JP2001287477A - Pamphlet-like printed matter - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a pamphlet-like printed matter so constituted as not to be subjected to the bad influence by the pressure of a feed roller in a printer print device upon a coil antenna or an IC chip when a pamphlet-like printed matter, in which a non-contact type IC function is provided, especially a pamphlet-like printed matter for a use application, in which a printing treatment with the printer print device is necessary, such as a bankbook or the like. SOLUTION: A non-contact type IC adhering medium, on the rear side of which a self-adhesive layer is provided and in which a non-contact type IC chip having a coil antenna formed on the surface thereof is built, is pasted onto the front cover or rear cover of the pamphlet-like printed matter.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a booklet-shaped printed matter having a non-contact IC storage medium having a built-in IC chip on the surface of which a coil antenna capable of performing communication with an external processing device in a non-contact manner. Things.

[0002]

2. Description of the Related Art Heretofore, for example, a non-contact type IC card has been generally known as a non-contact type IC storage medium capable of performing communication with an external processing device in a non-contact state. These non-contact type IC cards are usually made of plastic. For example, a data communication coil for inputting / outputting signals in a non-contact manner inside a 0.76 mm-thick card made of a polyvinyl chloride base and the data communication coil are provided. IC connected to communication coil
In general, a non-contact type IC card is configured by incorporating a non-contact type IC module including a chip (semiconductor integrated circuit).

[0003] Since these non-contact type IC cards are usually made of plastic, processing and molding of the card base are required depending on the shape of the built-in non-contact type IC module. It is also a factor that hinders the trend in each industry to improve services by introducing a contact-type customer service system.

In recent years, it has become possible to reduce the thickness of non-contact IC modules, and a non-contact IC card having a thickness of, for example, 0.25 mm using a polyethylene terephthalate substrate as a card substrate has been developed. These non-contact I
Since the non-contact type IC card as the C storage medium is made of plastic, it is not possible to write or print various kinds of information and data even when it is desired to print the data with a printer or the like. There is a problem that it is not suitable for various booklet-like printed materials such as passbooks and passports that require printing.

[0005] Therefore, in order to provide a non-contact IC storage means in a booklet-shaped printed matter, a front cover or a back cover is formed by a resin sheet having a non-contact IC module built therein.
A booklet-shaped printed matter in which a book body text sheet is stitched between the front cover and the back cover so that it can be written on the paper body paper has been developed and is known. However, since these booklet-shaped printed materials usually have a structure in which a non-contact IC module is built in the vicinity of the center in a resin sheet provided on the front side of the booklet-shaped printed material, for example, a booklet-shaped printed material having such a structure is used. When used for passbooks, etc., ATM
At the time of printer printing processing by the device (automatic depositing and dispensing device), by the feed roller running near the center of the passbook,
Pressure is applied to the built-in IC chip and the non-contact IC module, and there is a risk of breaking the IC chip and the non-contact IC module, which is not preferable.

In order to incorporate a non-contact IC module in the front cover or the back cover of a booklet-like printed material, the manufacturing cost is increased. There is a lot of waste on resources and there is a problem.

[0007]

SUMMARY OF THE INVENTION The present invention is to provide a booklet-like printed material which can provide the function of a non-contact type IC with less resources and lower production cost than conventional products. Also, when used for booklet prints for applications that require printing by a printer printing device such as the one above, the adverse effect of pressure on the coil antenna or IC chip provided on the booklet prints by the feed roller in the printer printing device should be minimized. Even when the booklet-shaped printed matter is stapled, the IC card is attached to the body paper bound inside the booklet-shaped printed matter.
An object of the present invention is to provide a booklet-shaped printed matter having a non-contact type IC designed so that the chip is not pressed and configured to reduce the cause of the failure of the IC chip.

[0008]

In order to achieve the above-mentioned object, a booklet-shaped printed material according to the present invention comprises a non-contact type IC chip having a coil antenna formed on a front surface and a sticking medium having an adhesive layer on a back surface. And a non-contact type IC sticking medium incorporated therein, and the non-contact type IC sticking medium is attached to a front cover or a back cover of a booklet-shaped printed matter.

Further, the non-contact type IC sticking medium is stuck to a region near a corner on an inner surface of a front cover or a back cover of the booklet-shaped printed matter.

[0010] When the booklet-shaped printed matter is bound, the non-contact type IC sticking medium stuck to the booklet-shaped printed matter and the text sheet bound inside the booklet-shaped printed matter are prevented from overlapping. A notch is provided in a region near a corner of the text sheet.

Further, the booklet-shaped printed matter is a bankbook or a passport. Further, the same copy-forgery-inhibited pattern printing is performed on the surface of the non-contact IC attaching medium and the surface of the booklet-shaped printed matter on the side where the non-contact IC attaching medium is attached. Further, a mark indicating a position where the non-contact type IC attaching medium is attached is printed on the booklet-shaped printed matter.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the drawings. FIG. 1A is a plan view of a non-contact type IC chip having a coil antenna formed on a surface, and FIG.
FIGS. 2A and 2B are perspective views of a non-contact type IC chip having a coil antenna formed on its surface, FIGS. 2A and 2B are plan views of non-contact type IC sticking media having different shapes, and FIG. )
4 is a perspective view showing a state in which a non-contact type IC attaching medium is attached to the booklet-shaped printed matter according to the present invention, FIG. 5 is a sectional view taken along the line BB of FIG. 4, and FIG. FIG. 7 is a perspective view showing a state in which a notch is provided at a corner portion of the body sheet of the booklet-shaped printed matter according to the present invention, and FIG. 7 is a diagram illustrating the body sheet of FIG. 6 on the back cover side where the non-contact IC attaching medium is attached. FIG. 8 is a plan view showing a state where the booklet-shaped printed matter according to the present invention shown in FIG. 7 is bound, and FIGS.
(B) is a partially cutaway plan view of the booklet-shaped printed matter on which marks indicating the positions where the non-contact type IC sticking media of different shapes are to be stuck are printed.

As shown in FIGS. 2 and 3, a non-contact type IC sticking medium 2 used for the booklet-shaped printed matter 1 of the present invention comprises a first label substrate 4 and a second label A non-contact type IC chip 6 is built in between the material and the material 5, and an adhesive layer 7 is formed on the lower surface of the second label substrate 5 provided below. That is, the first label base material 4 and the second label base material 5 on which the pressure-sensitive adhesive layer 7 is formed on the lower surface
To form a sticking medium, and the non-contact IC chip 6 is built in the sticking medium to form the non-contact IC sticking medium 2. Normally, a copy-forgery-inhibited pattern print 13 of various designs is applied to the booklet-shaped printed matter 1 such as a passbook to prevent forgery and the like, but the same is applied to the surface of the first label substrate 4 of the non-contact type IC sticking medium. In this case, the non-contact type IC sticking medium 2 can be easily recognized even when the non-contact type IC sticking medium 2 is replaced.

Further, the non-contact type I
Before attaching the C attaching medium 2, it is preferable to attach a release paper 9 to the back surface of the adhesive layer 7 of the non-contact type IC attaching medium 2 in a releasable manner. The pressure-sensitive adhesive layer 7 of the non-contact type IC pasting medium 2 is not formed at the stage of producing the non-contact type IC pasting medium 2, and is used when the non-contact type IC pasting medium 2 is pasted to a book-like printed matter such as a passbook. Then, an adhesive may be applied to the back surface of the second label substrate 5 and attached. And
As shown in FIG. 1, a coil antenna 9 is formed on the surface of the non-contact type IC chip 6 to enable wireless data communication.

A method of manufacturing the non-contact type IC chip 6 will be described. A terminal pad portion of the IC chip is masked, an insulating film having a thickness of about 10 .mu.m is formed on the chip surface with polyimide or the like by an electrodeposition technique. Peel off the mask. It is desirable to form a complete insulator by the heat treatment, and then to perform a surface roughening treatment to improve the adhesion of the metal layer. And
A power supply layer is formed by electroless Ni plating, a mask is formed by photoresist, fine coil wiring is performed by electrolytic plating, and finally the resist and the electroless Ni plating are peeled off, and non-contact terminal pads are formed on the chip surface. The antenna connected to is processed. Incidentally, not only Ni but also Cu can be used. As described above, for example, an antenna having a width of 20 μm, a space of 20 μm, and a metal thickness of 20 μm and about 45 turns can be obtained on a square IC chip of 4 mm in length and width. Then, by protecting these fine coil wirings with an overcoat of polyimide or the like, a coil-on-chip non-contact type IC chip 6 is obtained.

Next, a method of manufacturing the non-contact type IC sticking medium 2 will be described. For example, the second label substrate 5 shown in FIG.
An adhesive layer 7 having a thickness of 20 μm is formed on the lower surface of a high-quality paper 125 μm corresponding to the above, and a generally used high-quality paper adhesive label in which a release paper 8 is releasably attached to the surface of the adhesive layer 7 is used. is there. An IC chip having a thickness of 100 μm is placed on the high-quality paper adhesive label and fixed with an adhesive.
High quality paper (corresponding to the first label substrate 4 shown in FIG. 3) having a thickness of 125 μm on which the pressure-sensitive adhesive layer 3 having a thickness of 0 μm is formed is laminated and integrated. Thereafter, the sheet is punched into a desired shape and size to produce the non-contact type IC attaching medium 2 having the release paper 8 on the back side. In this case, a so-called half-cut may be performed in which only the release paper 8 is left and other parts are punched.

The IC chip is attached to the adhesive layer 3 formed on the back surface of the high quality paper corresponding to the first label substrate 4 and then superposed on the high quality paper corresponding to the second label substrate 5. It may be. It is preferable that the size of the non-contact IC attaching medium 2 is as small as possible, and the shape can be arbitrarily selected. As an example, FIG. 2A shows a non-contact type IC sticking medium 2 having a rectangular shape, and FIG. 2B shows a non-contact type IC sticking medium 2 having a right-angled isosceles triangle. In particular, when pasting on a booklet such as a passbook,
It is a right-angled isosceles triangle with a side of about 10 mm, and the right-angled intersection part should be a rounded corner having the same diameter as the rounded corner at the corner of the booklet such as a passbook. Is also preferred.

The booklet-shaped printed material 1 of the present invention has a configuration in which a non-contact type IC sticking medium 2 is attached to the front or back cover of the booklet-shaped printed material, and FIG. A configuration in which a non-contact type IC attaching medium 2 is attached to a side surface is shown. As shown in FIG. 9, a mark indicating the position where the non-contact type IC sticking medium is to be stuck is printed in advance at the position where the non-contact type IC sticking medium 6 is stuck on the booklet-shaped printed matter 1, and the non-contact type IC sticking medium is attached. It is preferable that the medium 6 be stuck at an accurate position. FIG.
9A is a rectangular mark for a non-contact type IC sticking medium, and FIG. 9B is a part of a booklet-shaped printed matter on which a triangular mark for a non-contact type IC sticking medium is printed. A cutaway plan view is shown as an example.

Normally, the booklet-shaped printed matter includes a front cover 9 and a back cover 10, and a body paper 11 provided between the front cover 9 and the back cover 10; When the body paper 11 is turned over, the non-contact IC attaching medium 2 is attached to the
Non-contact type IC in which the sticking medium 2 is bent and built
There is a risk that a failure may be caused by applying extra stress to the chip. In addition, since the thin paper is usually used as the text paper 11, if the non-contact type IC bonding medium 2 is bonded, there is a risk that the paper may be damaged at the time of use.

In addition, depending on the intended use of the booklet-shaped printed matter, the non-contact type IC affixing medium 2 is replaced with the front cover 9 or the back cover 1.
The shape can be adjusted by affixing to a desired position on the front surface or the back surface of the zero. In particular, cover 9
Alternatively, when the non-contact type IC attaching medium 2 is attached to the surface of the back cover 10, a print pattern or character information of a desired design may be printed on the surface of the first label substrate 4.

The non-contact type IC attaching medium 2 is preferably attached to a region near a corner on the inner surface of the front cover 9 or the back cover 10 of the booklet-shaped printed matter. In particular, when the booklet-shaped printed matter 1 is a medium such as a passbook used for the purpose of performing a printer printing process of an ATM device, the non-contact type IC sticking medium 2 built in by a feed roller running near the center of the passbook. However, there is a risk that the IC chip may be broken due to the pressure exerted by the feed roller, so that the non-contact type I
By adhering the C adhering medium 2, it is possible to avoid the adverse effects of these feed rollers, which is effective.

However, the non-contact type IC sticking medium 2
Is constituted by sandwiching the non-contact type IC chip 6 between the first label base material 4 and the second label base material 5, the first label base material 4 having the built-in non-contact type IC chip 6 Is extruded outward, the thickness of a part of the non-contact type IC attaching medium 2 is actually increased by about 50 μm, and the surface of a part of the booklet-shaped printed matter 1 is swollen. Therefore, if the booklet-shaped printed matter 11 is bound in this state, there is a danger that the body paper 11 bound inside presses the non-contact type IC chip 6 to apply pressure and cause damage or failure.

Therefore, as another embodiment of the present invention, as shown in FIG.
Alternatively, the non-contact type IC affixing medium 2 is attached to a region near the corner on the inner surface of the back cover 10, and the body paper 10 bound to the inside of the booklet-shaped printed matter 1 as shown in FIG. The area near the corners of the body sheet 10 so that the part of the body sheet 10 and the non-contact type IC chip 6 built in the body 2 are not overlapped when the sheet 10 is overlaid and bound. And a notch 12 is provided.

As a result, as shown in FIGS. 7 and 8, when the booklet-shaped printed material 1 is bound, the non-contact type IC chip 3 incorporated in the non-contact type IC sticking medium 2 is attached to the body paper 11. Thus, it is possible to avoid adverse effects such as failure due to receiving pressure. The shape of the cutout portion 12 formed in the vicinity of the text sheet may be a desired shape such as a corner cut or a rounded corner.

The booklet-shaped printed matter of the present invention is particularly effective when used in a bankbook, passport, or the like where the booklet-shaped printed matter cannot be misused by a third party. In this case, a non-contact IC The chip 6 stores collation data for certifying the identity, such as face photograph data of the identity, and confirms the identity of the collation data by wireless signal exchange with an external device, thereby confirming the identity of the collation data so that a booklet such as a passbook or a passport can be obtained. This makes it possible to ensure the certainty in using the printed matter.

[0026]

As described in detail above, the booklet-shaped printed matter of the present invention can provide the function of a non-contact type IC with less resources and lower production cost than the conventional product.
A booklet for applications that require printing by a printer printing device, such as a passbook, by attaching a non-contact IC attachment medium to the area near the corner on the inner surface of the front or back cover of the booklet-shaped printed matter Also when used for printed matter, the influence of pressure on the coil antenna and the IC chip by the feed roller in the printer printing apparatus can be minimized, and the cause of the failure can be eliminated and the safety is high. In addition, by providing the notch in the vicinity of the corner of the body paper of the booklet-shaped printed matter, the non-contact type IC attaching medium provided in the vicinity of the corner on the inner surface of the front cover or the back cover is pressed against the body paper. As a result, it is possible to eliminate the cause of the failure and provide a highly safe booklet-like printed material. By using the booklet-shaped printed matter for a bankbook or passport, non-contact data communication is possible, which is convenient. In addition, since the same copy-forgery-inhibited pattern printing is performed on the surface of the non-contact IC attaching medium and the surface of the booklet-shaped printed matter on which the non-contact IC attaching medium is attached, the non-contact IC attaching medium is provided. Even if you paste it maliciously, you can immediately find out and have the effect of preventing alteration. Furthermore, non-contact IC
By printing the mark indicating the position where the sticking medium is stuck, the non-contact IC sticking medium can be stuck at an accurate position when a booklet-shaped printed matter is manufactured.

[Brief description of the drawings]

FIG. 1A is a plan view of a non-contact type IC chip having a coil antenna formed on the surface, and FIG. 1B is a perspective view of the non-contact type IC chip having a coil antenna formed on the surface.

FIGS. 2A and 2B are plan views of non-contact type IC sticking media having different shapes.

FIG. 3 is a sectional view taken along line AA of FIG. 2 (b).

FIG. 4 is a perspective view showing a state in which a non-contact type IC attaching medium is attached to a booklet-shaped printed matter according to the present invention.

FIG. 5 is a sectional view taken along line BB of FIG. 4;

FIG. 6 is a perspective view showing a state in which a notch is provided at a corner portion of a body sheet of a booklet-shaped printed matter according to the present invention.

7 is a perspective view showing a state in which the body paper of FIG. 6 is superimposed on the back cover side on which the non-contact type IC attaching medium is attached.

8 is a plan view showing a state where the booklet-shaped printed matter according to the present invention shown in FIG. 7 is bound.

FIG. 9 is a partially cutaway plan view of a booklet-shaped printed matter on which marks indicating positions where non-contact type IC sticking media having different shapes are stuck are printed.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Booklet printed matter 2 Non-contact type IC sticking medium 3,7 Adhesive layer 4 First label base material 5 Second label base material 6 Non-contact type IC chip 8 Release paper 9 Front cover 10 Back cover 11 Body paper 12 Notch Part 13 copy-forgery-inhibited pattern printing 14 mark indicating the position where the non-contact IC attaching medium is attached

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) G07D 9/00 436 G06K 19/00 H

Claims (6)

[Claims] A non-contact type IC chip having a coil antenna formed on a front surface, a non-contact type IC bonding medium embedded in a bonding medium having an adhesive layer on a back surface, and the non-contact type IC chip.
C. The booklet-shaped printed matter, wherein the sticking medium is stuck on the front cover or the back cover of the booklet-shaped printed matter. 2. The booklet-shaped printed matter according to claim 1, wherein the non-contact type IC sticking medium is stuck to a region near a corner on the inner surface of the front or back cover of the booklet-shaped printed matter. . 3. When the booklet-shaped printed matter is bound,
A notch is provided in a region near a corner of the body paper so that the non-contact type IC affixing medium affixed to the booklet printed matter and the body paper bound inside the booklet printed matter do not overlap. The book-form printed matter according to claim 2, characterized in that: 4. The booklet-shaped printed matter according to claim 1, wherein the booklet-shaped printed matter is a bankbook or a passport. 5. The same copy-forgery-inhibited pattern printing is performed on the surface of the non-contact type IC sticking medium and the surface of the booklet-shaped printed matter on the side where the non-contact type IC sticking medium is stuck. The book-form printed matter according to any one of claims 1 to 3. 6. The booklet according to claim 1, wherein a mark indicating a position where a non-contact type IC sticking medium is to be attached is printed on the booklet-shaped printed matter. Printed matter.