instead of providing the jumper wire 33 on the back side, the antenna pattern may be crossed by bonding to the intersecting portion of the antenna pattern using a wiring made of an insulating base material and a conductive member, and connecting the end of the wiring with the antenna. .

  As another antenna forming method, a metal wire such as a copper wire may be fixedly arranged in a coil shape on one of the base materials or on the antenna sheet to form the antenna. The number of turns and the shape of the antenna can be appropriately set according to the communication frequency and other characteristics. This configuration can be suitably used particularly when an antenna / wiring is formed on one side.

  The IC 15 and the antenna 16 can be connected by bonding the terminal end of the antenna and a bump or connection pad 34 connected to the IC chip by welding or an adhesive. In order to reduce the thickness of the IC chip protruding toward the first base material 14a and the second base material 14b, an opening may be provided in the antenna sheet, and the IC chip may be disposed there. As the adhesive, a conductive adhesive can be suitably used. Further, when an opening is provided in the IC mounting region of the first base material or the second base material, the IC may be mounted after the base materials are bonded together. Further, the IC may be connected to the antenna in the form of a module having a connection terminal or the like instead of the bare chip.

  The inlet 30 is sandwiched between the first base material 14a and the second base material 14b of the inlay sheet, and the base material and the inlet are bonded together to protect the inlet, and various media can be used as the inlay. It can be attached to and used. Bonding of both base materials can be performed by laminating an adhesive layer of a heat seal material on the first base material and the second base material bonding surface. When the pattern of the antenna 16 is directly provided on the inlay sheet 14 as an inlet, a separate adhesive layer film is provided, and the adhesive layer film is provided between the first base material and the second base material. It may be sandwiched and laminated.

  Examples of the material of the first base material 14a and the second base material 14b of the inlay sheet include an insulating plastic film (PET-G: amorphous copolyester, PVC: vinyl chloride resin, etc.) and an insulating synthetic material. Uses porous substrates such as paper (polyolefin-based synthetic paper manufactured by PPG, trade name “Teslin” (registered trademark), or polypropylene-based synthetic paper manufactured by YUPO Corporation, product name “YUPO” (registered trademark)). Is possible. Among these, a porous base material is more preferable because it can be satisfactorily adhered to the cover base material 11 and the shape retention layer 12. As the thickness of the base materials 14a and 14b, for example, a thickness of about 100 μm to about 1000 μm can be used. Among these, when applied to a booklet, the range of about 100 μm to about 500 μm is more preferable.

  Further, as described above, an opening or a non-penetrating counterbore may be provided at the corresponding position of the base material 14a, 14b to reduce the IC thickness. The opening or counterbore may be provided on only one of the base materials, or may be provided on both base materials. It is possible to relieve stress on the IC chip 15 and prevent physical destruction of the IC under load.

  The form retention layer 12 uses a material made of a fibrous base material and is bonded to the cover base material 11 and the inlay sheet 14 to keep the form of the booklet open or closed at the back part 20 of the booklet. Can do. This is because repulsion of the cover base material at the time of opening and closing the booklet has a buffering effect because the fibers in the shape retention layer try to hold the open / closed state of the booklet. That is, as shown in FIGS. 1 and 2, a shape retention layer is laminated on the opposite side of the cover base material 12 with the inlay sheet 14 interposed therebetween, or between the cover base material and the inlay sheet as shown in FIGS. Since the shape retention layer made of a fibrous base material is laminated on and fixed by the adhesive layers 21 and 13, repulsion when the cover is bent can be buffered. Of course, as shown in FIG. 6, two form-retaining layers may be provided so as to sandwich both surfaces of the inlay sheet.

  Since the inlay sheet 14, the cover base material 11, and the booklet paper are often supplied separately, it is preferable to previously laminate the configuration in which the shape holding layer is bonded to the inlay sheet as the booklet intermediate member 26 with IC. Since the inlay sheet is integrated by supplying such an IC-equipped booklet intermediate member as a member supply form, booklet production by bonding the cover base material 11 and booklet paper becomes easy.

Specific examples of the fibrous base material include a general paper base material made of pulp fibers and a synthetic paper made of synthetic fibers. For example, high-quality paper used for printing can be used. Examples of the synthetic paper include polypropylene fiber synthetic paper (YUPO (registered trademark)). A paper substrate is particularly preferable because of its good compatibility with water. The shape retention layer 12 is preferably about 30 to 250 g / m ² . When it is less than 30 g / m ² , the effect of maintaining the shape is weak. If it exceeds 250 g / m ² , it is unsuitable because it is too thick as a member to be sandwiched between covers. In the paper substrate, there is a paper pattern indicating the direction of the fiber. In the present invention, it is preferable to laminate the paper so as to be parallel to the opening / closing direction (back direction). This is because the repulsive force is strong when folding in the direction of the paper (folding in the direction in which the fold is perpendicular to the paper), and conversely, the repulsive force is weak when bending in the direction parallel to the paper. By making the opening and closing direction coincide with this direction, it becomes easier to maintain the form at the time of opening and closing.

The shape retention layer 12 and the inlay sheet 14 can be bonded together by hot melt, water-based adhesive (water glue), curable adhesive, or the like. In particular, it is preferable to bond the shape retention layer and the inlay sheet using a resin adhesive. Conventionally, when a water-based adhesive is used when the cover base material is bonded to the inlay sheet, there is a problem that the booklet is uneven as the adhesive is dried, resulting in irregularities in the booklet. However, in the present invention, the form-holding layer and the inlay sheet are bonded together with a resin adhesive and fixed with a resin adhesive layer 23, whereby the cover base material or the facing (booklet paper 17) is bonded to a solvent type containing water paste. Even when pasting with an agent, there is no twist or unevenness, and uniform bonding is possible. This is particularly effective when the cover substrate and the shape retention layer are bonded together. Furthermore, by using a solvent-free resin adhesive, it is easy to uniformly bond the form-holding layer made of the fibrous base material when it is bonded to the inlay sheet, which is preferable. For example, thermoplastic resins such as hot melt, various curable resin adhesives such as UV curable type, moisture curable type, and thermosetting type can be used.
The adhesive layer 23 may be applied or laminated on the inlay sheet side and bonded together, or may be applied or laminated on the shape maintaining layer side and bonded together.

  Moreover, when the shape retention layer is laminated | stacked on the opposing surface of the cover base material 12 on both sides of the inlay sheet 14 like FIG.1 and FIG.2, after bonding an inlay sheet and a shape retention layer previously, an inlay sheet and By sticking the cover material, it is preferable that a space corresponding to the thickness of the inlay sheet is generated at the back portion of the booklet, and the cover material and the shape retention layer are not fixed at the back portion of the booklet. By doing so, the back portion of the booklet paper 17 is not fixed to the back portion of the cover, and the booklet can be opened and closed more smoothly.

  Moreover, you may give a printing pattern, such as a character, a symbol, and a figure, to the adhesive surface with the inlay sheet 14 of the form retention layer 12. By providing a print pattern, the print pattern may be peeled off when the inlay sheet is peeled off, and the replacement of the inlay sheet with IC may be visually confirmed. In particular, since the form retention layer is made of a fibrous base material, such printing is also easy.

  FIGS. 7A and 7B are schematic diagrams for explaining a process of creating a multi-faceted booklet member 26 with an IC in which the inlay sheet 14 and the shape retention layer 12 are bonded together. In FIG. 7, the antenna is omitted. In FIG. 7A, a two-sided inlay sheet is prepared and attached to the left and right regions on the shape-retaining layer 12, and then cut into a member with an IC having one IC on each side. To separate. An inlay sheet may be formed by cutting a plurality of inlets sandwiched between substrates to form an inlay sheet with an IC and an inlay sheet that does not include an IC. It may be formed by using a single inlay sheet without including.

  In FIG. 7 (B), after creating a multi-faceted inlay sheet, an opening is provided in the back portion so as to keep it in a row, while the left and right inlay sheets are connected at the opening end. In this case, after lamination, the part where the ends are connected is cut together with the separation. The singulation may be performed before the cover material 11 is bonded, or may be performed after the cover material is bonded. Further, only the cutting of S2 may be performed, and final separation may be performed after the booklet is formed by pasting booklet sheets. In addition, as described above, in the configuration of FIGS. 1 and 2, it is preferable that the cover material and the shape retention layer 12 are not fixed at the back portion 21 of the booklet. When a layer is provided, it is preferable that an adhesive layer is not formed on the shape-retaining layer.

  For the cover substrate 11, cloth cloth, paper cloth, cardboard, leather, synthetic leather, or the like is used. An adhesive layer 22 such as hot melt may be formed in advance for laminating the shape retention layer 12 on the cover substrate. In particular, in the configuration of FIGS. 3 and 4, when the inlay sheet 14 and the shape retention layer are bonded together with the resin adhesive layer, as described above, the aqueous base material (water glue) is used to maintain the shape of the cover base material. The layers can be easily bonded together at room temperature without causing irregularities or the like on the cover substrate. Thereafter, the booklet paper is attached to the opposite surface of the cover base material using an adhesive, whereby a booklet with an IC is obtained. Note that the booklet may be separated into individual pieces after pasting the booklet paper.

<Production of booklet member with IC>
An antenna sheet in which an etching antenna was connected to an IC chip was sandwiched between two substrates made of porous resin (teslin manufactured by PGP, thickness: 175 μm × 2), and pressed by thermal lamination to obtain an inlay sheet. Further, the inlay sheet was separated into individual pieces by cutting, thereby creating an inlay sheet piece with an IC and an inlay sheet piece not containing an IC.

Next, water is uniformly applied to the entire surface of one side of the paper base material (OCR paper manufactured by Oji Paper Co., Ltd., 104 g / m ² ) to be the shape-retaining layer, and inlay sheet pieces and ICs that do not contain IC on the left and right sides of the paper base material. Each inlay sheet piece with a mark is arranged so that no inlay sheet exists in the area corresponding to the back part of the booklet. It dried in this state, and it was set as the booklet member with IC by adhere | attaching. The direction of the stitches is arranged so as to be orthogonal to the direction in which the inlay sheets are arranged, that is, to coincide with the back direction of the booklet.

<Production of booklet with IC>
Next, a paper cloth (manufactured by Toyo Cloth Co., Ltd.) is prepared as a cover substrate, a moisture-curing urethane adhesive is applied to the entire surface of one side of the cover substrate, and the inlay sheet side of the produced booklet member with IC is prepared. That is, the shape retention layer was superposed and bonded so as to face the cover substrate with the inlay sheet interposed therebetween. After the adhesive layer is cured, a facing paper (OCR paper manufactured by Oji Paper Co., 104 g / m ² ) equivalent to the booklet paper is pasted with water glue to create a booklet with an IC, and the booklet is closed to about 25 g / cm ^2. And aged for 24 hours in an environment of 23 ° C. and 50% RH.

<Production of a booklet with an IC with a comparative configuration>
For comparison, a booklet with an IC was prepared by attaching an inlay sheet to a cover base material without including a shape retention layer. The other steps are the same as those in the booklet with IC.

<Comparison experiment>
After the aging was completed, the degree of booklet opening was measured in an environment of 23 ° C. and 50% RH with the load removed. As shown in FIG. 8, the opening with any IC booklet was observed with time, but the degree of opening was reduced with the IC booklet of the configuration of the present invention, and the opening was less than the comparative configuration.

100-300 ... Booklet with IC 11 ... Cover base material 12 ... Form retention layer 14 ... Inlay sheet 23 ... Booklet member with IC

Claims (8)

A cover substrate;
A form-retaining layer made of a fibrous base material, laminated on the entire surface of the cover base material,
An inlay sheet laminated on the shape-retaining layer, separated at the back, and having the IC and the antenna fixed to at least one of the separated layers, and a booklet paper laminated on both of the separated inlay sheets; ,
A booklet with IC. A cover substrate;
An inlay sheet laminated on a cover substrate, separated at the back portion, and having an IC and an antenna fixed to at least one of the separated parts;
A form-retaining layer composed of a fibrous base material laminated over both separated inlay sheets;
A booklet paper laminated on the form-retaining layer;
A booklet with IC.   3. The booklet with an IC according to claim 1, wherein the shape holding layer is made of a paper base material, and the thread of the paper base material coincides with the direction of the spine of the booklet.   The booklet with an IC according to any one of claims 1 to 3, wherein a printed pattern is applied to an adhesive surface of the form retention layer with the inlay sheet.   The booklet with an IC according to claim 1, wherein the form retention layer and the cover base material are bonded with water glue.   The booklet with an IC according to claim 2, wherein the shape holding layer portion straddling the back portion on the inlay sheet is provided with a space not fixed to the cover base material side. An inlay sheet that is separated by a back portion, and an IC and an antenna are fixed to at least one of the separated parts;
A form-retaining layer composed of a fibrous base material laminated over both separated inlay sheets;
A booklet member with an IC, wherein the inlay sheet and the shape retention layer are fixed by a resin adhesive layer.   The booklet member with IC according to claim 7, wherein the shape retention layer is made of a paper base material, and the thread of the paper base material coincides with the spine direction of the booklet member.

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