JP4657831B2 - Non-contact type IC label manufacturing method - Google Patents

Description

The present invention relates to a method for manufacturing a non-contact type IC label writing and reading that are capable of information in a non-contact state.

  In recent years, with the progress of the information-oriented society, information is recorded on a card, and information management and settlement using the card are performed. In addition, information is recorded on a label attached to a product or the like, and management of the product or the like using this label is also performed.

  In information management using such a card or label, a non-contact type IC card or a non-contact type in which an IC chip capable of writing and reading information in a non-contact state on the card or label is mounted. Type IC labels are rapidly spreading due to their excellent convenience.

  8A and 8B are diagrams showing a configuration example of a general non-contact type IC label. FIG. 8A is a diagram showing an internal structure, and FIG. 8B is a cross-sectional view taken along line AA ′ shown in FIG. .

  In this configuration example, as shown in FIG. 8, an antenna 412 made of a coiled conductive material and a contact 413 made of a conductive material are formed on one surface of a base substrate 414 made of paper or the like, An IC chip 411 capable of writing and reading information from the outside in a non-contact state via the antenna 412 is mounted, and an adhesive 420 is applied to the surface of the base substrate 414 on which the antenna 412 is formed, The release paper 440 is detachably attached by the adhesive 420. The contact 413 is formed at both ends of the coiled antenna 412, and the IC chip 411 is bonded onto the base substrate 414 with a conductive adhesive (not shown) so that the IC chip 411 is connected to the contact 413. Thus, a circuit including the antenna 412, the contact 413, and the IC chip 411 is formed.

  In the non-contact type IC label 401 configured as described above, the release paper 440 is peeled off and attached to an adherend such as an article with an adhesive 420, and an information writing / reading device (externally provided) ( (Not shown), a current flows to the antenna 412 by electromagnetic induction from the information writing / reading device, and this current is supplied to the IC chip 411 via the contact 413. Information is written to the IC chip 411 from the information writing / reading device, and information written to the IC chip 411 is read by the information writing / reading device.

  Here, the non-contact type IC label 401 as described above may be used as a sealed label for the purpose of preventing counterfeiting of products. In that case, the non-contact type IC label 401 is used by being attached to an adherend such as an article. Later, it is necessary to prevent unauthorized reuse.

  Therefore, a release agent is applied to a part of the area where the antenna of the base substrate is formed, and an antenna made of a metal thin film is formed thereon by vapor deposition or etching, and then the antenna of the base substrate is formed. When the adhesive is applied to the entire surface, and the non-contact type IC label is peeled off from the adherend after being attached to the adherend, among the antennas formed on the base substrate, The part formed in the area where the release agent is not applied is peeled off from the adherend, and the part formed in the area where the release agent is applied is peeled off from the base substrate to form an adherend together with the adhesive. A technique for remaining the image is considered (for example, see Patent Document 1). In the non-contact type IC label configured in this way, when peeled from the adherend after being attached to the adherend, the release agent is not applied among the antennas formed on the base substrate. Since the part formed in the area peels off from the adherend, and the part formed in the area where the release agent is applied peels off from the base substrate and remains on the adherend together with the adhesive, the antenna is disconnected. Thus, it can be prevented from functioning as a non-contact type IC label and illegally reused.

Here, in the non-contact type IC label as described above, when the adhesive is applied to the surface on which the antenna is formed, the antenna may be peeled off from the base substrate by the adhesive application work, It will be difficult to achieve high productivity. Therefore, if a double-sided tape is used as the adhesive, the adhesive can be applied to the base substrate by sticking this double-sided tape on the surface of the base substrate on which the antenna is formed. When the adhesive is applied to the base substrate, the antenna can be prevented from peeling off from the base substrate, and high productivity can be realized.
JP 2000-105806 A

  However, when double-sided tape is used as the adhesive for non-contact type IC labels, as described above, a release agent is applied to a part of the area of the base substrate where the antenna is formed, and the antenna is formed thereon. Then, even when the non-contact type IC label is peeled off from the adherend after the non-contact type IC label is attached to the adherend, as a configuration in which an adhesive is applied to the entire surface of the base substrate where the antenna is formed, The adhesive itself is difficult to break, making it difficult to disconnect the antenna.

  For example, when using an adhesive in which an adhesive is applied to both surfaces of a substrate, when the non-contact IC label is peeled off from the adherend after being attached to the adherend, Since the base material is difficult to break, it is difficult to disconnect the antenna.

  In addition, when a baseless double-sided tape is used as an adhesive, there is no double-sided tape base, but the baseless double-sided tape aggregates the adhesive to maintain its shape without using the base. Since it is configured so that the force is strong, the shear holding force is strong, and thus, when the non-contact type IC label is attached to the adherend and then peeled off from the adherend, the adhesive as described above It is difficult to break itself, and it is difficult to disconnect the antenna.

  When the adhesive having strong cohesive force is used as the adhesive for the non-contact type IC label, such as the above-mentioned substrate-less double-sided tape, after the non-contact type IC label is attached to the adherend, When peeled off, there is a problem that the adhesive itself is not easily broken and it is difficult to disconnect the antenna.

The present invention has been made in view of the problems of the conventional techniques as described above, and prevents unauthorized reuse even when a cohesive having a strong cohesive force is used. and to provide a method of manufacturing a non-contact type IC label that can.

In order to achieve the above object, the present invention provides:
An IC chip in which a conductive pattern is formed on one surface of the base substrate and information can be written and read through the conductive pattern in a non-contact state is the conductive pattern of the base substrate. writing and reading of information in a non-contact state via a mounted on possible a position, the pressure-sensitive adhesive on one surface of the base material is applied, prior SL adhesive, conductive of the base substrate Non-contact type IC label having a half slit cut in the thickness direction so as not to penetrate the front and back of the adhesive from the opposite side of the base substrate so as to divide the region where the adhesive pattern is formed A manufacturing method of
Forming the conductive pattern on the base substrate;
Mounting the IC chip at a position where information can be written and read in a non-contact state through the conductive pattern of the base substrate;
Forming a half slit that does not penetrate the front and back of the adhesive from the side opposite to the first release paper on the adhesive applied on the first release paper;
A step of attaching a second release paper to the surface of the pressure-sensitive adhesive on which the half slit is formed;
Peeling the first release paper from the adhesive;
And applying a pressure-sensitive adhesive from which the first release paper has been peeled off to one surface of the base substrate.

  In the present invention configured as described above, after being attached to the adherend by the adhesive applied to one surface of the base substrate, the state in which the adhesive is attached to the base substrate, When peeling begins at the interface between the adherend and the adhesive, the adhesive on the upstream side in the peeling direction with respect to the slit is continuously attached to the base substrate in the area where the slit is provided in the adhesive. While trying to peel off from the body, the adhesive on the downstream side in the peeling direction with respect to the slit tries to remain attached to the adherend, so that the upstream side and the downstream side in the peeling direction differ through the slit. A force is generated in the direction, and the base substrate is broken by the force. Therefore, when the slit is formed so as to divide the region where the conductive pattern of the base substrate is formed, the base substrate is broken and the conductive pattern is disconnected, thereby forming a non-contact type IC label. It can be prevented from functioning and being reused illegally.

  Further, the half slit is formed by irradiating the adhesive applied on the first release paper with a laser beam from the side opposite to the first release paper.

  As described above, in the present invention, the adhesive applied to one surface of the base substrate on which the conductive pattern is formed has a thickness so as to divide the region of the base substrate on which the conductive pattern is formed. Since the structure has a slit cut in the vertical direction, the adhesive is adhered to the base substrate after being adhered to the adherend by the adhesive applied to the base substrate, that is, the adherend. If the adhesive starts to peel off at the interface between the adhesive and the adhesive, the base substrate will break in the area where the adhesive is slit and the conductive pattern will be disconnected. Even if it is, it is possible to prevent unauthorized reuse.

  When the slit provided in the adhesive is a half slit that is cut from the side opposite to the base substrate and does not penetrate the front and back of the adhesive, a step of forming a conductive pattern on the base substrate, and the base A step of mounting an IC chip at a position where writing and reading of information can be performed in a non-contact state via a conductive pattern of the base material, and a first release on the adhesive applied on the first release paper A step of forming a half slit that does not penetrate the front and back of the pressure-sensitive adhesive from the side opposite to the paper, a step of attaching a second release paper to the surface on which the half slit of the pressure-sensitive adhesive is formed, and a first step from the pressure-sensitive adhesive. If a non-contact type IC label is manufactured by the process of peeling the release paper and the process of applying the adhesive from which the first release paper has been peeled to one surface of the base substrate, a slit is formed in the adhesive. After this adhesive Since it can be applied to the base substrate, the half slit can be formed without damaging the conductive pattern and the IC chip, and the half slit was cut from the side opposite to the base substrate. This half slit makes it easy to divide the adhesive together with the base substrate from the side to be peeled off from the adherend and the side to remain on the adherend, thereby making the base substrate easy to break. be able to.

  Moreover, in what forms a half slit by irradiating the adhesive provided on the 1st release paper with a laser beam from the opposite side to the 1st release paper, from a thermosetting adhesive as an adhesive If such a thing is used, it can avoid that the surface of the area | region in which the half slit was formed hardens | cures with a heat | fever, and then the area | region in which the half slit was formed will adhere again.

  Embodiments of the present invention will be described below with reference to the drawings.

(First embodiment)
FIG. 1 is a view showing a first embodiment of a non-contact type IC label of the present invention, (a) is a view showing a structure of a sticking surface to an adherend, and (b) is (a). It is AA 'sectional drawing shown in FIG.

  In this embodiment, as shown in FIG. 1, a coiled antenna 112 and a contact 113 that are conductive patterns are formed on one surface of a base substrate 114 made of paper, and from the outside through the antenna 112. An IC chip 111 capable of writing and reading information in a non-contact state is mounted, and further, a baseless double-sided tape is used as a strong cohesive adhesive on the surface of the base base 114 on which the antenna 112 is formed. The adhesive 120 is applied by being affixed, and a release paper 140 is detachably attached to the surface of the adhesive 120 opposite to the base substrate 114. The conductive pattern is formed by the antenna 112 and the contact 113, and the contact 113 is formed at both ends of the coiled antenna 112. A conductive adhesive (not shown) is connected to the contact 113 so that the IC chip 111 is connected. The IC chip 111 is adhered onto the base substrate 114 by the above-described method, whereby a circuit including the antenna 112, the contact 113, and the IC chip 111 is formed. That is, the IC chip 111 is mounted at a position where information can be written and read out in a non-contact state via the antenna 112 and the contact 113 of the base substrate 114. The adhesive 120 is formed with a plurality of half slits 130 that are cut in the thickness direction of the adhesive 120 from the side opposite to the base substrate 114 and do not penetrate the front and back of the adhesive 120. That is, the half slit 130 is formed in the adhesive 120 so as to divide the region where the antenna 112 of the base substrate 114 is formed into a plurality of parts.

  In the non-contact type IC label 101 configured as described above, the release paper 140 is peeled off and attached to an adherend such as an article by the adhesive 120, and an information writing / reading device (externally provided) ( (Not shown) causes a current to flow through the antenna 112 by electromagnetic induction from the information writing / reading device, and this current is supplied to the IC chip 111 via the contact 113, so that in a non-contact state, Information is written to the IC chip 111 from the information writing / reading device, and information written to the IC chip 111 is read by the information writing / reading device.

  Below, the manufacturing method of the non-contact type IC label 101 mentioned above is demonstrated.

  FIG. 2 is a diagram for explaining a method of manufacturing the non-contact type IC label 101 shown in FIG.

  First, the antenna 112 and the contact 113 are formed on one surface of the base substrate 114 by a method such as screen printing using a conductive paste containing conductive particles and a resin material (FIG. 2A). Note that the antenna 112 and the contact 113 may be formed from a metal thin film by vapor deposition or etching, not limited to screen printing using a conductive paste.

  Next, the IC chip 111 is mounted on the base substrate 114 so as to be connected to the contact 113, and the IC chip 111 is bonded onto the base substrate 114 with a conductive adhesive (not shown) (FIG. 2B). )). Thereby, the IC chip 111 is electrically connected to the contact 113, and a circuit including the antenna 112, the contact 113, and the IC chip 111 is formed.

  Further, the first release paper 150 is irradiated with a laser beam from the side opposite to the release paper 150 of the base-less double-sided tape in which an acrylic, natural rubber, or silicone-based adhesive 120 is applied. Thus, a half slit 130 that does not penetrate the adhesive 120 is formed in the adhesive 120 (FIG. 2C). At this time, the formation depth of the half slit 130 is adjusted by adjusting the irradiation output of the laser beam. Moreover, as a base-material-less double-sided tape, it is possible to use 3M adhesive transfer tape 468MP (made by Sumitomo 3M Co., Ltd.), for example. At this time, if a baseless double-sided tape made of a thermosetting adhesive such as a silicone-based adhesive is used, when the half slit 130 is formed by irradiating laser light as described above, the adhesive The surface of the region in which the 120 half slits 130 are formed is cured by heat, and then the region in which the half slits 130 are formed is not attached again.

  Next, the 2nd release paper 140 is stuck on the surface in which the half slit 130 of the adhesive 120 was formed (FIG.2 (d)).

  Thereafter, the release paper 150 is peeled off from the adhesive 120, and the adhesive 120 having the release paper 140 attached to one surface is attached to the surface of the base substrate 114 where the antenna 112 is formed. The non-contact type IC label 101 as shown in FIG. 2 is completed (FIG. 2E). The release papers 140 and 150 may be configured by, for example, using paper or a film as a base material and applying a fluorine-based release agent such as silicone fluoride on one surface thereof. As described above, the release paper 140 on the side where the half slits 130 were formed was attached to the adhesive 120 in order to attach the baseless double-sided tape to the base substrate 114 in a state where the release paper 140 was not peeled off. In this state, it is necessary to peel off the release paper 150 on the side where the half slit 130 is not formed. Therefore, it is preferable to use different types of release agents to be applied to the two release papers 140 and 150. The release paper 150 on the side where the slits 130 are not formed is peeled off more easily than the release paper 140 on the side where the half slits 130 are formed. It is preferred.

  In this way, the adhesive 120 is applied to the base substrate 114 by sticking the substrate-less double-sided tape to the surface of the base substrate 114 where the antenna 112 is formed. Therefore, the antenna 112 is not peeled off from the base substrate 114 or the productivity is not lowered.

  Since the adhesive 120 is attached to the base substrate 114 after the half slit 130 is formed in the adhesive 120 in this way, the surface of the base substrate 114 on which the antenna 112 is formed as in this embodiment. Even when the adhesive 120 having the half slits 130 is attached, the half slits 130 can be formed in the adhesive 120 without damaging the antenna 112. Thereby, the pattern of the half slit 130 can be set without being influenced by the shape of the antenna 112 formed on the base substrate 114, and stable fragility can be imparted.

  Moreover, when the adhesive 120 is attached to the base substrate 114 by forming the half slit 130 in which the adhesive 120 is partially left in the thickness direction in this way, the adhesive 120 is half It can be stuck to the base substrate 114 without being divided by the slit 130, and can be made brittle by the half slit 130 at the time of use.

  Below, the effect | action in case it peels from the state which the non-contact-type IC label 101 mentioned above was affixed on adherends, such as an article | item, is demonstrated.

  FIG. 3 is a diagram illustrating a state in which the non-contact type IC label 101 illustrated in FIG. 1 is peeled off from a state of being attached to an adherend.

  In order to peel off the non-contact type IC label 101 attached to the adherend 160 from the adherend 160, when the interface between the non-contact type IC label 101 and the adherend 160 is peeled off, first, the adhesive 120 is interposed. Then, the non-contact type IC label 101 is peeled off from the adherend 160 (FIG. 3A).

  When the non-contact type IC label 101 is pulled away from the adherend 160 in order to peel the non-contact type IC label 101 from the adherend 160, the adhesive 120 is a baseless double-sided tape. Although the cohesive force is strong, when the part to be peeled becomes the part where the half slit 130 is formed, the region where the half slit 130 is formed tears in the cutting direction of the half slit 130 (FIG. 3B).

  Thereafter, when the non-contact type IC label 101 is further pulled away from the adherend 160, the region where the half slit 130 of the adhesive 120 is formed is torn, and therefore, the peeling direction with respect to the half slit 130. While the upstream-side adhesive 120 is to be peeled off from the adherend 160 in a state where the upstream-side adhesive 120 is still attached to the base substrate 114, the adhesive 120 on the downstream side in the peeling direction with respect to the half slit 130 is attached to the adherend 160. An attempt is made to remain attached, whereby a force is generated in different directions on the upstream side and the downstream side in the peeling direction via the half slit 130, and the base substrate 114 is broken by the force (FIG. 3C). , (D)). In this state, the antenna 112 for performing writing and reading of information in a non-contact state with respect to the IC chip 111 is disconnected, so that writing and reading of information with respect to the IC chip 111 is impossible. . Further, since the base substrate 114 is broken, the non-contact type IC label 101 cannot be pasted on the adherend 160 again.

(Second Embodiment)
4A and 4B are diagrams showing a second embodiment of the non-contact type IC label of the present invention, in which FIG. 4A is a diagram showing a structure of a sticking surface to an adherend, and FIG. It is AA 'sectional drawing shown in FIG.

  In this embodiment, as shown in FIG. 4, a coiled antenna 212 and a contact 213 that are conductive patterns are formed on one surface of a base substrate 214 made of paper, and from the outside via the antenna 212. An IC chip 211 capable of writing and reading information in a non-contact state is mounted, and a baseless double-sided tape is used as an adhesive with strong cohesion on the surface of the base base 214 on which the antenna 212 is formed. The adhesive 220 is applied by being attached, and the release paper 240 is detachably attached to the surface of the adhesive 220 opposite to the base substrate 214. Note that a conductive pattern is formed by the antenna 212 and the contact 213, the contact 213 is formed at both ends of the coiled antenna 212, and a conductive adhesive (not shown) is connected to the contact 213 so that the IC chip 211 is connected. ), The IC chip 211 is adhered onto the base substrate 214, whereby a circuit including the antenna 212, the contact 213, and the IC chip 211 is formed. That is, the IC chip 211 is mounted at a position where information can be written and read out in a non-contact state via the antenna 212 and the contact 213 of the base substrate 214. Further, the adhesive 220 is formed with a plurality of slits 230 that are cut in the thickness direction of the adhesive 220 and penetrate the front and back of the adhesive 220. That is, the slit 230 is formed in the adhesive 220 so as to divide the region where the antenna 212 of the base substrate 214 is formed into a plurality of parts.

  In the non-contact type IC label 201 configured as described above, the release paper 240 is peeled off and attached to an adherend such as an article with an adhesive 220, and an information writing / reading device (externally provided) ( (Not shown), a current flows to the antenna 212 by electromagnetic induction from the information writing / reading device, and this current is supplied to the IC chip 211 via the contact 213, so that in a non-contact state, Information is written to the IC chip 211 from the information writing / reading device, and information written to the IC chip 211 is read by the information writing / reading device.

  Below, the manufacturing method of the non-contact type IC label 201 mentioned above is demonstrated.

  FIG. 5 is a diagram for explaining a method of manufacturing the non-contact type IC label 201 shown in FIG.

  First, the antenna 212 and the contact 213 are formed on one surface of the base substrate 214 by a method such as screen printing using a conductive paste containing conductive particles and a resin material (FIG. 5A). In addition to screen printing using a conductive paste, it is conceivable to form the antenna 212 and the contact 213 from a metal thin film by vapor deposition or etching.

  Next, the IC chip 211 is mounted on the base substrate 214 so as to be connected to the contact point 213, and the IC chip 211 is adhered to the base substrate 214 with a conductive adhesive (not shown) (FIG. 5B). )). As a result, the IC chip 211 is electrically connected to the contact point 213, and a circuit including the antenna 212, the contact point 213, and the IC chip 211 is formed.

  Further, by applying a laser beam from the opposite side of the release paper 240 of the base material-less double-sided tape in which an acrylic, natural rubber, or silicone-based adhesive 220 is applied onto the release paper 240, an adhesive is obtained. The slit 230 which penetrated the front and back of the adhesive 230 is formed in the agent 220 (FIG.5 (c)). At this time, it is preferable that no slit be formed in the release paper 240 by adjusting the irradiation output of the laser beam. Further, as the base material-less double-sided tape, for example, 3M adhesive transfer tape 468MP (manufactured by Sumitomo 3M Limited) can be used as in the case of the first embodiment. At this time, if the baseless double-sided tape is made of a thermosetting adhesive such as a silicone-based adhesive, the adhesive 220 is formed when the slit 230 is formed by irradiating laser light as described above. The surface of the region where the slit 230 is formed is cured by heat, and then the region where the slit 230 is formed is not stuck again.

  After that, the adhesive 220 having the release paper 240 attached to one surface is attached to the surface of the base substrate 214 on which the antenna 212 is formed, and the non-contact type IC label 201 as shown in FIG. Is completed (FIG. 5D). The release paper 240 may be configured by, for example, using paper or a film as a base material and applying a fluorine-based mold release agent such as silicone fluoride on one surface thereof.

  In this way, the adhesive 220 is applied to the base substrate 214 by sticking the substrate-less double-sided tape to the surface of the base substrate 214 where the antenna 212 is formed. Therefore, the antenna 212 is not peeled off from the base substrate 214 or the productivity is not lowered.

  In addition, after the slit 230 is formed in the adhesive 220 in this way, the adhesive 220 is attached to the base substrate 214, so that the surface of the base substrate 214 on which the antenna 212 is formed, as in this embodiment, Even when the adhesive 220 having the slit 230 is attached, the slit 230 can be formed in the adhesive 220 without damaging the antenna 212. Thereby, the pattern of the slit 230 can be set without being influenced by the shape of the antenna 212 formed on the base substrate 214, and stable vulnerability can be imparted.

  Below, the effect | action in the case where it peels from the state which the non-contact-type IC label 201 mentioned above was affixed on adherends, such as an article | item, is demonstrated.

  FIG. 6 is a diagram illustrating a state in which the non-contact type IC label 201 illustrated in FIG. 4 is peeled off from a state of being attached to an adherend.

  In order to peel off the non-contact type IC label 201 adhered to the adherend 260 from the adherend 260, when the interface between the non-contact type IC label 201 and the adherend 260 is peeled off, first, the adhesive 220 is interposed. Then, the non-contact type IC label 201 is peeled off from the adherend 260 (FIG. 6A).

  When the non-contact type IC label 201 is pulled away from the adherend 260 in order to peel the non-contact type IC label 201 from the adherend 260, the part to be peeled becomes the part where the slit 230 is formed. Since the adhesive 220 is broken by the slit 230 in the region where the slit 230 is formed, the adhesive 220 on the upstream side in the peeling direction with respect to the slit 230 is continuously attached to the base substrate 214. While trying to peel off from the adherend 260, the adhesive 220 on the downstream side in the peel direction with respect to the slit 230 tries to remain attached to the adherend 260, whereby the upstream side in the peel direction through the slit 230. Forces are generated in different directions on the downstream side (FIG. 6B).

  Thereafter, when the non-contact type IC label 201 is further pulled away from the adherend 260, the base substrate 214 is broken by the two forces having different directions as described above (FIGS. 6C and 6D). )). In this state, the antenna 212 for performing writing and reading of information in a non-contact state with respect to the IC chip 211 is disconnected, so that writing and reading of information with respect to the IC chip 211 is impossible. . Further, since the base substrate 214 is broken, the non-contact type IC label 201 cannot be attached to the adherend 260 again.

(Third embodiment)
FIG. 7 is a view showing a third embodiment of the non-contact type IC label of the present invention, wherein (a) is a view showing a structure of a sticking surface to an adherend, and (b) is (a). It is AA 'sectional drawing shown in FIG.

  In the present embodiment, as shown in FIG. 7, a booster antenna 315 that is a coiled conductive pattern is formed on one surface of a base substrate 314 made of paper, and an antenna 312 is provided. In addition, an IC chip 311 that performs writing and reading of information from the outside in a non-contact state via the booster antenna 315 is mounted, and the surface of the base substrate 314 on which the booster antenna 315 is formed has a strong cohesive force. A base material-less double-sided tape is applied as an agent to give an adhesive 320, and a release paper 340 is detachably attached to the surface of the adhesive 320 opposite to the base substrate 314. Yes. The adhesive 320 is formed with a plurality of half slits 330 that are cut in the thickness direction of the adhesive 320 from the side opposite to the base substrate 314 and do not penetrate the front and back of the adhesive 320. That is, the half slit 330 is formed in the adhesive 320 so as to divide the region where the booster antenna 315 of the base substrate 314 is formed into a plurality of parts.

  In the non-contact type IC label 301 configured as described above, the release paper 340 is peeled off and attached to an adherend such as an article with an adhesive 320, and an information writing / reading device (externally provided) ( (Not shown), electromagnetic induction occurs between the antenna 312 provided on the IC chip 311 and the antenna on the information writing / reading device side, so that the information written in the IC chip 311 is Information is read by the information writing / reading device in a non-contact state, or information is written to the IC chip 311 from the information writing / reading device in a non-contact state. Here, the sharpness Q indicating the ease of reception in the IC chip 311 is determined by the inductance, capacitance, and resistance component of the antenna 312. Therefore, for example, when the conductor diameter of the antenna 312 is increased, the sharpness Q is increased, thereby extending the communicable distance of the IC chip 311. In this embodiment, since the booster antenna 315 is formed on the base substrate 314, the booster antenna 315 and the antenna 312 are electromagnetically coupled, thereby increasing the apparent conductor diameter of the antenna 312 and sharpening it. Degree Q increases. Therefore, in this embodiment, since the IC chip 311 is mounted at a position where information can be written and read out in a non-contact state via the booster antenna 315 of the base substrate 314, the antenna 312 and the booster are mounted. Information is written and read through the antenna 315.

  Also in the non-contact type IC label 301 described above, when the adhesive 320 is peeled off from the adherend after being attached to the adherend such as an article, the adhesive 320 has a half slit 330 in the region where the half slit 330 is formed. The base substrate 314 is broken by the force in the different directions between the upstream side and the downstream side in the peeling direction via the half slit 330, and the base substrate 314 is broken by the force. The booster antenna 315 formed in the circuit is disconnected. When the booster antenna 315 is disconnected, the communication distance changes greatly, and unauthorized use can be prevented.

  In the above-described three embodiments, a plurality of half slits or slits are formed in the adhesive. However, as long as the area of the base substrate antenna or the booster antenna is divided. One may be sufficient. It is also conceivable to form a lattice.

  In the above-described three embodiments, the base substrate made of paper has been described as an example. However, any material other than paper can be applied as long as it is easily broken. Moreover, even if it consists of material which is hard to fracture | rupture, such as a film, it can be used as a base substrate by setting it as the structure which is easy to fracture | rupture by inserting a slit.

  In the above-described three embodiments, information is written to and read from an IC chip when a current flows through a coil-shaped antenna or a booster antenna formed on a base substrate by electromagnetic induction. Although an inductive contactless IC label has been described as an example, the present invention is an electrostatic that has two antennas formed on a base substrate so as to face each other with a predetermined interval. The present invention can be applied to any non-contact type IC label such as a coupled non-contact type IC label that cannot be written to or read from the IC chip when the antenna or contact is disconnected or has a significantly different communication distance.

  In the above-described three embodiments, the base substrate antenna or the booster antenna is provided with a half-slit or slit-formed adhesive, but the base substrate antenna or It is also conceivable that an adhesive having half slits or slits is applied to the surface opposite to the surface on which the booster antenna is formed, and the adhesive is adhered to the adherend with this adhesive.

It is a figure which shows 1st Embodiment of the non-contact-type IC label of this invention, (a) is a figure which shows the structure of the sticking surface to a to-be-adhered body, (b) is A shown to (a) It is -A 'sectional drawing. It is a figure for demonstrating the manufacturing method of the non-contact-type IC label shown in FIG. It is a figure which shows the state in case the non-contact type IC label shown in FIG. 1 is peeled off from the state affixed on the to-be-adhered body. It is a figure which shows 2nd Embodiment of the non-contact-type IC label of this invention, (a) is a figure which shows the structure of the sticking surface to a to-be-adhered body, (b) is A shown to (a). It is -A 'sectional drawing. It is a figure for demonstrating the manufacturing method of the non-contact-type IC label shown in FIG. It is a figure which shows the state in case the non-contact type IC label shown in FIG. 4 is peeled off from the state affixed on the to-be-adhered body. It is a figure which shows 3rd Embodiment of the non-contact-type IC label of this invention, (a) is a figure which shows the structure of the sticking surface to a to-be-adhered body, (b) is A shown to (a). It is -A 'sectional drawing. It is a figure which shows one structural example of a common non-contact-type IC label, (a) is a figure which shows an internal structure, (b) is A-A 'sectional drawing shown to (a).

Explanation of symbols

101, 201, 301 Non-contact IC label 111, 211, 311 IC chip 112, 212, 312 Antenna 113, 213 Contact 114, 214, 314 Base substrate 120, 220, 320 Adhesive 130, 330 Half slit 140, 150 , 240, 340 Release paper 160, 260 Substrate 230 Slit 315 Booster antenna

Claims (2)

An IC chip having a conductive pattern formed on one surface of the base substrate and capable of writing and reading information in a non-contact state via the conductive pattern is formed on the conductive pattern of the base substrate. It is mounted at a position where information can be written and read out in a non-contact state via an adhesive, and an adhesive is applied to one surface of the base substrate, and the adhesive is a conductive pattern of the base substrate. Of a non-contact type IC label having a half slit cut in the thickness direction so as not to penetrate the front and back of the pressure-sensitive adhesive from the opposite side to the base substrate so as to divide the region where the substrate is formed A method,
Forming the conductive pattern on the base substrate;
Mounting the IC chip at a position where information can be written and read in a non-contact state through the conductive pattern of the base substrate;
Forming a half slit that does not penetrate the front and back of the adhesive from the side opposite to the first release paper on the adhesive applied on the first release paper;
A step of attaching a second release paper to the surface of the pressure-sensitive adhesive on which the half slit is formed;
Peeling the first release paper from the adhesive;
And a step of applying the pressure-sensitive adhesive from which the first release paper has been peeled to one surface of the base substrate. In the manufacturing method of the non-contact type IC label according to claim 1,
Manufacturing the non-contact type IC label, wherein the half slit is formed by irradiating the adhesive applied on the first release paper with a laser beam from the side opposite to the first release paper. Method.

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