JP4993075B2 - Non-contact IC module mounting booklet - Google Patents

Description

The present invention relates to a booklet such as a passbook or a passport on which a non-contact IC module capable of communicating with a non-contact IC card reader / writer is mounted.

Patent Document 1 discloses a passbook printing apparatus that thermally transfers and prints the color face image of a passbook holder and character information such as personal information for a passbook having a wireless IC chip (memory medium) capable of contactless communication. Is introduced.
In the passbooks having built-in wireless IC chips capable of non-contact communication introduced in Patent Document 1, the passbooks themselves can be used even when there is no problem in the operation of the wireless IC chips capable of non-contact communication when the passbooks are manufactured. Due to poor external appearance, it may not be possible to ship as a product.
For this reason, in a passbook with a built-in wireless IC chip capable of non-contact communication, the yield of expensive wireless IC chips capable of non-contact communication is low, which is likely to contribute to an increase in manufacturing cost.
Also, a micro-crack is generated in the wireless IC chip capable of non-contact communication due to a physical load at the time of manufacture of the bank book, and the wireless IC chip capable of non-contact communication operating at the time of factory shipment inspection is replaced with the bank book. There is a possibility that a micro-crack may grow into a crack that breaks a wireless IC chip capable of non-contact communication due to a physical load when the owner's passbook is used.
Furthermore, for some ATM devices (automatic deposit / withdrawal devices), non-contact communication is possible with the built-in feed roller, etc., when the transaction details are printed in the main text of the passbook. In some cases, it passes through a wireless IC chip or the like.
In this case, the internal stress generated in the wireless IC chip capable of non-contact communication every time an ATM device or the like is used may eventually cause the wireless IC chip capable of non-contact communication to break down.
Furthermore, the wireless IC chip capable of contactless communication is destroyed by a physical load such as bending stress when the passbook holder carries a wireless IC chip capable of contactless communication. there is a possibility.
That is, a passbook with a built-in wireless IC chip capable of contactless communication may be inferior in physical reliability.
Patent Document 2 introduces a booklet having a non-contact data carrier provided with a coil antenna.
In a booklet having a non-contact data carrier equipped with a coil antenna, there is a problem of micro cracks in a wireless IC chip capable of non-contact communication due to a load at the time of manufacturing the passbook in Patent Document 1, and non-contact by a feed roller such as an ATM device. The problem of destroying the wireless IC chip capable of contact communication and the problem of destroying the wireless IC chip capable of non-contact communication due to a physical load such as bending stress when carrying a passbook do not occur.
However, in the non-contact data carrier provided with the coil antenna of Patent Document 2, since the opening area of the coil antenna is small, the magnetic flux passing through the external processing device (non-contact reader / writer) is small and sufficient electromotive force is generated. It cannot be used, and can only be used in close contact with the external processing apparatus.
Further, the IC passport requires a communication distance of a proximity non-contact IC card of ISO / IEC14443.
For this reason, the booklet having a non-contact data carrier provided with the coil antenna of Patent Document 2 can only be used in close contact with an external processing device, and is not suitable for an IC passport.
JP 2006-281667 A Japanese Patent Laid-Open No. 2002-42067

For this reason, the present invention suppresses manufacturing costs and has high physical reliability in booklets such as passbooks and passports on which non-contact IC modules are mounted, and is close to non-contact IC card reader / writers. It is an object of the present invention to provide a booklet such as a passbook or passport on which a non-contact IC module that can be used is mounted.

A first aspect of the present invention is a booklet such as a passbook or passport that mounts a non-contact IC module unit that can communicate with a non-contact IC card reader / writer, and either the front cover part or the back cover part of the booklet. The front cover part or back cover of the booklet having at least one booster antenna on one side, having a corner cut on either one of the left and right lower ends of the booklet, and having only the at least one booster antenna A non-contact IC module with a non-contact IC chip with a built-in printed coil antenna is adhered to a position corresponding to the corner cut portion so as not to overlap the main body. This is an IC module mounting booklet.
more than

According to a second aspect of the present invention, the shape of the non-contact IC module mounted with a non-contact IC chip with a built-in printed coil antenna according to the first aspect is a triangular shape, and two sides of the triangular shape are outer peripheral portions of a booklet main body. The non-contact IC module mounting booklet has a configuration in which one side of the triangular shape is bonded to a position parallel to one side of the booster antenna.

According to a third aspect of the present invention, the arrangement of the non-contact IC chip mounted with the non-contact IC chip with built-in printed coil antenna and the booster antenna according to the first aspect is the non-contact IC with built-in non-contact IC chip with built-in printed coil antenna The non-contact IC module mounting booklet is characterized in that the booster antenna is arranged at a position where it does not overlap with more than half of the module.

The present invention relates to a booklet such as a passbook or passport that mounts a non-contact IC module that can communicate with a non-contact IC card reader / writer, and only one or more booster antennas are attached to either the front cover part or the back cover part of the booklet. Non-contact IC with built-in non-contact IC chip with built-in printed coil antenna on the back side of booklet cover with booster antenna after corner cut etc. at any one of the left and right lower ends of booklet text The module is bonded to a position that does not overlap the corner cut etc. of the booklet text.
For this reason, the non-contact IC module is not subjected to a physical load at the time of booklet manufacturing, so that a micro-crack due to the physical load at the time of booklet manufacturing does not occur in the non-contact IC chip, and the physical when the booklet is used. The micro-crack on the non-contact IC chip does not grow into a crack that breaks the non-contact IC chip due to a general load.
Furthermore, when booklets are manufactured, the non-contact IC chip connected to the printed coil antenna is not built in the front cover or back cover of the booklet. Manufacturing defects are not caused by defects, and the yield of non-contact IC chips and the like is high, so that manufacturing costs can be kept low.
In addition, since the non-contact IC module is bonded to the bottom lower part of the cover part of the booster antenna-formed booklet, the feed roller of the ATM device or the like does not pass, so the problem of destroying the non-contact IC chip by the feed roller of the ATM device or the like Does not occur.
Further, since the non-contact IC module protects the non-contact IC chip with a printed circuit board material or the like, there is no problem of breaking the non-contact IC chip due to a physical load such as bending stress when using booklets.
In combination with the above effects, in the present invention, since one or more booster antennas having a wide opening for generating sufficient electromotive force in the non-contact IC chip are provided in one booklet cover, It has an excellent effect that a communication distance of a proximity type with a contact IC card reader / writer can be obtained.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings, taking a magnetic passbook as an example.
FIG. 1 is an explanatory diagram of the overall configuration of the present invention.
FIG. 2 is a cross-sectional view of the front cover portion of the present invention.
FIG. 3 is an explanatory diagram in which two booster antennas of the present invention are formed on the front cover.
FIG. 4 is an explanatory diagram of a magnetic passbook cover portion in which a booster antenna is formed with multiple impositions according to the present invention.
FIG. 5 is a diagram illustrating the configuration of the multilayer printed board for a non-contact IC module of the present invention.

[overall structure]
The overall configuration of the present invention will be described with reference to FIG.
In the upper part of FIG. 1, a printed coil antenna 1 is formed by etching on a printed circuit board, and both ends of the printed coil antenna and a connection pad of the non-contact IC chip 2 are connected by wire bonding and then resin-sealed. The internal structure of the non-contact IC module 3 to be obtained is shown.
The shape of the non-contact IC module 3 is a triangular shape as shown in the upper part of FIG. 1, with two sides of the non-contact IC module 3 being the outer periphery of the magnetic passbook 4 and one side of the non-contact IC module 3 being a booster antenna. The shape is parallel to one side.
This is because the opening of the non-contact IC module 3 becomes large and the electromotive force from the booster antenna 6 can be increased.
Furthermore, since the triangular shape has no corners compared to the quadrangular shape, even if the magnetic passbook 4 is bent, the magnetic passbook 4 is not damaged.
1 shows that only the booster antenna 6 is built in the front cover portion 5 of the magnetic passbook 4.
In addition, the non-contact IC module 3 is adhered to the bottom left bottom surface of the front cover portion 5 of the magnetic passbook 4.
The bankbook text 7 indicates that a corner cut portion 8 is formed at the lower left corner.
The corner cut portion 8 is formed so that the non-contact IC module 3 and the passbook text 7 do not overlap.
Further, in the lower diagram of FIG. 1, since the simple magnetic passbook and the magnetic passbook 4 of the present invention may be used together, the magnetic tape portion 11 is formed on the back cover portion surface 10 of the magnetic passbook 4. It is shown that.
For example, until all ATM devices and the like are equipped with a non-contact IC card reader / writer, even the magnetic passbook 4 of the present invention is processed by the information on the magnetic tape unit 11 in the non-contact IC card reader / writer-installed ATM device and the like. Since it is necessary, the magnetic tape part 11 needs to be formed.
When the booster antenna 6 is incorporated in the magnetic passbook cover part, the booster antenna 6 causes minute irregularities on the surface of the magnetic passbook cover part.
If the magnetic tape portion is formed in the portion where the minute unevenness is generated, the reading of the magnetic tape portion of an ATM device or the like has an adverse effect such as fluctuation of magnetic output.
For this reason, in the magnetic passbook 4 of this invention, the booster antenna 6 is not formed in the back cover part 9 which the magnetic tape part 11 forms.

[Booster antenna section]
FIG. 2 shows a cross-sectional view of the front cover portion 5 of the magnetic passbook 4.
Between the cross cover 12 and the lining paper 13, only a booster antenna 6 in which a known solvent-based conductive paste is formed by silk printing is incorporated.
In addition, although the booster antenna 6 formed the solvent type conductive paste by silk printing, other booster antennas, such as a wound coil made of a coated copper wire, or a conductive material such as an aluminum foil layer or a copper foil layer, are used. It may be a booster antenna formed of a foil layer and formed by photoetching a conductive foil layer laminated on one side of an insulating base material that is a base base material.
In addition, although PET (polyethylene terephthalate), a polyimide, a polycarbonate, etc. are used for the insulating material which is a base substrate, it is not limited to this.
Regarding the manufacture of the booster antenna 6 of the present invention, as an example, the booster antenna 6 is printed on a predetermined position on the back surface of the continuous lining paper 13 by using a silk printing machine with a solvent-based conductive paste, and wound up after drying.
On the surface of the continuous lining paper 13 on which the booster antenna 6 is silk-printed, a known dry laminator is used to coat a dry laminator with a solvent contained in the dry laminating adhesive after coating the entire surface with a known dry laminating adhesive. After being vaporized in a drying oven, the laminate was obtained by laminating with a continuous cloth cover 12.
In FIG. 1, only one booster antenna 6 is illustrated. However, for example, the non-contact IC chip 2 mounted on the non-contact IC module unit 3 requires a larger electromotive force than the single booster antenna 6. If so, as shown in FIG. 3, an outer periphery forming booster antenna 6 a may be further formed on the outer periphery of the booster antenna 6.

[Manufacture of passbooks and corner cuts]
FIG. 4 shows a magnetic passbook cover portion 14 formed by the booster antenna 6 with multiple impositions.
The left half in which the booster antenna 6 of the magnetic passbook cover 14 is built becomes the cover 5 of the magnetic passbook 4, and the right half becomes the back cover 9 of the magnetic passbook 4.
This magnetic passbook cover part 14 is a known magnetic passbook manufacturing process, and is first finished as a magnetic passbook containing only the booster antenna 6 in which the corner cut portion is not formed.
As a method for forming the lower left corner cut section 8 of the bankbook text 7, as an example, the front cover and back cover sections of the magnetic bankbook are opened, and only the lower left corner of the bankbook text is put into a cutting machine and cut. A corner cut portion 8 is formed.
The corner cut portion 8 is sized so that the non-contact IC module 3 and the passbook text 7 do not overlap when the non-contact IC module 3 is adhered to the back surface of the lower left end of the front cover portion 5 of the magnetic passbook 4. Cut.

[Manufacture of non-contact IC modules]
The production of the non-contact IC module 3 will be described.
As an example, the non-contact IC module 3 is a printed circuit board in which copper foil is formed on both surfaces of a known printed circuit board material such as FR4 or BT resin, and the printed coil antenna 1 and both ends of the printed coil antenna are connected to the surface by photoetching. Form a pat.
Further, although not shown, there is a printed coil antenna wiring portion for avoiding overlapping of the printed coils on the front surface on the back surface, and the printed coil antenna wiring portion is connected to the front surface printed coil antenna by a through hole.
After mounting the non-contact IC chip 2 from the die bonder, the connection pads of the non-contact IC chip 2 and the connection pads at both ends of the printed coil antenna are connected by wire bonding, then sealed with a known sealing resin and cured to a predetermined size. It is obtained by finishing.
Note that the non-contact IC chip 2 may be mounted by flip chip mounting. That is, a stat bump or the like is formed on the connection pad of the non-contact IC chip 2 and connected to the connection pads at both ends of the printed coil antenna by a known anisotropic conductive film.
Further, when the non-contact IC chip 2 has a CPU, a large electromotive force is required.
In this case, the number of turns of the printed coil 1 of the non-contact IC module 3 may be increased by a multilayer printed board by a build-up process using a conductive paste.
As an example, FIG. 5 shows a configuration of a multilayer printed board by a build-up process using a conductive paste before bonding.
The double-sided copper-clad printed circuit board 15 is formed by forming through-hole portions 16 at the end portions of the front and back printed coil antennas 1a and 1b after forming the printed coil antennas 1a and 1b on both sides by photoetching. A core substrate 17 in which 1a and 1b are conducted is obtained.
On the copper foil 18, the conductive paste is repeated several times by silk printing to obtain conical conductive paste columns 19 and 19a.
Along with the prepreg 20 subjected to the penetration treatment into which the conductive paste columns 19 and 19a enter, they are arranged on both surfaces of the core substrate 17, and adhesion by the prepreg 20 and press bonding of the conductive paste columns 19 and 19a are performed.
For this reason, the conductive paste column 19 of the copper foil 18 on the back surface and the printed coil antenna 1a on the back surface of the core substrate 17 are connected, and the conductive paste column 19a of the copper foil 18 on the front surface and the printed coil antenna 1b of the core substrate 17 are connected. Are connected to each other.
Further, although not shown, after the printed coil antenna is formed on the back surface such as the printed coil antenna 1 and the connection pad by photoetching, the non-contact IC chip 2 is mounted by the die bonder, and then the non-contact IC chip 2 is mounted. After connecting the connection pad and both ends of the printed coil antenna 1 by wire bonding, sealing with a known sealing resin, curing and finishing to a predetermined size, a non-contact IC module 3 using a multilayer printed board is obtained.

[Implementation of non-contact IC module to bankbook]
As an example, a known acrylic pressure-sensitive heat-sensitive adhesive film is attached to the back surface of the non-contact IC module 3 and then adhered to the bottom left back surface portion of the front cover portion 5 of the magnetic passbook 4 by thermocompression bonding.
The total thickness of the non-contact IC module 3 and the known acrylic pressure-sensitive heat-sensitive adhesive film is
The total thickness of the passbook text 7 should be the same or thinner.
Even if there is no problem in the operation of the non-contact IC chip, the magnetic passbook with the built-in non-contact IC chip becomes a defective product due to a defective appearance of the passbook when the magnetic passbook is manufactured.
In the present invention, since the non-contact IC module 3 is bonded after the magnetic passbook 4 is completed, the yield of expensive non-contact IC chips and the like is high, and the manufacturing cost can be kept low.
In addition, in a magnetic passbook with a built-in non-contact IC chip, a non-contact IC chip that has been operating at the time of factory shipment inspection due to a micro crack generated in the non-contact IC chip due to a physical load at the time of manufacture is Due to a heavy load, there is a possibility that micro cracks grow into cracks that destroy the non-contact IC chip.
For this reason, it is generally necessary to perform screening such as a thermal shock test, but the magnetic passbook itself is mainly paper.
For this reason, since the magnetic passbook itself is damaged by the heating and cooling heat during the thermal shock test, screening cannot be performed.
In the present invention, since the non-contact IC module 3 is bonded after the magnetic passbook 4 is completed, no physical load is applied to the non-contact IC chip 2 at the time of manufacturing the magnetic passbook, so that screening is unnecessary.
In the present invention, since the non-contact IC module 3 is bonded to the lower left end portion, a non-contact IC chip 2 is not destroyed because a feed roller such as an ATM device does not pass through.
Further, since the non-contact IC module 3 protects the non-contact IC chip 2, the non-contact IC chip 2 is not destroyed by a physical load due to bending stress or the like when the depositor is used.
For this reason, in the present invention, it is possible to obtain high physical reliability.
Moreover, the non-contact IC module 3 and the booster antenna 6 or the non-contact IC module 3 and the outer peripheral portion formation booster antenna 6a are preferably in a slightly overlapping state.

[Description of communication method]
The booster antenna 6 can be formed larger than the printed coil antenna 1 of the non-contact IC module 3.
Thereby, since the resonance peak of the signal from the non-contact IC card reader / writer can be taken large, it is possible to perform long-distance communication as compared with the single unit of the printed coil antenna 1 of the non-contact IC module 3.
Further, the booster antenna 6 receives the electromagnetic wave from the non-contact IC card reader / writer as a primary coil antenna.
The printed coil antenna 1 of the non-contact IC module 3 that is electromagnetically coupled to the booster antenna 6 serves as a secondary coil antenna, and exchanges signals.
For this reason, the booster antenna 6 has a larger opening and more magnetic flux to pass than the printed coil antenna 1 of the non-contact IC module 3 alone, so that a large electromotive force can be obtained.
In the case where the outer periphery forming booster antenna 6a is further formed on the outer periphery of the booster antenna 6 shown in FIG. 3, the outer periphery forming booster antenna 6a and the booster antenna 6 are also electromagnetically coupled. Furthermore, since the opening is large and the magnetic flux passing therethrough increases, a large electromotive force can be obtained.
Further, it has been described that the non-contact IC module 3 and the booster antenna 6 or the non-contact IC module 3 and the outer peripheral portion forming booster antenna 6a preferably overlap each other, but this is a small antenna built in the non-contact IC module 3. This is because the state of electromagnetic coupling is the strongest.
For this reason, in this invention, arrangement | positioning of the non-contact IC module 3 and the booster antenna 6 is arrange | positioned in the position where the booster antenna 6 does not overlap with the half or more of the non-contact IC module 3. .

[Counterfeit Countermeasures]
As described in detail above, the present invention incorporates only the booster antenna 6 in the front cover portion 5 of the magnetic passbook 4, has the corner cut portion 8 at the lower left corner of the passbook body 7, and is a non-contact IC chip. 2 and the printed coil antenna 1 of the printed circuit board are bonded to a position that does not overlap the corner cut portion 8 on the back side of the lower left portion of the front cover.
For this reason, when the non-contact IC module 3 is peeled off from the magnetic passbook 4 and used after being bonded to another magnetic passbook 4, it is necessary to immediately determine with an ATM device or the like.
For example, the booster antenna 6 is prepared in several patterns with different resonance points. The front cover of the magnetic passbook 4 contains one booster antenna 6 arbitrarily selected from several patterns having different resonance points.
When the magnetic passbook 4 is issued, a non-contact IC card reader / writer built in the issuing machine measures the resonance point of each booster antenna, and the measurement result is encrypted and recorded in the IC memory unit of the non-contact IC chip 2.
For the authenticity determination, the non-contact IC card reader / writer built in the ATM device or the like measures the resonance point of the booster antenna 6 built in the front cover 5 of the magnetic passbook 4 and stores it in the IC memory section of the non-contact IC chip 2. The measured values such as the resonance point of the booster antenna 6 at the time of issuance, which is encrypted and recorded, are compared and verified by the ATM device after decryption, and if they are different, it is determined to be false.
At the time of issuance, the magnetic passbook number and the like are printed as optically readable information such as OCR characters and bar codes on the inside of the back cover of the magnetic passbook 4.
Furthermore, in the non-contact IC card reader / writer of the magnetic passbook 4 issuing machine, the magnetic passbook number printed on the back cover of the magnetic passbook 4 at the time of issuance is optically readable information such as OCR characters and barcodes. Then, it is encrypted and recorded in the IC memory part of the non-contact IC chip 2.
The authenticity determination is made by optically reading information such as OCR characters or bar codes printed on the back cover of the magnetic passbook 4 by the optical information reading device built in the ATM device, etc. The contact IC card reader / writer reads the information that is encrypted and recorded in the IC memory part of the non-contact IC chip 2 and compares it with the decrypted information using an ATM device or the like. It may be a thing.
Further, when the non-contact IC module 3 is to be peeled off from the magnetic passbook 4, the non-contact IC module 3 is peeled off at a part of the stacked antenna portions of the non-contact IC module 3 to make the operation impossible. There may be.

[Modification]
It has been described that the total thickness of the non-contact IC module 3 and the known acrylic pressure-sensitive heat-sensitive adhesive film is the same as or thinner than the total thickness of the passbook text 7.
When the non-contact IC module 3 is thin, that is, when the total thickness of the thin non-contact IC module and the known acrylic pressure-sensitive heat-sensitive adhesive film is equal to or thinner than half the thickness of the passbook text 7.
In this case, in the manufacturing process of the magnetic passbook 4, the corner cut portion 8 is processed with the passbook text 7 opened, and then manufactured in a known magnetic passbook manufacturing process.
Thereafter, the thin non-contact IC module is bonded by the method described in the above embodiment.

[Examples other than magnetic passbook]
Although the present invention has been described with the magnetic passbook, it can be applied to an IC passport or the like.
A booster antenna is formed on the cover of the booklet passport, and a non-contact IC module is bonded to the lower left end of the cover.
A corner cut portion is formed at the lower left corner of the text so that the booklet text itself and the non-contact IC module do not overlap.
Also, a face photograph or the like is formed on the back surface of the back cover. In other words, since the booster antenna and the non-contact IC module are not arranged on the face-photograph forming surface of the back cover, it has an excellent feature that does not select the printing method of the printer that forms the face-photograph.
In addition, the IC passport requires the communication distance of the proximity contactless IC card of ISO / IEC14443, but in the present invention, the communication distance of the proximity contactless IC card of ISO / IEC14443 is excellent by the booster antenna. Has characteristics.
Furthermore, in the case of an IC passport, it is necessary to prevent destruction of the non-contact IC chip or the like by imprinting at the time of immigration.
In the present invention, since the non-contact IC module is bonded to the lower left corner of the IC passport cover, it has an excellent feature that there is little fear of the non-contact IC chip being destroyed by imprinting at the time of immigration.
Furthermore, since there is no problem of destruction of the non-contact IC chip due to bending stress caused by carrying the IC passport holder, it is possible to provide an IC passport boasting high physical reliability.

Illustration of overall configuration Front cover cross section Illustration of two booster antennas formed on the front cover Explanatory drawing of the cover of the magnetic passbook with a multi-sided booster antenna Configuration diagram of multilayer printed circuit board for non-contact IC module

Explanation of symbols

1: Printed coil antenna 1a: Printed coil antenna on the back side of the core board 1b: Printed coil antenna on the front side of the core board 2: Non-contact IC chip 3: Non-contact IC module 4: Magnetic passbook 5: Cover cover 6: Booster antenna 6a: Perimeter forming booster antenna 7: Passbook text 8: Corner cut part 9: Back cover part 10: Back cover part surface 11: Magnetic tape part 12: Cross cover 13: Lined paper 14: Magnetic passbook cover part 15: Double-sided copper drawing Printed circuit board 16: Through-hole portion 17: Core substrate 18: Copper foil 19: Back surface conductive paste column 19a: Front surface conductive paste column 20: Prepreg

Claims (3)

In booklets such as passbooks and passports that mount non-contact IC module units that can communicate with non-contact IC card reader / writers, only at least one booster antenna is provided on either the front cover part or the back cover part of the booklet. The booklet has a corner cut on one of the left and right lower ends of the text, and is printed on the back side of either the front cover part or the back cover part of the booklet having only the at least one booster antenna. A non-contact IC module mounting booklet having a configuration in which a non-contact IC module with a coil antenna built-in is attached to a position corresponding to the corner cut portion so as not to overlap the body . The shape of the non-contact IC module mounted with a non-contact IC chip with a built-in printed coil antenna according to claim 1 is a triangular shape, two sides of the triangular shape are outer peripheral portions of booklets, and one side of the triangular shape is a booster antenna. A non-contact IC module mounting booklet, characterized in that it has a configuration in which it is adhered to a position parallel to one side. The arrangement of the non-contact IC module mounted with a non-contact IC chip with a built-in printed coil antenna and the booster antenna according to claim 1 is such that a booster antenna overlaps with more than half of the non-contact IC module with a non-contact IC chip built-in printed coil antenna. A non-contact IC module mounting booklet, which is arranged at a position where it does not become.

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